Equivalent simulation analysis method and system for shock absorber of integrated electronic system

Abstract

The invention discloses an equivalent simulation analysis method and system for a shock absorber of a comprehensive electronic system, and the method comprises the steps: carrying out the optimization and comparison verification of a constructed equivalent simplified finite element simulation model, and combining the sensitive frequency of a working environment of the comprehensive electronic system; according to the analysis method, the response of the shock absorber is researched on the basis of an equivalent model method, and variables in an analysis system are remarkably reduced by eliminating irrelevant influence factors; simulation parameter iteration correction is carried out by utilizing test data according to physical quantities such as a contact form, a pre-tightening force and a damping ratio which influence a finite element simulation analysis result, so that the precision of a simulation model is improved, and meanwhile, a finite element simulation result and actual measurement data of the shock absorber can be compared to judge the suitability of the shock absorber and a comprehensive electronic system; according to the analysis method, an equivalent simulation model with relatively high precision is established, and the simulation result is highly similar to the actual situation, so that the damping effect can be considered without an intermediate quantity of a vibration transfer coefficient, the response size of internal components of a comprehensive electronic system can be directly analyzed, and the comprehensive performance of the damper can be judged.

Description

Technical Field

[0001] The present invention belongs to the technical field of shock absorber simulation analysis, and particularly relates to an equivalent simulation analysis method and system for shock absorbers of an integrated electronic system. Background Art

[0002] In the usage environment of an integrated electronic system, it often faces severe mechanical working conditions such as long-term vibration and transient shock. To improve the environmental adaptability of the integrated electronic system, shock absorbers are usually used in engineering to reduce the vibration and shock levels transmitted to the interior of the product.

[0003] Limited by factors such as the requirements of product R & D progress and the lack of finite element simulation accuracy, at present, for the performance evaluation of shock absorbers of integrated electronic systems used in aerospace, a single test method is mostly adopted, and the adaptability of the shock absorber is determined based on test results such as frequency response, magnification factor, and peak curve.

[0004] The problems existing in the existing finite element simulation models of shock absorbers in engineering practical applications are as follows: a) The modeling is too idealized. Most of them use mathematical theoretical models to replace the actual models for research, which is out of touch with actual engineering applications; b) The idealized simulation model results in its analysis results being unable to be compared with test data, and the practicality is not high; c) In the process of establishing the existing simulation model, too much attention is paid to the shock absorber itself, ignoring its installation and usage environment, resulting in the analysis results focusing on parameters that are not helpful for engineering evaluation, and not focusing on the points concerned by the problem orientation.

[0005] In summary, the establishment of an equivalent simulation method for shock absorbers of an integrated electronic system can effectively solve the problems of low simulation accuracy, long evaluation cycle span, and inability to compare simulation with test, and improve the efficiency and accuracy of reliability analysis of electronic equipment. Summary of the Invention

[0006] The purpose of the present invention is to provide an equivalent simulation analysis method and system for shock absorbers of an integrated electronic system to overcome the technical problems of low accuracy of finite element simulation of shock absorbers in the prior art, large deviation from the actual situation, and weak engineering practicality.

[0007] To solve the above problems, the present invention adopts the following technical solutions: An equivalent simulation analysis method for shock absorbers of an integrated electronic system, comprising the following steps: Equivalently simplify and measure the mass parameters of the internal components of the integrated electronic system to construct a finite element simulation model; Considering contact settings and constitutive settings, optimize the established finite element simulation model; Test and compare the optimized finite element simulation model for verification, correct the simulation parameters, and complete the further optimization of the finite element simulation model; Combined with the sensitive frequency of the integrated electronic system's working environment, use the optimized finite element simulation model to conduct simulation analysis on the vibration damping effect of the shock absorber.

[0008] Furthermore, the equivalent simplification of the internal components of the integrated electronic system is divided into the simplification of components with no influence and the repair and simplification of components with large mass.

[0009] Furthermore, the operation of simplifying components with no influence is to directly delete this component, and the operation of repairing and simplifying components with large mass is to ignore the fine features inside the component, fill the internal space to form a regular solid, delete the installation accessory structure of the component on the PCB, and use the repair and filling function to fill the space left by the deletion.

