Machining parameter calibration method of machining equipment and machining equipment

Abstract

The invention provides a machining parameter calibration method of machining equipment and the machining equipment, the machining equipment comprises a machining platform, engraving laser and a guide part, the engraving laser is slidably connected with the guide part, the machining platform is used for placing engraving consumables, and firstly, the machining platform is controlled to move in the Z-axis direction according to the preset step length; then, in the moving process of the machining platform, the engraving laser is controlled to emit laser to the engraving consumable under the different heights of the machining platform, and a plurality of target patterns corresponding to the different heights of the machining platform are obtained on the engraving consumable; and finally, the focus height of the engraving laser is obtained according to the multiple target patterns corresponding to the different heights to which the machining platform moves. The focus height of the engraving laser can be automatically determined, user interaction is simplified, and the user experience is greatly improved while the accuracy of the determined focus height is guaranteed.

Description

Technical Field

[0001] The present application relates to the technical field of numerical control manufacturing, and in particular to a method for calibrating processing parameters of a processing device and a processing device. Background Art

[0002] Processing devices, such as 3D printers, (laser) cutters, laser engravers, etc., can provide processing methods such as printing, cutting, engraving, etc., and can be used to manufacture complex items that cannot be achieved by traditional manufacturing techniques (such as injection molding or manual assembly). For laser engraving tasks, in order to obtain the best engraving pattern effect, it is necessary to ensure that the distance from the engraving laser to the engraving target plane is exactly the best focusing distance of the laser. At the best focusing distance of the laser, after the laser beam passes through the focusing lens, the smallest spot can be formed on the engraving target plane, and this position has the highest energy density. In the prior art, generally, it is manually adjusted to the best focusing position before the device leaves the factory, but this method is feasible for machines fixed in the Z-axis direction, and has a relatively large error for devices that can move in the Z-axis direction. Summary of the Invention

[0003] In view of this, the present application provides a method for calibrating processing parameters of a processing device and a processing device, which can automatically determine the focal height of the engraving laser of the processing device, greatly simplifies user interaction, and improves the user experience while ensuring the calibration effect.

[0004] In a first aspect, an embodiment of the present application provides a method for calibrating processing parameters of a processing device. The processing device includes a processing platform, an engraving laser, and a guiding member. The engraving laser is slidably connected to the guiding member, and the processing platform is used to place engraving consumables. The method includes:

[0005] Controlling the processing platform to move in the Z-axis direction according to a preset step size;

[0006] During the movement of the processing platform, controlling the engraving laser to emit laser light to the engraving consumables at different heights where the processing platform moves, and obtaining a plurality of target patterns corresponding to different heights where the processing platform moves on the engraving consumables;

[0007] Obtaining the focal height of the engraving laser according to the plurality of target patterns corresponding to different heights where the processing platform moves.

[0008] In a possible embodiment, the plurality of target patterns include a plurality of calibration patterns at different positions on the engraving consumables;

[0009] The obtaining the focal height of the engraving laser according to the plurality of target patterns corresponding to different heights where the processing platform moves includes:

[0010] Obtain the pattern parameters of the multiple calibration patterns at different positions on the engraving consumable;

[0011] Determine multiple coordinate data according to the multiple pattern parameters and the height corresponding to each pattern parameter;

[0012] Perform fitting processing on the multiple coordinate data to obtain curve data, and determine the focal height according to the height corresponding to the minimum value of the pattern parameter in the curve data.

[0013] In a possible embodiment, the multiple target patterns include multiple calibration lines at different positions on the engraving consumable;

[0014] The obtaining the focal height of the engraving laser according to the multiple target patterns corresponding to different heights to which the processing platform moves includes:

[0015] Obtain the widths of the multiple calibration lines at different positions on the engraving consumable;

[0016] Based on the height to which the processing platform moves corresponding to the calibration line with the minimum width, obtain the focus of the engraving laser.

[0017] In a possible embodiment, the processing device further includes an image sensing module, and the image sensing module is slidably connected to the guiding member;

[0018] Before the obtaining the focal height of the engraving laser according to the multiple target patterns corresponding to different heights to which the processing platform moves, the method further includes:

[0019] Control the image sensing module to move above the corresponding position of the engraving consumable in the order in which the engraving laser emits laser light to the engraving consumable, so as to collect the multiple target patterns.

[0020] In a possible embodiment, the processing device further includes a 3D printing head, the image sensing module is on the 3D printing head, and the engraving laser is connected to the 3D printing head.

[0021] In a possible embodiment, the processing device further includes an image sensing module, and the image sensing module is fixedly arranged at a preset position of the processing device;

[0022] Before the obtaining the focal height of the engraving laser according to the multiple target patterns corresponding to different heights to which the processing platform moves, the method further includes:

[0023] Control the image sensing module to collect an initial image of the engraving consumable after the processing platform stops moving;

[0024] Performing a normalization process on the initial image to obtain a normalized image;

[0025] The multiple target patterns in the normalized image are determined according to the position where the engraving laser emits laser light to the engraving consumable material and the order in which the engraving laser emits laser light to the engraving consumable material.

[0026] In a possible embodiment, the plurality of target patterns include a plurality of calibration lines at different positions of the engraving consumable;

[0027] The step of obtaining pattern parameters of the plurality of calibration patterns at different positions of the engraving consumable includes:

[0028] The line width parameter of each calibration line at different positions of the engraving consumable is obtained.

[0029] In a possible embodiment, the plurality of target patterns include a plurality of calibration points at different positions of the engraving consumable;

[0030] The step of obtaining pattern parameters of the plurality of calibration patterns at different positions of the engraving consumable includes:

[0031] The point area parameter of each calibration point at different positions of the engraving consumable is obtained.

[0032] In a possible embodiment, the horizontal coordinate of the coordinate data is any one of the multiple pattern parameters, and the vertical coordinate is the height corresponding to any one of the multiple pattern parameters, or the vertical coordinate of the coordinate data is any one of the multiple pattern parameters, and the horizontal coordinate is the height corresponding to any one of the multiple pattern parameters.

[0033] In a possible embodiment, during the movement of the processing platform, the engraving laser emits laser light at the same power toward the engraving consumable at different heights to which the processing platform moves.

[0034] In a possible embodiment, each target pattern in the plurality of target patterns is engraved by the engraving laser at the same movement speed.

[0035] In a possible embodiment, controlling the processing platform to move in the Z-axis direction according to a preset step length includes:

[0036] After controlling the processing platform to move to a preset height, the processing platform is then controlled to move toward the engraving laser in a Z-axis direction according to a preset step length.

[0037] In a possible embodiment, each of the multiple target patterns carries height information to which the corresponding processing platform moves.

[0038] In a second aspect, an embodiment of the present application provides a method for calibrating processing parameters of a processing device. The processing device includes a processing platform, an engraving laser, and a guiding member. The engraving laser is slidably connected to the guiding member, and the processing platform is used to place engraving consumables. The method includes:

[0039] Controlling the engraving laser to move in the Z-axis direction at a preset step size;

[0040] During the movement of the engraving laser, controlling the engraving laser to emit laser light to the engraving consumables at different heights where the engraving laser moves, and obtaining a plurality of target patterns corresponding to different heights where the engraving laser moves on the engraving consumables;

[0041] Obtaining the focal height of the engraving laser according to the plurality of target patterns corresponding to different heights where the engraving laser moves.

[0042] In a third aspect, an embodiment of the present application provides a method for calibrating processing parameters of a processing device. The processing device includes a processing platform, a cutting tool assembly, and a guiding member. The cutting tool assembly is slidably connected to the guiding member, and the processing platform is used to place cutting consumables. The method includes:

[0043] Controlling the processing platform to move in the Z-axis direction at a preset step size;

[0044] During the movement of the processing platform, controlling the cutting tool assembly to perform cutting on the cutting consumables at different heights where the processing platform moves, and obtaining a plurality of scratches corresponding to different heights where the processing platform moves on the cutting consumables;

[0045] Obtaining the tool pressure condition of the cutting tool assembly at different heights where the processing platform moves according to the plurality of scratches corresponding to different heights where the processing platform moves.

[0046] In a possible embodiment, the plurality of scratches include multiple scribed lines at different positions on the cutting consumables;

[0047] The obtaining the tool pressure condition of the cutting tool assembly at different heights where the processing platform moves according to the plurality of scratches corresponding to different heights where the processing platform moves includes:

[0048] Obtaining images of the multiple scribed lines at different positions on the cutting consumables;

[0049] Based on the height at which the processing platform moves corresponding to the first appearance of a scribed line on the cutting consumables, obtaining the position of the cutting tool assembly relative to the cutting consumables.

[0050] In a possible embodiment, the processing device further includes an image sensing module, and the image sensing module is slidably connected to the guiding member;

[0051] Before obtaining the tool pressure conditions of the cutter assembly at different heights of the processing platform according to the multiple scratches corresponding to different heights of the movement of the processing platform, the method further includes:

[0052] Controlling the image sensing module to move above the position of the corresponding cutting consumable in the order in which the cutter assembly cuts the cutting consumable, so as to collect the multiple scratches.

[0053] In a possible embodiment, the processing device further includes a 3D printing head, the image sensing module is on the 3D printing head, and the cutter assembly is connected to the 3D printing head.

[0054] In a possible embodiment, each of the multiple scratches is formed by the cutter assembly cutting at the same moving speed.

[0055] Fourthly, an embodiment of the present application provides a processing device, which includes a processing platform, an engraving laser and a guiding member. The engraving laser is slidably connected to the guiding member, and the processing platform is used to place engraving consumables;

[0056] The processing device further includes a processor, and the processor is used to execute the instructions of any method in the first aspect or the second aspect of the embodiments of the present application.

[0057] In a possible embodiment, the processing device further includes a 3D printing head, and the engraving laser is connected to the 3D printing head.

[0058] Fifthly, an embodiment of the present application provides a processing device, which includes a processing platform, a cutter assembly and a guiding member. The cutter assembly is slidably connected to the guiding member, and the processing platform is used to place cutting consumables;

[0059] The processing device further includes a processor, and the processor is used to execute the instructions of any method in the third aspect of the embodiments of the present application.

[0060] In a possible embodiment, the processing device further includes a 3D printing head, and the cutter assembly is connected to the 3D printing head.

