Wafer surface treatment mechanism and wafer surface treatment equipment

Abstract

The invention relates to the technical field of semiconductor material processing, and provides a wafer surface processing mechanism and wafer surface processing device.The wafer surface processing mechanism comprises an equipment rack, the equipment rack comprises a loading area, a displacement area and a processing area, and the wafer surface processing mechanism further comprises a through groove, a sliding frame, a negative pressure clamping assembly, a secondary clamping assembly and a cleaning assembly; two through grooves are symmetrically formed in the equipment rack, the two through grooves are symmetrically arranged, the sliding frame is arranged between the two through grooves in a sliding mode, the negative pressure clamping assembly is installed on the sliding frame, the secondary clamping assembly is installed in the treatment area, and the cleaning assembly is installed in the treatment area. The technical problems that in the prior art, due to the fact that the wafer is thin, the wafer is prone to damage in the cleaning process, cleaning liquid residues are prone to occurring, the wafer is subjected to secondary pollution, and then the cleaning effect is affected are solved.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to the technical field of semiconductor material processing, and more specifically, to a wafer surface treatment mechanism and a wafer surface treatment device. Background Art

[0002] A wafer is a thin slice made of semiconductor material and is an indispensable part of modern electronic devices. It is also known as an integrated circuit chip or chip, and is a semiconductor block with miniaturized electronic components designed to perform multiple functions on the same single circuit board. The core part of the wafer is the silicon substrate, which provides the support structure for the electronic components.

[0003] To improve the surface quality of the wafer and increase the yield rate, it is also necessary to clean the surface of the wafer. The contaminants on the wafer surface mainly include adsorbed ions and elements, thin films, discrete particles, microparticles (particle clusters), and adsorbed gases. These contaminants may come from sources such as equipment, processing chemicals, operating factors, gas pipelines, wafer processing, and thin film deposition systems. Effective surface cleaning can remove these contaminants and ensure the smooth progress of subsequent process steps.

[0004] During the cleaning process, it is necessary to hold the wafer. Since the wafer itself is very thin, it is difficult to effectively clean the clamped part during the cleaning process, and it is easily damaged during the cleaning process. In addition, if the wafer is successfully cleaned during the cleaning process and not handled properly after cleaning, such as not being dried in time after cleaning, the crystal may be re - contaminated by the impurities in the cleaning liquid remaining on the crystal, making it difficult to thoroughly clean the wafer. Summary of the Invention

[0005] To overcome the above - mentioned defects, embodiments of the present disclosure provide a wafer surface treatment mechanism and a wafer surface treatment device, which solve the technical problems in the prior art that due to the thinness of the wafer itself, it is easily damaged during the cleaning process, and it is prone to residual cleaning liquid, resulting in secondary contamination of the wafer and thus affecting the cleaning effect.

[0006] A wafer surface treatment mechanism includes an equipment frame. The equipment frame includes a loading area, a displacement area, and a processing area, and further includes: Through - slots, two through - slots are symmetrically opened on the equipment frame, and the two through - slots are symmetrically arranged; A sliding frame, the sliding frame is slidably arranged between the two through - slots; A negative - pressure clamping assembly, the negative - pressure clamping assembly is installed on the sliding frame and is used for clamping the wafer; A secondary clamping assembly, the secondary clamping assembly is installed inside the processing area and is used for clamping the other end of the wafer; Cleaning component, which is installed inside the processing area and used to clean both ends of the wafer.

[0007] Based on the above solution, the negative pressure clamping component includes: Mounting frame, which is fixedly installed on the top of the sliding frame; First clamping disc, which is fixedly installed on the sliding frame and is of a hollow structure; First clamping groove, and two such first clamping grooves are coaxially and symmetrically provided at both ends of the first clamping disc; Adsorption clamping part, which is installed on the mounting frame and used to fix the wafer.

[0008] Based on the above solution, the adsorption clamping part includes: First air pump, which is fixedly installed on the mounting frame; First air pipe, which is connected between the first clamping disc and the input end of the first air pump; First air inlet holes, and a plurality of such first air inlet holes are equidistantly provided on both of the first clamping grooves.

[0009] Based on the above solution, the secondary clamping component includes: Pushing frame, and two such pushing frames are symmetrically arranged inside the processing area; First electric cylinder, and the first electric cylinder is fixedly installed on both sides of the equipment frame, and the output end of the first electric cylinder is fixedly connected to the pushing frame; Second clamping disc, and the second clamping disc is fixedly installed on both of the pushing frames and is of a hollow structure; Second clamping groove, and the second clamping groove is provided on both of the second clamping discs; Carrying frame, and two such carrying frames are symmetrically and fixedly installed on the equipment frame.