[0010] Furthermore, the evaluation parameters for measuring the mass parameters at least include the center of mass and the moment of inertia.

[0011] Furthermore, the contact setting considers non-linear contact factors, and based on the modal frequency analysis, the pre-stress calculation of the shock absorber is introduced.

[0012] Furthermore, after the pre-stress calculation is completed, the result is used as the load boundary condition for the modal analysis.

[0013] Furthermore, the constitutive setting is to select one of the Neo-Hookean model, Yeoh model, and Mooney-Rivlin model for the shock absorber.

[0014] Furthermore, the process of testing and comparing the optimized finite element simulation model and correcting the simulation parameters is to correct the parameters of the finite element simulation model using the test data of the test fixture sample; The parameter correction of the finite element simulation model includes the correction of the contact relationship, the fitting of the constitutive model parameters, and the adjustment of the damping ratio.

[0015] Furthermore, the determination process of the damping ratio is as follows: First, give an initial value of the damping ratio in the simulation model; Increase or decrease the value of the damping ratio in a certain increment, conduct sweep-frequency simulation calculations under different working conditions, obtain the frequency response curves under different damping ratios, and compare them with the test curves; Adopt the least squares method or the genetic algorithm optimization calculation method. When comparing the frequency responses, judge that the error range where the simulation points are consistent with the test points is within 10%. If all the frequency point errors are within this range, the optimization result is considered to be the optimal damping ratio.

[0016] In a second aspect, a comprehensive electronic system shock absorber equivalent simulation analysis system is provided, including a model construction module, a model optimization module, a parameter correction module, and a simulation analysis module, where: Model construction module: used to perform equivalent simplification and mass parameter measurement on the internal components of the comprehensive electronic system, and construct a finite element simulation model; Model optimization module: used to optimize the established finite element simulation model by considering contact settings and constitutive settings; Parameter correction module: perform test comparison and verification on the optimized finite element simulation model, correct the simulation parameters, and complete the further optimization of the finite element simulation model; Simulation analysis module: combine the sensitive frequency of the working environment of the comprehensive electronic system, and use the optimized finite element simulation model to perform simulation analysis on the shock absorption effect of the shock absorber.

[0017] Compared with the prior art, the present invention has the following beneficial technical effects: The present invention provides a comprehensive electronic system shock absorber equivalent simulation analysis method. By optimizing and comparing and verifying the constructed equivalent simplified finite element simulation model, combining the sensitive frequency of the working environment of the comprehensive electronic system, and using the optimized finite element simulation model to perform simulation analysis on the shock absorption effect of the shock absorber, this analysis method studies the response of the shock absorber based on the equivalent model method, significantly reduces the variables in the analysis system by eliminating irrelevant influencing factors, and for physical quantities such as contact form, pre-tightening force, and damping ratio that affect the results of finite element simulation analysis, uses test data to perform iterative correction of simulation parameters to improve the accuracy of the simulation model. At the same time, the results of the finite element simulation can be compared with the measured data of the shock absorber to judge its compatibility with the comprehensive electronic system; this analysis method establishes an equivalent simulation model with high accuracy, and the simulation results are highly similar to the actual situation. Therefore, the shock absorption effect can be directly analyzed without considering the intermediate quantity of the vibration transfer coefficient, and the response magnitude of the internal components of the comprehensive electronic system can be directly analyzed to evaluate the comprehensive performance of the shock absorber.

[0018] This analysis method combines numerical simulation methods with testing during the product development stage to achieve performance prediction and analysis of the shock absorber. Different from the traditional method of simply relying on testing to judge the performance and applicability of the shock absorber, this method not only has a mathematical and physical theoretical basis to avoid the blindness of simply relying on testing, but also takes into account engineering practicability to avoid the idealized analysis model being divorced from reality, has strong engineering operability, and has a positive promoting effect on improving the environmental adaptability of the comprehensive electronic system.

[0019] Preferably, through the idea of combining simulation and testing, key parameter testing and equivalent model establishment are carried out separately in the development stage. The equivalent model abandons the conventional refined analysis idea, follows the principles of mass equivalence, position equivalence, and effective simplification of the structure body, modifies and improves the integrated electronic system model, deletes the components or regions with no influence, and reasonably simplifies the structure body that affects the calculation efficiency.

