A microwave chip test fixture

Abstract

The application discloses a microwave chip testing tool, relates to the technical field of microwave chip testing, and aims to solve the technical problem of insufficient function of clamping equipment in the microwave chip testing tool, and comprises a testing machine table; a conveying assembly is arranged on the testing machine table; a basic transfer assembly is arranged on the testing machine table and is located opposite an output end of the conveying assembly; a plurality of auxiliary tables for energizing operation of microwave chips are arranged below the basic transfer assembly; and a clamping assembly for stable and limited positioning of the microwave chip testing operation is arranged on the side of the auxiliary table. Based on the adjustment and setting of the clamping assembly, the clamping assembly has two different clamping modes, i.e., a flexible clamping state and an elastic retaining state, the two different clamping modes are used to simulate the different thermal expansion coefficients of gallium arsenide and gallium nitride microwave chips in the energizing test, and the functionality of the operation is effectively improved.

Description

Technical Field

[0001] This invention relates to the field of microwave chip testing technology, and more specifically, to a microwave chip testing fixture. Background Technology

[0002] Microwave chips are a core component of microwave radio frequency integrated circuits, playing a crucial role in fields such as wireless communication. They are primarily used to process signals in the microwave frequency band (typically 300MHz-300GHz). These chips integrate various microwave circuit components, such as transistors, capacitors, and inductors, onto a single semiconductor chip to perform functions such as signal generation, amplification, filtering, mixing, modulation, and demodulation. Key features include high frequency, high speed, high integration, and low power consumption. Because they operate in the microwave frequency band, the extremely high signal frequency requires transistors and other components within the chip to have extremely short switching times and very high electron migration speeds to achieve high-speed signal processing. Simultaneously, to meet the miniaturization and portability demands of modern wireless communication equipment, microwave chips need to possess high integration, enabling the implementation of complex microwave circuit functions within a very small chip area. Furthermore, low power consumption is another important characteristic, extending the operating time of battery-powered devices.

[0003] Gallium arsenide (GaAs) microwave chips and gallium nitride (GaN) microwave chips differ in the following physical aspects during circuit testing: Coefficient of thermal expansion: Gallium nitride has a relatively small coefficient of thermal expansion, making it less prone to dimensional changes and deformation with temperature variations, resulting in more stable performance during high and low temperature cycling tests. Gallium arsenide has a relatively large coefficient of thermal expansion, requiring careful attention to the impact of temperature changes on its structure and performance during testing.

[0004] Gallium nitride (GaN) chips: With a relatively small coefficient of thermal expansion, flexible fixing structures can accommodate their small thermal expansion and contraction changes at different temperatures after circuit testing. Flexible fixing provides a buffer; when the chip undergoes dimensional changes due to temperature variations, the fixing structure can elastically deform accordingly, preventing excessive stress on the chip and protecting it from damage. This also ensures effective chip fixing, maintaining stability during subsequent use or testing.

[0005] Gallium arsenide (GaAs) chips: Due to their relatively large coefficient of thermal expansion, their thermal expansion and contraction are more pronounced with temperature changes. Using flexible fixing methods can better accommodate changes in chip size. Flexible materials or structures can deform more fully to adapt to the chip's thermal expansion and contraction, reducing the risk of internal structural damage or performance changes caused by thermal stress, and ensuring the chip's stability and reliability under different temperature environments.

[0006] Existing microwave chip testing fixtures, which simulate power-on operation, generate different temperatures, resulting in poor adaptability due to the fixed and limited structure of the clamping equipment. Gallium arsenide (GaAs) and gallium nitride (GaN) microwave chips have different coefficients of thermal expansion. While both use flexible clamping mechanisms, they cannot accurately adapt to the different degrees of thermal expansion and contraction under actual temperature changes. For example, GaAs chips have a large coefficient of thermal expansion, requiring a flexible clamping structure with a large range of expansion and contraction to accommodate rising temperatures. Conversely, GaN chips have a small coefficient of thermal expansion; if the clamping structure is too flexible, it may not provide sufficient clamping force at room temperature or low temperatures, leading to insecure chip fixation. Existing microwave chip testing fixtures mostly use fixed clamping mechanisms, which cannot effectively adapt to the different thermal expansion characteristics of GaAs and GaN microwave chips. Therefore, we propose a new microwave chip testing fixture. Summary of the Invention

[0007] The purpose of this invention is to provide a microwave chip testing fixture to solve the technical problem of insufficient clamping device function in microwave chip testing fixtures.