[0061] Sixth aspect, an embodiment of the present application provides a computer-readable storage medium. The computer-readable storage medium stores a computer program for electronic data exchange. The computer program causes a computer to execute some or all of the steps described in any of the methods in the first aspect, second aspect, and third aspect of the embodiments of the present application.

[0062] Seventh aspect, an embodiment of the present application provides a computer program product. The computer program product includes a non-transitory computer-readable storage medium storing a computer program. The computer program is operable to cause a computer to execute some or all of the steps described in any of the methods in the first aspect of the embodiments of the present application. The computer program product can be a software installation package.

[0063] Eighth aspect, an embodiment of the present application provides a method for calibrating processing parameters of a processing device. The processing device includes a processing platform, a cutting tool assembly, and a guiding member. The cutting tool assembly is slidably connected to the guiding member. The processing platform is used to place cutting consumables. The method includes:

[0064] Controlling the cutting tool assembly to move in the Z-axis direction according to a preset step size;

[0065] During the movement of the cutting tool assembly, controlling the cutting tool assembly to perform cutting on the cutting consumables at different heights reached, and obtaining a plurality of scratches corresponding to different heights reached by the cutting tool assembly on the cutting consumables;

[0066] According to the plurality of scratches corresponding to different heights reached by the cutting tool assembly, obtaining the tool pressure conditions of the cutting tool assembly at different heights reached.

[0067] It can be seen that through the method for calibrating processing parameters of the above-mentioned processing device and the processing device, the processing device includes a processing platform, an engraving laser, and a guiding member. The engraving laser is slidably connected to the guiding member. The processing platform is used to place engraving consumables. First, controlling the processing platform to move in the Z-axis direction according to a preset step size; then, during the movement of the processing platform, controlling the engraving laser to emit laser light to the engraving consumables at different heights reached by the processing platform, and obtaining a plurality of target patterns corresponding to different heights reached by the processing platform on the engraving consumables; finally, according to the plurality of target patterns corresponding to different heights reached by the processing platform, obtaining the focal height of the engraving laser. The present application can calibrate the focusing distance, that is, the focal point, of the engraving laser based on a plurality of target patterns corresponding to different heights reached by the engraving laser on the processing platform. Implementing the present application can automatically determine the focal height of the engraving laser, simplify user interaction, and greatly improve the user experience while ensuring the accuracy of the determined focal height. Description of the Drawings

[0068] Figure 1A Schematic diagram of the structure of a processing device provided by an embodiment of the present application;

[0069] Figure 1B Schematic diagram of the structure of another processing device provided by an embodiment of the present application;

[0070] Figure 2 Schematic diagram of the process flow of a method for calibrating processing parameters of a processing device provided by an embodiment of the present application;

[0071] Figure 3A Schematic diagram of a calibration line provided by an embodiment of the present application;

[0072] Figure 3B Schematic diagram of another calibration line provided by an embodiment of the present application;

[0073] Figure 4 Schematic diagram of a mapping relationship between a target pattern and height provided by an embodiment of the present application;

[0074] Figure 5 Schematic diagram of the installation position of an image sensing module provided by an embodiment of the present application;

[0075] Figure 6 Schematic diagram of the installation position of another image sensing module provided by an embodiment of the present application;

[0076] Figure 7 Schematic diagram of the structure of another processing device provided by an embodiment of the present application;

[0077] Figure 8 Schematic diagram of the process flow of a method for calibrating processing parameters of another processing device provided by an embodiment of the present application;

[0078] Figure 9 Schematic diagram of the structure of another processing device provided by an embodiment of the present application;

[0079] Figure 10 Schematic diagram of the process flow of a method for calibrating processing parameters of another processing device provided by an embodiment of the present application. Detailed implementation manners

[0080] In order to enable those skilled in the art to better understand the solution of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0081] In the description and claims of this application and the above-mentioned drawings, terms such as "first", "second", etc. are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally further include steps or units not listed, or may optionally further include other steps or units inherent to these processes, methods, products or devices.

[0082] The expression "at least one (item)" or a similar expression in the embodiments of this application refers to any combination of these items, including any combination of a single item (item) or multiple items (items), and means one or more, and multiple means two or more. For example, at least one (item) of a, b, or c can represent the following seven cases: a, b, c, a and b, a and c, b and c, a, b, and c. Among them, each of a, b, and c can be an element or a set containing one or more elements.

[0083] The "connection" that appears in the embodiments of this application refers to various connection methods such as direct connection or indirect connection to achieve communication between devices, and this application does not make any limitations in this regard. In the description of this application, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. In one example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, and can be the communication inside two elements or the interaction relationship between two elements.

[0084] Referring to "embodiments" in this context means that the specific features, structures, or characteristics described in connection with the embodiments may be included in at least one embodiment of this application. The phrase appearing in various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0085] Currently, for laser engraving tasks, to engrave clear and sharp patterns, it is necessary to ensure that the distance from the engraving laser to the engraving target plane is exactly the optimal position for laser focusing. Generally speaking, for a machine with a fixed position in the Z-axis direction, it can be adjusted to the optimal focus before leaving the factory. However, if the Z-axis is movable and the engraving laser and the processing platform are decoupled. For example, the engraving laser can move in the XY plane, and the processing platform can move in the Z-axis direction; or, the engraving laser can move in the X direction, the processing platform can move in the Y direction, and the engraving laser can move in the Z-axis direction. Then, how to quickly and accurately determine the focal height of the engraving laser before processing becomes a problem.

[0086] To solve the above problems, the embodiments of the present application provide a method for calibrating processing parameters of a processing device and a processing device, which can automatically determine the focal height of the engraving laser, simplify user interaction, and greatly improve the user experience while ensuring the accuracy of the determined focal height.

[0087] Please refer to Figure 1A , the embodiments of the present application provide a processing device, including an engraving laser 100, a guide member 200, and a processing platform 300. In some feasible embodiments, the processing device is a gantry structure (as Figure 1A shown), the guide member 200 is supported by two Z-axis vertical columns, the processing platform 300 can move along the X-axis direction, and the engraving laser 100 can move along the guide member 200 in the Y-axis direction, where the directions of the X-axis and the Y-axis can be swapped. For example, it can be said that the processing platform can move along the Y-axis direction, and the engraving laser can move along the X-axis direction. The present application does not limit the establishment of the device coordinate system.

[0088] The processing platform 300 moves in the X-axis direction. The engraving laser 100 can move up and down in the Z-axis to process the object to be processed placed on the processing platform 300.

[0089] Optionally, the processing device can be a corexy structure as shown in Figure 1B . The processing device includes an engraving laser 500, a guide member 600, a processing platform 400, and a Z-axis lead screw 700. The guide member 600 can be supported by the frame on the processing device. The engraving laser 500 can move on the XY plane along the guide member 600 driven by a belt. The processing platform 400 is connected to the Z-axis lead screw 700 to realize the movement of the processing platform 400 in the Z-axis direction. Exemplarily, the guide member can be at least one of a Y-axis linear guide, a carbon rod, and an X-axis optical axis, and the engraving laser can be a laser head.

[0090] It should be understood Figure 1A and Figure 1BThis is just a schematic illustration and does not limit the structural type of the processing equipment. In some feasible embodiments, the processing equipment can also be of a cantilever type structure. In this application, unless otherwise clearly specified and defined, terms such as "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components, unless otherwise clearly defined. "Connection" includes detachable connection and non-detachable connection. For example, fixed connection can include detachable fixed connection and non-detachable fixed connection, rotational connection can include detachable rotational connection and non-detachable rotational connection, and sliding connection can include detachable sliding connection and non-detachable sliding connection. Connection can also be a direct connection or an indirect connection through a component. For example, for a detachable fixed connection, it means that in the installed state, the positional relationship between at least two connected objects can be fixed; similarly, there are rotational connection, sliding connection, etc.

[0091] In some feasible embodiments, the processing platform 300 is used to provide a platform for the production and processing of the engraving laser 100. The guiding member 200 is used to support the engraving laser 100. The engraving laser 100 is slidably connected to the guiding member 200, and the engraving laser 100 can linearly slide along the extension direction of the guiding member 200 (the Y-axis direction) or slide in the YZ plane through a belt during processing. The sliding of the engraving laser 100 along the extension direction of the guiding member 200 (the Y-axis direction), the movement of the processing platform 300 along the X-axis direction, and the up and down movement of the engraving laser 100 along the Z-axis direction can be coordinated by a stepper motor and a transmission system, so that the stepper motor drives the engraving laser 100 and / or the processing platform 300 to perform precise movement in three-dimensional space, ensuring that the material processed by the engraving laser 100 is formed according to the designed trajectory.

[0092] Among them, the engraving consumables can be placed on the processing platform 300, and the engraving laser 100 can move along the Z-axis, so that the engraving laser 100 can emit laser at different heights to the engraving consumables, and obtain multiple target patterns corresponding to different heights where the engraving laser 100 moves on the engraving consumables, thereby facilitating the determination of the focal height of the engraving laser 100 using the above multiple target patterns in the subsequent process. It can be understood that the processing equipment includes a processor, and the processor is used to execute the processing parameter calibration method of the following processing equipment.

[0093] The following combines Figure 2 to illustrate a processing parameter calibration method for a processing equipment in an embodiment of the present application. Figure 2 is a schematic flowchart of a processing parameter calibration method for a processing equipment provided in an embodiment of the present application. This method can be applicable toFigure 1B The processing equipment shown in the figure, the processing equipment includes a processing platform 400 that can move along the Z-axis and an engraving laser 500 that can move in the XY plane. The engraving laser 500 is slidably connected to a guide 600, and the processing platform 400 is used to place engraving consumables. Specifically, it includes the following steps:

[0094] Step S201, control the processing platform to move in the Z-axis direction according to a preset step size.

[0095] Among them, the preset step size is a pre-set value, which can be 0.1 mm, 1 mm, etc. and is not specifically limited here. The processing platform can be controlled to move multiple times in the Z-axis direction according to the preset step size.

