Apparatus for transporting wafer-shaped articles

Abstract

Apparatus for transporting wafer-shaped articles, comprising: a support having a support surface; one or more gas channels in the support having one or more outlets in the support surface; and one or more grooves on the support surface for receiving at least a portion of an end effector for supporting the wafer-shaped article.

Description

Technical Field

[0001] The present invention relates to an apparatus for transporting wafer-like objects (such as semiconductor wafers). Background Art

[0002] In the process of manufacturing semiconductor devices, multiple different processes are usually performed on semiconductor wafers in order to fabricate semiconductor devices on the wafers. These processes typically include etching a material layer previously deposited on the wafer surface to remove a portion of the material. This is usually achieved by coating an etching chemical on the surface of the wafer to etch the material layer on the wafer surface. During the etching process (i.e., the so-called spin etching process), the wafer may rotate.

[0003] When performing such an etching process, the wafer to be processed is usually taken out from a wafer cassette (such as a front-opening unified pod, FOUP). Then, the wafer to be processed is usually placed on a wafer support, such as a rotatable chuck, with the side of the wafer having the material layer to be etched facing upward. Then, the etching chemical is coated on the material layer on the upward surface of the wafer to etch the material layer. The opposite side of the wafer is usually kept away from contact with the etching chemical, so the other side of the wafer is protected from the influence of the etching chemical.

[0004] After the etching process is completed, the upward surface of the wafer can then be cleaned, for example, by spraying a cleaning liquid or a rinsing liquid on this surface of the wafer. Similarly, in the so-called spin cleaning process, the wafer can rotate during the cleaning process.

[0005] Then, the wafer can be removed from the wafer support and transferred to the same or a different wafer cassette, or to a device for further processing for further processing.

[0006] In the apparatus previously used by the applicant to perform such an etching process, an end effector of a robotic arm is used to take out the wafer from the wafer cassette. The end effector is usually a Bernoulli-type end effector or a Bernoulli end effector, which uses the Bernoulli principle or effect to support the wafer in a non-contact manner. Such an end effector usually has a plurality of gas outlets on the support surface of the end effector, and these gas outlets are configured to supply gas to support the wafer in a non-contact manner according to the Bernoulli principle or effect.

[0007] In particular, an air cushion is formed between the support surface of the end effector and the wafer, where an air flow causes a low pressure (or a lower pressure or a reduced pressure) to be formed in at least a partial area between the support surface of the end effector and the wafer. This means that the wafer is sucked towards the support surface of the end effector by the low pressure, so that the wafer is held by the end effector, but contact with the support surface of the end effector is avoided by the air cushion. Thus, the wafer is supported on the air cushion and is kept at a certain distance from the support surface of the end effector.

[0008] Typically, such an end effector is located below the wafer and is used to support the wafer from below.

[0009] Such an end effector is usually thin and has a flat or blade-like shape, so that the end effector can be inserted between different wafers stacked in a wafer cassette.

[0010] The end effector can be similar to, for example, the tool described in US 5,967,578, the entire content of which is incorporated herein by reference.

[0011] In the device used by the applicant previously, the wafer supported by the end effector is transferred to another wafer handling device by a robotic arm, and the wafer handling device is used to subsequently transfer the wafer from the end effector to a wafer support device for processing.

[0012] The wafer handling device can be similar to, for example, the handling device described in US 6,152,507, the entire content of which is incorporated herein by reference.

[0013] The wafer handling device is configured to support the wafer from above according to the Bernoulli principle or effect. Thus, for example, the wafer handling device can be a so-called Bernoulli gripper or Bernoulli grip, etc.

[0014] For example, Figure 9A is a schematic diagram of such a wafer handling device. As Figure 9A shown, the wafer handling device includes a support 1, the lower side or bottom side of which has a flat surface 3. A gas channel 5 is formed in the support 1, and the gas channel extends towards the flat surface 3 in an outwardly inclined manner and terminates at a gas outlet opening in the flat surface 3 at one of its ends. The other end of the gas channel 5 is connected to a gas supply pipe 7 for supplying gas to the flat surface 3 via the gas channel 5.

[0015] The gas channel 5 is an annular gap formed between the insertion part of the support 1 and the main body part of the support 1. Thus, the gas channel 5 is an annular gas channel.

[0016] The gas passage 5 is configured such that, according to Bernoulli's principle or effect, the gas supplied from the gas passage 5 to the plane 3 supports the wafer 9 in a non-contact manner below the plane 3 of the support 1.

[0017] In particular, an air cushion is formed between the plane 3 of the wafer transfer device and the wafer 9, wherein the air flow through the gas passage 5 causes a low pressure (or a lower pressure or a reduced pressure) to be formed in at least a partial region between the plane 3 and the wafer 9. In particular, a low pressure is formed in the central region of the plane 3 inside at least the annular gas passage 5. This means that the wafer 9 is sucked towards the plane 3 by the low pressure, so that the wafer 9 is held by the wafer transfer device, but contact with the plane 3 is avoided by the air cushion. Thus, the wafer 9 is supported on the air cushion and is kept at a certain distance from the plane 3 below the plane 3.

[0018] In order to transfer the wafer 9 from the end effector 2 to the wafer transfer device, the wafer transfer device is located above the wafer 9, and the wafer 9 is supported from below by the end effector. Then, gas is supplied via the gas passage 5 of the wafer transfer device, and due to the low pressure (or a lower pressure or a reduced pressure) caused by the gas flowing through the gas passage 5, the wafer 9 is sucked upwards towards the plane 3 of the support 1, but the air flow avoids contact between the wafer 9 and the plane 3. Any gas supply from the end effector 2 can be stopped simultaneously to assist in the transfer of the wafer 9 from the end effector 2 to the wafer transfer device.

[0019] Then the wafer 9 is transported to a wafer support, such as a rotating chuck, by the wafer transfer device, and the wafer 9 is lowered onto the wafer support for subsequent processing of the wafer 9.

[0020] For example, the support 1 can be attached to a transfer device or a transfer mechanism or a manipulator, such as a robotic arm, for moving the support 1 and thus holding the wafer by the support 1.