[0008] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a microwave chip testing fixture, including a testing machine; a conveying component is provided on the testing machine; a basic transfer component is provided on the testing machine relative to the output end of the conveying component; several auxiliary platforms for powering on the microwave chip are provided below the basic transfer component; clamping components for stabilizing and limiting the microwave chip testing operation are provided on the sides of the auxiliary platforms; a dual-axis platform is provided at the output end of the basic transfer component; a material stacking mechanism is provided at the second movable end of the dual-axis platform; a vision testing mechanism connected to the testing machine is provided above the material stacking mechanism; wherein, the clamping components have a flexible clamping state and an elastic holding state.

[0009] This invention is based on the adjustment settings of the clamping component, which enables the clamping component to have two different clamping methods, forming a flexible clamping state and an elastic holding state. By using two different clamping methods, the different thermal expansion coefficients of gallium arsenide and gallium nitride microwave chips in simulated power-on tests are realized, effectively improving the functionality of operation.

[0010] Preferably, the basic transfer assembly includes a stand arranged on the test bench; a horizontal displacement adjustment guide rail is arranged horizontally on the stand; a plurality of vertical adjustment guide rails are provided on the movable end of the horizontal displacement adjustment guide rails via a mounting block; a synchronization seat is provided on one side of the horizontal displacement adjustment guide rails and is installed and connected to the plurality of vertical adjustment guide rails; an adsorption shaft is provided on the synchronization seat via a plurality of downward guide rails.

[0011] Preferably, the auxiliary platform includes a connecting seat arranged on one side of the stand; the connecting seat is provided with a plurality of power-on heating test components that match the pins of the microwave chip, and the gap between the power-on heating test components and the connecting seat forms a plurality of ejector pin cavities; a release ejector pin is provided in the ejector pin cavity by a spring.

[0012] Preferably, the dual-axis platform includes a transversely arranged adjusting guide rail A and a longitudinally arranged adjusting guide rail B on the adjusting guide rail A; and the stacking mechanism includes a stacking platform installed at the movable end of the adjusting guide rail B; conveying rollers are provided on both sides of the stacking platform; a drive motor is provided at the input end of one of the conveying rollers, and the two conveying rollers are connected by a conveyor belt; wherein, a plurality of guide posts are sequentially arranged on the stacking platform relative to the upper surface of the conveyor belt; wherein the gap between two adjacent guide posts forms a stacking cavity.

[0013] Preferably, the vision testing mechanism includes a test drive rail arranged above the conveyor belt; the movable end of the test drive rail is provided with a vision testing component via a drive seat.

[0014] Preferably, the clamping assembly includes an auxiliary connecting seat arranged on one side of the connecting seat; an adjusting movable cylinder is installed on the auxiliary connecting seat; an auxiliary block is provided on the movable end of the adjusting movable cylinder; two adjusting slide rails are symmetrically arranged on the auxiliary block; the adjusting slide rails are arranged at an angle or horizontally; and a clamping unit is provided on the movable end of the adjusting slide rail through a mounting seat.

[0015] Preferably, the clamping unit includes a clamping base arranged at the movable end of the adjusting slide rail; the clamping base has symmetrically formed sliding grooves; the included angle of the sliding grooves is less than or equal to 90 degrees; a drive shaft is movably inserted into the clamping base; a negative pressure suction structure is formed between the clamping base and the drive shaft; an arc-shaped buckle is provided at the end of the drive shaft; connecting limiting groove blocks are provided on both sides of the end of the drive shaft; the inner wall of the connecting limiting groove block has a cylindrical rotating hook groove and a receiving adapter groove with a width smaller than the radial diameter of the rotating hook groove.