[0096] In some feasible embodiments, assuming that each time the processing platform moves on the Z-axis, the engraving laser emits a laser beam towards the engraving consumable once, then the preset step size can characterize the calibration sensitivity. For example, the smaller the preset step size, the higher the calibration accuracy. For example, the processing platform can be controlled to move in the Z direction with a relatively large preset step size. After steps S202 to S203 are completed, the focal height of the engraving laser can be roughly found. Then, the processing platform is controlled to move to the vicinity of the roughly found focal height of the laser, and the processing platform is controlled to move in the Z direction with a smaller preset step size, and steps S202 and S203 are continued to be executed, so that a more accurate focal height of the engraving laser can be obtained. Optionally, assuming that the processing platform moves multiple times on the Z-axis and the engraving laser emits a laser beam towards the engraving consumable once, when the number of target patterns is determined, the preset step size can also characterize the calibration range.

[0097] Optionally, in a possible embodiment, after controlling the processing platform to move to a preset height, the processing platform can be controlled to move towards the engraving laser in the Z-axis direction according to a preset step size. Among them, the engraving laser has a theoretically recommended focal distance at the factory, and the preset height can be the theoretically recommended focal distance of the processing platform relative to the engraving laser. For example, the theoretically recommended focal distance can be a nameplate value. Implementing the present application can calibrate the height difference between the theoretically recommended focal distance and the actual focal distance.

[0098] Step S202, during the movement of the processing platform, control the engraving laser to emit laser beams towards the engraving consumable at different heights where the processing platform moves to, and obtain a plurality of target patterns corresponding to different heights where the processing platform moves on the engraving consumable.

[0099] Among them, the plurality of target patterns include a plurality of calibration patterns at different positions on the engraving consumable. It can be understood that the style and shape of each target pattern are the same, and there will be differences in details for each target pattern due to the different distances between the processing platform and the engraving laser.

[0100] In some possible embodiments, each time the processing platform moves once on the Z-axis, the control engraving laser emits laser light towards the engraving consumable once. For example, if the processing platform moves n times on the Z-axis with a preset step size, then the control engraving laser emits laser light at n heights where the processing platform moves to, and n target patterns corresponding to the n heights where the processing platform moves are obtained at different positions on the engraving consumable. n can be a natural number greater than 2, and the value of n can be flexibly adjusted according to actual needs and will not be specifically limited here. For example, by controlling the processing platform to move in the Z-axis direction with a preset step size of 1 mm, after the processing platform moves 1 mm each time, the control engraving laser can be controlled to move on the XY plane to obtain a target pattern on the engraving consumable. Then, when the moving distance of the processing platform reaches 15 mm, 15 target patterns can be obtained on the engraving consumable.

[0101] Alternatively, each time the processing platform moves m times on the Z-axis, where m is greater than or equal to 2, the control engraving laser emits laser light towards the engraving consumable once. For example, the processing platform can be controlled to move in the Z-axis direction with a preset step size of 1 mm. After the processing platform moves 3 mm each time, the control engraving laser can be controlled to move on the XY plane to obtain a target pattern on the engraving consumable. Then, when the moving distance of the processing platform reaches 15 mm, 5 target patterns can be obtained on the engraving consumable.

[0102] In a possible embodiment, the target pattern can be a calibration line, and multiple target patterns can be multiple calibration lines at different positions on the engraving consumable. Please refer to Figure 3A , Figure 3A which is a schematic diagram of a calibration line provided by an embodiment of the present application. Figure 3A In , n is 9, that is, there are 9 calibration lines, and each calibration line specifies the same length. For example, the control engraving laser can be controlled to engrave the first calibration line starting from the top. After the engraving is completed, the processing platform is controlled to move to the next height with a preset step size, and then the control engraving laser starts to engrave the second calibration line at a preset distance below the first calibration line, and so on, until 9 calibration lines are obtained.

[0103] In a possible embodiment, the target pattern can be a calibration point, and multiple target patterns can be multiple calibration points at different positions on the engraving consumable. For example, the control engraving laser can be controlled to engrave the first calibration point starting from the top. After the engraving is completed, the processing platform is controlled to move to the next height with a preset step size, and then the control engraving laser starts to engrave the second calibration point at a preset distance below the first calibration point, and so on, until n calibration points are obtained, which will not be elaborated here.

[0104] In a possible embodiment, during the movement of the processing platform, the engraving laser emits laser light to the engraving consumable at the same power at different heights reached by the processing platform. That is, during the movement of the processing platform, the engraving laser outputs the same power to engrave the target pattern, which can avoid the differences in the target pattern caused by different powers of the engraving laser.

[0105] In a possible embodiment, each of the multiple target patterns is engraved by the engraving laser at the same moving speed, thereby avoiding the differences in the target pattern caused by different moving speeds of the engraving laser.

[0106] In a possible embodiment, each target pattern can carry the height information of the corresponding height reached by the processing platform. During the movement of the processing platform, the engraving laser can process the target pattern on the surface of the engraving consumable and engrave the height reached by the processing platform corresponding to the target pattern in the adjacent area of each target pattern. Exemplarily, the height reached by the processing platform can be the distance between the processing platform and the engraving laser, or the height reached by the processing platform can be the distance from the processing platform to the bottom of the processing device or the height from the processing platform to a certain reference point in the processing device.

[0107] Taking Figure 3B the target pattern shown in which includes calibration lines as an example, the distance between the processing platform and the engraving laser can be engraved beside each calibration line. It can be seen that when the processing platform is 20 mm away from the engraving laser, the engraving laser emits laser light to the engraving consumable, and a calibration line is obtained on the surface of the engraving consumable; when the processing platform is 19.5 mm away from the engraving laser, the engraving laser emits laser light to the engraving consumable, and another calibration line is obtained on the surface of the engraving consumable; successively, calibration lines formed on the surface of the engraving consumable at the positions where the processing platform is 19 mm, 18.5 mm, 18 mm, and 17.5 mm away from the engraving laser are obtained respectively.

[0108] Further, in some feasible implementation manners, the calibration lines can be collected by the image sensing module during the process of the engraving laser engraving the calibration lines, or the calibration lines can be collected by the image sensing module after the engraving laser finishes engraving the calibration lines. That is, the image sensing module can collect one calibration line at a time, or the image sensing module can collect multiple or even all calibration lines at a time. Based on the image of the calibration lines collected by the image acquisition module, the width of the calibration lines is obtained, and the height reached by the processing platform corresponding to the calibration line with the smallest width is used as the focus of the engraving laser. As Figure 3B shown in the calibration lines, when the processing platform is 18.5 mm away from the engraving laser, the width of the calibration line is the smallest, that is, the focus of the engraving laser can be obtained as 18.5 mm.

[0109] Alternatively, in some feasible embodiments, the height of the movement of the processing platform and the width of the calibration line can form a two-dimensional coordinate. For example, taking the distance between the processing platform and the engraving laser as the abscissa and the width of the calibration line as the ordinate, a curve is obtained by fitting the two-dimensional coordinates during the movement of the processing platform, and the abscissa corresponding to the minimum value point of the ordinate is the focus of the engraving laser.

[0110] Alternatively, the width of the calibration line and the height of the movement of the processing platform can be input into a big data model to obtain the focus of the engraving laser, and this big data model is trained by the factory information of the engraving laser or the focus information of historical calibration.

[0111] This application can also further determine the focus of the engraving laser by combining the focus of the engraving laser calibrated in the history of the processing equipment.

[0112] Optionally, please refer to Figure 4 , Figure 4 which is a schematic diagram of the mapping relationship between a target pattern and a height provided by an embodiment of this application. Here, the height is the height to which the processing platform moves. The target patterns include image I0, image I1 until image In, and the heights include H0, H1 until height Hn. The interval between each height is the height step h. It can be seen that there can be a mapping relationship between the target pattern and the height.

[0113] Step S203, obtain the focus height of the engraving laser according to a plurality of target patterns corresponding to different heights to which the processing platform moves.

[0114] In a possible embodiment, the plurality of target patterns include a plurality of calibration patterns at different positions on the engraving consumable. The pattern parameters of the plurality of calibration patterns at different positions on the engraving consumable can be obtained. Then, according to the plurality of pattern parameters and the height corresponding to each pattern parameter, a plurality of coordinate data are determined. Finally, fitting processing is performed on the plurality of coordinate data to obtain curve data, and the focus height is determined according to the height corresponding to the minimum value of the pattern parameter in the curve data. It can be understood that n pattern parameters of n calibration patterns can be obtained, and n coordinate data are determined according to the n pattern parameters and the height corresponding to each pattern parameter. The height corresponding to each pattern parameter is the height to which the processing platform moves corresponding to each target pattern.

[0115] In a possible embodiment, when the multiple target patterns include multiple calibration lines at different positions on the engraving consumable, obtaining the pattern parameters of the multiple calibration patterns at different positions on the engraving consumable includes: obtaining the line width parameter of each calibration line at different positions on the engraving consumable. Since when the engraving laser engraves calibration lines on the engraving consumable at different heights with a constant power and a constant speed, there will be differences in the widths of the calibration lines, because the laser beam can obtain the thinnest engraving line at the focal height, and the thinnest engraving line cannot be obtained when deviating from the focal height. In this way, the width of each calibration line can be determined, facilitating subsequent calibration.

[0116] In a possible embodiment, when the multiple target patterns include multiple calibration points at different positions on the engraving consumable, obtaining the pattern parameters of the multiple calibration patterns at different positions on the engraving consumable includes: obtaining the point area parameter of each calibration point at different positions on the engraving consumable. Since when the engraving laser engraves calibration points on the engraving consumable at different heights with a constant power and a constant speed, there will be differences in the areas of the calibration points, because the laser beam can obtain the smallest engraving point at the focal height, and the smallest engraving point cannot be obtained when deviating from the focal height. In this way, the area of each calibration point can be determined, facilitating subsequent calibration.

[0117] Wherein, the abscissa of the coordinate data is any one of the multiple pattern parameters, and the ordinate is the height corresponding to any one of the multiple pattern parameters, or, the ordinate of the coordinate data is any one of the multiple pattern parameters, and the abscissa is the height corresponding to any one of the multiple pattern parameters.

[0118] For example, when the pattern parameter is the line width parameter, if the line width parameters include w1, w2,..., wn, and the corresponding heights include h1, h2,..., hn, then n coordinate data can be obtained, including (w1, h1), (w2, h2),...,(wn, hn) or (h1, w1), (h2, w2),...,(hn, wn). Curve fitting can be performed on this set of coordinates to find the minimum point of the line width parameter on the curve, and then the height corresponding to the minimum line width is determined as the focal height.