[0021] As Figure 9A shown, the wafer transfer device further includes a plurality of guide arms 11, and the guide arms 11 are adjacent to the gas outlet openings outside the gas outlet opening. The plurality of guide arms 11 project beyond the plane 3 of the support 1 and can be adjusted radially relative to the plane 3.

[0022] The plurality of guide arms 11 are configured to limit or restrict the lateral movement of the wafer 9 supported below the plane 3 relative to the plane 3. In particular, if the wafer 9 moves laterally relative to the plane 3, the plurality of guide arms are configured to contact the circumferential edge of the wafer 9 to limit or restrict the lateral movement of the wafer 9 relative to the plane 3. Thus, the guide arms 11 do not clamp the wafer 9, but form an adjustable circumferential alignment surface, alignment line or alignment point for the wafer 9.

[0023] Subsequently, after the wafer processing is completed, the wafer can be removed from the upper wafer support by a wafer transfer device and transferred back to the end effector. The end effector can be positioned below the wafer, and then the wafer can be transferred from the wafer transfer device to the end effector, so that the wafer can be transferred by the end effector to the same or a different wafer cassette, or to a further processing device for further processing.

[0024] The inventors have realized that a possible drawback of such an existing arrangement is that it is difficult to process both the front and back sides of a wafer simultaneously using the existing arrangement. In particular, the wafer can only be transferred between the end effector and the wafer transfer device in a specific configuration where the end effector is located below the wafer and the wafer transfer device is located above the wafer (i.e., the wafer is located between the end effector and the wafer transfer device).

[0025] For example, in the above arrangement, the end effector 2 can pick up the wafer from the wafer cassette, with the end effector located below the wafer and the first side of the wafer facing upward, away from the end effector. Then, the end effector 2 can position the wafer below the support 1 of the wafer transfer device, with the first side of the wafer facing upward towards the support 1, and the support of the wafer can be transferred from the end effector to the support 1. Then, the wafer transfer device can convey the wafer to the wafer support, such as a rotating chuck, and lower the wafer onto the wafer support, with the first side of the wafer facing upward away from the wafer support. Then, the first side of the wafer is processed.

[0026] However, in such an arrangement, it is impossible to process the second side of the wafer opposite to the first side, because the wafer cannot be placed on the wafer support with the second side of the wafer facing upward away from the wafer support.

[0027] In addition, if the wafer 9 is picked up from above by the end effector 2 ( Figure 9B ), with the first side facing the end effector 9, then the second side faces the transfer device, so only the second side is processed. If the wafer is very thin and / or warped, it may be necessary to pick up the wafer in this way when the end effector is a Bernoulli end effector. Therefore, the way of taking out the wafer from the wafer cassette determines the way of processing the wafer.

[0028] The present invention is designed based on the above considerations. Summary of the Invention

[0029] According to a first aspect of the present invention, there is provided an apparatus for transporting a wafer-like object, the apparatus comprising: a support having a support surface; one or more gas channels in the support, having one or more outlets at the support surface; and one or more grooves on the support surface for receiving at least a part of an end effector for supporting the wafer-like object.

[0030] According to the present invention, at least a portion of an end effector for supporting a wafer-like object can be received in one or more grooves on a support surface. Thus, in a first arrangement, at least a portion of the end effector for supporting the wafer-like object can be inserted into one or more grooves on the support surface, with the end effector positioned between the support and the wafer-like object. For example, the end effector can be moved perpendicular to the support surface to insert at least a portion of the end effector into one or more grooves on the support surface, and / or the end effector can be moved parallel to the support surface (e.g., laterally) to insert at least a portion of the end effector into one or more grooves on the support surface. Then, the support of the wafer-like object can be transferred from the end effector to the support, and then the end effector can be withdrawn laterally from the one or more grooves on the support surface while the wafer is supported by the support.

[0031] In addition, in a second arrangement, the end effector supporting the wafer-like object can be positioned such that the wafer-like object is between the end effector and the support. Then, the support of the wafer-like object can be transferred from the end effector to the support, and then the end effector and / or the support can be moved away.

[0032] This helps to position the wafer-like object on the support such that a first major surface of the wafer-like object faces away from the support, or a second major surface of the wafer-like object faces away from the support. This can help to subsequently position the wafer-like object on a wafer support (such as a rotating chuck) of a processing device such that the first major surface of the wafer-like object faces upward for processing, or the second major surface of the wafer-like object faces upward for processing.

[0033] For example, this can be advantageous when it is necessary to process both the front and back sides of a wafer, and thus it is necessary to continuously expose both sides of the wafer-like object in one or more processing devices for processing.

[0034] The device according to the first aspect of the present invention can have any one of the following optional features, or, in a compatible case, any combination of the following optional features.

[0035] The device can also be referred to as an apparatus.

[0036] The device can be a conveying device, or a transporting device, or a moving device.

[0037] The device can be a wafer conveying device.

[0038] Conveying the wafer-like object can mean moving or transporting the wafer-like object.

[0039] The wafer-like object can be a wafer, such as a semiconductor wafer like a silicon wafer.

[0040] The wafer-like object can be disc-shaped or disk-shaped.

[0041] The wafer-like object can be circular or substantially circular.

[0042] The support member can be a part of the device that faces the wafer-like object being transported by the device.

[0043] The support member can be a part of the device that is used to support the wafer-like object being transported by the device.

[0044] The support member can be used to support the wafer-like object, or is configured or adapted to support the wafer-like object.

[0045] The support member can comprise a single component or multiple components.

[0046] The support surface can be a surface of the support member that faces the wafer-like object being transported by the device.

[0047] The support surface can be used to support the wafer-like object, or is configured or adapted to support the wafer-like object.

[0048] The support surface can be used to support the wafer-like object in a non-contact manner, or is configured or adapted to support the wafer-like object.

[0049] The support surface can be planar, a plane, or flat, or substantially planar, a plane, or flat.

[0050] The support surface can be the bottom surface or lower surface of the support member.

[0051] The support surface can be the bottom surface or lower surface of the device.

[0052] One or more gas channels can include one or more nozzles, bores, tubes, pipes, or passages.

[0053] One or more gas channels can include slits, slots, or gaps.

[0054] One or more gas channels can be used to convey, transport, or supply gas to one or more outlets, or can be configured to convey, transport, or supply gas to one or more outlets.