[0010] Based on the above solution, it further includes: Second air pump, and the second air pump is fixedly installed inside both of the carrying frames; Second air pipe, and the input ends of both of the second air pumps are connected with the second air pipe, and the second air pipe is connected to the second clamping disc; Second air inlet holes, and a plurality of such second air inlet holes are equidistantly provided on both of the second clamping grooves.

[0011] Based on the above solution, the cleaning component includes: Sliding frame, and two such sliding frames are symmetrically and slidably installed inside the processing area; Cleaning rollers, the cleaning rollers are installed on both of the two sliding frames in an inclined and rotatable manner; Cleaning sleeves, the cleaning sleeves are fixedly sleeved on both of the two cleaning rollers; Spiral grooves, the spiral grooves are formed on both of the two cleaning sleeves; Water tank, the water tank is fixedly installed at the bottom of the equipment frame; Second electric cylinders, two of the second electric cylinders are symmetrically and fixedly installed inside the processing area, and the output ends of the second electric cylinders are fixedly connected to the sliding frames; Blowing part, the blowing part is installed on the sliding frame and is used for blowing the wafer; Driving part, the driving part is installed on the sliding frame and is used for driving the cleaning roller to rotate.

[0012] On the basis of the foregoing solution, the blowing part includes: Spraying pipes, the spraying pipes are fixedly installed inside both of the two sliding frames; Water spray heads, two groups of the water spray heads are symmetrically installed on both of the two spraying pipes, the two groups of water spray heads are respectively located on both sides of the cleaning sleeve, and each group of water spray heads is provided with a plurality of the water spray heads at equal distances; Drain pipes, the drain pipes are communicated with both of the two spraying pipes.

[0013] On the basis of the foregoing solution, it further includes: Air spraying pipes, the air spraying pipes are fixedly installed inside both of the two sliding frames; Air jet heads, two groups of the air jet heads are symmetrically installed on both of the two air spraying pipes, the two groups of air jet heads are respectively located on both sides of the cleaning sleeve, and each group of air jet heads is provided with a plurality of the air jet heads at equal distances; Exhaust pipes, the exhaust pipes are communicated with both of the two air spraying pipes; Connectors, the tails of the two exhaust pipes and the tails of the two drain pipes are both communicated with the connectors, and the connectors are fixedly installed on the equipment frame.

[0014] On the basis of the foregoing solution, the driving part includes universal joints, the universal joints are fixedly installed at the ends of both of the two cleaning rollers, and it further includes: First motors, the first motors are fixedly installed inside both of the two sliding frames; Driven gears, the driven gears are rotatably installed inside both of the two sliding frames, and the driven gears are fixedly connected to the universal joints; Driving gears, the driving gears are fixedly installed at the output ends of both of the two first motors; Drive gears are rotatably installed inside both of the sliding frames, and the drive gears are meshed with the driven gears and the driving gears.

[0015] A wafer surface treatment device uses the above-mentioned wafer surface treatment mechanism, and includes: A second motor, which is fixedly installed on the device frame; A screw rod, which is rotatably installed inside the displacement area; A nut, which is threadedly sleeved on the screw rod, and the nut is fixedly installed on the mounting frame; Guide rods, two of the guide rods are symmetrically and fixedly installed inside the displacement area, and both of the guide rods are slidably matched with the mounting frame.

[0016] The beneficial effects of the embodiments of the present disclosure are as follows: 1. In the present disclosure, the wafer is placed in the first clamping groove, the first air pump is started, the air inside the first clamping disc is extracted through the first air pipe, so that the inside of the first clamping disc is in a negative pressure state. At the same time, the first air inlet hole will suck external air into the first clamping disc. When the wafer is in the first clamping groove, through the setting of the first air inlet hole, the wafer can be adsorbed in the first clamping groove, achieving the effect of fixing the wafer, thereby ensuring the stability and safety of the wafer during the processing. The design of the second clamping groove is similar to that of the first clamping groove, and through the second air pump and the second air pipe, the adsorption and fixation of the wafer can also be realized, ensuring the rapid replacement and continuous processing of the wafer, effectively fixing the wafer, and not affecting the cleaning quality.

[0017] 2. In the present disclosure, the cleaning roller drives the cleaning sleeve to rotate, so as to clean the end face of the wafer through the cleaning sleeve. Through the setting of the spiral groove, the cleaning liquid is evenly distributed on the end face of the wafer, enhancing the cleaning effect and improving the cleaning efficiency. The obliquely arranged cleaning roller optimizes the cleaning quality, and at the same time can also reduce the possibility of secondary pollution of the impurities removed, reducing the risk of scratching the surface of the wafer, and ensuring the cleanliness and yield during the processing.

