Pressurizing device, light-emitting chip transfer equipment and method

Abstract

The invention relates to the technical field of display, and discloses a pressurizing device, a light-emitting chip transfer device and a light-emitting chip transfer method. According to the pressurizing device, an illumination through hole is formed in a cylindrical pressing head and extends in the axial direction of the cylindrical pressing head, and the cylindrical pressing head is provided with a pressure applying end face which is perpendicular to the axial direction; the rotary drum is in threaded fit with the periphery of the cylindrical pressure head; the transparent pressing plate is fixed to the pressure applying end face of the cylindrical pressing head, the orthographic projection of the transparent pressing plate on the pressure applying end face is at least partially overlapped with the illumination through hole, and the transparent pressing plate is used for being connected with the first substrate; the limiting mechanism is connected to the cylindrical pressing head, and the limiting mechanism is used for limiting the cylindrical pressing head to rotate along with the rotating drum, so that the cylindrical pressing head drives the transparent pressing plate and the first base plate to do linear motion in the axial direction, and the cylindrical pressing head makes contact with the second base plate in the axial direction and generates interaction force; the driving mechanism is connected to the rotating drum and used for providing rotating power for the rotating drum. The pressurizing device integrates the pressurizing function and the laser processing function, and the uniformity of pressure in the pressurizing process is good.

Description

Technical Field

[0001] The present disclosure relates to the field of display technologies, and in particular, to a pressing device, a light-emitting chip transfer device, and a light-emitting chip transfer method. Background Art

[0002] Mass transfer is a manufacturing technology for precisely transferring millions or even tens of millions of micron-scale Micro LEDs (Micro Light Emitting Diode Display) from a source substrate to a driving backplane. There are many challenges in terms of transfer yield, accuracy, and speed, which have become the technical bottleneck restricting the development of new-generation display products. Currently, a variety of laser-assisted transfer technologies have been developed. This technology has advantages such as little damage to devices, high selectivity, and fast and efficient response, and has currently become a very promising mass transfer solution.

[0003] The mass transfer process has the most demanding requirements. It requires high-pressure and high-precision bonding of upper and lower substrates of different sizes, laser irradiation, and peeling of the upper and lower substrates. This process is a very important part of Micro LED production. Since this technology is not yet mature, it is urgent to independently develop relevant devices to verify the feasibility of the equipment process.

[0004] It should be noted that the information disclosed in the above background art section is only used to enhance the understanding of the background of the present disclosure, and thus may include information that does not constitute the prior art known to those of ordinary skill in the art. Summary of the Invention

[0005] The purpose of the present disclosure is to overcome the deficiencies of the above-mentioned prior art and provide a pressing device, a light-emitting chip transfer device, and a light-emitting chip transfer method.

[0006] According to one aspect of the present disclosure, a pressing device is provided for transferring a light-emitting chip from a first substrate to a second substrate. The pressing device includes:

[0007] A cylindrical indenter, on which a light-irradiation through-hole is provided, the light-irradiation through-hole extends along the axial direction of the cylindrical indenter, and the cylindrical indenter has a pressing end face perpendicular to the axial direction;

[0008] A rotating cylinder, threadedly engaged with the outer periphery of the cylindrical indenter;

[0009] A transparent pressing plate, fixed to the pressing end face of the cylindrical indenter, and at least part of the orthographic projection of the transparent pressing plate on the pressing end face overlaps with the light-irradiation through-hole. The transparent pressing plate is used to connect the first substrate;

[0010] A limiting mechanism is connected to the cylindrical pressing head. The limiting mechanism is used to restrict the rotation of the cylindrical pressing head following the rotating cylinder, so that the cylindrical pressing head drives the transparent pressing plate and the first substrate to perform a linear motion along the axial direction, and contacts the second substrate in the axial direction and generates an interaction force.

[0011] A driving mechanism is connected to the rotating cylinder and is used to provide rotational power for the rotating cylinder.

[0012] In an exemplary embodiment of the present disclosure, an outer spiral groove is provided on the outer peripheral surface of the cylindrical pressing head, and an inner spiral groove matching the outer spiral groove is provided on the inner cylindrical wall of the rotating cylinder. The pressing device further includes:

[0013] A ball is in rolling fit within the outer spiral groove and the inner spiral groove.

[0014] In an exemplary embodiment of the present disclosure, the pressing device further includes a slewing bearing and a fixing plate. The slewing bearing includes a relatively rotatable bearing inner ring and a bearing outer ring; the fixing plate is fixedly connected to the bearing inner ring, and the bearing outer ring is fixedly connected to the rotating cylinder; or, the fixing plate is fixedly connected to the bearing outer ring, and the bearing inner ring is fixedly connected to the rotating cylinder.

[0015] In an exemplary embodiment of the present disclosure, the pressing device further includes:

[0016] A cross beam is provided on the side of the fixing plate facing away from the rotating cylinder, and the fixing plate is fixed to the cross beam.

[0017] In an exemplary embodiment of the present disclosure, a limiting through hole is provided on the cylindrical pressing head, and the limiting through hole extends along the axial direction. The limiting mechanism includes:

[0018] A guiding shaft is slidably fitted within the limiting through hole, and at least one end of the guiding shaft is fixed.

[0019] In an exemplary embodiment of the present disclosure, the limiting mechanism further includes:

[0020] A linear bearing is fixed within the limiting through hole, and the guiding shaft is slidably fitted within the linear bearing.

[0021] In an exemplary embodiment of the present disclosure, the pressing device further includes:

[0022] A pressure sensor is provided between the transparent pressing plate and the pressing end face.

[0023] In an exemplary embodiment of the present disclosure, two driving mechanisms are provided, and the two driving mechanisms are symmetrically arranged on opposite sides of the rotating cylinder with the central axis of the rotating cylinder as the axis of symmetry; two pressure sensors are provided, and the two pressure sensors are respectively arranged between the light through holes and the two driving mechanisms.

[0024] In an exemplary embodiment of the present disclosure, the pressing device further includes:

[0025] A controller, having a control output end and a signal input end, the two pressure sensors are electrically connected to the signal input end of the controller, the control output end is electrically connected to the control end of the driving mechanism, and the controller is configured to control the output pressure of the two driving mechanisms according to the pressure signals sensed by the two pressure sensors.

[0026] In an exemplary embodiment of the present disclosure, the pressing device further includes:

[0027] A transmission mechanism, connected between the driving mechanism and the rotating cylinder, and the transmission mechanism is configured to transmit the rotational power of the driving mechanism to the rotating cylinder to make the rotating cylinder rotate.

[0028] In an exemplary embodiment of the present disclosure, the transmission mechanism includes:

[0029] A first gear, fixedly connected to the rotating cylinder and arranged coaxially with the rotating cylinder;

[0030] A second gear, fixed to the output end of the driving mechanism, and the second gear meshes with the first gear.

[0031] In an exemplary embodiment of the present disclosure, the driving mechanism includes:

[0032] A driving motor, having a driving shaft;

[0033] A speed reducer, connected to the driving shaft, and the output shaft of the speed reducer is fixedly connected to the second gear.

