Visual analysis method, system and equipment for structural characteristics of assembly holes based on adjacency matrix and medium

Abstract

The invention relates to the technical field of digital assembly processes, in particular to an adjacent matrix-based assembly hole structure characteristic visual analysis method, system and equipment and a medium. According to the method, firstly, an assembly attribute information table is obtained, a contact-based adjacent matrix is constructed, a description model of assembly hole structure characteristics is established, secondly, the number and spatial positions of assembly holes are obtained through the attribute information table, and then the assembly relation between zero standard parts in an assembly is analyzed. And finally, displaying the structural characteristics of the assembly holes in different positions and different assembly relations in the assembly body in a three-dimensional environment, and constructing a three-dimensional visual analysis environment for the structural characteristics of the assembly holes. The method gets rid of the traditional mode which seriously depends on visual recognition, achieves the automatic analysis and visual display of the structural characteristics of the assembly holes, improves the process preparation efficiency of process personnel, and reduces the probability of misrecognition.

Description

Technical Field

[0001] The present invention relates to the technical field of digital assembly process design, and in particular, to a method, system, device and medium for visual analysis of the structural characteristics of assembly holes based on an adjacency matrix. Background Art

[0002] In the design of complex product assembly processes, most current digital assembly process design technologies integrate manufacturing process management systems with modules such as data management, assembly simulation, and typical knowledge bases in a multi-system integration manner, intuitively and clearly reflecting the assembly process design intent and improving product assembly quality. However, most current digital assembly process design systems focus on assembly schemes, assembly sequences, and assembly simulations. There is a lack of auxiliary process design technology for hole positions to determine assembly process parameters based on stack characteristics.

[0003] Aircraft assembly is an important link in aircraft manufacturing. Affected by factors such as structural characteristics and structural rigidity, in the aircraft assembly process, connection means such as screwing and riveting are usually used to assemble components into parts or products. During the process preparation in the assembly stage, process personnel use three-dimensional design data as the manufacturing basis to construct process models and related process information. Among them, the identification and analysis of the structural characteristics such as the standard part grades and stack information of assembly holes are the basis for process personnel to familiarize themselves with the product structure and carry out work such as compiling process documents. However, an aircraft structure usually contains more than millions of standard parts with a wide distribution. Not only are the number of standard parts large, but the types of standard parts are also very diverse, and the assembly forms of zero-standard parts are different. The method mainly based on visual inspection usually cannot meet the requirements of current process preparation efficiency and accuracy. Summary of the Invention

[0004] Aiming at the problem that the method mainly based on visual inspection during aircraft assembly usually cannot meet the requirements of current process preparation efficiency and accuracy, the present invention provides a method, system, device and medium for visual analysis of the structural characteristics of assembly holes based on an adjacency matrix; a description model of the structural characteristics of assembly holes is established in advance, the assembly relationships between zero-standard parts in the assembly are analyzed, and finally the structural characteristics of assembly holes with different positions and different assembly relationships in the assembly are displayed in a three-dimensional environment, constructing a convenient and efficient three-dimensional assembly hole characteristic analysis environment for process personnel; getting rid of the traditional mode that heavily relies on visual recognition in the past, realizing the automatic analysis and intuitive display of the structural characteristics of assembly holes, improving the process preparation efficiency of process personnel, and reducing the probability of misidentification and wrong identification.

[0005] The specific implementation content of the present invention is as follows: A visualization analysis method for the structural characteristics of assembly holes based on an adjacency matrix. First, obtain the assembly attribute information table, construct an adjacency matrix based on contact, and establish a description model for the structural characteristics of assembly holes. Second, the attribute information table is used to obtain the number and spatial positions of the assembly holes. Then, analyze the assembly relationships between the zero-standard parts in the assembly. Finally, display the structural characteristics of the assembly holes with different positions and different assembly relationships in the assembly in a three-dimensional environment to construct a three-dimensional visualization analysis environment for the structural features of assembly holes.

[0006] To better implement the present invention, further, the visualization analysis method for the structural characteristics of assembly holes based on an adjacency matrix specifically includes the following steps: Step S1: Export the attribute information tables of each sub-assembly in the assembly, and construct an undirected adjacency matrix of zero-standard parts based on contact; Step S2: According to the attribute information table, obtain the number and spatial positions of the assembly holes; Step S3: Analyze the structural characteristics of the assembly holes according to the undirected adjacency matrix of zero-standard parts, and obtain the material characteristics of the assembly holes in combination with the number and spatial positions of the assembly holes; Step S4: Construct a three-dimensional visualization analysis environment for the structural features of assembly holes according to the structural characteristics of the assembly holes and the material characteristics of the assembly holes.

