Efficient broken silicon wafer impurity removing and sorting device

Abstract

The invention relates to the technical field of broken silicon wafer treatment, in particular to an efficient broken silicon wafer impurity removing and sorting device which comprises a base, two drifting units are installed at the top of the base, each drifting unit is composed of a stand column and a drifting groove fixed to the top end of the stand column, the drifting grooves are obliquely arranged, supporting strips are fixedly arranged on the inner side of each drifting groove, and the supporting strips are arranged on the top end of the stand column. An air gathering cover is movably connected to the tops of the supporting strips in a lap joint mode, an air exhaust mechanism used for synchronously supplying air to the two drifting grooves is installed between the two drifting grooves, and a discharging mechanism used for recycling sorted broken silicon wafers and foreign matter is installed at the low-position end of each drifting groove. According to the efficient and energy-saving blanking device, the exhaust mechanism capable of adjusting the air outlet angle is used in cooperation with the air gathering cover, the wind power dissipation amount can be greatly reduced, wind power is utilized to the maximum extent, wind power electricity consumption is saved, and the blanking speed is increased.

Description

Technical Field

[0001] The present invention relates to the technical field of broken silicon wafer processing, and specifically to an efficient impurity removal and sorting device for broken silicon wafers. Background Art

[0002] Due to the advantages of being pollution-free, inexhaustible, and having no regional restrictions, solar energy makes solar power generation the main direction of new energy development and utilization today. As an important component of solar power generation, the production and processing technology of solar silicon wafers has become increasingly mature. Currently, in the cleaning process of multi-wire cut fragments and cleaning and inspection fragments of solar silicon wafers, it is very necessary to perform drift impurity removal on the cleaned broken silicon wafers.

[0003] In the prior art, a sloped plastic trough is mostly used for drift impurity removal of broken silicon wafers. With the potion as the carrier, the broken silicon wafers float on the surface. The broken silicon wafers on the surface of the potion are blown by a fan, so that the broken silicon wafers drift downward and flow into the silicon wafer collection barrel, while the gravel and other metals mixed in the broken silicon wafers sink to the bottom to achieve the purpose of drift separation of foreign objects.

[0004] However, the above prior art still has certain defects. That is, during use, the wind overflows seriously, resulting in waste of wind power, low drift efficiency, and at the same time, greatly increasing the electricity consumption of the fan, causing serious energy waste. Summary of the Invention

[0005] The purpose of the present invention is to provide an efficient impurity removal and sorting device for broken silicon wafers to solve the problems raised in the above background art.

[0006] The purpose of the present invention can be achieved by the following technical solutions:

[0007] An efficient impurity removal and sorting device for broken silicon wafers includes a base. Two drift units are installed on the top of the base. Each drift unit consists of a column and a drift trough fixed at the top of the column, and the drift trough is inclined. A support bar is fixedly arranged inside each drift trough, and a wind gathering cover is movably lapped on the top of the support bar. An exhaust mechanism for synchronously supplying air to the two drift troughs is installed between the two drift troughs;

[0008] A discharging mechanism for separately recovering the sorted broken silicon wafers and foreign objects is installed at the low end of each drift trough, and a liquid discharging mechanism for circulating and supplying the liquid medicine is provided between each drift trough and the base.

[0009] In a preferred embodiment, an air return groove is opened on the wind gathering cover. A wind guiding plate is fixedly arranged at the position of the air inlet port of the air return groove corresponding to the inside of the drift trough. A plurality of exhaust grooves communicating with the air return groove are opened at the bottom of the wind gathering cover, and the exhaust grooves are inclined.

[0010] In a preferred embodiment, the exhaust mechanism includes a U-shaped support groove formed on two floating troughs and a U-shaped frame disposed between the two floating troughs. L-shaped support plates are fixedly connected between the U-shaped frame and the two floating troughs. A ring cylinder is horizontally and fixedly penetrated through the bottom end of the U-shaped frame. An exhaust main pipe is rotatably installed inside the ring cylinder through a bearing.

[0011] A supply air pipe communicating with the inside of the ring cylinder is fixedly penetrated through the top of the U-shaped frame. A control valve is provided on the supply air pipe. An annular arc groove is formed inside the ring cylinder. An air inlet facing the annular arc groove is formed on the outside of the exhaust main pipe. Exhaust branch pipes are communicated and provided at positions corresponding to the inside of each floating trough on the outside of the exhaust main pipe. Sealing end caps are threadedly connected to both ends of the exhaust main pipe. Sealing rings are fixedly provided at the joints between the two ends inside the ring cylinder and the exhaust main pipe.

[0012] In a preferred embodiment, a driving part for adjusting the air outlet angle of the exhaust branch pipe is further provided on the outside of the U-shaped frame. The driving part includes a mounting frame fixed on the outside of the U-shaped frame and a gear ring fixedly sleeved on the outside of the exhaust main pipe. A gear meshing with the gear ring is rotatably installed inside the mounting frame. A driving motor for driving the gear to rotate is fixedly installed on the outside of the mounting frame.