[0119] For example, when the pattern parameter is the point area parameter, if the point area parameters include d1, d2,..., dn, and the corresponding heights include h1, h2,..., hn, then n coordinate data can be obtained, including (d1, h1), (d2, h2),...,(dn, hn) or (h1, d1), (h2, d2),...,(hn, dn). Curve fitting can be performed on this set of coordinates to find the minimum point of the point area parameter on the curve, and then the height corresponding to the minimum point area is determined as the focal height.

[0120] In a possible embodiment, the widths of the calibration lines at different positions of the plurality of the engraving consumables can be obtained, and then, based on the height to which the processing platform moves corresponding to the calibration line with the minimum width, the focus of the engraving laser can be obtained.

[0121] It can be seen that through the processing parameter calibration method and the processing equipment of the above-mentioned processing equipment, the processing equipment includes a processing platform, an engraving laser and a guiding member, the engraving laser is slidably connected to the guiding member, and the processing platform is used to place the engraving consumables. First, control the processing platform to move in the Z-axis direction according to a preset step length; then, during the movement of the processing platform, control the engraving laser to emit laser light to the engraving consumables at different heights to which the processing platform moves, and obtain a plurality of target patterns corresponding to different heights to which the processing platform moves on the engraving consumables; finally, according to the plurality of target patterns corresponding to different heights to which the processing platform moves, obtain the focus height of the engraving laser. The focus height of the engraving laser can be automatically determined, the user interaction is simplified, and while ensuring the accuracy of the determined focus height, the user experience is greatly improved.

[0122] In a possible embodiment, the processing equipment further includes an image sensing module. Among them, the image sensing module can include a camera, a profiler, etc., and the profiler can be composed of a camera and a line laser emitter. Among them, the image sensing module can be used to collect the above-mentioned plurality of target patterns.

[0123] Further, in a possible embodiment, refer to Figure 5 , Figure 5 which is a schematic diagram of the installation position of an image sensing module provided by an embodiment of the present application. It can be seen that the image sensing module 510 is slidably connected to the guiding member 200. Exemplarily, the image sensing module 510 can be mounted on the engraving laser 100, and the engraving laser 100 is slidably connected to the guiding member 200. Or the image sensing module can be directly slidably connected to the guiding member, sharing a driving mechanism with the engraving laser or having an independent driving mechanism.

[0124] The connection methods and functions of the guiding member, the engraving laser and the processing platform can be referred to Figure 1A or Figure 1B for the description, which will not be elaborated here.

[0125] Among them, before obtaining the focal height of the engraving laser based on multiple target patterns corresponding to different heights where the processing platform moves to, the image sensing module can be controlled to move above the position of the corresponding engraving consumable in the order of the engraving laser emitting laser to the engraving consumable, so as to collect the multiple target patterns. In this application, the image sensing module can move directly above the target pattern without image rotation, which can simplify the calculation. Specifically, one target pattern can be collected each time it moves, or multiple target patterns can be collected each time it moves. The number of collected target patterns is positively correlated with the shooting range of the image sensing module. For example, the image sensing module can be controlled to move directly above each calibration line each time to collect the pattern of the corresponding calibration line. Or, the number of times of collection and the position of each collection can be determined based on the number, distribution range, and shooting range of the calibration lines. For example, the number of collections can be 7, and 3 calibration lines are collected each time. Then, the image sensing module can be controlled to move 7 times, and each time it moves to a position where a complete 3 calibration lines can be photographed to collect the corresponding 3 calibration lines. It should be noted that the 3 calibration lines collected each time are not repeated. Thus, the collection efficiency can be improved while ensuring the clarity of the collected target patterns. Among them, the collection order can be to collect once for each engraved target pattern, or to collect after multiple target patterns are engraved, or to collect after all target patterns are engraved. There is no specific limitation here, which can improve the flexibility of collecting target patterns.

[0126] In a possible embodiment, referring to Figure 6 , Figure 6 is a schematic diagram of the installation position of another image sensing module provided by the embodiment of the present application. It can be seen that the image sensing module 610 is fixedly installed at a preset position, and the preset position can be a position where all target patterns can be photographed, such as above the front door housing, the top shell, or the side frame of the processing device.

[0127] The connection method and function of the guide member, the engraving laser, and the processing platform can be referred to Figure 1A or Figure 1B for the description, and will not be elaborated here.

[0128] Among them, since the image sensing module 610 is fixedly arranged at a preset position of the processing device, there is an inclination angle between the image sensing module and the processing platform. Before obtaining the focal height of the engraving laser according to a plurality of target patterns corresponding to different heights where the processing platform moves to, the image sensing module can be controlled to collect an initial image of the engraving consumable after the processing platform stops moving, and then the initial image is rotated to obtain a rotated image. Finally, the plurality of target patterns in the rotated image are determined according to the position where the engraving laser emits laser to the engraving consumable and the order in which the engraving laser emits laser to the engraving consumable. In this application, the focal point of the engraving laser can be calibrated by reusing the time-lapse camera of the processing device.

[0129] It can be seen that in this way, a plurality of target patterns can be collected by the image sensing module, which is convenient for providing reliable data support for quickly and accurately determining the focal height subsequently.

[0130] In a possible embodiment, the processing device may further include a 3D printing head. The image sensing module is on the 3D printing head, and the engraving laser is connected to the 3D printing head. Alternatively, the image sensing module is decoupled from the 3D printing head. The connection manner between the engraving laser and the 3D printing head may include a detachable connection. The 3D printing head includes a hot end for heating the printing material. For example, when a laser head including an engraving laser is already connected to the 3D printing head, the laser head can be disassembled and replaced with a cutter assembly that can be connected. When a cutter assembly that can be connected is already connected to the 3D printing head, the connection for the cutter assembly can be disassembled and replaced with a laser head including an engraving laser. The hot end of the 3D printing head for heating the printing material can extrude the printing material through a nozzle. The printing material can be a plastic filament that is easy to heat and melt, such as polylactic acid or acrylonitrile-butadiene-styrene copolymer. The diameter of the nozzle can be 0.2 mm, 0.4 mm, 0.8 mm, etc. The printable materials of the 3D printing head can also be printing materials of multiple colors and multiple different properties. For example, multiple printable materials can be obtained by connecting a feeding device, rather than just a single printable material. In some feasible embodiments, when the 3D printing head is connected to the laser head, after the 3D printing head finishes printing a product or during the printing process, the laser head performs laser engraving on the 3D printed product / part of the product. The high energy density of the laser beam rapidly raises the temperature of the material surface, melts or vaporizes it, thereby forming the desired pattern or text. This reduces the steps of first installing the 3D printing head, then disassembling the 3D printing head, and then installing the laser head, improving production efficiency. Alternatively, placing the processing consumables of the laser head, such as materials like acrylic boards, wood, metals, glass, stainless steel, rocks, etc., on the processing platform, the laser head can process other products besides the 3D printed products. The processing device of the present application can either achieve 3D printing alone, or achieve laser engraving / cutting alone, or achieve both 3D printing and laser engraving / cutting. By sharing the same set of motion devices, such as guide rods / processing platforms, etc., between the laser head and the 3D printing head, various different processing methods can be achieved, such as printing, engraving / cutting, printing while engraving / cutting, engraving / cutting after printing, etc., providing multiple possibilities for the manufacture of complex products, and can further improve the production and manufacturing efficiency with low cost.

[0131] Engraving refers to the process of changing the appearance of a material without completely penetrating it, removing part of the material by scratching, carving, or other means to create the desired shape, pattern, or design. For example, fine lines and patterns are scratched on the material surface by a cutter, or text or patterns are engraved on the material surface by a laser beam.

[0132] It can be seen that through the processing parameter calibration method and processing equipment of the above-mentioned processing equipment, the processing equipment includes a processing platform, an engraving laser, and a guiding member. The engraving laser is slidably connected to the guiding member, and the processing platform is used to place engraving consumables. First, control the processing platform to move in the Z-axis direction according to a preset step length; then, during the movement of the processing platform, control the engraving laser to emit laser light to the engraving consumables at different heights where the processing platform moves, and obtain a plurality of target patterns on the engraving consumables corresponding to different heights where the processing platform moves; finally, according to the plurality of target patterns corresponding to different heights where the processing platform moves, obtain the focal height of the engraving laser. It can automatically determine the focal height of the engraving laser, simplify user interaction, and greatly improve the user experience while ensuring the accuracy of the determined focal height.

[0133] Next, in conjunction with Figure 7 Another processing equipment in the embodiments of the present application will be described. Please refer to Figure 7 , the embodiments of the present application provide a processing equipment, including an engraving laser 710, a guiding member 720, and a processing platform 730. In some feasible embodiments, the processing equipment is a gantry structure (as Figure 7 shown), the guiding member 720 is supported by two Z-axis vertical columns, the engraving laser 710 can move up and down along the Z-axis with the guiding member 720, the engraving laser 710 can move in the Y-axis direction along the guiding member 720, and the processing platform 730 moves in the X-axis direction.

[0134] Next, in conjunction with Figure 8 Another processing parameter calibration method of the processing equipment in the embodiments of the present application will be described. Figure 8 FIG. Figure 7 is a schematic flowchart of another processing parameter calibration method provided by the embodiments of the present application. This method can be applied to the processing equipment shown in

[0135] Step S801, control the engraving laser to move in the Z-axis direction according to a preset step length.

[0136] Among them, the preset step length is a pre-set value, which can be 0.1 mm, 1 mm, etc., and is not specifically limited here. The engraving laser can be controlled to move in the Z-axis direction multiple times according to the preset step length.

[0137] In some feasible embodiments, it is assumed that each time the engraving laser moves on the Z-axis, the engraving laser is controlled to emit a laser beam towards the engraving consumable once. This preset step size characterizes the calibration sensitivity. For example, the smaller the preset step size, the higher the calibration accuracy obtained. In some feasible embodiments, the engraving laser can be controlled to move in the Z-direction with a relatively large preset step size. After steps S802 to S803 are completed, the focal height of the engraving laser can be roughly found. Then, the engraving laser is controlled to move near the roughly found focal height of the laser, and the engraving laser is controlled to move in the Z-direction with a smaller preset step size, and steps S802 and S803 are continued to be executed, so that a more accurate focal height of the engraving laser can be obtained. Optionally, it is assumed that the engraving laser moves multiple times on the Z-axis, and the engraving laser is controlled to emit a laser beam towards the engraving consumable once. When the number of target patterns is determined, this preset step size can also characterize the calibration range.

