Enameled wire preparation method

Abstract

The invention is applicable to the technical field of enameled wire preparation, and particularly relates to an enameled wire preparation method which comprises the following steps: detecting starting information of an enameled wire preparation device; preparing parameters in the current preparing device are obtained based on the starting information, the preparing parameters in the current preparing device are evaluated and analyzed, and evaluation result information is obtained; preparing the enameled wire under the condition that the evaluation state indicated by the evaluation result information is that the evaluation state is satisfied, and obtaining preparation difference information; wherein the preparation difference information is used for reflecting defect conditions occurring when the enameled wire is prepared; correcting according to the defect condition indicated by the preparation difference information to obtain corrected preparation information; wherein the corrected preparation information is used for indicating the corrected parameters of the preparation device, and the enameled wire is prepared by using the corrected preparation parameters of the preparation device. According to the enameled wire preparation method provided by the invention, defect accumulation during continuous production can be prevented, so that the error rate is reduced.

Description

Technical Field

[0001] This application belongs to the technical field of enameled wire preparation, and particularly relates to a method for preparing enameled wire. Background Art

[0002] Enameled wire is also called enameled copper wire or enameled iron wire; enameled wire is a wire used in electrical and electronic equipment, and its outer layer is covered with a layer of insulating paint or resin, usually polyurethane paint or epoxy resin paint.

[0003] In the related art, the method for preparing enameled wire usually starts production directly without evaluating the current device parameters after startup. Deviation of the parameters from the standard results in defective products. If the parameters change during the preparation process but are not detected and corrected in time, defect accumulation occurs during continuous production, with low efficiency and high error rate. Summary of the Invention

[0004] The embodiment of this application provides a method for preparing enameled wire, which can solve the problems of product defects caused by unstable and inaccurate parameters in the startup stage and the inability to detect and correct parameters in time.

[0005] In a first aspect, the embodiment of this application provides a method for preparing enameled wire, including:

[0006] Detecting the startup information of the enameled wire preparation device; wherein, the startup information is used to indicate the startup instruction of the preparation device;

[0007] Based on the startup information, obtaining the preparation parameters in the current preparation device, and evaluating and analyzing the preparation parameters in the current preparation device to obtain evaluation result information; wherein, the evaluation result information is used to indicate the evaluation status obtained after evaluating according to the preparation parameters in the current preparation device, and the evaluation status includes a satisfied evaluation status and an unsatisfied evaluation status;

[0008] When the evaluation status indicated by the evaluation result information is a satisfied evaluation status, preparing enameled wire to obtain preparation difference information; wherein, the preparation difference information is used to reflect the defect situation that occurs when preparing enameled wire;

[0009] According to the defect situation indicated by the preparation difference information, making corrections to obtain corrected preparation information; wherein, the corrected preparation information is used to indicate the parameters of the preparation device after correction, and using the preparation parameters of the corrected preparation device to prepare enameled wire.

[0010] The enameled wire preparation method provided by this application can obtain the working status of the preparation device in a timely manner by detecting the startup information of the enameled wire preparation device. Further, based on the startup information, a detailed evaluation and analysis of the preparation parameters in the current preparation device is carried out, so that the enameled wire can be prepared when the parameters are stable and meet the production requirements, which can reduce the product defect problems caused by unstable parameters. At the same time, when the evaluation status indicated by the evaluation result information meets the evaluation status, the enameled wire is prepared to obtain the preparation difference information, reducing the situation where the preparation device directly starts production without evaluating the current equipment parameters after startup, resulting in defective products due to parameter deviation from the standard. By real-time monitoring and analyzing the difference information that appears during the preparation process, the problems existing in the preparation link can be quickly located, and the preparation parameters can be corrected in a timely manner according to the difference situation, thereby improving the stability and consistency of the product during continuous production, preventing the accumulation of defects during continuous production, not only improving production efficiency but also reducing the error rate.

[0011] In a second aspect, an embodiment of this application provides an enameled wire preparation system, including:

[0012] A detection unit for detecting the startup information of the enameled wire preparation device; wherein, the startup information is used to indicate the startup instruction of the preparation device;

[0013] An evaluation unit for obtaining the preparation parameters in the current preparation device based on the startup information, and performing an evaluation and analysis on the preparation parameters in the current preparation device to obtain evaluation result information; wherein, the evaluation result information is used to indicate the evaluation status obtained after evaluating according to the preparation parameters in the current preparation device, and the evaluation status includes a status of meeting the evaluation status and a status of not meeting the evaluation status;

[0014] A result unit for preparing the enameled wire when the evaluation status indicated by the evaluation result information meets the evaluation status to obtain preparation difference information; wherein, the preparation difference information is used to reflect the defect situation that appears when preparing the enameled wire;

[0015] A correction unit for correcting according to the defect situation indicated by the preparation difference information to obtain corrected preparation information; wherein, the corrected preparation information is used to indicate the parameters of the preparation device after correction, and the enameled wire is prepared using the preparation parameters of the corrected preparation device.

[0016] In a third aspect, an embodiment of this application provides an enameled wire preparation device, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the computer program is executed by the processor, it implements the method according to any one of the first aspects described above.

[0017] Fourthly, an embodiment of the present application provides a computer program product. When the computer program product runs on an enameled wire preparation device, the enameled wire preparation device is enabled to execute the enameled wire preparation method described in any one of the above first aspects.

[0018] It can be understood that for the beneficial effects of the above second to fourth aspects, reference can be made to the relevant descriptions in the above first aspect, which will not be elaborated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0020] Figure 1 is a schematic flowchart of an enameled wire preparation method provided by an embodiment of the present application;

[0021] Figure 2 is a schematic flowchart of the implementation of step S100 in the enameled wire preparation method provided by an embodiment of the present application;

[0022] Figure 3 is a schematic flowchart of the implementation of step S130 in the enameled wire preparation method provided by an embodiment of the present application;

[0023] Figure 4 is a schematic flowchart of the implementation of step S133 in the enameled wire preparation method provided by an embodiment of the present application;

[0024] Figure 5 is a schematic flowchart of the implementation of step S200 in the enameled wire preparation method provided by an embodiment of the present application;

[0025] Figure 6 is a schematic flowchart of the implementation of step S300 in the enameled wire preparation method provided by an embodiment of the present application;

[0026] Figure 7 is a schematic flowchart of the implementation of step S400 in the enameled wire preparation method provided by an embodiment of the present application;

[0027] Figure 8 is a schematic flowchart of the implementation of step S440 in the enameled wire preparation method provided by an embodiment of the present application;

[0028] Figure 9 is a schematic structural diagram of an enameled wire preparation system provided by an embodiment of the present application;

[0029] Figure 10It is a schematic structural diagram of a control device for an enameled wire manufacturing apparatus provided by an embodiment of the present application. Detailed implementation manners

[0030] In the following description, for the purpose of illustration rather than limitation, specific details such as specific system architectures, technologies, etc. are presented in order to thoroughly understand the embodiments of the present application. However, those skilled in the art should clearly understand that the present application can also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to avoid unnecessary details from interfering with the description of the present application.

[0031] It should be understood that when used in the specification of the present application and the appended claims, the term "comprising" indicates the presence of the described features, wholes, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or their combinations.