[0013] In a preferred embodiment, the discharging mechanism includes a silicon wafer discharge port formed at the end of the floating trough and a plurality of foreign object discharge ports formed at the bottom of the floating trough near the silicon wafer discharge port. Collection boxes are fixedly provided at positions corresponding to the silicon wafer discharge port and the foreign object discharge ports on the top of the base. Intermittent discharging assemblies are provided at positions corresponding to the silicon wafer discharge port and each foreign object discharge port at the bottom of the floating trough.

[0014] The intermittent discharging assembly at the silicon wafer discharge port includes a rotating shaft one rotatably installed through the floating trough by a bearing. A discharging roller one is fixedly sleeved on the outside of the rotating shaft one at a position inside the silicon wafer discharge port. A plurality of material grooves one are formed on the outside of the discharging roller one. A side arc plate one attached to the discharging roller one is fixedly provided at the bottom of the floating trough.

[0015] The intermittent discharging assembly at the foreign object discharge port includes ear plates fixed on both sides of the bottom of the floating trough opposite to the foreign object discharge port. A rotating shaft two is rotatably installed through the two ear plates by a bearing. A discharging roller two is fixedly sleeved on the outside of the rotating shaft two at a position inside the foreign object discharge port. A plurality of material grooves two are formed on the outside of the discharging roller two. A side arc plate two attached to the discharging roller two is fixedly provided at the bottom of the floating trough. A stop bar is fixedly provided on the inner bottom of the floating trough on the side of the foreign object discharge port near the silicon wafer discharge port.

[0016] In a preferred embodiment, the discharging mechanism further includes a power assembly for driving the first discharging roller and a plurality of second discharging rollers to rotate synchronously. The power assembly includes a side frame fixed to the top of the base and flange plates fixed to both ends of the first rotating shaft and the second rotating shaft. A servo motor is fixedly installed on one side of the side frame, and a flange plate is also fixedly connected to the end of the output shaft of the servo motor;

[0017] The output shaft of the servo motor is flange-connected to one end of the first rotating shaft on one of the floating troughs. The first rotating shafts and the opposite ends of the second rotating shafts on the two floating troughs are all flange-connected. Two pulley wheels are fixedly sleeved on the outer sides of one end of each of the first rotating shaft and the second rotating shafts. The adjacent first rotating shaft and the second rotating shaft and the adjacent two second rotating shafts are all connected by belt drives.

[0018] In a preferred embodiment, the liquid discharging mechanism includes a filter screen fixed inside each collection box and a liquid medicine box fixed to the top of the base. Connecting pipes are fixedly provided between adjacent two collection boxes and between the adjacent collection box and the liquid medicine box. One end of the liquid medicine box is communicated with a liquid supply pipe extending into the corresponding floating trough. Pumps are installed on both the liquid supply pipe and the connecting pipe connected to the liquid medicine box;

[0019] The liquid discharging mechanism further includes a liquid return pipe connecting the floating trough and the corresponding liquid medicine box and an arc-shaped cover fixed between the baffle strip and the inner side of the floating trough. The end of the liquid return pipe communicating with the floating trough extends to the inner side of the arc-shaped cover.

[0020] In a preferred embodiment, blanking mechanisms are installed on the inner sides of the high-position ends of the two floating troughs. The blanking mechanism includes a third rotating shaft rotatably installed through the floating trough by bearings. Flange plates are also fixedly provided at both ends of the third rotating shaft, and a pulley wheel is also fixedly sleeved on one end of the third rotating shaft. The adjacent second rotating shaft and the third rotating shaft are connected by a belt drive. The third rotating shafts on the two floating troughs are also flange-connected;

[0021] A receiving roller is fixedly sleeved on the outer side of the third rotating shaft. A material groove three is formed on the outer side of the receiving roller. A material box is arranged on the inner side of the floating trough. The discharge port of the material box is attached to the outer side of the receiving roller. Ear blocks are fixedly connected between both ends of the material box and the inner side of the floating trough. A discharging auxiliary plate is fixedly provided at the position corresponding to the receiving roller on the inner side of the floating trough. Stopping columns arranged in a staggered manner are fixedly provided on the inner side of the discharging auxiliary plate.

[0022] In a preferred embodiment, the blanking mechanism further includes a cross bar fixed to the inner side of the floating trough and a guiding arc bar fixed to the bottoms of the two ear blocks. A U-shaped swing frame is rotatably sleeved on the outer side of the cross bar. One end of each of the two guiding arc bars movably penetrates through the U-shaped swing frame. A stop disc is fixedly provided at the end of the guiding arc bar. An arc-shaped spring fixedly connecting the stop disc and the U-shaped swing frame is sleeved on the outer side of the guiding arc bar. Poking rods are fixedly provided at the positions corresponding to both ends of the U-shaped swing frame on the outer side of the third rotating shaft. An impact column is fixedly provided on the outer side of the U-shaped swing frame.

[0023] Advantages of the present invention:

[0024] 1. By using the exhaust mechanism with adjustable air outlet angle in cooperation with the air collecting hood, the present invention can greatly reduce the wind dissipation amount, maximize the utilization of wind power, save wind power consumption, and accelerate the blanking speed.

[0025] 2. By continuously rotating the unloading roller, the present invention can synchronously achieve the intermittent discharge and collection of the sorted broken silicon wafers and the bottom sediment foreign matters, so as to achieve the purpose of continuous drift sorting and improve the production capacity of drift sorting.

