Non-metal and metal material gluing and curing method and system based on frequency conversion microwaves

Abstract

The invention discloses a non-metal and metal material gluing and curing method and system based on frequency conversion microwaves. The method comprises the steps that a non-metal material to be glued, a metal material to be glued and an adhesive are obtained; coating and activating a non-metallic material and a metallic material to be glued with an adhesive so as to enhance the permeability and adhesion of the adhesive; and alternately curing the non-metal material and the metal material which are glued by utilizing a frequency conversion microwave technology, controlling the environment atmosphere in the curing process, and cooling after curing is completed. By utilizing the embodiment of the invention, the performance of the adhesive can be effectively improved, so that a stronger bonding effect and better comprehensive performance of the material are realized.

Description

Technical Field

[0001] The present invention belongs to the field of gluing technology, and particularly relates to a method and system for gluing and curing between non-metal and metal materials based on variable-frequency microwave. Background Art

[0002] With the rapid development of industry, the applications of non-metal materials and metal materials are becoming more and more extensive, especially in high-tech fields such as aerospace, automobile manufacturing, and electronic products. The combination of such materials can achieve a lighter and stronger design while improving the comprehensive performance of products. However, the differences in physical and chemical properties between non-metal and metal materials lead to many challenges in the gluing process, such as insufficient bonding strength, mismatched thermal expansion, and poor durability. These challenges have prompted researchers to seek more efficient and reliable methods to improve the gluing performance to meet the growing industrial demands.

[0003] Traditional gluing and curing methods mainly rely on thermal curing or chemical reaction curing. These methods often require a long curing time and are prone to generating internal stress during the curing process, resulting in deformation of the materials. In addition, traditional methods have high requirements for environmental conditions and are easily affected by humidity, temperature, etc., thereby affecting the gluing effect. Summary of the Invention

[0004] The purpose of the present invention is to provide a method and system for gluing and curing between non-metal and metal materials based on variable-frequency microwave to solve the deficiencies in the prior art, which can effectively improve the performance of the adhesive, thereby achieving a stronger bonding effect and better comprehensive performance of the materials.

[0005] An embodiment of the present application provides a method for gluing and curing between non-metal and metal materials based on variable-frequency microwave, and the method includes: Obtaining the non-metal material, metal material, and adhesive to be glued; Coating and activating the adhesive on the non-metal material and metal material to be glued to enhance the permeability and adhesion of the adhesive; Using variable-frequency microwave technology to alternately cure the glued non-metal material and metal material, controlling the environmental atmosphere during the curing process, and performing a cooling treatment after the curing is completed.

[0006] Optionally, the obtaining the non-metal material, metal material, and adhesive to be glued includes: Performing surface treatment on the non-metal material to be glued, using plasma cleaning or chemical etching technology to increase the surface energy of the material to improve the adhesion of the adhesive; Coat the surface of the metal material to be glued with a microwave absorption coating, which is composed of a conductive polymer or a metal oxide and has a thickness of 5 - 20 microns to enhance the absorption of microwave energy; Obtain an adhesive with adjustable viscosity and strong bonding. The adhesive contains a polymer matrix and noble metal nanoparticles to form a composite material, improving its thermal conductivity and mechanical strength. Add a controllable phase change material to the adhesive so that it undergoes a phase change within the range of 40°C to 60°C, thereby providing dynamic temperature control during the curing stage.

[0007] Optionally, the coating and activation of the adhesive on the non-metal material and the metal material to be glued include: Evenly coat the adhesive on the contact surface between the non-metal and the metal, with the coating thickness controlled between 100 - 500 microns, and use high-pressure spraying technology to ensure even coating; Use the first low-frequency microwave for preliminary activation after coating, so that the adhesive is heated to the softening temperature within 10 - 30 seconds. Among them, the first low-frequency microwave is 915 MHz, and the softening temperature is 80°C to 100°C.

[0008] Optionally, the use of frequency conversion microwave technology for alternating curing of the glued non-metal material and metal material includes: Perform preliminary curing at a frequency of 2.45 GHz for 5 minutes, and set the microwave power to 30 W / cm² to promote the rapid curing of the adhesive and its interaction with the metal surface; Switch to a frequency of 1.2 GHz for 3 minutes, and control the temperature of the curing area at 50°C to 70°C to utilize the characteristics of the phase change material to regulate the curing kinetics and prevent stress concentration; Finally, use the second low-frequency microwave for 15 minutes to stabilize the curing effect and ensure uniform distribution of stress between the non-metal and metal materials. Among them, the second low-frequency microwave is 850 MHz.

[0009] Optionally, the control of the environmental atmosphere during the curing process and the cooling treatment after curing include: During the curing process, use an argon or nitrogen protective atmosphere to establish a low-oxygen environment to reduce the oxidation reaction on the metal surface and maintain the stability of the adhesive at the same time; Monitor and adjust the temperature and humidity during the curing process, where the temperature is maintained at 20°C to 25°C and the humidity is maintained between 40% and 60% to ensure the best conditions for the gluing process; After curing, perform a slow cooling treatment, controlling the temperature drop rate at 10°C / min to avoid internal stress in the material caused by sudden temperature drop.

[0010] Another embodiment of the present application provides a gluing and curing system between non-metallic and metallic materials based on variable-frequency microwave. The system includes: An acquisition module, configured to acquire non-metallic materials, metallic materials, and adhesives to be glued. A gluing module, configured to coat and activate the adhesives on the non-metallic materials and metallic materials to be glued, so as to enhance the permeability and adhesiveness of the adhesives. A curing module, configured to alternately cure the glued non-metallic materials and metallic materials by using variable-frequency microwave technology, control the ambient atmosphere during the curing process, and perform a cooling treatment after the curing is completed.

[0011] Another embodiment of the present application provides a storage medium, in which a computer program is stored. Wherein, the computer program is configured to execute the method described in any one of the above when running.

[0012] Another embodiment of the present application provides an electronic device, including a memory and a processor. A computer program is stored in the memory, and the processor is configured to run the computer program to execute the method described in any one of the above.