[0138] Optionally, in a possible embodiment, after the engraving laser is controlled to move to a preset height, the engraving laser can be controlled to move towards the engraving laser in the Z-axis direction according to a preset step size. Among them, the engraving laser has a theoretically recommended focal distance at the factory, and the preset height can be the theoretically recommended focal distance of the engraving laser relative to the processing platform. For example, this theoretically recommended focal distance can be a nameplate value. By implementing the present application, the height difference between the theoretically recommended focal distance and the actual focal distance can be calibrated.

[0139] Step S802: During the movement of the engraving laser, the engraving laser is controlled to emit laser beams towards the engraving consumable at different heights where the engraving laser moves, and a plurality of target patterns corresponding to different heights where the engraving laser moves are obtained on the engraving consumable.

[0140] Among them, the plurality of target patterns include a plurality of calibration patterns at different positions on the engraving consumable. It can be understood that the style and shape of each target pattern are the same, and due to the different distances between the processing platform and the engraving laser, there will be differences in details for each target pattern.

[0141] Among them, each time the engraving laser moves on the Z axis, the engraving laser is controlled to emit laser light towards the engraving consumable once. For example, if the engraving laser moves n times on the Z axis with a preset step size, then the engraving laser is controlled to emit laser light towards the engraving consumable at n heights where the engraving laser moves, and n target patterns corresponding to the n heights where the engraving laser moves are obtained at different positions on the engraving consumable. n can be a natural number greater than 2, and the value of n can be flexibly adjusted according to actual needs and will not be specifically limited here. For example, if the engraving laser is controlled to move in the Z axis direction with a preset step size of 1 mm, after the engraving laser moves 1 mm each time, the engraving laser can be controlled to move on the XY plane to obtain a target pattern on the engraving consumable. Then, when the moving distance of the engraving laser reaches 15 mm, 15 target patterns can be obtained on the engraving consumable.

[0142] Alternatively, every time the engraving laser moves m times on the Z axis, where m is greater than or equal to 2, the engraving laser is controlled to emit laser light towards the engraving consumable once. For example, the engraving laser can be controlled to move in the Z axis direction with a preset step size of 1 mm. After the engraving laser moves 3 mm each time, the engraving laser can be controlled to move on the Y square or the processing platform can be controlled to move in the X direction to obtain a target pattern on the engraving consumable. Then, when the moving distance of the engraving laser reaches 15 mm, 5 target patterns can be obtained on the engraving consumable.

[0143] In a possible embodiment, the target pattern can be a calibration line, and multiple target patterns can be multiple calibration lines at different positions on the engraving consumable. For example, n is 9, that is, there are 9 calibration lines, and each calibration line specifies the same length. For example, the engraving laser can be controlled to engrave the first calibration line starting from the top. After the engraving is completed, the engraving laser is controlled to move to the next height with a preset step size, and then the engraving laser is controlled to start engraving the second calibration line at a preset distance below the first calibration line, and so on until 9 calibration lines are obtained.

[0144] In a possible embodiment, the target pattern can be a calibration point, and multiple target patterns can be multiple calibration points at different positions on the engraving consumable. For example, the engraving laser can be controlled to engrave the first calibration point starting from the top. After the engraving is completed, the engraving laser is controlled to move to the next height with a preset step size, and then the engraving laser is controlled to start engraving the second calibration point at a preset distance below the first calibration point, and so on until n calibration points are obtained, which will not be elaborated here.

[0145] In a possible embodiment, during the process of the engraving laser, the engraving laser emits laser light to the engraving consumable at the same power at different heights where the engraving laser moves. That is, during the movement of the engraving laser on the processing platform, the engraving laser outputs the same power to engrave the target pattern, which can avoid the differences in the target pattern caused by different powers of the engraving laser.

[0146] In a possible embodiment, each of the multiple target patterns is formed by the engraving laser engraving at the same moving speed, thereby avoiding the differences in the target pattern caused by different moving speeds of the engraving laser.

[0147] In a possible embodiment, each target pattern can carry the height information corresponding to the height where the engraving laser moves to. During the movement of the engraving laser, the engraving laser can process the target pattern on the surface of the engraving consumable and engrave the height where the engraving laser moves to corresponding to the target pattern in the nearby area of each target pattern. Exemplarily, the height where the engraving laser moves to can be the distance between the engraving laser and the processing platform, or it can be the distance between the engraving laser and the bottom of the processing device or the height from the engraving laser to a certain reference point in the processing device. Taking the target pattern including calibration lines as an example, by engraving the distance between the processing platform and the engraving laser beside each calibration line, it can be seen that when the processing platform is 20 mm away from the engraving laser, the engraving laser emits laser light to the engraving consumable, and a calibration line is obtained on the surface of the engraving consumable; when the processing platform is 19.5 mm away from the engraving laser, the engraving laser emits laser light to the engraving consumable, and another calibration line is obtained on the surface of the engraving consumable; successively, calibration lines formed on the surface of the engraving consumable at the positions where the processing platform is 19 mm, 18.5 mm, 18 mm, and 17.5 mm away from the engraving laser are obtained respectively.

[0148] Further, in some feasible embodiments, the calibration lines can be collected by the image sensing module during the process of the engraving laser engraving the calibration lines, or the calibration lines can be collected by the image sensing module after the engraving laser finishes engraving the calibration lines. That is, the image sensing module can collect one calibration line at a time, or the image sensing module can collect multiple or even all calibration lines at a time. Based on the image of the calibration lines collected by the image acquisition module, the width of the calibration lines is obtained, and the height where the engraving laser moves to corresponding to the calibration line with the smallest width is taken as the focus of the engraving laser. As Figure 3B shown in the calibration lines, when the processing platform is 18.5 mm away from the engraving laser, the width of the calibration line is the smallest, that is, the focus of the engraving laser can be obtained as 18.5 mm.

[0149] Alternatively, in some feasible embodiments, the height of the engraving laser movement and the width of the calibration line can form a two-dimensional coordinate. For example, taking the distance between the processing platform and the engraving laser as the abscissa and the width of the calibration line as the ordinate, a curve is obtained by fitting the two-dimensional coordinates during the movement of the engraving laser, and the abscissa corresponding to the minimum value point of the ordinate is the focus of the engraving laser.

[0150] Or, the width of the calibration line and the height of the engraving laser movement can be input into a big data model to obtain the focus of the engraving laser, and the big data model is trained by the factory information of the engraving laser or the focus information of historical calibration.

[0151] This application can also further determine the focus of the engraving laser by combining the focus of the engraving laser calibrated in the history of the processing equipment.

[0152] It can be seen that in this way, the variable that causes differences in the target pattern can be determined as the distance between the processing platform and the engraving laser, so as to determine the accurate focus height of the engraving laser subsequently.

[0153] Step S803, obtain the focus height of the engraving laser according to a plurality of target patterns corresponding to different heights where the engraving laser moves to.

[0154] It can be understood that for the steps not described in detail above, reference can be made to the description of the method in Figure 2 The difference from Figure 8 is the structure of the movement in the Z-axis, and the rest of the processing logic is similar, so it will not be elaborated here. Figure 2

[0155] It can be seen that through the processing parameter calibration method of the above processing equipment and the processing equipment, the processing equipment includes a processing platform, an engraving laser, and a guide member, the engraving laser is slidably connected to the guide member, and the processing platform is used to place engraving consumables. First, control the engraving laser to move in the Z-axis direction according to a preset step size; then, during the movement of the engraving laser, control the engraving laser to emit laser to the engraving consumables at different heights respectively, and obtain a plurality of target patterns corresponding to different heights where the engraving laser moves to on the engraving consumables; finally, obtain the focus height of the engraving laser according to a plurality of target patterns corresponding to different heights where the engraving laser moves to. The focus height of the engraving laser can be automatically determined, the user interaction is simplified, and the accuracy of the determined focus height is ensured while greatly improving the user experience.

[0156] In this embodiment, the processing equipment may also include an image sensing module and / or a 3D printing head, and reference can be made to the corresponding descriptions in Figure 5 Figure 6 、 and it will not be elaborated here.

[0157] Figure 8 and Figure 2 The difference between the calibration methods involved is that Figure 2 It is used in the processing equipment structure where the processing platform moves along the Z axis, such as the corexy structure; Figure 8 It is a processing equipment structure in which the engraving laser moves along the Z axis, such as a gantry structure or a cantilever structure.

[0158] Combine the following Figure 9 Another processing equipment in the embodiment of the present application is described. Figure 9 A schematic diagram of another processing device provided in an embodiment of the present application includes a cutter assembly 910, a guide member 920 and a processing platform 930. In some feasible embodiments, the processing device is a gantry structure (such as Figure 9 As shown in FIG. 1 , the guide member 920 is supported by two Z-axis vertical columns, the processing platform 930 can move along the X-axis, and the cutter assembly 910 can move along the guide member 920 in the Y-axis direction, wherein the directions of the X-axis and the Y-axis can be interchanged, for example, the processing platform can move along the Y-axis direction, and the engraving laser can move along the X-axis direction. This application does not limit the establishment of the device coordinate system.

[0159] The processing platform 930 moves in the X-axis direction. The cutter assembly 910 can move up and down in the Z-axis to process the object to be processed placed on the processing platform 930.

[0160] Optionally, the processing equipment can be a corexy structure, the guide member can be supported by a frame on the processing equipment, the cutter assembly can move on the XY plane along the guide member driven by the belt, the processing platform is connected to the Z-axis lead screw to realize the movement of the processing platform in the Z-axis direction, and the guide member can be at least one of a Y-axis rail, a carbon rod, and an X-axis optical axis, and the cutter assembly can be a cutter head. In some feasible embodiments, the processing equipment can also be a cantilever structure.