[0026] 3. The present invention pumps the filtered liquid medicine into the liquid medicine tank through a pump, and returns the excessive liquid medicine in the broken silicon wafer collection area to the liquid medicine tank through a return liquid pipe, so as to realize the recycling of the liquid medicine.

[0027] 4. By using the output power of the servo motor to indirectly drive the rotation of the third rotating shaft, the present invention enables the material groove three on the material receiving roller to be intermittently communicated with the discharge port on the material box, so as to achieve intermittent small-batch blanking, avoid excessive blanking at one time and cause raw material accumulation, which is not conducive to the drift sorting process. Brief Description of the Drawings

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative efforts.

[0029] Figure 1 It is a schematic diagram of the overall structure of the first perspective of the present invention;

[0030] Figure 2 It is a schematic diagram of the overall structure of the second perspective of the present invention;

[0031] Figure 3 It is a schematic diagram of the structure of the first perspective of the drift unit of the present invention;

[0032] Figure 4 It is the present invention Figure 3 in the schematic sectional structure diagram;

[0033] Figure 5 It is a schematic diagram of the partial structure of the drift unit of the present invention;

[0034] Figure 6 It is a schematic diagram of the structure of the second perspective of the drift unit of the present invention;

[0035] Figure 7 It is a schematic diagram of the structure of the exhaust mechanism of the present invention;

[0036] Figure 8 It is a partial sectional view of the exhaust mechanism of the present invention;

[0037] Figure 9 It is a schematic structural view of the blanking mechanism of the present invention from the first perspective;

[0038] Figure 10 It is a schematic structural view of the blanking mechanism of the present invention from the second perspective;

[0039] Figure 11 It is a sectional structural view of the blanking mechanism of the present invention.

[0040] The reference numerals in the figure are as follows: 1, base; 2, column; 3, drift tank; 4, air collecting hood; 41, air guiding plate; 42, return air groove; 43, exhaust air groove; 5, exhaust mechanism; 51, U-shaped support groove; 52, U-shaped frame; 53, L-shaped support plate; 54, annular cylinder; 55, main exhaust pipe; 56, exhaust branch pipe; 57, sealing end cover; 58, air supply pipe; 59, control valve; 510, mounting frame; 511, gear; 512, driving motor; 513, gear ring; 514, sealing ring; 515, annular arc groove; 516, air inlet; 6, discharging mechanism; 61, silicon wafer discharge port; 62, foreign matter discharge port; 63, ear plate; 64, rotating shaft one; 65, rotating shaft two; 66, unloading roller one; 67, material tank one; 68, unloading roller two; 69, material tank two; 610, side arc plate one; 611, side arc plate two; 612, stop bar; 613, collection box; 614, side frame; 615, servo motor; 616, pulley; 7, liquid discharging mechanism; 71, filter screen; 72, connecting pipe; 73, liquid supply pipe; 74, liquid return pipe; 75, arc cover; 76, liquid medicine tank; 8, blanking mechanism; 81, rotating shaft three; 82, material box; 83, ear block; 84, cross bar; 85, U-shaped swing frame; 86, guiding arc rod; 87, stop disk; 88, arc spring; 89, dial rod; 810, receiving roller; 811, material tank three; 812, unloading auxiliary plate; 813, stop column; 814, impact column; 9, support bar. Detailed implementation manners

[0041] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0042] The impurity removal and sorting device of the present invention is a kind of solar silicon wafer production and processing equipment, mainly used for drift impurity removal of the washed broken silicon wafers, and sorting out pure broken silicon wafers without gravel and other metals.

[0043] Example 1

[0044] Referring to the attached specification Figure 1-2 and Figure 5 , the present invention provides an efficient device for removing impurities and sorting broken silicon wafers, including a base 1. Two drifting units are installed on the top of the base 1. Here, two drifting units are taken as an example for illustration in this application, and more drifting units can also be selected for use according to actual production requirements. Each drifting unit consists of a column 2 and a drifting trough 3 fixed at the top of the column 2, and the drifting trough 3 is arranged in an inclined manner. A supporting strip 9 is fixedly arranged inside each drifting trough 3, and a wind gathering hood 4 is movably lapped on the top of the supporting strip 9. An exhaust air mechanism 5 for synchronously supplying air to the two drifting troughs 3 is installed between the two drifting troughs 3. After the wind gathering hood 4 is lapped on the supporting strip 9, the wind gathering hood 4 can be fixedly installed at the upper end of the drifting trough 3 by using a locking bolt to prevent the wind discharged by the exhaust air mechanism 5 from blowing the wind gathering hood 4 away due to the large wind force. The air supply source of the exhaust air mechanism 5 can be realized by a pneumatic pump installed on the base 1 to provide wind with stable air pressure, and the wind force is controlled by a valve. Among them, the pneumatic pump and the valve are not specifically drawn, and both of them adopt existing mature technologies and will not be elaborated here;

[0045] A discharging mechanism 6 for separately recovering the sorted broken silicon wafers and foreign matters is installed at the low-position end of each drifting trough 3, and a liquid discharging mechanism 7 for circulating and supplying the liquid medicine is arranged between each drifting trough 3 and the base 1.