[0013] Compared with the prior art, a gluing and curing method between non-metallic and metallic materials based on variable-frequency microwave provided by the present invention includes: acquiring non-metallic materials, metallic materials, and adhesives to be glued; coating and activating the adhesives on the non-metallic materials and metallic materials to be glued, so as to enhance the permeability and adhesiveness of the adhesives; alternately curing the glued non-metallic materials and metallic materials by using variable-frequency microwave technology, controlling the ambient atmosphere during the curing process, and performing a cooling treatment after the curing is completed, thereby effectively improving the performance of the adhesives, and achieving a stronger bonding effect and better comprehensive material performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a hardware structure block diagram of a computer terminal for a gluing and curing method between non-metallic and metallic materials based on variable-frequency microwave provided by an embodiment of the present invention; Figure 2 It is a flowchart of a gluing and curing method between non-metallic and metallic materials based on variable-frequency microwave provided by an embodiment of the present invention; Figure 3 It is a structural diagram of a gluing and curing system between non-metallic and metallic materials based on variable-frequency microwave provided by an embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0015] The embodiments described below with reference to the drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0016] An embodiment of the present invention first provides a method for gluing and curing between non-metallic and metallic materials based on variable-frequency microwave, which can be applied to electronic devices, such as computer terminals, specifically, ordinary computers, etc.

[0017] The following takes running on a computer terminal as an example to describe it in detail. Figure 1 The following is a hardware structure block diagram of a computer terminal for a method for gluing and curing between non-metallic and metallic materials based on variable-frequency microwave provided by an embodiment of the present invention. As Figure 1 shown, the computer device includes a processor, a memory, and a network interface connected through a system bus. Among them, the memory may include a non-volatile storage medium and an internal memory.

[0018] The non-volatile storage medium can store an operating system and a computer program. The computer program includes program instructions, and when the program instructions are executed, the processor can execute any method for gluing and curing between non-metallic and metallic materials based on variable-frequency microwave.

[0019] The processor is used to provide computing and control capabilities to support the operation of the entire computer device.

[0020] The internal memory provides an environment for the operation of the computer program in the non-volatile storage medium. When the computer program is executed by the processor, the processor can execute any method for gluing and curing between non-metallic and metallic materials based on variable-frequency microwave.

[0021] The network interface is used for network communication, such as sending assigned tasks, etc. Those skilled in the art can understand that Figure 1 the structure shown in is only a block diagram of some structures related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine some components, or have different component arrangements.

[0022] It should be understood that the processor may be a central processing unit (CPU), and the processor may also be other general-purpose processors, digital signal processors (DSPs), application specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. Among them, the general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc.

[0023] See Figure 2 , an embodiment of the present invention provides a method for gluing and curing between non-metallic and metallic materials based on variable-frequency microwave, which may include the following steps: S201, obtain the non-metallic material, metallic material and adhesive to be glued; In the present invention, obtaining the non-metallic material, metallic material and adhesive to be glued is the primary step of the entire gluing and curing method. This process involves selecting suitable materials to ensure the performance and reliability of the final product. Non-metallic materials usually include plastics, composite materials or fiberglass, etc., while metallic materials include aluminum, steel, copper, etc. According to the application requirements, it is crucial to select materials with excellent mechanical properties, heat resistance and corrosion resistance. In addition, the selection of the adhesive is also very critical, and its properties and functions will directly affect the gluing performance, such as adhesion, temperature resistance and hydrolysis stability, etc. Therefore, comprehensively considering the physical and chemical characteristics of the materials and their respective application scenarios, selecting suitable materials to be glued and adhesives lays the foundation for the subsequent steps.

[0024] The effective implementation of this stage ensures that the materials used have excellent characteristics and compatibility, providing the basis for the subsequent gluing process. By reasonably selecting materials, subsequent problems caused by material mismatch, such as insufficient bonding strength and thermal expansion mismatch, can be reduced, thereby improving the reliability and durability of the gluing interface. In addition, optimizing the ratio and properties of the materials will also provide better conditions for the subsequent curing process, thereby enhancing the bonding effect between the materials and ensuring that the final product can maintain its performance under extreme conditions. Therefore, obtaining suitable non-metallic materials, metallic materials and adhesives is a key link in the whole process, and its importance cannot be ignored.

[0025] Specifically, the non-metallic material to be glued can be surface-treated using plasma cleaning or chemical etching techniques to increase the surface energy of the material and improve the adhesion of the adhesive; During the gluing process, the surface characteristics of the non-metallic material are crucial for the adhesion performance of the adhesive. By surface-treating the non-metallic material, such as plasma cleaning or chemical etching, surface contaminants and oxide layers can be effectively removed, thereby significantly increasing the surface energy of the material. This process provides a better adhesion foundation for the adhesive, enabling the adhesive to penetrate more deeply into the microstructure of the material and form a strong bond. Increasing the surface energy of the non-metallic material directly enhances the adhesion of the adhesive, thereby improving the strength and stability of the entire gluing structure. This step is crucial for ensuring good bonding between non-metallic and metallic materials, helping to improve the overall performance and durability of the product, especially under external stress or temperature changes.

[0026] Before starting the surface treatment, it is necessary to conduct a preliminary inspection of the non-metallic materials to be bonded to ensure that there is no obvious dirt, grease or oxide layer on the surface. Taking polymer materials as an example, they are first placed in a plasma cleaning device. The device can adjust the gas type and flow rate, such as using a mixture of argon and oxygen to produce a suitable plasma environment. Then set the appropriate power and treatment time, usually between 100-200 watts, and the treatment time is about 5-10 minutes, depending on the nature of the material. After treatment, the surface of the non-metallic material will appear clean and activated, greatly increasing its surface energy, allowing the subsequent adhesive to adhere better.

[0027] In chemical etching technology, choosing the right solution is also crucial. For some polymers, hydrofluoric acid can be used to effectively etch their surfaces. Place the material in the prepared hydrofluoric acid solution and soak it for 5-15 minutes, depending on the corrosion resistance of the material. During the entire process, make sure to operate in a well-ventilated area and wear protective equipment to ensure safety. After etching, the material can be rinsed with deionized water to remove residual chemicals and finally blown dry with nitrogen or compressed air. This not only removes surface contaminants, but also forms micro-roughness, further improving the adhesion of the adhesive.

[0028] Finally, the treated non-metallic materials need to be glued within a short time to avoid re-contamination. It is recommended to store the materials in dust-proof bags or sealed containers after treatment, and limit humidity and temperature in the environment to reduce oxidation. This series of steps ensures the best surface condition of the non-metallic materials, laying a solid foundation for the subsequent gluing process.