[0018] 3. In the present disclosure, when it is necessary to spray the cleaning liquid, the water spray head is opened to spray the cleaning liquid on the wafer. After spraying the cleaning liquid, the exhaust pipe is inflated through the corresponding pipeline. At this time, the air jet head is opened to blow air on the wafer and other positions, so as to avoid the residue of the cleaning liquid, and further clean the wafer and other parts, and at the same time ensure that the end face of the wafer after cleaning will not be polluted, thereby improving the overall processing effect and product quality.

[0019] 4. In the present disclosure, through the cooperation of the negative pressure clamping assembly and the secondary clamping assembly, while ensuring stable fixation of the wafer and preventing displacement during cleaning, the clamping position of the wafer can be quickly changed, thereby cleaning both ends of the wafer, improving the cleaning efficiency, reducing the possibility of wafer damage. Through the setting of the cleaning assembly, the cleaned position is purged when spraying the cleaning liquid, thereby reducing the residue of the cleaning liquid on the wafer, avoiding secondary contamination of the wafer, and further improving the cleaning quality of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the following will briefly introduce the drawings required for the description of the embodiments of the present disclosure. Obviously, the drawings described below are only some exemplary embodiments of the present disclosure. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on the content of the exemplary embodiments of the present disclosure and these drawings.

[0021] Figure 1 Schematic diagram of the overall structure in the present invention; Figure 2 Schematic diagram of the overall structure from another angle in the present invention; Figure 3 Schematic diagram of the sectional three-dimensional structure in the present invention; Figure 4 Schematic diagram of the sectional structure of the negative pressure clamping assembly in the present invention; Figure 5 Schematic diagram of the sectional structure of the cooperation between the secondary clamping assembly and the equipment frame in the present invention; Figure 6 Schematic diagram of the sectional structure of the secondary clamping assembly in the present invention; Figure 7 Schematic diagram of the sectional structure of the cooperation between the cleaning assembly and the equipment frame in the present invention; Figure 8 Schematic diagram of the sectional structure of the cleaning assembly in the present invention; Figure 9 Schematic diagram of the sectional structure of the cleaning assembly from another angle in the present invention; Figure 10 Schematic diagram of the sectional structure of the cooperation between the mounting bracket, the screw rod and the nut in the present invention.

[0022] In the figure: 1. equipment frame; 2. through groove; 3. sliding frame; 4. mounting frame; 5. first clamping plate; 6. first clamping groove; 7. first air pump; 8. first air pipe; 9. first air inlet; 10. pushing frame; 11. first electric cylinder; 12. second clamping plate; 13. second clamping groove; 14. bearing frame; 15. second air pump; 16. second air pipe; 17. second air inlet; 18. sliding frame; 19. cleaning roller; 20. cleaning sleeve; 21. spiral groove; 22. water tank; 23. spray pipe; 24. water spray head; 25. drain pipe; 26. jet pipe; 27. jet head; 28. exhaust pipe; 29. ​​joint; 30. universal joint; 31. first motor; 32. driven gear; 33. driving gear; 34. transmission gear; 35. second motor; 36. screw; 37. nut; 38. guide rod. DETAILED DESCRIPTION

[0023] The present disclosure is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present disclosure, rather than to limit the present disclosure.

[0024] In order to simplify the drawings, only the parts related to the disclosure are schematically shown in each figure, and they do not represent the actual structure of the product. In addition, in order to simplify the drawings and facilitate understanding, in some figures, only one of the parts with the same structure or function is schematically shown, or only one of them is marked. In this article, "one" not only means "only one", but also means "more than one", and "several" includes "two" and "more than two".

[0025] In this document, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this disclosure can be understood according to specific circumstances.

[0026] In the present disclosure, unless otherwise expressly specified and limited, a first feature being “above” or “below” a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being “above”, “above”, and “above” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0027] In the description of this embodiment, the orientation or positional relationships such as "upper", "lower", "left", "right", etc. are based on the orientation or positional relationships shown in the drawings. They are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present disclosure.

[0028] In addition, in the description of this application, the terms "first", "second", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0029] As Figures 1 to 10 shown, it shows a wafer surface treatment mechanism in the present disclosure, including an equipment frame 1. The equipment frame 1 includes a loading area, a displacement area, and a processing area. It also includes a through groove 2, a sliding frame 3, a negative pressure clamping assembly, a secondary clamping assembly, and a cleaning assembly. Two through grooves 2 are symmetrically opened on the equipment frame 1, and the two through grooves 2 are symmetrically arranged. The sliding frame 3 is slidably arranged between the two through grooves 2. The negative pressure clamping assembly is installed on the sliding frame 3 and is used to clamp the wafer. The negative pressure clamping assembly includes a mounting frame 4, a first clamping disc 5, a first clamping groove 6, and an adsorption clamping part. The mounting frame 4 is fixedly installed on the top of the sliding frame 3. The first clamping disc 5 is fixedly installed on the sliding frame 3. The first clamping disc 5 is a hollow structure. Two first clamping grooves 6 are coaxially and symmetrically opened at both ends of the first clamping disc 5. The adsorption clamping part is installed on the mounting frame 4 and is used to fix the wafer.