[0020] Preferably, mass parameter measurement can be used as an auxiliary means for model verification and calibration. On the one hand, it refines the simulation model, and on the other hand, it also verifies the rationality of the simulation model. By measuring parameters such as the mass center of mass and moment of inertia, the mass distribution of the simulation model is readjusted, and new values are assigned to the material parameters for the simplified parts or structures, so that the mass center and moment of inertia parameters of the adjusted finite element simulation model are consistent with the measured values.

[0021] Preferably, based on the modal frequency analysis, the pre-stress calculation of the shock absorber is introduced to consider the non-linear contact factors of the shock absorber in the frequency calculation. After the pre-stress calculation based on the static analysis is completed, the result is used as the load boundary condition for the modal analysis, and the subsequent modal frequency simulation is calculated based on this.

[0022] Preferably, for the problem that the damping ratio cannot be predicted, an initial value of the damping ratio is first given in the simulation model, and then its value is increased or decreased according to a certain increment to perform the swept-frequency simulation calculation under different working conditions, obtain the frequency response curves under different damping ratios, and compare them with the test curves. Optimization calculation methods such as the least square method or genetic algorithm are used to determine the optimal damping ratio.

[0023] Preferably, the two-way verification of correcting the simulation model based on the test results and verifying the test with the simulation results realizes the closed-loop of simulation and testing, which is further conducive to the improvement of the equivalent simulation method. Description of the Drawings

[0024] Figure 1 It is a flowchart of the equivalent simulation analysis method for the shock absorber of the integrated electronic system of the present invention.

[0025] Figure 2 It is a schematic diagram of the structure of the integrated electronic system and the shock absorber.

[0026] Figure 3 It is a process diagram for constructing the equivalent simulation analysis model of the shock absorber.

[0027] Figure 4 a is a schematic diagram of the simplified repair of the device with solder balls.

[0028] Figure 4 b is a schematic diagram of the simplified repair of the device with leads.

[0029] Figure 5Schematic diagram for deleting the pin holes of components on the PCB.

[0030] Figure 6 Schematic diagram of the typical installation method and contact relationship of the shock absorber in the integrated electronic system.

[0031] Figure 7 Schematic diagram of the measurement system for the test fixture sample.

[0032] Figure 8 Schematic diagram of the swept - frequency simulation response curve and characteristic frequency.

[0033] Among them, 1. Flexible belt; 2. Small device; 3. PCB; 4. Shock absorber; 5. Bracket; 6. Inertial measurement unit; 7. Connector; 8. High - power device. Specific implementation mode

[0034] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0035] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above - mentioned accompanying drawings are used to distinguish similar objects, and do not necessarily need to describe a specific order or sequence. It should be understood that such used data can be interchanged under appropriate circumstances so that the embodiments of the present invention described here can be implemented in an order different from those illustrated or described here. In addition, the terms "including" and "having" and any variations thereof are intended to cover non - exclusive inclusion. For example, a process, method, system, product or device including a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0036] The present invention provides an equivalent simulation analysis method for the shock absorber of an integrated electronic system, as Figure 1 shown, including the following steps; Step 1, perform equivalent simplification and mass parameter measurement on the internal components of the integrated electronic system, and construct a finite - element simulation model; Specifically, the schematic diagram of the integrated electronic system and the shock absorber structure is as Figure 2As shown, the integrated electronic system uses high-integration and integrated design technology to integrate the functions of guidance, navigation, and control solution. The shock absorbers 4 are evenly distributed around the housing, connecting the integrated electronic system framework and the external structure. The internal inertial measurement unit 6 of the integrated electronic system is placed on the bracket 5.

[0037] The internal structure of the integrated electronic system is complex, with many PCBs 3, small devices 2, and high-power devices 8. Most of them are installed inside the integrated electronic system framework by plugging, screwing, and welding. The irregular structure will cause serious centroid eccentricity and large differences in moment of inertia, etc. This places high requirements on the use of shock absorbers.