[0046] It should be noted that the present invention uses the wind gathering hood 4 to gather the wind discharged by the exhaust air mechanism 5 and converge it into the drifting trough 3 to reduce the overflow of the wind force, so as to maximize the wind force for blowing the broken silicon wafers to drift and separate, which can not only improve the production capacity of the drifting trough 3, but also save the usage of wind power. At the same time, through the combined use of the discharging mechanism 6 and the liquid discharging mechanism 7, continuous drifting and sorting can be realized.

[0047] Specifically, as shown in Figure 1 , Figure 4 and Figure 7-8 , an air return groove 42 is formed on the wind gathering hood 4, and a wind guiding plate 41 is fixedly arranged at the position of the air inlet port of the air return groove 42 corresponding to the inner side of the drifting trough 3. Among them, the lowest point of the wind guiding plate 41 will never come into contact with the broken silicon wafers during the drifting process to avoid affecting the drifting speed of the broken silicon wafers. A plurality of exhaust grooves 43 communicating with the air return groove 42 are formed at the bottom of the wind gathering hood 4, and the exhaust grooves 43 are arranged in an inclined manner;

[0048] The exhaust air mechanism 5 includes a U-shaped support groove 51 formed on two drift troughs 3 and a U-shaped frame 52 arranged between the two drift troughs 3. L-shaped support plates 53 are fixedly connected between the U-shaped frame 52 and the two drift troughs 3. A ring cylinder 54 is horizontally and fixedly penetrated through the bottom end of the U-shaped frame 52. An exhaust air main pipe 55 is rotatably installed inside the ring cylinder 54 through a bearing.

[0049] A supply air pipe 58 that communicates with the inside of the ring cylinder 54 is fixedly penetrated through the top of the U-shaped frame 52. An air pressure pump can be connected to the air inlet end of the supply air pipe 58 for stable air supply. A control valve 59 is provided on the supply air pipe 58. An annular arc groove 515 is formed inside the ring cylinder 54. An air inlet 516 that is opposite to the annular arc groove 515 is formed on the outside of the exhaust air main pipe 55. Exhaust air branch pipes 56 are communicated and arranged at positions corresponding to the inside of each drift trough 3 on the outside of the exhaust air main pipe 55. Sealing end caps 57 are threadedly connected to both ends of the exhaust air main pipe 55. The two ends of the exhaust air main pipe 55 can be blocked by using the threadedly connected sealing end caps 57. Sealing rings 514 are fixedly provided at the joints between the inner sides of the two ends of the ring cylinder 54 and the exhaust air main pipe 55. The two ends of the ring cylinder 54 can be sealed by using the sealing rings 514, so that the supplied air will not leak from the two ends of the ring cylinder 54.

[0050] A driving part for adjusting the air outlet angle of the exhaust air branch pipe 56 is further provided on the outside of the U-shaped frame 52. The driving part includes a mounting frame 510 fixed on the outside of the U-shaped frame 52 and a gear ring 513 fixedly sleeved on the outside of the exhaust air main pipe 55. A gear 511 meshing with the gear ring 513 is rotatably installed inside the mounting frame 510. A driving motor 512 for driving the gear 511 to rotate reciprocally in positive and negative directions is fixedly installed on the outside of the mounting frame 510.

[0051] It should be noted that, on the basis of this application, if more drift units need to be connected for production, the sealing end cap 57 on the exhaust air main pipe 55 of the corresponding drift unit needs to be unscrewed, and the two exhaust air main pipes 55 to be connected are conducted by using an adapter. In this way, under the state of only retaining one supply air pipe 58 for air supply, synchronous air supply to multiple groups of drift units can be realized. Among them, in the process of drifting and sorting the broken silicon wafers, the air is pressed into the inside of the supply air pipe 58 by using an air pressure pump, so that the air enters the inner cavity of the annular arc groove 515 inside the ring cylinder 54, then enters the inside of the exhaust air main pipe 55 through the air inlet 516 on the exhaust air main pipe 55, and finally is discharged through the exhaust air branch pipes 56 connected to the exhaust air main pipe 55, and evenly blown onto the broken silicon wafers on the drift surface, so as to blow the floating broken silicon wafers to move rapidly along the drift surface by wind force, and make the floating broken silicon wafers quickly enter the collection area.

[0052] During the process of continuously blowing air onto the broken silicon wafers on the floating surface through the exhaust branch pipe 56, the driving motor 512 is also used to drive the gear 511 to rotate reciprocally in the forward and reverse directions, and the rotating gear 511 is used to drive the corresponding rotation of the gear ring 513, thereby driving the exhaust branch pipe 56 on the exhaust main pipe 55 to swing reciprocally up and down, so as to dynamically adjust the air outlet angle of the exhaust branch pipe 56, increasing the wind-receiving area of the broken silicon wafers on the floating surface and achieving the purpose of increasing the floating speed of the broken silicon wafers;

[0053] In addition, after the air blown out by the exhaust branch pipe 56 enters the cavity formed between the air collecting hood 4 and the floating tank 3, most of the air will enter the return air groove 42 under the guidance of the air guiding plate 41, and then be discharged through the exhaust groove 43 communicating with the return air groove 42 and blown onto the broken silicon wafers on the floating surface, achieving the purpose of further accelerating the blanking speed of the broken silicon wafers. A small part of the air will cross the air guiding plate 41 and enter the collection area of the broken silicon wafers, and escape as the broken silicon wafers are discharged. In this way, the wind dissipation can be greatly reduced, thus maximizing the utilization of wind power and saving wind power consumption.

