Automatic packaging equipment and method suitable for BGA chip processing

Abstract

The present invention relates to the technical field of BGA chip packaging, and specifically to automatic packaging equipment and method suitable for BGA chip processing, which includes a machine base, a machine top cover and a support frame group, wherein a packaging platform is fixedly installed on the top of the machine base through a column, a supporting carrier is fixedly installed on the machine top cover through a bracket at the bottom, a guide block is fixedly installed at the bottom midpoint of the supporting carrier, a guide slide block is symmetrically provided at the bottom of the guide block, a sliding frame is provided below the guide slide, an I-shaped slider is slidably connected in the guide slide, and a connecting plate is provided below the sliding frame; the present invention avoids the problems of uneven force and displacement deviation of the chip caused by a traditional rigid clamping structure through a step-by-step position calibration method, effectively improves the calibration accuracy and stability, and reduces the risk of chip damage during the lateral calibration process.

Description

Technical Field

[0001] The present invention relates to the technical field of BGA chip packaging, in particular to automatic packaging equipment and a method suitable for BGA chip processing. Background Art

[0002] BGA chip is a surface mount packaging technology chip with many solder balls / solder joints arranged in an array on the bottom. These solder balls are used to connect to the pads on the circuit board, effectively increasing the number of pins and reducing the pin spacing. This packaging form allows the chip to accommodate more pins with the same package volume, so it can achieve a higher degree of integration. It is commonly used in computer CPUs, GPUs and some high-end integrated circuits. Compared with traditional packaged chips, BGA chips have good signal transmission performance and excellent electrical performance. However, they also have the disadvantage of being difficult to repair because the solder joints are at the bottom of the chip, making it difficult to detect and repair the solder joints.

[0003] In substrate positioning technology, the method of using four clamping claws to directly calibrate the four sides of the substrate has many defects. Since the four clamping claws need to move simultaneously to position the substrate, the position accuracy, movement synchronization and uniformity of the applied force of each clamping claw are difficult to accurately control, which can easily cause the substrate to be subjected to uneven force in an instant, thereby causing the substrate to produce slight distortion, seriously affecting the positioning accuracy, and cannot meet the current demand for high-precision positioning of substrates.

[0004] In view of the above technical defects, a solution is now proposed. Summary of the Invention

[0005] The object of the present invention is to provide an automatic packaging device and method suitable for BGA chip processing, so as to solve the problems mentioned in the above background technology.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solution: an automatic packaging device suitable for BGA chip processing, comprising a machine base, a machine top cover, and a support frame group, wherein a packaging platform is fixedly installed on the top of the machine base via a column, a supporting carrier is fixedly installed on the machine top cover via a bracket at the bottom, a guide block is fixedly installed at the bottom midpoint of the supporting carrier, a guide slot is symmetrically provided at the bottom of the guide block, a sliding frame is provided below the guide slot, an I-shaped slider is slidably connected in the guide slot, a connecting plate is provided below the sliding frame, and a two-way adjustment component is provided at the bottom of the connecting plate;

[0007] The two-way adjustment component includes two transverse track frames and an I-shaped track block slidably connected to the inside of the transverse track frame. The bottom of the I-shaped track block is fixedly installed with a longitudinal track frame, and the inside of the longitudinal track frame is slidably connected with a slide bar. The inner side walls of the transverse track frame and the longitudinal track frame are fixedly installed with electromagnetic guide rods, and the bottom of the slide bar is fixedly installed with a pneumatic suction cup.

[0008] Preferably, a linkage frame is fixedly connected at the top midpoint of the connecting plate, a limiting guide rod is fixedly connected to the inner side wall of the linkage frame, a guide rail is fixedly connected to the bottom of the guide block, and the limiting guide rod is slidably connected in a guide rail groove opened on the guide rail side wall.

[0009] Preferably, a vertical rod is fixedly mounted on the inner side wall of the sliding frame, and a sliding sleeve that cooperates with the vertical rod is fixedly mounted on the top of the outer side wall of the linkage frame.