[0034] In an exemplary embodiment of the present disclosure, the pressing device further includes:

[0035] A mounting plate, arranged on the side of the rotating cylinder close to the transparent pressing plate, and the mounting plate is used to fix the driving mechanism and the limiting mechanism, and a receiving through hole for the transparent pressing plate to pass through is provided on the mounting plate.

[0036] In an exemplary embodiment of the present disclosure, the pressing device further includes:

[0037] A fixing screw, used to fix the transparent pressing plate and the cylindrical pressing head.

[0038] In an exemplary embodiment of the present disclosure, a plurality of adsorption through-holes are provided on the transparent pressing plate, and the adsorption openings of the adsorption through-holes are located on the surface of the transparent pressing plate facing the first substrate. The pressing device further includes:

[0039] A vacuum adsorption mechanism connected to the plurality of adsorption through-holes, and the vacuum adsorption mechanism is used to evacuate the adsorption through-holes.

[0040] In an exemplary embodiment of the present disclosure, the vacuum adsorption mechanism includes:

[0041] A vacuum pump connected to the adsorption through-hole;

[0042] A vacuum pressure regulating valve connected between the vacuum pump and the adsorption through-hole;

[0043] A negative pressure gauge connected to the adsorption through-hole.

[0044] In an exemplary embodiment of the present disclosure, the pressing device further includes:

[0045] A first solenoid valve connected between the adsorption through-hole and the vacuum pressure regulating valve, and the first solenoid valve has at least three interfaces;

[0046] An air compressor connected to one of the interfaces of the first solenoid valve.

[0047] In an exemplary embodiment of the present disclosure, the pressing device further includes:

[0048] A second solenoid valve connected between the air compressor and the first solenoid valve;

[0049] An air filter connected between the adsorption through-hole and the first solenoid valve.

[0050] According to another aspect of the present disclosure, a light-emitting chip transfer device is provided, including:

[0051] A pressing device, which is the pressing device described in any one of the above;

[0052] A carrier table oppositely arranged with the pressing device in the axial direction, and the carrier table is used to carry the second substrate;

[0053] A laser irradiation device for generating a laser with a target wavelength and irradiating the laser onto the transparent pressing plate.

[0054] In an exemplary embodiment of the present disclosure, the light-emitting chip transfer device further includes:

[0055] A heating member connected to the carrier table, and the heating member is used to heat the carrier table.

[0056] According to another aspect of the present disclosure, a method for transferring a light-emitting chip is provided, including:

[0057] transferring the light-emitting chip from a source substrate to an intermediate substrate, and then from the intermediate substrate to a target substrate;

[0058] wherein, the light-emitting chip is transferred from the source substrate to the intermediate substrate by using the light-emitting chip transfer device described in any one of the above, the first substrate is the source substrate, and the second substrate is the intermediate substrate;

[0059] and / or, the light-emitting chip is transferred from the intermediate substrate to the target substrate by using the light-emitting chip transfer device described in any one of the above, the first substrate is the intermediate substrate, and the second substrate is the target substrate.

[0060] According to still another aspect of the present disclosure, a method for transferring a light-emitting chip is provided, including pressurizing and laser irradiating a first substrate and a second substrate by using the light-emitting chip transfer device described in any one of the above, the first substrate allows a laser of a target wavelength to pass through axially, and the light-emitting chip is initially located on the first substrate:

[0061] wherein, the driving mechanism drives the rotating cylinder to rotate, so that the transparent pressing plate moves towards the bearing table to apply pressure, so that the first substrate and the second substrate are in contact and generate a mutual acting force;

[0062] The laser generated by the laser irradiation device passes through the transparent pressing plate to irradiate the first substrate and the second substrate with laser, so that the light-emitting chip on the first substrate is transferred to the second substrate.

[0063] For the pressurizing device of the present disclosure, on the one hand, a light-irradiation through hole is provided on the cylindrical pressing head, and the orthographic projection of the transparent pressing plate on the pressing end face overlaps at least partially with the light-irradiation through hole, so that the laser can be emitted to the transparent pressing plate on the pressing end face through the light-irradiation through hole, and penetrate through the transparent pressing plate to irradiate the first substrate on which the Micro LED is installed, so that the Micro LED is separated from the first substrate; on the other hand, the cylindrical pressing head is in threaded cooperation with the rotating cylinder, and the limiting mechanism is used to limit the rotation of the cylindrical pressing head following the rotating cylinder, so that the cylindrical pressing head drives the transparent pressing plate and the first substrate to perform a linear motion along the axis, contact with the second substrate axially and generate a mutual acting force, that is, the first substrate and the second substrate are pressed by the cylindrical pressing head and the transparent pressing plate to achieve high-pressure and high-precision bonding, so that the pressurizing device integrates the functions of pressurizing and laser processing; moreover, the rotation of the rotating cylinder drives the cylindrical pressing head and the transparent pressing plate to apply pressure, so that the pressure at each part of the transparent pressing plate is basically the same, thereby ensuring the uniformity of the pressure during the pressurizing process.

[0064] It should be understood that the above general description and the following detailed description are merely exemplary and explanatory, and do not limit the present disclosure. Brief Description of the Drawings

[0065] The drawings herein are incorporated into and constitute a part of this specification, showing embodiments consistent with the present disclosure, and are used together with the specification to explain the principles of the present disclosure. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and those of ordinary skill in the art can obtain other drawings based on these drawings without creative efforts.

[0066] Figure 1 It is a schematic structural diagram of an exemplary embodiment of the pressurizing device of the present disclosure.

[0067] Figure 2 It is Figure 1 a schematic cross-sectional view of the cylindrical pressure head and the rotating cylinder in

[0068] Figure 3 It is Figure 1 a schematic three-dimensional structural view of the cooperation between the cylindrical pressure head and the limiting mechanism in

[0069] Figure 4 It is Figure 1 a schematic three-dimensional structural view of the rotating cylinder in

[0070] Figure 5 It is a schematic electrical connection structure diagram of the controller.

[0071] Figure 6 It is a schematic gas circuit connection diagram of the vacuum adsorption mechanism.

[0072] Figure 7 It is a schematic structural diagram of the light-emitting chip transfer device of the present disclosure.

