Micro-needle column radiator with bending connection structure

Abstract

The invention discloses a micro-needle column radiator with a bending connection structure. The micro-needle column radiator comprises at least one heat conducting plate and a plurality of micro-needle columns, the heat conducting plate has a first surface and a second surface opposite to each other. The first surface of the heat-conducting plate is connected with the plurality of microneedle columns, and the second surface of the heat-conducting plate is used for being connected with a heat source. The microneedle column is provided with a long extending section and a bent connecting section which are integrally connected, the included angle between the bent connecting section and the long extending section is 80-100 degrees, and the bent connecting section is connected to the first surface of the heat conducting plate in a horizontal lying mode. According to the micro-needle column radiator, the situation that protrusions needing to be ground are generated on the second surface of the heat conduction plate, and consequently the ultra-thin heat conduction plate deforms is avoided, and the bonding strength of the small micro-needle columns and the heat conduction plate can be improved.

Description

Technical Field

[0001] The present invention relates to a micro-pin fin heat sink, and more particularly to a micro-pin fin heat sink having a bent connection structure. Background Art

[0002] Currently, the requirements for micro-pin fin heat sinks in the market are getting higher and higher, especially for the joint strength and heat conduction performance. The Chinese invention patent (CN119677072A) provides a micro-pin fin heat sink, which enhances the joint strength by emitting a laser beam through the micro-pin fin joint surface (the first surface) of the heat conduction plate towards the heat source joint surface (the second surface) of the heat conduction plate to join the micro-pin fins. However, this method will generate protrusions on the second surface of the heat conduction plate. Therefore, it is necessary to grind the protrusions to avoid reducing the contact area with the heat source and affecting the heat conduction performance. However, grinding the protrusions will easily deform the extremely thin heat conduction plate, causing a dilemma. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a micro-pin fin heat sink with a bent connection structure in view of the deficiencies of the prior art.

[0004] An embodiment of the present invention provides a micro-pin fin heat sink with a bent connection structure, including: at least one heat conduction plate and a plurality of micro-pin fins; wherein, at least one of the heat conduction plates has a first surface and a second surface facing each other, the first surface of at least one of the heat conduction plates is connected to a plurality of the micro-pin fins, and the second surface of at least one of the heat conduction plates is used to connect to a heat source; wherein, at least one of the plurality of micro-pin fins has an integrally connected long-shaped extension section and a bent connection section, the included angle between the bent connection section and the long-shaped extension section is 80°-100°, and the bent connection section is connected to the first surface of the heat conduction plate in a lying manner.

[0005] In a preferred embodiment, the cross-sections of the plurality of micro-pin fins are respectively at least one of circular, oval, square, diamond, and water droplet shapes, and the distance between the two farthest endpoints on the cross-section of each micro-pin fin < 0.5 mm.

[0006] In a preferred embodiment, the height of at least one of the micro-pin fins > 3 mm, and at least one of the micro-pin fins is made of copper, copper alloy, aluminum, aluminum alloy, or copper-aluminum composite material.

[0007] In a preferred embodiment, at least one of the microneedle columns is made of aluminum or an aluminum alloy, and the composition of at least one of the microneedle columns by weight percentage includes: more than 99% Al (aluminum), less than 0.25% Si (silicon), less than 0.4% Fe (iron), less than 0.05% Cu (copper), less than 0.05% Mn (manganese), less than 0.05% Mg (magnesium), less than 0.05% Zn (zinc), less than 0.05% V (vanadium), less than 0.03% Ti (titanium), and less than 0.03% of a single impurity.

[0008] In a preferred embodiment, the bent connecting section of at least one of the microneedle columns is connected to the first surface of the heat conducting plate by ultrasonic welding, so that an ultrasonic welding part is generated between the bent connecting section of at least one of the microneedle columns and the first surface of the heat conducting plate.

[0009] In a preferred embodiment, the thickness of at least one of the heat conducting plates is < 0.5 mm, and at least one of the heat conducting plates is made of copper, a copper alloy, aluminum, an aluminum alloy, or a copper-aluminum composite material.