[0055] One or more gas channels in the support member can mean one or more gas channels within the support member, or contained within the support member, or surrounded by the support member.

[0056] Each of the one or more gas channels may have respective outlets in the support surface.

[0057] The one or more outlets may be one or more gas outlets.

[0058] The one or more outlets may be one or more openings or holes in the support surface.

[0059] The one or more outlets may include elongate outlets, such as annular outlets.

[0060] Opposite ends (opposite the outlets) of each of the one or more gas channels may be connected or configured to be connected to a gas supply arrangement or a gas supply, such as a gas supply pipe configured to supply gas to the one or more gas channels. The connection may be a direct connection or an indirect connection via another component such as an additional pipe or chamber.

[0061] The support may include a gas supply arrangement or a gas supply.

[0062] The apparatus may include or be connected or connectable to a gas supply device or a gas source for supplying gas to the one or more gas channels. For example, the gas supply device or gas source may include a gas tank or container, such as a pressurized gas.

[0063] The apparatus may include or be connected or connectable to a gas source, such as a pressurized gas source.

[0064] The one or more recesses may include one or more trenches, or troughs, or channels, or recesses, or cut-outs, or depressions, or indentations.

[0065] The one or more trenches may be adapted or configured to receive at least a portion of an end effector for supporting a wafer-like object.

[0066] The one or more recesses may be used to receive at least a portion of the distal end of the end effector.

[0067] The one or more recesses may be used to receive the distal end of the end effector.

[0068] The one or more recesses may be used to receive at least a portion of a support portion of the end effector, the support portion being configured to support a wafer-like object. The one or more recesses may be used to receive the support portion of the end effector, the support portion being configured to support a wafer-like object.

[0069] One or more grooves may be adapted or configured to receive at least a portion of a support of an end effector, the support being configured to support a wafer-like object. One or more grooves may be adapted or configured to receive a support of an end effector, the support being configured to support a wafer-like object.

[0070] At least a portion of the end effector may be or include a distal end of the end effector.

[0071] One or more grooves may be configured to receive the entire thickness of at least a portion of the end effector, such as the entire thickness of the distal end of the end effector. This may be achieved by the depth of the one or more grooves being the same as or greater than the thickness of that portion of the end effector.

[0072] One or more grooves may be used to receive one or more forks or fingers or prongs or blades of the end effector.

[0073] One or more grooves may be used to receive a forked end of the end effector.

[0074] At least a portion of the end effector may be inserted into one or more grooves by movement of the end effector perpendicular to the support surface.

[0075] In addition, or as an alternative, at least a portion of the end effector may be inserted into one or more grooves by movement of the end effector parallel to the support surface, such as by lateral or sideward movement of the end effector relative to the support surface or support.

[0076] One or more grooves may be adapted or configured to receive at least a portion of the end effector when supporting or transporting a wafer-like object by the device.

[0077] One or more grooves may be adapted or configured to laterally insert at least a portion of the end effector into one or more grooves when supporting or transporting a wafer-like object by the device.

[0078] One or more grooves may be adapted or configured to laterally withdraw at least a portion of the end effector from one or more grooves when supporting or transporting a wafer-like object by the device.

[0079] The device may further include a plurality of restraint elements configured to restrain lateral movement of the wafer-like object transported by the device relative to the support surface.

[0080] The support may include a plurality of restraint elements.

[0081] The restricting element may include an arm, such as a guiding arm, a pin, a protrusion, a member, or a part.

[0082] The restricting element may be located at the end of respective arms that may extend radially along the support. These arms may be linearly extensible arms.

[0083] The restricting element may be disposed around or outside the perimeter or circumference or outer edge of the support surface.

[0084] The restricting element may project beyond the support surface of the device.

[0085] The position of the restricting element relative to the support surface is adjustable. For example, the position of the restricting element may be adjusted radially relative to the support surface.

[0086] A plurality of restricting elements may be configured to contact the circumferential edge of the wafer-like object transported by the device when the wafer-like object is laterally displaced relative to the support surface.

[0087] A plurality of restricting elements may form a circumferential alignment surface, an alignment line, or an alignment point, the position of which is adjustable, such as the radial position is adjustable.

[0088] For example, there may be three or more restricting elements.

[0089] One or more gas channels may be configured to supply gas (from one or more outlets) to support the wafer-like object according to Bernoulli's principle or effect.

[0090] One or more gas channels may be configured to supply gas (from one or more outlets) to support the wafer-like object in a non-contact manner.

[0091] One or more gas channels may be configured to supply gas (from one or more outlets) to form an air cushion between the support surface of the device and the wafer-like object.

[0092] One or more gas channels may be configured to supply gas (from one or more outlets) to form a low pressure (or a lower pressure or a reduced pressure) in at least a partial region between the support surface and the wafer-like object. For example, the low pressure (or the reduced pressure) may be formed at least in the central region of the support surface. Thus, the wafer-like object is sucked towards the support surface due to the low pressure.

[0093] One or more gas channels may be configured to supply gas (from one or more outlets) to support the wafer-like object on the air cushion and maintain a certain spacing from the support surface, such as below the support surface.

[0094] The device may include a plurality of gas channels in a support, each gas channel having a respective outlet at a support surface.

[0095] The plurality of outlets may be arranged on the support surface in a circular symmetry or substantially circular symmetry manner.

[0096] Each of the plurality of outlets may be arranged on the support surface in one or more arcs or parts or segments of a circle.

[0097] One or more gas channels may each form an angle or be inclined outwardly relative to the support surface.

[0098] One or more gas channels may each form an angle or be inclined outwardly relative to the support surface when extending towards the support surface.

[0099] One or more gas channels may each form an angle or be inclined outwardly, away from the center of the support surface.

[0100] One or more gas channels may each form an angle or be inclined outwardly, away from the center of the support surface when extending towards the support surface.

[0101] One or more gas channels may each form an angle or be inclined radially outward relative to the support surface.

[0102] One or more gas channels may each be inclined radially outward, away from the center of the support surface.

[0103] One or more gas channels may each form an angle or be inclined so that the gas is discharged from one or more outlets at an angle to the support surface in an outward direction (i.e., away from the center of the support surface) relative to the support surface.

