Micro-needle column heat sink with a bent connection structure

Abstract

The present invention discloses a micro-needle column heat sink with a bent connection structure, which includes at least one heat conduction plate and a plurality of micro-needle columns. The heat conduction plate has a first surface and a second surface facing away from each other. The first surface of the heat conduction plate is connected to the plurality of micro-needle columns, and the second surface of the heat conduction plate is used for connection with a heat source. The micro-needle column has an integrally connected long-shaped extension section and a bent connection section, and the included angle between the bent connection section and the long-shaped extension section is 80 to 100 degrees, and the bent connection section is connected to the first surface of the heat conduction plate in a lying manner. The micro-needle column heat sink will not generate protrusions that need to be ground on the second surface of the heat conduction plate, resulting in deformation of the extremely thin heat conduction plate, and can also improve the bonding strength between the fine micro-needle columns and the heat conduction plate.

Description

Technical Field

[0001] The present invention relates to a micro-needle column heat sink, and more particularly to a micro-needle column heat sink having a bent connection structure. Background Art

[0002] Currently, the requirements for micro-needle column heat sinks in the market are getting higher and higher, especially for the joint strength and thermal conductivity. The Chinese invention patent (CN119677072A) provides a micro-needle column heat sink, which enhances the joint strength by emitting a laser beam towards the heat source joint surface (the second surface) of its heat conducting plate through the micro-needle column joint surface (the first surface) of the heat conducting plate to join the micro-needle columns. However, this method will generate protrusions on the second surface of the heat conducting plate. Therefore, it is necessary to grind the protrusions to avoid reducing the contact area with the heat source and affecting the thermal conductivity. However, grinding the protrusions will make the extremely thin heat conducting plate extremely easy to deform, causing a dilemma. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a micro-needle column heat sink with a bent connection structure in view of the deficiencies of the prior art.

[0004] An embodiment of the present invention provides a micro-needle column heat sink with a bent connection structure, including: at least one heat conducting plate and a plurality of micro-needle columns; wherein, at least one of the heat conducting plates has a first surface and a second surface facing each other, the first surface of at least one of the heat conducting plates is connected to the plurality of micro-needle columns, and the second surface of at least one of the heat conducting plates is used to connect to a heat source; wherein, at least one of the plurality of micro-needle columns has an integrally connected long-shaped extension section and a bent connection section, the included angle between the bent connection section and the long-shaped extension section is 80-100 degrees, and the bent connection section is connected to the first surface of the heat conducting plate in a lying manner.

[0005] In a preferred embodiment, the cross-sections of the plurality of micro-needle columns are respectively at least one of circular, oval, square, diamond, and water-drop shape, and the distance between the two farthest endpoints on the cross-section of each micro-needle column < 0.5 mm.

[0006] In a preferred embodiment, the height of at least one of the micro-needle columns > 3 mm, and at least one of the micro-needle columns is made of copper, copper alloy, aluminum, aluminum alloy, or copper-aluminum composite material.

[0007] In a preferred embodiment, at least one of the micro-needle columns is made of aluminum or an aluminum alloy, and the composition of at least one of the micro-needle columns by weight percentage includes: more than 99% of Al (aluminum), less than 0.25% of Si (silicon), less than 0.4% of Fe (iron), less than 0.05% of Cu (copper), less than 0.05% of Mn (manganese), less than 0.05% of Mg (magnesium), less than 0.05% of Zn (zinc), less than 0.05% of V (vanadium), less than 0.03% of Ti (titanium), and less than 0.03% of a single impurity.

[0008] In a preferred embodiment, the bent connecting section of at least one of the micro-needle columns is connected to the first surface of the heat conducting plate by ultrasonic welding, so that an ultrasonic welding part is generated between the bent connecting section of at least one of the micro-needle columns and the first surface of the heat conducting plate.

[0009] In a preferred embodiment, the thickness of at least one of the heat conducting plates < 0.5 mm, and at least one of the heat conducting plates is made of copper, a copper alloy, aluminum, an aluminum alloy, or a copper-aluminum composite material.

[0010] In a preferred embodiment, the material of at least one of the heat conducting plates is the same as the material of at least one of the micro-needle columns.