[0073] Description of the Reference Numerals:

[0074] 11. Cylindrical pressure head; 111. Light illumination through-hole; 112. Pressing end face; 113. Outer spiral groove; 114. Depressed part; 115. Limiting through-hole;

[0075] 12. Rotating cylinder; 121. Inner spiral groove;

[0076] 13. Transparent pressing plate; 131. Adsorption through-hole; 1311. Adsorption port; 1312. First pipeline; 1313. Ventilation port; 14. Ball;

[0077] 2. Limiting mechanism; 21. Guide shaft; 22. Linear bearing;

[0078] 3. Driving mechanism; 31. Driving motor; 32. Reducer;

[0079] 4. Transmission mechanism; 41. First gear; 42. Second gear; 43. Mounting seat;

[0080] 5. Vacuum adsorption mechanism; 51. Vacuum pump; 52. Vacuum pressure regulating valve; 53. Negative pressure gauge; 54. First solenoid valve; 55. Air compressor; 56. Second solenoid valve; 57. Air filter;

[0081] 6. Mounting plate; 61. Accommodating through hole;

[0082] 7. Slewing bearing; 71. Bearing inner ring; 72. Bearing outer ring;

[0083] 8. Fixed plate; 81. Thickening plate;

[0084] 9. Cross beam; 10. Pressure sensor; 101. Controller;

[0085] 100. Pressing device;

[0086] 200. Carrying platform; 201. Support rod; 202. Support plate;

[0087] 300. Laser irradiation device; 400. Heating member;

[0088] X. Axial direction. Detailed implementation manners

[0089] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. Like reference numerals in the figures denote like or similar structures, and thus their detailed description will be omitted. In addition, the drawings are only schematic illustrations of the present disclosure and are not necessarily drawn to scale.

[0090] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of the icon to another component, these terms are used in this specification only for convenience, for example, according to the directions of the examples described in the accompanying drawings. It can be understood that if the device of the icon is turned upside down, the component described as "upper" will become the component "lower". When a structure is "on" another structure, it may mean that a structure is integrally formed on another structure, or that a structure is "directly" disposed on another structure, or that a structure is "indirectly" disposed on another structure through another structure.

[0091] The terms "a", "an", "the", "said" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "comprising" and "having" are used to mean an open inclusion and refer to the possibility of the existence of additional elements / components / etc. in addition to the listed elements / components / etc.; the terms "first", "second", "third", etc. are used only as labels and are not a limitation on the quantity of their objects.

[0092] In this application, unless otherwise clearly specified and defined, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral one; it can be a direct connection or an indirect connection through an intermediate medium. "And / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this text generally represents an "or" relationship between the related objects before and after.

[0093] The exemplary embodiments of the present disclosure provide a pressurizing device 100. Referring to Figures 1-6 as shown, the pressurizing device 100 is used to transfer a light-emitting chip from a first substrate to a second substrate. The pressurizing device 100 may include a cylindrical indenter 11, a rotating cylinder 12, a transparent pressing plate 13, a limiting mechanism 2, and a driving mechanism 3; a light illumination through hole 111 is provided on the cylindrical indenter 11, and the light illumination through hole 111 extends along the axial direction X of the cylindrical indenter 11. The cylindrical indenter 11 has a pressing end face 112, and the pressing end face 112 is perpendicular to the axial direction X; the rotating cylinder 12 is in threaded engagement with the outer circumference of the cylindrical indenter 11; the transparent pressing plate 13 is fixed to the pressing end face 112 of the cylindrical indenter 11, and the orthographic projection of the transparent pressing plate 13 on the pressing end face 112 at least partially overlaps with the light illumination through hole 111. The transparent pressing plate 13 is used to connect the first substrate; the limiting mechanism 2 is connected to the cylindrical indenter 11, and the limiting mechanism 2 is used to limit the rotation of the cylindrical indenter 11 following the rotating cylinder 12, so that the cylindrical indenter 11 drives the transparent pressing plate 13 and the first substrate to perform a linear motion along the axial direction X, contact the second substrate in the axial direction X and generate an interaction force; the driving mechanism 3 is connected to the rotating cylinder 12 and is used to provide a rotational power for the rotating cylinder 12.

[0094] The pressurizing device 100 of the present disclosure, on the one hand, is provided with a light-passing through hole 111 on the cylindrical pressing head 11. The orthographic projection of the transparent pressing plate 13 on the pressing end face 112 at least partially overlaps with the light-passing through hole 111, so that the laser can pass through the light-passing through hole 111 and irradiate the transparent pressing plate 13 on the pressing end face 112, and then penetrate the transparent pressing plate 13 and irradiate the first substrate on which the Micro LED is installed, so that the Micro LED is separated from the first substrate; on the other hand, the first substrate and the second substrate are pressed by the cylindrical pressing head 11 and the transparent pressing plate 13 to achieve high-pressure and high-precision bonding, so that the pressurizing device 100 integrates the functions of pressurization and laser processing; moreover, the rotating cylinder 12 rotates to drive the cylindrical pressing head 11 and the transparent pressing plate 13 to apply pressure, so that the pressure at each part of the transparent pressing plate 13 is basically the same, thereby ensuring the uniformity of the pressure during the pressurization process.

[0095] In the present exemplary embodiment, referring to Figure 1 and Figure 2 as shown, the pressurizing device 100 may include a cross beam 9, and the rotating cylinder 12 may be fixed below the cross beam 9.

[0096] Specifically, the pressurizing device 100 may include a slewing bearing 7 and a fixing plate 8. The fixing plate 8 is fixed below the cross beam 9, and a through hole for the laser to pass through is provided on the fixing plate 8. The slewing bearing 7 may include a rotatable bearing inner ring 71 and a bearing outer ring 72, that is, the bearing inner ring 71 and the bearing outer ring 72 of the slewing bearing 7 can rotate independently. The bearing inner ring 71 may be fixedly connected to the fixing plate 8, and when the fixing plate 8 is fixed below the cross beam 9, the slewing bearing 7 can be fixed.

[0097] The bearing outer ring 72 is fixedly connected to the rotating cylinder 12. Specifically, the bearing outer ring 72 may be fixedly connected to the upper end face of the rotating cylinder 12; so that the bearing outer ring 72 and the rotating cylinder 12 can rotate together, and the rotating cylinder 12 is fixed to the cross beam 9 through the slewing bearing 7 and the fixing plate 8.

[0098] Of course, in some other exemplary embodiments of the present disclosure, the bearing outer ring 72 may be fixedly connected to the fixing plate 8, and when the fixing plate 8 is fixed below the cross beam 9, the slewing bearing 7 can be fixed. The bearing inner ring 71 is fixedly connected to the rotating cylinder 12, so that the bearing inner ring 71 and the rotating cylinder 12 can rotate together, and the rotating cylinder 12 is fixed to the cross beam 9 through the slewing bearing 7 and the fixing plate 8. Moreover, the cross beam 9 may not be provided, but support legs may be provided to support the mounting plate 6 described later to fix the pressurizing device 100.

[0099] In addition, in some other exemplary embodiments of the present disclosure, the fixing plate 8 may not be provided, and the inner ring 71 of the slewing bearing 7 may be directly fixed to the cross beam 9, and the outer ring 72 of the slewing bearing 7 is fixedly connected to the rotating cylinder 12; or, the outer ring 72 of the slewing bearing 7 may be directly fixed to the cross beam 9, and the inner ring 71 of the slewing bearing 7 is fixedly connected to the rotating cylinder 12.