[0038] As Figure 3 shown, the equivalent simplification of the internal devices of the integrated electronic system is specifically as follows: (1)Construction of a simplified equivalent finite element simulation model 1) Device simplification and correction: First, sort out the internal devices of the integrated electronic system, distinguish the small devices 2 that have no impact on the shock absorption evaluation effect and can be directly deleted, and the high-power devices 8 that need to be simplified and repaired. For the small devices that can be directly deleted, relevant operations are carried out in the three-dimensional geometry preprocessing software. Software that supports the modification of the three-dimensional geometry model preprocessing includes Creo, CATIA, Space Claim, etc. Among them, Space Claim does not consider the assembly relationship between parts during preprocessing, and the deletion operation does not affect other parts. Use this software for the deletion operation.

[0039] The existence of large-mass devices 8 will affect the mass distribution of the PCB 3, and thus affect parameters such as the overall modal frequency of the integrated electronic system. For large devices (such as relays, crystal oscillators, etc.), structural form simplification and equivalence are required. The most direct method is to ignore the fine features inside the device and fill the internal space to form a regular entity. Secondly, for the installation accessory structures of the devices on the PCB 3, deletion and repair operations can also be carried out for simplification. For example, solder joints, pins, etc. with underfill are added. First, use three-dimensional geometry software to delete detailed features such as solder balls, and then use the repair and filling function to fill the holes left by the deletion to achieve structural simplification, and then perform material parameter equivalence. The simplification of the device installation accessory structure is as Figure 4 a, Figure 4 b shown.

[0040] 2) Structural repair and simplification of the integrated electronic system The parts that need to be repaired and simplified include the PCB 3, connectors 7, and flex belts 1, etc. This part of the simplification requires the comprehensive use of the methods of deleting features and modifying features.

[0041] a) Deletion of the pin hole features of the devices on the PCB 3 Some components are electrically and structurally connected to the PCB3 through pin - hole mating. The pin - holes have little impact on the modal frequency and mechanical response of the PCB3 and will become an obvious interference factor during finite - element simulation. Therefore, feature deletion operations are performed on the pin - holes in the 3D geometry software, as Figure 5 shown.

[0042] (2)Finite - element equivalent model correction based on parameter measurement After the preliminary establishment of the finite - element simulation model, due to simplification measures, there are problems where the mass distribution of some components or regions is inconsistent with the actual situation, which will lead to errors in simulation calculations and further affect the adaptability analysis of the shock absorber.

[0043] As Figure 3 shown, mass parameter measurement can be used as an auxiliary means for model verification and correction. On the one hand, it refines the simulation model, and on the other hand, it also verifies the rationality of the simulation model. By measuring parameters such as the mass center and moment of inertia, the mass distribution of the simulation model is readjusted. For simplified parts or structures, new values are assigned in the material parameters so that the mass center and moment of inertia parameters of the adjusted finite - element simulation model are consistent with the measured values, completing the construction of a highly accurate equivalent simulation model for the integrated electronic system.

[0044] Step 2: Considering contact settings and constitutive settings, optimize the established finite - element simulation model; (3)Considering non - linear contact factors in the simulation model The shock absorber of the integrated electronic system is made of hyper - elastic material, and its installation contact surface is neither a fixed constraint in the form of welding nor a smooth contact form. Under the action of external excitation, there may be sliding friction or static friction on the contact surface of the shock absorber. However, since conventional modal analysis cannot consider non - linear factors, and from a simulation perspective, the modal frequency calculation is an important index for evaluating the performance of the shock absorber; In engineering, non - simulation methods are generally used to study the shock absorber frequency based on mathematical equations for establishment and simulation. The drawback of this method is that it is too idealized and has poor practicality. This analysis method introduces the calculation of the prestress of the shock absorber on the basis of modal frequency analysis to consider the non - linear contact factors of the shock absorber in frequency calculation.

[0045] The calculation of prestress can be completed using typical finite - element analysis software, such as ANSYS Mechanical, etc. When defining the contact, for different contact surfaces, considering the direction of external excitation and other factors, the contact settings are comprehensively carried out according to the degree of influence on the analysis results. The typical installation methods and contact relationships of the shock absorber of the integrated electronic system are as Figure 6 shown, and the specific contact settings of the shock absorber are shown in Table 1: Table 1 Shock absorber contact settings