[0010] Preferably, the two opposite side walls of the guide block are fixedly connected with directional slide rails, and the side walls of the sliding frame are fixedly connected with a telescopic sleeve assembly, and the telescopic sleeve assembly is composed of a telescopic rod and a sleeve, and the bottom of the telescopic rod included in the telescopic sleeve assembly is fixedly connected with a positioning splint, and the top of the telescopic rod is movably connected with a roller through a bearing that cooperates with the directional groove opened at the bottom of the directional slide rail.

[0011] Preferably, a positioning collision plate is symmetrically fixedly installed on the bottom of the supporting carrier plate, a lifting push rod is symmetrically fixedly installed on the bottom of the guiding block, and a pneumatic suction cup 2 is fixedly installed on the bottom end of the lifting push rod.

[0012] Preferably, the bottom end of the I-shaped slider is fixedly connected to the bottom of the sliding frame, and the I-shaped track block and the slide bar are respectively slidably connected to the outer side of the corresponding electromagnetic guide rod through the through grooves opened on their own side walls, and the inner walls of the through grooves of the I-shaped track block and the slide bar are fixedly installed with metal sheets that cooperate with the electromagnetic guide rod.

[0013] Preferably, the four corners of the top of the packaging platform are each provided with an oblique groove, a sliding block is slidably connected in the oblique groove, a corner alignment frame is fixedly installed on the top of the sliding block, and an electric push rod for driving the sliding block to slide is fixedly installed on the outside of the packaging platform.

[0014] Preferably, the top and bottom ends of the support frame group are fixedly connected to the bottom of the machine top cover and the top of the machine base respectively, and the interior of the guide block is further provided with a horizontal transverse groove connected to the two guide slide grooves, and a shift rod is fixedly connected between the two I-shaped slide blocks, and the shift rod is slidably connected in the horizontal transverse groove;

[0015] The interior of the guide block is movably connected to a screw rod through a bearing, and the rod is threadedly connected to the screw rod through a thread groove opened in the middle. A motor for driving the screw rod to rotate is fixedly installed on the outside of the guide block.

[0016] The present invention also provides an operating method for an automatic packaging device suitable for BGA chip processing, comprising the following steps:

[0017] Step 1: Preparation of substrate and BGA chip: Place the substrate on the packaging platform, fix it with electric push rod and corner alignment frame, place the BGA chip on the pneumatic suction cup and adsorb it, and the linkage frame drives the connecting plate to move down in preparation for the follow-up;

[0018] Step 2: Horizontal positioning of the BGA chip: The roller moves from longitudinal groove 1 to longitudinal groove 2 and then to longitudinal groove 1. The alignment clamp aligns the two ends of the BGA chip. After the electromagnetic guide rod is energized and the I-type track block is fixed, the clamping of the BGA chip is released again.

[0019] Step 3: BGA chip and substrate are bonded and welded: The BGA chip is placed close to the pneumatic suction cup 2 to the lowest position. After it contacts the alignment plate, the electromagnetic guide rod fixes the BGA chip, and the suction cup 2 absorbs the BGA chip, driving it to bond with the substrate, and finally welded with a hot air gun.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] 1. Through a step-by-step position calibration method, during the horizontal lateral position calibration process, the linkage between the directional slide and the roller ensures the smooth and precise movement of the alignment clamp, avoiding the uneven force and displacement deviation of the chip caused by the traditional rigid clamping structure, effectively improving the calibration accuracy and stability, and reducing the risk of chip damage during the lateral calibration process. Secondly, in the horizontal longitudinal position calibration stage, the mutual cooperation between the electromagnetic guide rod, the slide bar and the alignment collision plate further enhances the accuracy and controllability of the calibration, and cooperates with the alignment collision plate to fine-tune the longitudinal position of the chip. This precise step-by-step operation can adapt to BGA chips of different sizes and shapes, greatly improving the versatility and flexibility of the equipment.