[0007] To better implement the present invention, further, Step S1 specifically includes the following steps: Step S11: Call the CAD secondary development plug-in to analyze the assembly T, and export the basic attribute information of the sub-assembly T k in the assembly T; Step S12: According to the assembly set V, the edge set E of the undirected contact relationship graph, and the number i of sub-assemblies, call the CAD interference analysis to construct an undirected adjacency matrix of zero-standard parts based on contact.

[0008] To better implement the present invention, further, the basic attribute information in Step S11 includes drawing number, name, example number, assembly path, type, material, and axis; The drawing number is the part number of the sub-assembly T k in the assembly T; The name is the term of the sub-assembly T k in the assembly T; The example number is the example name of the sub-assembly T k in the assembly T; The assembly path is the structure tree path from the top-level parent node to the sub-assembly T k in the CATIA structure tree, separated by " / "; The type is the classification of the sub-assembly T k in the assembly T, which can be divided into parts, connectors, and mating parts; The material is the "material grade" in the custom attributes; The axis is the sub-assembly T of the type "connector" k , and the endpoint coordinates of the axis are separated by ",".

[0009] In order to better implement the present invention, further, the step S2 specifically includes the following steps: Step S21: According to the attribute information table of the sub-assembly, obtain the sub-assembly of the type "connector", and count the number M of the sub-assemblies of the type "connector" and the relevant attribute information to obtain the number M of the assembly holes; Step S22: Obtain the spatial position of the assembly hole according to the axis data of the assembly T k attribute information; Step S23: According to the number M of the assembly holes and the spatial position, equivalent the sub-assembly of the type "connector" to an embodiment of the assembly hole, and establish a mapping relationship between the assembly hole and the sub-assembly.

[0010] In order to better implement the present invention, further, the step S3 specifically includes the following steps: Step S31: Obtain M vertices corresponding to the sub-assembly with the structural characteristic type of "connector"; Step S32: Obtain the vertices contacted by the m-th vertex vt to obtain the set Nt, Nt = {j ∈ V|Atj = 1}; Step S33: Use the number of the set Nt as the number of stacked layers, and the respective sub-assemblies corresponding to the set Nt as the stacked parts. The number of stacked layers and the stacked parts together constitute the structural characteristics of the assembly hole; according to the attribute information of the set Nt and the corresponding sub-assembly, obtain the materials of the respective stacked parts to form the material characteristics of the assembly hole.

[0011] In order to better implement the present invention, further, the specific operation of the step S4 is: display the structural characteristics and material characteristics obtained from the M assembly holes in step S33 in a three-dimensional environment, construct a three-dimensional visualization analysis environment for the structural features of the assembly hole, and construct a text annotation at the starting point of the axis of the sub-assembly corresponding to the assembly hole.

[0012] Based on the above-mentioned visualization analysis method for the structural characteristics of the assembly hole based on the adjacency matrix, in order to better implement the present invention, further, a visualization analysis system for the structural characteristics of the assembly hole based on the adjacency matrix is proposed, which is used to execute the above-mentioned visualization analysis method for the structural characteristics of the assembly hole based on the adjacency matrix; it includes an acquisition unit, a statistical unit, a preprocessing unit, and a construction unit; The acquisition unit is used to obtain the assembly attribute information table, construct an adjacency matrix based on contact, and establish a description model of the structural characteristics of the assembly hole; The statistical unit is used to obtain the quantity and spatial position of the assembly holes from the attribute information table; The preprocessing unit is used to analyze the assembly relationships between the zero-standard parts in the assembly; The construction unit is used to display the structural characteristics of the assembly holes with different positions and different assembly relationships in the assembly in a three-dimensional environment, and construct a three-dimensional visualization analysis environment for the structural features of the assembly holes.

[0013] Based on the above-mentioned visualization analysis method for the structural characteristics of assembly holes based on the adjacency matrix, in order to better implement the present invention, further, an electronic device is proposed, which includes a memory and a processor; a computer program is stored on the memory; when the computer program is executed on the processor, the above-mentioned visualization analysis method for the structural characteristics of assembly holes based on the adjacency matrix is realized.