[0046] The contact settings of the shock absorber of the integrated electronic system are carried out according to the above table. Among them, contact pair 1 and contact pair 5 refer to the bolted contact settings. Considering that the shock absorber is made of hyperelastic material and has a preload in the initial installation state, it is considered that it is always in contact with the sleeve and the housing without separation during the working state. Its installation method determines that there will be no tangential slip, and the light weight basically will not affect the overall structural stiffness. Therefore, contact pairs 2 and 3 can be set according to the Bond type. The shock absorber bushing is connected to the sleeve by threads and is used to fix and support the shock absorber. It does not act as a load-bearing component in actual work. Therefore, contact pair 4 can also be set according to the Bond type. The shock absorber bushing is a metal structure, and the small friction and slip effect between it and the installation body needs to be considered. Therefore, contact pair 6 is set according to Frictional friction.

[0047] After the prestress calculation based on the static analysis is completed, the results are used as the load boundary conditions for the modal analysis, and the subsequent modal frequency simulation is calculated based on this.

[0048] (4)Determination of the non-linear material parameters of the shock absorber Like contact non-linearity, material non-linearity is also an important factor affecting the finite element simulation results. The hyperelasticity of the shock absorber is manifested in the non-linear relationship of the stress-strain curve. Therefore, in the simulation, it cannot be simply considered that the shock absorber material can be replaced by a linear elastic relationship. A constitutive model that conforms to the selected shock absorber needs to be used to represent the hyperelastic relationship of the material.

[0049] Common hyperelastic stress-strain relationships include the Neo-Hookean model, the Yeoh model, and the Mooney-Rivlin model. Multiple uniaxial tensile tests are used to obtain the stress-strain relationship of the shock absorber, and it is compared with the fitting curves of different constitutive models. The most fitting constitutive model and fitting parameters are selected as the hyperelastic material properties of the shock absorber.

[0050] Step 3: Test and compare the optimized finite element simulation model for verification, correct the simulation parameters, and complete the further optimization of the finite element simulation model; (5)Parameter correction of the test fixture sample To more accurately evaluate the shock absorption effect of the shock absorber of the integrated electronic system and support the shock absorber selection work, it is necessary to use the test data of the test fixture sample to correct the parameters of the finite element simulation model. The test fixture sample uses a pattern machine with adjusted mass distribution to install the studied shock absorber. The test types include sweep frequency test, random vibration test, etc. The measurement sensors are arranged at multiple points on the integrated electronic system. After the test, a multi-point average control method is adopted for the test results to comprehensively evaluate parameters such as the frequency peak value of the shock absorber. The test system is built as Figure 7 shown.

[0051] The measurement of the test fixture sample is a verification test, and its results can be used to accurately correct the parameters of the finite element simulation model. The main parameter involved is the damping ratio. At the same time, the measurement results can also be used to further screen and correct the contact relationship and constitutive model parameters to ensure that the contact relationship parameters and constitutive model parameters are the most suitable for the current finite element simulation model.

[0052] First, the operation steps for damping ratio correction are described. As an important parameter for measuring the performance of shock absorbers, the variables involved in the damping ratio include the system mass M, the system stiffness K, and the damping c. Due to the complex structure of the integrated electronic system, these parameters cannot be accurately obtained through theoretical calculations, so the damping ratio cannot be predicted.

[0053] In the simulation model, first give the initial value of the damping ratio, and then increase or decrease its value in a certain increment to perform the swept-frequency simulation calculation under different working conditions, obtain the frequency response curves under different damping ratios, and compare them with the test curves. Figure 8 The figure shows the swept-frequency curve of a typical integrated electronic system and the indication of characteristic frequencies.

[0054] Since there are multiple test points, for the determination of the optimal damping ratio, optimization calculation methods such as the least squares method or genetic algorithm can be adopted. When comparing the frequency responses, the error range for judging that the simulation points are consistent with the test points can be set within 10%. As long as the errors of all frequency points are within this range, the optimization result can be considered valid, and the damping ratio under this working condition is the one closest to the simulation setting parameters of the shock absorber of the integrated electronic system.

[0055] For the correction of the contact relationship and constitutive model, the correction at this stage is different from that in the stage of establishing the simulation model. This stage focuses on the fine-tuning of parameters and does not make large-scale changes. Based on the measurement results, the parameter values are fine-tuned to make the fitting degree between the measurement value and the simulation value higher. The fine-tuning parameters at this stage do not need to be given a certain range, but are result-oriented, sorting out the parameter values that can improve the fitting degree and making changes.