[0030] Specifically, in order to remove chemical and particulate impurities on the wafer, ensure that the wafer surface is clean and pollution-free, and reduce the adverse effects of residual contaminants on the operation of semiconductor devices, which may lead to product failure, it is necessary to clean the surface of the wafer. At this time, first place the wafer to be cleaned into the first clamping grooves 6 on both sides of the first clamping plate 5. The thickness of the wafer is greater than the depth of the first clamping groove 6. At this time, start the adsorption clamping part to adsorb the wafer in the first clamping groove 6. Then, through the setting of the mounting frame 4, push the sliding frame 3 to move in the two through grooves 2 until the sliding frame 3 drives the first clamping plate 5 to move to the cleaning position. Then, fix the relative position of the sliding frame 3 and the through groove 2, so as to fix the wafer in the first clamping groove 6. Then start the cleaning component. The cleaning component cleans one end of the wafer in the first clamping groove 6 and simultaneously cleans the working end of the secondary clamping component. After completion, retract the cleaning component, start the secondary clamping component to move to the working position. At this time, turn off the adsorption clamping part, start the secondary clamping component to fix the wafer, so that the uncleaned end of the wafer is exposed. Then move the wafer back to the cleaning position, start the cleaning component again to clean the other end face of the wafer, and simultaneously clean the first clamping grooves 6 on both sides of the first clamping plate 5 to avoid contaminating the wafer after contacting it. After the cleaning is completed, place the wafer on the secondary clamping component back into the first clamping groove 6 and fix the wafer through the adsorption clamping part. Then lift the sliding frame 3 to its original position, and the cleaned wafer can be taken out.

[0031] As described above, Figure 4 As shown in the figure, the adsorption clamping part includes a first air pump 7, a first air pipe 8, and a first air inlet hole 9. The first air pump 7 is fixedly installed on the mounting frame 4. The first air pipe 8 is connected between the first clamping plate 5 and the input end of the first air pump 7. A plurality of first air inlet holes 9 are evenly arranged on the two first clamping grooves 6.

[0032] Specifically, when it is necessary to fix the wafer in the first clamping groove 6, first place the wafer into the first clamping groove 6. At this time, start the first air pump 7. The first air pump 7 extracts the air in the first clamping plate 5 through the first air pipe 8, making the inside of the first clamping plate 5 in a negative pressure state. At the same time, the first air inlet hole 9 will suck the external air into the first clamping plate 5. When the wafer is in the first clamping groove 6, through the setting of the first air inlet hole 9, the wafer can be adsorbed in the first clamping groove 6, thus achieving the effect of fixing the wafer. When it is necessary to take out the wafer, just turn off the first air pump 7.

[0033] As Figures 5 to 7As shown, the secondary clamping assembly is installed inside the processing area and is used to clamp the other end of the wafer. The secondary clamping assembly includes a pushing frame 10, a first electric cylinder 11, a second clamping disc 12, a second clamping groove 13, and a bearing frame 14. Two pushing frames 10 are symmetrically arranged inside the processing area. The first electric cylinders 11 are fixedly installed on both sides of the equipment frame 1. The output end of the first electric cylinder 11 is fixedly connected to the pushing frame 10. The second clamping discs 12 are fixedly installed on both pushing frames 10. The second clamping disc 12 is a hollow structure. The second clamping grooves 13 are formed on both second clamping discs 12. Two bearing frames 14 are symmetrically and fixedly installed on the equipment frame 1. It also includes a second air pump 15, a second air pipe 16, and a second air inlet hole 17. The second air pumps 15 are fixedly installed inside both bearing frames 14. The input ends of both second air pumps 15 are communicated with the second air pipe 16. The second air pipe 16 is communicated with the second clamping disc 12. A plurality of second air inlet holes 17 are equidistantly formed on both second clamping grooves 13.