[0104] The angle with the support surface may be greater than 0° and less than 90°.

[0105] The angle may be an acute angle.

[0106] One or more gas channels may each form an angle greater than 0° and less than 90° with the support surface.

[0107] One or more grooves may each be linear or substantially linear.

[0108] One or more grooves may each extend linearly or substantially linearly in the plane of the support surface, or parallel to the plane of the support surface.

[0109] The device may include two or more grooves.

[0110] Each of the one or more grooves may extend to the edge of the support surface, such that the end effector may be laterally inserted into the one or more grooves from the edge of the support surface or the support member, and / or such that the end effector may be laterally withdrawn from the one or more grooves from the edge of the support surface or the support member.

[0111] Thus, the end effector may be laterally moved relative to the device or the support surface of the device (i.e., moved parallel to the support surface) so that at least a portion of the end effector (e.g., the distal end of the end effector) is received in the one or more grooves, and / or so that the end effector is withdrawn from the one or more grooves.

[0112] As described above, the one or more grooves may be adapted or configured to receive at least a portion of the end effector when the wafer-like object is supported or transported by the device. Thus, when the wafer-like object is supported or transported by the device, the end effector may be inserted between the device and the wafer-like object.

[0113] The device may include one or more openings or holes or cuts in the one or more grooves.

[0114] The device may include one or more openings or holes or cuts in the one or more grooves of the support surface.

[0115] The one or more openings or holes or cuts may be configured to allow gas entering the one or more grooves to exit the one or more grooves via the one or more openings or holes or cuts. This may prevent an increase in pressure in the one or more grooves.

[0116] The one or more openings or holes or cuts may be configured to allow gas to exit the one or more grooves via the support surface.

[0117] The one or more openings or holes or cuts are larger than the one or more outlets of the one or more gas channels.

[0118] The one or more openings or holes or cuts may extend from one side of the support member to the opposite side of the support member.

[0119] The device may include a gas distribution chamber in the support member, wherein each of the one or more gas channels is connected to the gas distribution chamber.

[0120] The device may include a gas supply pipe connected to the gas distribution chamber for supplying gas to the gas distribution chamber.

[0121] When the device is used to transport a wafer-like object, the support surface may be located on the bottom side of the device.

[0122] When the device is used to transport a wafer-like object, the support surface may be the bottom surface or the lower surface of the device.

[0123] For example, the device can be used to transport wafer-like objects with a diameter of 300 mm.

[0124] The device can be configured to support the wafer-like object from above the wafer-like object.

[0125] In addition, or as an alternative, the device can be configured to support the wafer-like object from below the wafer-like object.

[0126] The device can further include a transfer device or a transfer mechanism or a manipulator for moving the support 1. For example, the device can include a robotic arm or other actuator for moving the support.

[0127] The device can include a rotating mechanism or a flipping mechanism for flipping the support. Flipping the support means flipping the support up and down, or turning the support over, for example, making the surface of the support that was previously facing up face down.

[0128] The rotating mechanism or the flipping mechanism can alternatively be referred to as a rotating actuator or a flipping actuator or a rotating module or a flipping module.

[0129] This can help position the wafer-like object from the end effector onto the support, with the first major surface of the wafer-like object facing away from the support, or the second major surface of the wafer-like object facing away from the support.

[0130] Alternatively, or additionally, the end effector can be rotated or flipped in order to flip the end effector.

[0131] This can help position the wafer-like object from the end effector onto the support, with the first major surface of the wafer-like object facing away from the support, or the second major surface of the wafer-like object facing away from the support.

[0132] The device can include two supports, and the support surfaces of the two supports face in opposite or substantially opposite directions. For example, the two supports can be arranged in a unit, with one support located above the other support, and the support surfaces of the supports facing in opposite directions.

[0133] The device can include a rotating mechanism, an actuator or a module, or a flipping mechanism, an actuator or a module for flipping the unit.

[0134] The wafer-like object can be positioned on the upper support in the support by using an end effector that supports the wafer-like object from above, and the wafer-like object is located between the end effector and the upper support in the support.

[0135] Alternatively, an end effector that supports the wafer-like object from above can also be used to position the wafer-like object on the lower support member in the support member, and the end effector is located between the wafer-like object and the lower support member in the support member.

[0136] This can help position the wafer-like object from the end effector onto the support member, such that the first major surface of the wafer-like object faces away from the support member, or the second major surface of the wafer-like object faces away from the support member.

[0137] According to a second aspect of the present invention, there is provided a flat plate for use in an apparatus for transporting a wafer-like object, comprising: a support surface; one or more gas channels in the flat plate, having one or more outlets on the support surface; and one or more grooves on the support surface for receiving at least a portion of an end effector for supporting the wafer-like object.

[0138] The second aspect of the present invention may have any features of the first aspect of the present invention described above, unless incompatible.

[0139] The flat plate of the second aspect of the present invention may have any features of the support member of the first aspect of the present invention, unless incompatible.

[0140] The support surface of the second aspect of the present invention may have any features of the support surface of the first aspect of the present invention, unless incompatible.

[0141] One or more gas channels of the second aspect of the present invention may have any features of one or more gas channels of the first aspect of the present invention, unless incompatible.

[0142] One or more outlets of the second aspect of the present invention may have any features of one or more outlets of the first aspect of the present invention, unless incompatible.

[0143] One or more grooves of the second aspect of the present invention may have any features of one or more grooves of the first aspect of the present invention, unless incompatible.

[0144] The flat plate of the second aspect of the present invention may correspond to or be used as the support member or a part of the support member of the first aspect of the present invention.

[0145] The flat plate may be a Bernoulli plate, or a Bernoulli grip plate, or a Bernoulli gripper, or a Bernoulli grip.

[0146] According to a third aspect of the present invention, there is provided a support for use in an apparatus for transporting wafer-like objects, comprising: a support surface; one or more gas channels in the support, having one or more outlets on the support surface; and one or more grooves on the support surface for receiving at least a portion of an end effector for supporting the wafer-like object.

[0147] The support according to the third aspect of the present invention may have any feature of the support according to the first aspect of the present invention, unless incompatible.

[0148] According to a fourth aspect of the present invention, there is provided an apparatus for transporting wafer-like objects, the apparatus comprising a flat plate according to the second aspect of the present invention or a support according to the third aspect of the present invention.