[0011] In a preferred embodiment, the micro-needle column heat sink with a bent connection structure further includes a plastic strengthening structure, and the plastic strengthening structure is in contact with at least one of the heat conducting plates and at least one of the micro-needle columns at the same time.

[0012] In a preferred embodiment, a sheared inclined surface structure is formed at the upper end of the long-shaped extension section of at least one of the micro-needle columns.

[0013] In a preferred embodiment, there are at least two or more of the heat conducting plates, and the first surface of each of the heat conducting plates is connected to the plurality of micro-needle columns.

[0014] In a preferred embodiment, at least one of the heat conducting plates is one of a flat heat pipe or a vapor chamber with a hollow structure inside.

[0015] The beneficial effects of the present invention are as follows: The micro-needle columns of the micro-needle column heat sink have an integrally connected long-shaped extension section and a bent connection section, and the bent connection section is connected to the first surface of the heat conducting plate in a lying manner. In this way, the bent connection section of the micro-needle column is connected to the first surface of the heat conducting plate in a lying manner, which not only does not generate a protrusion that needs to be ground on the second surface of the heat conducting plate, resulting in the deformation of the extremely thin heat conducting plate, but also can improve the bonding strength between the fine micro-needle columns and the heat conducting plate.

[0016] To enable a further understanding of the features and technical content of the present invention, please refer to the following detailed description and diagrams of the present invention. However, the provided diagrams are only for reference and illustration, and are not used to limit the present invention. Description of the Drawings

[0017] Figure 1 Schematic side view of the first embodiment of the micro-needle column heat sink.

[0018] Figure 2 For Figure 1 Enlarged schematic view of part A in

[0019] Figure 3 Schematic view of the shape of the micro-needle column in the embodiment where the cross-section of the micro-needle column is circular.

[0020] Figure 4 Schematic view of the shape of the micro-needle column in the embodiment where the cross-section of the micro-needle column is oval.

[0021] Figure 5 Schematic view of the shape of the micro-needle column in the embodiment where the cross-section of the micro-needle column is square.

[0022] Figure 6 Schematic view of the shape of the micro-needle column in the embodiment where the cross-section of the micro-needle column is rhombic.

[0023] Figure 7 Schematic view of the shape of the micro-needle column in the embodiment where the cross-section of the micro-needle column is drop-shaped.

[0024] Figure 8 Schematic side view of the second embodiment of the micro-needle column heat sink.

[0025] Figure 9 Schematic side view of the third embodiment of the micro-needle column heat sink.

[0026] Figure 10 Schematic side view of the fourth embodiment of the micro-needle column heat sink.

[0027] Explanation of the reference numerals of the components: 10: heat conducting plate; 11: first surface; 12: second surface; 13: hollow structure; 20: micro-needle column; 21: elongated extension section; 211: inclined surface structure; 22: bent connecting section; 23: ultrasonic welding part; 30: plastic strengthening structure; 31: strengthening side wall; 32: cross wall; 900: heat source; A, B: end points; L: laser beam. Detailed Description of the Preferred Embodiments

[0028] The following is to illustrate the related implementation manners of the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. Additionally, the drawings of the present invention are only for simple schematic illustration and are not drawn according to actual dimensions, which is stated in advance. And the same or similar parts in the drawings are labeled with the same reference numerals. The following embodiments will further detail the related technical content of the present invention, but the disclosed content is not used to limit the protection scope of the present invention. Additionally, the term "or" used herein should, depending on the actual situation, possibly include any one or a combination of more of the associated listed items.

[0029] [First Embodiment]

[0030] Please refer to Figures 1 to 7 as shown, which is a specific embodiment of the present invention. The embodiment of the present invention provides a micro-needle column heat sink with a bent connection structure. According to the micro-needle column heat sink with a bent connection structure (hereinafter referred to as the micro-needle column heat sink) provided by the embodiment of the present invention, it includes a heat conduction plate 10 and a plurality of micro-needle columns 20.