[0029] The surface of the metal material to be bonded is coated with a microwave absorbing coating, which is composed of a conductive polymer or a metal oxide and has a thickness of 5-20 microns to enhance the absorption of microwave energy; The main purpose of applying microwave absorbing coating is to increase the energy absorption capacity of metal materials during microwave curing. This coating is usually composed of conductive polymers or metal oxides, which can effectively absorb microwave energy and convert it into heat energy, which helps to improve the curing efficiency and quality of the adhesive. In terms of coating thickness control, choosing a thickness of 5-20 microns can avoid affecting the mechanical properties of the metal material while ensuring good absorption. By applying a microwave absorbing coating on the metal surface, the heating uniformity and speed during microwave curing can be effectively improved, so that the adhesive can reach the required curing temperature in a shorter time. This technology not only improves production efficiency, but also effectively reduces stress concentration caused by uneven temperature, thereby improving the overall mechanical properties and long-term reliability of the product.

[0030] During the process of coating the microwave absorption coating, it is first necessary to prepare the required conductive polymer solution or metal oxide powder. Taking conductive polymers as an example, materials such as polypyrrole (PPy) or polyaniline (PANI) can be used and dissolved in an appropriate solvent to form a uniform coating solution. Subsequently, the metal material needs to be pretreated, for example, by simply cleaning to remove surface dirt to ensure the adhesion performance of the coating. Next, the coating can be uniformly applied to the metal surface by spraying, dip coating or brush coating, ensuring that the coating thickness is controlled within the range of 5 - 20 micrometers.

[0031] During the spraying process, it is necessary to ensure that the distance between the spray gun and the metal surface is appropriate, usually maintained at 15 - 30 centimeters, to avoid excessive or uneven coating thickness. Adopting the method of multiple thin sprays can not only ensure the uniform distribution of the coating but also help control the thickness. For example, first spray a thin layer of the coating, and after drying, perform the second spray until the desired thickness is reached. Throughout the process, attention should be paid to the influence of environmental temperature and humidity to ensure the adhesion and performance of the coating during the drying process.

[0032] After coating, the metal material needs to be placed in an oven for curing treatment to improve the adhesion and stability of the coating. Set an appropriate oven temperature, such as 80 - 120 °C, and perform curing for 30 minutes to 1 hour, which helps remove the solvent in the coating and at the same time enhances its bonding force with the metal substrate. After curing, performance tests need to be carried out, such as the determination of microwave absorption ability, to ensure that the coating can fully play its role in the subsequent curing process.

[0033] Obtain an adhesive with adjustable viscosity and strong bonding. The adhesive contains a polymer matrix and noble metal nanoparticles to form a composite material, improving its thermal conductivity and mechanical strength. Add a controllable phase change material to the adhesive so that it undergoes a phase change within the range of 40 °C to 60 °C, thereby providing dynamic temperature regulation during the curing stage.

[0034] The key to this step lies in preparing a special adhesive. Its composite material structure can not only provide excellent bonding performance but also possess good thermal conductivity and mechanical strength. By introducing noble metal nanoparticles, these particles can enhance the overall thermal management ability of the adhesive due to their excellent thermal conductivity. At the same time, the added controllable phase change material can provide the necessary temperature regulation during the curing process, enabling the adhesive to maintain the best bonding state when the temperature changes. The design of this adhesive can achieve dynamic temperature control during the curing stage, thereby improving the adaptability of the adhesive during the curing process and reducing the stress generated due to rapid temperature changes. In addition, the enhanced thermal conductivity and mechanical strength enable the final product to exhibit more excellent performance under mechanical and thermal forces and adapt to more stringent application environments.

[0035] In the initial stage of preparing the adhesive, first select a suitable polymer matrix, such as epoxy resin or polyurethane. Generally, these materials have high curing performance and strength. Add the polymer matrix to a container in a certain proportion, and then gradually add noble metal nanoparticles, such as gold or silver nanoparticles, and use an ultrasonic stirrer to mix them evenly. This process requires controlling the concentration of the nanoparticles, usually 1%-5% of the matrix, to ensure the best performance of the final adhesive without affecting its fluidity.

[0036] After completing the mixing of the matrix and the nanoparticles, next add a controllable phase change material to further improve the thermal management performance of the adhesive. The selection of the controllable phase change material can be based on the application requirements. Commonly used ones are paraffin-based phase change materials or salt-based phase change materials. When adding, these phase change materials can be dissolved or dispersed in a small amount of solvent in advance and then gradually added to the adhesive to ensure their uniform distribution. After mixing, sufficient stirring should be carried out to avoid agglomeration. This can not only ensure the temperature control ability of the adhesive during the curing stage but also improve its overall strength and thermal conductivity.

[0037] Finally, the mixed adhesive needs to be subjected to viscosity testing and curing performance evaluation to confirm its adaptability in actual applications. In the laboratory, equipment such as a rotational viscometer can be used to test its viscosity. The goal is to ensure good fluidity at room temperature for easy coating and application. After determining that its performance meets the requirements, a small-scale trial can be carried out for gluing experiments to observe its curing effect under different temperature conditions to ensure that the expected strong bonding and dynamic temperature control can be achieved in actual applications.

[0038] S202, coat and activate the adhesive on the non-metallic material and the metallic material to be glued to enhance the permeability and adhesion of the adhesive; In the process of gluing non-metallic and metallic materials, the coating and activation of the adhesive are crucial steps. This process includes applying an appropriate amount of adhesive to the contact surfaces of the non-metallic and metallic materials and enhancing the performance of the adhesive through specific activation techniques. In this way, the permeability of the adhesive is enhanced, enabling it to better penetrate into the microscopic pores of the contact surface, thereby improving its adhesion. In addition, the activation of the adhesive can make it reach the softening temperature in a short time, thereby improving its fluidity and ensuring its uniform distribution on the material contact surface.

[0039] This method of coating and activation can not only improve the adhesiveness of the adhesive, but also significantly enhance the overall gluing effect. The enhanced adhesive can better adapt to the surface characteristics of different materials after coating. Especially when the surface energy of non-metallic materials is low, it usually leads to poor gluing effects. By improving its permeability and fluidity, it is ensured that the adhesive can form a stronger bond with the interface between non-metallic and metallic materials, thereby improving the mechanical properties and durability of the final product, which is of great significance for enhancing the overall performance and service life of the materials.