[0056] It should be noted that a) the fitting degree between measurement and simulation only needs to satisfy an error within 10%, without an upper limit, and the error should be reduced as much as possible; b) when correcting the parameters of the test fixture sample, it covers the contact relationship, constitutive model, and damping ratio. Except that the priority of damping ratio correction is higher, the order of the other two corrections does not need to be considered and can be carried out according to personal operating habits.

[0057] (6) Mutual verification between simulation and testing Modal analysis can determine the sensitive frequencies of the integrated electronic system. This frequency is the system resonance frequency, representing the prone-to-occur structural resonance. The swept-frequency simulation based on the sensitive frequency can determine the structural response at this frequency. In the post-processing of the simulation results, the displacement, velocity, or acceleration responses of the concerned parts are extracted and can be compared with the results of the test specimen to check the error range. Similarly, the error range within 10% can be taken as the evaluation index for the simulation validity. The two-way verification of correcting the simulation model based on the test results and verifying the test with the simulation results proposed by this analysis method realizes the closed-loop of simulation and test, which is further beneficial to the improvement of the equivalent simulation method.

[0058] Step 4: Combine the sensitive frequencies of the integrated electronic system's working environment, and use the optimized finite element simulation model to conduct a simulation analysis on the vibration reduction effect of the shock absorber; (7)Evaluation of the Vibration Reduction Effect of the Shock Absorber for the Integrated Electronic System Based on the Equivalent Simulation Method Traditionally, the evaluation of the vibration reduction effect of the shock absorber is carried out using the vibration transmission coefficient, and parameters such as the stiffness and damping coefficient of the vibration reduction system need to be determined. This is applicable to the ideal analysis model and cannot be applied to complex models. This analysis method establishes an equivalent simulation model with high accuracy, and the simulation results are highly similar to the actual situation. Therefore, the vibration reduction effect can be considered directly by analyzing the response magnitudes of the internal components of the integrated electronic system without using the intermediate quantity of the vibration transmission coefficient, and the comprehensive performance of the shock absorber can be evaluated. The specific result analysis components and evaluation indicators are shown in Table 2.

[0059] Table 2 Extraction Locations and Evaluation Indicators of the Simulation Results

[0060] In another embodiment of the present invention, the main design process of the equivalent simulation analysis method for the shock absorber of the integrated electronic system is given, which is specifically divided into the following steps: (1)Equivalent Method of Mass and Stiffness Modes of the Finite Element Simulation Model: The integrated electronic system adopts an external vibration reduction method, and shock absorber mounting ears are reserved around the integrated frame; a set of shock absorbers consists of two parts, upper and lower, which are nested into the mounting ears and connected to the external structure through a metal vibration reduction sleeve, thus avoiding the rigid connection between the integrated electronic system and the external structure.

[0061] On the simulation implementation path, abandon the traditional method of achieving simulation accuracy with an accurate and complete model, and adopt a simplified and equivalent substitution approach to establish a finite element simulation model. A research process is sorted out: determining devices with no influence → simplifying the structural form of devices with influence → repairing the structure and balancing the mass → equivalent stiffness of the simplified model → determining the contact form → adding the simulation constitutive model → calculating the modal frequency. This research process can specifically solve the problem that the simulation results are greatly affected by the established model, achieve the simplification purpose through the optimization and improvement of devices and structures, ensure the rationality of the calculation results through mass equivalence, and realize the basic path for evaluating the shock absorber effect from the simulation perspective.

[0062] The mass and stiffness equivalence are carried out synchronously. The mass equivalence is carried out using the simplified model and the test data of the mass parameters of the integrated electronic system, and the simulation mass parameters are adjusted successively from the device level, board level, component level and system level; the stiffness equivalence is based on the simplified model, and beam elements, plate elements and shell elements are fully utilized for structure substitution, and the equivalent stiffness parameters are input into the simulation model. The verification of the stiffness parameters uses the test fixture sample, and is corrected through the gap between the modal calculation and the measurement results of the test fixture sample to further improve the equivalent simulation model.