[0010] In a preferred embodiment, the material of at least one of the heat conducting plates is the same as the material of at least one of the microneedle columns.

[0011] In a preferred embodiment, the microneedle column heat sink having a bent connection structure further includes a plastic strengthening structure, and the plastic strengthening structure is in contact with at least one of the heat conducting plates and at least one of the microneedle columns at the same time.

[0012] In a preferred embodiment, a sheared inclined surface structure is formed at the upper end of the long extended section of at least one of the microneedle columns.

[0013] In a preferred embodiment, there are at least two or more of the heat conducting plates, and the first surface of each of the heat conducting plates is connected to the plurality of microneedle columns.

[0014] In a preferred embodiment, at least one of the heat conducting plates is one of a flat heat pipe or a vapor chamber having a hollow structure inside.

[0015] The beneficial effect of the present invention is that the microneedle columns of the microneedle column heat sink have an integrally connected long extended section and a bent connecting section, and the bent connecting section is connected to the first surface of the heat conducting plate in a lying manner. In this way, the bent connecting section of the microneedle column is connected to the first surface of the heat conducting plate in a lying manner, which not only does not generate a protrusion that needs to be polished on the second surface of the heat conducting plate, resulting in the deformation of the extremely thin heat conducting plate, but also can improve the bonding strength between the fine microneedle columns and the heat conducting plate.

[0016] To enable a further understanding of the features and technical content of the present invention, please refer to the following detailed description and diagrams of the present invention. However, the provided diagrams are only for reference and illustration and are not used to limit the present invention. Description of the Drawings

[0017] Figure 1 It is a schematic side view of the first embodiment of the micro-needle column heat sink.

[0018] Figure 2 It is Figure 1 an enlarged schematic view of part A in

[0019] Figure 3 It is a schematic view of the shape of the embodiment where the cross-section of the micro-needle column is circular.

[0020] Figure 4 It is a schematic view of the shape of the embodiment where the cross-section of the micro-needle column is oval.

[0021] Figure 5 It is a schematic view of the shape of the embodiment where the cross-section of the micro-needle column is square.

[0022] Figure 6 It is a schematic view of the shape of the embodiment where the cross-section of the micro-needle column is rhombic.

[0023] Figure 7 It is a schematic view of the shape of the embodiment where the cross-section of the micro-needle column is drop-shaped.

[0024] Figure 8 It is a schematic side view of the second embodiment of the micro-needle column heat sink.

[0025] Figure 9 It is a schematic side view of the third embodiment of the micro-needle column heat sink.

[0026] Figure 10 It is a schematic side view of the fourth embodiment of the micro-needle column heat sink.

[0027] Description of the reference numerals of the components: 10: heat conduction plate; 11: first surface; 12: second surface; 13: hollow structure; 20: micro-needle column; 21: elongated extension section; 211: inclined surface structure; 22: bent connection section; 23: ultrasonic welding part; 30: plastic reinforcement structure; 31: reinforcement side wall; 32: cross wall; 900: heat source; A, B: endpoints; L: laser beam. Detailed Description of the Embodiments

[0028] The following is to illustrate the implementation manners related to the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple schematic illustration and are not drawn according to actual dimensions, which is stated in advance. And the same or similar parts in the drawings are labeled with the same reference numerals. The following embodiments will further detail the related technical content of the present invention, but the disclosed content is not intended to limit the protection scope of the present invention. In addition, the term "or" used herein should be considered to include any one or a combination of more of the associated listed items depending on the actual situation.

[0029] [First Embodiment] Please refer to Figures 1 to 7 as shown, which is a specific embodiment of the present invention. The embodiment of the present invention provides a micro-pin fin heat sink with a bent connection structure. According to the micro-pin fin heat sink with a bent connection structure (hereinafter referred to as the micro-pin fin heat sink) provided by the embodiment of the present invention, it includes a heat conducting plate 10 and a plurality of micro-pin fins 20.