[0100] In the present exemplary embodiment, referring to Figure 1 and Figure 2 as shown, a thickening plate 81 is further provided between the fixing plate 8 and the cross beam 9. The distance between the cross beam 9 and the driving mechanism 3 can be increased through the thickening plate 81 to avoid interference between the cross beam 9 and the driving mechanism 3. Through holes for the laser to pass through are also provided on the thickening plate 81. Of course, the thickening plate 81 may not be provided when there is no interference between the cross beam 9 and the driving mechanism 3.

[0101] In the present exemplary embodiment, referring to Figures 1-3 as shown, the cylindrical indenter 11 is provided as a cylinder, so that the cylindrical indenter 11 has an axial direction X. A light illumination through hole 111 is provided on the cylindrical indenter 11, and the light illumination through hole 111 extends along the axial direction X of the cylindrical indenter 11. The cylindrical indenter 11 has a pressing end face 112, and the pressing end face 112 is perpendicular to the axial direction X.

[0102] A transparent pressing plate 13 is fixed to the pressing end face 112 of the cylindrical indenter 11. Specifically, a recess 114 is provided on the end face of the cylindrical indenter 11 where the transparent pressing plate 13 is provided, and the transparent pressing plate 13 is installed in the recess 114. The bottom surface of the recess 114 is the pressing end face 112, and the shape of the recess 114 is adapted to the shape of the transparent pressing plate 13, so that the recess 114 can limit the transparent pressing plate 13 to prevent the transparent pressing plate 13 from displacing; the transparent pressing plate 13 can be fixed to the pressing end face 112 of the cylindrical indenter 11 through fixing screws. Of course, the transparent pressing plate 13 can be fixed to the pressing end face 112 of the cylindrical indenter 11 through an adhesive.

[0103] Moreover, the orthographic projection of the transparent pressing plate 13 on the pressing end face 112 overlaps at least partially with the light illumination through hole 111. For example, the orthographic projection of the transparent pressing plate 13 on the pressing end face 112 can completely cover the end of the light illumination through hole 111, and the orthographic projection of the transparent pressing plate 13 on the pressing end face 112 can also cover a part of the end of the light illumination through hole 111. So that the laser can be emitted through the light illumination through hole 111 to the transparent pressing plate 13 on the pressing end face 112, and penetrate through the transparent pressing plate 13 to the first substrate on which the Micro LED is installed, so that the Micro LED is separated from the first substrate.

[0104] The material of the transparent pressing plate 13 can be quartz glass. Of course, the material of the transparent pressing plate 13 can also be other transparent plastics, transparent resins, etc.

[0105] In some embodiments of the present disclosure, the target wavelength of the laser that can pass through the transparent pressing plate 13 is 100 nm - 2000 nm. Specifically, the range of the target wavelength can be 390 nm - 780 nm, such as visible light, or 780 nm - 2000 nm, such as infrared light, or 100 nm - 390 nm, such as ultraviolet light. Further, the target wavelength can also be 770 nm - 622 nm (red light); 622 nm - 597 nm (orange light); 597 nm - 577 nm (yellow light); 577 - 492 nm (green light); 492 nm - 450 nm (cyan light); 450 nm - 435 nm (blue light); 455 nm - 350 nm (violet light). Of course, the target wavelength can also be 100 nm - 1900 nm, or 200 nm - 1800 nm, or 300 nm - 1700 nm, or 400 nm - 1600 nm, or 500 nm - 1500 nm, or 600 nm - 1400 nm, or 700 nm - 1300 nm, or 800 nm - 1200 nm, or 900 nm - 1100 nm, etc.

[0106] Refer to Figures 1-4 As shown, the rotary cylinder 12 is in threaded fit with the outer periphery of the cylindrical pressing head 11, such that the rotary cylinder 12 is sleeved on the outer periphery of the cylindrical pressing head 11, and the rotary cylinder 12 can rotate relative to the cylindrical pressing head 11. Specifically, refer to Figure 3 As shown, an external spiral groove 113 is provided on the outer peripheral surface of the cylindrical pressing head 11. Refer to Figure 4 As shown, an internal spiral groove 121 matching the external spiral groove 113 is provided on the inner cylindrical wall of the rotary cylinder 12. Moreover, the pressing device 100 may further include a ball 14, and the ball 14 is in rolling fit within the external spiral groove 113 and the internal spiral groove 121. The ball 14 makes the friction between the rotary cylinder 12 and the cylindrical pressing head 11 a rolling friction, reduces the frictional force between the rotary cylinder 12 and the cylindrical pressing head 11, and improves the power transmission efficiency between the rotary cylinder 12 and the cylindrical pressing head 11.

[0107] Of course, in some other exemplary embodiments of the present disclosure, an external thread may be provided on the outer peripheral surface of the cylindrical pressing head 11, and an internal thread matching the external thread may be provided on the inner cylindrical wall of the rotary cylinder 12, so that the rotary cylinder 12 is in threaded fit with the outer periphery of the cylindrical pressing head 11.

[0108] Refer to Figure 2 and Figure 3 As shown, the limiting mechanism 2 is connected to the cylindrical pressing head 11, and the limiting mechanism 2 is used to limit the rotation of the cylindrical pressing head 11 following the rotary cylinder 12, so that the cylindrical pressing head 11 drives the transparent pressing plate 13 and the first substrate to perform a linear motion along the axial direction X.

[0109] Specifically, a limit through hole 115 is provided on the cylindrical indenter 11. The limit through hole 115 extends along the axial direction X. The limit through hole 115 can be provided in four numbers, and the four limit through holes 115 are evenly distributed on the outer periphery of the light through hole 111, so that the limit acting force is evenly distributed. The limit mechanism 2 can include a guide shaft 21. The guide shaft 21 is slidably fitted in the limit through hole 115. At least one end of the guide shaft 21 is fixed. For example, one end of the guide shaft 21 close to the fixed plate 8 is fixedly connected to the fixed plate 8 by screws. The rotation of the guide shaft 21 is limited by the fixed plate 8, so that the guide shaft 21 cannot rotate, and thus the cylindrical indenter 11 cannot rotate following the rotating cylinder 12. However, since the rotating cylinder 12 has been fixed to the cross beam 9, when the rotating cylinder 12 rotates, the rotating cylinder 12 cannot perform linear movement, so that the cylindrical indenter 11 threadedly fitted with the rotating cylinder 12 can perform linear movement, thereby realizing pressing. Of course, the number of the limit through holes 115 and the number of the guide shafts 21 can be set as required. For example, the limit through hole 115 can be provided in one, two, three or more numbers. Correspondingly, the guide shaft 21 can be provided in one, two, three or more numbers.

[0110] In some exemplary embodiments of the present disclosure, the limit mechanism 2 may further include a linear bearing 22. The linear bearing 22 is fixed in the limit through hole 115. The guide shaft 21 is slidably fitted in the linear bearing 22. The linear bearing 22 can be of a straight cylinder type, so that the guide shaft 21 is slidably fitted in the cylinder of the linear bearing 22. The linear bearing 22 has small friction, is relatively stable, does not change with the bearing speed, and can obtain a smooth linear movement with high sensitivity and high precision. The friction between the guide shaft 21 and the limit through hole 115 can be reduced by the linear bearing 22.

