Electronic module
By forming a recess with a diameter larger than the internal connection terminal on the upper surface of the chip spacer and joining it with the electronic components, the position offset and rotation problems between the internal connection terminals and the chip spacer in the electronic module are solved, and better self-alignment effect and welding quality are achieved.
Patent Information
- Application Number
- CN202480003336.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-09-28
- Filing Date
- 2024-08-02
- Publication Date
- 2025-05-30
AI Technical Summary
In the electronic module, in the bonding process between the internal connection terminal and the chip spacer, solder flow causes position deviation and it is difficult to achieve a self-alignment effect. Especially when the number of chip electrodes changes, suppressing position deviation and rotation becomes a problem.
A recess with a diameter larger than the inner connecting terminal is formed on the upper surface of the chip spacer and is engaged with the electronic components by a conductive bonding member to achieve effective alignment and fixation of the inner connecting terminals.
Through this design, the positional offset between the internal connection terminals and the chip spacer can be effectively suppressed, and the self-alignment effect can be improved, ensuring the correct flow and condensation of the solder and avoiding rotational movement.
Smart Images
Figure CN120077470A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to an electronic module. Background Art
[0002] Conventionally, an electronic module including a semiconductor element and internal connection terminals that connect the electrodes of the semiconductor element and wiring patterns on a substrate has been known. On the other hand, an electronic module including a semiconductor element, a substrate on which the semiconductor element is mounted, pin terminals as internal connection terminals connected to the wiring patterns on the substrate, and a lead frame that supports the pin terminals and electrically connects the electrodes of the semiconductor element to the pin terminals has been known (see Patent Document 1 below). Moreover, in such an electronic module, there is also a case where the internal connection terminals are connected to the electrodes of the semiconductor element instead of the wiring patterns. As such an electronic module, an electronic module that achieves stress relaxation by connecting a semiconductor element to internal connection terminals via a chip spacer can be considered.
[0003] However, as Figure 5 shown, an electronic module is also known in which a semiconductor element 320 is bonded via a solder BM30 on an insulating substrate 312, and a chip spacer 318 is bonded via a solder BM20 to the lower end side of an internal connection terminal 334 inserted through a through hole (not shown) formed in a lead frame (not shown).
[0004] Prior Art Documents
[0005] Patent Documents
[0006] Patent Document 1: Japanese Patent No. 6850938 Summary of the Invention
[0007] Problems to be Solved by the Invention
[0008] However, in the bonding process between the internal connection terminal 334 and the chip spacer 318, there is a problem that the solder BM20 between the internal connection terminal 334 and the chip spacer 318 flows out, resulting in a positional deviation between the internal connection terminal 334 and the chip spacer 318 during solder melting and making it difficult to achieve the desired self-alignment effect.
[0009] In addition, when using the chip spacer 318 as a buffer material, in the case of a chip having electrodes on its surface, in order to reduce the resistance component, it is necessary to expand the shape of the chip spacer 318 according to the number of chip electrodes. At this time, it becomes a problem to realize a structure that suppresses the positional deviation between the internal connection terminal 334 and the chip spacer 318 and the rotation of the chip spacer 318 during solder melting.
[0010] Accordingly, the present invention has been accomplished in view of the above problems, and an object thereof is to provide an electronic module that suppresses positional deviation between an internal connection terminal and a chip spacer and improves a desired self-alignment effect.
[0011] Another object is to provide an electronic module that suppresses positional deviation between an internal connection terminal and a chip spacer and rotation of the chip spacer during solder melting and improves a desired self-alignment effect when the shape of the chip spacer is enlarged according to the number of chip electrodes.
[0012] Means for Solving the Problems
[0013] The present invention is an electronic module, characterized in that the electronic module includes: an electronic component; at least one internal connection terminal that is electrically connected to the electronic component and has conductivity; and a chip spacer that is formed between a lower end surface of the internal connection terminal and the electronic component, the chip spacer being joined to the electronic component via a conductive joining member, and at least one recess having a diameter larger than that of the internal connection terminal being formed on an upper surface of the chip spacer.
[0014] Advantages of the Invention
[0015] According to the electronic module of the present invention, since at least one recess having a diameter larger than that of the internal connection terminal is formed on the upper surface of the chip spacer, it is possible to provide an electronic module that suppresses positional deviation between the internal connection terminal and the chip spacer and improves a desired self-alignment effect.