[0149] The fourth aspect of the present invention may have any feature of the first, second or third aspect of the present invention, unless incompatible.

[0150] According to a fifth aspect of the present invention, there is provided a device, the device comprising: an apparatus according to the first or fourth aspect of the present invention; and a robotic arm having an end effector; wherein the end effector is configured to be at least partially insertable into one or more grooves in the support surface of the apparatus.

[0151] The device may further comprise a wafer processing device or a wafer processing apparatus.

[0152] The device may comprise a spin etching and / or spin cleaning device.

[0153] The end effector may be blade-shaped or flat-plate-shaped.

[0154] The end effector may have one or more forks or fingers or spines or blades, for example two forks or fingers or spines or blades.

[0155] The end effector may have a forked end.

[0156] The end effector may have a support surface that is planar or flat or substantially planar or flat for supporting the wafer-like object.

[0157] The end effector may have a support portion configured or adapted to support the wafer-like object.

[0158] The end effector may be a Bernoulli-type end effector or a Bernoulli end effector.

[0159] The end effector may be configured to support the wafer-like object in a non-contact manner according to the Bernoulli principle or effect.

[0160] The end effector may include a support surface having one or more gas outlets.

[0161] One or more gas outlets may be configured to supply gas to support a wafer-like object in a non-contact manner according to Bernoulli's principle or effect.

[0162] One or more gas outlets may be configured to output gas from the support surface in an outward direction relative to the support surface and at an angle to the support surface. The angle may be greater than 0° and less than 90°.

[0163] One or more gas outlets may be configured to form an air cushion between the support surface of the end effector and the wafer-like object, thereby forming a low pressure (or lower pressure or reduced pressure) in at least a portion of the area between the support surface and the wafer-like object. This means that the wafer-like object is attracted to the support surface of the end effector by the low pressure, such that the wafer-like object is held by the end effector, but the air cushion prevents the wafer-like object from contacting the support surface of the end effector. Thus, the wafer-like object is supported on the air cushion and is kept at a certain distance from the support surface of the end effector.

[0164] The end effector may be configured to be located below the wafer-like object and support the wafer-like object from below.

[0165] In addition, or as an alternative, the end effector may be configured to be located above the wafer-like object and support the wafer-like object from above.

[0166] The end effector may be configured to be inserted between different wafers stacked in a wafer cassette.

[0167] The end effector may be configured to be at least partially received in one or more grooves when the wafer-like object is supported or transported by the device.

[0168] The end effector may be configured to be laterally inserted into one or more grooves.

[0169] The present invention includes the aspects described above and combinations of preferred features, unless such combinations are clearly not permitted or are explicitly avoided.

[0170] The apparatus may further include a support for supporting the wafer cassette.

[0171] The robotic arm may be configured to transfer wafers from the wafer cassette to the device using the end effector.

[0172] The device may be configured to transfer the wafers transferred to the device by the robotic arm to a wafer processing apparatus for processing.

[0173] Transferring the support of the wafer-like object from the end effector to the support may include stopping the airflow from one or more openings of the end effector and starting the airflow from one or more openings of the support.

[0174] The gas can be nitrogen. BRIEF DESCRIPTION OF THE DRAWINGS

[0175] Embodiments and experiments illustrating the principles of the present invention will now be discussed with reference to the drawings:

[0176] Figure 1 Schematic diagram of the first main side of a device according to an embodiment of the present invention.

[0177] Figure 2 is Figure 1 Perspective schematic diagram of the first main side of the device.

[0178] Figure 3 is Figure 1 Perspective schematic diagram of the second main side of the device.

[0179] Figure 4 Schematic diagram of a device according to an embodiment of the present invention.

[0180] Figure 5 Schematic diagram of an end effector that can be used in an embodiment of the present invention.

[0181] Figure 6 Schematic diagram of a device according to an embodiment of the present invention.

[0182] Figure 7 is a partially enlarged schematic diagram of a device having a wafer Figure 6 thereof.

[0183] Figure 8 Schematic diagram of a device according to an embodiment of the present invention.

[0184] Figure 9A and Figure 9B is a schematic diagram of a known wafer transfer device. DETAILED DESCRIPTION

[0185] Aspects and embodiments of the present invention will now be discussed with reference to the drawings. Further aspects and embodiments will be apparent to those skilled in the art. All documents mentioned herein are incorporated herein by reference.

[0186] Figures 1 to 3 Schematic diagram of a flat plate (or support) that can be used in a wafer transfer device to transfer wafers. Figure 1 Schematic diagram of the first main side of the flat plate, Figure 2 perspective schematic diagram of the first main side of the flat plate, and Figure 3 perspective schematic diagram of the second main side of the flat plate.

[0187] As Figures 1 to 3As shown, the flat plate 13 is substantially circular. For example, the diameter of the flat plate can be between 250 mm and 300 mm.

[0188] The flat plate 13 includes a support surface 15 which is configured to face a wafer such as a semiconductor wafer. As described below, the support surface 15 is configured to support the wafer in a non-contact manner.

[0189] Formed on the support surface 15 are two grooves 17 for receiving at least a part of an end effector. The two grooves 17 linearly extend in the plane of the support surface 15 respectively, or are parallel to the plane of the support surface 15, and extend from one side or edge of the support surface 15 to the other side or edge of the support surface 15. Thus, the two grooves 17 span across the support surface 15.

[0190] The two grooves 17 are configured to receive two forks, fingers, prongs or blades of an end effector for supporting a wafer. In particular, by moving the end effector perpendicular to the support surface 15 and / or by moving the end effector parallel to the support surface 15, the two forks, fingers, prongs or blades of the end effector can be at least partially inserted into the two grooves 17. In addition, the two grooves 17 are configured to enable the two forks, fingers, prongs or blades of the end effector to be laterally withdrawn from the flat plate 13 from the side of the flat plate 13 when the wafer is supported by the flat plate 13.

[0191] The depth of the two grooves 17 is configured such that when the flat plate 13 is used to support or transport a wafer, the two forks, fingers, prongs or blades of the end effector can be received in the two grooves 17. For example, the depth of the two grooves 17 can be greater than the thickness of the two forks, fingers, prongs or blades of the end effector. For example, the depth of the two grooves 17 can be greater than or equal to 1 mm and less than or equal to 5 mm.