[0040] Specifically, the adhesive can be evenly coated on the contact surface between non-metallic and metallic materials, with the coating thickness controlled between 100 - 500 microns, and high-pressure spray technology is used to ensure uniform coating. In this step, the uniform coating of the adhesive is crucial. First, through high-pressure spray technology, the adhesive is evenly sprayed in an atomized form on the contact surface between the non-metallic material and the metallic material. This spray technology can ensure that the adhesive is quickly dispersed to the contact surface during the coating process, avoiding the difference in bonding strength caused by uneven coating. During the coating process, it is necessary to strictly control the coating thickness of the adhesive between 100 - 500 microns. This range can not only ensure good bonding force between the bonded materials, but also avoid various problems during the curing process due to excessive coating thickness. Uniform adhesive coating is the basis for ensuring the bonding force between non-metallic and metallic materials, and good coating quality directly affects the mechanical properties and durability after gluing. This step can effectively avoid problems such as poor bonding and stress concentration caused by uneven coating, thereby improving the reliability and safety of the product. By controlling the coating thickness, it is also possible to avoid uneven curing and residual internal stress caused by excessive adhesive thickness, further improving the adaptability and service life of the material.

[0041] In this step, the adhesive needs to be prepared first. To ensure the efficiency and uniformity of the spraying process, the viscosity of the adhesive must be appropriate. Usually, amino resin or polyurethane adhesives are commonly used choices, which can form high-strength bonds after curing. Place the adhesive in the liquid storage tank of the high-pressure spray device, and through adjusting the settings of the device, ensure that its spraying pressure is within a suitable range, generally set between 0.5 - 1.5 MPa, and the specific value is appropriately adjusted according to the characteristics of the adhesive and the model of the nozzle.

[0042] Next, ensure that the nozzles of the spraying equipment are clean and unblocked to avoid unevenness during spraying. For the contact surfaces of non-metallic and metallic materials, first clean and treat these surfaces appropriately to remove surface oil stains and dust, ensuring that the adhesive can fully contact the substrate surface. After cleaning, use a high-pressure spraying device to evenly spray the adhesive on the contact surface, and the spraying thickness should be strictly controlled between 100 - 500 microns. To achieve this goal, different spraying modes can be selected, such as cross spraying or circular spraying, to ensure that the adhesive can cover the entire contact surface.

[0043] After spraying, the thickness of the applied adhesive must be detected. This can be achieved by a non-contact laser thickness gauge to ensure that the thickness of each coated area is within the specified range. If it is found that the local thickness is excessive or insufficient, supplementary spraying or re-spraying can be carried out as needed. Maintaining the stability and accuracy of the spraying equipment is crucial for the coating quality of the adhesive. Regularly check and calibrate the equipment to ensure that during subsequent production processes, the coating of the adhesive always remains uniform and accurate.

[0044] Use the first low-frequency microwave to perform preliminary activation after coating, so that the adhesive is heated to the softening temperature within 10 - 30 seconds, where the first low-frequency microwave is 915 MHz and the softening temperature is 80°C to 100°C.

[0045] In this step, the preliminary activation of the adhesive by the first low-frequency microwave can quickly heat the adhesive to its softening temperature within a short time. This activation method utilizes the penetration characteristics of the microwave to uniformly heat the interior of the adhesive, thereby accelerating its softening process and improving its fluidity. Within this temperature range, the viscosity of the adhesive is significantly reduced, enabling it to better fill the tiny gaps between the contact surfaces, enhancing the adhesion and permeability of the adhesive, and making the final bonding effect more ideal. Through preliminary activation, the fluidity and bonding ability of the adhesive are significantly improved, laying a good foundation for the subsequent curing process. This process can effectively increase the mutual contact area between materials, thereby enhancing the bonding strength and tolerance. At the same time, rapid and uniform heating can also reduce potential damage caused by thermal stress differences, improve the overall bonding quality, ensure that the materials exhibit excellent mechanical properties and stability during use, and provide a reliable solution for various applications.

[0046] In the first step of low-frequency microwave activation, first, place the non-metal and metal materials coated with the adhesive in the working area of the microwave activation equipment. Before starting, ensure that the equipment is in normal working condition, which can be confirmed by checking the frequency and power parameters of the microwave transmitter. Set the frequency to 915 MHz, and adjust the power of the microwave equipment according to the characteristics of the materials and the adhesive. Generally, it is recommended to be between 50 W and 200 W. After the equipment is started, adjust the height and placement angle so that the microwave can evenly cover all coated contact surfaces.

[0047] During the specific activation process, ensure that the activation time is controlled between 10 - 30 seconds. The microwave heating principle used at this time is to utilize the vibration of water molecules and free radicals inside the adhesive to rapidly increase the temperature. Monitor the temperature change during this process. It is recommended to use an infrared thermometer to detect the temperature of the adhesive in real time to ensure that it is heated to the set softening temperature (80°C to 100°C). This fast and uniform heating method plays a positive role in promoting the fluidity and adhesion inside the adhesive, and can effectively improve the permeability of the adhesive, enabling it to better fill the gaps between the contact surfaces.

[0048] If it is monitored that the adhesive fails to reach the predetermined softening temperature in time, adjust the equipment parameters, such as increasing the microwave power or extending the heating time. However, some adhesives are more sensitive to temperature, so avoid overheating that may cause the adhesive to decompose or its performance to decline during adjustment. Throughout the process, pay attention to maintaining the stability of the environment, avoid the influence of external environmental fluctuations on the heating process, and ensure that the adhesive is evenly and moderately activated.

[0049] S203, Use variable-frequency microwave technology to alternately cure the glued non-metal and metal materials, control the environmental atmosphere during the curing process, and perform a cooling treatment after the curing is completed.

[0050] Use variable-frequency microwave technology to alternately cure the glued non-metal and metal materials, aiming to optimize the curing process of the adhesive by adjusting the microwave frequency and curing time. Specifically, the curing process is divided into three stages: preliminary curing, temperature adjustment, and final curing. In each stage, microwaves of different frequencies act on the glued materials, enabling the adhesive to effectively interact with the metal surface during the curing process and form a uniform and stable bonding layer at the glued interface. This method not only improves the curing speed but also enhances the overall performance of the materials, ensuring a high-strength connection between the non-metal and the metal.

