A half-silicon wafer coating film variable-pitch rotating device

Abstract

The application discloses a kind of half silicon wafer film coating variable-pitch rotating devices, belong to silicon wafer transport equipment technical field;Among them, the equipment includes two buffer mechanisms and base seat for simultaneously receiving / two half silicon wafers;Fixed frame with opening structure is provided on buffer mechanism, the fixed frame is equipped with two buffer channels;Two lifting motors corresponding to two buffer mechanisms are provided on base seat, the power output end of each lifting motor is connected with corresponding screw rod, each screw rod is slidably connected with corresponding backboard, each backboard is slidably connected with corresponding buffer mechanism, the bottom of base seat is provided with rotating motor, each lifting motor drives corresponding screw rod to move up and down in Y-axis direction, and drives corresponding buffer mechanism of screw rod to move up and down in Y-axis direction.The half silicon wafer film coating variable-pitch rotating device provided by the application can simultaneously receive / two half silicon wafers, two groups of variable-pitch rotating devices for feeding and discharging are configured by a single robot, a switching mechanism of one for one is realized, the robot is ensured to continuously operate, and the production capacity is improved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of silicon wafer transportation equipment, and particularly relates to a half-silicon wafer coating variable-pitch rotating device. BACKGROUND

[0002] In the field of semiconductor manufacturing, the coating process of a silicon wafer is a key step, which directly affects the performance and reliability of a device.

[0003] Traditional silicon wafer coating equipment has some limitations when processing half-silicon wafers, such as low automation, low efficiency, and large floor area. In particular, when interacting with a robot for wafer insertion, an additional buffer mechanism is needed to ensure that the robot has no waiting time for wafer insertion, which not only increases the complexity of the equipment but also increases the cost.

[0004] Therefore, the existing technology needs a more efficient, compact, and automated half-silicon wafer coating variable-pitch rotating device. SUMMARY

[0005] To solve the problems in the related art, the application provides a half-silicon wafer coating variable-pitch rotating device for a half-silicon wafer coating automation equipment, which meets the wafer insertion performance and capacity requirements of the half-silicon wafer coating automation equipment and has a small floor area.

[0006] The technical solution is as follows:

[0007] A half-silicon wafer coating variable-pitch rotating device is provided, which includes two buffer mechanisms and a base seat for simultaneously receiving / two half-silicon wafers, the buffer mechanisms are arranged on the same base seat,

[0008] The buffer mechanism is provided with a fixed frame with an opening structure, and the fixed frame is provided with two buffer channels.

[0009] The base seat is provided with two lifting motors corresponding to the two buffer mechanisms, the power output end of each lifting motor is connected with a corresponding lead screw, each lead screw is slidingly connected with a corresponding back plate, each back plate is slidingly connected with a corresponding buffer mechanism, and the bottom of the base seat is provided with a rotating motor, each lifting motor drives the corresponding lead screw to move up and down in the Y-axis direction, and the corresponding buffer mechanism of the lead screw moves up and down in the Y-axis direction.

[0010] In a further technical solution, the rotating motor is connected with a speed reducer.

[0011] In a further technical solution, the rotating motor rotates 180°, and simultaneously drives the two buffer mechanisms to rotate 180° in the same axial plane.

[0012] In a further technical solution, the lead screw is provided with a sliding block, and the base seat is provided with a sliding groove.

[0013] Further technical solutions, it is also provided with two groups of motor and synchronous belt structure, each cache channel is provided with a plurality of pairs of silicon wafer support rod.

[0014] Further technical solutions, each cache channel is provided with corresponding clamping assembly, the clamping assembly is connected with the synchronous belt, the synchronous belt is connected with the power output end of the first motor, two groups of clamping assembly opposite movement.

[0015] Further technical solutions, the cache mechanism is provided with a second cylinder, the drive end of the second cylinder is connected with the second connecting rod assembly, the second connecting rod assembly is connected with two push plates, the push plate is arranged in the slot of the first bottom plate on the cache mechanism, the second cylinder drives the second connecting rod assembly to move, and the push plate moves forward and backward.

[0016] Further technical solutions, the cache mechanism is provided with a first cylinder, the drive end of the first cylinder is connected with the first connecting rod assembly through a sliding block, the first cylinder pushes the sliding block to move downward, and drives the first connecting rod assembly 14 to rotate 0°-5°.

[0017] Further technical solutions, one plane of the first cylinder is fixedly arranged on the first back plate, the first back plate is slidingly connected with the base seat, and the other plane of the first cylinder is connected with the first bottom plate on the cache mechanism.