[0014] Based on the above-mentioned visualization analysis method for the structural characteristics of assembly holes based on the adjacency matrix, in order to better implement the present invention, further, a computer-readable storage medium is proposed, and a computer instruction is stored on the computer-readable storage medium; when the computer instruction is executed on the above-mentioned electronic device, the above-mentioned visualization analysis method for the structural characteristics of assembly holes based on the adjacency matrix is realized.

[0015] The present invention has the following beneficial effects: By displaying the structural characteristics of the assembly holes with different positions and different assembly relationships in the assembly in a three-dimensional environment, the present invention constructs a convenient and efficient three-dimensional assembly hole characteristic analysis environment for the process personnel; getting rid of the traditional mode that seriously relies on visual recognition in the past, realizing the automatic analysis and intuitive display of the structural characteristics of the assembly holes, improving the process preparation efficiency of the process personnel, and reducing the probabilities of misrecognition and wrong recognition. Description of the Drawings

[0016] Figure 1 It is a schematic block diagram of the construction process for the visualization analysis of the structural characteristics of the assembly holes provided by the present invention.

[0017] Figure 2 It is an embodiment diagram of the assembly holes provided by the present invention.

[0018] Figure 3 It is an effect diagram of the three-dimensional visualization display of the assembly holes provided by the present invention. Detailed Embodiment

[0019] To more clearly illustrate the technical solutions of the embodiments of the present invention, the following will combine the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. It should be understood that the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments, and should not be regarded as a limitation of the protection scope. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work belong to the protection scope of the present invention.

[0020] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "set", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can also be directly connected, or indirectly connected through an intermediate medium, and can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0021] Embodiment 1: This embodiment proposes a visualization analysis method for the structural characteristics of assembly holes based on an adjacency matrix. First, obtain the assembly attribute information table, construct an adjacency matrix based on contact, and establish a description model for the structural characteristics of assembly holes. Secondly, the attribute information table obtains the number and spatial positions of the assembly holes. Then, analyze the assembly relationships between the zero-standard parts in the assembly. Finally, display the structural characteristics of the assembly holes with different positions and different assembly relationships in the three-dimensional environment to construct a three-dimensional visualization analysis environment for the structural characteristics of assembly holes.

[0022] Working principle: Establish a description model for the structural characteristics of assembly holes in advance, analyze the assembly relationships between the zero-standard parts in the assembly, and finally display the structural characteristics of the assembly holes with different positions and different assembly relationships in the three-dimensional environment to construct a convenient and efficient three-dimensional assembly hole characteristic analysis environment for process personnel; get rid of the traditional mode that seriously relies on visual recognition in the past, realize the automatic analysis and intuitive display of the structural characteristics of assembly holes, improve the process preparation efficiency of process personnel, and reduce the probability of misrecognition and wrong recognition.

[0023] Embodiment 2: Based on the above Embodiment 1, as Figure 1 shown, it will be described in detail in the form of steps.

[0024] The visualization analysis method for the structural characteristics of assembly holes based on an adjacency matrix specifically includes the following steps: Step S1: Export the attribute information tables of each sub-assembly in the assembly and construct an undirected adjacency matrix of zero-standard parts based on contact.

[0025] Step S1 specifically includes the following steps: Step S11: Call the CAD secondary development plug-in to analyze the assembly T, and export the basic attribute information of the sub-assembly T in the assembly T k .

[0026] To better implement the present invention, further, the basic attribute information in step S11 includes drawing number, name, example number, assembly path, type, material, axis; The drawing number is the part number of the sub-assembly T k . The name is the term of the sub-assembly T k . The example number is the example name of the sub-assembly T k . The assembly path is the structure tree path from the top-level parent node to the sub-assembly T in the CATIA structure tree, separated by " / "; k The type is the classification of the sub-assembly T, which can be divided into parts, connectors, and mating parts; k The material is the "material grade" in the custom attributes; The axis is the sub-assembly T of the type "connector" k , and the endpoint coordinates of the axis are separated by ",".

[0027] Step S12: According to the assembly set V, the edge set E of the undirected contact relationship graph, and the number i of sub-assemblies, call the CAD interference analysis to construct an undirected adjacency matrix of zero-standard parts based on contact.

[0028] Step S2: Obtain the number and spatial position of the assembly holes according to the attribute information table.

[0029] Step S2 specifically includes the following steps: Step S21: According to the attribute information table of the sub-assembly, obtain the sub-assemblies of the type "connector", and count the number M and related attribute information of the sub-assemblies of the type "connector" to obtain the number M of the assembly holes; Step S22: Obtain the spatial position of the assembly holes according to the axis data of the attribute information of the assembly T k . Step S23: According to the number M of the assembly holes and the spatial position, equivalent the sub-assemblies of the type "connector" to the examples of the assembly holes, and establish the mapping relationship between the assembly holes and the sub-assemblies.