[0030] In this embodiment, the heat conducting plate 10 can be made of copper, copper alloy, aluminum, aluminum alloy, or copper-aluminum composite material, so that the heat conducting plate 10 is a bottom plate with high thermal conductivity. Further, the thickness of the heat conducting plate 10 is less than 0.5 mm, so that the heat conducting plate 10 is an extremely thin and high-thermal-conductivity bottom plate.

[0031] Furthermore, the heat conducting plate 10 has a first surface 11 and a second surface 12 facing each other. The first surface 11 of the heat conducting plate 10 is connected to the plurality of micro-pin fins 20, and the second surface 12 of the heat conducting plate 10 is used to contact a heat source 900 (such as a power chip).

[0032] In this embodiment, the plurality of micro-pin fins 20 are connected to the first surface 11 of the heat conducting plate 10, and the micro-pin fins 20 can be made of copper, copper alloy, aluminum, aluminum alloy, or copper-aluminum composite material, so that the micro-pin fins 20 are pin fins with high thermal conductivity.

[0033] Furthermore, each microneedle pillar 20 has an integrally connected elongated extension section 21 and a bent connection section 22. The included angle between the bent connection section 22 and the elongated extension section 21 of the microneedle pillar 20 is 80 to 100 degrees, and the bent connection section 22 of the microneedle pillar 20 is connected to the first surface 11 of the heat conducting plate 10 in a lying manner. In this way, the bent connection section 22 of the microneedle pillar 20 is connected to the first surface 11 of the heat conducting plate 10 in a lying manner. Compared with the method of emitting a laser beam through the first surface 11 towards the second surface 12 of the heat conducting plate 10 to connect the microneedle pillar 20, it will not generate protrusions that need to be ground on the second surface 12 of the heat conducting plate 10, resulting in deformation of the extremely thin heat conducting plate 10, and can also improve the bonding strength between the tiny microneedle pillars 20 and the heat conducting plate 10.

[0034] Furthermore, in order to form a better bond between the microneedle pillar 20 and the heat conducting plate 10, the microneedle pillar 20 and the heat conducting plate 10 are joined by ultrasonic welding. Further, because the bent connection section 22 of the microneedle pillar 20 lies on the first surface 11 of the heat conducting plate 10, it is convenient for the ultrasonic welding head to directly contact the bent connection section 22, and directly transfer the high-frequency vibration energy to the bent connection section 22, thereby generating an ultrasonic welding part 23 (as shown in Figure 2 ), thus forming a better bond.

[0035] In an embodiment, the cross-section of the elongated extension section 21 of the microneedle pillar 20 can be circular (as shown in Figure 3 ), oval (as shown in Figure 4 ), square (as shown in Figure 5 ), diamond-shaped (as shown in Figure 6 ), or drop-shaped (as shown in Figure 7 ). And, no matter which of the above shapes the cross-section of the elongated extension section 21 of the microneedle pillar 20 is, as shown in Figure 4 、 6 , the distance between the two farthest endpoints A and B on the cross-section of the elongated extension section 21 of the microneedle pillar 20 needs to be less than 0.5 mm to meet the requirements of microneedle formation. In addition, the height of the microneedle pillar 20 can be greater than 3 mm, up to 6 mm, so that the microneedle pillar 20 is in a high needle shape.

[0036] In one embodiment, the microneedle posts 20 may be made of aluminum or an aluminum alloy. Therefore, when the microneedle posts 20 are made of aluminum or an aluminum alloy, in order to increase the thermal conductivity and weldability of the microneedle posts 20, the composition of the microneedle posts 20 by weight percentage includes: more than 99% Al (aluminum), 0.25% or less Si (silicon), 0.4% or less Fe (iron), 0.05% or less Cu (copper), 0.05% or less Mn (manganese), 0.05% or less Mg (magnesium), 0.05% or less Zn (zinc), 0.05% or less V (vanadium), 0.03% or less Ti (titanium), and 0.03% or less of a single impurity (such as, but not limited to, bismuth, antimony, or lead).

[0037] In one embodiment, the material of the heat conducting plate 10 is the same as that of the microneedle posts 20. For example, both the heat conducting plate 10 and the microneedle posts 20 may be made of aluminum or an aluminum alloy, or both may be made of copper or a copper alloy.