[0034] Specifically, after the wafer is clamped in the first clamping groove 6 and the cleaning is completed, the cleaning assembly is retracted, and the first electric cylinder 11 is started. The first electric cylinder 11 drives the pushing frame 10 to move until the pushing frame 10 drives the second clamping disc 12 to move to the position of the first clamping disc 5. At this time, a part of the wafer in the first clamping groove 6 is in the second clamping groove 13. The second air pump 15 is started. The second air pump 15 extracts the air inside the second clamping disc 12 through the second air pipe 16, making the inside of the second clamping disc 12 in a negative pressure state. At the same time, the second air inlet hole 17 will suck the external air into the second clamping disc 12. At the same time, the first air pump 7 is turned off, and the wafer can be fixed inside the second clamping groove 13. Then the first electric cylinder 11 is retracted. Through the arrangement of the pushing plate and the second clamping disc 12, the wafer is moved back to the cleaning position, and the wafer can be cleaned. After the other end of the wafer is cleaned, the first electric cylinder 11 is restarted. The pushing plate drives the second clamping disc 12 to move until the wafer on the second clamping groove 13 enters the first clamping groove 6. At this time, the second air pump 15 is turned off, and the first air pump 7 is turned on. The wafer is placed back and fixed in the first clamping groove 6 again. Then through the arrangement of the mounting frame 4, the sliding frame 3 is lifted, and the first clamping disc 5 can be removed, and then the wafer can be taken out.

[0035] It should be added that the depth of the second clamping groove 13 is less than the thickness of the wafer.

[0036] Such as Figures 7 to 9As shown, the cleaning component is installed inside the processing area and is used to clean both ends of the wafer. The cleaning component includes a sliding frame 18, a cleaning roller 19, a cleaning sleeve 20, a spiral groove 21, a water tank 22, a second electric cylinder 39, a blowing part, and a driving part. Two sliding frames 18 are symmetrically and slidably installed inside the processing area. Cleaning rollers 19 are inclined and rotatably installed on both sliding frames 18. Cleaning sleeves 20 are fixedly sleeved on both cleaning rollers 19. Spiral grooves 21 are formed on both cleaning sleeves 20. The water tank 22 is fixedly installed at the bottom of the equipment frame 1. Two second electric cylinders 39 are symmetrically and fixedly installed inside the processing area. The output end of the second electric cylinder 39 is fixedly connected to the sliding frame 18. The blowing part is installed on the sliding frame 18 and is used to blow the wafer. The driving part is installed on the sliding frame 18 and is used to drive the cleaning roller 19 to rotate.

[0037] Specifically, when cleaning the wafer in the first clamping groove 6, start the second electric cylinder 39. The second electric cylinder 39 pushes the sliding frame 18 to move. The sliding frame 18 drives the cleaning roller 19 to move. At the same time, start the driving part. The driving part drives the cleaning roller 19 to rotate. The cleaning roller 19 drives the cleaning sleeve 20 to rotate, so as to clean the end face of the wafer through the cleaning sleeve 20. At the same time, turn on the blowing part and spray the cleaning liquid on the end face of the wafer during the cleaning process. Through the setting of the spiral groove 21, the cleaning liquid is evenly distributed on the end face of the wafer, enhancing the cleaning effect. The impurities cleaned off will be quickly taken away from the wafer surface and flow into the water tank 22 along with the cleaning liquid, ensuring the cleanliness of the wafer end face. At the same time, the sprayed cleaning liquid will also finally enter the water tank 22 along with the removed impurities, and then it can be cleaned regularly. After the cleaning is completed, retract the second electric cylinder 39. Then, after the wafer enters the second clamping groove 13, restart the second electric cylinder 39 to clean the other end of the wafer. After the cleaning is completed, retract the second electric cylinder 39 to make the sliding frame 18 return to the initial position.

[0038] The above-mentioned, such as Figure 8 、 Figure 9As shown in the figure, the spraying part includes a spray pipe 23, a water spray head 24 and a drain pipe 25. The spray pipes 23 are fixedly installed inside both of the two sliding frames 18. Two groups of water spray heads 24 are symmetrically installed on both of the two spray pipes 23. The two groups of water spray heads 24 are respectively located on both sides of the cleaning sleeve 20. Each group of water spray heads 24 is provided with a plurality of water spray heads 24 at equal intervals. The drain pipes 25 are communicated with both of the two spray pipes 23. It further includes an air spray pipe 26, an air spray head 27, an exhaust pipe 28 and a connector 29. The air spray pipes 26 are fixedly installed inside both of the two sliding frames 18. Two groups of air spray heads 27 are symmetrically installed on both of the two air spray pipes 26. The two groups of air spray heads 27 are respectively located on both sides of the cleaning sleeve 20. Each group of air spray heads 27 is provided with a plurality of air spray heads 27 at equal intervals. The exhaust pipes 28 are communicated with both of the two air spray pipes 26. The tails of the two exhaust pipes 28 and the tails of the two drain pipes 25 are both communicated with the connector 29. The connector 29 is fixedly installed on the equipment frame 1.