[0018] The technical solutions at least include the following technical effects:

[0019] 1. A cache box mechanism for half-silicon wafer coating automatic equipment is designed, which can simultaneously receive / send two half-silicon wafers, and through a single robot, two groups of loading and unloading variable-pitch rotating devices are configured to realize a standby switching mechanism, so that the robot can work continuously, thereby improving the production capacity.

[0020] 2. Compared with the traditional double automatic configuration of a process equipment, the device occupies a small area and is more compact, saving space.

[0021] It should be understood that the above general description and the following detailed description are only exemplary and cannot limit the present application. BRIEF DESCRIPTION OF DRAWINGS

[0022] The drawings herein are incorporated into the specification and form part of the specification, which shows embodiments consistent with the present application, and together with the specification, is used to explain the principles of the present application.

[0023] Figure 1 A front view of a half-silicon wafer coating variable-pitch rotating device provided for a preferred embodiment of the present application;

[0024] Figure 2 A perspective view of a half-silicon wafer coating variable-pitch rotating device provided for a preferred embodiment of the present application;

[0025] Figure 3 For Figure 2 structure diagram of the lifting motor and the screw rod in the second buffer mechanism;

[0026] Figure 4 For Figure 2 front view of the base in the second buffer mechanism;

[0027] Figure 5 For Figure 2 front view of the first buffer mechanism in the second buffer mechanism;

[0028] Figure 6 For Figure 5 sectional view of the D direction in the second buffer mechanism;

[0029] Figure 7 structure diagram of the push plate and the connecting rod in the second buffer mechanism; BRIEF DESCRIPTION OF DRAWINGS

[0031] 1. first buffer mechanism; 1-1, first bottom plate; 1-2, fixed frame; 1-3, silicon wafer support rod; 1-4, first clamping assembly; 1-5, second clamping assembly; 2, second buffer mechanism; 3, first lifting motor; 4, second lifting motor; 5, first motor; 6, base; 7, rotary motor; 8, first screw rod; 9, second screw rod; 10, first back plate; 11, second back plate; 12, synchronous belt; 13, first air cylinder; 14, first connecting rod assembly; 15, second connecting rod assembly; 16, second air cylinder; 17, first push plate; 18, second push plate. DETAILED DESCRIPTION

[0032] The exemplary embodiments will be described in detail herein with reference to the attached drawings. In the following description, like reference numerals refer to like elements, unless the context clearly dictates otherwise. The following description of exemplary embodiments is not representative of all possible embodiments consistent with the present application. Instead, they are merely examples of apparatuses and methods consistent with some aspects of the present application as detailed in the appended claims.

[0033] The half-silicon wafer film coating variable-pitch rotating device provided by the present application is a buffer box mechanism in a half-silicon wafer film coating automatic equipment, which simultaneously receives / transmits two half-silicon wafers, and each single robot is configured with two sets of loading and unloading variable-pitch rotating devices, one of which is used for switching back and forth to ensure that the robot does not stop operating and affect the production capacity, thereby meeting the requirements of the half-silicon wafer film coating automatic equipment in terms of wafer insertion performance and production capacity. Compared with a double-automation configuration with one process equipment, the half-silicon wafer film coating variable-pitch rotating device provided by the present application has a smaller floor area.

[0034] As shown in the accompanying Figures 1-4As shown, the half-silicon wafer film coating variable-pitch rotating device of the embodiment is provided with two buffer mechanisms, a first buffer mechanism 1 and a second buffer mechanism 2, which are installed on the same base seat 6. The bottom of the base seat 6 is connected with the power output end of a rotating motor 7, which is used to rotate the half-silicon wafer film coating variable-pitch rotating device by 180°. The rotating motor 7 is also connected with a speed reducer. The first buffer mechanism 1 is in sliding connection with a first back plate 10, and the second buffer mechanism 2 is in sliding connection with a second back plate 11. The first back plate 10 is connected with a sliding block on a first lead screw 8, and the second back plate 11 is connected with a sliding block on a second lead screw 9. The top of the base seat 6 is provided with a first lifting motor 3 and a second lifting motor 4. The power output end of the first lifting motor 3 is connected with the first lead screw 8, which drives the first lead screw 8 to lift and drives the sliding block on the first lead screw 8 to move up and down in the Y-axis direction, so as to drive the first back plate 10 to move up and down in the Y-axis direction in the sliding groove on the base seat. The power output end of the second lifting motor 4 is connected with the second lead screw 9, which drives the second lead screw 9 to lift and finally drives the sliding block on the second lead screw 9 to move up and down in the Y-axis direction, so as to drive the second back plate 11 to move up and down in the vertical direction in the sliding groove on the base seat. One side of the half-silicon wafer film coating variable-pitch rotating device is connected with a robot, and the other side is connected with a transmission runway. The transmission runway is provided with a belt. When the belt rotates, the variable pitch decreases by one step. By using friction, two half-silicon wafers on the variable pitch are simultaneously transmitted out through the belt line. The half-silicon wafer film coating variable-pitch rotating device provided in the embodiment can simultaneously receive / transmit two half-silicon wafers. By configuring two sets of variable-pitch rotating devices for feeding and discharging through a single robot, a switching mechanism for one standby is realized, which ensures that the robot does not stop operating, thereby improving the production capacity.