[0016] Preferably, the clamping unit further includes a bidirectional compound force arc spring fixed to the arc buckle; rubber blocks are provided on both sides of the bidirectional compound force arc spring and at the "C"-shaped opening; hook-connecting sliding seats are fixedly provided at both ends of the bidirectional compound force arc spring; the hook-connecting sliding seats are slidably engaged with the sliding groove; wherein, the hook-connecting sliding seats are provided with a limiting rotating shaft relative to the position of the connecting limiting groove block; the limiting rotating shaft is composed of a rectangular central part and fan-shaped rotating parts arranged on both sides of the central part.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] 1. Based on the adjustment settings of the clamping component, the present invention enables the clamping component to have two different clamping methods, forming a flexible clamping state and an elastic holding state. By using two different clamping methods, the different thermal expansion coefficients of gallium arsenide and gallium nitride microwave chips in simulated power-on tests are realized, effectively improving the functionality of operation.

[0019] 2. This invention achieves the transfer of microwave chips from the output end of the conveying component to the auxiliary platform by adjusting the horizontal displacement guide rail and the vertical adjustment guide rail. Through sequential operation, the microwave chips are simulated to operate multiple times, reducing the limitations of single operation. Different microwave chips operate in a single environment, and the test data cannot effectively support the actual use of microwave chips. It is also convenient to operate and has a simple structure.

[0020] 3. The present invention adjusts the sliding rails to move closer together, causing the two clamping units to move closer together to clamp and fix the microwave chip, thereby reducing the possibility of slight movement or offset of the microwave chip test fixture during testing, which could lead to poor contact between the microwave chip pins and the power-on heating test components.

[0021] 4. This invention operates through the stroke of the drive shaft, in conjunction with the elastic compound force of the bidirectional compound force arc spring, causing the bidirectional compound force arc spring and the rubber block to move as a whole. Figure 7 As shown, the microwave chip is flexibly clamped by two sets of opposing bidirectional compound force arc springs and rubber blocks. This clamping method utilizes the axial compression of the "C"-shaped cavity of the bidirectional compound force arc springs and the deformation of the rubber blocks to achieve flexible clamping, effectively adapting to the high thermal expansion coefficient of gallium arsenide microwave chips and maintaining a compatible clamping operation. The drive shaft's return stroke drives the two ends of the hook-connected sliding seat to move and rotate, while the arc-shaped buckle pulls and adjusts the middle end of the bidirectional compound force arc springs. The joint causes the bidirectional compound force arc spring and the rubber block to form a "U" shape. This "U" shape allows for spring-like compression at both ends of the bidirectional compound force arc spring and the rubber block. During rotation adjustment, the limiting rotating shaft matches the receiving adapter groove, allowing the two hooked sliding seats to have the space required during compression. The elastic force of the bidirectional compound force arc spring clamps the gallium nitride microwave chip on both sides, while simultaneously adapting to the relatively small thermal expansion coefficient of gallium nitride and maintaining good clamping stability. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the present invention;

[0023] Figure 2 This is a schematic diagram of the overall three-dimensional structure of the present invention from another perspective;

[0024] Figure 3 For the present invention Figure 2 A magnified view of the structure at point A in the middle;

[0025] Figure 4 This is a three-dimensional structural diagram of the material stacking mechanism and the vision testing mechanism of the present invention;

[0026] Figure 5 This is a three-dimensional structural diagram of the auxiliary platform and clamping assembly of the present invention;

[0027] Figure 6 This is a three-dimensional structural diagram of the loosening pin of the present invention;

[0028] Figure 7 This is a schematic diagram of the three-dimensional disassembled structure of the clamping unit of the present invention;

[0029] Figure 8 For the present invention Figure 7 A magnified schematic diagram of the structure at point B in the middle;

[0030] Figure 9 For the present invention Figure 7 A magnified schematic diagram of the structure at point C.