[0039] Specifically, when spraying the cleaning liquid, connect the corresponding pipeline to the drain pipe 25 through the connector 29, connect the corresponding pipeline to the exhaust pipe 28 through the connector 29, introduce the cleaning liquid into the drain pipe 25, and the cleaning liquid entering the drain pipe 25 fills the entire spray pipe 23. Then, when it is necessary to spray the cleaning liquid, turn on the water spray head 24 to spray the cleaning liquid on the wafer. After spraying the cleaning liquid, inflate the exhaust pipe 28 through the corresponding pipeline. At this time, turn on the air spray head 27 to blow air on the wafer and the first clamping plate 5 or the second clamping plate 12, so as to avoid the residue of the cleaning liquid and further clean the wafer and the rest of the parts.

[0040] It should be added that when the wafer is in the first clamping groove 6, during the cleaning process, through the settings of the air spray head 27 and the water spray head 24, the second clamping groove 13 is cleaned synchronously to ensure that the second clamping groove 13 does not contaminate the end face of the wafer after cleaning, and improve the processing quality.

[0041] As described above, such as Figure 8 、 Figure 9 As shown in the figure, the driving part includes a universal joint 30. The universal joints 30 are fixedly installed at the ends of both of the two cleaning rollers 19. It further includes a first motor 31, a driven gear 32, a driving gear 33 and a transmission gear 34. The first motors 31 are fixedly installed inside both of the two sliding frames 18. The driven gears 32 are rotatably installed inside both of the two sliding frames 18. The driven gear 32 is fixedly connected with the universal joint 30. The output ends of the two first motors 31 are fixedly installed with the driving gears 33. The transmission gears 34 are rotatably installed inside both of the two sliding frames 18. The transmission gear 34 meshes with the driven gear 32 and the driving gear 33.

[0042] Specifically, when it is necessary to drive the cleaning roller 19 to rotate, the first motor 31 is started. The first motor 31 drives the driving gear 33 to rotate, the driving gear 33 drives the transmission gear 34 to rotate, and the transmission gear 34 can drive the driven gear 32 to rotate. The driven gear 32 drives the cleaning roller 19 to rotate through the universal joint 30, achieving efficient cleaning.

[0043] As Figure 10 shown, a wafer surface treatment device uses the above-mentioned wafer surface treatment mechanism, including a second motor 35, a screw 36, a nut 37, and a guide rod 38. The second motor 35 is fixedly installed on the equipment frame 1. The screw 36 is rotatably installed inside the displacement area. The nut 37 is threadedly sleeved on the screw 36. The nut 37 is fixedly installed on the mounting bracket 4. Two guide rods 38 are symmetrically and fixedly installed inside the displacement area. Both guide rods 38 are slidably engaged with the mounting bracket 4.

[0044] Specifically, when it is necessary to adjust the position of the mounting bracket 4, the second motor 35 is started. The second motor 35 drives the screw 36 to rotate. The screw 36 drives the mounting bracket 4 to move along the guide rod 38 through the nut 37, thereby driving the sliding bracket 3 to move through the mounting bracket 4.

[0045] The working principle or usage process of this application is as follows: In order to remove chemical and particulate impurities on the wafer, ensure that the wafer surface is clean and pollution-free, and reduce the adverse effects of residual contaminants on the operation of semiconductor devices, which may lead to product failure. Therefore, it is necessary to clean the surface of the wafer. At this time, the wafer to be cleaned is first placed in the first clamping grooves 6 on both sides of the first clamping plate 5. The thickness of the wafer is greater than the depth of the first clamping grooves 6. At this time, the first air pump 7 is started. The first air pump 7 extracts the air inside the first clamping plate 5 through the first air pipe 8, making the inside of the first clamping plate 5 in a negative pressure state. At the same time, the first air inlet hole 9 will suck external air into the first clamping plate 5. When the wafer is in the first clamping groove 6, through the setting of the first air inlet hole 9, the wafer can be adsorbed in the first clamping groove 6, thus achieving the effect of fixing the wafer.

[0046] Then, through the setting of the mounting bracket 4, the second motor 35 is started. The second motor 35 drives the screw 36 to rotate. The screw 36 drives the mounting bracket 4 to move along the guide rod 38 through the nut 37, thereby driving the sliding bracket 3 to move in the two through slots 2 through the mounting bracket 4. Until the sliding bracket 3 drives the first clamping plate 5 to move to the cleaning position, the second motor 35 is turned off, and the relative position of the sliding bracket 3 and the through slot 2 can be fixed, thereby fixing the wafer in the first clamping groove 6, and then the wafer is started to be cleaned.

[0047] Before cleaning, connect the corresponding pipeline to the drain pipe 25 through the joint 29, and connect the corresponding pipeline to the exhaust pipe 28 through the joint 29. Then, start the second electric cylinder 39. The second electric cylinder 39 pushes the sliding frame 18 to move, and the sliding frame 18 drives the cleaning roller 19 to move. At the same time, start the first motor 31. The first motor 31 drives the driving gear 33 to rotate, the driving gear 33 drives the transmission gear 34 to rotate, and the transmission gear 34 can drive the driven gear 32 to rotate. The driven gear 32 drives the cleaning roller 19 to rotate through the universal joint 30, and the cleaning roller 19 drives the cleaning sleeve 20 to rotate, so as to clean the end face of the wafer through the cleaning sleeve 20.