[0038] In one embodiment, the material of the heat conducting plate 10 may be different from that of the microneedle posts 20. For example, the heat conducting plate 10 may be made of copper or a copper alloy, and the microneedle posts 20 may be made of aluminum or an aluminum alloy; or the heat conducting plate 10 may be made of aluminum or an aluminum alloy, and the microneedle posts 20 may be made of copper or a copper alloy; or the heat conducting plate 10 may be made of copper or a copper alloy, and at least one of the microneedle posts 20 corresponding to the position of the heat source 900 among the plurality of microneedle posts 20 is made of copper or a copper alloy, and the rest are made of aluminum or an aluminum alloy, which can reduce the material cost and improve the thermal conductivity at the same time.

[0039] In one embodiment, at the upper end of the elongated extension 21 of the microneedle post 20, that is, the end not connected to the corresponding bent connection section 22, a sheared inclined surface structure 211 is formed.

[0040] [Second Embodiment] Please refer to Figure 8 as shown, which is the second embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

[0041] In order to increase the overall structural strength of the extremely thin heat conducting plate 10 and the tiny microneedle posts 20, the microneedle heat sink provided in this embodiment further includes a plastic reinforcing structure 30. And the plastic reinforcing structure 30 is in contact with at least one heat conducting plate 10 and at least one microneedle post 20 at the same time.

[0042] Furthermore, the plastic reinforcing structure 30 has two reinforcing side walls 31 disposed opposite to each other, and a cross wall 32 connected between the two reinforcing side walls 31. The bottom surfaces of the two reinforcing side walls 31 contact the heat conducting plate 10, the bottom surface of the cross wall 32 contacts the micro-needle posts 20, and the inclined surface structure 211 formed at the upper ends of the micro-needle posts 20 further embeds into the bottom surface of the cross wall 32, which can further increase the overall structural strength.

[0043] [Third Embodiment] Please refer to Figure 9 shown, which is the third embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

[0044] The micro-needle post heat sink provided in this embodiment includes two heat conducting plates 10. And, the first surface 11 of each heat conducting plate 10 is connected to a plurality of micro-needle posts 20. Further, the first surface 11 of the lower heat conducting plate 10 is connected to the lower ends of the plurality of micro-needle posts 20, and the first surface 11 of the upper heat conducting plate 10 is connected to the upper ends of the plurality of micro-needle posts 20. And, the second surface 12 of the lower heat conducting plate 10 is connected to a heat source 900, and the second surface 12 of the upper heat conducting plate 10 is not connected to any heat source, so as to simply improve the heat dissipation capacity. Since the second surface 12 of the upper heat conducting plate 10 is not connected to any heat source, a laser beam L can be emitted towards the second surface 12 of the upper heat conducting plate 10, so as to pass through the first surface 11 of the upper heat conducting plate 10 and enter the micro-needle posts 20, and then the first surface 11 of the upper heat conducting plate 10 and the upper ends of the micro-needle posts 20 can be joined by laser welding.

[0045] [Fourth Embodiment] Please refer to Figure 10 shown, which is the fourth embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

[0046] The heat conducting plate 10 of this embodiment can be a flat heat pipe or a vapor chamber having a hollow structure 13 inside, that is, the heat conducting plate 10 itself can be a flat heat pipe or a vapor chamber, and its first surface 11 and second surface 12 are the opposite outer sides of the flat heat pipe or the vapor chamber.

[0047] As described above, the micro-needle column heat sink with a bending connection structure provided by the present invention includes a heat conduction plate 10 and a plurality of micro-needle columns 20. The heat conduction plate 10 has a first surface 11 and a second surface 12 facing away from each other. The first surface 11 of the heat conduction plate 10 is connected to the plurality of micro-needle columns 20, and the second surface 12 of the heat conduction plate 10 is used to be connected to a heat source 900. At least one of the plurality of micro-needle columns 20 has an integrally connected long-shaped extension section 21 and a bending connection section 22. The included angle between the bending connection section 22 and the long-shaped extension section 21 is 80 to 100 degrees, and the bending connection section 22 is connected to the first surface 11 of the heat conduction plate 10 in a lying manner. Thus, the bending connection section 22 of the micro-needle column 20 is connected to the first surface 11 of the heat conduction plate 10 in a lying manner, which not only does not generate a protrusion that needs to be ground on the second surface 12 of the heat conduction plate 10, resulting in deformation of the extremely thin heat conduction plate 10, but also can improve the bonding strength between the fine micro-needle columns 20 and the heat conduction plate 10.

