Highly reliable chip resistor with surface structure and method of manufacturing the same

Abstract

The present application relates to a kind of high reliability chip resistor with surface structure, including substrate and the end electrode of two ends, resistance layer between two side end electrodes, and protective layer is arranged on resistance layer, further include being arranged on substrate and being located under resistance layer several strip microstructure, strip microstructure area is arranged with laser adjustment group area, resistance layer is formed by laser cutting interval reservation two end part resistance area along strip microstructure and forms zigzag resistance path.The present application adopts strip microstructure to effectively avoid the formation of ion migration channel by separating two side resistance, glass microstructure layer enhances the insulation of laser incision, reduces the breakdown risk caused by potential difference;Using strip surface structure occupies smaller space than parallel laser incision, the resistance range that can be adjusted is larger;Change the direction of potential ion migration channel from horizontal to along strip surface structure, make it exist larger angle with electric field direction, slow down the speed of ion migration.

Description

TECHNICAL FIELD

[0001] The present application relates to an electronic component, in particular to a high-reliability chip resistor with surface structure. BACKGROUND

[0002] The resistor often faces alternating hot and cold ambient temperature, internal load current, self-heating under voltage, high-frequency vibration and other adverse working conditions in the working environment. After a long time of operation, the protective layer and the resistance layer will be separated at the interface, thereby opening the ion migration channel at the interface. When the voltage is loaded for a long time, silver-based elements will grow into dendritic crystals (silver and copper are more common in electrode materials, and the ion migration phenomenon of silver is the most obvious) at the laser cutting edge. When the two sides of the cutting edge are shorted by dendritic crystals, the chip resistor resistance value decreases, eventually leading to resistance exceeding the allowable value and resistance failure. SUMMARY

[0003] In order to solve the problem of the separation of the protective layer and the resistance layer at the interface to form an ion migration channel and form dendritic crystals affecting the resistance of the existing resistor during use, the present application provides a high-reliability chip resistor with surface structure.

[0004] The technical scheme adopted by the present application is: a high-reliability chip resistor with surface structure, comprising a substrate, end electrodes at both ends, a resistance layer between the two end electrodes, and a protective layer covering the resistance layer, further comprising a plurality of strip-shaped microstructures arranged on the substrate below the resistance layer, the strip-shaped microstructures are prepared by printing process, and the edge of the strip-shaped microstructure prepared by printing process collapses to form an arc-shaped edge at the lower end. The laser cutting area of the strip-shaped microstructure is arranged with a laser cutting area, and the resistance layer is formed by laser cutting along the strip-shaped microstructure to keep the resistance area at both ends and form a zigzag resistance path.

[0005] As one of the preferred schemes of the high-reliability chip resistor with surface structure, the laser cutting width is greater than the side of the strip-shaped microstructure.

[0006] As one of the preferred schemes of the high-reliability chip resistor with surface structure, the protective layer comprises a first protective layer made of the same material as the strip-shaped microstructure on the resistance layer, and a second protective layer above the first protective layer.

[0007] As one of the preferred schemes of the high-reliability chip resistor with surface structure, a nickel-chromium base layer is arranged below the resistance layer, and the thickness of the nickel-chromium base layer is less than 20nm.

[0008] As one of the preferred schemes of the high-reliability chip resistor with surface structure, the first protective layer is a glass protective layer, the second protective layer is a polymer protective layer, and the plurality of strip-shaped microstructures are made of glass.

[0009] As one of the preferred schemes of the high-reliability chip resistor with surface structure, the strip-shaped microstructure and the substrate are combined by a circular arc transition, and the edge of the resistance layer is arranged on the circular arc.

[0010] A manufacturing method of a high-reliability chip resistor with surface structure, characterized by comprising the following steps:

[0011] a. preparing a ceramic substrate and printing an electrode layer;

[0012] b. coating glue and exposing a strip-shaped microstructure by mask, and then washing away the excess glue;

[0013] c. preparing a glass microstructure and removing the cured glue;

[0014] d. arranging a resistance layer on the surface with the glass microstructure, and overlapping the electrode layer at both ends of the resistance layer.