[0032] It should also be understood that the term "and / or" used in the specification of the present application and the appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0033] As used in the specification of the present application and the appended claims, the term "if" can be interpreted as "when", "once", "in response to determining", or "in response to detecting" depending on the context. Similarly, the phrase "if determined" or "if detecting [the described condition or event]" can be interpreted as meaning "once determined", "in response to determining", "once detecting [the described condition or event]", or "in response to detecting [the described condition or event]" depending on the context.

[0034] In addition, in the description of the specification of the present application and the appended claims, the terms "first", "second", "third", etc. are only used for differentiating descriptions and cannot be understood as indicating or implying relative importance.

[0035] The reference to "one embodiment" or "some embodiments" etc. described in the specification of the present application means that a specific feature, structure, or characteristic described in connection with that embodiment is included in one or more embodiments of the present application. Thus, statements such as "in one embodiment", "in some embodiments", "in other some embodiments", "in still other embodiments", etc. that appear in different places in this specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in another way. The terms "comprising", "including", "having", and their variants all mean "including but not limited to", unless otherwise specifically emphasized in another way.

[0036] In the method for preparing enameled wires in the related art, production usually starts directly without evaluating the current device parameters after startup. Deviations of the parameters from the standards result in defective products. If the parameters change during the preparation process but are not detected and corrected in a timely manner, defect accumulation occurs during continuous production, leading to low efficiency and easy errors. To solve the above problems, an embodiment of the present application provides a method for preparing enameled wires.

[0037] In this method, the working state of the preparation device can be obtained in a timely manner by detecting the startup information of the enameled wire preparation device. Further, based on the startup information, a detailed evaluation and analysis of the preparation parameters in the current preparation device are carried out, so that the preparation of enameled wires can be carried out when the parameters are stable and meet the production requirements, which can reduce the problem of product defects caused by unstable parameters. At the same time, when the evaluation state indicated by the evaluation result information meets the evaluation state, the preparation of enameled wires is carried out to obtain preparation difference information. By monitoring and analyzing the difference information that appears during the preparation process in real time, the problems existing in the preparation link can be quickly located, and the preparation parameters can be corrected in a timely manner according to the difference situation, so as to improve the stability and consistency of the product during continuous production, prevent defect accumulation during continuous production, not only improve the production efficiency, but also reduce the error rate.

[0038] The method for preparing enameled wires provided by the embodiment of the present application can be applied to an enameled wire preparation device. At this time, the enameled wire preparation device is the execution subject of the method for preparing enameled wires provided by the embodiment of the present application. The embodiment of the present application does not impose any restrictions on the specific type of the enameled wire preparation device.

[0039] For example, the enameled wire preparation device includes a preparation device and a control device, and the preparation device and the control device are communicatively connected; wherein, the preparation device includes a wire feeding member, a painting member, a wire drawing member, and a drying member. Among them, the wire feeding member is used to wind the metal wire raw material, and as the preparation process progresses, the wire is gradually released to provide a continuous wire supply for subsequent processing; the painting member is used to atomize the paint liquid by high pressure through a spray head and spray it on the surface of the wire, and the casting coating head makes the paint liquid evenly cover the wire in a casting manner to ensure uniform coating of the insulating paint; the wire drawing machine is used to be drawn to the required diameter under the action of tension, and at the same time, the surface of the wire can be made smoother to improve the dimensional accuracy and surface quality of the wire; the drying member is used to generate high temperature by using heating elements (such as heating wires or heating sheets) to provide the heat required for the drying and curing of the insulating paint. The control device can be a console or a control panel in the control room, or can also be a terminal such as a mobile phone, a tablet computer, a notebook computer, a netbook, a desktop computer, a smart large screen, a computer, or a laptop computer.

[0040] To better understand the enameled wire preparation method provided by the embodiments of the present application, the following provides an exemplary introduction to the specific implementation process of the enameled wire preparation method provided by the embodiments of the present application.

[0041] Figure 1 The schematic flowchart of the enameled wire preparation method provided by the embodiments of the present application is shown. The enameled wire preparation method includes:

[0042] S100, detecting the startup information of the enameled wire preparation device; wherein, the startup information is used to indicate the startup instruction of the preparation device.

[0043] Exemplarily, the startup instruction indicated by detecting the startup information of the enameled wire preparation device can be achieved by installing sensors, such as photoelectric sensors, pressure sensors, or temperature sensors, etc. When the sensor detects that the change in a specific physical quantity reaches the set threshold, a signal will be generated, and this signal can be used as the startup instruction, thereby detecting the startup instruction of the preparation device.

[0044] In a possible implementation manner, please refer to Figure 2 , after S100, detecting the startup information of the enameled wire preparation device, it includes:

[0045] S110, obtaining the preparation information of the enameled wire in the preparation system; wherein, the preparation information includes the application information and specification information of the enameled wire, and there is at least one piece of preparation information.

[0046] It can be understood that the preparation system can be an order storage system established by staff for storing demand orders sent by customers or manufacturing tasks to be completed input by staff, etc., but is not limited thereto. There are multiple pieces of preparation information in the preparation system, and there are two types of information in each piece of preparation information. One is the application information and specification information of the enameled wire. The application information of the enameled wire can be the application field or application place, etc. (the demand for the enameled wire or the preparation conditions to be met in this application place or application field can be located according to the application place or application field). The specification information can be the diameter requirement of the enameled wire, the thickness of the paint surface, the error range, and the allowable range of defects, etc., but is not limited thereto.

[0047] Exemplarily, obtaining the preparation information of the enameled wire in the preparation system can be achieved by selecting the preparation information from the preparation system through the control platform or control panel in the workshop or by manually inputting the preparation information by technicians.

[0048] S120, when there is only one piece of preparation information of the enameled wire in the preparation system, using the preparation device to prepare the enameled wire according to the preparation information.

[0049] It can be understood that in the case of enameled wire preparation, if only one and only one enameled wire preparation information is obtained in the preparation system, the enameled wire can be prepared by the preparation device according to this one enameled wire preparation information.

[0050] S130. In the case where there are multiple enameled wire preparation information in the preparation system, determine the differences between the multiple preparation information.

[0051] It can be understood that the multiple preparation information can be 2 pieces of preparation information, 3 pieces of preparation information, 5 pieces of preparation information, 10 pieces of preparation information, 20 pieces of preparation information, etc., but not limited thereto.

[0052] Exemplarily, in the case of enameled wire preparation, if multiple preparation information is obtained in the preparation system, the application information and specification information in each preparation information are respectively extracted, and then the application information in each preparation information is compared, and the specification information in each preparation information is compared to obtain the differences between the application information and the differences between the specification information.

[0053] In a possible implementation manner, please refer to Figure 3 , S130. In the case where there are multiple enameled wire preparation information in the preparation system, determine the differences between the multiple preparation information, including:

[0054] S131. In the case where there are multiple enameled wire preparation information in the preparation system, respectively extract the application information included in each preparation information, and then perform a first analysis on the extracted application information to obtain multiple application difference information; wherein, the application difference information is used to indicate the differences between the usage places.