[0031] Explanation of the labels in the diagram:

[0032] 1. Testing machine; 2. Conveying assembly; 3. Basic transfer assembly; 4. Auxiliary platform; 5. Clamping assembly; 6. Dual-axis platform; 7. Stacking mechanism; 8. Vision testing mechanism;

[0033] 301. Stand; 302. Horizontal displacement adjusting guide rail; 303. Vertical adjusting guide rail; 304. Synchronizing seat; 305. Downward guide rail; 306. Adsorption shaft;

[0034] 401. Connector; 402. Power-on temperature rise test assembly; 403. Loose pin;

[0035] 501. Auxiliary connecting seat; 502. Adjustable movable cylinder; 503. Auxiliary block; 504. Adjustable slide rail; 505. Clamping unit; 5051. Clamping base; 5052. Sliding groove; 5053. Drive shaft; 5054. Arc buckle; 5055. Connecting limit groove block; 5056. Rotating hook groove; 5057. Accommodating adapter groove; 5058. Bidirectional compound force arc spring; 5059. Rubber block; 50510. Hook sliding seat; 50511. Limiting rotation shaft;

[0036] 701. Stacking table; 702. Conveyor roller; 703. Drive motor; 704. Guide column;

[0037] 801. Test drive rail; 802. Vision test component. Detailed Implementation

[0038] like Figures 1 to 9 As shown, the present invention relates to a microwave chip testing fixture, comprising a testing platform 1; a conveying component 2 is disposed on the testing platform 1; a basic transfer component 3 is disposed on the testing platform 1 relative to the output end of the conveying component 2; several auxiliary platforms 4 for powering on the microwave chip are disposed below the basic transfer component 3; clamping components 5 for stabilizing and limiting the microwave chip testing operation are disposed on the sides of the auxiliary platforms 4; a dual-axis platform 6 is disposed at the output end of the basic transfer component 3; a material stacking mechanism 7 is disposed at the second movable end of the dual-axis platform 6; a vision testing mechanism 8 connected to the testing platform 1 is disposed above the material stacking mechanism 7; wherein, the clamping component 5 has a flexible clamping state and an elastic holding state. Based on the adjustable settings of the clamping component 5, the present invention enables the clamping component 5 to have two different clamping methods, forming a flexible clamping state and an elastic holding state. By using two different clamping methods, the different thermal expansion coefficients of gallium arsenide and gallium nitride microwave chips in simulated power-on testing are achieved, effectively improving the functionality of the operation.

[0039] In an embodiment of the present invention, the basic transfer component 3 includes a stand 301 arranged on the test platform 1; a horizontal displacement adjustment guide rail 302 is arranged horizontally on the stand 301; a plurality of vertical adjustment guide rails 303 are provided on the movable end of the horizontal displacement adjustment guide rail 302 via a mounting block; a synchronization seat 304 is provided on one side of the horizontal displacement adjustment guide rail 302 and is installed and connected to the plurality of vertical adjustment guide rails 303; an adsorption shaft 306 is provided on the synchronization seat 304 via a plurality of downward guide rails 305. The present invention realizes the transfer of microwave chips from the output end of the transfer component 2 to the auxiliary platform 4 by adjusting the horizontal displacement adjustment guide rail 302 horizontally and adjusting the vertical adjustment guide rails 303 vertically, and realizes the sequential operation of the microwave chips to perform multiple simulated power-on operation through sequential operation, reducing the single operation environment of different microwave chips in use, and the test data cannot effectively support the actual use of microwave chips. It is also convenient to operate and has a simple structure.

[0040] In an embodiment of the present invention, the auxiliary platform 4 includes a connecting seat 401 arranged on one side of the stand 301; the connecting seat 401 is provided with a plurality of power-on temperature rise test components 402 that match the pins of the microwave chip, and the gap between the power-on temperature rise test components 402 and the connecting seat 401 forms a plurality of ejector pin cavities; a release ejector pin 403 is provided in the ejector pin cavity by means of a spring. In the present invention, the power-on temperature rise test components 402 simulate the power-on operation of the microwave chip, and the springs apply an upward pushing force to the release ejector pins 403, making it easy for the microwave chip to detach.

[0041] In an embodiment of the present invention, the dual-axis platform 6 includes a transversely arranged adjusting guide rail A and a longitudinally arranged adjusting guide rail B on the adjusting guide rail A; and the stacking mechanism 7 includes a stacking platform 701 mounted on the movable end of the adjusting guide rail B; conveying rollers 702 are provided on both sides of the stacking platform 701; a drive motor 703 is provided at the input end of one of the conveying rollers 702, and the two conveying rollers 702 are connected by a conveyor belt; wherein, a plurality of guide posts 704 are sequentially arranged on the stacking platform 701 relative to the upper surface of the conveyor belt; wherein, the gap between two adjacent guide posts 704 forms a stacking cavity. The present invention uses the stacking cavity to limit the microwave chip on both sides, and in conjunction with the conveyor belt's conveying drive, causes multiple microwave chips to be placed sequentially on the conveyor belt, facilitating positioning testing by the vision testing mechanism 8.