[0031] In this embodiment, the heat conduction plate 10 can be made of copper, copper alloy, aluminum, aluminum alloy, or copper-aluminum composite material, so that the heat conduction plate 10 is a bottom plate with high thermal conductivity. Further, the thickness of the heat conduction plate 10 is less than 0.5 mm, so that the heat conduction plate 10 is an extremely thin and high-thermal-conductivity bottom plate.

[0032] Furthermore, the heat conduction plate 10 has a first surface 11 and a second surface 12 facing each other. The first surface 11 of the heat conduction plate 10 is connected to the plurality of micro-needle columns 20, and the second surface 12 of the heat conduction plate 10 is used to contact a heat source 900 (such as a power chip).

[0033] In this embodiment, the plurality of micro-needle columns 20 are connected to the first surface 11 of the heat conduction plate 10, and the micro-needle columns 20 can be made of copper, copper alloy, aluminum, aluminum alloy, or copper-aluminum composite material, so that the micro-needle columns 20 are needle columns with high thermal conductivity.

[0034] Furthermore, each microneedle pillar 20 has an integrally connected elongated extension section 21 and a bent connection section 22. The included angle between the bent connection section 22 and the elongated extension section 21 of the microneedle pillar 20 is 80° - 100°, and the bent connection section 22 of the microneedle pillar 20 is connected to the first surface 11 of the heat conducting plate 10 in a lying manner. In this way, the bent connection section 22 of the microneedle pillar 20 is connected to the first surface 11 of the heat conducting plate 10 in a lying manner. Compared with the method of emitting a laser beam through the first surface 11 towards the second surface 12 of the heat conducting plate 10 to connect the microneedle pillar 20, not only will no protrusions that need to be ground be generated on the second surface 12 of the heat conducting plate 10, which may cause deformation of the extremely thin heat conducting plate 10, but also the bonding strength between the tiny microneedle pillar 20 and the heat conducting plate 10 can be improved.

[0035] Furthermore, in order to form a better bond between the microneedle pillar 20 and the heat conducting plate 10, the microneedle pillar 20 and the heat conducting plate 10 are joined by ultrasonic welding. Further, because the bent connection section 22 of the microneedle pillar 20 lies on the first surface 11 of the heat conducting plate 10, it is convenient for the ultrasonic welding head to directly contact the bent connection section 22, and the high-frequency vibration energy can be directly transmitted to the bent connection section 22, thereby generating an ultrasonic welding part 23 (as Figure 2 shown in the figure) between the bent connection section 22 of the microneedle pillar 20 and the first surface 11 of the heat conducting plate 10, thus forming a better bond.

[0036] In an embodiment, the cross-section of the elongated extension section 21 of the microneedle pillar 20 can be circular (as Figure 3 shown in the figure), oval (as Figure 4 shown in the figure), square (as Figure 5 shown in the figure), rhombus (as Figure 6 shown in the figure), or drop-shaped (as Figure 7 shown in the figure). And, regardless of which of the above shapes the cross-section of the elongated extension section 21 of the microneedle pillar 20 is, as Figure 4 , 6 shown in the figure, the distance between the two farthest endpoints A and B on the cross-section of the elongated extension section 21 of the microneedle pillar 20 needs to be less than 0.5 mm to meet the requirement of microneedle formation. In addition, the height of the microneedle pillar 20 can be greater than 3 mm, up to 6 mm, so that the microneedle pillar 20 is in the shape of a high needle.

[0037] In one embodiment, the microneedle posts 20 can be made of aluminum or aluminum alloy. Therefore, when the microneedle posts 20 are made of aluminum or aluminum alloy, in order to increase the thermal conductivity and weldability of the microneedle posts 20, the composition of the microneedle posts 20 by weight percentage includes: more than 99% Al (aluminum), 0.25% or less Si (silicon), 0.4% or less Fe (iron), 0.05% or less Cu (copper), 0.05% or less Mn (manganese), 0.05% or less Mg (magnesium), 0.05% or less Zn (zinc), 0.05% or less V (vanadium), 0.03% or less Ti (titanium), and 0.03% or less of a single impurity (such as, but not limited to, bismuth, antimony, or lead).