[0055] It can be understood that in the case where there are multiple pieces of enameled wire preparation information in the preparation system, the application information included in each piece of preparation information is extracted separately, and then the first analysis of the extracted application information can be to compare the differences between the extracted application information to obtain multiple application difference information. For example, there is a first application information and a second application information. The first application information is applied to transformer sites, and the second application information is applied to home appliance sites. Therefore, when the motor runs, it will generate a relatively high temperature and is in an environment such as being humid and dusty. Therefore, it is required that the enameled wire has good heat resistance, moisture resistance, and abrasion resistance to ensure stable insulation performance during long-term operation. The home appliance use environment is relatively mild, but the compatibility and aesthetics with other components need to be considered. It is required to have good flexibility to facilitate wiring and installation in a narrow space, and the surface should be smooth and free of burrs to avoid damaging other components. So the difference between the two is that during preparation, the first application information needs to meet the heat resistance, moisture resistance, and abrasion resistance, as well as the corresponding setting parameters on the preparation device. The second application information needs to meet the requirements of improving surface smoothness and aesthetics in addition to the basic electrical requirements, as well as the corresponding setting parameters on the preparation device. The heat resistance, moisture resistance, and abrasion resistance corresponding to the first application information and the surface smoothness and aesthetics corresponding to the second application information are the first difference (i.e., the requirement difference), and the parameters that need to be set on the preparation device that needs to be adjusted corresponding to the first application information and the parameters that need to be set on the preparation device that needs to be adjusted corresponding to the second application information are the second difference (i.e., the parameter adjustment difference). The first difference (i.e., the requirement difference) and the second difference (i.e., the parameter adjustment difference) are combined into application difference information.

[0056] S132. The specification information included in each piece of preparation information is extracted separately, and then the second analysis of the extracted specification information is performed to obtain multiple specification difference information; among them, the specification difference information is used to indicate the diameter difference and coating difference of the enameled wire.

[0057] It can be understood that, similar to the method of step S131 above, when there are multiple pieces of enameled wire preparation information in the preparation system, the specification information included in each piece of preparation information is extracted respectively, and then a second analysis of the extracted specification information can be to perform a difference comparison on the extracted specification information to obtain multiple specification difference information. For example, there is a first specification information and a second specification information. The first specification information is applied to the motor field, and the second specification information is applied to the home appliance field. So motors include small motors and industrial motors. Small motors may use enameled wire with a relatively thin wire diameter, such as about 0.5mm - 0.1mm; while large industrial motors use enameled wire with a relatively thick wire diameter to carry large currents, which may reach 2mm - 5mm, and large three-phase asynchronous motors in factories may use enameled wire with a wire diameter of more than 3mm. And for common household fans in the home appliance field, enameled wire with a wire diameter of 0.2 - 0.3mm may be used; so the diameter of the enameled wire is different, and the corresponding parameter settings are different. In addition, the insulation thickness in the motor field may be between 0.05mm - 0.2mm, specifically depending on the working voltage and use environment of the motor. For example, the insulation thickness of the enameled wire used in high-voltage motors may reach 0.15mm - 0.2mm; while the insulation thickness of the enameled wire of low-voltage motors is usually about 0.05mm - 0.1mm; in the home appliance field, the insulation thickness is relatively thin, usually between 0.03mm - 0.1mm. For example, the insulation thickness of the enameled wire in ordinary small household appliances may be only 0.03mm - 0.05mm; while for some home appliances with relatively large power and high safety requirements, such as air conditioners, etc., the insulation thickness of their enameled wire may be about 0.08mm - 0.1mm. So the insulation thickness is also different, and the setting sizes of the corresponding painting parameters are also different. Therefore, the insulation thickness and the wire diameter can be determined as specification difference information.

[0058] S133. Based on multiple application difference information and multiple specification difference information, determine the differences between multiple pieces of preparation information.

[0059] Exemplarily, by comparing the parameter setting corresponding to the difference in application information described in step S131 with the parameter setting corresponding to the difference in specification information in step S132, the differences between multiple preparation information can be obtained. For example, the comparison between the parameter setting corresponding to the difference in application information and the parameter setting corresponding to the difference in specification information can be exemplified. For example, the parameter setting for the first application information is A: 10, B, 20; the parameter setting for the second application information is A: 12, B, 18; then the difference in A is 10:12, the difference in B is 20:18, the parameter setting for the first specification information is C: 15, D: 17; the parameter setting for the second specification information is C: 7, D: 9; therefore, the difference in C is 15:7, the difference in D is 17:9, so the difference in application information A difference 10:12, B difference 20:18, and the difference in specification information C difference 15:7, D difference 17:9 are determined as the differences between the preparation information.

[0060] With such a setting, by performing difference analysis on the application information and specification information in multiple preparation information, the differences between different preparation information can be accurately grasped, thereby providing data support for subsequent fine-tuning of preparation parameters according to the difference situation. Difference analysis helps to quickly and accurately adjust the preparation parameters when continuously producing enameled wires of different specifications to meet the requirements of different preparation information.

[0061] In a possible implementation manner, please refer to Figure 4 , S133, based on multiple application difference information and multiple specification difference information, determine the differences between multiple preparation information, including:

[0062] S1331, respectively score the differences between the usage places indicated by multiple application difference information according to the place conditions to obtain multiple place difference information; wherein, the place difference information is used to indicate multiple satisfaction score values obtained after scoring according to the place conditions, and the place conditions are the usage places that the preparation device can satisfy.

[0063] It can be understood that the place conditions being the usage places that the preparation device can satisfy can be understood as the degree to which device A can satisfy in usage place B, that is, it can be 100% satisfaction (i.e., tailor-made), 80% satisfaction, 60% satisfaction, 30% satisfaction or 0, etc., but not limited to this.

[0064] S1332, respectively score the diameter difference and coating difference of the enameled wires indicated by multiple specification difference information according to the specification conditions to obtain multiple specification difference information; wherein, the specification difference information is used to indicate multiple satisfaction score values obtained after scoring according to the specification conditions, and the specification conditions are the diameter and coating state of the enameled wires that the preparation device can satisfy.

[0065] It can be understood that the specification conditions are the diameter of the enameled wire that the preparation device can meet and the coating state, which can be understood as the diameter and coating state stretched by device A; then, the diameter and coating state stretched by device A are scored, which can be obtained by comparing the diameter and coating state stretched by device A with the preset diameter and coating state, and the satisfaction score value is obtained according to the comparison result.

[0066] S1333. Determine the differences between multiple preparation information according to multiple site difference information and multiple specification difference information.

[0067] Exemplarily, integrate the multiple satisfaction score values indicated by the multiple site difference information and the multiple satisfaction score values indicated by the multiple specification difference information to determine the differences between multiple preparation information.

[0068] With such a setting, the matching degree of the preparation device for different preparation information can be understood more intuitively, so as to adjust the preparation parameters more precisely. Specifically, by scoring the site conditions and specification conditions, a quantitative satisfaction degree can be obtained, avoiding the error of subjective judgment and making the adjustment of the preparation parameters more accurate. At the same time, integrating the site difference information and the specification difference information can consider the differences between the preparation information more comprehensively, so that the enameled wire prepared can meet the requirements of different application sites and specifications.

[0069] S140. Perform weight analysis according to the differences between multiple preparation information, and adaptively prepare the enameled wire.