[0022] 2. In terms of stress, the synergy between various components ensures the smooth transmission and uniform application of force, which greatly reduces the stress on the BGA chip during the position calibration process and distributes it evenly, avoiding the occurrence of stress concentration, greatly reducing the potential defects of the chip caused by stress problems, and significantly improving the reliability and stability of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to facilitate understanding by those skilled in the art, the present invention will be further described below with reference to the accompanying drawings;

[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 Schematic diagram of the guide rail structure in the present invention;

[0026] Figure 3 Schematic diagram of the vertical rod structure in the present invention;

[0027] Figure 4 Schematic diagram of the sliding frame structure of the present invention;

[0028] Figure 5 Schematic diagram of the sliding horizontal track frame structure in the present invention;

[0029] Figure 6 Schematic diagram of the corner alignment frame structure in the present invention;

[0030] Figure 7 It is a bottom view of the guide shift block structure in the present invention.

[0031] Figure numerals: 1. Machine base; 2. Machine top cover; 3. Support frame assembly; 4. Support carrier plate; 5. Guide block; 6. Connecting plate; 7. Sliding frame; 8. I-shaped slider; 10. Packaging platform; 111. Horizontal track frame; 112. I-shaped track block; 113. Electromagnetic guide rod; 114. Longitudinal track frame; 12. Pneumatic suction cup 1; 13. Linkage frame; 14. Limiting guide rod; 15. Guide rail; 16. Directional slide rail; 17. Telescopic sleeve assembly; 18. Alignment splint; 19. Roller; 20. Alignment collision plate; 21. Lifting push rod; 22. Pneumatic suction cup 2; 23. Corner alignment frame; 24. Vertical rod. DETAILED DESCRIPTION

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0033] Example 1: Figure 1-Figure 7 As shown, an automatic packaging device suitable for BGA chip processing includes a machine base 1, a machine top cover 2 and a support frame group 3. The top of the machine base 1 is fixedly installed with a packaging platform 10 through a column, and the machine top cover 2 is fixedly installed with a supporting plate 4 through a bracket at the bottom. A guide block 5 is fixedly installed at the midpoint of the bottom of the supporting plate 4. The bottom of the guide block 5 is symmetrically provided with a guide groove, and a sliding frame 7 is provided below the guide groove. An I-type slider 8 is slidably connected in the guide groove. A connecting plate 6 is provided below the sliding frame 7, and a two-way adjustment component is provided at the bottom of the connecting plate 6, as shown in FIG. Figure 4 As shown, the bottom end of the sliding frame 7 is not fixedly connected to the connecting plate 6;

[0034] The bidirectional adjustment assembly includes two transverse track frames 111 and an I-shaped track block 112 slidably connected to the interior of the transverse track frame 111. A longitudinal track frame 114 is fixedly mounted on the bottom of the I-shaped track block 112. A slide bar is slidably connected to the interior of the longitudinal track frame 114. Electromagnetic guide rods 113 are fixedly mounted on the inner side walls of the transverse track frame 111 and the longitudinal track frame 114. A pneumatic suction cup 12 is fixedly mounted on the bottom of the slide bar.

[0035] The bottom of the supporting carrier plate 4 is symmetrically fixed with a positioning collision plate 20, the bottom of the guide block 5 is symmetrically fixed with a lifting push rod 21, and the bottom end of the lifting push rod 21 is fixed with a pneumatic suction cup 22. The pneumatic suction cup 12 and the pneumatic suction cup 22 are both existing equipment, and their function is to adsorb and move the BGA chip, and the distance between the two pneumatic suction cups 12 is greater than the width of the pneumatic suction cup 22.

[0036] A linkage frame 13 is fixedly connected to the top midpoint of the connecting plate 6, and a limit guide rod 14 is fixedly connected to the inner side wall of the linkage frame 13. A guide rail 15 is fixedly connected to the bottom of the guide block 5, and the limit guide rod 14 is slidably connected to the guide rail groove opened on the side wall of the guide rail 15.

[0037] A vertical rod 24 is fixedly mounted on the inner side wall of the sliding frame 7 , and a sliding sleeve that cooperates with the vertical rod 24 is fixedly mounted on the top of the outer side wall of the linkage frame 13 .