[0111] Referring to Figure 1 As shown, the driving mechanism 3 is connected to the rotating cylinder 12. The driving mechanism 3 is used to provide rotational power for the rotating cylinder 12. Specifically, the driving mechanism 3 can include a driving motor 31 and a speed reducer 32. The driving motor 31 has a driving shaft. The driving motor 31 can be a rotating motor, and rotational power is output through the driving shaft. The speed reducer 32 is connected to the driving shaft of the driving motor 31. The output shaft of the speed reducer 32 is fixedly connected to the second gear 42. For example, the output shaft of the speed reducer 32 and the second gear 42 can be fixedly connected through an elastic coupling. The rotation speed can be reduced and the torque can be increased by the speed reducer 32.

[0112] Of course, in some other exemplary embodiments of the present disclosure, when the rotation speed of the driving motor 31 is appropriate, the speed reducer 32 may not be provided.

[0113] In the present exemplary embodiment, referring to Figure 1As shown, the pressing device 100 may further include a transmission mechanism 4. The transmission mechanism 4 is connected between the driving mechanism 3 and the rotating cylinder 12. The transmission mechanism 4 is used to transmit the rotational power of the driving mechanism 3 to the rotating cylinder 12 to make the rotating cylinder 12 rotate.

[0114] The transmission mechanism 4 may be a gear transmission mechanism 4. Specifically, the transmission mechanism 4 may include a first gear 41 and a second gear 42. The first gear 41 is fixedly connected to the rotating cylinder 12 and is arranged concentrically with the rotating cylinder 12. For example, the first gear 41 may be fixed to the end face of the rotating cylinder 12 facing away from the cross beam 9 by screws, or the first gear 41 may also be sleeved on the outer periphery of the rotating cylinder 12. The second gear 42 is fixed to the output end of the driving mechanism 3, that is, the second gear 42 is fixed to the output shaft of the speed reducer 32, and the second gear 42 meshes with the first gear 41.

[0115] The transmission mechanism 4 may include a mounting seat 43. The second gear 42 is installed in the mounting seat 43. Specifically, the second gear 42 is installed in the mounting seat 43 through a bearing, so that the second gear 42 can rotate. The driving mechanism 3 is installed above the mounting seat 43. Specifically, the speed reducer 32 is installed above the mounting seat 43, and the driving motor 31 is installed on the side of the speed reducer 32 facing away from the mounting seat 43.

[0116] The specific pressing working process is as follows. The cross beam 9 may be fixed to the ground. Therefore, the cross beam 9 can be fixed in the axial direction X and does not move. Moreover, the thickening plate 81, the slewing bearing 7, and the fixing plate 8 can also be fixed in the axial direction X. The driving mechanism 3 and the transmission mechanism 4 are fixed to the mounting plate 6, and the limiting mechanism 2, the driving mechanism 3, and the transmission mechanism 4 can also be fixed in the axial direction X. The driving motor 31 rotates. After being decelerated by the speed reducer 32, the speed reducer 32 drives the second gear 42 to rotate. The second gear 42 drives the first gear 41 to rotate. The first gear 41 drives the rotating cylinder 12 to rotate. Since the rotating cylinder 12 is fixed and cannot perform linear motion, and the cylindrical pressing head 11 is limited by the limiting mechanism 2 and cannot perform rotational motion, therefore, under the action of the rotational force of the rotating cylinder 12, the cylindrical pressing head 11 performs linear motion along the axial direction X, and then drives the transparent pressing plate 13 and the first substrate to perform linear motion along the axial direction X.

[0117] In the present exemplary embodiment, referring to Figure 2 and Figure 3 As shown, the pressing device 100 may further include a pressure sensor 10. The pressure sensor 10 is arranged between the transparent pressing plate 13 and the pressing end face 112. The pressure applied by the cylindrical pressing head 11 can be sensed in real time through the pressure sensor 10. For example, grooves may be provided on the pressing end face 112 and the transparent pressing plate 13 to accommodate the pressure sensor 10. Preferably, the pressure sensor 10 may be a disc-shaped pressure sensor, which can better complete the pressure test while not affecting the contact between the transparent pressing plate 13 and the pressing end face 112.

[0118] In the present exemplary embodiment, with reference to Figure 1 and Figure 2 as shown, the driving mechanisms 3 can be provided in two, and the two driving mechanisms 3 are symmetrically arranged on the opposite sides of the rotary drum 12 with the central axis of the rotary drum 12 as the axis of symmetry, that is, the axis of symmetry of the two driving mechanisms 3 is the central axis of the rotary drum 12; it can also be said that the two driving mechanisms 3 are symmetrically arranged on the opposite sides in the radial direction of the rotary drum 12; in this case, the second gears 42 also need to be provided in two, and the two second gears 42 are fixedly connected to the output ends of the two driving mechanisms 3 in a one-to-one correspondence. The pressure sensors 10 can be provided in two, and the pressure sensors 10 are arranged between the light through holes 111 and the driving mechanisms 3, so that the two pressure sensors 10 can detect the pressures output by the two driving mechanisms 3 in real time in a one-to-one correspondence.

[0119] In the present exemplary embodiment, with reference to Figure 5 as shown, the pressurizing device 100 may further include a controller 101. The controller 101 has a control output end and a signal input end. The two pressure sensors 10 are electrically connected to the signal input end of the controller 101. Specifically, the signal output ends of the two pressure sensors 10 are electrically connected to the signal input end of the controller 101; the control output end is electrically connected to the control end of the driving mechanism 3. The controller 101 is used to control the output pressures of the two driving mechanisms 3 according to the pressure signals sensed by the two pressure sensors 10.

[0120] For the convenience of description, the two pressure sensors 10 are respectively a first pressure sensor and a second pressure sensor, and the two driving mechanisms 3 are a first driving mechanism and a second driving mechanism; the first pressure sensor is arranged between the light through hole 111 and the first driving mechanism and is used to detect the pressure output by the first driving mechanism 3; the second pressure sensor is arranged between the light through hole 111 and the second driving mechanism and is used to detect the pressure output by the second driving mechanism.

[0121] Specifically, the controller 101 compares the pressure signals sensed by the two pressure sensors 10. If the difference between the pressure signals sensed by the two pressure sensors 10 is within the set range, the controller 101 does not output a control signal, and the two driving mechanisms 3 maintain the current output pressures; if the difference between the pressure signals sensed by the two pressure sensors 10 exceeds the set range, and the pressure signal sensed by the first pressure sensor is greater than the pressure signal sensed by the second pressure sensor, the controller 101 outputs a control signal to increase the output pressure of the second driving mechanism or decrease the output pressure of the first driving mechanism, so that the output pressures of the two driving mechanisms 3 are basically the same to ensure the balance of the pressures of the cylindrical indenter 11 and the transparent pressing plate 13.