[0070] Exemplarily, match the weights of the differences between each preparation information, and allocate weights according to the available range of the preparation device. The more consistent with the preparation device, the greater the weight. For example, device A is most accurate in diameter control and coating thickness control. The differences between multiple preparation information are also the requirements for diameter and coating thickness. Then the obtained weight is greater, and it will preferentially adapt to the preparation of enameled wire, that is, (diameter and coating thickness) is greater than (diameter or coating thickness), then the corresponding weight is (diameter and coating thickness) is greater than (diameter or coating thickness), so it preferentially adapts to the preparation of (diameter and coating thickness) and then adapts to the preparation of (diameter or coating thickness).

[0071] With such a setting, the preparation system can efficiently and accurately prepare the enameled wire according to the differences between the preparation information. By performing weight analysis on the differences between multiple preparation information, the preparation information that is most matched with the preparation device can be considered preferentially, thus improving the preparation efficiency and quality. At the same time, the adaptive preparation method also makes the preparation system more flexible and can also meet the different needs of different customers.

[0072] S200. Obtain the preparation parameters in the current preparation device based on the startup information, and evaluate and analyze the preparation parameters in the current preparation device to obtain evaluation result information. The evaluation result information is used to indicate the evaluation status obtained after evaluating according to the preparation parameters in the current preparation device. The evaluation status includes a satisfied evaluation status and an unsatisfied evaluation status.

[0073] It can be understood that when the preparation device is running, it is possible to extract or manually view and record the parameters in the preparation device (the parameters extracted from the preparation device should be those without any manual modification or reset operation after the preparation device runs, that is, the parameters of the preparation device after running), and perform simulation analysis on the extracted parameters. Obtain an evaluation result based on the analysis result, compare the evaluation result with a preset result standard. If the evaluation result is greater than the preset result standard, obtain a satisfied evaluation status and determine the satisfied evaluation status as the evaluation result information. If the evaluation result is less than the preset result standard, obtain an unsatisfied evaluation status and determine the unsatisfied evaluation status as the evaluation result information. The satisfied evaluation status and the unsatisfied evaluation status can be obtained by comparing with a preset standard value. For example, the preset standard value is 70%. After performing simulation analysis on the extracted parameters, if the evaluation result value obtained based on the analysis result is between 70% and 100% (not equal to 70% and equal to 100%), it conforms to the satisfied evaluation status. Conversely, if it is less than 70% and equal to 70%, it conforms to the unsatisfied evaluation status.

[0074] In a possible implementation, please refer to Figure 5 , S200. Obtain the preparation parameters in the current preparation device based on the startup information, and evaluate and analyze the preparation parameters in the current preparation device to obtain evaluation result information, including:

[0075] S210. Obtain target parameter information. There are multiple pieces of target parameter information according to different preparation requirements of the enameled wire. The target parameter information is used to indicate the performance value of the enameled wire prepared under ideal conditions.

[0076] Exemplarily, obtaining the target parameter information can be by obtaining the performance value of the enameled wire prepared under ideal conditions from the historical usage records. It can also be by performing performance tests on the enameled wire. For example, a tensile testing machine can measure the tensile strength and elongation rate of the enameled wire, an insulation resistance tester can measure the insulation resistance, and a withstand voltage tester can detect the withstand voltage performance, etc. It can also be by using equipment such as an environmental simulation test chamber to simulate the usage conditions of the enameled wire under different temperatures, humidities, and electromagnetic environments, observe and measure its performance changes, so as to obtain the target parameters under specific application scenarios. For example, in a high-temperature environment simulation test, observe the changes in the insulation performance and mechanical performance of the enameled wire at different temperatures to obtain the target parameters of its heat resistance performance.

[0077] S220, when receiving the start information, extract the current preparation parameters of the preparation device, perform simulation analysis according to the preparation parameters of the preparation device, and obtain simulation preparation information; wherein, the simulation preparation information is used to indicate the performance value of the enameled wire simulated by using the current preparation parameters of the preparation device.

[0078] Exemplarily, when receiving the start information, extract the current preparation parameters of the preparation device, then output the preparation parameters of the preparation device to a performance test tool for simulation testing, obtain the performance value of the enameled wire, and determine the performance value of the enameled wire as the simulation preparation information; the performance test tool can be wire and cable design software, such as Cable CAD and analyze the enameled wire using ANSYS.

[0079] S230, perform parameter correspondence analysis on the performance value of the enameled wire indicated by the simulation preparation information and the performance value of the enameled wire prepared under the ideal state indicated by the target parameter information, and obtain evaluation result information.

[0080] Exemplarily, compare the performance value of the enameled wire indicated by the simulation preparation information with the performance value of the enameled wire prepared under the ideal state indicated by the target parameter information to obtain evaluation result information; the parameter comparison can be a comparative calculation, and determine the evaluation result information according to the calculation result; for example, the performance values include insulation resistance, tensile strength, and elongation; if the performance value of the enameled wire indicated by the simulation preparation information is an insulation resistance value of 20, a tensile strength value of 50, and an elongation of 15%, and if the performance value of the enameled wire prepared under the ideal state is an insulation resistance value of 20, a tensile strength value of 60, and an elongation of 10%, then compare and calculate the performance value of the enameled wire indicated by the simulation preparation information with the performance value of the enameled wire prepared under the ideal state, and obtain that the insulation resistance value of the performance value indicated by the simulation preparation information minus the insulation resistance value of the performance value of the enameled wire prepared under the ideal state is 20 - 20 = 0, so the insulation resistance value meets the standard, the tensile strength value of the performance value indicated by the simulation preparation information minus the tensile strength value of the performance value of the enameled wire prepared under the ideal state is 50 - 60 = -10, so the tensile strength value does not meet the standard, the elongation of the performance value indicated by the simulation preparation information minus the elongation of the performance value of the enameled wire prepared under the ideal state is 15 - 10 = 5, and the elongation meets the standard. Therefore, the evaluation result of the insulation resistance value is 70%, the tensile strength value is 30%, and the elongation is 90%. Then, compare Compare 63.33% with the standard value of 70%. Since 63.33% is less than 70%, determine the non - meeting evaluation status as the evaluation result information.

[0081] With such settings, it is possible to more precisely evaluate whether the preparation parameters in the current preparation device meet the requirements for the preparation of enameled wires. By performing parameter correspondence analysis on the simulated preparation information and the target parameter information, a quantitative evaluation result can be obtained, avoiding the errors of manual judgment and making the evaluation result more accurate and reliable.

[0082] S300. When the evaluation status indicated by the evaluation result information is the satisfied evaluation status, carry out the preparation of enameled wires to obtain preparation difference information; wherein, the preparation difference information is used to reflect the defect conditions that occur when preparing enameled wires.

[0083] It can be understood that when the evaluation status is the satisfied evaluation status, carry out the preparation of enameled wires, detect the preparation defects during the preparation process, and determine the preparation defects as the preparation difference information; the defect conditions that occur when preparing enameled wires include the drawing speed of the enameled wire and the coating state of the enameled wire, etc., but are not limited thereto.

[0084] In a possible implementation manner, please refer to Figure 6 S300. When the evaluation status indicated by the evaluation result information is the satisfied evaluation status, carry out the preparation of enameled wires to obtain preparation difference information, including:

[0085] S310. When the evaluation status indicated by the evaluation result information is the satisfied evaluation status, obtain the first operation information of the preparation device; wherein, the first operation information is used to indicate the drawing speed of the preparation device for the enameled wire.