[0042] In an embodiment of the present invention, the visual testing mechanism 8 includes a test drive rail 801 arranged above the conveyor belt; a visual testing component 802 is mounted on the movable end of the test drive rail 801 via a drive seat. The present invention uses the visual testing component 802 to photograph and compare the shape of the microwave chip after multiple simulated power-ups, thus testing the expansion of the microwave chip.

[0043] In an embodiment of the present invention, the clamping assembly 5 includes an auxiliary connecting seat 501 arranged on one side of the connecting seat 401; an adjusting cylinder 502 is mounted on the auxiliary connecting seat 501; an auxiliary block 503 is provided at the movable end of the adjusting cylinder 502; two adjusting slide rails 504 are symmetrically arranged on the auxiliary block 503; the adjusting slide rails 504 are arranged at an angle or horizontally; and a clamping unit 505 is provided at the movable end of the adjusting slide rails 504 via a mounting base. The present invention drives the adjusting slide rails 504 to move closer together, causing the two clamping units 505 to move closer together to clamp and fix the microwave chip, reducing the possibility of slight movement or offset during testing of the microwave chip testing fixture, which could lead to poor contact between the microwave chip pins and the power-on heating test assembly 402.

[0044] In an embodiment of the present invention, the clamping unit 505 includes a clamping base 5051 arranged at the movable end of the adjusting slide rail 504; the clamping base 5051 is provided with symmetrical sliding grooves 5052; the included angle of the sliding grooves 5052 is less than or equal to 90 degrees; a drive shaft 5053 is movably inserted into the clamping base 5051; a negative pressure suction structure is formed between the clamping base 5051 and the drive shaft 5053; an arc-shaped buckle 5054 is provided at the end of the drive shaft 5053; connecting limiting groove blocks 5055 are provided on both sides of the end of the drive shaft 5053; the inner wall of the connecting limiting groove block 5055 is provided with a cylindrical rotating hook groove 5056 and a receiving adapter groove 5057 with a width smaller than the radial diameter of the rotating hook groove 5056. The present invention uses a suction gas phase connection port provided at one end of the clamping base 5051 in conjunction with a suction pump to achieve the return stroke of the drive shaft 5053 through negative pressure and pressure boosting, thereby realizing the adjustment of the clamping unit 505.

[0045] In an embodiment of the present invention, the clamping unit 505 further includes a bidirectional compound force arc spring 5058 fixed on the arc-shaped buckle 5054; rubber blocks 5059 are provided on both sides and at the "C"-shaped opening of the bidirectional compound force arc spring 5058; hook-connecting sliding seats 50510 are fixedly provided at both ends of the bidirectional compound force arc spring 5058; the hook-connecting sliding seats 50510 slide in cooperation with the sliding groove 5052; wherein, a limiting rotating shaft 50511 is provided at the position of the hook-connecting sliding seat 50510 relative to the position of the connecting limiting groove block 5055; the limiting rotating shaft 50511 is composed of a rectangular central part and fan-shaped rotating parts arranged on both sides of the central part. The present invention operates by the stroke of the drive shaft 5053, in conjunction with the elastic compound force of the bidirectional compound force arc spring 5058, causing the bidirectional compound force arc spring 5058 and the rubber blocks 5059 to be as a whole. Figure 7As shown, the microwave chip is flexibly clamped on both sides using two sets of opposing bidirectional compound force arc springs 5058 and rubber blocks 5059. This clamping method utilizes the axial compression capability of the "C"-shaped cavity of the bidirectional compound force arc springs 5058 and the deformation of the rubber blocks 5059 to achieve flexible clamping, effectively adapting to the high thermal expansion coefficient of gallium arsenide microwave chips and maintaining a compatible clamping operation. The return stroke of the drive shaft 5053 drives the two ends of the hook-connected sliding seat 50510 to move and rotate, while the arc-shaped buckle 5054 adjusts the traction of the middle section of the bidirectional compound force arc springs 5058. This causes the bidirectional compound force arc spring 5058 and the rubber block 5059 to form a "U" shape. Furthermore, the two ends of the bidirectional compound force arc spring 5058 and the rubber block 5059 can be compressed like a spring during the "U" shape. In conjunction with the limiting rotation shaft 50511 and the receiving adaptation groove 5057 during the rotation adjustment process, the two hook-connected sliding seats 50510 can have the space required during the compression process. The elastic force of the bidirectional compound force arc spring 5058 clamps the two sides of the gallium nitride microwave chip, and simultaneously adapts to the relatively small thermal expansion coefficient of gallium nitride, while maintaining good clamping stability.