[0030] Step S3: Analyze the structural characteristics of the assembly holes according to the undirected adjacency matrix of zero-standard parts, and obtain the material characteristics of the assembly holes in combination with the number and spatial position of the assembly holes.​​

[0031] Step S3 specifically includes the following steps: Step S31: Obtain M vertices corresponding to the sub-assemblies with the structural feature type of "connector"; Step S32: Obtain the vertices contacted by the m-th vertex vt to obtain the set Nt, where Nt = {j ∈ V|Atj = 1}; Step S33: Take the number of the set Nt as the number of stacked layers, and each sub-assembly corresponding to the set Nt as the stacked parts. The number of stacked layers and the stacked parts together constitute the structural feature of the assembly hole; according to the attribute information of the set Nt and the corresponding sub-assemblies, obtain the materials of each stacked part to form the material feature of the assembly hole.

[0032] Step S4: Construct a three-dimensional visualization analysis environment for the structural features of the assembly hole according to the structural feature and the material feature of the assembly hole.

[0033] The specific operation of step S4 is as follows: Display the structural features and material features obtained from the M assembly holes in step S33 in a three-dimensional environment, construct a three-dimensional visualization analysis environment for the structural features of the assembly hole, and construct a text annotation at the starting point of the axis of the sub-assembly corresponding to the assembly hole.

[0034] Working principle: This embodiment gets rid of the traditional mode that seriously relies on visual recognition in the past, realizes the automatic analysis and intuitive display of the structural features of the assembly hole, improves the process preparation efficiency of process personnel, and reduces the probability of misrecognition and wrong recognition.

[0035] Other parts of this embodiment are the same as those of the above-mentioned embodiment 1, so they will not be elaborated here.

[0036] Embodiment 3: On the basis of any one of the above-mentioned Embodiment 1 - Embodiment 2, as Figure 1 , Figure 2 , Figure 3 shown, a specific embodiment is used for detailed description.

[0037] Step S1: Input the attribute information table of each sub-assembly in the assembly T and the adjacency matrix based on contact.

[0038] The attribute information table analyzes the assembly using a CAD secondary development plug-in and exports the basic attribute information of each sub-assembly in the assembly. Among them, the assembly T has a total of i sub-assemblies, and the k-th sub-assembly Tk has multiple attribute information, specifically including: drawing number, name, embodiment number, assembly path, type, material, axis.

[0039] This embodiment will be specifically described by taking the assembly in CATIA as an example. The drawing number is the part number of the sub-assembly Tk; the term is the name of the sub-assembly Tk; the embodiment number is the embodiment name of the sub-assembly Tk; the assembly path is the structural tree path from the top-level parent node to the sub-assembly Tk in the CATIA structural tree, which is separated by " / "; the type is the classification of the sub-assembly Tk, which can be divided into parts, connectors, and mating parts; the part is the non-standard sub-assembly Tk, the connector is a standard part that plays a penetrating role and provides fastening force, and the mating part is a standard part used to receive the fastening force of the part; the material is the "material grade" in the custom attributes; the axis is the sub-assembly Tk of the type "connector", and the endpoint coordinates of the axis are separated by ",".

[0040] The adjacency matrix uses the interference analysis provided by the CAD software to construct an undirected adjacency matrix of zero-standard parts based on contact. The values in the matrix represent the assembly relationship. Usually, 1 indicates the existence of physical contact, and 0 indicates the non-existence of physical contact.

[0041] The adjacency matrix A is used to represent an undirected contact relationship graph G=(V, E), where V is the set of sub-assemblies and E is the set of edges. In the embodiment, the adjacency matrix A is an i*i symmetric matrix, where i is the number of sub-assemblies. If there is a contact relationship between vertices vp and vq, then Apq = Aqp = 1; otherwise, Apq = Aqp = 0.

[0042] Step S2: Count the number and spatial positions of the assembly holes.

[0043] Take each sub-assembly of the type "connector" as an example of an assembly hole to establish the mapping relationship between the assembly hole and the sub-assembly. According to the attribute information table of the sub-assembly, screen the sub-assemblies of the type "connector". Count the number M and related attribute information of the sub-assemblies that meet the above conditions. Thus, the number of assembly holes can be obtained as M, and the spatial position can be obtained by analyzing the axis data in the Tk attribute information.