[0016] In addition, according to the electronic module of the present invention, it is possible to provide an electronic module that suppresses positional deviation between the internal connection terminal and the chip spacer and rotation of the chip spacer during solder melting and improves a desired self-alignment effect when the shape of the chip spacer is enlarged according to the number of chip electrodes. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 is a perspective view showing the appearance of an electronic module 100 according to a first embodiment.
[0018] Figure 2 is a diagram for explaining a chip spacer in the first embodiment. Figure 2 In (a), it is a top view showing one pin terminal and a chip spacer of the electronic module according to the first embodiment, Figure 2 In (b), it is Figure 2 a longitudinal sectional view of (a) above, Figure 2 In (c), it is a perspective view showing the appearance of the chip spacer.
[0019] Figure 3 is a diagram showing the cross-sectional structure of the electronic module 100 according to the first embodiment.
[0020] Figure 4 This is a diagram when multiple internal connection terminals in the form of pin terminals are used.
[0021] Figure 5 This is a diagram showing the cross-sectional structure of the electronic module 100 according to the second embodiment.
[0022] Figure 6 This is a diagram for explaining the electronic module related to the prior art. Detailed implementation mode
[0023] Hereinafter, the electronic module according to the present invention will be described. The embodiments described below do not limit the invention related to the technical solution. In addition, not all of the elements and their combinations described in the embodiments are essential for the present invention.
[0024] (First embodiment)
[0025] As Figure 1 shown, the electronic module 100 according to the first embodiment is in a substantially rectangular parallelepiped shape that is long in the front-rear direction and flat in the up-down direction. The electronic module 100 includes an insulating substrate 112, electronic components 120, a first terminal 130, a second terminal 140, a third terminal 160, a first connection frame 132B, a second connection frame 142B, a third connection frame 152B, and a sealing resin (not shown).
[0026] The insulating substrate 112 is a ceramic substrate of a DCB (Direct Copper Bonding substrate; direct copper bonding substrate) having circuit wirings formed on the upper surface and a metal plate for heat dissipation formed on the lower surface (back surface). Two electronic components 120 are arranged, for example, on the circuit wirings formed on one surface of the insulating substrate 112. It should be noted that the insulating substrate 112 may also be a printed substrate or the like. The insulating substrate 112 is preferably formed in a rectangular flat plate shape and disposed at the central portion in the length direction of the electronic module 100, that is, the front-rear direction.
[0027] Two electronic components 120A and 120B are respectively arranged on the circuit wirings on one surface of the insulating substrate 112. As the electronic components 120A and 120B, they are configured as semiconductor components. For example, a power MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor; insulated gate field effect transistor) can be used, an IGBT, a thyristor, a diode, or other appropriate components can be used. The electronic components 120A and 120B have electrodes (not shown) on two surfaces of the semiconductor substrate, have a source electrode and a gate electrode formed on the surface, and have a drain electrode (not shown) formed on the back surface.
[0028] In the electronic component 120A, the source electrode is connected to the first terminal 130 via the chip spacer 122, the internal connection terminal 134, and the first connection frame 132B. In addition, it is connected to the pin terminal 172 serving as a sensing terminal via a wire, circuit wiring, etc. The gate electrode is connected to the pin terminal 174 via circuit wiring. The drain electrode is formed on the lower surface side of the semiconductor substrate and is electrically connected to the circuit wiring. It should be noted that in Figure 1 the example of, the internal connection terminal 134 is a pin terminal having a substantially polygonal shape when viewed in the vertical direction, more specifically, a substantially quadrilateral shape, and further specifically, a substantially quadrilateral shape with rounded corners protruding outward.
[0029] In the electronic component 120B, the source electrode is connected to the drain electrode of the front-side electronic component 120A via a chip spacer (not shown), the internal connection terminal 154, the third connection frame 152B, and circuit wiring, and is connected to the third terminal 160 via the third connection frame 152B. In addition, it is connected to the pin terminal 172 serving as a sensing terminal via a wire, circuit wiring, etc. The gate electrode is connected to the pin terminal 174 via circuit wiring. The drain electrode is formed on the lower surface side of the semiconductor substrate and is electrically connected to the second connection frame 142B via circuit wiring. It should be noted that in Figure 1 the example of, the internal connection terminal 154 is a pin terminal having a substantially polygonal shape when viewed in the vertical direction, more specifically, a substantially quadrilateral shape, and further specifically, a substantially quadrilateral shape with rounded corners protruding outward (hereinafter, in the internal connection terminal 154, when viewed in the vertical direction, it has a substantially polygonal shape, more specifically, a substantially quadrilateral shape, and further specifically, a substantially quadrilateral shape with rounded corners protruding outward, and there is a case where it is only substantially polygonal).