[0046] Working principle: This embodiment provides a microwave chip testing fixture. Usage steps:

[0047] S100, Loading process: Microwave chips are placed on the conveying assembly 2 by manual or mechanical means for sequential conveying;

[0048] S200, Clamping process: The horizontal displacement adjustment guide rail 302 is adjusted horizontally and the vertical adjustment guide rail 303 is adjusted vertically to cause the adsorption shaft 306 to perform negative pressure adsorption on the microwave chip located on the conveying component 2, and the microwave chip is placed on the power-on heating test component 402 in conjunction with the horizontal displacement adjustment guide rail 302 and the vertical adjustment guide rail 303.

[0049] S300, Adjustment Process:

[0050] If the gallium arsenide microwave chip is clamped and adjusted: the pumping motor causes the drive shaft 5053 to move during the stroke, and the bidirectional compound force arc spring 5058 elastically compresses, causing the bidirectional compound force arc spring 5058 and the rubber block 5059 to unfold as a whole. This clamping method utilizes the "C" shaped cavity of the bidirectional compound force arc spring 5058 to perform axial compression and the deformation of the rubber block 5059 to achieve flexible clamping.

[0051] If the gallium nitride microwave chip is clamped and adjusted: the suction pump causes the drive shaft 5053 to return, which drives the two ends of the hook-connected sliding seat 50510 to move and rotate in the center. The arc-shaped buckle 5054 is used to pull and adjust the middle end of the bidirectional compound force arc spring 5058, so that the bidirectional compound force arc spring 5058 and the rubber block 5059 form a "U" shape. Furthermore, the two ends of the bidirectional compound force arc spring 5058 and the rubber block 5059 can be compressed like a spring when the "U" shape is formed.

[0052] S400: The microwave chip is clamped in a matching state by moving two sets of adjusting slide rails 504 relatively close to each other, thus maintaining stability during the test.

[0053] S500, Simulation Test Processing: The microwave chip is simulated by using an adapted on / off circuit to activate the power-on temperature rise test component 402.

[0054] S600, Stacking Process: The horizontal displacement adjustment guide rail 302 and the vertical adjustment guide rail 303 are adjusted to cause the adsorption shaft 306 to perform negative pressure adsorption on the microwave chip located on the conveyor assembly 2. After the microwave chip is simulated to be powered on multiple times by the horizontal displacement adjustment guide rail 302 and the vertical adjustment guide rail 303, it is placed on the conveyor belt. The drive motor 703 drives the conveyor belt to adjust its displacement and stack multiple microwave chips.

[0055] S700, Visual Testing: The shape of the microwave chip after multiple simulated power-on cycles is photographed and compared using the visual testing component 802 to test the expansion of the microwave chip.

[0056] The embodiments disclosed in this invention are preferred embodiments, but are not limited thereto. Those skilled in the art can easily understand the spirit of this invention based on the above embodiments and make different extensions and variations, but as long as they do not depart from the spirit of this invention, they are all within the protection scope of this invention.