[0063] (2)Mutual verification between test data and constitutive model: Sort out the material types of each component of the equivalent simulation model of the integrated electronic system, and perform simulation material loading according to the different stress-strain relationships reflected by linear elasticity, bilinear and hyperelasticity. The bilinear model is selected for the main frame and board-level components, and the commonly used linear elastic model is selected for the equivalent devices.

[0064] The Mooney-Rivlin constitutive model can characterize the hyperelastic mechanical characteristics of the shock absorber. Carry out test comparison and fitting for the constitutive model parameters. On the basis of establishing the simulation finite element model, carry out the test of the mass parameters of the integrated electronic system and compare and verify them with the parameters of the simulation model; compare and verify the modal frequency calculated from the constitutive parameters of the simulation finite element model with the corresponding real frequency of the shock absorber. The evaluation criterion is that the error between the simulation modal frequency and the test real frequency is within 10%. Correct the Mooney-Rivlin model parameters to improve the rationality of the constitutive model parameters and realize the closed-loop of verifying the constitutive model parameters based on simulation; the mass parameter test carried out at this stage is an important guarantee and prerequisite for the simulation accuracy and the basis for subsequent analysis of the shock absorption effect of the shock absorber.

[0065] (3)Simulation parameter correction: The parameters that affect the simulation results are analyzed and the constitutive model of the shock absorber is improved by using equivalent tests. The definition form of contact, the size of the damping ratio and other factors are changed one by one according to the single variable principle for simulation calculations, and compared with the actual frequency sweep results, a set of definition parameters closest to the actual response results is determined to achieve the correction of the simulation parameters. Furthermore, based on the finite element simulation response of the shock absorber of the integrated electronic system, the applicability of the shock absorber is concluded in combination with the lowest frequency of the working environment of the integrated electronic system that is sensitive to external interference.

[0066] (4) In terms of the simulation types adopted, the first is the static prestressed simulation that takes nonlinear factors into consideration. The simulation results are passed to the modal analysis. The tests corresponding to these two simulations are the mass equivalent parameter tests. Secondly, swept frequency simulation and fixed frequency simulation are performed. The swept frequency simulation corresponds to the tooling sample test, and the last fixed frequency simulation is to evaluate the vibration reduction effect of the shock absorber.

[0067] This analysis process aims to carry out key parameter testing and equivalent model establishment in the development stage by combining simulation and testing. The equivalent model abandons the conventional refined analysis ideas and follows the principles of mass equivalence, position equivalence, and effective simplification of structures. It corrects and improves the comprehensive electronic system model, deletes unaffected components or areas, and reasonably simplifies structures that affect calculation efficiency. Key parameter tests include center of mass, moment of inertia, etc. These parameters can calibrate the simulation equivalent model and further improve the simulation model.

[0068] This analysis method studies the response of the shock absorber based on the equivalent model method. It significantly reduces the variables in the analysis system by eliminating irrelevant influencing factors. For physical quantities that affect the finite element simulation analysis results, such as contact form, preload, and damping ratio, the simulation parameters are iteratively corrected using test data to improve the accuracy of the simulation model. At the same time, the results of the finite element simulation can be compared with the measured data of the shock absorber to determine its compatibility with the integrated electronic system.

[0069] This analysis method combines numerical simulation methods with tests in the product development stage to achieve performance estimation analysis of the shock absorber. Unlike the traditional method of relying solely on tests to judge the performance and applicability of the shock absorber, this method not only has mathematical basic theories to avoid the blindness of relying solely on tests, but also takes into account engineering practicality to avoid the idealized analysis model being out of touch with reality. It has strong engineering operability and plays a positive role in improving the environmental adaptability of integrated electronic systems.

[0070] In yet another embodiment of the present invention, a comprehensive electronic system shock absorber equivalent simulation analysis system is provided, comprising a model building module, a model optimization module, a parameter correction module and a simulation analysis module, wherein: Model construction module: used to equivalently simplify the internal devices of the integrated electronic system and measure the quality parameters, and construct a finite element simulation model; Model optimization module: used to optimize the established finite element simulation model by considering contact settings and constitutive settings; Parameter correction module: test and compare the optimized finite element simulation model for verification, correct the simulation parameters, and complete the further optimization of the finite element simulation model; Simulation analysis module: combine the sensitive frequency of the working environment of the integrated electronic system, and use the optimized finite element simulation model to simulate and analyze the vibration damping effect of the shock absorber.

