Jet flow structure optimized chip radiator

Abstract

A jet flow structure optimized chip radiator disclosed by the present invention comprises a radiator main body, a protection shell and a heat dissipation assembly, the protection shell is fixedly installed on the outer side of the radiator main body, the heat dissipation assembly is fixedly arranged in the radiator main body, and the heat dissipation assembly comprises a jet flow, a jet flow cavity, a convection cavity, a collection port, a water inlet and a water outlet. A plurality of jet flow sets are fixedly installed in the radiator body, a jet flow cavity is formed in the radiator body, the jet flow sets are arranged in the jet flow cavity, a convection cavity is formed in the bottom of the interior of the radiator body, and a collecting opening is formed in one side of the bottom of the radiator body. Compared with traditional water-cooling heat exchange, the jet flow has the advantages that the heat exchange efficiency caused by the impact effect is higher, meanwhile, the spoilers are used for lengthening the flow path and the needle fins are used for enhancing the flow disturbance in the convection layer, the larger convection heat exchange efficiency is obtained by damaging the boundary layer, and the heat exchange effect is improved through the convection effect and the impact effect.

Description

Technical Field

[0001] The present invention relates to the technical field of heat exchange equipment, and particularly to a chip radiator with optimized jet flow structure. Background Art

[0002] With the continuous development of science and technology, microelectronic devices have been widely used in many fields such as aerospace technology, industrial manufacturing, health care, etc. The performance of electronic chips is getting stronger and stronger, and at the same time, the heat generated by electronic chips is also increasing continuously. At present, the heat flux density of electronic chips has exceeded 100 W / cm2 and there is still an increasing trend. At present, there are mainly two ways of chip heat dissipation. One is air-cooled heat dissipation, and the other is water-cooled heat dissipation. By improving and optimizing the structure of the air-cooled radiator, such as the shape and geometric size of the fins, the heat dissipation performance of the radiator has been improved to a certain extent.

[0003] In the existing document 202120308330.2, the structure of the traditional water-cooled radiator is that a metal water-cooled head contacts the CPU. There are microchannels for the coolant to flow through on the metal water-cooled head. The microchannels can enhance the heat exchange efficiency between the heat conducted by the CPU and the coolant. Then the water pump transports the heated coolant through the pipeline into the cooling row. The cooling row cools the coolant and then transports it through the water pump into the microchannels of the water-cooled head to exchange heat and cool with the CPU again. The coolant flows in the cooling row and transfers heat to the heat dissipation fins of the cooling row, and the fan blows the heat on the fins into the air, thereby cooling the coolant. This cycle repeats, so as to achieve the effect of continuous heat dissipation. Therefore, the present invention proposes a chip radiator with optimized jet flow structure to solve the problems existing in the prior art. Summary of the Invention

[0004] Aiming at the above problems, the purpose of the present invention is to propose a chip radiator with optimized jet flow structure. Compared with the traditional water-cooled heat exchange, the jet flow of this chip radiator with optimized jet flow structure has a higher heat exchange efficiency brought by the impact effect. At the same time, in the convective layer, a spoiler is used to lengthen the flow path and pin fins are used to strengthen the flow disturbance, and a greater convective heat exchange efficiency is obtained by destroying the boundary layer, so as to improve the heat exchange effect from both convective and impact effects.

[0005] To achieve the object of the present invention, the present invention is implemented through the following technical solutions: An optimized jet flow structure chip radiator, comprising a radiator main body, a protective housing and a heat dissipation component. The protective housing is fixedly installed on the outside of the radiator main body, and the heat dissipation component is fixedly arranged inside the radiator main body. Heat exchange and heat dissipation are processed through the setting of the radiator main body. The protective housing is provided to prevent dust, moisture and other pollutants from entering the radiator and the chip, extending the service life of the device. Through the setting of the heat dissipation component, the heat dissipation component utilizes jet flow technology, and directly impacts the chip surface by high-speed jetting of the cooling medium, effectively taking away heat, significantly improving the heat dissipation efficiency, and ensuring that the chip can still maintain a relatively low working temperature under high load. A heat exchange cavity is opened inside the radiator main body. The heat dissipation component includes a jet, a jet cavity, a convection cavity, a collection port, a water inlet and a water outlet. A plurality of groups of jets are fixedly installed inside the radiator main body. A jet cavity is opened inside the radiator main body. The jets are arranged inside the jet cavity. A convection cavity is opened at the bottom inside the radiator main body. A collection port is opened on one side of the bottom of the radiator main body. The collection port is arranged on one side of the jet. A plurality of groups of water inlets are opened at the top of the radiator main body. A water outlet is opened on one side outside the radiator main body. The water outlet is arranged on one side of the convection cavity.