[0086] Exemplarily, when the evaluation status indicated by the evaluation result information is the satisfied evaluation status, it can be detected by a speed sensor or a displacement sensor installed on the preparation device, and then the drawing speed of the enameled wire indicated by the first operation information can be obtained; the speed sensor or the displacement sensor can be installed near the traction wheel of the enameled wire drawing equipment to accurately measure the drawing speed of the enameled wire.

[0087] S320. Obtain the second operation information according to the drawing speed of the enameled wire indicated by the first operation information; wherein, the second operation information is used to reflect the coating condition of the preparation device for the enameled wire.

[0088] Exemplarily, the drawn enameled wire is continuously detected according to the drawing speed of the enameled wire indicated by the first operation information to obtain a continuity result, and the coating condition of the enameled wire is determined according to the continuity result. The continuity detection can be performed by acquiring a coating image and extracting a first straight line and a second straight line in the coating image (in the coating image, the enameled wire is in a straight and long strip shape, and one of the first straight line and the second straight line is the upper straight line and the other is the lower straight line), detecting whether there are breakpoints or convex points on the first straight line and the second straight line, marking the breakpoints or convex points on the first straight line and the second straight line and their positions, and determining the marked breakpoints or convex points and the positions of the breakpoints or convex points as the second operation information.

[0089] S330, obtain preparation difference information according to the drawing speed of the enameled wire indicated by the first operation information and the coating condition of the enameled wire indicated by the second operation information.

[0090] Exemplarily, the preparation difference information is obtained by analyzing the acquired drawing speed of the enameled wire and the coating condition of the enameled wire indicated by the second operation information; wherein, according to the first operation information, the change in the drawing speed of the enameled wire can be obtained, and the coating defects of the enameled wire obtained from the second operation information, that is, the breakpoints or convex points on the coating image, and the defects of uneven coating thickness and coating fault occurring during coating due to the change in the drawing speed of the first operation information, so as to determine the change in the drawing speed of the enameled wire, the breakpoints or convex points, and the uneven coating thickness and coating fault as the preparation difference information.

[0091] With such a setting, problems that may exist in the process of preparing enameled wire can be captured more accurately. By real-time monitoring and analyzing the drawing speed and coating condition, the preparation differences are found and located, so as to take targeted measures for improvement and optimization. Not only can it be processed in real time, but also the generation of defective products can be reduced and the production cost can be lowered; at the same time, it also provides data support for subsequent correction.

[0092] S400, correct according to the defect condition indicated by the preparation difference information to obtain corrected preparation information; wherein, the corrected preparation information is used to indicate the parameters of the corrected preparation device, and the enameled wire is prepared using the preparation parameters of the corrected preparation device.

[0093] Exemplarily, correct according to the preparation parameters corresponding to the defect condition indicated by the preparation difference information to obtain corrected preparation information.

[0094] In summary, the problems existing in the preparation link can be quickly located, and the preparation parameters can be corrected in time according to the difference situation, so as to improve the stability and consistency of the product during continuous production, prevent the accumulation of defects during continuous production, reduce the error rate, and improve the production efficiency.

[0095] In a possible implementation, please refer to Figure 7 S400, and correct it according to the defect situation indicated by the preparation difference information to obtain corrected preparation information, including:

[0096] S410, detect the enameled wire according to the first operation information to obtain actual detection information; wherein, the actual detection information is used to indicate the diameter value of the enameled wire obtained by stretching the enameled wire at the stretching speed indicated by the first operation information.

[0097] Exemplarily, detect the diameter of the enameled wire according to the first operation information to obtain the diameter value of the enameled wire obtained by stretching the enameled wire at the stretching speed indicated by the first operation information; wherein, the detection can be obtained by a laser diameter gauge or an inductive diameter gauge installed at the outlet of the stretching part. For example, the laser diameter gauge can be based on the diffraction principle of laser. When the laser beam irradiates the enameled wire, a specific light intensity distribution will be formed behind it, and the diameter of the enameled wire is calculated by detecting the change of the light intensity distribution. This method has no damage to the enameled wire, high precision, fast speed, can be measured online in real time, is applicable to enameled wires of various diameters, especially for the diameter detection of enameled wires on high-speed production lines; the inductive diameter gauge can utilize the principle of electromagnetic induction. When the enameled wire passes through the inductive coil, it will cause a change in the inductance of the coil, and then calculate the diameter of the enameled wire by measuring the change in the inductance.

[0098] S420, randomly select a section of the stretched enameled wire according to the random selection method, and divide the stretched section of the enameled wire into multiple line segments, and detect the diameters of the multiple line segments to obtain multiple detection result information; wherein, the detection result information is used to indicate the difference situation of the diameter values of the multi-terminal enameled wire.

[0099] It can be understood that the random selection method can be to randomly select any end of the stretched enameled wire; dividing the stretched section of the enameled wire into multiple line segments can be understood as dividing any obtained enameled wire into multiple segments.

[0100] Exemplarily, dividing any selected section of the enameled wire can be divided into 3 segments, 5 segments or 10 segments, etc., but not limited thereto. Then detect the diameter of each divided section to obtain the difference value of the diameter values.

[0101] S430, respectively perform correction calculations on the multiple detection result information and the preparation parameters of the preparation device to obtain first correction information; wherein, the first correction information is used to indicate the stretching preparation parameters of the corrected preparation device.

[0102] It can be understood that the difference situation of the diameter values of the multi-terminal enameled wire indicated by each detection result information is respectively subjected to multiple linear regression correction calculations with the preparation parameters of the preparation device to obtain the first correction information.

[0103] Exemplarily, the correction calculation based on multiple linear regression first establishes a regression model, calculates correction values, and determines the corrected parameters. Among them, establishing the regression model can be to assume that the detection result is Y and the preparation parameters are X 1 (tensile speed), X 2 (coating thickness), X 3 (lacquer solution temperature), etc. have a linear relationship, and establish a multiple linear regression model Y = β 0 +β 1 X 1 +β 2 X 2 +β 3 X 3 +…+∈, where β 0 , β 1 , β 2 and β 3 etc. are regression coefficients, and ∈ is the error term; calculating the correction value can be, when there is a new detection result, calculating the correction values of each preparation parameter according to the regression model. For example, for the tensile speed X 1 , its correction value (assuming only the correction of the tensile speed is considered and β 1 ≠0), and then determining the corrected tensile speed X new = X 1 +ΔX 1 , and in this way, other corrected preparation parameters can be obtained through this method, and then the first correction information is formed.

[0104] S440, analyze according to the coating situation indicated by the second operation information to obtain the second correction information; among them, the second correction information is used to indicate the coating preparation parameters of the corrected preparation device.