[0192] In addition, the flat plate 13 includes a plurality of gas channels which have openings 19 on the support surface 15. The gas channels are configured to supply gas via the openings 19 so as to support the wafer in a non-contact manner above or below the support surface 15 according to Bernoulli's principle or effect.

[0193] In particular, when gas is supplied via the opening 19, an air cushion is formed between the support surface 15 and the wafer opposite to the support surface 15 (e.g., below the support surface 15), wherein the airflow via the opening 19 causes a low pressure (or a lower pressure or a reduced pressure) to be formed at least in a partial area between the support surface 15 and the wafer. In particular, a low pressure is formed at least in the central area of the support surface 15. This means that the wafer is sucked towards the support surface 15 by the low pressure, so that the wafer is held by the flat plate 13, but the contact with the support surface 15 is avoided by the air cushion. Therefore, the wafer is supported on the air cushion and kept at a certain distance from the support surface 15, e.g., below the support surface 15.

[0194] When extending towards the support surface 15, the plurality of gas channels each form an angle or are inclined outwards relative to the support surface 15. Therefore, the gas is discharged from each of the plurality of outlets 19 at an angle with respect to the support surface 15 in an outward direction (i.e., away from the center of the support surface 15). The angle with the support surface 15 is greater than 0° and less than 90°, i.e., an acute angle.

[0195] As Figure 1 and Figure 2 shown, each of the plurality of outlets 19 is arranged on the support surface 15 in one or more circular arcs or parts or segments of a circle. In addition, the plurality of outlets 19 are arranged in a circular symmetry or substantially circular symmetry on the support surface 15.

[0196] Figure 4 is a schematic diagram of a device according to an embodiment of the present invention, e.g., Figures 1 to 3 the flat plate 13 in the shown embodiment. As Figure 4 shown, when extending towards the support surface 15, the plurality of gas channels 21 in the flat plate 13 are each inclined outwards, away from the center of the support surface 15. Therefore, with respect to the center of the support surface 15, the gas is discharged from the respective outlets 19 of the gas channels 21 at an angle α greater than 0° and less than 90° with the support surface 15.

[0197] As Figure 4 shown, the opposite ends of the gas channels 21 and the outlets 19 are connected to a gas distribution chamber 23 in the flat plate 13. Therefore, gas can be supplied from the gas distribution chamber to each gas channel 21. In addition, the flat plate 13 includes a gas inlet 25 connected to the gas distribution chamber 23, and gas can be supplied from the outside of the flat plate 13 to the gas distribution chamber 23 via the gas inlet 25. Of course, the gas distribution chamber 23 and the gas inlet are only an example of the arrangement for supplying gas to the gas channels 21, and alternative arrangements are possible and within the scope of the present invention. For example, the gas supply pipes can be directly connected to each gas channel 21. In addition, the position of the gas inlet 25 can be different from Figure 4 the position shown.

[0198] As Figures 1 to 3 shown, the flat plate 13 includes a plurality of cuts 27 in the groove 17. The cuts 27 provide a flow path through the entire thickness of the flat plate 13 in the groove 17. In particular, the cuts 27 provide holes or openings that extend from one major side or major surface of the flat plate 13 to the other major side or major surface of the flat plate 13. These cuts 27 allow the gas output from the outlet 19 of the gas channel and the gas entering the groove 17 to escape from the groove 17. Otherwise, the pressure in the groove 17 may increase and prevent the wafer from being properly held under low pressure (or lower pressure or reduced pressure) according to Bernoulli's principle or effect.

[0199] Figure 5 is a schematic diagram of an end effector that can be used in an embodiment of the present invention. As Figure 5 shown, the end effector 29 includes a body portion 31 and two forks, fingers, spines, or blades 33 that extend from the body portion 31. The end effector 29 can be flat plate-shaped or blade-shaped.

[0200] The body portion 31 can be configured (e.g., shaped) to be received by the distal end of a robotic arm. Thus, the end effector 29 can be connected or connectable to the distal end of a robotic arm.

[0201] The forks, fingers, spines, or blades 33 of the end effector 29 provide a support portion of the end effector 29 for supporting a wafer. In this embodiment, the end effector 29 is a Bernoulli-type end effector that is configured to support the wafer in a non-contact manner according to Bernoulli's principle or effect in the manner described above.

[0202] Thus, the end effector 29 includes a plurality of gas channels, and the outlets 35 of which are formed in the support surface 37 of each of the forks, fingers, spines, or blades 33. Each gas channel slopes outward from the center of the end effector 29 toward the support surface 37, so that the gas is discharged outward from the outlet 35 at an angle greater than 0° and less than 90° with respect to the support surface 37.

[0203] The end effector 29 further includes a gas supply device connected to each gas channel. For example, the gas supply device can include a gas supply pipe. The gas supply device can further include a gas distribution chamber connected to each gas channel.

[0204] According to Bernoulli's principle or effect, the end effector 29 can be configured to support the wafer from above the wafer. Thus, the outlets 35 can be formed on the lower surface or bottom surface of the end effector 29.

[0205] The end effector 29 is configured to be at least partially insertable into the recess 27 of the flat plate 13. For example, at least a portion of the forks, fingers, spikes, or blades 33 of the end effector 29 can be laterally inserted into the recess 27 of the flat plate 13.

[0206] The depth of the recess 27 in the flat plate 13 is greater than the thickness of the forks, fingers, spikes, or blades 33 of the end effector 29. Thus, the recess 27 can accommodate the full thickness of the forks, fingers, spikes, or blades 33.

[0207] Thus, the forks, fingers, spikes, or blades 33 of the end effector 29 can be laterally inserted into the recess 27 of the flat plate 13 (i.e., inserted laterally from the side of the flat plate 13), while the wafer is supported by the flat plate 13.

[0208] Figure 6 FIG. [FIG. number not provided] is a schematic diagram of a device according to an embodiment of the present invention, the device including the flat plate 13 of the first embodiment. In particular, Figure 6 FIG. [FIG. number not provided] is a schematic diagram of a wafer handling device 39 including the above-mentioned flat plate 13.