[0030] The first connection frame 132B and the first terminal 130 are integrally formed of the same plate material 132. That is, in the plate material 132, the portion buried in the sealing resin corresponds to the first connection frame 132B. The first connection frame 132B has a through hole 133 that penetrates the first connection frame 132B in the vertical direction (see Figure 3), electrically connected to the first terminal 130. The through hole 133 is roughly polygonal when viewed in the up-down direction, more specifically, roughly quadrilateral, and further specifically, roughly quadrilateral with corners protruding outward in an arc shape (hereinafter, in the through hole 133, when viewed in the up-down direction, it is roughly polygonal, more specifically, roughly quadrilateral, and further specifically, roughly quadrilateral with corners protruding outward in an arc shape, and there is a case where it is only roughly polygonal). The upper end of the internal connection terminal 134 is embedded in the through hole 133, and the first connection frame 132B is connected to the electrode of the electronic component 120 through the internal connection terminal 134. It should be noted that the shape of the through hole is not limited to a roughly polygonal shape, and can also be a cylindrical shape or the like.
[0031] The internal connection terminal 134 is made of a roughly polygonal metal and electrically connects the electrode of the electronic component 120 to the first connection frame 132B. The internal connection terminal 134 is fixed to the first connection frame 132B by, for example, pressing, and is also electrically connected. It should be noted that the shape of the internal connection terminal is not limited to a roughly polygonal shape, and may also be a cylindrical shape, etc.
[0032] like Figure 2 (a) and Figure 2 As shown in (c) in FIG. 1 , the chip spacer 122 is formed of a thin flat plate material (here, a copper plate) having conductivity and is roughly polygonal when viewed in the vertical direction, more specifically, roughly quadrilateral, and more specifically, roughly quadrilateral with corners protruding outward in an arc shape (hereinafter, in the internal connection terminal 154, when viewed in the vertical direction, it is roughly polygonal, more specifically, roughly quadrilateral, and more specifically, roughly quadrilateral with operating corners protruding outward in an arc shape, and there is a case where it is only roughly polygonal), and is arranged in a manner that the center of the chip spacer 122 coincides with the center of the internal connection terminal 134. The diameter of the chip spacer 122 is set to be larger than the diameter of the internal connection terminal 134. On the upper surface of the chip spacer 122, a recess 113 having an outer diameter larger than that of the internal connection terminal 134 is formed. The recess 113 is formed to be roughly polygonal when viewed in the vertical direction, more specifically, roughly quadrilateral, and more specifically, roughly quadrilateral with corners protruding outward in arc shape (hereinafter, in the internal connection terminal 154, when viewed in the vertical direction, it is roughly polygonal, more specifically, roughly quadrilateral, and more specifically, roughly quadrilateral with corners protruding outward in arc shape, and there is a case where it is only roughly polygonal). The chip spacer 122 is bonded to the lower surface of the internal connection terminal 134 in the recess 113 via a conductive bonding material (for example, solder BM2). The lower surface of the chip spacer 122 is bonded to the upper surface (specifically, an electrode not shown) of the electronic component 120 via a conductive bonding material (for example, solder BM1).
[0033] In addition, a convex portion 115 is formed on the lower surface of the chip spacer 122, and the lower end of the convex portion 115 is in contact with the electrode of the electronic component 120, so that the distance between the bottom of the chip spacer 122 and the electronic component 120 can be kept constant. Moreover, the solder thickness of the solder BM1 disposed between the chip spacer 122 and the electronic component 120 can be kept constant. On the upper surface of the chip spacer 122, a concave portion 117 corresponding to the convex portion 115 is formed. It should be noted that the convex portion 115 is formed by applying a force vertically downward from above with pins (not shown) at, for example, four locations in the recess 113 of the chip spacer 122, and can also be formed by other methods, such as using a mold. In addition, the concave portion 117 is a portion formed when the convex portion 115 is formed by applying a force vertically downward with a pin, and the external shape of the concave portion 117 is a shape corresponding to the shape of the convex portion 115, and its outer diameter and depth change corresponding to the shape of the convex portion 115. In addition, preferably, the formation positions of the convex portion 115 and the concave portion 117 are formed outside the outer peripheral position of the internal connection terminal 134 and inside the outer diameter of the chip spacer 122.