[0006] A further improvement lies in that: A plurality of groups of spray nozzles are opened above the heat exchange cavity. The size specifications of each group of spray nozzles are the same. The spray nozzles are connected to external pipelines and water pumps.

[0007] A further improvement lies in that: The heat exchange cavity is provided with multiple layers and not less than two layers. Circularly arranged pin fins are fixedly arranged inside the jet cavity. The pin fins are arranged with the middle being high and the edge being low.

[0008] A further improvement lies in that: The shape of the collection port is circular. The collection port is arranged on one side of the jet.

[0009] A further improvement lies in that: A water cooling head is arranged on the outside of the radiator main body. The material of the water cooling head is the metal material copper. The material of the pin fins is copper. The material of the pin fins is the same as that of the flow around plate. The material of the outer shell of the heat exchange cavity is aluminum material.

[0010] A further improvement lies in that: A heat insulation plate is fixedly installed inside the radiator main body. The heat insulation plates are respectively installed on both sides inside the jet cavity.

[0011] A further improvement lies in that: The heights of the cylindrical pin fins arranged inside the convection cavity are the same. A plurality of groups of flow disturbing plates are arranged inside the convection cavity.

[0012] A further improvement lies in that: Fixing plates are fixedly installed on both sides of the radiator main body. The size specifications of the two fixing plates are the same.

[0013] Further improvements are as follows: the diameter of the collection port and the outlet is 5 mm, the diameter of the pin fins is 0.7 mm, the overall height of the heat exchange chamber is 30 mm, the height of the convection chamber is 7 mm, and the thickness of the spoiler and the isolation plate is 1 mm.

[0014] The beneficial effects of the present invention are as follows: the present invention enhances the heat exchange effect between the chip and the coolant. Compared with traditional water cooling heat exchange, the impinging jet has a higher heat exchange efficiency due to the impact effect. At the same time, in the convection layer, the spoiler is used to lengthen the flow path and the pin fins are used to strengthen the flow disturbance, and a greater convective heat exchange efficiency is obtained by destroying the boundary layer. The heat exchange effect is improved by both convection and impact. The second-layer convection chamber is used to collect the heat energy that the jet coolant fails to fully exchange, which can save energy well. At the same time, a certain height difference is set between the water inlet and the water outlet, which can save pump power well and reduce energy consumption. Description of the Drawings

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0016] Figure 1 It is the overall structure of the present invention patent;

[0017] Figure 2 It is the flow path of the coolant of the present invention in the jet chamber;

[0018] Figure 3 It is the flow path of the coolant of the present invention entering the convection chamber;

[0019] Figure 4 It is the overall cross-sectional view of the present invention.

[0020] Reference numerals in the drawings: 1, radiator main body; 2, protective housing; 3, heat exchange chamber; 4, jet; 5, jet chamber; 6, convection chamber; 7, collection port; 8, water inlet; 9, water outlet; 10, pin fins; 11, heat insulation plate; 12, fixing plate. Detailed Embodiments

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0022] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection" and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0023] In Document 202120308330.2, the heat transfer coefficient can be actively adjusted to achieve temperature stability and break the flow boundary layer. The convective heat transfer coefficient is mentioned. When operating at low temperatures, the blade rotation can be not turned on, saving energy consumption. Compared with traditional water-cooled radiators, there are already water-cooled radiators with a jet structure that have higher heat dissipation efficiency. However, at present, the jet radiator only changes the heat transfer of the water-cooled head from forced convection to jet heat transfer, and the water-cooled head, nozzle arrangement, structure, etc. have not been optimized, resulting in the inability to fully utilize the advantages brought by the jet radiator.