[0105] Exemplarily, for different types of defects, analyze the relationship between the possible causes and the coating parameters. For example, the bubble defect may be related to the temperature, viscosity of the coating solution, and the humidity of the coating environment; the flow mark defect may be related to the coating speed and the pressure of the coating roller. According to the defect analysis result, determine the correction value of the coating parameter. For example, if it is found that the bubble defect is caused by too high a temperature of the coating solution, and the current coating solution temperature is T 1 , then it is necessary to lower the temperature of the coating solution, and the correction value ΔT = -k 1 ×N 1 , where k 1 is a coefficient related to the number of bubbles N 1 , and the negative sign indicates that the temperature needs to be lowered. For the flow mark defect, if it is determined that it is caused by too fast a coating speed, and the current coating speed is V co-cu , then the correction value of the coating speed ΔV CO = -k2 ×L s , where k 2 is a coefficient related to the flow mark length L s , and finally the corrected coating temperature V 温 = T 1 +ΔT, and the corrected coating speed V 速 = V co-cu +ΔV co , so as to obtain the coating preparation parameters of the preparation device indicated by the second correction information.

[0106] In a possible implementation, please refer to Figure 8 , S440, analyze according to the coating situation indicated by the second operation information to obtain the second correction information, including:

[0107] S441, determine the continuity information of the enameled wire after stretching is completed; wherein, the continuity information is used to indicate the surface smoothness of the enameled wire after stretching is completed.

[0108] Exemplarily, determining the continuity information of the enameled wire can be through laser detection; the laser detection can be to emit a laser beam from a laser sensor to the surface of the enameled wire, and the laser beam is received by the sensor after being reflected on the surface. According to information such as the intensity, angle, and time of the reflected light, the roughness and smoothness of the surface of the enameled wire are calculated. The operation method of laser detection can be to align the laser detection device with the enameled wire so that the laser beam is perpendicularly irradiated on the surface of the enameled wire. The laser detection will automatically collect and analyze the reflected light signal, and display the relevant data and images of the surface smoothness in real time. In addition, the detection device can be moved along the enameled wire to perform continuous detection on different parts to obtain the relevant data and images of the smoothness to determine the surface smoothness of the enameled wire after stretching is completed.

[0109] S442, determine all the positioning areas on the enameled wire based on the continuity information; wherein, the positioning areas are the crack areas and / or pit areas on the enameled wire after stretching is completed. There is at most one crack in the crack area, and the crack includes a crack depth value and a gap width value. There is at most one depression in the pit area, and the depression includes a depression diameter value and a depression depth value.

[0110] It can be understood that the gap width value can be understood as if the pit area is semi-circular or arc-shaped, etc., the width of its gap can be the diameter value, and there can also be a depth value or a length value. Understanding that there is at most one depression in the pit area means that one crack or pit is represented by one positioning area; the depression is of an irregular shape.

[0111] Exemplarily, all the positioning areas on the enameled wire can be determined by an ultrasonic probe or a vision detection system. Specifically, the ultrasonic probe emits ultrasonic pulses towards the enameled wire. When the ultrasonic waves encounter defects such as cracks or pits, reflection and scattering will occur. The receiving probe receives the reflected wave signal. The determination method can be based on information such as the time delay and amplitude of the reflected wave to judge the position and type of the defect. Through the characteristics of the reflected wave, such as the strength of the signal and the change of the waveform, the size and depth of the crack or pit can be obtained. Among them, the stronger the reflected wave signal, the larger or deeper the defect. The vision detection system is composed of a high-resolution camera and an optical lens to form a vision detection system, which continuously captures images of the surface of the enameled wire, and then identifies the characteristics of cracks and pits through image processing. Specifically, for cracks, the lines of the cracks can be identified, and the gap width value can be determined through information such as the width and length of the lines. Then, combined with the depth of field information of the image or by comparing with a standard sample, the crack depth value can be estimated. For pits, the boundary is determined according to the shape and shadow and other characteristics of the pits in the image, so as to obtain the depression diameter value, and the depression depth value is obtained by using the gradient value of the gray-scale change.

[0112] S443, Calculate the coating of the crack area or / and the pit area with a preset area. When the crack area or / and the pit area is less than the preset area, obtain the second correction information.

[0113] Exemplarily, calculating the coating of the crack area or / and the pit area with a preset area can be obtained through a coating formula. For example, determine the amount of coating material according to the crack area or / and the pit area, and obtain the amount of material required for coating according to the size of the crack area or the pit area. For example, for the crack area, if the crack is to be completely filled, the volume V of the coating material 裂纹 =S 裂纹 ×D 裂纹 . (Assume that the coating material is filled to the crack depth, which can be determined according to actual needs); for the pit area, if the pit is to be filled The volume of the coating material (assuming that the pit is a cylinder and the coating material is filled to the pit depth, which can be determined according to actual needs), and then the second correction information can be calculated through V 裂纹 and V 凹坑 . Among them, when the crack area or / and the pit area is less than the preset area, the coating material can be used to fill the corresponding cracks in the crack area and the corresponding pits in the pit area.

[0114] With such settings, the defective areas on the enameled wire can be accurately located, and the coating parameters can be corrected for these specific areas. By comparing the actual sizes of the cracks or pits with the preset areas, when the defective areas are small, the coating parameters such as the flow rate of the coating liquid and the coating speed can be automatically adjusted according to the preset coating correction rules, so as to improve the coating quality. This can not only improve the overall quality of the enameled wire and reduce the defective rate caused by defects, but also help maintain the consistency and stability of the product.

[0115] S450, obtain the corrected preparation information based on the first correction information and the second correction information.

[0116] Exemplarily, determine the first correction information and the second correction information as the corrected preparation information.

[0117] As described in the above steps, the problems existing in the preparation process can be more comprehensively reflected and corrected accordingly. By precisely adjusting the preparation parameters, the preparation process can be optimized to make the preparation process more controllable and stable. After obtaining the corrected preparation information, the preparation system can use the corrected preparation parameters to prepare the enameled wire, which can not only improve the quality of the prepared enameled wire, but also meet the different requirements of different customers for the enameled wire. It can greatly reduce the errors and the generation of defective products during the preparation process, improve the production efficiency, and more efficiently and accurately prepare enameled wire that meets the requirements.

[0118] In a possible implementation manner, the method further includes:

[0119] Perform coating calculation on the crack area or / and the pit area and the preset area. When the crack area or / and the pit area is larger than the preset area, obtain a prompt message; wherein, the prompt message is used to prompt the technician to repair the preparation device.

[0120] Exemplarily, perform coating calculation on the crack area or / and the pit area and the preset area. When the crack area or / and the pit area is larger than the preset area, prompt the technician to repair the preparation device.

[0121] With such settings, potential problems that may exist in the preparation device can be discovered and repaired in a timely manner, thus avoiding greater failures or errors in the subsequent preparation process. For example, if the crack area or the pit area exceeds the preset area, this may mean that the coating device or related components of the preparation device are worn, aged or malfunctioning. If not repaired and replaced in a timely manner, it may lead to a decline in the quality of the prepared enameled wire and even fail to meet the performance requirements of customers. Through the prompt message, the technician can quickly locate the problem and take necessary maintenance measures to ensure the stable operation of the preparation device and the preparation quality of the enameled wire. In addition, this real-time monitoring and feedback mechanism also helps improve the production efficiency and reduce the production cost.

[0122] In a possible implementation, the method further includes: obtaining parameter reset information when the evaluation status indicated by the evaluation result information is a non-compliant evaluation status; wherein the parameter reset information is for reminding the technician to re-enter or re-import the preparation parameters into the preparation device.

[0123] Exemplarily, when the evaluation status indicated by the evaluation result information is a non-compliant evaluation status, the technician is reminded to re-enter or re-import the preparation parameters into the preparation device.