[0048] During the cleaning process, introduce the cleaning liquid into the drain pipe 25. The cleaning liquid entering the drain pipe 25 fills the entire spray pipe 23. When it is necessary to spray the cleaning liquid, open the spray head 24 to spray the cleaning liquid on the wafer and the second clamping plate 12. After spraying the cleaning liquid, inflate the exhaust pipe 28 through the corresponding pipeline. At this time, open the air jet head 27 to blow air on the wafer and the second clamping plate 12, so as to avoid the residue of the cleaning liquid and further clean the wafer and the rest of the parts, ensure that the second clamping groove 13 will not contaminate the end face of the wafer after cleaning, improve the processing quality. Through the setting of the spiral groove 21, the cleaning liquid is evenly distributed on the end face of the wafer, enhancing the cleaning effect. The impurities cleaned off will be quickly taken away from the wafer surface and flow into the water tank 22 with the cleaning liquid, ensuring the cleanliness of the wafer end face. The sprayed cleaning liquid will also finally enter the water tank 22 along with the impurities to be cleaned off, and it can be cleaned regularly.

[0049] After the cleaning of the wafer clamped in the first clamping groove 6 is completed, retract the second electric cylinder 39 and start the first electric cylinder 11. The first electric cylinder 11 drives the pushing frame 10 to move until the pushing frame 10 drives the second clamping plate 12 to move to the position of the first clamping plate 5. At this time, a part of the wafer in the first clamping groove 6 is in the second clamping groove 13. Start the second air pump 15. The second air pump 15 extracts the air in the second clamping plate 12 through the second air pipe 16, making the inside of the second clamping plate 12 in a negative pressure state. At the same time, the second air inlet hole 17 will suck the external air into the second clamping plate 12. At the same time, close the first air pump 7, and the wafer can be fixed inside the second clamping groove 13. Then retract the first electric cylinder 11. Through the setting of the pushing plate and the second clamping plate 12, move the wafer back to the cleaning position, and the cleaning steps can be repeated to start cleaning the other end of the wafer and the first clamping groove 6. After the cleaning of the other end of the wafer is completed, retract the second electric cylinder 39 to make the sliding frame 18 return to the initial position. Then restart the first electric cylinder 11 and drive the second clamping plate 12 to move through the pushing plate until the wafer on the second clamping groove 13 enters the first clamping groove 6. At this time, close the second air pump 15 and turn on the first air pump 7 to put the wafer back and fix it in the first clamping groove 6 again. Then lift the sliding frame 3 to the original position and then take out the wafer.

[0050] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure and not to limit them. Although the present disclosure has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present disclosure can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present disclosure, and they should all be covered within the scope of the claims of the present disclosure.

Claims

1. A wafer surface processing mechanism, comprising an equipment frame (1), wherein the equipment frame (1) comprises a loading area, a displacement area and a processing area, characterized in that: Also includes: A through slot (2), wherein two through slots (2) are symmetrically provided on the equipment frame (1), and the two through slots (2) are symmetrically arranged; A sliding frame (3), the sliding frame (3) being slidably disposed between the two through slots (2); A negative pressure clamping assembly, the negative pressure clamping assembly being mounted on the sliding frame (3) and being used to clamp the wafer; A secondary clamping assembly, the secondary clamping assembly is installed inside the processing area and is used to clamp the other end of the wafer; A cleaning component is installed inside the processing area and is used to clean both ends of the wafer.

2. A wafer surface processing mechanism according to claim 1, characterized in that: The negative pressure clamping assembly comprises: A mounting frame (4), the mounting frame (4) being fixedly mounted on the top of the sliding frame (3); A first clamping plate (5), the first clamping plate (5) being fixedly mounted on the sliding frame (3), the first clamping plate (5) being a hollow structure; A first clamping groove (6), wherein two ends of the first clamping plate (5) are coaxially and symmetrically provided with two first clamping grooves (6); An adsorption clamping part, which is mounted on the mounting frame (4) and is used to fix the wafer.

3. A wafer surface processing mechanism according to claim 2, characterized in that: The adsorption clamping part comprises: a first air pump (7), the first air pump (7) being fixedly mounted on the mounting frame (4); a first air pipe (8), the first air pipe (8) being connected between the first clamping plate (5) and an input end of the first air pump (7); First air inlet holes (9), a plurality of first air inlet holes (9) are provided at equal distances on the two first clamping grooves (6).