[0015] e. performing laser cutting along the strip-shaped microstructure to form a group to a target resistance value;

[0016] f. arranging a protective layer.

[0017] Further, in step b, an alumina ceramic substrate is used and a film mask is used, a layer of film glue is spin-coated on the alumina ceramic substrate, the film glue is exposed and cured to form a strip-shaped microstructure pattern through a strip-shaped mask, and the uncured film glue is washed away.

[0018] Further, between steps b and c, there is also a step: sputtering a nickel-chromium base layer on the surface of the ceramic substrate with the glass microstructure to increase the bonding strength between the resistance layer and the ceramic base layer, and the thickness of the nickel-chromium base layer is less than the thickness of the resistance layer, and the thickness of the nickel-chromium base layer is less than 20 nm. The thickness of the nickel-chromium base layer is less than the average free path of nickel-chromium electrons.

[0019] Further, the protective layer in step f includes a glass protective layer, the glass protective layer is arranged on the resistance layer, the glass protective layer is in contact with the surface of the glass microstructure, and a polymer protective layer is further arranged on the glass protective layer.

[0020] Further, in step d, the resistance layer is made by sputtering process, then the laser is cut along the strip-shaped microstructure to form a zigzag resistance path, and the resistance is adjusted synchronously.

[0021] The high-reliability chip resistor with surface structure and the manufacturing method thereof have the following beneficial effects:

[0022] I. The adoption of strip microstructure effectively avoids the formation of ion migration channel by blocking the resistance on both sides.

[0023] II. The glass microstructure layer enhances the insulation of the laser cut, reduces the risk of breakdown caused by potential difference; the strip surface structure occupies less space than parallel laser cuts, has a larger adjustable resistance range; changes the direction of potential ion migration channel from horizontal to along the strip surface structure, which has a large angle with the direction of electric field, slows down the speed of ion migration. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 It is an explosion schematic diagram of the embodiment one of the present application.

[0025] Figure 2 It is a cross-sectional schematic diagram of the embodiment one of the present application.

[0026] Figure 3 It is Figure 2 A part enlarged schematic diagram.

[0027] Figure 4 It is an explosion schematic diagram of the embodiment two of the present application.

[0028] Figure 5 It is a process flow schematic diagram of the present application.

[0029] Wherein: 1, substrate; 2, end electrode; 3, resistance layer; 4, protective layer; 5, strip microstructure; 41, first protective layer; 42, second protective layer; 6, nickel-chromium base layer. DETAILED DESCRIPTION

[0030] The present application will be further described below in conjunction with specific drawings. It should be noted that in this application, the terms “include”, “contain” or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device. Without more limitation, the element defined by the statement “including a…” does not exclude the presence of another identical element in the process, method, article or device including the element. In addition, the structure proportion shown in the drawings is not the actual proportion, and the part structure is enlarged for clear display.

[0031] As Figures 1 to 4 shown:

[0032] Embodiment one: a high-reliability chip resistor with surface structure, comprising a substrate 1 and end electrodes 2 at both ends, a resistance layer 3 between the two side end electrodes 2, and a protective layer 4 covering the resistance layer 3, further comprising a plurality of strip-shaped microstructures 5 arranged on the substrate 1 and below the resistance layer 3, the strip-shaped microstructures 5 are prepared by printing process, a plurality of laser adjustment areas are arranged in the region of the strip-shaped microstructures 5, and the resistance layer 3 forms a zigzag resistance path by laser cutting along the strip-shaped microstructures 5 to reserve part of the resistance area at both ends. The laser cutting width is greater than the side of the strip-shaped microstructure 5.

[0033] In this embodiment, a nickel-chromium base layer 6 is arranged below the resistance layer 3, and the thickness of the nickel-chromium base layer 6 is less than 20 nm. The thickness of the nickel-chromium base layer 6 is much smaller than the average electron migration free path of nickel-chromium, so it can be considered as insulation. The use of the nickel-chromium base layer 6 effectively improves the bonding strength of the connection between the resistance layer 3 and the substrate 1.