[0035] As shown, Figure 2 The first buffer mechanism 1 and the second buffer mechanism 2 have the same structure. The structure of the first buffer mechanism 1 is as follows. The first buffer mechanism 1 is provided with a fixing frame 1-2, which is provided with two buffer channels for storing half-silicon wafers. The fixing frame 1-2 is of an open structure design. The buffer channels are provided with a plurality of pairs of symmetrically arranged silicon wafer supporting rods. The symmetrically arranged silicon wafer supporting rods 1-3 are used to place half-silicon wafers. The fixing frame 1-2 is assembled on a first bottom plate 1-1.

[0036] Each buffer channel is provided with a clamping assembly, a total of two sets of clamping assemblies, a first clamping assembly 1-4 and a second clamping assembly 1-5, each clamping assembly is fixed on the corresponding mounting plate, and the clamping assembly abuts against the silicon wafer to achieve the silicon wafer to be placed in order. When the robot places the silicon wafer in the buffer channel, the silicon wafer is not placed in order, and the clamping assembly needs to align the silicon wafer to continue the subsequent operation. The first clamping assembly 1-4 and the second clamping assembly 1-5 are connected with the synchronous belt 12 respectively, the synchronous belt 12 is connected with the power output end of the first motor 5, and the synchronous movement of the clamping assembly is realized. The two sets of clamping assemblies move oppositely, are controlled by single power, are clamped simultaneously by using the two sets of clamping assemblies, and are overlapped in the middle of the two silicon wafers when taking and placing the silicon wafers, so that the silicon wafers are corrected in the horizontal direction.

[0037] The front-back correction is completed by a cylinder and a connecting rod structure; the cylinder and the connecting rod structure control the swing of 0-5°, prevent the silicon wafer from moving during rotation, and rotate the entire buffer box mechanism as a whole by about 5° upward during rotation, so that the centrifugal force during rotation cannot throw out the silicon wafer or cause displacement, and the cylinder controls the movement of the front-back push plate of the silicon wafer.

[0038] As shown in Figures 5-7 , the second cylinder 16 is fixedly installed on the first bottom plate 1-1, the driving end of the second cylinder 16 is connected with the second connecting rod assembly 15, the two telescopic walls of the second connecting rod assembly 15 are respectively connected with the corresponding push plates, the two push plates are arranged in the two empty grooves of the first bottom plate 1-1, and the four bearings are fixed on the first bottom plate 1-1 to play a guiding role. The second cylinder 16 drives the second connecting rod assembly 15 to move, finally pushes the first push plate 17 and the second push plate 18 to move forward and backward, the first push plate 10 and the second push plate 11 correspond to the corresponding buffer channels respectively, so that the front-back correction of the silicon wafer is realized.

[0039] As shown in Figures 5-7 , the first cylinder 13 drives the first connecting rod assembly 14 to rotate, controls the first buffer mechanism 1 to swing by 0-5°, and prevents the silicon wafer from moving during rotation. One plane of the first cylinder 13 is fixed on the first back plate 10, the other plane of the first cylinder 13 is connected on the first bottom plate 1-1, the driving end of the first cylinder 13 is connected with the first connecting rod assembly 14 through a sliding block, the first cylinder 13 pushes the sliding block to move downward, drives the first connecting rod assembly 14 to rotate the entire assembly by a certain angle, and rotates the entire first buffer mechanism 1 as a whole by about 5° upward, so that the centrifugal force during rotation cannot throw out the silicon wafer or cause displacement.

[0040] The buffer box mechanism of the half-silicon wafer coating automatic equipment can simultaneously receive / send two half-silicon wafers, two sets of loading and unloading variable-pitch rotating devices are configured by a single robot, a standby switching mechanism is realized, the robot is ensured to be in operation, and the production capacity is improved.