[0038] The two opposite side walls of the guide block 5 are fixedly connected with directional slide rails 16. The directional groove at the bottom of the directional slide rail 16 is shaped as follows: Figure 2 As shown, the directional groove is composed of two horizontal longitudinal grooves 1, two symmetrical oblique grooves and one horizontal longitudinal groove 2. The side wall of the sliding frame 7 is fixedly connected with a telescopic sleeve assembly 17. The telescopic sleeve assembly 17 is composed of a telescopic rod and a sleeve. The telescopic rod is slidably connected in the sleeve. The bottom of the telescopic rod included in the telescopic sleeve assembly 17 is fixedly connected with a positioning splint 18, and the top of the telescopic rod is movably connected with a roller 19 that cooperates with the directional groove opened at the bottom of the directional slide rail 16 through a bearing.

[0039] The bottom end of the I-shaped slider 8 is fixedly connected to the bottom of the sliding frame 7, and the I-shaped track block 112 and the slide bar are respectively slidably connected to the outer side of the corresponding electromagnetic guide rod 113 through the through grooves opened on their side walls, and the inner walls of the through grooves of the I-shaped track block 112 and the slide bar are fixedly installed with metal sheets that cooperate with the electromagnetic guide rod 113, such as Figure 4 As shown, a wire for energizing the electromagnetic guide rod 113 is provided on the outer side of the transverse track frame 111;

[0040] like Figure 4As shown, the top and bottom ends of the support frame group 3 are fixedly connected to the bottom of the machine top cover 2 and the top of the machine base 1 respectively. A horizontal transverse groove connected to the two guide slide grooves is also provided inside the guide block 5. A shift rod is fixedly connected between the two I-shaped sliders 8, and the shift rod is slidably connected in the horizontal transverse groove. The inside of the guide block 5 is movably connected to a screw rod through a bearing, and the shift rod is threadedly connected to the screw rod through a threaded groove opened in the middle. A motor for driving the screw rod to rotate is fixedly installed on the outside of the guide block 5. The motor drives the screw rod to rotate, and further drives the shift rod to drive the I-shaped slider 8 to move horizontally back and forth along the guide block 5, thereby realizing continuous transportation of BGA chips.

[0041] During the specific setting, the BGA chip is placed on the bottom of the pneumatic suction cup 12 and is adsorbed by the pneumatic suction cup 12. The external motor drives the screw rod to rotate, and further drives the I-shaped slider 8 to slide in the guide groove in a directional manner by driving the shift rod. During the sliding process, the limiting guide rod 14 slides along the guide groove opened obliquely downward. As the height of the limiting guide rod 14 gradually decreases, the position of the BGA chip also decreases synchronously, prompting the linkage frame 13 to use the sliding sleeves on the two outer walls to drive the connecting plate 6 to move gradually downward along the vertical rod 24;

[0042] While the I-shaped slider 8 moves horizontally, the roller 19 moves along the directional groove at the bottom of the directional slide rail 16. When the roller 19 moves from the longitudinal groove 1 on the outer edge of the directional slide rail 16 through the oblique groove to the horizontal longitudinal groove 2, the roller 19 drives the telescopic rod and the alignment clamp 18 fixedly connected to its bottom to move inward. The two alignment clamps 18 approach each other and align the two ends of the BGA chip. The BGA chip is driven by the alignment clamp 18 during the alignment process.

[0043] When the two alignment clamps 18 are not aligned with the horizontal longitudinal groove 2, the two ends of the BGA chip are always assisted in positioning and tightening. The BGA chip drives the I-type track block 112 to slide in the horizontal track frame 111 through the sliding bar on the top of the pneumatic suction cup 12 and the longitudinal track frame 114. The I-type track block 112 moves synchronously on the outside of the electromagnetic guide rod 113 until the horizontal position of the BGA chip is calibrated. At this time, the corresponding electromagnetic guide rod 113 is energized and fixed to the metal sheet on the inner wall of the through groove of the I-type track block 112, further limiting the movement of the I-type track block 112.