[0034] In this embodiment, a double-layer protective layer 4 is used, which comprises a first protective layer 414 made of the same material as the strip-shaped microstructure 5 arranged on the resistance layer 3, and a second protective layer 424 arranged above the first protective layer 414. The first protective layer 414 is a glass protective layer 4, the second protective layer 424 is a high polymer protective layer 4, and the plurality of strip-shaped microstructures 5 are made of glass. Specifically, glass paste is used to print the strip-shaped microstructure 5, and a circular arc transition is formed at the junction of the strip-shaped microstructure 5 and the substrate 1. The edges of the subsequently arranged resistance layer 3 must be pressed onto the circular arc, so even when laser cutting adjustment is performed, the resistance layer 3 is also overlapped on the circular arc of the strip-shaped microstructure 5. The use of the overlapping scheme hinders the formation of ion migration channels even if the strip-shaped microstructure 5 produces interface peeling, and the laser cutting part of the resistance layer 3 is overlapped on the side of the strip-shaped microstructure 5, as shown in Figure 5 The interface B, i.e. the strip-shaped microstructure 5 and the first protective layer 414 are sintered with the same material, have good bonding force, and are more difficult to separate.

[0035] Embodiment two: a high-reliability chip resistor with surface structure, comprising a substrate 1 and end electrodes 2 at both ends, a resistance layer 3 between the two side end electrodes 2, and a protective layer 4 covering the resistance layer 3, further comprising a plurality of strip-shaped microstructures 5 arranged on the substrate 1 and below the resistance layer 3, the strip-shaped microstructures 5 are prepared by printing process, a plurality of laser adjustment areas are arranged in the region of the strip-shaped microstructures 5, and the resistance layer 3 forms a zigzag resistance path by laser cutting along the strip-shaped microstructures 5 to reserve part of the resistance area at both ends. The laser cutting width is greater than the side of the strip-shaped microstructure 5. The use of the strip-shaped microstructure 5 and the single protective layer 4 structure can also reduce the formation of ion migration channels between the resistances of the zigzag path.

[0036] As Figure 5The application discloses a high-reliability chip resistor manufacturing method with a reliable chip having a surface structure, and the method comprises the following steps:

[0037] a. preparing a ceramic substrate and printing an electrode layer;

[0038] b. coating and masking exposure of a strip-shaped microstructure, and then washing away the excess glue;

[0039] c. preparing a glass microstructure and removing the cured glue;

[0040] d. arranging a resistance layer on the surface with the glass microstructure, and overlapping the electrode layer at both ends of the resistance layer.

[0041] e. performing laser cutting along the strip-shaped microstructure to form a group to a target resistance value;

[0042] f. arranging a protective layer.

[0043] Then, silver plating and tin soldering are performed on the end electrodes at both ends of the resistance to complete production.

[0044] In the embodiment, the ceramic substrate of alumina is adopted in step b, and a film mask is adopted, a layer of film glue is spin-coated on the ceramic substrate of alumina, the film glue is cured to form a strip-shaped microstructure pattern through strip-shaped gate mask exposure, and the uncured film glue is washed away.

[0045] In the embodiment, the ceramic substrate with the glass microstructure is sputtered with a nickel-chromium base layer between step b and step c to increase the bonding strength between the resistance layer and the ceramic base layer, and the thickness of the nickel-chromium base layer is less than that of the resistance layer, and the thickness of the nickel-chromium base layer is 10 nanometers.

[0046] In the embodiment, the protective layer in step f comprises a glass protective layer, the glass protective layer is arranged on the resistance layer, the glass protective layer is in contact with the surface of the glass microstructure, and a high-molecular protective layer is arranged on the glass protective layer.

[0047] In the embodiment, the resistance layer in step d is made by using a sputtering process, then the resistance path is cut along the strip-shaped microstructure by using laser to form a zigzag resistance path, and the resistance is adjusted synchronously.