[0122] Of course, in some other exemplary embodiments of the present disclosure, three or more driving mechanisms 3 are provided, and the three or more driving mechanisms 3 are uniformly distributed on the outer periphery of the rotating cylinder 12 with the central axis of the rotating cylinder 12 as the central axis. In this case, three or more second gears 42 also need to be provided, and the three or more second gears 42 are fixedly arranged at the output ends of the three or more driving mechanisms 3 in one-to-one correspondence. Three or more pressure sensors 10 can be provided, and the three or more pressure sensors 10 are arranged between the light through holes 111 and the three or more driving mechanisms 3 in one-to-one correspondence, so that the three or more pressure sensors 10 can detect the pressure output by the three or more driving mechanisms 3 in real time in one-to-one correspondence. Moreover, the output pressure of the three or more driving mechanisms 3 can be controlled to be substantially the same through the controller 101.

[0123] In this exemplary embodiment, with reference to Figure 1 and Figure 2 as shown, the pressing device 100 may include a mounting plate 6, and the mounting plate 6 is used to fix the driving mechanism 3 and the limiting mechanism 2.

[0124] Specifically, the mounting plate 6 is arranged on the side of the rotating cylinder 12 close to the transparent pressing plate 13, that is, the mounting plate 6 is arranged on the side of the rotating cylinder 12 facing away from the cross beam 9. A receiving through hole 61 for the transparent pressing plate 13 to pass through is provided on the mounting plate 6, that is, the receiving through hole 61 is arranged opposite to the transparent pressing plate 13, so that the transparent pressing plate 13 can pass through the receiving through hole 61 and adsorb to the first substrate.

[0125] Moreover, one end of the guide shaft 21 close to the mounting plate 6 can be fixedly connected to the mounting plate 6 by screws, and the rotation of the guide shaft 21 is further limited by the mounting plate 6.

[0126] The mounting seat 43 is also fixed on the mounting plate 6, so that the driving mechanism 3 is fixed on the mounting plate 6.

[0127] Of course, in some other exemplary embodiments of the present disclosure, the mounting plate 6 may not be provided, and the driving mechanism 3 can be fixed on the cross beam 9. For example, the driving motor 31 can be directly fixed on the cross beam 9.

[0128] In this exemplary embodiment, the transparent pressing plate 13 can adsorb the first substrate, with reference to Figure 2As shown, a plurality of adsorption through-holes 131 are provided on the transparent pressing plate 13. The adsorption through-holes 131 have an adsorption port 1311 and a ventilation port 1313. The adsorption port 1311 and the ventilation port 1313 are connected through a first pipeline 1312, and the first pipeline 1312 is arranged inside the transparent pressing plate 13. The adsorption port 1311 of the adsorption through-hole 131 is located on the surface of the transparent pressing plate 13 facing the first substrate, that is, the adsorption through-hole 131 is located on the surface of the transparent pressing plate 13 facing the carrier 200. The ventilation port 1313 can be located on the side wall of the transparent pressing plate 13, and the ventilation port 1313 can be used to connect to the vacuum adsorption mechanism 5. After passing through the ventilation port 1313, the first pipeline 1312, and the adsorption port 1311, the vacuum adsorption mechanism 5 adsorbs the first substrate through the adsorption port 1311. The material of the transparent pressing plate 13 includes crystalline or amorphous inorganic non-metals. The transparent pressing plate 13 can generally be a cuboid, a cube, a polygonal prism, a cylinder, etc.

[0129] Referring to Figure 6 As shown, the pressing device 100 may further include a vacuum adsorption mechanism 5. The vacuum adsorption mechanism 5 is connected to a plurality of adsorption through-holes 131, and the vacuum adsorption mechanism 5 is used to evacuate the adsorption through-holes 131.

[0130] Specifically, the vacuum adsorption mechanism 5 may include a vacuum pump 51 and a vacuum pressure regulating valve 52. The vacuum pump 51 is connected to the adsorption through-holes 131 through a ventilation pipe, and the vacuum pressure regulating valve 52 is connected between the vacuum pump 51 and the adsorption through-holes 131, that is, the vacuum pressure regulating valve 52 is connected to the ventilation pipe between the vacuum pump 51 and the adsorption through-holes 131. The vacuum pressure regulating valve 52 realizes the regulation and stabilization of pressure by controlling the flow of gas. The vacuum pressure regulating valve 52 can be a manual vacuum pressure regulating valve 52; the vacuum pressure regulating valve 52 can also be an automatic vacuum pressure regulating valve 52. The automatic vacuum pressure regulating valve 52 can collect the negative pressure of the adsorption through-holes 131 and realize the regulation and stabilization of pressure by controlling the flow of gas.

[0131] The vacuum adsorption mechanism 5 may further include a negative pressure gauge 53. The negative pressure gauge 53 is connected to the adsorption through-holes 131, and the negative pressure of the adsorption through-holes 131 can be detected and displayed through the negative pressure gauge 53. Of course, the negative pressure gauge 53 may not be provided.

[0132] The vacuum adsorption mechanism 5 may further include a vacuum circuit breaker, and the vacuum circuit breaker is connected to the vacuum pump 51.

[0133] The pressurizing device 100 may further include a first solenoid valve 54 and an air compressor 55. The first solenoid valve 54 has at least three interfaces. For example, the first solenoid valve 54 may be a two-way solenoid valve, a three-way solenoid valve, a four-way solenoid valve, etc. The first solenoid valve 54 is connected between the adsorption through-hole 131 and the vacuum pressure regulating valve 52, that is, the first solenoid valve 54 is connected to the air pipe between the adsorption through-hole 131 and the vacuum pressure regulating valve 52. The air compressor 55 is connected to one of the interfaces of the first solenoid valve 54.

[0134] For example, the first solenoid valve 54 is a two-way solenoid valve. The two-way solenoid valve has three interfaces. The first interface is connected to the adsorption through-hole 131 through an air pipe, the second interface is connected to the vacuum pressure regulating valve 52 through an air pipe, and the third interface is connected to the air compressor 55 through an air pipe. The first solenoid valve 54 can be adjusted to make the first interface communicate with the second interface or make the first interface communicate with the third interface. When the first interface communicates with the second interface, the adsorption through-hole 131 is connected to the vacuum pressure regulating valve 52 and the vacuum pump 51, and the vacuum pump 51 can evacuate the adsorption through-hole 131 so that the transparent pressing plate 13 can adsorb the first substrate. When the first interface communicates with the third interface, the adsorption through-hole 131 is connected to the air compressor 55, and the air compressor 55 can introduce high-pressure air into the adsorption through-hole 131.

[0135] Since the roughness of the planes where the transparent pressing plate 13 and the first substrate are in contact with each other is relatively low, the transparent pressing plate 13 can adsorb the first substrate well. However, after the transparent pressing plate 13 adsorbs the first substrate, even if the negative pressure is removed, there is still a certain adsorption force between the transparent pressing plate 13 and the first substrate, resulting in that the first substrate is not easily separated from the transparent pressing plate 13.