[0071] The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited thereto. Within the scope of the technical concept of the present invention, various simple modifications can be made to the technical solutions of the present invention, including any other suitable combination of each technical feature. These simple modifications and combinations should also be regarded as the content disclosed by the present invention and fall within the protection scope of the present invention.

Claims

1. A comprehensive electronic system shock absorber equivalent simulation analysis method, characterized in that: The following steps are involved: Carry out equivalent simplification and quality parameter measurement of the internal components of the integrated electronic system and build a finite element simulation model; Considering the contact settings and constitutive settings, the established finite element simulation model is optimized; Test and compare the optimized finite element simulation model, modify the simulation parameters, and further optimize the finite element simulation model; Combined with the sensitive frequency of the working environment of the integrated electronic system, the vibration reduction effect of the shock absorber is simulated and analyzed using the optimized finite element simulation model.

2. The equivalent simulation analysis method for a comprehensive electronic system shock absorber according to claim 1 is characterized in that: The equivalent simplification of the internal components of the integrated electronic system is divided into simplification of non-impact components and simplification of repair of large-mass components.

3. The equivalent simulation analysis method for a comprehensive electronic system shock absorber according to claim 2 is characterized in that: The operation of simplifying the non-impact device is to directly delete the device, and the operation of repairing and simplifying the large-mass device is to ignore the small features inside the device, fill the internal space to form a regular entity, delete the mounting auxiliary structure of the device on the PCB, and use the repair filling function to fill the space left by the deletion.

4. The equivalent simulation analysis method for a comprehensive electronic system shock absorber according to claim 1 is characterized in that: The evaluation parameters of the mass parameter measurement include at least the center of mass and the moment of inertia.

5. The equivalent simulation analysis method for a comprehensive electronic system shock absorber according to claim 1 is characterized in that: The contact setting takes nonlinear contact factors into consideration and introduces the shock absorber prestress calculation based on the modal frequency analysis.

6. The method and system for equivalent simulation analysis of shock absorber of integrated electronic system according to claim 5, characterized in that: After the prestress calculation is completed, the result is used as the load boundary condition for modal analysis.

7. The equivalent simulation analysis method for a comprehensive electronic system shock absorber according to claim 1 is characterized in that: The constitutive setting is that the shock absorber selects one of the Neo-Hookean model, the Yeoh model and the Mooney-Rivlin model.

8. The equivalent simulation analysis method for a comprehensive electronic system shock absorber according to claim 1 is characterized in that: The process of testing, comparing and verifying the optimized finite element simulation model and correcting the simulation parameters is to use the test data of the test fixture sample to correct the parameters of the finite element simulation model; The parameter correction of the finite element simulation model includes contact relationship correction, constitutive model parameter fitting and damping ratio adjustment.

9. The equivalent simulation analysis method for a comprehensive electronic system shock absorber according to claim 8 is characterized in that: The damping ratio is determined as follows: In the simulation model, the initial value of the damping ratio is first given; Increase or decrease the damping ratio value according to a certain increment, perform frequency sweep simulation calculations under different working conditions, obtain the frequency response curves under different damping ratios, and compare them with the test curves; The least square method or genetic algorithm is used for optimization calculation. When comparing the frequency responses, the error interval between the simulation point and the test point is judged to be within 10%. If the errors of all frequency points are within this range, the optimization result is considered to be the optimal damping ratio.

10. A simulation analysis system based on the integrated electronic system shock absorber equivalent simulation analysis method according to claim 1, characterized in that: It includes model building module, model optimization module, parameter correction module and simulation analysis module, among which: Model building module: used to perform equivalent simplification and quality parameter measurement of the internal components of the integrated electronic system and build a finite element simulation model; Model optimization module: used to optimize the established finite element simulation model by considering contact settings and constitutive settings; Parameter correction module: Test, compare and verify the optimized finite element simulation model, correct the simulation parameters, and further optimize the finite element simulation model; Simulation analysis module: Combined with the sensitive frequency of the working environment of the integrated electronic system, the vibration reduction effect of the shock absorber is simulated and analyzed using the optimized finite element simulation model.

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