[0038] In one embodiment, the material of the heat conducting plate 10 is the same as that of the microneedle posts 20. For example, both the heat conducting plate 10 and the microneedle posts 20 can be made of aluminum or aluminum alloy, or both can be made of copper or copper alloy.

[0039] In one embodiment, the material of the heat conducting plate 10 and the material of the microneedle posts 20 can be different. For example, the heat conducting plate 10 can be made of copper or copper alloy, and the microneedle posts 20 can be made of aluminum or aluminum alloy; or the heat conducting plate 10 can be made of aluminum or aluminum alloy, and the microneedle posts 20 can be made of copper or copper alloy; or the heat conducting plate 10 can be made of copper or copper alloy, and at least one of the microneedle posts 20 corresponding to the position of the heat source 900 among the plurality of microneedle posts 20 is made of copper or copper alloy, and the rest are made of aluminum or aluminum alloy, which can reduce the material cost and improve the thermal conductivity at the same time.

[0040] In one embodiment, at the upper end of the elongated extension 21 of the microneedle post 20, that is, the end not connected to the corresponding bent connection section 22, a sheared inclined surface structure 211 is formed.

[0041] [Second Embodiment]

[0042] Please refer to Figure 8 as shown, which is the second embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

[0043] In order to increase the overall structural strength of the extremely thin heat conducting plate 10 and the tiny microneedle posts 20, the microneedle heat sink provided in this embodiment further includes a plastic strengthening structure 30. And the plastic strengthening structure 30 is in contact with at least one heat conducting plate 10 and at least one microneedle post 20 at the same time.

[0044] Furthermore, the plastic reinforcement structure 30 has two reinforcing side walls 31 arranged oppositely, and a cross wall 32 connected between the two reinforcing side walls 31. The bottom surfaces of the two reinforcing side walls 31 contact the heat conducting plate 10, the bottom surface of the cross wall 32 contacts the micro-needle columns 20, and the inclined surface structure 211 formed at the upper ends of the micro-needle columns 20 further embeds into the bottom surface of the cross wall 32, which can further increase the overall structural strength.

[0045] [Third Embodiment]

[0046] Please refer to Figure 9 as shown. This is the third embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

[0047] The micro-needle column heat sink provided in this embodiment includes two heat conducting plates 10. And, the first surface 11 of each heat conducting plate 10 is connected to a plurality of micro-needle columns 20. Further, the first surface 11 of the lower heat conducting plate 10 is connected to the lower ends of the plurality of micro-needle columns 20, and the first surface 11 of the upper heat conducting plate 10 is connected to the upper ends of the plurality of micro-needle columns 20. And, the second surface 12 of the lower heat conducting plate 10 is connected to a heat source 900, and the second surface 12 of the upper heat conducting plate 10 is not connected to any heat source, so as to simply improve the heat dissipation capacity. Since the second surface 12 of the upper heat conducting plate 10 is not connected to any heat source, a laser beam L can be emitted toward the second surface 12 of the upper heat conducting plate 10, so as to pass through the first surface 11 of the upper heat conducting plate 10 and enter the micro-needle columns 20, and then the first surface 11 of the upper heat conducting plate 10 and the upper ends of the micro-needle columns 20 can be joined by laser welding.

[0048] [Fourth Embodiment]

[0049] Please refer to Figure 10 as shown. This is the fourth embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

[0050] The heat conducting plate 10 in this embodiment can be a flat heat pipe or a vapor chamber with a hollow structure 13 inside, that is, the heat conducting plate 10 itself can be a flat heat pipe or a vapor chamber, and its first surface 11 and second surface 12 are the opposite outer sides of the flat heat pipe or the vapor chamber.