Claims

1. A microwave chip testing fixture, characterized in that, It includes a test machine (1); a conveying component (2) is provided on the test machine (1); a basic transfer component (3) is provided on the test machine (1) relative to the output end of the conveying component (2); Several auxiliary platforms (4) for powering on microwave chips are provided below the basic transfer component (3). The auxiliary stage (4) is provided with a clamping component (5) on its side for stabilizing and limiting the microwave chip testing operation. The output end of the basic transfer component (3) is provided with a dual-axis platform (6); the second movable end of the dual-axis platform (6) is provided with a material stacking mechanism (7); a visual testing mechanism (8) connected to the testing machine (1) is provided above the material stacking mechanism (7). The clamping component (5) has a flexible clamping state and an elastic holding state; The clamping assembly (5) includes an auxiliary connecting seat (501) arranged on one side of the connecting seat (401); an adjustable movable cylinder (502) is installed on the auxiliary connecting seat (501); an auxiliary block (503) is provided on the movable end of the adjustable movable cylinder (502); two adjusting slide rails (504) are symmetrically arranged on the auxiliary block (503); the adjusting slide rails (504) are arranged at an incline or horizontally; and a clamping unit (505) is provided on the movable end of the adjusting slide rails (504) through a mounting seat. The clamping unit (505) includes a clamping base (5051) arranged at the movable end of the adjusting slide rail (504); the clamping base (5051) is provided with sliding grooves (5052) in a symmetrical shape; the included angle of the sliding grooves (5052) is less than or equal to ninety degrees; A drive shaft (5053) is movably inserted inside the clamping base (5051); a negative pressure suction structure is formed between the clamping base (5051) and the drive shaft (5053); An arc-shaped buckle (5054) is provided at the end of the drive shaft (5053); connecting limiting grooves (5055) are provided on both sides of the end of the drive shaft (5053). The inner wall of the connecting limiting groove block (5055) is provided with a cylindrical rotating hook groove (5056) and a receiving adapter groove (5057) with a width smaller than the radial diameter of the rotating hook groove (5056). The clamping unit (505) further includes a bidirectional compound force arc spring (5058) fixed on the arc buckle (5054); rubber blocks (5059) are provided on both sides and at the "C"-shaped opening of the bidirectional compound force arc spring (5058); hook-connecting sliding seats (50510) are fixedly provided at both ends of the bidirectional compound force arc spring (5058); the hook-connecting sliding seats (50510) are slidably engaged with the sliding groove (5052); The hook-connecting sliding seat (50510) is provided with a limiting rotating shaft (50511) relative to the connecting limiting groove block (5055); the limiting rotating shaft (50511) is composed of a rectangular central part and a fan-shaped rotating part arranged on both sides of the central part.

2. The microwave chip testing fixture according to claim 1, characterized in that, The basic transfer assembly (3) includes a stand (301) arranged on the test machine (1); a horizontal displacement adjustment guide rail (302) is arranged horizontally on the stand (301); a plurality of vertical adjustment guide rails (303) are provided on the movable end of the horizontal displacement adjustment guide rail (302) through a mounting block; a synchronization seat (304) is provided on one side of the horizontal displacement adjustment guide rail (302) and is installed and connected to the plurality of vertical adjustment guide rails (303); an adsorption shaft (306) is provided on the synchronization seat (304) through a plurality of downward guide rails (305).

3. The microwave chip testing fixture according to claim 2, characterized in that, The auxiliary platform (4) includes a connecting seat (401) arranged on one side of the stand (301); the connecting seat (401) is provided with a plurality of power-on heating test components (402) that match the pins of the microwave chip, and the gap between the power-on heating test components (402) and the connecting seat (401) forms a plurality of ejector pin cavities; a release ejector pin (403) is provided in the ejector pin cavity by means of a spring.

4. The microwave chip testing fixture according to claim 3, characterized in that, The dual-axis platform (6) includes a transversely arranged adjusting guide rail A and a longitudinally arranged adjusting guide rail B on the adjusting guide rail A; and the stacking mechanism (7) includes a stacking platform (701) installed on the movable end of the adjusting guide rail B; both sides of the stacking platform (701) are provided with conveying rollers (702); one of the conveying rollers (702) is provided with a drive motor (703) at its input end, and the two conveying rollers (702) are connected by a conveyor belt; wherein, a plurality of guide posts (704) are arranged sequentially on the stacking platform (701) relative to the upper surface of the conveyor belt; wherein, the gap between two adjacent guide posts (704) forms a stacking cavity.

5. A microwave chip testing fixture according to claim 4, characterized in that, The visual testing mechanism (8) includes a test drive rail (801) arranged above the conveyor belt; the movable end of the test drive rail (801) is provided with a visual testing component (802) via a drive seat.

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