[0034] Furthermore, the formation positions of the convex portion 115 and the concave portion 117 are preferably formed on a substantially polygon, and more specifically, at least one or more, a total of three or more are formed on each side of the substantially quadrilateral side. The reason for making the number of the convex portion 115 and the concave portion 117 at least three or more is to not affect the upright state of the chip spacer 122. In addition, when the cross-sectional shape of the internal connection terminal 134 is a substantially polygon when observed in the vertical direction, more specifically, a substantially quadrilateral, and further specifically, a substantially quadrilateral with rounded corners protruding outward (hereinafter, in the internal connection terminal 154, when observed in the vertical direction, it is a substantially polygon, more specifically, a substantially quadrilateral, and further specifically, a substantially quadrilateral with rounded corners protruding outward, and there are cases where it is only a substantially polygon), it is desired that the cross-sectional shape of the concave portion 117 is also the same, that is, a substantially polygon when observed in the vertical direction, more specifically, a substantially quadrilateral, and further specifically, a substantially quadrilateral with rounded corners protruding outward (hereinafter, in the internal connection terminal 154, when observed in the vertical direction, it is a substantially polygon, more specifically, a substantially quadrilateral, and further specifically, a substantially quadrilateral with rounded corners protruding outward, and there are cases where it is only a substantially polygon).
[0035] It should be noted that a chip spacer (not shown) is also disposed between the lower surface of the internal connection terminal 154 and the electronic component 120 in the same manner as described above, and its structure and the like are the same as those described above, so the description thereof is omitted.
[0036] The second connection frame 142B is electrically connected to the second terminal 140. The second connection frame 142B is embedded inside the sealing resin. In the electronic module 100, the second connection frame 142B is integrally formed from the same plate material 142 as the second terminal 140. That is, in the plate material 142, the portion embedded in the sealing resin corresponds to the second connection frame 142B.
[0037] The second connection frame 142B has four through-holes (reference numerals omitted) that penetrate the second connection frame 142B in the vertical direction. The through-holes are circular in shape when viewed in the vertical direction. In the four through-holes, upper ends of internal connection electrodes 144 are respectively fitted. Through the four internal connection electrodes 144, the second connection frame 142B is connected to electrodes (not shown) of the electronic component 120B. The internal connection electrodes 144 are fixed to the second connection frame 142B by press-fitting, for example. The number of the above-mentioned through-holes and internal connection electrodes 144 is not limited to 4 as long as the required electric power can flow, and can be any number of 1 or more.
[0038] The third connection frame 152B is electrically connected to the third terminal 160. The third connection frame 152B may also be disposed on the same plane as the first connection frame 132B and the second connection frame 142B.
[0039] The third connection frame 152B has a through-hole (reference numeral omitted) that penetrates the third connection frame 152B in the vertical direction. The through-hole is circular in shape when viewed in the vertical direction. In the through-hole, the upper end of an internal connection terminal 154, which is an internal connection electrode, is fitted. Through the internal connection electrode 144, the third connection frame 152B is connected to electrodes (not shown) of the electronic component 120. The internal connection terminal 154 is fixed to the third connection frame 152B by press-fitting, for example.
[0040] As Figure 1 shown, the first terminal 130 is disposed in front in the front-rear direction of the electronic module 100. The first terminal 130 is a conductive flat plate material and is formed of a plate material 132A formed into a plate shape from a copper plate or the like, for example. The first terminal 130 has a through-hole (reference numeral omitted) that penetrates the first terminal 130 in the vertical direction. The through-hole is, for example, circular in shape when viewed in the vertical direction. It should be noted that the shape of the through-hole is not limited to a circular shape and may be a polygon such as a hexagon.
[0041] In the through-hole, the upper end of the first cap nut 230 is fitted. Here, the height of the upper surface of the first cap nut 230 is preferably the same as or lower than the height of the upper surface of the first terminal 130.
[0042] The lower surface of the first terminal 130 and the first cap nut 230 are embedded inside the sealing resin. On the other hand, the upper surface of the first terminal 130 is exposed to the outside of the sealing resin. An external connection member (not shown) is disposed on the upper surface of the first terminal 130 exposed from the sealing resin and fixed by a bolt (not shown), enabling electrical connection between the first terminal 130 and the external connection member.