[0044] Step S3: Perform data preprocessing on the adjacency matrix; the data preprocessing mainly analyzes the structural characteristics of the assembly holes in the adjacency matrix for the M assembly holes, and then combines the attribute information table to obtain the material characteristics of the assembly holes. First, obtain the M vertices corresponding to the sub-assemblies with the structural characteristic type of "connector". For the m-th vertex, obtain the set Nt by obtaining all the vertices in contact with the vertex vt, Nt = {j ∈ V|Atj = 1}, which contains all the vertices adjacent to the vertex vt. The number of the set Nt is the number of stacked layers, and the respective sub-assemblies corresponding to the set Nt are the stacked parts. The number of stacked layers and the stacked parts together constitute the structural characteristics of the assembly hole. Then, combine the set Nt with the attribute information of the corresponding sub-assembly to obtain the materials of each stacked part, which form the material characteristics of the assembly hole.

[0045] Step S4: Construct a three-dimensional visualization analysis environment for the structural features of assembly holes; display the structural characteristics and material properties obtained for the M assembly holes in step S3 in the three-dimensional environment for visual analysis by process personnel. In this embodiment, an example is given based on the CAITA software. At the starting point of the axis of the sub-assembly corresponding to each assembly hole, a text annotation is constructed.

[0046] The text content is as follows: drawing number of the connector, number of laminations, lamination parts, lamination materials. For details, please refer to the attached drawings.

[0047] Other parts of this embodiment are the same as any one of the above-mentioned Embodiment 1 - Embodiment 2, so they will not be elaborated here.

[0048] Embodiment 4: Based on any one of the above-mentioned Embodiment 1 - Embodiment 3, this embodiment proposes a three-dimensional visualization analysis system for the structural characteristics of assembly holes based on an adjacency matrix, which is used to execute the above-mentioned method for visualizing the structural characteristics of assembly holes based on an adjacency matrix; it includes an acquisition unit, a statistics unit, a preprocessing unit, and a construction unit; The acquisition unit is used to obtain the assembly attribute information table, construct an adjacency matrix based on contact, and establish a description model for the structural characteristics of assembly holes; The statistics unit is used to obtain the number and spatial positions of the assembly holes from the attribute information table; The preprocessing unit is used to analyze the assembly relationships between the zero-standard parts in the assembly; The construction unit is used to display the structural characteristics of the assembly holes with different positions and different assembly relationships in the assembly in a three-dimensional environment, and construct a three-dimensional visualization analysis environment for the structural features of assembly holes.

[0049] This embodiment also proposes an electronic device, including a memory and a processor; a computer program is stored on the memory; when the computer program is executed on the processor, the above-mentioned method for visualizing the structural characteristics of assembly holes based on an adjacency matrix is implemented.

[0050] This embodiment also proposes a computer-readable storage medium, on which a computer instruction is stored; when the computer instruction is executed on the above-mentioned electronic device, the above-mentioned method for visualizing the structural characteristics of assembly holes based on an adjacency matrix is implemented.

[0051] Other parts of this embodiment are the same as any one of the above-mentioned Embodiment 1 - Embodiment 3, so they will not be elaborated here.

[0052] The above are only the preferred embodiments of the present invention, and do not impose any form of limitation on the present invention. Any simple modification or equivalent change made to the above embodiments based on the technical essence of the present invention shall fall within the protection scope of the present invention.

Claims

1. A visual analysis method of assembly hole structural characteristics based on adjacency matrix, characterized in that: First, the assembly attribute information table is obtained, and a contact-based adjacency matrix is ​​constructed to establish a description model of the assembly hole structure characteristics. Secondly, the attribute information table obtains the number and spatial position of the assembly holes. Then, the assembly relationship between the parts in the assembly is analyzed. Finally, the assembly hole structure characteristics of different positions and different assembly relationships in the assembly are displayed in a three-dimensional environment, and a three-dimensional visualization analysis environment for assembly hole structure features is constructed.

2. The method for visual analysis of assembly hole structural characteristics based on adjacency matrix according to claim 1, characterized in that: The assembly hole structure characteristic visualization analysis method based on the adjacency matrix specifically comprises the following steps: Step S1: export the attribute information table of each subassembly in the assembly, and construct the contact-based zero-part undirected adjacency matrix; Step S2: According to the attribute information table, the number and spatial position of the assembly holes are obtained; Step S3: analyzing the structural characteristics of the assembly holes according to the undirected adjacency matrix of the standard parts, and obtaining the material characteristics of the assembly holes in combination with the number and spatial positions of the assembly holes; Step S4: constructing a three-dimensional visualization analysis environment for the structural features of the assembly holes according to the structural characteristics of the assembly holes and the material characteristics of the assembly holes.