[0044] When the roller 19 moves from the longitudinal groove 2 on the inner side of the directional slide rail 16 through the oblique groove to the horizontal longitudinal groove 1, the roller 19 drives the telescopic rod and the alignment clamp 18 fixedly connected to its bottom to move outward, and the two alignment clamps 18 move away from each other and release the alignment of the two ends of the BGA chip. After the I-shaped track block 112 is energized and fixed by the electromagnetic guide rod 113, the BGA chip will no longer be shaken by external interference during the movement.

[0045] Example 2: Figure 6 As shown, the four corners of the top of the packaging platform 10 are each provided with an oblique groove, in which a push block is slidably connected, and a corner alignment frame 23 is fixedly installed on the top of the push block. An electric push rod for driving the push block to slide is fixedly installed on the outside of the packaging platform 10. The substrate for packaging with the BGA chip is placed on the top of the packaging platform 10. The electric push rod drives the push block to further drive the corner alignment frame 23 to move. The four corners of the substrate on the top of the packaging platform 10 are positioned and fixed by using multiple corner alignment frames 23, thereby further improving the packaging accuracy of the BGA chip and the substrate.

[0046] It should be explained here that the corner alignment frames 23 move in pairs, not synchronously, to avoid the forces in four directions being applied simultaneously at an instant, which would cause uneven forces on the substrate. If there is a slight deviation in the position accuracy or the magnitude of the force applied by one or more of the clamping claws, the substrate may easily be slightly twisted or deformed, thereby affecting the alignment accuracy.

[0047] Before the BGA chip is lowered, the substrate needs to be placed on the top of the packaging platform 10, and the four corners of the substrate need to be aligned and fixed using the electric push rod and the corner alignment frame 23. When the BGA chip is close to the pneumatic suction cup 22 under the cooperation of the limiting guide rod 14 and the guide groove, and the BGA chip is at the lowest position, the pneumatic suction cup 22 is located in the gap between the two pneumatic suction cups 12;

[0048] During this process, one end of the BGA chip first contacts the alignment striker 20, and further drives the slider to slide outside the electromagnetic guide rod 113 in the longitudinal track frame 114. When the BGA chip is aligned in the horizontal and vertical positions under the action of the alignment striker 20, the corresponding electromagnetic guide rod 113 is energized to generate magnetic force and is fixed to the metal sheet on the inner wall of the slider groove, further restricting the movement of the BGA chip.

[0049] Then the lifting push rod 21 drives the pneumatic suction cup 22 to descend and fix the top of the BGA chip. The pneumatic suction cup 12 releases the adsorption of the top of the BGA chip. The lifting push rod 21 drives the BGA chip to move down accurately through the pneumatic suction cup 22 and fits it with the specific position of the substrate on the top of the packaging platform 10. Then a hot air gun is used to accurately package and weld the two.

[0050] The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the present invention to specific embodiments. Obviously, many modifications and variations are possible based on the contents of this specification. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better understand and utilize the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. An automatic packaging device suitable for BGA chip processing, comprising a machine base (1), a machine top cover (2) and a support frame group (3), characterized in that: The top of the machine base (1) is fixedly mounted with a packaging platform (10) through a platform column, the machine top cover (2) is fixedly mounted with a supporting plate (4) through a bracket at the bottom, a guide block (5) is fixedly mounted at the bottom midpoint of the supporting plate (4), a guide slot is symmetrically provided at the bottom of the guide block (5), a sliding frame (7) is provided below the guide slot, an I-shaped slider (8) is slidably connected in the guide slot, a connecting plate (6) is provided below the sliding frame (7), and a two-way adjustment component is provided at the bottom of the connecting plate (6); The bidirectional adjustment component comprises two transverse track frames (111) and an I-type track block (112) slidably connected to the interior of the transverse track frame (111); a longitudinal track frame (114) is fixedly installed at the bottom of the I-type track block (112); a slide bar is slidably connected to the interior of the longitudinal track frame (114); electromagnetic guide rods (113) are fixedly installed on the inner side walls of the transverse track frame (111) and the longitudinal track frame (114); and a pneumatic suction cup (12) is fixedly installed at the bottom of the slide bar.