[0043] As Figures 1 to 3 shown, the second terminal 140 is disposed behind the electronic module 100 in the front-rear direction. The second terminal 140 is a conductive flat plate material, for example, constituted by a plate material 142A formed of a copper plate. The second terminal 140 has a through hole (reference numeral omitted) that penetrates the second terminal 140 in the up-down direction. When observed in the up-down direction, the through hole is, for example, circular in shape.
[0044] In the through hole, the upper end of the second cap nut 240 is fitted. Here, the height of the upper surface of the second cap nut 240 is preferably the same as or lower than the height of the upper surface of the second terminal 140.
[0045] The lower surface of the second terminal 140 and the second cap nut 240 are embedded inside the sealing resin. On the other hand, the upper surface of the second terminal 140 is exposed to the outside of the sealing resin. An external connection member (not shown) is disposed on the upper surface of the second terminal 140 exposed from the sealing resin and fixed by a bolt (not shown), enabling electrical connection between the second terminal 140 and the external connection member.
[0046] The electronic module 100 may also include a third terminal 160. The third terminal 160 is an arbitrary component. As Figure 1 shown, the third terminal 160 is a conductive flat plate material, for example, formed of a copper plate. The third terminal 160 is disposed such that the front-rear direction becomes the plate thickness direction, forming a long strip shape with the up-down direction as the length direction. The third terminal 160 is disposed above the sealing resin and has a portion exposed from the sealing resin (hereinafter referred to as the "upper side portion") and a portion covered by the sealing resin (hereinafter referred to as the "lower side portion").
[0047] The upper side portion of the third terminal 160 has a through hole (reference numeral omitted) that penetrates the third terminal 160 in the front-rear direction. Thereby, an external connection member (not shown) can be fixed to the third terminal 160 by a bolt (not shown) and a nut (not shown). Further, one end of a cap nut (not shown) may be fitted in the through hole. Thereby, when the external connection member is fixed to the third terminal 160 by a bolt, reliable electrical connection between the third terminal 160 and the external connection member can be achieved. The lower side portion of the third terminal 160 is connected to an electrode (not shown) of the electronic component 120.
[0048] In the electronic module 100 according to the first embodiment, since at least one recess having a diameter larger than that of the internal connection terminal is formed on the upper surface of the chip spacer 122, it is possible to provide the electronic module 100 that suppresses the positional deviation between the internal connection terminal 134 and the chip spacer 122 and improves the desired self-alignment effect. In addition, it is possible to provide an electronic module that suppresses the positional deviation between the internal connection terminal 134 and the chip spacer 122 and the rotation of the chip spacer 122 during solder melting and improves the desired self-alignment effect when the shape of the chip spacer 122 is enlarged according to the number of chip electrodes.
[0049] Furthermore, in the electronic module 100 according to the first embodiment, since a recess 113 having an outer diameter larger than the outer diameter of the internal connection terminal 134 is formed in the chip spacer 122, the solder BM2 between the upper surface of the chip spacer 122 and the lower surface of the internal connection terminal 134 can be suppressed from flowing out radially outward through the recess 113.
[0050] Furthermore, since the chip spacer 122 is arranged so as to be centered with the internal connection terminal 134, it is possible to suppress the rotational movement of the internal connection terminal 134 during solder solidification.
[0051] Furthermore, even when the shape of the chip spacer 122 is enlarged according to the number of chip electrodes, the solder BM2 between the upper surface of the chip spacer 122 and the lower surface of the internal connection terminal 134 can be suppressed from flowing out radially outward, and the rotational movement of the internal connection terminal 134 during solder solidification can be suppressed.
[0052] Furthermore, since the cross section of the internal connection terminal 134 is formed in a substantially polygonal shape, the rotation of the internal connection terminal 134 can be suppressed.
[0053] (Refer to Figure 4 )
[0054] It should be noted that when the shape of the internal connection terminal is cylindrical, the rotational movement of the internal connection terminal can be suppressed by using at least two or more internal connection terminals. In the electronic module 100, the internal connection terminal 134 has at least one.
[0055] Furthermore, since the cross section of the recess 113 is substantially polygonal, the internal connection terminal 134 can be fitted into the recess 113, the solder BM2 between the upper surface of the chip spacer 122 and the lower surface of the internal connection terminal 134 can be suppressed from flowing out radially outward, and the rotational movement of the internal connection terminal 134 during solder solidification can be suppressed.
[0056] Furthermore, since the cross-section of the chip spacer 122 is substantially polygonal, the connection area with the electronic component 120 can be increased, and the contact resistance is reduced.