[0054] Specifically, as Figure 1 and Figure 3-5 shown, the discharging mechanism 6 includes a silicon wafer discharge port 61 opened at the end of the floating tank 3 and a plurality of foreign object discharge ports 62 opened at the bottom of the floating tank 3 near the silicon wafer discharge port 61. Collection boxes 613 are fixedly provided at the positions on the top of the base 1 corresponding to the silicon wafer discharge port 61 and the foreign object discharge ports 62, and intermittent discharging assemblies are provided at the positions on the bottom of the floating tank 3 corresponding to the silicon wafer discharge port 61 and each foreign object discharge port 62;

[0055] The intermittent discharging assembly at the silicon wafer discharge port 61 includes a first rotating shaft 64 rotatably installed through the floating tank 3 by means of bearings. A first discharging roller 66 is fixedly sleeved on the outer side of the first rotating shaft 64 at a position inside the silicon wafer discharge port 61. A plurality of material grooves 67 are opened on the outer side of the first discharging roller 66. A first side arc plate 610 is fixedly provided at the bottom of the floating tank 3 and is in contact with the first discharging roller 66, which can prevent the floating broken silicon wafers from being directly discharged together with the liquid medicine before the material grooves 67 on the first discharging roller 66 fully enter the floating tank 3, thus affecting the subsequent discharge of the broken silicon wafers;

[0056] The intermittent discharging assembly at the foreign object discharge port 62 includes ear plates 63 fixed to both sides of the bottom of the drift tank 3 opposite to the foreign object discharge port 62. A second rotating shaft 65 is rotatably installed between the two ear plates 63 through bearings. A second discharging roller 68 is fixedly sleeved on the outer side of the second rotating shaft 65 at a position inside the foreign object discharge port 62. A plurality of material grooves 69 are formed on the outer side of the second discharging roller 68. A second side arc plate 611 is fixedly arranged at the bottom of the drift tank 3 and is in contact with the second discharging roller 68. A retaining bar 612 is fixedly arranged on the inner bottom of the drift tank 3 on the side of the foreign object discharge port 62 close to the silicon wafer discharge port 61. Similarly, the setting of the second side arc plate 611 can also prevent the Mina solution from continuously discharging from the drift tank together with foreign objects (such as gravel, other metals, etc.), causing the drift surface to drop below the upper end surface of the retaining bar 612, and thus unable to smoothly enter the broken silicon wafer collection area. Instead, it may even enter the corresponding collection box 613 together with the foreign objects, failing to achieve the purpose of sorting broken silicon wafers. The setting of the retaining bar 612 can block the foreign objects that sink to the bottom from entering the broken silicon wafer collection area;

[0057] The discharging mechanism 6 further includes a power assembly for driving the first discharging roller 66 and the plurality of second discharging rollers 68 to rotate synchronously. The power assembly includes a side frame 614 fixed to the top of the base 1 and flange plates fixed to both ends of the first rotating shaft 64 and the second rotating shaft 65. A servo motor 615 is fixedly installed on one side of the side frame 614, and a flange plate is also fixedly connected to the end of the output shaft of the servo motor 615;

[0058] The output shaft of the servo motor 615 is flange-connected to one end of the first rotating shaft 64 on one of the drift tanks 3. The first rotating shafts 64 and the second rotating shafts 65 on the two drift tanks 3 are flange-connected to each other at the opposite ends. Two belt pulleys 616 are fixedly sleeved on the outer sides of one end of each of the first rotating shaft 64 and the second rotating shaft 65. The adjacent first rotating shaft 64 and the second rotating shaft 65 as well as the adjacent two second rotating shafts 65 are connected by belt drives.

[0059] It should be noted that during the process of classifying and discharging and collecting the broken silicon wafers and foreign objects at the drift sorting area, the servo motor 615 is used to drive the first rotating shaft 64 to rotate, and the belt is used to drive the plurality of second rotating shafts 65 to rotate synchronously. The plurality of material grooves 67 on the first discharging roller 66 are used to alternately receive the broken silicon wafers on the drift surface. At the same time, the plurality of material grooves 69 on the second discharging roller 68 are used to alternately receive the foreign objects that sink to the bottom. Then, the broken silicon wafers mixed with the solution and the foreign objects mixed with the solution received are successively poured into the corresponding collection box 613 for collection, so as to achieve the purpose of continuous drift sorting.