[0024] According to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4As shown in the figure, this embodiment provides an optimized chip radiator with a jet flow structure, including a radiator body 1, a protective housing 2, and a heat dissipation component. The protective housing 2 is fixedly installed on the outside of the radiator body 1, and the heat dissipation component is fixedly arranged inside the radiator body 1. Heat exchange and heat dissipation are carried out through the setting of the radiator body 1. The protective housing 2 is provided to prevent dust, moisture, and other pollutants from entering the radiator and the chip, extending the service life of the device. Through the setting of the heat dissipation component, the heat dissipation component utilizes jet flow technology to directly impact the chip surface by spraying a cooling medium at high speed, effectively taking away heat, significantly improving the heat dissipation efficiency, and ensuring that the chip can still maintain a relatively low working temperature under high load. An exchange cavity 3 is opened inside the radiator body 1. The heat dissipation component includes a jet 4, a jet cavity 5, a convection cavity 6, a collection port 7, a water inlet 8, and a water outlet 9. Multiple groups of jets 4 are fixedly installed inside the radiator body 1. Through the setting of the jets 4, the cooling medium is sprayed at high speed to directly impact the chip surface, thereby effectively removing heat. A jet cavity 5 is opened inside the radiator body 1, and the jets 4 are arranged inside the jet cavity 5. Through the setting of the jet cavity 5, the flow area of the cooling medium is restricted, forcing the medium to accelerate to form a high-speed jet flow, thereby enhancing the heat exchange efficiency. A convection cavity 6 is opened at the bottom inside the radiator body 1 to promote the flow of the cooling medium in the cavity and enhance the heat exchange between the medium and the chip. A collection port 7 is opened on one side of the bottom of the radiator body 1. Through the setting of the collection port 7, the cooling medium after dissipating heat through the chip surface is collected to ensure that the cooling medium can be effectively recycled. The collection port 7 is arranged on one side of the jet 4. Multiple groups of water inlets 8 are opened at the top of the radiator body 1. Through the setting of the water inlets 8, the coolant is introduced into the radiator to cool the chip. A water outlet 9 is opened on one side of the outside of the radiator body 1. The water outlet 9 is arranged on one side of the convection cavity 6. Through the setting of the water outlet 9, the coolant that has absorbed the heat of the chip is discharged for cooling and recycling.

[0025] Multiple groups of nozzles are opened above the heat exchange cavity 3. The size specifications of each group of nozzles are the same, and the nozzles are connected to external pipes and water pumps.

[0026] The heat exchange cavity 3 is provided with multiple layers and not less than two layers. Circularly arranged pin fins 10 are fixedly arranged inside the jet cavity 5, and the pin fins 10 are arranged with the middle higher than the edge.

[0027] The shape of the collection port 7 is circular, and the collection port 7 is arranged on one side of the jet 4.

[0028] A water-cooled head is arranged on the outside of the radiator body 1. The material of the water-cooled head is the metal material copper. The material of the pin fins 10 is copper, and the material of the pin fins 10 is the same as that of the flow-around plate. The material of the outer shell of the heat exchange cavity 3 is an aluminum material.

[0029] An insulating board 11 is fixedly installed inside the radiator body 1. Through the setting of the insulating board 11, heat conduction from the chip to other components through the radiator structure is reduced. The insulating board 11 is respectively installed on both sides inside the jet cavity 5, which helps to maintain the cooling effect of the chip and prevent heat from dissipating to unnecessary places.

[0030] The heights of the cylindrical pin fins 10 arranged inside the convection cavity 6 are the same. Multiple sets of spoiler plates are arranged inside the convection cavity 6. Through the setting of the spoiler plates, the flow path of convective heat transfer is lengthened.

[0031] Fixed plates 12 are fixedly installed on both sides of the radiator body 1. The sizes and specifications of the two fixed plates 12 are the same. Through the setting of the fixed plates 12, it is convenient to drive the radiator body 1 for detachable installation and use, and it is convenient to install and use the radiator body 1 at any time.

[0032] The diameter of the collection port 7 and the outlet diameter are 5 mm, the diameter of the pin fin 10 is 0.7 mm, the overall height of the heat exchange cavity 3 is 30 mm, the height of the convection cavity 6 is 7 mm, and the thickness of the spoiler plate and the isolation plate is 1 mm.