[0051] By adopting variable-frequency microwave technology for the alternating curing of bonding materials, the bonding effect is significantly improved, the stress concentration phenomenon between materials is reduced, and the overall reliability and durability of the materials are enhanced. Variable-frequency microwave provides a flexible heating method, which can adjust the curing conditions according to the requirements of different stages, thus creating an optimal curing environment. This is of great significance for improving the performance stability of products and their working ability under high load and extreme environments. Especially in the applications in the aerospace, automotive and other high-tech fields, it ensures the long-term use safety of products.

[0052] Specifically, by using variable-frequency microwave technology, the non-metallic materials and metallic materials after bonding are cured alternately. The initial curing can be carried out at a frequency of 2.45 GHz for 5 minutes, and the microwave power is set to 30 W / cm² to promote the rapid curing of the adhesive and its interaction with the metal surface. In the alternating curing of non-metallic materials and metallic materials after bonding, the initial curing is first carried out at a frequency of 2.45 GHz for 5 minutes, and the microwave power is set to 30 W / cm². The purpose of this stage is to use microwaves of this specific frequency to accelerate the curing process of the adhesive and promote good interaction between the adhesive and the metal surface. High-frequency microwaves can effectively excite the molecules in the adhesive, enabling it to quickly pass through the softening zone and enter the curing stage. During this process, the temperature of the metal surface should be monitored to ensure that it does not exceed the thermal failure temperature of the material. At the same time, monitor the temperature change of the adhesive during the curing process to ensure that the designed curing characteristics are achieved.

[0053] In the initial curing stage, it is first necessary to configure the microwave curing equipment and set appropriate parameters. Before operation, ensure that the microwave generator of the equipment is operating normally and can stably generate a frequency signal of 2.45 GHz. Then, place the bonded non-metallic and metallic materials in the working chamber of the microwave equipment, ensuring that their positions are suitable for the uniform distribution of microwaves. After starting the equipment, set the microwave power to 30 W / cm² and set the curing time to 5 minutes on the control panel. Observe the temperature change of the adhesive through the real-time monitoring system to ensure that there is no overheating or local low temperature during the curing process.

[0054] During the operation process, special attention needs to be paid to the surface state of the bonding materials. Due to the high thermal conductivity of metallic materials, the metal surface may heat up rapidly under microwave excitation. Therefore, an infrared thermometer is required to monitor the temperature of the metal surface to ensure that it remains within a safe range. If it is found that the temperature exceeds the designed range, the microwave emission should be stopped immediately, the power setting should be adjusted or cooling measures should be increased. At the same time, cooling liquid can be arranged in the curing tank to help control the temperature and prevent material damage caused by overheating.

[0055] After the initial curing is completed, the curing effect of the adhesive should be tested. Tensile tests or shear tests can be used to evaluate the bonding strength of the materials to ensure that the bonding performance between the materials meets the expected standards in the subsequent curing steps. At this time, record the temperature and time parameters of the initial curing to provide data basis for subsequent process optimization and equipment adjustment.

[0056] Switch to a frequency of 1.2 GHz for 3 minutes and control the temperature of the curing area between 50°C and 70°C to take advantage of the properties of the phase change material, adjust the curing kinetics, and prevent stress concentration; After the initial curing is completed, the frequency is switched to 1.2GHz for the second stage of curing, which lasts for 3 minutes. This stage is designed to use the characteristics of phase change materials to adjust the temperature during the curing process and prevent potential damage caused by stress concentration. In this frequency range, microwaves can more effectively penetrate the material and promote the phase change process of the phase change material, thereby providing flexibility and adaptability of the material under load, making the overall curing process more balanced and stable. By switching the microwave frequency at this stage, the thermal characteristics of the phase change material can be effectively utilized to adjust the temperature of the bonding area. Avoiding stress concentration caused by excessively high or uneven temperature distribution ensures the formation of a good bonding interface between non-metallic and metallic materials, significantly improving the durability and reliability of the product. Compared with the single-frequency curing method, this process significantly enhances the toughness of the material and reduces the risk of cracking that may occur during use, especially in harsh operating environments, and can give full play to its excellent anti-fatigue properties.

[0057] When performing the second stage of curing, the parameters of the microwave device must first be reconfigured, the frequency must be adjusted to 1.2GHz, and the duration must be set to 3 minutes. In order to ensure effective penetration of microwaves, the placement of materials in the curing area must be appropriately adjusted, such as spacing the materials appropriately to ensure that the microwaves can act evenly on the contact surface. After starting the equipment, the temperature of the bonding area is monitored in real time, and a temperature monitoring instrument is used to ensure that the temperature of the curing area is maintained between 50°C and 70°C to ensure the best performance of the phase change material.

[0058] During this process, if the temperature is detected to exceed the preset range, the microwave power needs to be adjusted immediately, the excitation intensity needs to be reduced, or a cooling method needs to be introduced. For example, airflow can be introduced into the curing chamber to remove excess heat and ensure that the temperature during the curing process is controlled within a safe range. At the same time, the stability of the environment is maintained to avoid adverse effects on the curing process caused by external factors such as air flow and humidity changes.

[0059] After curing, the bonding performance of the material is evaluated again. The microstructure of the bonding layer is checked to ensure that there are no bubbles or defects. The temperature and time data of this stage are recorded to provide a reference for further improving the curing process.

[0060] Finally, use the second low-frequency microwave for 15 minutes to stabilize the curing effect and ensure uniform stress distribution between non-metallic and metallic materials, where the second low-frequency microwave is 850 MHz.

[0061] Finally, after the curing is completed, use the second low-frequency microwave (850 MHz) to stabilize the curing effect for 15 minutes. The purpose of this stage is to ensure the stability and uniformity of the cured adhesive during long-term use. By using the low-frequency microwave of 850 MHz, the molecules in the adhesive are reactivated, making the internal structure of the glued layer more dense, reducing the stress concentration caused by temperature difference, and providing guarantee for the final material connection. In this stage, through the long-term action of the low-frequency microwave, the possible internal stress can be effectively eliminated, which helps the adhesive to cure completely, improving the strength and toughness of the glued interface. Especially after experiencing high temperature or mechanical shock, through the uniformly distributed microwave excitation, it helps the material to maintain its mechanical properties and reduce the risk of peeling and fracture. This process not only provides a higher safety factor for the product, but also significantly extends the service life of the material, ensuring its reliability in high-performance applications.