4. A wafer surface processing mechanism according to claim 3, characterized in that: The secondary clamping assembly comprises: A pushing frame (10), two of the pushing frames (10) being symmetrically arranged inside the processing area; a first electric cylinder (11), wherein the first electric cylinder (11) is fixedly mounted on both sides of the equipment frame (1), and an output end of the first electric cylinder (11) is fixedly connected to the pushing frame (10); a second clamping plate (12), the second clamping plate (12) being fixedly mounted on the two pushing frames (10), the second clamping plate (12) being a hollow structure; A second clamping groove (13), wherein the two second clamping plates (12) are each provided with the second clamping groove (13); A supporting frame (14), wherein two supporting frames (14) are symmetrically and fixedly mounted on the equipment frame (1).

5. A wafer surface processing mechanism according to claim 4, characterized in that: Also includes: A second air pump (15), wherein the second air pump (15) is fixedly installed inside the two supporting frames (14); a second air pipe (16), wherein the input ends of the two second air pumps (15) are both connected to the second air pipe (16), and the second air pipe (16) is connected to the second clamping plate (12); Second air inlet holes (17), a plurality of second air inlet holes (17) are evenly spaced apart on the two second clamping grooves (13).

6. A wafer surface processing mechanism according to claim 5, characterized in that: The cleaning component comprises: A sliding frame (18), wherein two sliding frames (18) are symmetrically and slidably mounted inside the processing area; A cleaning roller (19), on which the two sliding frames (18) are both tiltably and rotatably mounted; A cleaning sleeve (20), wherein the two cleaning rollers (19) are both fixedly sleeved with the cleaning sleeve (20); A spiral groove (21), wherein the two cleaning sleeves (20) are both provided with the spiral groove (21); A water tank (22), the water tank (22) being fixedly mounted on the bottom of the equipment rack (1); A second electric cylinder (39), two of which are symmetrically and fixedly installed inside the processing area, and an output end of the second electric cylinder (39) is fixedly connected to the sliding frame (18); A blowing part, the blowing part is mounted on the sliding frame (18) and is used for blowing the wafer; A driving unit, the driving unit is mounted on the sliding frame (18) and is used to drive the cleaning roller (19) to rotate.

7. A wafer surface processing mechanism according to claim 6, characterized in that: The blowing part comprises: A spray pipe (23), wherein the spray pipe (23) is fixedly installed inside the two sliding frames (18); Water spray heads (24), two groups of the water spray heads (24) are symmetrically mounted on the two spray pipes (23), the two groups of the water spray heads (24) are respectively located on both sides of the cleaning sleeve (20), and each group of the water spray heads (24) has a plurality of the water spray heads (24) arranged at equal distances; A drainage pipe (25), wherein both of the two spray pipes (23) are connected to the drainage pipe (25).

8. A wafer surface processing mechanism according to claim 7, characterized in that: Also includes: An air jet pipe (26), wherein the air jet pipe (26) is fixedly mounted inside the two sliding frames (18); Air jet heads (27), two groups of the air jet heads (27) are symmetrically mounted on the two air jet pipes (26), the two groups of the air jet heads (27) are respectively located on both sides of the cleaning sleeve (20), and each group of the air jet heads (27) has a plurality of the air jet heads (27) arranged at equal distances; an exhaust pipe (28), wherein the two air injection pipes (26) are both connected to the exhaust pipe (28); A joint (29), the tail ends of the two exhaust pipes (28) and the tail ends of the two drainage pipes (25) are both connected to the joint (29), and the joint (29) is fixedly mounted on the equipment frame (1).

9. A wafer surface processing mechanism according to claim 8, wherein the driving part comprises a universal joint (30), and the ends of the two cleaning rollers (19) are fixedly mounted with the universal joint (30), characterized in that: Also includes: A first motor (31), wherein the first motor (31) is fixedly mounted inside the two sliding frames (18); A driven gear (32), wherein the driven gear (32) is rotatably mounted inside the two sliding frames (18), and the driven gear (32) is fixedly connected to the universal joint (30); A driving gear (33), the output ends of the two first motors (31) being fixedly mounted with the driving gear (33); A transmission gear (34) is rotatably mounted inside the two sliding frames (18), and the transmission gear (34) is meshed with the driven gear (32) and the driving gear (33).

10. A wafer surface processing device, using a wafer surface processing mechanism as claimed in claim 9, characterized in that: include: a second motor (35), the second motor (35) being fixedly mounted on the equipment frame (1); a screw rod (36), the screw rod (36) being rotatably mounted inside the displacement zone; a nut (37), the nut (37) being threadedly sleeved on the screw rod (36), and the nut (37) being fixedly mounted on the mounting frame (4); Guide rods (38), two guide rods (38) are symmetrically and fixedly installed inside the displacement zone, and both of the guide rods (38) are slidably matched with the mounting frame (4).

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