[0041] Compared with the traditional double automation plus a process equipment, the cache box mechanism of the automatic film coating equipment for half silicon wafers has small floor area, is more compact, and saves space.

[0042] The left and right correction of the two groups of half silicon wafers of the cache box mechanism of the automatic film coating equipment for half silicon wafers is completed through a group of motors and a synchronous belt structure, and the front and back correction is completed through a cylinder and a connecting rod structure. When rotating, the entire cache box mechanism rotates upward by about 5°, so as to ensure that the centrifugal force during rotation does not shake out the silicon wafers or cause displacement. The front and back correction and swing of the silicon wafers are controlled by the cylinder and the connecting rod mechanism, effectively preventing displacement of the silicon wafers during rotation, and ensuring the stability of the silicon wafers and the film coating quality.

[0043] The structures, proportions, sizes, etc. shown in the drawings attached to the specification are only used to cooperate with the content disclosed in the specification, to be understood and read by those skilled in the art, and do not have technical significance to limit the conditions under which the present application can be implemented. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects and purposes that the present application can produce, should still fall within the scope of the technical content disclosed by the present application. At the same time, the terms such as "upper", "lower", "left", "right", "middle", "front and back", and "first", "second" in the specification are only for the convenience of clear description, and are not used to limit the scope of the present application. The change or adjustment of the relative relationship, without substantially changing the technical content, is also considered as the scope of the present application.

[0044] Other embodiments of the application will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. It is intended that the application be limited only by the scope of the claims, including any amendments thereof, and can include any variations made to the application following the principles of the application and including other known equivalents to the subject matter of the application. The specification and examples are to be considered exemplary only, with the true scope and spirit of the application indicated by the following claims.

[0045] It should be understood that the present application is not limited to the precise construction that has been described above and shown in the accompanying drawings, and that various modifications and changes can be made to the application without departing from the scope thereof. The scope of the application is limited only by the claims that follow.

Claims

1. A variable pitch rotating device for half-wafer silicon wafer coating, characterized in that: Includes two buffer mechanisms for simultaneously receiving / transmitting two half-wafers of silicon and a base (6); the two buffer mechanisms are mounted on the same base (6). The buffer mechanism is provided with a fixed frame (1-2) with an open structure, and the fixed frame (1-2) is provided with two buffer channels; The base (6) is provided with two lifting motors corresponding to the two buffer mechanisms. The power output end of each lifting motor is connected to the corresponding lead screw. Each lead screw is slidably connected to the corresponding back plate. Each back plate is slidably connected to the corresponding buffer mechanism. The bottom of the base (6) is provided with a rotary motor (7). Each lifting motor drives the corresponding lead screw to move up and down in the Y-axis direction, and drives the buffer mechanism corresponding to the lead screw to move up and down in the Y-axis direction. The buffer mechanism is provided with a second cylinder (16), the drive end of the second cylinder (16) is connected to the second linkage assembly (15), the second linkage assembly (15) is connected to two push plates, the push plates are set in the empty slot of the first base plate (1-1) on the buffer mechanism, the second cylinder (16) drives the second linkage assembly (15) to move, and pushes the push plates to move back and forth; The buffer mechanism is provided with a first cylinder (13). The driving end of the first cylinder (13) is connected to the first connecting rod assembly (14) through a slider. The first cylinder (13) pushes the slider down, which drives the first connecting rod assembly (14) to rotate the entire assembly by 0°-5°. One plane of the first cylinder (13) is fixedly mounted on the first back plate (10), the first back plate (10) is slidably connected to the base plate (6), and the other plane of the first cylinder (13) is connected to the first base plate (1-1) on the buffer mechanism.

2. The half-wafer silicon wafer coating variable pitch rotating device according to claim 1, characterized in that, The rotary motor (7) is connected to the reducer.

3. The half-wafer silicon wafer coating variable pitch rotating device according to claim 2, characterized in that, The rotary motor (7) rotates 180°, and at the same time drives the two buffer mechanisms to rotate 180° on the same axis plane.

4. The variable pitch rotating device for half-wafer silicon wafer coating according to claim 1, characterized in that, A slider is provided on the lead screw, and a groove is provided on the base (6).

5. The half-wafer silicon wafer coating variable pitch rotating device according to claim 1, characterized in that, Each cache channel is equipped with several pairs of silicon wafer support rods (1-3).

6. The half-wafer silicon wafer coating variable pitch rotating device according to claim 5, characterized in that, Each buffer channel is equipped with a corresponding clamping component, which is connected to the synchronous belt (12). The synchronous belt (12) is connected to the power output end of the first motor (5), and the two sets of clamping components move in opposite directions.

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