[0209] As Figure 6 shown, according to the first embodiment of the present invention, the device 39 includes two flat plates 13. The two flat plates 13 are arranged one above the other, and the support surfaces 15 of the flat plates 13 face in opposite directions (away from each other). Thus, when the support surface 15 of one of the flat plates 13 faces upward, the support surface 15 of the other flat plate 13 faces downward. Each flat plate 13 forms a respective support for supporting the wafer. Thus, the device 39 includes two supports for supporting the wafer.

[0210] Of course, in other embodiments, the device 39 can include only a single flat plate 13, and as Figure 6 shown, more than one support is not necessary.

[0211] The two support flat plates are connected together to form a unit 41, and the unit 41 is rotatably connected to the arm 43 of the device 39 by a rotary connector 45. The unit 41 can be rotated using the rotary connector 45, thereby flipping the unit 41. When flipped, the support surface 15 that was originally upward will face downward, and the support surface 15 that was originally downward will face upward. For example, the unit 41 can be rotated between a first configuration and a second configuration, where in the first configuration, the support surface 15 of the first flat plate 13 faces upward and the support surface 15 of the second flat plate 13 faces downward, and in the second configuration, the support surface 15 of the first flat plate 13 faces downward and the support surface 15 of the second flat plate 13 faces upward.

[0212] The arm 43 is pivotally or rotatably connected to the linear motion mechanism 47 such that the arm 43 can pivot or rotate relative to the linear motion mechanism. For example, the arm 43 can pivot or rotate between a first configuration in which the arm 43 is horizontal or substantially horizontal and a second configuration in which the arm 43 is vertical or substantially vertical.

[0213] The linear motion mechanism can be used to linearly move the arm 43, such as moving in a direction perpendicular to the arm 43. For example, the linear motion mechanism 47 can be a linear actuator.

[0214] Each wafer plate 13 can have any of the features of the wafer plates 13 described above and / or Figures 1 to 4 shown. For the sake of clarity and brevity, these features are not individually numbered herein and are not repeated here. Figure 6 in

[0215] Figure 7 An enlarged view of the apparatus 41 showing the wafer 49 received by an upper wafer plate 13.

[0216] In operation, an end effector that supports the wafer from above according to the Bernoulli effect can be used to position the wafer on any one of the two wafer plates 13. For example, the end effector can be placed above the upper wafer plate of the two wafer plates, with the wafer located between the end effector and the upper wafer plate 13. Then, the support for the wafer can be transferred from the end effector to the upper wafer plate 13, and then the end effector and / or the unit 41 can be moved away. For example, the supply of gas to the outlet of the end effector can be stopped, and gas can be started to be delivered to the opening 19 of the upper wafer plate so as to transfer the support for the wafer to the upper wafer plate 13.

[0217] Alternatively, the end effector can be placed below the lower one of the wafer plates 13, with the end effector located between the wafer and the lower wafer plate 13. The end effector can be moved perpendicular to the support surface 15 of the lower wafer plate such that at least a portion of the end effector is located in the groove 17 of the support surface 15. Then, the support for the wafer can be transferred from the end effector to the lower wafer plate 13. Then, the end effector can be laterally withdrawn from the groove 17 on the support surface 15 while the wafer is supported by the lower wafer plate 13.

[0218] When the wafer is placed on the upper wafer plate 13 in the above manner, the first major surface of the wafer faces away from the upper wafer plate 13. Subsequently, when the unit 41 is flipped over and the wafer is placed on the rotating chuck of the wafer processing apparatus, the second major surface of the wafer will face upward and be exposed for processing.

[0219] Conversely, when the wafer is placed on the lower plate 13 in the above-described manner, the second major surface of the wafer faces away from the lower plate 13. When the wafer is subsequently placed on the rotating chuck of the wafer processing apparatus, the first major surface of the wafer will face upward and be exposed for processing.

[0220] Therefore, the present invention can place the wafer on the rotating chuck of the wafer processing apparatus so that either major surface of the wafer is exposed for processing, thereby enabling processing of either major surface or sequential processing of both major surfaces.

[0221] In an alternative embodiment, there may be only a single plate 13 (or support). The single plate 13 can be flipped so that the support surface of the plate 13 faces upward or downward. Thus, as Figure 6 and Figure 7 shown, more than one plate 13 is not necessary.

[0222] In another alternative embodiment, the plate 13 may not be flippable or rotatable. Instead, the end effector may be flippable or rotatable. Thus, as Figure 6 and Figure 7 shown, the flippable or rotatable plate 13 is not necessary.

[0223] Furthermore, or as an alternative, in other embodiments, the support may not be in the form of the plate as Figures 1 to 3 shown. Instead, the support may comprise a body that is not plate-shaped and that has a support surface and the other features described above.

[0224] As Figure 6 and Figure 7 shown, each plate 13 includes a plurality of restricting elements 48 configured to restrict lateral movement of the wafer transported by the plate 13 relative to the support surface 15 of the plate 13.

[0225] In particular, each restricting element 48 includes a respective pin that projects from the plate 13 beyond the support surface 15 of the plate 13. Each pin is located on a respective linearly extensible arm 50 that extends in the radial direction of the plate so that the radial position of the pin can be adjusted.

[0226] The plurality of pins are arranged around the circumference of the support surface 15 so as to contact the radially outer edge of the wafer supported by the support when the wafer is laterally displaced relative to the support surface 15. Thus, the plurality of pins restrict or constrain the lateral movement of the wafer relative to the support surface. However, the plurality of pins do not grip the wafer.

[0227] Figure 8Schematic diagram of a device according to an embodiment of the present invention. The device 51 includes a support 53 for supporting a wafer cassette containing a plurality of wafers. The device 51 further includes a robotic arm 55 having an end effector, which may have any of the features of the above-mentioned robotic arm and end effector. The robotic arm is configured to pick up wafers from the wafer cassette using the end effector.

[0228] In addition, the device 51 further includes a wafer transfer device 57, which may have any of the features of the above-mentioned wafer transfer device. The robotic arm 55 transports the wafers picked up from the wafer cassette to the wafer transfer device 57. Then, the support of the wafers is transferred from the end effector to the wafer transfer device 57.