[0060] Specifically, as Figure 2-6As shown in the figure, the liquid medicine discharging mechanism 7 includes a filter screen 71 fixed inside each collection box 613 and a liquid medicine tank 76 fixed on the top of the base 1. Connecting pipes 72 are fixedly arranged between adjacent two collection boxes 613 and between the adjacent collection box 613 and the liquid medicine tank 76. One end of the liquid medicine tank 76 is communicated with a liquid supply pipe 73 extending into the corresponding floating trough 3. Pumps are installed on both the liquid supply pipe 73 and the connecting pipe 72 connected to the liquid medicine tank 76;

[0061] The liquid medicine discharging mechanism 7 further includes a liquid return pipe 74 connecting the floating trough 3 and the corresponding liquid medicine tank 76 and an arc-shaped cover 75 fixed between the baffle 612 and the inner side of the floating trough 3. One end of the liquid return pipe 74 connecting the floating trough 3 extends to the inner side of the arc-shaped cover 75. Among them, the setting of the liquid return pipe 74 can guide the liquid medicine entering the broken silicon chip collection area back to the inside of the liquid medicine tank 76 to prevent the liquid medicine from accumulating too much and submerging the air guide plate 41, thereby affecting the subsequent floating of the broken silicon chips. During this period, the liquid medicine return rate of the liquid return pipe 74 ensures that the floating broken silicon chips are always above the upper end surface of the baffle 612, but will not let the air guide plate 41 prevent the floating broken silicon chips from entering the broken silicon chip collection area. Additionally, by extending one end of the liquid return pipe 74 connecting the floating trough 3 to the inner side of the arc-shaped cover 75, it can effectively prevent the suction force formed at the liquid inlet end during the liquid medicine return process from causing the floating broken silicon chips to sink and block the liquid return pipe.

[0062] It should be noted that during the process of floating the broken silicon chips, on the one hand, the liquid medicine that enters the corresponding collection box 613 along with the broken silicon chips and foreign objects will be filtered out by the filter screen 71, and then under the action of the pump on the connecting pipe 72, the filtered liquid medicine will be pumped into the liquid medicine tank 76 for reuse. On the other hand, the liquid medicine flowing back through the liquid return pipe 74 will also enter the liquid medicine tank 76 for reuse. In this way, the recycling of the liquid medicine can be realized, reducing waste. Among them, the liquid medicine return mode of the liquid return pipe 74 can be to set the liquid return pipe in an inclined manner for natural return, or to passively return through the pump installed on the horizontally arranged liquid return pipe 74.

[0063] Embodiment 2

[0064] Referring to the attached drawings of the specification Figure 4 and Figure 9-11 The present invention also provides an efficient device for removing impurities and sorting broken silicon chips. Feeding mechanisms 8 are installed on the inner sides of the high-position ends of the two floating troughs 3. The feeding mechanism 8 includes a rotating shaft three 81 rotatably installed through the floating trough 3 through bearings. Flange plates are fixedly arranged at both ends of the rotating shaft three 81, and a pulley 616 is fixedly sleeved at one end of the rotating shaft three 81. The rotating shaft two 65 and the rotating shaft three 81 arranged adjacent to each other are connected by belt drive. The rotating shafts three 81 on the two floating troughs 3 are also flange-connected. Among them, the structural design of the rotating shaft three 81 can realize the linkage action of the feeding mechanisms 8 inside multiple floating units, and there is no need to additionally install a power source to drive the feeding;

[0065] A receiving roller 810 is fixedly sleeved on the outer side of the third rotating shaft 81. A third material groove 811 is formed on the outer side of the receiving roller 810. A material box 82 is arranged inside the drift groove 3. The discharge port of the material box 82 is attached to the outer side of the receiving roller 810. Ear blocks 83 are fixedly connected between both ends of the material box 82 and the inner side of the drift groove 3. A discharge assisting plate 812 is fixedly arranged at the position corresponding to the receiving roller 810 on the inner side of the drift groove 3. Interleaved retaining columns 813 are fixedly arranged on the inner side of the discharge assisting plate 812. Among them, the raw materials to be drifted poured out from the third material groove 811 will first fall onto the discharge assisting plate 812 and be scattered by impact, and then are shunted by the interleaved retaining columns 813, so that the raw materials falling into the drift groove 3 will not form a local accumulation.

[0066] It should be noted that in the process of controlling the raw materials inside the material box 82 to fall into the drift groove 3 for drift sorting, the output power of the servo motor 615 is used to indirectly drive the third rotating shaft 81 to rotate, so that the third material groove 811 on the receiving roller 810 is intermittently communicated with the discharge port on the material box 82, and the raw materials inside the material box 82 fall into the third material groove 811. In this way, intermittent small-batch feeding can be realized, avoiding excessive feeding at one time, which will cause raw material accumulation and is not conducive to the drift sorting process.

[0067] Specifically, as Figure 10-11 shown, the feeding mechanism 8 further includes a cross bar 84 fixed on the inner side of the drift groove 3 and a guiding arc bar 86 fixed at the bottoms of the two ear blocks 83. A U-shaped swing frame 85 is rotatably sleeved on the outer side of the cross bar 84. One end of each of the two guiding arc bars 86 movably penetrates through the U-shaped swing frame 85. A retaining disc 87 is fixedly arranged at the end of the guiding arc bar 86. An arc-shaped spring 88 for fixedly connecting the retaining disc 87 and the U-shaped swing frame 85 is sleeved on the outer side of the guiding arc bar 86. Poking rods 89 are fixedly arranged at the positions corresponding to both ends of the U-shaped swing frame 85 on the outer side of the third rotating shaft 81. An impact column 814 is fixedly arranged on the outer side of the U-shaped swing frame 85. Among them, when the U-shaped swing frame 85 is in the state as Figure 10 shown (assuming this state as the initial state), the arc-shaped spring 88 is still in a compressed state, and at this time, the impact end of the impact column 814 is attached to the bottom end surface of the material box 82, and the third rotating shaft 81 rotates counterclockwise.