[0051] In summary, the micro-pin fin heat sink with a bent connection structure provided by the present invention includes a heat conducting plate 10 and a plurality of micro-pin fins 20. The heat conducting plate 10 has a first surface 11 and a second surface 12 facing away from each other. The first surface 11 of the heat conducting plate 10 is connected to the plurality of micro-pin fins 20, and the second surface 12 of the heat conducting plate 10 is used to connect to a heat source 900. At least one micro-pin fin 20 among the plurality of micro-pin fins 20 has an integrally connected elongated extension section 21 and a bent connection section 22. The included angle between the bent connection section 22 and the elongated extension section 21 is 80 to 100 degrees, and the bent connection section 22 is connected to the first surface 11 of the heat conducting plate 10 in a lying manner. Thus, the bent connection section 22 of the micro-pin fin 20 is connected to the first surface 11 of the heat conducting plate 10 in a lying manner, which not only does not generate a protrusion that needs to be ground on the second surface 12 of the heat conducting plate 10 and cause deformation of the extremely thin heat conducting plate 10, but also can improve the bonding strength between the fine micro-pin fins 20 and the heat conducting plate 10.

[0052] The content disclosed above is only a preferred and feasible embodiment of the present invention, and does not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the content of the specification and drawings of the present invention are included in the scope of the patent application of the present invention. The content disclosed above is only a preferred and feasible embodiment of the present invention, and does not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the content of the specification and drawings of the present invention are included in the scope of the patent application of the present invention.

Claims

1. A micro-needle column heat sink with a bent connection structure, comprising at least one heat conduction plate and a plurality of micro-needle columns; wherein, At least one of the heat conducting plates has a first surface and a second surface facing away from each other. The first surface of at least one of the heat conducting plates is connected to a plurality of the micro-needle columns, and the second surface of at least one of the heat conducting plates is used to be connected to a heat source. It is characterized in that at least one of the plurality of micro-needle columns has an integrally connected long-shaped extension section and a bent connection section, the included angle between the bent connection section and the long-shaped extension section is 80 to 100 degrees, and the bent connection section is connected to the first surface of the heat conducting plate in a lying manner. At least one of the bent connection sections of the micro-needle columns is connected to the first surface of the heat conducting plate by ultrasonic welding, so that an ultrasonic welding part is generated between the bent connection section of at least one of the micro-needle columns and the first surface of the heat conducting plate, and a sheared inclined surface structure is formed at the upper end of the long-shaped extension section of at least one of the micro-needle columns.

2. The micro-needle column heat sink with a bent connection structure according to claim 1, characterized in that: The cross-sections of the plurality of micro-needle columns are respectively at least one of circular, elliptical, square, rhombic, and water-drop-shaped, and the distance between the two farthest end points on the cross-section of each micro-needle column < 0.5 mm.

3. The micro-needle column heat sink with a bent connection structure according to claim 1, characterized in that: The height of at least one of the micro-needle columns > 3 mm, and at least one of the micro-needle columns is made of copper, copper alloy, aluminum, aluminum alloy, or copper-aluminum composite material.

4. The micro-needle column heat sink with a bent connection structure according to claim 1, wherein: At least one of the micro-needle columns is made of aluminum or aluminum alloy, and the components of at least one of the micro-needle columns by weight percentage include: more than 99% of Al, less than 0.25% of Si, less than 0.4% of Fe, less than 0.05% of Cu, less than 0.05% of Mn, less than 0.05% of Mg, less than 0.05% of Zn, less than 0.05% of V, less than 0.03% of Ti, and less than 0.03% of a single impurity.

5. The micro-needle column heat sink with a bent connection structure according to claim 1, characterized in that: The thickness of at least one of the heat conducting plates < 0.5 mm, and at least one of the heat conducting plates is made of copper, copper alloy, aluminum, aluminum alloy, or copper-aluminum composite material.

6. The micro-needle column heat sink with a bent connection structure according to claim 1, wherein: The material of at least one of the heat conducting plates is the same as the material of at least one of the micro-needle columns.

7. The micro-needle column heat sink with a bent connection structure according to claim 1, wherein: It further includes a plastic strengthening structure, and the plastic strengthening structure is in contact with at least one of the heat conducting plates and at least one of the micro-needle columns at the same time.

8. The micro-needle column heat sink with a bending connection structure according to claim 1, characterized in that: There are at least two or more of the heat conducting plates, and the first surface of each heat conducting plate is connected to the plurality of micro-needle columns.

9. The micro-needle column heat sink with a bent connection structure according to claim 1, characterized in that: At least one of the heat conducting plates is one of a flat heat pipe or a vapor chamber with a hollow structure inside.

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