[0136] The air compressor 55 can output high-pressure air to the adsorption through-hole 131 through the first solenoid valve 54 and the ventilation pipe. The high-pressure air is ejected through the adsorption through-hole 131, generating a certain thrust on the first substrate. Moreover, the high-pressure air enters between the first substrate and the transparent pressing plate 13, destroying the vacuum degree between the first substrate and the transparent pressing plate 13, making it easy for the first substrate to be separated from the transparent pressing plate 13.

[0137] The pressurizing device 100 may further include a second solenoid valve 56 and an air filter 57. The second solenoid valve 56 is connected between the air compressor 55 and the first solenoid valve 54. The second solenoid valve 56 can be used to further control the air compressor 55 to prevent the air compressor 55 from introducing high-pressure air when the transparent pressing plate 13 adsorbs the first substrate.

[0138] An air filter 57 is connected between the adsorption through-hole 131 and the first electromagnetic valve 54. The air passing through can be filtered by the air filter 57, especially the high-pressure air, to prevent dust and other impurities in the high-pressure air from being ejected onto the first substrate and contaminating the first substrate.

[0139] Based on the same inventive concept, the present disclosure also provides a light-emitting chip transfer device. Referring to Figure 7 as shown, the dotted arrows in the figure represent the optical paths of laser irradiation. The light-emitting chip transfer device may include a carrier table 200, a laser irradiation device 300, and a pressing device 100. The pressing device 100 is the pressing device 100 in any of the above embodiments, so it will not be described in detail here. The carrier table 200 and the pressing device 100 are oppositely arranged in the axial direction X. The carrier table 200 is used to carry the second substrate; the laser irradiation device 300 is used to generate a laser with a target wavelength and irradiate the laser onto the transparent pressing plate 13.

[0140] The laser irradiation device 300 may be disposed above the cross beam 9. In this case, a through-hole for the laser to pass through is also provided on the cross beam 9. The laser emitted by the laser irradiation device 300 sequentially passes through the through-hole on the cross beam 9, the through-hole on the thickening plate 81, the through-hole on the fixing plate 8, the through-hole formed by the inner ring 71 of the bearing of the slewing bearing 7, the through-hole on the rotating cylinder 12, and the light-irradiation through-hole 111 on the cylindrical pressing head 11, irradiates onto the transparent pressing plate 13, and passes through the transparent pressing plate 13 to irradiate onto the first substrate.

[0141] Of course, in some other exemplary embodiments of the present disclosure, the laser irradiation device 300 may be disposed below the cross beam 9, for example, disposed in the through-hole on the thickening plate 81. In this case, a through-hole for the laser to pass through does not need to be provided on the cross beam 9. The laser emitted by the laser irradiation device 300 sequentially passes through the through-hole on the thickening plate 81, the through-hole on the fixing plate 8, the through-hole formed by the inner ring 71 of the bearing of the slewing bearing 7, the through-hole on the rotating cylinder 12, and the light-irradiation through-hole 111 on the cylindrical pressing head 11, irradiates onto the transparent pressing plate 13, and passes through the transparent pressing plate 13 to irradiate onto the first substrate.

[0142] The carrier stage 200 may include support rods 201 and a support plate 202. The number of support rods 201 may be multiple, and the multiple support rods 201 surround the support plate 202. The number of support rods 201 can be set according to the size or shape of the support plate 202, etc. For example, if the support plate 202 is substantially circular, the number of support rods 201 can be three, four, five or more, and the multiple support rods 201 are circumferentially and evenly distributed around the support plate 202. Another example is that if the support plate 202 is substantially quadrilateral, the number of support rods 201 can be four, six, eight or more, and the multiple support rods 201 can be distributed around the support plate 202 according to the position of the four sides of the support plate 202. The support rods 201 extend along the axial direction X. The cross-section of the support rods 201 can be circular, oval, triangular, rectangular, square or other polygons, etc., and the present disclosure does not specifically limit this.

[0143] In the present exemplary embodiment, the light-emitting chip transfer device further includes a heating member 400. The heating member 400 is connected to the carrier stage 200. Specifically, the heating member 400 is disposed on the side of the support plate 202 of the carrier stage 200 close to the support rods 201, and the heating member 400 is used to heat the carrier stage 200.

[0144] The heating member 400 has a heating function and mainly completes the heating of the carrier stage 200. The heating member 400 may include a housing and structures such as heating tubes and temperature controllers disposed inside the housing, and the present disclosure does not specifically limit this. The carrier stage 200 and the heating member 400 may be connected integrally. For example, the heating member 400 can be fixed to the carrier stage 200 by screws, or the carrier stage 200 and the heating member 400 are directly processed into an integral structure.

[0145] During the pressurization process, the carrier stage 200, the laser irradiation device 300, and the heating member 400 all remain stationary in the axial direction X.

[0146] Based on the same inventive concept, the present disclosure also provides a method for transferring a light-emitting chip. The method for transferring a light-emitting chip may include: transferring the light-emitting chip from the source substrate to the intermediate substrate, and then from the intermediate substrate to the target substrate;

[0147] Among them, the light-emitting chip is transferred from the source substrate to the intermediate substrate by using the above light-emitting chip transfer device, the first substrate is the source substrate, and the second substrate is the intermediate substrate;

[0148] And / or, the light-emitting chip is transferred from the intermediate substrate to the target substrate by using the above light-emitting chip transfer device, the first substrate is the intermediate substrate, and the second substrate is the target substrate.

[0149] Based on the same inventive concept, the present disclosure also provides a method for transferring light-emitting chips. The method for transferring light-emitting chips may include applying pressure and laser irradiation to a first substrate and a second substrate. The first substrate allows laser light of a target wavelength to pass through axially in the X direction, and the light-emitting chips are initially located on the first substrate.

[0150] Among them, the driving mechanism 3 drives the rotating cylinder 12 to rotate, so that the transparent pressing plate 13 moves towards the bearing platform 200 to apply pressure, causing the first substrate and the second substrate to contact and generate a mutual acting force.

[0151] The laser generated by the laser irradiation device 300 passes through to the transparent pressing plate 13 to perform laser irradiation on the first substrate and the second substrate, so that the light-emitting chips on the first substrate are transferred to the second substrate.

[0152] Furthermore, the method for transferring light-emitting chips further includes:

[0153] Turn on the vacuum pump 51 to evacuate the adsorption through holes 131 on the transparent pressing plate 13, so that the transparent pressing plate 13 adsorbs the first substrate, and the transparent pressing plate 13 rises to separate the first substrate from the second substrate.

[0154] After transferring the first substrate to the target position; turn off the vacuum pump 51, and turn on the air compressor 55 to pass high-pressure air through the adsorption through holes 131 on the transparent pressing plate 13 to break the vacuum between the transparent pressing plate 13 and the first substrate, and the high-pressure air applies a thrust to the first substrate to separate the transparent pressing plate 13 from the first substrate.

[0155] Furthermore, in the case where the heating member 400 is provided, the method for transferring light-emitting chips may further include: the heating member 400 heats the bearing platform 200, and then heats the second substrate, which further facilitates the massive transfer of chips and provides feasibility for the massive transfer of chips.