[0048] The content disclosed above is only a preferred and feasible embodiment of the present invention, and does not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the content of the specification and drawings of the present invention are included in the scope of the patent application of the present invention. The content disclosed above is only a preferred and feasible embodiment of the present invention, and does not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the content of the specification and drawings of the present invention are included in the scope of the patent application of the present invention.

Claims

1. A micro-needle column heat sink with a bent connection structure, comprising at least one heat conducting plate and a plurality of micro-needle columns; wherein: At least one of the heat conducting plates has a first surface and a second surface facing each other, the first surface of at least one of the heat conducting plates is connected to a plurality of the microneedle columns, and the second surface of at least one of the heat conducting plates is used to connect to a heat source; it is characterized in that: at least one of the plurality of microneedle columns has an elongated extension section and a bent connection section integrally connected, the angle between the bent connection section and the elongated extension section is 80 to 100 degrees, and the bent connection section is connected to the first surface of the heat conducting plate in a horizontal manner.

2. The micro-needle column heat sink with a bent connection structure according to claim 1, characterized in that: The cross-sections of the plurality of microneedle columns are at least one of circular, elliptical, square, diamond, and teardrop-shaped, and the distance between the two farthest endpoints on the cross-section of each microneedle column is less than 0.5 mm.

3. The micro-needle column heat sink with a bent connection structure according to claim 1, characterized in that: The height of at least one of the microneedle columns is greater than 3 mm, and at least one of the microneedle columns is made of copper, copper alloy, aluminum, aluminum alloy, or copper-aluminum composite material.

4. The micro-needle column heat sink with a bent connection structure according to claim 1, characterized in that: At least one of the microneedle columns is made of aluminum or an aluminum alloy, and the composition of at least one of the microneedle columns includes, by weight percentage: more than 99% Al, less than 0.25% Si, less than 0.4% Fe, less than 0.05% Cu, less than 0.05% Mn, less than 0.05% Mg, less than 0.05% Zn, less than 0.05% V, less than 0.03% Ti, and less than 0.03% of a single impurity.

5. The micro-needle column heat sink with a bent connection structure according to claim 1, characterized in that: At least one bending connection section of the microneedle column is connected to the first surface of the heat conducting plate by ultrasonic welding, so that an ultrasonic welding portion is generated between the bending connection section of the microneedle column and the first surface of the heat conducting plate.

6. The micro-needle column heat sink with a bent connection structure according to claim 1, characterized in that: The thickness of at least one of the heat conducting plates is less than 0.5 mm, and at least one of the heat conducting plates is made of copper, copper alloy, aluminum, aluminum alloy, or copper-aluminum composite material.

7. The micro-needle column heat sink with a bent connection structure according to claim 1, characterized in that: The material of at least one of the heat conducting plates is the same as the material of at least one of the microneedle columns.

8. The micro-needle column heat sink with a bent connection structure according to claim 1, characterized in that: It also includes a plastic reinforcement structure, which is in contact with at least one of the heat conducting plates and at least one of the micro-needle columns.

9. The micro-needle column heat sink with a bent connection structure according to claim 1, characterized in that: A shearing inclined surface structure is formed on the upper end of at least one of the elongated extension sections of the microneedle column.

10. The micro-needle column heat sink with a bent connection structure according to claim 1, characterized in that: There are at least two heat conducting plates, and the first surface of each heat conducting plate is connected to the plurality of micro-needle columns.

11. The micro-needle column heat sink with a bent connection structure according to claim 1, characterized in that: At least one of the heat conducting plates is a flat heat pipe or a heat spreader with a hollow structure inside.

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