[0062] When performing the final stage of curing treatment, first, set the microwave equipment to a frequency of 850 MHz and adjust the time to 15 minutes. Reasonably arrange the position of the material in the curing area to ensure uniform microwave irradiation. After starting the microwave equipment, it is necessary to monitor the temperature in the curing area to ensure that it is maintained within the optimal range to promote further stabilization of the adhesive.

[0063] To maintain a good curing effect, it is recommended to introduce a temperature monitoring system during the curing process to ensure that there are no abnormal temperature fluctuations in the adhesive during the entire curing process. During this process, the operator should continuously observe the changes in the glued layer, especially at the edges and joints of the material, to prevent defects caused by the accumulation of bubbles or internal stress. If abnormal temperature changes are found during the curing process, the microwave power should be adjusted in a timely manner or the curing time should be extended to ensure the smooth progress of the entire curing process.

[0064] Finally, after the curing is completed, it is recommended to conduct strength tests and microscopic structure inspections to evaluate the performance and structural integrity of the glued layer to ensure the stability and reliability of the glued material in subsequent applications. These data not only provide a basis for the quality control of the finished product, but also provide practical references for the improvement of subsequent processes.

[0065] Specifically, during the curing process, environmental atmosphere control is carried out, and after the curing is completed, cooling treatment is carried out. During the curing process, an argon or nitrogen protective atmosphere can be used. By establishing a low-oxygen environment, the oxidation reaction on the metal surface can be reduced, and at the same time, the stability of the adhesive can be maintained; During the curing process, an argon or nitrogen protective atmosphere is adopted to create a low-oxygen environment, aiming to reduce the oxidation reaction on the metal surface while maintaining the chemical stability of the adhesive. As inert gases, argon and nitrogen can effectively isolate oxygen in the external air, prevent metal oxidation under high-temperature conditions, and ensure that the bonded surface is not affected by oxides during the curing process. This control strategy can not only improve the adhesion between the metal material and the adhesive but also enhance the bonding strength after curing, thereby improving the performance and service life of the final product. Implementing low-oxygen environment control can significantly improve the bonding quality between metal and non-metal materials and prevent bonding failure caused by oxidation. In addition, maintaining an argon or nitrogen protective atmosphere also helps to enhance the stability of the adhesive during the curing process and the necessary temperature control ability, thus ensuring that the final bonded joint has good anti-fatigue characteristics and long-term use reliability. This is of great significance for material bonding in high-demand industries such as aerospace and automotive.

[0066] During the curing process, an argon or nitrogen protective atmosphere is adopted to create a low-oxygen environment and reduce the oxidation reaction on the metal surface while maintaining the stability of the adhesive. Such an operation first requires establishing a closed atmosphere system in the curing chamber to ensure that external air does not enter. The atmosphere system can be equipped with a flow meter and a control valve to adjust the inflow of argon or nitrogen as needed. Then, a gas replacement experiment is carried out to ensure that the inside of the cavity has reached the preset low-oxygen environment before starting the curing. During the gas replacement, the purity of the protective gas can be confirmed through a visual or odor detection system to ensure that it meets the predetermined standards.

[0067] During the curing process, an oxygen sensor is needed to continuously monitor the oxygen concentration in the protective atmosphere and ensure that it always remains below 0.1%. If the monitoring result shows an increase in the oxygen concentration, the gas flow rate needs to be adjusted quickly or a backup gas source is used to ensure that the adhesive coated on the metal surface and the non-metal material will not fail due to oxidation during curing. In addition, an alarm system can be set up so that once the oxygen concentration exceeds the safety threshold, the system will automatically issue an alarm to prompt the operator to handle it in a timely manner.

[0068] Finally, after the curing is completed, the low-oxygen environment is maintained for a period of time to help stabilize the stability and performance of the cured adhesive. Through an appropriate time delay, it can be ensured that the metal no longer undergoes an oxidation reaction, and at the same time, the adhesive can be fully cured to achieve the best bonding effect. All monitoring data should be recorded in real time for subsequent analysis and improvement of process parameters to achieve higher bonding performance and material safety.

[0069] Monitor and adjust the temperature and humidity during the curing process. Among them, the temperature is maintained at 20°C to 25°C, and the humidity is maintained between 40% and 60% to ensure the best conditions for the bonding process; Monitor and adjust the temperature and humidity during the curing process. Among them, the temperature is maintained between 20°C and 25°C, and the humidity is maintained between 40% and 60% to ensure the best conditions for the gluing process. Temperature and humidity are important factors affecting the performance of the adhesive, which are crucial for ensuring the uniform curing of the adhesive and avoiding the generation of bubbles and defects. Through precise environmental control, ideal reaction conditions can be provided for the adhesive during the curing process, enabling the adhesive to fully exert its performance. By strictly monitoring and adjusting the environmental temperature and humidity, the adhesion and curing uniformity of the adhesive can be effectively improved, and the curing quality fluctuations caused by environmental changes can be reduced. This not only helps to improve the strength and durability of the final joint, but also ensures the reliable bonding performance between materials when used in high-humidity or high-temperature environments. Therefore, this control measure has important industrial application value, especially in the manufacturing of high-performance composite materials and structural components, which can improve the overall process consistency and product quality.

[0070] Monitor and adjust the temperature and humidity during the curing process. Among them, the temperature is maintained between 20°C and 25°C, and the humidity is maintained between 40% and 60% to ensure the best conditions for the gluing process. The implementation of this step requires first equipping the curing equipment with temperature and humidity sensors and control devices to ensure that the current environmental status can be monitored in real time during the entire curing period. At the same time, the system should have an automatic adjustment function so that when the temperature or humidity changes, it can be adjusted in a timely manner according to the set value.

[0071] Specifically, if the temperature is too low, the environmental temperature can be quickly raised to the standard range through heating elements such as hot air circulators or infrared heating tubes. If the humidity decreases, humidification can be achieved by spraying water into the curing chamber through a humidity generator. In complex application scenarios, it is recommended to use a PID controller to make the adjustment of temperature and humidity more accurate and stable, so as to ensure that the entire gluing process is not affected by environmental changes.