[0161] In some feasible embodiments, the processing platform 930 is used to provide a platform for the production and processing of the cutter assembly 910. The guide 920 is used to support the cutter assembly 910. The cutter assembly 910 is slidably connected to the guide 920. During processing, the cutter assembly 910 can linearly slide along the extension direction of the guide 920 (the Y-axis direction) or slide in the YZ plane through a belt. The cutter assembly 910 moves along the Y-axis direction relative to the frame of the processing platform 930 following the guide 920. The sliding of the cutter assembly 910 along the extension direction of the guide 920 (the Y-axis direction) on the guide 920, the movement of the cutter assembly 910 along the Z-axis direction following the guide 920, and the movement of the processing platform 930 along the X-axis direction can be coordinated by a stepper motor and a transmission system, so that the stepper motor drives the cutter assembly 910 and / or the processing platform 930 to perform precise movement in three-dimensional space, ensuring that the material processed by the cutter assembly 910 is formed according to the designed trajectory.

[0162] Among them, the cutting consumables can be placed on the processing platform 930. The cutter assembly 910 can perform cutting on the cutting consumables at different heights. Multiple scratches corresponding to different heights of the movement of the processing platform 930 are obtained on the cutting consumables, so as to facilitate determining the tool pressure condition of the cutter assembly 910 by using the above multiple scratches in the subsequent process. It can be understood that the processing device includes a processor, and the processor is used to execute the processing parameter calibration method of the following processing device.

[0163] Please refer to Figure 10 , Figure 10 which is a process view of another processing parameter calibration method provided by an embodiment of the present application. The processing device includes a processing platform that can move along the Z-axis and a cutter assembly that can move in the XY plane. The cutter assembly is slidably connected to the guide. The processing platform is used to place the cutting consumables, and specifically includes the following steps:

[0164] Step S1001, control the processing platform to move in the Z-axis direction according to a preset step size.

[0165] Among them, the preset step size can be 0.1 mm, 1 mm, etc., and no specific limitation is made here. The processing platform can be controlled to move multiple times in the Z-axis direction according to the preset step size.

[0166] In some feasible embodiments, it is assumed that each time the processing platform moves once along the Z-axis, the cutting tool assembly is controlled to cut the consumable once. Then this preset step size characterizes the calibration sensitivity. For example, the smaller the preset step size, the higher the obtained calibration accuracy. In some feasible embodiments, the processing platform can be controlled to move in the Z direction with a relatively large preset step size. After steps S1002 to S1003 are completed, the standard cutting height of the cutting tool assembly can be roughly found. Then the processing platform is controlled to move to the vicinity of the standard cutting height of the cutting tool assembly that is roughly found, and the processing platform is controlled to move in the Z direction with a smaller preset step size. The cutting tool assembly continues to execute step S1002 at different positions of the consumable, so that a relatively accurate standard cutting height of the cutting tool assembly can be obtained. Optionally, it is assumed that each time the processing platform moves multiple times along the Z-axis, the cutting tool assembly is controlled to cut the consumable once. When the number of target patterns is determined, this preset step size can also characterize the calibration range.

[0167] Step S1002, during the movement of the processing platform, control the cutting tool assembly to cut the consumable at different heights where the processing platform moves to, and obtain a plurality of scratches on the consumable corresponding to different heights where the processing platform moves to.

[0168] Among them, the plurality of scratches include a plurality of scribed lines at different positions on the consumable. It can be understood that the style and shape of each scratch can be the same. Due to the different distances between the processing platform and the cutting tool assembly, there will be detailed differences in each scribed line.

[0169] Among them, each time the processing platform moves once along the Z-axis, the cutting tool assembly is controlled to cut the consumable once. For example, if the processing platform moves n times along the Z-axis with a preset step size, then control the cutting laser to cut the consumable at n heights where the processing platform moves to, and obtain n scribed lines corresponding to n heights where the processing platform moves to at different positions on the consumable. n can be a natural number greater than 2, and the value of n can be flexibly adjusted according to actual needs and will not be specifically limited here. For example, control the processing platform to move in the Z-axis direction with a preset step size of 1 mm. After the processing platform moves 1 mm each time, control the cutting tool assembly to move in the XY plane to obtain a scratch on the consumable. Then when the movement distance of the processing platform reaches 15 mm, 15 scratches can be obtained on the consumable.

[0170] Alternatively, every time the processing platform moves m times on the Z-axis, where m is greater than or equal to 2, the cutter assembly is controlled to cut on the consumable. For example, the processing platform can be controlled to move in the Z-axis direction at a preset step size of 1 mm. After the processing platform moves 3 mm each time, the cutter assembly can be controlled to move on the XY plane to create a scratch on the consumable. Then, when the moving distance of the processing platform reaches 15 mm, 5 scratches can be obtained on the consumable.

[0171] For example, n is 9, that is, there are 9 scribed lines, and each scribed line is specified with the same length. For example, the cutter assembly can be controlled to start cutting the first scribed line from the top. After the cutting is completed, the processing platform is controlled to move to the next height at the preset step size, and then the cutter assembly is controlled to start engraving the second scribed line at a preset distance below the first scratch, and so on until 9 scribed lines are obtained.

[0172] In a possible embodiment, each of the multiple scratches is formed by the cutter assembly cutting at the same moving speed, so as to avoid differences in the scratches caused by different moving speeds of the cutter assembly.

[0173] It can be seen that in this way, the variable causing differences in the scratches can be determined as the distance between the processing platform and the cutter assembly, so as to determine the accurate tool pressure condition of the cutter assembly subsequently.

[0174] In a possible embodiment, each scratch can carry the height information corresponding to the position where the processing platform moves to. During the movement of the processing platform, the cutter assembly can process scratches on the surface of the consumable and cut the height corresponding to the position where the processing platform moves to in the vicinity of each scratch. Exemplarily, the height where the processing platform moves to can be the distance between the processing platform and the cutter assembly, or it can be the distance between the processing platform and the bottom of the processing equipment. Taking the scratch including a scribed line as an example, the distance between the processing platform and the cutter assembly is engraved beside each scribed line. When the processing platform is 10 mm away from the cutter assembly, the cutter assembly is controlled to cut on the consumable to obtain a scribed line on the surface of the consumable; when the processing platform is 9.5 mm away from the cutter assembly, the cutter assembly is controlled to cut on the consumable to obtain another scribed line on the surface of the consumable; and so on, to obtain the scribed lines formed on the surface of the consumable at the positions where the processing platform is 9 mm, 8.5 mm, 8 mm, and 7.5 mm away from the cutter assembly respectively.

[0175] Further, in some feasible embodiments, the scribing can be collected by the image sensing module during the process of the cutter assembly cutting the scribing line, or the scribing can be collected by the image sensing module after the cutter assembly finishes cutting the scribing line. That is, the image sensing module can collect one scribing line at a time, or the image sensing module can collect multiple or even all scribing lines at a time. Based on the image of the scribing line collected by the image acquisition module, the width of the scribing line is obtained, and the height to which the processing platform corresponding to the scribing line with the smallest width moves is used as the standard cutting height of the cutter assembly.

[0176] Alternatively, in some feasible embodiments, the height of the movement of the processing platform and the width of the scribing line can form a two-dimensional coordinate. For example, taking the distance between the processing platform and the cutter assembly as the abscissa and the width of the scribing line as the ordinate, the two-dimensional coordinates during the movement of the processing platform are fitted to obtain a curve, and the abscissa corresponding to the minimum value point of the ordinate is the standard cutting height of the cutter assembly.

[0177] Alternatively, the width of the scribing line and the height of the movement of the processing platform can be input into a big data model to obtain the standard cutting height of the cutter assembly, and this big data model is trained by the factory information of the cutter assembly or the standard cutting height information of historical calibration.

[0178] This application can also further determine the standard cutting height of the cutter assembly by combining the standard cutting height of the cutter assembly calibrated in the history of the processing equipment.

[0179] Step S1003, according to a plurality of scratches corresponding to different heights to which the processing platform moves, obtain the tool pressure condition of the cutter assembly when the processing platform moves to different heights.

[0180] Among them, images of the plurality of scribing lines at different positions on the cutting consumable can be obtained; based on the height to which the processing platform moves corresponding to the first appearance of the scribing line on the cutting consumable, the position of the cutter assembly relative to the cutting consumable is obtained. It can be understood that the height of the cutter assembly can be calibrated based on this position. At different heights to which the processing platform moves, scratches of different depths correspond. The processing height of the object to be cut can be determined according to the thickness of different objects to be cut.

[0181] In a possible embodiment, scratch parameters of the multiple scratches at different positions on the cutting consumable can be obtained. Then, multiple coordinate data are determined based on the multiple scratch parameters and the height corresponding to each scratch parameter. Finally, the multiple coordinate data are subjected to fitting processing to obtain curve data, and the standard cutting height is determined according to the height corresponding to the minimum value of the scratch parameter in the curve data. It can be understood that n scratch parameters of n calibration patterns can be obtained, and n coordinate data are determined based on the n scratch parameters and the height corresponding to each scratch parameter. The height corresponding to each scratch parameter is the height to which the processing platform corresponding to each target pattern moves.

[0182] Among them, the abscissa of the coordinate data is any one of the multiple scratch parameters, and the ordinate is the height corresponding to any one of the multiple scratch parameters, or the ordinate of the coordinate data is any one of the multiple scratch parameters, and the abscissa is the height corresponding to any one of the multiple scratch parameters.

[0183] For example, when the scratch parameter is the line width parameter, if the line width parameters include w1, w2, ……, wn, and the corresponding heights include h1, h2, ……, hn, then the n coordinate data obtained can include (w1, h1), (w2, h2), ……, (wn, hn) or (h1, w1), (h2, w2), ……, (hn, wn). Curve fitting can be performed on this set of coordinates to find the minimum value point of the line width parameter on the curve, and then the height corresponding to the minimum line width is determined as the focus height.

[0184] It can be seen that through the processing parameter calibration method of the above processing equipment and the processing equipment, the processing equipment includes a processing platform, a cutter assembly, and a guide member. The cutter assembly is slidably connected to the guide member. The processing platform is used to place the cutting consumable. The method includes: controlling the processing platform to move in the Z-axis direction according to a preset step size; during the movement of the processing platform, controlling the cutter assembly to perform cutting on the cutting consumable at different heights to which the processing platform moves, and obtaining multiple scratches on the cutting consumable corresponding to different heights to which the processing platform moves; and obtaining the tool pressure conditions of the cutter assembly at different heights to which the processing platform moves according to the multiple scratches corresponding to different heights to which the processing platform moves. The standard cutting height of the cutter assembly can be automatically determined, simplifying user interaction, ensuring the accuracy of the determined standard cutting height, and greatly improving the user experience at the same time.