[0033] The optimized chip radiator with the jet flow structure first involves the change of the water-cooled head. The traditional microchannel water-cooled head lacks the secondary disturbance after the jet flow impact, and the heat exchange effect does not reach the best. Using a pin fin type water-cooled head can not only strengthen the impact of the jet flow, but also cause multiple disturbances in the flat plate after the jet impact, thereby destroying the boundary layer and greatly enhancing the heat exchange effect. At the same time, the pin fins are arranged in a circular pattern, and the height of the middle pin fin is the highest, and the heights of other pin fins decrease in sequence with the radius of the arranged circle. Using the non-uniform height pin fin arrangement can effectively reduce the chip junction temperature and enhance heat exchange. At the same time, using circular pin fins 10 can effectively balance the heat exchange effect and pump power consumption. Compared with other pin fin shapes, such as square or water droplet shape, circular pin fins can effectively reduce the pump power consumption while obtaining an ideal heat exchange effect. For the nozzle arrangement, the heat transfer efficiency of the multi-nozzle (3×3 array) is 3 - 4 times higher than that of the single nozzle, and the highest temperature of the radiator bottom plate decreases, and the temperature uniformity (i.e., the temperature uniformity of the chip) is better, thereby increasing the service life of the chip. At the same time, after the jet impacts the pin fins, there is still some temperature that has not been fully heat exchanged. Therefore, a second layer called the convection layer is arranged to continue to strengthen heat exchange. The convection layer collects the coolant after the impact, and at the same time, the spoiler plates in the second layer increase the heat exchange path, and the cylinders are used to destroy the flow boundary layer and enhance the convective heat transfer efficiency. In this way, the part after the jet impact heat exchange is used to continue to heat exchange the chip.

[0034] The basic principles, main features and advantages of the present invention have been shown and described above. Those skilled in the art should understand that the present invention is not limited by the above embodiments, and what is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A jet flow structure optimized chip heat sink, comprising a heat sink body (1), a protective shell (2) and a heat sink assembly, characterized in that: A protective shell (2) is fixedly mounted on the outside of the radiator body (1); a heat dissipation component is fixedly mounted inside the radiator body (1); a heat exchange cavity (3) is opened inside the radiator body (1); the heat dissipation component comprises a jet (4), a jet cavity (5), a convection cavity (6), a collecting port (7), a water inlet (8) and a water outlet (9); a plurality of jets (4) are fixedly mounted inside the radiator body (1); a jet cavity (5) is opened inside the radiator body (1); The jet (4) is arranged inside the jet chamber (5); a convection chamber (6) is provided at the bottom of the radiator body (1); the heat exchange chamber (3) is divided into two parts, namely the jet chamber (5) and the convection chamber (6); a collecting port (7) is provided on one side of the bottom of the radiator body (1); a plurality of water inlets (8) are provided on the top of the radiator body (1); a water outlet (9) is provided on one side of the outside of the radiator body (1); and the water outlet (9) is provided on one side of the convection chamber (6).

2. The jet flow structure optimized chip heat sink according to claim 1, characterized in that: A plurality of groups of nozzles are provided above the heat exchange chamber (3), and the size and specifications of each group of nozzles are the same. The nozzles are interconnected with external pipes and a water pump.

3. The jet flow structure optimized chip heat sink according to claim 1, characterized in that: The heat exchange chamber (3) is provided with multiple layers and no less than two layers, and circularly arranged needle fins (10) are fixedly provided inside the jet chamber (5), and the needle fins (10) are arranged with a high middle and low edges.

4. The jet flow structure optimized chip heat sink according to claim 1, characterized in that: The collecting port (7) is circular in shape and is arranged on one side of the jet (4).

5. The jet flow structure optimized chip heat sink according to claim 3, characterized in that: A water cooling head is arranged on the outside of the radiator body (1), the material of the water cooling head is copper, the material of the needle fins (10) is copper, the material of the needle fins (10) is the same as that of the flow plate, and the material of the outer shell of the heat exchange chamber (3) is aluminum.

6. The jet flow structure optimized chip heat sink according to claim 1, characterized in that: A heat insulation board (11) is fixedly installed inside the radiator body (1), and the heat insulation board (11) divides the heat exchange chamber (3) into a jet chamber (5) and a convection chamber (6).

7. The jet flow structure optimized chip heat sink according to claim 3, characterized in that: The cylindrical pin fins (10) arranged inside the convection cavity (6) have a uniform height, and a plurality of groups of spoilers are arranged inside the convection cavity (6).

8. The jet flow structure optimized chip heat sink according to claim 1, characterized in that: Fixing plates (12) are fixedly mounted on both sides of the radiator body (1), and the two groups of fixing plates (12) have the same size and specifications.

9. The jet flow structure optimized chip heat sink according to claim 3, characterized in that: The diameter of the collecting port (7) and the outlet diameter are 5 mm, the diameter of the needle fin (10) is 0.7 mm, the overall height of the heat exchange chamber (3) is 30 mm, the height of the convection chamber (6) is 7 mm, and the thickness of the spoiler and the isolation plate is 1 mm.

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