2. The automatic packaging equipment suitable for BGA chip processing according to claim 1, characterized in that: A linkage frame (13) is fixedly connected at the top midpoint of the connecting plate (6), a limiting guide rod (14) is fixedly connected to the inner side wall of the linkage frame (13), a guide rail (15) is fixedly connected to the bottom of the guide block (5), and the limiting guide rod (14) is slidably connected in a guide rail groove provided on the side wall of the guide rail (15).

3. The automatic packaging equipment suitable for BGA chip processing according to claim 2, characterized in that: A vertical rod (24) is fixedly mounted on the inner side wall of the sliding frame (7), and a sliding sleeve that cooperates with the vertical rod (24) is fixedly mounted on the top of the outer side wall of the linkage frame (13).

4. The automatic packaging equipment suitable for BGA chip processing according to claim 3, characterized in that: The two opposite side walls of the guide block (5) are fixedly connected with directional slide rails (16), and the side walls of the sliding frame (7) are fixedly connected with a telescopic sleeve assembly (17). The telescopic sleeve assembly (17) is composed of a telescopic rod and a sleeve. The bottom of the telescopic rod included in the telescopic sleeve assembly (17) is fixedly connected with a positioning clamp (18), and the top of the telescopic rod is movably connected with a roller (19) that matches the directional groove opened at the bottom of the directional slide rail (16) through a bearing.

5. The automatic packaging equipment suitable for BGA chip processing according to claim 4, characterized in that: A counter-collision plate (20) is symmetrically fixedly installed on the bottom of the supporting plate (4), a lifting push rod (21) is symmetrically fixedly installed on the bottom of the guiding block (5), and a pneumatic suction cup 2 (22) is fixedly installed on the bottom end of the lifting push rod (21).

6. The automatic packaging equipment suitable for BGA chip processing according to claim 5, characterized in that: The bottom end of the I-shaped slider (8) is fixedly connected to the bottom of the sliding frame (7); the I-shaped track block (112) and the slide bar are respectively slidably connected to the outer side of the corresponding electromagnetic guide rod (113) through the through slots opened on their side walls; and the inner walls of the through slots of the I-shaped track block (112) and the slide bar are fixedly mounted with metal sheets that match the electromagnetic guide rod (113).

7. The automatic packaging equipment suitable for BGA chip processing according to claim 6, characterized in that: The four corners of the top of the packaging platform (10) are all provided with oblique grooves, in which sliding blocks are slidably connected, a corner alignment frame (23) is fixedly installed on the top of the sliding block, and an electric push rod for driving the sliding block to slide is fixedly installed on the outside of the packaging platform (10).

8. The automatic packaging equipment suitable for BGA chip processing according to claim 7, characterized in that: The top and bottom ends of the support frame group (3) are fixedly connected to the bottom of the machine top cover (2) and the top of the machine base (1), respectively. A horizontal transverse groove connected to the two guide slide grooves is also provided inside the guide block (5). A shift rod is fixedly connected between the two I-shaped slide blocks (8), and the shift rod is slidably connected in the horizontal transverse groove.

9. An operating method for an automatic packaging device suitable for BGA chip processing, using the automatic packaging device suitable for BGA chip processing according to any one of claims 1 to 8, characterized in that: The following steps are involved: Step 1: Preparation of substrate and BGA chip: Place the substrate on the packaging platform (10), fix it with the electric push rod and the corner alignment frame (23), place the BGA chip on the pneumatic suction cup (12) for adsorption, and the linkage frame (13) drives the connecting plate (6) to move downward to prepare for the subsequent process; Step 2: Horizontal positioning of the BGA chip: the roller (19) moves from longitudinal groove 1 to longitudinal groove 2 and then to longitudinal groove 1, and the alignment clamp (18) aligns the two ends of the BGA chip. After the electromagnetic guide rod (113) is energized and the I-type track block (112) is fixed, the clamping of the BGA chip is released again; Step 3: BGA chip and substrate are bonded and welded: the BGA chip is moved close to the pneumatic suction cup 2 (22) to the lowest position, and after contacting the alignment collision plate (20), the electromagnetic guide rod (113) fixes the BGA chip, and the suction cup 2 absorbs the BGA chip, driving it to bond with the substrate, and finally welding is performed with a hot air gun.

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