[0068] The U-shaped swing frame 85 is pressed downwardly with the cross bar 84 as the rotation of the lever 89 causes the lever 89 to move downwardly and the U-shaped swing frame 85 is pressed ...

[0069] In the above technical solution, the driving motor 512 mentioned is a forward and reverse motor (Jingyan brand) with a model number of 80YS25GY38; the servo motor 615 mentioned is a stepping servo motor with a model number of PK268M-01A.

[0070] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, and these changes and improvements all fall within the scope of the present invention to be protected.

Claims

1. An efficient broken silicon wafer impurity removal and sorting device, comprising a base (1), characterized in that: Two drifting units are installed on the top of the base (1), each drifting unit is composed of a column (2) and a drifting trough (3) fixed on the top of the column (2), and the drifting trough (3) is arranged in an inclined manner. A support bar (9) is fixedly provided on the inner side of each drifting trough (3), and a wind collecting cover (4) is movably overlapped on the top of the support bar (9). An exhaust mechanism (5) for synchronously supplying air to the two drifting troughs (3) is installed between the two drifting troughs (3); A discharge mechanism (6) for respectively recovering the sorted broken silicon wafers and foreign matter is installed at the lower end of each drift trough (3), and a liquid medicine outlet mechanism (7) for circulating and supplying liquid medicine is provided between each drift trough (3) and the base (1).

2. The highly efficient broken silicon wafer impurity removal and sorting device according to claim 1 is characterized in that: The wind collecting cover (4) is provided with a return air slot (42), an air guide plate (41) is fixedly provided at a position of an air inlet port of the return air slot (42) on the inner side of the drifting slot (3), and a plurality of exhaust air slots (43) connected to the return air slot (42) are provided at the bottom of the wind collecting cover (4), and the exhaust air slots (43) are arranged in an inclined manner.

3. The highly efficient broken silicon wafer impurity removal and sorting device according to claim 1 is characterized in that: The exhaust mechanism (5) comprises a U-shaped bracket (51) provided on the two drifting troughs (3) and a U-shaped frame (52) provided between the two drifting troughs (3); an L-shaped support plate (53) is fixedly connected between the U-shaped frame (52) and the two drifting troughs (3); a ring cylinder (54) is fixedly provided through the bottom end of the U-shaped frame (52) in a horizontal direction; an exhaust main pipe (55) is rotatably installed on the inner side of the ring cylinder (54) via a bearing; An air supply pipe (58) connected to the inner side of the annular tube (54) is fixedly provided on the top of the U-shaped frame (52), the air supply pipe (58) being provided with a control valve (59), an annular arc groove (515) is provided on the inner side of the annular tube (54), an air inlet (516) directly opposite to the annular arc groove (515) is provided on the outer side of the exhaust main pipe (55), and an exhaust branch pipe (56) is provided on the outer side of the exhaust main pipe (55) at a position corresponding to the inner side of each drifting trough (3), sealing end caps (57) are threadedly connected to both ends of the exhaust main pipe (55), and sealing rings (514) are fixedly provided at the connection between the inner sides of both ends of the annular tube (54) and the exhaust main pipe (55).

4. The highly efficient broken silicon wafer impurity removal and sorting device according to claim 3 is characterized by: The U-shaped frame (52) is also provided with a driving unit for adjusting the air outlet angle of the exhaust branch pipe (56), the driving unit comprising a mounting frame (510) fixed to the outside of the U-shaped frame (52) and a gear ring (513) fixedly sleeved on the outside of the exhaust main pipe (55), a gear (511) meshing with the gear ring (513) being rotatably mounted on the inside of the mounting frame (510), and a driving motor (512) for driving the gear (511) to rotate being fixedly mounted on the outside of the mounting frame (510).

5. The highly efficient broken silicon wafer impurity removal and sorting device according to claim 1 is characterized in that: The discharge mechanism (6) comprises a silicon wafer discharge outlet (61) opened at the end of the drift trough (3) and a plurality of foreign matter discharge outlets (62) opened at the bottom of the drift trough (3) near the silicon wafer discharge outlet (61); a collecting box (613) is fixedly provided at the top of the base (1) at positions corresponding to the silicon wafer discharge outlet (61) and the foreign matter discharge outlet (62); and an intermittent discharge assembly is provided at the bottom of the drift trough (3) at positions corresponding to the silicon wafer discharge outlet (61) and each foreign matter discharge outlet (62).