[0229] In addition, the device 51 further includes a wafer processing device 59. For example, the wafer processing device may include a spin etching or spin cleaning device. The wafer processing device 59 may include a wafer support device, such as a spin chuck for receiving and supporting wafers from the wafer transfer device 57. The wafer processing device 59 may further include a liquid dispenser for dispensing a processing liquid onto the upper surface of the wafers supported by the wafer support.

[0230] The device 39 further includes a controller for controlling the operation of the device 39, such as a microprocessor. For example, the controller may control the supply of gas to the gas channels of the plate 13 to control the picking up, transporting, and dropping of the wafers by the support.

[0231] Of course, in other embodiments, the configuration of the end effector may be different from Figure 5 that shown, and thus the number and / or configuration of the grooves on the support surface may also be different. For example, the end effector may not have forks, fingers, spikes, or blades, or may have one or more forks, fingers, spikes, or blades, and the support surface may have a corresponding number of one or more grooves.

[0232] In addition, the number and / or arrangement of the gas channels and outlets may be different from Figures 1 to 4 that shown.

[0233] In other embodiments of the present invention, the support surface and the grooves may be formed in the support of the device for transporting wafers, rather than in the plate of the first embodiment of the present invention. For example, the support may be an integral support having a support surface and grooves.

[0234] In the above description, or in the following claims, or in the drawings, the disclosed features represented in their specific forms, or by means for performing the disclosed functions, or by methods or processes for obtaining the disclosed results, may be used singly or in any combination of these features, as appropriate, to implement the present invention in its various forms.

[0235] Although the present invention has been described in connection with the above exemplary embodiments, many equivalent modifications and variations will be apparent to those skilled in the art upon obtaining the present disclosure. Therefore, the above-described exemplary embodiments of the present invention are considered to be illustrative and not restrictive. Various changes may be made to the embodiments without departing from the spirit and scope of the present invention.

[0236] To avoid any doubt, any theoretical explanations provided herein are for the purpose of enhancing the reader's understanding. The inventors do not wish to be bound by any of these theoretical explanations.

[0237] Any chapter headings used herein are for organizational purposes only and should not be construed as limiting the subject matter described.

[0238] In this specification, including the following claims, unless the context requires otherwise, the words "comprise" and "include", and variations such as "comprises", "comprising", and "including", will be understood to imply the inclusion of the stated integer or step or group of integers or steps, but not the exclusion of any other integer or step or group of integers or steps.

[0239] It should be noted that, as used in this specification and the appended claims, the singular forms "a", "an", and "the" include plural referents unless the context clearly dictates otherwise. Ranges may be expressed herein as from "about" a particular value, and / or to "about" another particular value. When such a range is expressed, another embodiment includes from one particular value and / or to another particular value. Similarly, when values are expressed as approximations by use of the preposition "about", it is understood that the particular value so modified forms another embodiment. The term "about" associated with a numerical value is optional and, for example, may represent ±10%.

Claims

1. An apparatus for transporting wafer-like objects, which comprises: a support having a support surface; one or more gas channels in the support, which have one or more outlets at the support surface; and one or more grooves on the support surface for receiving at least a portion of an end effector for supporting the wafer-like object.

2. The apparatus according to claim 1, wherein the apparatus further comprises a plurality of restricting elements configured to restrict lateral movement of the wafer-like object transported by the apparatus relative to the support surface.

3. The apparatus according to claim 1 or 2, wherein the one or more gas channels are configured to supply gas to support the wafer-like object according to Bernoulli's principle.

4. The apparatus according to any one of the preceding claims, wherein the one or more gas channels are configured to supply gas to support the wafer-like object in a non-contact manner.

5. The apparatus according to any one of the preceding claims, wherein the apparatus comprises a plurality of the gas channels in the support, each of the gas channels having a corresponding outlet in the support surface.

6. The apparatus according to any one of the preceding claims, wherein each of the one or more gas channels is inclined outward relative to the support surface.

7. The apparatus according to any one of the preceding claims, wherein each of the one or more gas channels forms an angle greater than 0° and less than 90° with the support surface.

8. The apparatus according to any one of the preceding claims, wherein each of the one or more grooves is linear or substantially linear.

9. The apparatus according to any one of the preceding claims, wherein the apparatus comprises two or more grooves.

10. The apparatus according to any one of the preceding claims, wherein each of the one or more grooves extends to the edge of the support surface.

11. The apparatus according to any one of the preceding claims, wherein the apparatus comprises one or more openings or cuts in the one or more grooves.

12. The apparatus according to any one of the preceding claims, wherein the apparatus comprises a gas distribution chamber in the support, wherein each of the one or more gas channels is connected to the gas distribution chamber.

13. The apparatus according to any one of the preceding claims, wherein when the apparatus is used to transport the wafer-like object, the support surface is located on the lower side of the apparatus.

14. The apparatus according to any one of the preceding claims, wherein the apparatus is configured to support the wafer-like object from above the wafer-like object.

15. The apparatus according to any one of the preceding claims, wherein the apparatus comprises a rotating mechanism for flipping the support.

16. The apparatus according to any one of the preceding claims, wherein the apparatus comprises two supports arranged such that their support surfaces face in opposite directions or substantially opposite directions.

17. A flat plate used in an apparatus for transporting wafer-like objects, which comprises: a support surface; One or more gas channels in the flat plate, which have one or more outlets in the support surface; And One or more grooves in the support surface, the grooves being for receiving at least a portion of an end effector for supporting a wafer-like object.

18. A support used in an apparatus for transporting a wafer-like object, which Comprises: A support surface; One or more gas channels in the support, which have one or more outlets in the support surface; And One or more grooves in the support surface, the grooves being for receiving at least a portion of an end effector for supporting a wafer-like object.

19. An apparatus for transporting a wafer-like object, which comprises the flat plate according to claim 17 or the support according to claim 18.

20. A device, which Comprises: The apparatus according to any one of claims 1 to 16 or 19; And A robotic arm having an end effector; wherein, The end effector is configured to be at least partially inserted into the one or more grooves in the support surface of the apparatus.

21. The device according to claim 20, wherein the end effector is a Bernoulli type end effector.

22. The device according to claim 20 or 21, wherein the end effector comprises a support surface having one or more gas outlets.

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