[0185] In a possible embodiment, the processing equipment further includes an image sensing module. Among them, the image sensing module can include a camera, a profiler, etc. The profiler can be composed of a camera and a line laser emitter. Among them, the image sensing module can be used to collect the patterns of the multiple scratches.

[0186] Further, in a possible embodiment, the image sensing module may be slidably connected to the guiding member. Exemplarily, the image sensing module may be mounted on the cutter assembly and slidably connected to the guiding member through the cutter assembly. Alternatively, the image sensing module may be directly slidably connected to the guiding member, sharing a driving mechanism with the cutter assembly or having an independent driving mechanism. For the connection manner and functions of the guiding member, the cutter assembly, and the processing platform, reference may be made to the description in Figure 1A or Figure 1B which replaces the engraving laser in Figure 1A and Figure 1B with the cutter assembly, and details thereof will not be elaborated here.

[0187] Among them, it is possible to control the image sensing module to move to a position above the corresponding cutting consumable in the order in which the cutter assembly cuts the cutting consumable, so as to collect the multiple scratches. Specifically, one scratch can be collected each time it moves, or multiple scratches can be collected each time it moves. The number of scratches collected is positively correlated with the shooting range of the image sensing module. For example, the image sensing module can be controlled to move directly above each scratch each time to collect the pattern of the corresponding scratch. Alternatively, the number of times of collection and the position of each collection can be determined based on the number, distribution range, and shooting range of the scratches. For example, the number of collections can be 7, and 3 scratches are collected each time. Then, the image sensing module can be controlled to move 7 times, and each time it moves to a position where a complete 3 scratches can be photographed to collect the corresponding 3 scratches. It should be noted that the 3 scratches collected each time are not repeated. It can be seen that in this way, the collection efficiency can be improved while ensuring the clarity of the collected scratches. Among them, the collection order can be to collect once for each cut scratch, or to collect after cutting multiple scratches, or to collect after cutting all the scratches. Specific limitations are not made here, which can improve the flexibility of collecting scratches.

[0188] In a possible embodiment, the image sensing module may be disposed at a preset position, and the preset position may be a position where all the scratches can be photographed, such as above the front door housing, the top shell, or the side frame of the processing device. Details thereof will not be elaborated here.

[0189] Among them, since the image sensor module is fixedly arranged at a preset position of the processing equipment, there is an inclination angle between the image sensor module and the processing platform. Before obtaining the knife pressure of the cutter assembly according to the multiple scratches corresponding to the different heights to which the processing platform moves, the image sensor module can be controlled to collect the initial image of the cutting consumable after the processing platform stops moving, and then the initial image is normalized to obtain a normalized image, and finally, the multiple scratches in the normalized image are determined according to the position where the cutter assembly cuts on the cutting consumable and the order in which the cutter assembly cuts the scratches on the cutting consumable.

[0190] It can be seen that in this way, multiple scratches can be collected through the image sensing module, which is convenient for providing reliable data support for the subsequent rapid and accurate determination of standard cutting.

[0191] In some feasible implementations, the height to which the processing platform moves corresponding to the first occurrence of a scratch is determined as the working zero point of the cutter assembly.

[0192] In a possible embodiment, the processing device may further include a 3D printing head, the image sensing module is on the 3D printing head, the cutter assembly is connected to the 3D printing head, or the image sensing module is decoupled from the 3D printing head. Among them, the connection method between the cutter assembly and the 3D printing head may include a detachable connection. The 3D printing head includes a hot end for heating the printing material. For example, when a laser head including engraving laser is already connected to the 3D printing head, the laser head can be removed and replaced with a cutter assembly or the like. When a cutter assembly can be connected to the 3D printing head, the connection for connecting the cutter assembly can be removed and replaced with a laser head including engraving laser. Among them, the hot end of the 3D printing head for heating the printing material can extrude the printing material through a nozzle. The printing material can be a plastic filament that is easy to heat and melt, such as polylactic acid or acrylonitrile-butadiene-styrene copolymer. The diameter of the nozzle can be 0.2mm, 0.4mm, 0.8mm, etc. The printable materials of the 3D printing head can also be printing materials of multiple colors and multiple different properties. For example, multiple printable materials can be obtained by connecting a feeding device, rather than only one kind of printing material. In some feasible embodiments, when the 3D printing head is connected to a connector and the connector is connected to the cutter assembly, after the 3D printing head finishes printing a product or during the printing process, the cutter assembly is used to cut the 3D printed product / part of the product, and the cutter assembly cuts off the excess part of the 3D printed product. Or the cutter assembly performs secondary processing on the 3D printed product and cuts the 3D printed product into the required shape. The cutter assembly can be made of high-hardness materials, such as tool steel and hard alloy. The cutter head in the cutter assembly is detachable, and the cutter head can have various types, such as disc cutter type, pointed cutter type, etc., providing various different cutting methods. Or, processing consumables of the cutter assembly, such as materials like wood, paper, plastic, leather, metal sheets such as foils, fabrics, etc., are placed on the processing platform, and the cutter assembly can process other products except 3D printed products. The processing device of the present application can either achieve 3D printing alone, or achieve cutter cutting alone, or achieve both 3D printing and cutter cutting. Cutter cutting can cut some flammable materials, such as paper, plastic, etc., compared with laser cutting.

[0193] Cutting means changing the appearance, properties, and / or state of a material by mechanical force, thermal energy, hydraulic force, or chemical means to separate the material into two or more parts. Cutting can include, for example, performing through-cutting, bleaching, curing, burning, etc. For example, using mechanical cutting, thermal cutting, water cutting, or chemical cutting.

[0194] It can be seen that through the processing parameter calibration method and processing equipment of the above-mentioned processing equipment, the processing equipment includes a processing platform, a cutting tool assembly and a guiding member. The cutting tool assembly is slidably connected to the guiding member. The processing platform is used to place cutting consumables. The method includes: controlling the processing platform to move in the Z-axis direction according to a preset step size; during the movement of the processing platform, controlling the cutting tool assembly to perform cutting on the cutting consumables at different heights reached by the processing platform, and obtaining a plurality of scratches on the cutting consumables corresponding to different heights reached by the processing platform; according to the plurality of scratches corresponding to different heights reached by the processing platform, obtaining the tool pressure conditions of the cutting tool assembly at different heights reached by the processing platform. It can automatically determine the standard cutting height of the cutting tool assembly, simplify user interaction, ensure the accuracy of the determined standard cutting height, and greatly improve the user experience at the same time.

[0195] In a possible embodiment, the cutting consumables can be placed on the processing platform, and the cutting tool assembly can move in the Z-axis, so that the cutting tool assembly can perform cutting on the cutting assembly at different heights, and obtain a plurality of scratches on the cutting consumables corresponding to different heights reached by the cutting tool assembly, thereby facilitating the determination of the tool pressure conditions of the cutting tool assembly by using the above-mentioned plurality of scratches in the subsequent process.

[0196] Specifically, the cutting tool assembly can be controlled to move in the Z-axis direction according to a preset step size. During the movement of the cutting tool assembly, the cutting tool assembly is controlled to perform cutting on the cutting consumables at different heights reached by the cutting tool assembly, and a plurality of scratches corresponding to different heights reached by the cutting tool assembly are obtained on the cutting consumables. According to the plurality of scratches corresponding to different heights reached by the cutting tool assembly, the tool pressure conditions of the cutting tool assembly at different heights reached are obtained. Figure 10 It is applied to the processing equipment structure in which the processing platform moves along the Z-axis, such as the corexy structure; and this embodiment is for the processing equipment structure in which the cutting tool assembly moves along the Z-axis, such as the gantry structure or the cantilever type structure.

[0197] It can be seen that through the processing parameter calibration method and processing equipment of the above-mentioned processing equipment, the processing equipment includes a processing platform, a cutting tool assembly and a guide member, the cutting tool assembly is slidably connected to the guide member, and the processing platform is used to place cutting consumables. The method includes: controlling the cutting tool assembly to move in the Z-axis direction according to a preset step size; during the movement of the cutting tool assembly, controlling the cutting tool assembly to perform cutting on the cutting consumables at different heights where the cutting tool assembly moves, and obtaining a plurality of scratches on the cutting consumables corresponding to different heights where the cutting tool assembly moves; according to the plurality of scratches corresponding to different heights where the cutting tool assembly moves, obtaining the tool pressure conditions of the cutting tool assembly at different heights where the cutting tool assembly moves. It can automatically determine the standard cutting height of the cutting tool assembly, simplify user interaction, and greatly improve the user experience while ensuring the accuracy of the determined standard cutting height.

[0198] In this embodiment, the processing equipment may also include an image sensing module and / or a 3D printing head, which can be referred to Figure 5 、 Figure 6 for the corresponding descriptions and will not be elaborated here.

[0199] The above mainly introduces the solution of the embodiment of the present application from the perspective of the execution process on the method side. It can be understood that in order to implement the above functions, the processing equipment includes the corresponding hardware structures and / or software modules for executing each function. Those skilled in the art should easily realize that, combined with the units and algorithm steps of each example described in the embodiments provided in this article, the present application can be implemented in the form of hardware or a combination of hardware and computer software. Whether a certain function is executed in the way of hardware or computer software driving hardware depends on the specific application and design constraints of the technical solution. Professional technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the present application.

[0200] The embodiment of the present application also provides a computer storage medium, wherein the computer storage medium stores a computer program for electronic data exchange, and the computer program enables the computer to execute part or all of the steps of any method recorded in the above method embodiment, and the above computer includes an electronic device.

[0201] The embodiment of the present application also provides a computer program product, the above computer program product includes a non-transitory computer-readable storage medium storing a computer program, and the above computer program is operable to enable the computer to execute part or all of the steps of any method recorded in the above method embodiment. The computer program product can be a software installation package, and the above computer includes an electronic device.

[0202] It should be noted that for each of the above embodiments, for the sake of simple description, they are all described as a series of combinations of actions. Those skilled in the art should be aware that the present application is not limited by the described order of actions, because some steps in the embodiments of the present application can be performed in other orders or simultaneously. Additionally, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions, steps, modules, or units involved are not necessarily essential to the embodiments of the present application.