[0048] In the above embodiment, all the technical features are described, and it should be known that any third person can cancel part of the technical features for the purpose of avoiding, wherein the structure listed in the embodiment can be canceled according to the actual situation, and therefore, the listed technical features are not all necessary technical features. The protection scope of the application should be subject to the claims. Other embodiments of the application can be adjusted according to the actual needs, and the similar schemes are not described here, which does not mean that the similar schemes are abandoned.

Claims

1. A high-reliability chip resistor with surface structure, comprising a substrate (1) and end electrodes (2) at both ends, a resistance layer (3) between the two side end electrodes (2), and a protective layer (4) covering the resistance layer (3), characterized in that: Further comprising a plurality of strip-shaped microstructures (5) prepared by printing process and located below the resistance layer (3) on the substrate (1), the thickness of the strip-shaped microstructures (5) is greater than the thickness of the resistance layer (3), the resistance layer (3) forms a zigzag resistance path by laser cutting along the strip-shaped microstructures (5) and leaving part of the resistance area at both ends of the strip-shaped microstructures (5) as a spacer; the combination of the strip-shaped microstructures (5) and the substrate (1) is a circular arc transition, and the edge of the resistance layer (3) is pressed on the circular arc.

2. The high-reliability chip resistor with surface structure according to claim 1, characterized by: The protective layer (4) comprises a first protective layer (414) made of the same material as the strip-shaped microstructures (5) and located on the resistance layer (3), and a second protective layer (424) located above the first protective layer (414).

3. The high-reliability chip resistor with surface structure according to claim 1, characterized by: The resistance layer (3) is provided below a nickel-chromium base layer (6) with a thickness less than 20 nm.

4. The high-reliability chip resistor with surface structure according to claim 2, characterized by: The first protective layer (414) is a glass protective layer, and the second protective layer (424) is a high polymer protective layer, and the plurality of strip-shaped microstructures (5) are made of glass.

5. A method of manufacturing a high-reliability chip resistor having a surface structure according to any one of claims 1 to 4, characterized by The steps include: a. Preparing a ceramic substrate (1) and printing an electrode layer; b. Gluing and masking exposure of strip-shaped microstructure (5) pattern, then washing away the excess glue; c. Preparing strip-shaped microstructure and removing the cured glue; d. Providing a resistance layer (3) on the surface with strip-shaped microstructure (5), and the resistance layer (3) is overlapped at both ends of the electrode layer; e. Laser cutting along the strip-shaped microstructure (5) to form a resistance adjustment to the target resistance value; f. Providing a protective layer (4).

6. The method of manufacturing a high-reliability chip resistor with surface structure according to claim 5, characterized in that: In step b, an alumina ceramic substrate (1) is used and a film mask is used, a layer of film glue is spin-coated on the alumina ceramic substrate (1), the film glue is cured to form a strip-shaped microstructure (5) pattern by strip-shaped mask exposure, and the uncured film glue is washed away.

7. The method of manufacturing a high-reliability chip resistor with surface structure according to claim 5, characterized by: Between steps b and c, there is also a step: sputtering a nickel-chromium base layer (6) on the surface of the ceramic substrate (1) with strip-shaped microstructure to increase the bonding strength of the resistance layer (3) and the ceramic base layer, and the thickness of the nickel-chromium base layer (6) is less than the thickness of the resistance layer (3), and the thickness of the nickel-chromium base layer (6) is less than 20 nm.

8. The method of claim 5, wherein: The protective layer in step f includes a glass protective layer, the glass protective layer is provided on the resistance layer (3), the glass protective layer is in contact with the surface of the strip-shaped microstructure, and a high polymer protective layer is further provided on the glass protective layer.

9. The method of manufacturing a high-reliability chip resistor with surface structure according to claim 5, wherein: In step d, the resistance layer (3) is made by sputtering process, then laser cutting along the strip-shaped microstructure (5) to form a zigzag resistance path, and adjusting the resistance value at the same time.

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