[0124] With such a setting, it is possible to prevent defective products from being produced due to parameter deviation, and it is also possible to reduce the participation of technicians. When problems occur and the machine cannot handle them, manual participation is reminded as much as possible, which can save labor and keep the entire process of enameled wire preparation under control at all times; when the evaluation status indicated by the evaluation result information is a non-compliant evaluation status, it means that there may be problems with the current preparation parameters, and direct production may result in unqualified product quality. By reminding the technician to re-enter or re-import the preparation parameters, when the evaluation status indicated by the evaluation result information is a compliant evaluation status, that is, the next step is processed by the preparation device itself, the production efficiency and product quality can be improved.

[0125] It should be understood that the magnitudes of the sequence numbers of the steps in the above embodiments do not mean the order of execution. The order of execution of each process should be determined according to its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.

[0126] Corresponding to the enameled wire preparation method described in the above embodiments, an enameled wire preparation system is further provided in an embodiment of the present application. Each unit of the system can implement each step of the enameled wire preparation method. Figure 9 The block diagram of the enameled wire preparation system provided by the embodiment of the present application is shown. For the sake of convenience of description, only the parts related to the embodiment of the present application are shown.

[0127] Refer to Figure 9 , the enameled wire preparation system includes:

[0128] A detection unit, configured to detect the start information of the enameled wire preparation device; wherein the start information is used to indicate the start instruction of the preparation device,

[0129] An evaluation unit, configured to obtain the preparation parameters in the current preparation device based on the start information, and perform an evaluation and analysis on the preparation parameters in the current preparation device to obtain evaluation result information; wherein the evaluation result information is used to indicate the evaluation status obtained after the evaluation based on the preparation parameters in the current preparation device, and the evaluation status includes a compliant evaluation status and a non-compliant evaluation status;

[0130] A result unit, configured to prepare enameled wires when the evaluation status indicated by the evaluation result information meets the evaluation status, so as to obtain preparation difference information; wherein the preparation difference information is used to reflect the defect conditions occurring during the preparation of the enameled wires.

[0131] A correction unit, configured to perform correction according to the defect conditions indicated by the preparation difference information to obtain corrected preparation information; wherein the corrected preparation information is used to indicate the parameters of the preparation device after correction, and the enameled wires are prepared by using the preparation parameters of the corrected preparation device.

[0132] It should be noted that for the information interaction, execution process, etc. between the above-mentioned systems / units, since they are based on the same concept as the method embodiments of the present application, for their specific functions and the technical effects brought, reference can be specifically made to the method embodiment part, and details are not described herein again.

[0133] Those skilled in the art can clearly understand that for the convenience and conciseness of description, only the above-mentioned division of each functional unit and module is used as an example. In actual applications, the above-mentioned functions can be allocated to different functional units and modules according to needs, that is, the internal structure of the system is divided into different functional units or modules to complete all or part of the functions described above. Each functional unit and module in the embodiment can be integrated into a processing unit, or each unit exists physically alone, or two or more units are integrated into one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of a software functional unit. In addition, the specific names of each functional unit and module are only for the convenience of mutual distinction and do not limit the protection scope of the present application. The specific working processes of the units and modules in the above-mentioned system can refer to the corresponding processes in the foregoing method embodiments, and details are not described herein again.

[0134] An embodiment of the present application further provides an enameled wire preparation device. Figure 10 It is a schematic structural diagram of a control device of an enameled wire preparation device provided by an embodiment of the present application. As Figure 10 shown, the control device 6 of this embodiment includes: at least one processor 60 ( Figure 10 only one is shown in the figure), at least one memory 61 ( Figure 10 only one is shown in the figure), and a computer program 62 stored in the at least one memory 61 and executable on the at least one processor 60. When the processor 60 executes the computer program 62, the control device 6 implements the steps in any of the above-mentioned enameled wire preparation method embodiments, or the control device 6 implements the functions of each module / unit in the above-mentioned system embodiments.

[0135] Exemplarily, the computer program 62 may be divided into one or more modules / units, which are stored in the memory 61 and executed by the processor 60 to complete the present application. The one or more modules / units may be a series of computer program instruction segments capable of performing specific functions, and these instruction segments are used to describe the execution process of the computer program 62 in the control device 6.

[0136] The control device 6 may be a computing device such as a desktop computer or a notebook. The control device 6 may include, but is not limited to, a processor 60 and a memory 61. Those skilled in the art can understand that Figure 10 merely examples of the control device 6 are provided, which do not constitute a limitation on the control device 6. It may include more or fewer components than those shown in the figure, or combine certain components, or different components. For example, it may also include input / output devices, network access devices, a bus, etc.

[0137] The processor 60 may be a central processing unit (CPU), and the processor 60 may also be other general-purpose processors, digital signal processors (DSPs), application specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or any conventional processor, etc.

[0138] In some embodiments, the memory 61 may be an internal storage unit of the control device 6, such as the hard disk or memory of the control device 6. In other embodiments, the memory 61 may also be an external storage device of the control device 6, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. equipped on the control device 6. Further, the memory 61 may also include both the internal storage unit and the external storage device of the control device 6. The memory 61 is used to store an operating system, application programs, a boot loader, data, and other programs, such as the program code of the computer program. The memory 61 may also be used to temporarily store data that has been output or will be output.

[0139] The embodiments of the present application also provide a computer-readable storage medium storing a computer program, which when executed by a processor, implements the steps in any of the above method embodiments.

[0140] The embodiments of the present application provide a computer program product, which when running on an enameled wire manufacturing device, enables the enameled wire manufacturing device to implement the steps in any of the above method embodiments.

[0141] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, to implement all or part of the processes in the above method embodiments of the present application, a computer program can be used to instruct the relevant hardware to complete. The computer program can be stored in a computer-readable storage medium. When the computer program is executed by a processor, the steps in the above method embodiments can be implemented. Among them, the computer program includes computer program code, which can be in the form of source code, object code, executable file, or some intermediate form. The computer-readable medium can at least include: any entity or device capable of carrying the computer program code to the enameled wire manufacturing device, recording medium, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signal, telecommunication signal, and software distribution medium. For example, a USB flash drive, a mobile hard disk, a magnetic disk, or an optical disc, etc. In some jurisdictions, according to legislation and patent practice, the computer-readable medium cannot be an electrical carrier signal and a telecommunication signal.

[0142] In the above embodiments, the descriptions of the respective embodiments have their own focuses. For the parts not detailed or recorded in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0143] Those of ordinary skill in the art can realize that the units and algorithm steps of the examples described in combination with the embodiments disclosed herein can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Professional technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the present application.

[0144] In the embodiments provided in the present application, it should be understood that the disclosed enameled wire preparation system, equipment and method can be implemented in other ways. For example, the enameled wire preparation system and equipment embodiments described above are only illustrative. For example, the division of the modules or units is only a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed coupling or direct coupling or communication connection between each other can be through some interfaces. The indirect coupling or communication connection of the device or unit can be in electrical, mechanical or other forms.