[0072] In addition, it is crucial to record and analyze the monitoring data. Operators should regularly check the data records, identify potential abnormal patterns and make adjustments in a timely manner to prevent negative impacts on the performance of the adhesive caused by temperature and humidity fluctuations. To improve the effectiveness of monitoring, an automated system can be introduced to analyze the data through computer software and generate reports regularly to help make more scientific decisions in future gluing processes.

[0073] After curing is completed, perform a slow cooling treatment, controlling the cooling rate at 10°C / min to avoid internal stress in the material caused by sudden temperature drop.

[0074] After curing is completed, a slow cooling process is carried out, with the temperature controlled at a cooling rate of 10°C / min to avoid internal stress in the material caused by a sudden temperature drop. Slow cooling is one of the key process steps. The main purpose is to eliminate the thermal stress inside the material caused by rapid cooling, ensuring that the bonding interface between the non-metallic and metallic materials after curing remains stable and is not prone to cracking. Through slow cooling, the internal stress of the cured joint can be evenly released during temperature changes. Especially in the case of uneven thermal expansion and contraction, the risk of stress concentration in certain sections can be minimized. This treatment step helps to improve the service life and safety of the material, especially in application environments with strict requirements and large workload changes. This temperature reduction control is one of the key processes for high-performance products, which can effectively ensure the firm and reliable connection between non-metallic and metallic materials.

[0075] After curing is completed, a slow cooling process is carried out, with the temperature controlled at a cooling rate of 10°C / min to avoid internal stress in the material caused by a sudden temperature drop. To achieve this goal, the curing equipment needs to be equipped with an advanced cooling system that can adjust the cooling rate according to the temperature of the cured material. Specifically, after curing is completed, a reasonable cooling cycle and temperature curve need to be set first according to the properties and thickness of the material to ensure that the material can gradually adapt to the ambient temperature.

[0076] In the cooling stage, water cooling or air cooling methods can be used. For thicker joints, it is usually recommended to use a water cooling system because its heat exchange efficiency is higher and the set cooling rate can be achieved in a shorter time. During the cooling process, not only the surface temperature of the material needs to be monitored, but also the internal temperature, to ensure that the temperature gradient during cooling is maintained within a reasonable range and prevent internal stress caused by temperature differences from affecting the stability and strength of the material.

[0077] Finally, it is recommended to conduct mechanical property tests on the material after cooling to ensure that no cracks or other defects occur during the slow cooling process. This demonstration can be carried out in various ways such as tensile tests and shear tests. According to the test results, the effectiveness of the cooling method will be analyzed and feedback will be provided for future production. If the test does not meet the expected standards, the cooling strategy needs to be optimized to ensure the bonding quality and material performance safety in the next production process.

[0078] It can be seen that the non-metallic material, metallic material, and adhesive to be bonded are obtained; the non-metallic material and metallic material to be bonded are coated and activated with the adhesive to enhance the permeability and adhesion of the adhesive; the bonded non-metallic material and metallic material are alternately cured using variable-frequency microwave technology, the ambient atmosphere is controlled during the curing process, and a cooling treatment is carried out after curing is completed, thereby effectively improving the performance of the adhesive, achieving a stronger bonding effect and better comprehensive material performance.

[0079] Another embodiment of the present invention provides a gluing and curing system for non-metallic and metallic materials based on variable-frequency microwaves. Refer to Figure 3 , the system may include: An acquisition module 301, configured to acquire a non-metallic material, a metallic material, and an adhesive to be glued; A gluing module 302, configured to coat and activate the adhesive on the non-metallic material and the metallic material to be glued, so as to enhance the permeability and adhesion of the adhesive; A curing module 303, configured to alternately cure the glued non-metallic material and metallic material by using variable-frequency microwave technology, control the ambient atmosphere during the curing process, and perform a cooling treatment after the curing is completed.

[0080] It can be seen that acquiring a non-metallic material, a metallic material, and an adhesive to be glued; coating and activating the adhesive on the non-metallic material and the metallic material to be glued, so as to enhance the permeability and adhesion of the adhesive; alternately curing the glued non-metallic material and metallic material by using variable-frequency microwave technology, controlling the ambient atmosphere during the curing process, and performing a cooling treatment after the curing is completed, thereby effectively improving the performance of the adhesive, and thus achieving a stronger bonding effect and better comprehensive material properties.

[0081] The embodiment of the present invention also provides a storage medium, in which a computer program is stored, and the computer program is configured to execute the steps in any one of the above method embodiments when running.

[0082] Specifically, in this embodiment, the above storage medium may be configured to store a computer program for executing the following steps: S201, acquiring a non-metallic material, a metallic material, and an adhesive to be glued; S202, coating and activating the adhesive on the non-metallic material and the metallic material to be glued, so as to enhance the permeability and adhesion of the adhesive; S203, alternately curing the glued non-metallic material and metallic material by using variable-frequency microwave technology, controlling the ambient atmosphere during the curing process, and performing a cooling treatment after the curing is completed.

[0083] It can be seen that acquiring a non-metallic material, a metallic material, and an adhesive to be glued; coating and activating the adhesive on the non-metallic material and the metallic material to be glued, so as to enhance the permeability and adhesion of the adhesive; alternately curing the glued non-metallic material and metallic material by using variable-frequency microwave technology, controlling the ambient atmosphere during the curing process, and performing a cooling treatment after the curing is completed, thereby effectively improving the performance of the adhesive, and thus achieving a stronger bonding effect and better comprehensive material properties.

[0084] An embodiment of the present invention further provides an electronic device, including a memory and a processor. A computer program is stored in the memory, and the processor is configured to run the computer program to execute the steps in any one of the above method embodiments.

[0085] Specifically, the above electronic device may further include a transmission device and an input / output device. Among them, the transmission device is connected to the above processor, and the input / output device is connected to the above processor.

[0086] Specifically, in this embodiment, the above processor may be configured to execute the following steps through a computer program: S201, obtain non-metallic materials, metallic materials, and adhesives to be glued; S202, perform adhesive coating and activation on the non-metallic materials and metallic materials to be glued to enhance the permeability and adhesion of the adhesive; S203, use variable-frequency microwave technology to alternately cure the glued non-metallic materials and metallic materials, control the environmental atmosphere during the curing process, and perform a cooling treatment after the curing is completed.