3. The method for visual analysis of assembly hole structural characteristics based on adjacency matrix according to claim 2, characterized in that: The step S1 specifically includes the following steps: Step S11: Call the CAD secondary development plug-in to analyze assembly T and export subassembly T in assembly T k Basic attribute information; Step S12: According to the assembly set V, the undirected contact relationship graph edge set E, and the number of sub-assemblies i, call CAD interference analysis to construct a contact-based zero-standard part undirected adjacency matrix.

4. The method for visual analysis of assembly hole structural characteristics based on adjacency matrix according to claim 3 is characterized in that: The basic attribute information in step S11 includes drawing number, name, embodiment number, assembly path, type, material, and axis; The figure number is for subassembly T k Part number; The name is subassembly T k terminology; The embodiment number is subassembly T k The name of the embodiment of The assembly path is the top parent node to the subassembly T in the CATIA structure tree. k The structure tree path is separated by " / "; The type is subassembly T k The classification can be divided into parts, connectors and matching parts; The material is the "material grade" in the custom attribute; The axis is a subassembly T of type "connector" k , the endpoint coordinates of the axis are divided by ",".

5. The method for visual analysis of assembly hole structural characteristics based on adjacency matrix according to claim 4 is characterized in that: The step S2 specifically includes the following steps: Step S21: According to the attribute information table of the subassembly, the subassembly of type "connector" is obtained, and the number M of the subassembly of type "connector" and related attribute information are counted to obtain the number M of assembly holes; Step S22: According to the assembly T k The axis data of the attribute information obtains the spatial position of the assembly hole; Step S23: According to the number M and spatial positions of the assembly holes, the subassembly of the type "connector" is equivalent to an embodiment of the assembly hole, and a mapping relationship between the assembly hole and the subassembly is established.

6. The method for visual analysis of assembly hole structural characteristics based on adjacency matrix according to claim 5, characterized in that: The step S3 specifically comprises the following steps: Step S31: obtaining M vertices corresponding to the subassembly whose structural characteristic type is "connector"; Step S32: Get the vertices that the m-th vertex vt touches, and obtain a set Nt, Nt={j∈V|Atj=1}; Step S33: The number of set Nt is taken as the number of stacking layers, and each sub-assembly corresponding to set Nt is taken as a stacking part. The number of stacking layers and the stacking parts together constitute the structural characteristics of the assembly hole; according to the attribute information of set Nt and the corresponding sub-assembly, the material of each stacking part is obtained to constitute the material characteristics of the assembly hole.

7. The method for visual analysis of assembly hole structural characteristics based on adjacency matrix according to claim 6, characterized in that: The specific operation of step S4 is: displaying the structural characteristics and material characteristics of the M assembly holes obtained in step S33 in a three-dimensional environment, constructing a three-dimensional visualization analysis environment for the structural characteristics of the assembly holes, and constructing text annotations at the starting points of the sub-assembly axes corresponding to the assembly holes.

8. A visual analysis system for assembly hole structure characteristics based on adjacency matrix, used to execute the visual analysis method for assembly hole structure characteristics based on adjacency matrix as claimed in claim 1; characterized in that: It includes acquisition unit, statistics unit, preprocessing unit and construction unit; The acquisition unit is used to acquire the assembly attribute information table, construct a contact-based adjacency matrix, and establish a description model of the assembly hole structure characteristics; The statistical unit is used to obtain the number and spatial positions of the assembly holes from the attribute information table; The preprocessing unit is used to analyze the assembly relationship between the parts in the assembly; The construction unit is used to display the structural characteristics of assembly holes in different positions and different assembly relationships in the assembly in a three-dimensional environment, and to construct a three-dimensional visualization analysis environment oriented to the structural characteristics of the assembly holes.

9. An electronic device, characterized in that: It comprises a memory and a processor; the memory stores a computer program; when the computer program is executed on the processor, the assembly hole structure characteristic visualization analysis method based on the adjacency matrix as described in any one of claims 1 to 7 is implemented.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions; when the computer instructions are executed on the electronic device as described in claim 9, the assembly hole structure characteristic visualization analysis method based on the adjacency matrix as described in any one of claims 1-7 is implemented.

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