[0145] The units described as separate components may or may not be physically separated. The components displayed as units may or may not be physical units, that is, they may be located in one place or distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0146] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A method for preparing an enameled wire, characterized in that: include: Detecting startup information of an enameled wire preparation device; wherein the startup information is used to indicate a startup instruction of the preparation device; Based on the startup information, the preparation parameters in the current preparation device are obtained, and the preparation parameters in the current preparation device are evaluated and analyzed to obtain evaluation result information; wherein the evaluation result information is used to indicate an evaluation status obtained after the evaluation is performed according to the preparation parameters in the current preparation device, and the evaluation status includes a satisfied evaluation status and a dissatisfied evaluation status; When the evaluation status indicated by the evaluation result information satisfies the evaluation status, the enameled wire is prepared to obtain preparation difference information; wherein the preparation difference information is used to reflect the defects that occur when preparing the enameled wire; Corrections are made according to the defects indicated by the preparation difference information to obtain corrected preparation information; wherein the corrected preparation information is used to indicate the corrected parameters of the preparation device, and the enameled wire is prepared using the corrected preparation parameters of the preparation device.

2. The method for preparing an enameled wire according to claim 1, characterized in that: After the startup information of the enameled wire preparation device is detected, the method includes: Acquire preparation information of the enameled wire in the preparation system; wherein the preparation information includes application information and specification information of the enameled wire, and the preparation information has at least one; In the case where the preparation information of the enameled wire in the preparation system is one, preparing the enameled wire using the preparation device according to the preparation information; In the case where there are a plurality of pieces of preparation information of the enameled wire in the preparation system, determining a difference between the plurality of pieces of preparation information; A weight analysis is performed according to the differences between the plurality of preparation information, and the enameled wire is prepared adaptively.

3. The method for preparing an enameled wire according to claim 2, characterized in that: When there are multiple pieces of preparation information of the enameled wire in the preparation system, determining the difference between the multiple pieces of preparation information includes: In the case where there are multiple pieces of preparation information of the enameled wire in the preparation system, the application information included in each piece of the preparation information is extracted respectively, and then a first analysis is performed on each piece of the extracted application information to obtain multiple pieces of application difference information; wherein the application difference information is used to indicate the difference between the use places; Extracting the specification information included in each of the preparation information respectively, and then performing a second analysis on each of the extracted specification information to obtain a plurality of specification difference information; wherein the specification difference information is used to indicate the diameter difference and coating difference of the enameled wire; Based on the plurality of application difference information and the plurality of specification difference information, differences between the plurality of preparation information are determined.

4. The method for preparing an enameled wire according to claim 3, characterized in that: The determining the difference between the plurality of preparation information based on the plurality of application difference information and the plurality of specification difference information includes: Scoring the differences between the usage sites respectively indicated by the plurality of application difference information according to the site conditions to obtain a plurality of site difference information; wherein the site difference information is used to indicate a plurality of satisfaction score values ​​obtained after scoring according to the site conditions, and the site conditions are the usage sites that can be satisfied by the preparation device; Scoring the diameter differences and coating differences of the enameled wires indicated by the plurality of specification difference information respectively according to the specification conditions, to obtain a plurality of specification difference information; wherein the specification difference information is used to indicate a plurality of satisfied score values ​​after scoring according to the specification conditions, and the specification conditions are the diameter and coating state of the enameled wires that can be satisfied by the preparation device; The differences between the plurality of preparation information are determined according to the plurality of site difference information and the plurality of specification difference information.

5. The method for preparing an enameled wire according to claim 1, characterized in that: The method of obtaining the preparation parameters in the current preparation device based on the startup information, and evaluating and analyzing the preparation parameters in the current preparation device to obtain evaluation result information includes: Obtaining target parameter information; wherein the target parameter information has multiple values ​​according to different preparation requirements of the enameled wire, and the target parameter information is used to indicate the performance value of the enameled wire prepared under an ideal state; When the startup information is received, the current preparation parameters of the preparation device are extracted, and simulation analysis is performed according to the preparation parameters of the preparation device to obtain simulated preparation information; wherein the simulated preparation information is used to indicate the performance value of the enameled wire simulated using the current preparation parameters of the preparation device; The performance value of the enameled wire indicated by the simulated preparation information and the performance value of the enameled wire prepared under the ideal state indicated by the target parameter information are subjected to parameter correspondence analysis to obtain the evaluation result information.

6. The method for preparing an enameled wire according to claim 1, characterized in that: The enameled wire is prepared when the evaluation status indicated by the evaluation result information satisfies the evaluation status, and the preparation difference information is obtained, including: When the evaluation status indicated by the evaluation result information satisfies the evaluation status, obtaining first operation information of the preparation device; wherein the first operation information is used to indicate the stretching speed of the enameled wire by the preparation device; Obtaining second operation information according to the stretching speed of the enameled wire indicated by the first operation information; wherein the second operation information is used to reflect the coating condition of the enameled wire by the preparation device; The preparation difference information is obtained according to the stretching speed of the enameled wire indicated by the first operation information and the coating condition of the enameled wire indicated by the second operation information.

7. The method for preparing an enameled wire according to claim 6, characterized in that: The step of correcting the defect according to the preparation difference information to obtain the corrected preparation information includes: The enameled wire is tested according to the first operation information to obtain actual test information; wherein the actual test information is used to indicate the diameter value of the enameled wire obtained by stretching the enameled wire at the stretching speed indicated by the first operation information; According to a random selection method, a section of enameled wire that has been stretched is selected, and the section of enameled wire that has been stretched is divided into a plurality of line segments, and diameter detection is performed on the plurality of line segments to obtain a plurality of detection result information; wherein the detection result information is used to indicate the difference in diameter values ​​of the multi-end enameled wire; Perform correction calculation on the plurality of the detection result information and the preparation parameters of the preparation device respectively to obtain first correction information; wherein the first correction information is used to indicate the corrected stretching preparation parameters of the preparation device; Analyze the coating condition indicated by the second operation information to obtain second correction information; wherein the second correction information is used to indicate the coating preparation parameters of the preparation device after correction; Correction preparation information is obtained based on the first correction information and the second correction information.

8. The method for preparing an enameled wire according to claim 7, characterized in that: The step of analyzing the coating condition indicated by the second operation information to obtain the second correction information includes: Determine the continuous information of the enameled wire after the stretching is completed; wherein the continuous information is used to indicate the surface smoothness of the enameled wire after the stretching is completed; Determine all positioning areas on the enameled wire based on the continuous information; wherein the positioning area is a crack area or / and a pit area on the enameled wire after stretching, there is at most one crack in the crack area, the crack includes a crack depth value and a gap width value, and there is at most one depression in the pit area, the depression includes a depression diameter value and a depression depth value; The crack area and / or the pit area are coated and calculated with a preset area, and when the crack area and / or the pit area are smaller than the preset area, second correction information is obtained.

9. The method for preparing an enameled wire according to claim 8, characterized in that: The method further comprises: The crack area and / or the pit area are coated and calculated with a preset area, and a prompt message is obtained when the crack area and / or the pit area is larger than the preset area; wherein the prompt message is used to prompt a technician to inspect and repair the preparation device.

10. The method for preparing an enameled wire according to claim 1, characterized in that: The method further comprises: When the evaluation status indicated by the evaluation result information is that the evaluation status is not satisfied, parameter reset information is obtained; wherein, the parameter reset information is to remind the technician to re-enter or re-import the preparation parameters in the preparation device.

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