[0057] Furthermore, since at least a part of the cross-sections of the internal connection terminal 134 and the recess 113 are formed as the same substantially polygon, rotational movement of the internal connection terminal 134 can be suppressed.
[0058] (Second Embodiment)
[0059] Hereinafter, Figure 5 the electronic module according to the second embodiment of the present invention will be described. It should be noted that this second embodiment is the same as the above-described first embodiment except that the recess 117 is not formed, and thus only the different points will be described and the description of the same parts will be omitted. As Figure 5 shown, the chip spacer 126 is formed by molding using a mold, and does not form Figure 2 the recess 117 as shown in (c), and only the convex portion 115 is formed. Even if the recess 117 is not formed in this way and only the convex portion 115 is formed, a ring-shaped recess 113 having an outer diameter larger than the diameter of the internal connection terminal 134 is formed in the chip spacer 126.
[0060] Therefore, by providing the recess 113 having an outer diameter larger than the diameter of the internal connection terminal 134 in the chip spacer 126, outflow of the solder BM2 between the upper surface of the chip spacer 122 and the lower surface of the internal connection terminal 134 to the radially outer side can be suppressed. Further, since the convex portion 115 is formed on the lower surface of the chip spacer 126, the self-alignment at the time of condensation of the solder BM1 can act toward the axis of the internal connection terminal 134 by the convex portion 115.
[0061] It should be noted that the present invention is not limited to the above-described embodiments, and it goes without saying that various modifications and applications can be made within the scope of the invention described in the technical solution.
[0062] That is, in the above-described embodiment, the recess 113 having a diameter larger than that of the internal connection terminal 134 is formed on the upper surface of the chip spacer 122, but a plurality of such large-diameter recesses 113 may be formed corresponding to the number of the internal connection terminals 134. In other words, as long as at least one recess 113 having a diameter larger than that of the internal connection terminal 134 is formed on the upper surface of the chip spacer 122, the technical effects of the present invention can be achieved.
[0063] In addition, in the above-described embodiment, the cross-section of the internal connection terminal 134 is formed in a substantially polygonal shape, but a part thereof may also be formed in a substantially polygonal shape. That is, as long as at least a part of the cross-section of the internal connection terminal 134 is formed in a substantially polygonal shape, the technical effects of the present invention can be achieved.
[0064] Furthermore, in the above-described embodiment, the cross-section of the recess 113 is formed in a substantially polygonal shape, but a part thereof may also be formed in a substantially polygonal shape. That is, as long as at least a part of the cross-section of the recess 113 is formed in a substantially polygonal shape, the technical effects of the present invention can be achieved.
[0065] Still further, in the above-described embodiment, the chip spacer 122 is formed in a substantially polygonal shape, but a part thereof may also be formed in a substantially polygonal shape. That is, as long as at least a part of the chip spacer 122 is formed in a substantially polygonal shape, the technical effects of the present invention can be achieved.
[0066] Description of Reference Numerals
[0067] 100: Electronic module;
[0068] 112: Insulating substrate;
[0069] 113: Recess;
[0070] 115: Protrusion;
[0071] 117: Concave portion;
[0072] 120: Semiconductor element (electronic component);
[0073] 122: Chip spacer;
[0074] 130: First terminal;
[0075] 132A, 142A, 160A: Flat plates;
[0076] 134, 154: Internal connection terminals;
[0077] 140: Second terminal;
[0078] 132B, 142B, 152B: Connection frames;
[0079] 160: Third terminal;
[0080] 170: Sealing resin.
Claims
1. An electronic module, characterized in that: The electronic module has: Electronic components; at least one internal connection terminal electrically connected to the electronic component and having conductivity; and a chip spacer formed between the lower end surface of the internal connection terminal and the electronic element; The chip spacer is bonded to the electronic component via a conductive bonding material, and at least one recess having a diameter larger than that of the internal connection terminal is formed on an upper surface of the chip spacer.
2. The electronic module according to claim 1, characterized in that: At least a portion of the internal connection terminal is formed in a substantially polygonal shape.
3. The electronic module according to claim 1 or 2, characterized in that: At least a portion of the recess is substantially polygonal.
4. The electronic module according to claim 3, characterized in that: The internal connection terminal and at least a portion of the recess are formed in the same substantially polygonal shape.
5. The electronic module according to claim 1, characterized in that: At least a portion of the chip spacer is substantially polygonal.