[0087] It can be seen that obtaining non-metallic materials, metallic materials, and adhesives to be glued; performing adhesive coating and activation on the non-metallic materials and metallic materials to be glued to enhance the permeability and adhesion of the adhesive; using variable-frequency microwave technology to alternately cure the glued non-metallic materials and metallic materials, controlling the environmental atmosphere during the curing process, and performing a cooling treatment after the curing is completed, so as to effectively improve the performance of the adhesive, thereby achieving a stronger bonding effect and better comprehensive material performance.

[0088] The structure, features, and effects of the present invention have been described in detail based on the embodiments shown in the drawings. The above are only the preferred embodiments of the present invention, but the present invention is not limited to the scope defined by the drawings. Any changes made according to the concept of the present invention, or modified into equivalent embodiments with equivalent changes, still fall within the spirit covered by the specification and the drawings, and should be within the protection scope of the present invention.

Claims

1. A method for bonding and curing non-metallic and metallic materials based on variable frequency microwaves, characterized in that: The method comprises: Obtaining non-metallic materials, metal materials and adhesives to be bonded; Apply and activate adhesive to non-metallic materials and metal materials to be bonded to enhance the permeability and adhesion of the adhesive; The variable frequency microwave technology is used to alternately cure the non-metallic materials and metal materials after bonding, the environmental atmosphere is controlled during the curing process, and cooling treatment is performed after the curing is completed.

2. The method according to claim 1, characterized in that The step of obtaining the non-metallic material, the metal material and the adhesive to be bonded comprises: Surface treatment of non-metallic materials to be bonded, using plasma cleaning or chemical etching technology to increase the surface energy of the material to improve the adhesion of the adhesive; The surface of the metal material to be bonded is coated with a microwave absorbing coating, which is composed of a conductive polymer or a metal oxide and has a thickness of 5-20 microns to enhance the absorption of microwave energy; An adhesive with adjustable viscosity and strong bonding is obtained, wherein the adhesive comprises a polymer matrix and precious metal nanoparticles to form a composite material, improve its thermal conductivity and mechanical strength, and add a controllable phase change material to the adhesive so that it undergoes a phase change in the range of 40°C to 60°C, thereby providing dynamic temperature regulation during the curing stage.

3. The method according to claim 2, characterized in that The adhesive coating and activation of the non-metallic material and the metal material to be bonded comprises: The adhesive is evenly applied to the contact surface between non-metal and metal, and the coating thickness is controlled between 100-500 microns. High-pressure spray technology is used to ensure uniform coating; A first low-frequency microwave is used for preliminary activation after coating to heat the adhesive to a softening temperature within 10-30 seconds, wherein the first low-frequency microwave is 915 MHz and the softening temperature is 80°C to 100°C.

4. The method according to claim 3, characterized in that The method of using variable frequency microwave technology to alternately solidify the bonded non-metallic material and the metal material comprises: Initial curing was performed at a frequency of 2.45 GHz for 5 minutes, with the microwave power set to 30 W / cm² to promote rapid curing of the adhesive and its interaction with the metal surface; Switch to a frequency of 1.2 GHz for 3 minutes and control the temperature of the curing area between 50°C and 70°C to take advantage of the properties of the phase change material, adjust the curing kinetics, and prevent stress concentration; Finally, a second low-frequency microwave is used and maintained for 15 minutes to stabilize the curing effect and ensure uniform distribution of stress between the non-metallic and metallic materials, wherein the second low-frequency microwave is 850 MHz.

5. The method according to claim 4, characterized in that The environmental atmosphere is controlled during the curing process and a cooling process is performed after the curing is completed, including: During the curing process, argon or nitrogen protective atmosphere is used to create a low-oxygen environment to reduce the oxidation reaction on the metal surface while maintaining the stability of the adhesive; Monitor and adjust the temperature and humidity during the curing process, where the temperature is maintained between 20°C and 25°C and the humidity is maintained between 40% and 60%; After the curing is completed, a slow cooling process is carried out, and the temperature is controlled at a cooling rate of 10°C / min to avoid internal stress in the material caused by a sudden drop in temperature.

6. A non-metallic and metallic material bonding and curing system based on variable frequency microwaves, characterized in that: The system comprises: An acquisition module, used for acquiring non-metallic materials, metal materials and adhesives to be bonded; Gluing module, used to apply and activate adhesive to non-metallic materials and metal materials to be glued, so as to enhance the permeability and adhesion of the adhesive; The curing module is used to alternately cure the bonded non-metallic materials and metal materials using variable frequency microwave technology, control the environmental atmosphere during the curing process, and perform cooling after the curing is completed.

7. The system according to claim 6, characterized in that The acquisition module is specifically used for: Surface treatment of non-metallic materials to be bonded, using plasma cleaning or chemical etching technology to increase the surface energy of the material to improve the adhesion of the adhesive; The surface of the metal material to be bonded is coated with a microwave absorbing coating, which is composed of a conductive polymer or a metal oxide and has a thickness of 5-20 microns to enhance the absorption of microwave energy; An adhesive with adjustable viscosity and strong bonding is obtained, wherein the adhesive comprises a polymer matrix and precious metal nanoparticles to form a composite material, improve its thermal conductivity and mechanical strength, and add a controllable phase change material to the adhesive so that it undergoes a phase change in the range of 40°C to 60°C, thereby providing dynamic temperature regulation during the curing stage.

8. The system according to claim 7, characterized in that The adhesive coating and activation of the non-metallic material and the metal material to be bonded comprises: The adhesive is evenly applied to the contact surface between non-metal and metal, and the coating thickness is controlled between 100-500 microns. High-pressure spray technology is used to ensure uniform coating; A first low-frequency microwave is used for preliminary activation after coating to heat the adhesive to a softening temperature within 10-30 seconds, wherein the first low-frequency microwave is 915 MHz and the softening temperature is 80°C to 100°C.

9. A storage medium, characterized in that: The storage medium stores a computer program, wherein the computer program is configured to execute the method according to any one of claims 1 to 5 when executed.

10. An electronic device comprising a memory and a processor, characterized in that: A computer program is stored in the memory, and the processor is configured to run the computer program to perform the method according to any one of claims 1 to 5.

Images