6. The highly efficient broken silicon wafer impurity removal and sorting device according to claim 5, characterized in that: The intermittent unloading assembly at the silicon wafer discharge port (61) comprises a rotating shaft (64) which is rotatably mounted on the drift trough (3) via a bearing, a unloading roller (66) is fixedly sleeved on the outer side of the rotating shaft (64) at a position located on the inner side of the silicon wafer discharge port (61), a plurality of material troughs (67) are opened on the outer side of the unloading roller (66), and a side arc plate (610) which fits the unloading roller (66) is fixedly disposed on the bottom of the drift trough (3); The intermittent unloading assembly at the foreign matter discharge outlet (62) comprises ear plates (63) fixed on both sides of the bottom of the drift trough (3) and facing the foreign matter discharge outlet (62); a second rotating shaft (65) is rotatably installed between the two ear plates (63) via a bearing; a second unloading roller (68) is fixedly sleeved on the outer side of the second rotating shaft (65) at a position located inside the foreign matter discharge outlet (62); a plurality of second material troughs (69) are opened on the outer side of the second unloading roller (68); a second side arc plate (611) fitted with the second unloading roller (68) is fixedly provided at the bottom of the drift trough (3); and a blocking bar (612) is fixedly provided on the inner bottom of the drift trough (3) at one side of the foreign matter discharge outlet (62) close to the silicon wafer discharge outlet (61).

7. The highly efficient broken silicon wafer impurity removal and sorting device according to claim 6, characterized in that: The discharge mechanism (6) also includes a power assembly for driving a discharge roller 1 (66) and a plurality of discharge rollers 2 (68) to rotate synchronously, the power assembly including a side frame (614) fixed on the top of the base (1) and flanges fixed on both ends of the rotating shaft 1 (64) and the rotating shaft 2 (65), a servo motor (615) is fixedly mounted on one side of the side frame (614), and the end of the output shaft of the servo motor (615) is also fixedly connected to the flange; The output shaft of the servo motor (615) is flange-connected to one end of the rotating shaft 1 (64) on one of the drifting troughs (3); the rotating shafts 1 (64) and the opposite ends of the rotating shafts 2 (65) on the two drifting troughs (3) are flange-connected; two pulleys (616) are fixedly sleeved on the outer sides of one end of the rotating shaft 1 (64) and each rotating shaft 2 (65); the adjacent rotating shafts 1 (64) and the rotating shaft 2 (65) and the two adjacent rotating shafts 2 (65) are connected by belt transmission.

8. The highly efficient broken silicon wafer impurity removal and sorting device according to claim 6, characterized in that: The liquid medicine outlet mechanism (7) comprises a filter screen (71) fixed inside each collection box (613) and a liquid medicine box (76) fixed on the top of the base (1); a connecting pipe (72) is fixedly provided between two adjacent collection boxes (613) and between an adjacent collection box (613) and a liquid medicine box (76); one end of the liquid medicine box (76) is connected to a liquid supply pipe (73) extending to the inside of the corresponding drift tank (3); and a pump is installed on the liquid supply pipe (73) and the connecting pipe (72) connected to the liquid medicine box (76); The liquid medicine outlet mechanism (7) further comprises a liquid return pipe (74) connecting the drifting trough (3) and the corresponding liquid medicine box (76), and an arc cover (75) fixed between the retaining bar (612) and the inner side of the drifting trough (3); one end of the liquid return pipe (74) connecting the drifting trough (3) extends to the inner side of the arc cover (75).

9. The highly efficient broken silicon wafer impurity removal and sorting device according to claim 7, characterized in that: A material discharge mechanism (8) is installed on the inner side of the high end of the two drifting troughs (3), and the material discharge mechanism (8) includes a rotating shaft (81) which is installed on the drifting trough (3) in a through-type rotation manner through a bearing, and flanges are fixedly provided at both ends of the rotating shaft (81), and a pulley (616) is fixedly provided at one end of the rotating shaft (81), and the rotating shaft (65) and the rotating shaft (81) which are arranged adjacent to each other are connected by a belt transmission, and the rotating shafts (81) on the two drifting troughs (3) are also flange-connected; A material receiving roller (810) is fixedly sleeved on the outer side of the rotating shaft (81), a material trough (811) is provided on the outer side of the material receiving roller (810), a material box (82) is provided on the inner side of the drifting trough (3), a material outlet of the material box (82) is fitted with the outer side of the material receiving roller (810), ear blocks (83) are fixedly connected between the two ends of the material box (82) and the inner side of the drifting trough (3), a discharge auxiliary plate (812) is fixedly provided on the inner side of the drifting trough (3) at a position corresponding to the material receiving roller (810), and staggered blocking columns (813) are fixedly provided on the inner side of the discharge auxiliary plate (812).

10. The highly efficient broken silicon wafer impurity removal and sorting device according to claim 9, characterized in that: The unloading mechanism (8) further comprises a cross bar (84) fixed on the inner side of the drift trough (3) and a guide arc rod (86) fixed on the bottom of the two ear blocks (83); a U-shaped swing frame (85) is rotatably sleeved on the outer side of the cross bar (84); one end of each of the two guide arc rods (86) movably penetrates the U-shaped swing frame (85); a baffle (87) is fixedly provided at the end of the guide arc rod (86); an arc spring (88) is sleeved on the outer side of the guide arc rod (86) for fixedly connecting the baffle (87) and the U-shaped swing frame (85); levers (89) are fixedly provided on the outer side of the rotating shaft (81) at positions corresponding to the two ends of the U-shaped swing frame (85); and a collision column (814) is fixedly provided on the outer side of the U-shaped swing frame (85).

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