[0203] In the above embodiments, the descriptions of the embodiments of the present application each have their own focuses. For parts not detailed in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0204] The steps of the methods or algorithms described in the embodiments of the present application can be implemented in a hardware manner or by a processor executing software instructions. The software instructions can be composed of corresponding software modules, and the software modules can be stored in RAM, flash memory, ROM, EPROM, electrically erasable programmable read-only memory (EEPROM), registers, hard disks, removable hard disks, compact disc read-only memory (CD-ROM), or any other form of storage medium well-known in the art. An exemplary storage medium is coupled to the processor, enabling the processor to read information from the storage medium and write information to the storage medium. Of course, the storage medium can also be a component of the processor. The processor and the storage medium can be located in an ASIC. Additionally, the ASIC can be located in a terminal device or a management device. Of course, the processor and the storage medium can also exist as discrete components in the terminal device or the management device.

[0205] Those skilled in the art should be able to realize that in one or more of the above examples, the functions described in the embodiments of the present application can be implemented in whole or in part by software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the processes or functions described in the embodiments of the present application are generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center by wire (such as coaxial cable, optical fiber, digital subscriber line (DSL)) or wirelessly (such as infrared, wireless, microwave, etc.). The computer-readable storage medium can be any available medium that the computer can access or a data storage device such as a server or data center that includes one or more integrated available media. The available medium can be a magnetic medium (such as a floppy disk, hard disk, magnetic tape), an optical medium (such as a digital video disc (DVD)), or a semiconductor medium (such as a solid state disk (SSD)), etc.

[0206] Each device and product described in the above embodiments includes various modules / units, which can be software modules / units, hardware modules / units, or partly software modules / units and partly hardware modules / units. For example, for each device and product applied to or integrated into a chip, each module / unit it includes can be implemented in the form of hardware such as circuits. Or, at least some modules / units can be implemented in the form of software programs that run on the processor integrated inside the chip, and the remaining (if any) part of the modules / units can be implemented in the form of hardware such as circuits; for each device and product applied to or integrated into a chip module, each module / unit it includes can be implemented in the form of hardware such as circuits. Different modules / units can be located in the same component (such as a chip, a circuit module, etc.) or different components of the chip module. Or, at least some modules / units can be implemented in the form of software programs that run on the processor integrated inside the chip module, and the remaining (if any) part of the modules / units can be implemented in the form of hardware such as circuits; for each device and product applied to or integrated into a terminal device, each module / unit it includes can be implemented in the form of hardware such as circuits. Different modules / units can be located in the same component (such as a chip, a circuit module, etc.) or different components inside the terminal device. Or, at least some modules / units can be implemented in the form of software programs that run on the processor integrated inside the terminal device, and the remaining (if any) part of the modules / units can be implemented in the form of hardware such as circuits.

[0207] The specific embodiments described above further elaborate on the purpose, technical solutions, and beneficial effects of the embodiments of the present application. It should be understood that the above description is only the specific embodiments of the embodiments of the present application and is not used to limit the protection scope of the embodiments of the present application. Any modifications, equivalent replacements, improvements, etc. made on the basis of the technical solutions of the embodiments of the present application should be included in the protection scope of the embodiments of the present application.

Claims

1. A method for calibrating processing parameters of a processing equipment, characterized in that: The processing equipment comprises a processing platform, an engraving laser and a guide, the engraving laser is slidably connected to the guide, the processing platform is used to place engraving consumables, and the method comprises: Controlling the processing platform to move in the Z-axis direction according to a preset step length; During the movement of the processing platform, the engraving laser is controlled to emit laser light to the engraving consumable at different heights to which the processing platform moves, so as to obtain a plurality of target patterns on the engraving consumable corresponding to the different heights to which the processing platform moves; The focal height of the engraving laser is obtained according to a plurality of target patterns corresponding to different heights to which the processing platform moves.

2. The method according to claim 1, characterized in that The plurality of target patterns include a plurality of calibration patterns at different positions of the engraving consumable; The step of obtaining the focal height of the engraving laser according to a plurality of target patterns corresponding to different heights to which the processing platform moves comprises: Acquire pattern parameters of the plurality of calibration patterns at different positions of the engraving consumable; Determine a plurality of coordinate data according to a plurality of pattern parameters and a height corresponding to each pattern parameter; The plurality of coordinate data are fitted to obtain curve data, and the focus height is determined according to a height corresponding to a minimum value of a pattern parameter in the curve data.

3. The method according to claim 1, characterized in that The plurality of target patterns include a plurality of calibration lines at different positions of the engraving consumable; The step of obtaining the focal height of the engraving laser according to a plurality of target patterns corresponding to different heights to which the processing platform moves comprises: Obtaining the widths of the plurality of calibration lines at different positions of the engraving consumable; The focus of the engraving laser is obtained based on the height to which the processing platform moves corresponding to the calibration line with the smallest width.

4. The method according to claim 1, characterized in that: The processing equipment further comprises an image sensing module, wherein the image sensing module is slidably connected to the guide member; Before obtaining the focal height of the engraving laser according to a plurality of target patterns corresponding to different heights to which the processing platform moves, the method further includes: The image sensor module is controlled to move to above the position of the corresponding engraving consumable according to the order in which the engraving laser emits laser light to the engraving consumable, so as to collect the multiple target patterns.

5. The method according to claim 4, characterized in that The processing equipment also includes a 3D printing head, the image sensor module is on the 3D printing head, and the engraving laser is connected to the 3D printing head.

6. The method according to claim 1, characterized in that The processing equipment further comprises an image sensor module, and the image sensor module is fixedly arranged at a preset position of the processing equipment; Before obtaining the focal height of the engraving laser according to a plurality of target patterns corresponding to different heights to which the processing platform moves, the method further includes: Controlling the image sensing module to collect an initial image of the engraving consumable after the processing platform stops moving; Performing a normalization process on the initial image to obtain a normalized image; The multiple target patterns in the normalized image are determined according to the position where the engraving laser emits laser light to the engraving consumable material and the order in which the engraving laser emits laser light to the engraving consumable material.

7. The method according to claim 2, characterized in that The plurality of target patterns include a plurality of calibration lines at different positions of the engraving consumable; The step of obtaining pattern parameters of the plurality of calibration patterns at different positions of the engraving consumable includes: The line width parameter of each calibration line at different positions of the engraving consumable is obtained.

8. The method according to claim 2, characterized in that: The plurality of target patterns include a plurality of calibration points at different positions of the engraving consumable; The step of obtaining pattern parameters of the plurality of calibration patterns at different positions of the engraving consumable includes: The point area parameter of each calibration point at different positions of the engraving consumable is obtained.

9. The method according to claim 2, characterized in that: The horizontal coordinate of the coordinate data is any one of the multiple pattern parameters, and the vertical coordinate is the height corresponding to any one of the multiple pattern parameters, or the vertical coordinate of the coordinate data is any one of the multiple pattern parameters, and the horizontal coordinate is the height corresponding to any one of the multiple pattern parameters.

10. The method according to claim 1, characterized in that During the movement of the processing platform, the engraving laser emits laser light at the same power to the engraving consumable at different heights to which the processing platform moves.

11. The method according to claim 1 or 10, characterized in that: Each of the plurality of target patterns is engraved by the engraving laser at the same moving speed.

12. The method according to claim 1, characterized in that The controlling the processing platform to move in the Z-axis direction according to a preset step length includes: After controlling the processing platform to move to a preset height, the processing platform is then controlled to move toward the engraving laser in a Z-axis direction according to a preset step length.

13. The method according to claim 1, characterized in that Each of the plurality of target patterns carries height information to which the corresponding processing platform moves.

14. A method for calibrating processing parameters of a processing equipment, characterized in that: The processing equipment comprises a processing platform, a cutter assembly and a guide member, the cutter assembly is slidably connected to the guide member, the processing platform is used to place cutting consumables, and the method comprises: Controlling the processing platform to move in the Z-axis direction according to a preset step length; During the movement of the processing platform, the cutter assembly is controlled to cut on the cutting consumable at different heights to which the processing platform moves, so as to obtain a plurality of scratches on the cutting consumable corresponding to the different heights to which the processing platform moves; According to a plurality of scratches corresponding to the different heights to which the processing platform moves, the knife pressure conditions of the cutter assembly when the processing platform moves to different heights are obtained.

15. The method according to claim 14, characterized in that The plurality of scratches include a plurality of scratch lines at different positions of the cutting consumable; The method of obtaining the knife pressure of the cutter assembly when the processing platform moves to different heights according to the plurality of scratches corresponding to the processing platform moving to different heights includes: Acquire images of the plurality of scribe lines at different positions of the cutting consumable; Based on the height to which the processing platform moves when a mark appears on the cutting consumable material for the first time, the position of the cutter assembly relative to the cutting consumable material is obtained.

16. The method according to claim 14, characterized in that The processing equipment further comprises an image sensing module, wherein the image sensing module is slidably connected to the guide member; Before obtaining the knife pressure of the cutter assembly when the processing platform moves to different heights according to the plurality of scratches corresponding to the processing platform moving to different heights, the method further comprises: The image sensor module is controlled to move to a position above the corresponding cutting consumable material in the order in which the cutter assembly cuts the cutting consumable material, so as to collect the plurality of scratches.

17. The method according to claim 16, characterized in that The processing equipment also includes a 3D printing head, the image sensor module is on the 3D printing head, and the cutter assembly is connected to the 3D printing head.

18. The method according to claim 14, characterized in that Each of the plurality of scratches is formed by cutting with the cutter assembly at the same movement speed.

19. A processing equipment, characterized in that: The processing equipment comprises a processing platform, an engraving laser and a guide, the engraving laser is slidably connected to the guide, and the processing platform is used to place engraving consumables; The processing equipment also includes a processor, and the processor is used to execute the method according to any one of claims 1-13.

20. The processing equipment according to claim 19, characterized in that The processing equipment also includes a 3D printing head, and the engraving laser is connected to the 3D printing head.

21. A processing equipment, characterized in that: The processing equipment comprises a processing platform, a cutter assembly and a guide member, the cutter assembly is slidably connected to the guide member, and the processing platform is used to place cutting consumables; The processing equipment also includes a processor, which is used to execute the method according to any one of claims 14 to 18.

22. The processing equipment according to claim 21, characterized in that The processing equipment also includes a 3D printing head, and the cutter assembly is connected to the 3D printing head.

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