[0156] In a specific embodiment, the light-emitting chips are located on one side of the first substrate. A first adhesive layer sensitive to laser light of a specific wavelength is included between the first substrate and the light-emitting chips; when performing chip transfer, the second substrate is disposed opposite to the first substrate, and a second adhesive layer is included on the side of the second substrate facing the first substrate. When the laser sequentially passes through the transparent pressing plate 13 and the first substrate and acts on the first adhesive layer at the target position, the viscosity of the first adhesive becomes weaker, making the light-emitting chips at the target position more easily adhered by the second adhesive layer, thereby realizing the transfer of the light-emitting chips from the first substrate to the second substrate. Applying pressure and laser irradiation simultaneously is beneficial for the firmly bonding of the transferred light-emitting chips to the second substrate.

[0157] For example, a laser can perform surface irradiation on the first substrate (the irradiation area is relatively large) to transfer multiple light-emitting chips; for example, a laser can perform spot irradiation on the first substrate (it can be understood that the irradiation area only plays a role in transferring one of the light-emitting chips) to transfer the light-emitting chip at a target position; for example, a laser can scan the first substrate to sequentially transfer multiple light-emitting chips arranged in an array from the first substrate to the second substrate. Therefore, by using the light-emitting chip transfer device of the present disclosure, selective transfer of light-emitting chips can be achieved.

[0158] It should be noted that although the steps of the light-emitting chip transfer method in the present disclosure are described in a specific order, this does not require or imply that these steps must be performed in this specific order, or that all the steps shown must be performed to achieve the desired result. Additionally or alternatively, certain steps may be omitted, multiple steps may be combined into one step for execution, and / or one step may be decomposed into multiple steps for execution, etc., which should all be regarded as part of the present disclosure.

[0159] Those skilled in the art will readily conceive of other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure, which follow the general principles of the present disclosure and include known common knowledge or conventional technical means in the technical field not disclosed in the present disclosure. The specification and examples are only regarded as exemplary, and the true scope and spirit of the present disclosure are pointed out by the appended claims.

Claims

1. A pressurizing device, characterized in that, it is used to transfer a light-emitting chip from a first substrate to a second substrate, and the pressurizing device includes: a cylindrical indenter, on which a light-passing through hole is provided, the light-passing through hole extends along the axial direction of the cylindrical indenter, the cylindrical indenter has a pressing end face, and the pressing end face is perpendicular to the axial direction; a rotating cylinder, threadedly engaged with the outer periphery of the cylindrical indenter; a transparent pressing plate, fixed to the pressing end face of the cylindrical indenter, and the orthographic projection of the transparent pressing plate on the pressing end face overlaps at least partially with the light-passing through hole, and the transparent pressing plate is used to connect the first substrate; a limiting mechanism, connected to the cylindrical indenter, the limiting mechanism is used to limit the cylindrical indenter from rotating following the rotating cylinder, so that the cylindrical indenter drives the transparent pressing plate and the first substrate to perform a linear motion along the axial direction, and contacts the second substrate in the axial direction and generates an interaction force; a driving mechanism, connected to the rotating cylinder, for providing a rotating power for the rotating cylinder.

2. The pressurizing device according to claim 1, characterized in that, an outer spiral groove is provided on the outer peripheral surface of the cylindrical indenter, an inner spiral groove matching the outer spiral groove is provided on the inner cylindrical wall of the rotating cylinder, and the pressurizing device further includes: a ball, rolling and fitted within the outer spiral groove and the inner spiral groove.

3. The pressurizing device according to claim 1, characterized in that, the pressurizing device further includes a slewing bearing and a fixing plate, and the slewing bearing includes a relatively rotatable bearing inner ring and a bearing outer ring; the fixing plate is fixedly connected to the bearing inner ring, and the bearing outer ring is fixedly connected to the rotating cylinder; or, the fixing plate is fixedly connected to the bearing outer ring, and the bearing inner ring is fixedly connected to the rotating cylinder.

4. The pressurizing device according to claim 3, characterized in that, the pressurizing device further includes: a cross beam, provided on the side of the fixing plate away from the rotating cylinder, and the fixing plate is fixed to the cross beam.

5. The pressurizing device according to claim 1, characterized in that, a limiting through hole is provided on the cylindrical indenter, the limiting through hole extends along the axial direction, and the limiting mechanism includes: a guiding shaft, slidably fitted within the limiting through hole, and at least one end of the guiding shaft is fixed.

6. The pressurizing device according to claim 5, characterized in that, the limiting mechanism further includes: a linear bearing, fixed within the limiting through hole, and the guiding shaft is slidably fitted within the linear bearing.

7. The pressurizing device according to any one of claims 1 to 6, characterized in that, the pressurizing device further includes: a pressure sensor, provided between the transparent pressing plate and the pressing end face.

8. The pressurizing device according to claim 7, characterized in that, two driving mechanisms are provided, and the two driving mechanisms are symmetrically arranged on opposite sides of the rotating cylinder with the central axis of the rotating cylinder as the axis of symmetry; two pressure sensors are provided, and the two pressure sensors are respectively provided between the light-passing through hole and the two driving mechanisms in a one-to-one correspondence.

9. The pressurizing device according to claim 8, characterized in that, The pressure applying device further includes: A controller having a control output end and a signal input end. Two of the pressure sensors are electrically connected to the signal input end of the controller, and the control output end is electrically connected to the control end of the driving mechanism. The controller is configured to control the output pressure of the two driving mechanisms according to the pressure signals sensed by the two pressure sensors.

10. The pressure applying device according to any one of claims 1 to 6, characterized in that the pressure applying device further includes: A transmission mechanism connected between the driving mechanism and the rotating cylinder. The transmission mechanism is configured to transmit the rotational power of the driving mechanism to the rotating cylinder to cause the rotating cylinder to rotate.

11. The pressure applying device according to claim 10, characterized in that the transmission mechanism includes: A first gear fixedly connected to the rotating cylinder and arranged concentrically with the rotating cylinder; A second gear fixed to the output end of the driving mechanism, and the second gear meshes with the first gear.

12. The pressure applying device according to claim 11, characterized in that the driving mechanism includes: A driving motor having a driving shaft; A speed reducer connected to the driving shaft, and the output shaft of the speed reducer is fixedly connected to the second gear.

13. The pressure applying device according to any one of claims 1 to 6, characterized in that the pressure applying device further includes: A mounting plate provided on a side of the rotating cylinder close to the transparent pressing plate. The mounting plate is configured to fix the driving mechanism and the limiting mechanism, and a receiving through hole for the transparent pressing plate to pass through is provided on the mounting plate.

14. The pressure applying device according to any one of claims 1 to 6, characterized in that the pressure applying device further includes: Fixing screws for fixing the transparent pressing plate and the cylindrical pressing head.

15. The pressure applying device according to any one of claims 1 to 6, characterized in that A plurality of adsorption through holes are provided on the transparent pressing plate, and the adsorption ports of the adsorption through holes are located on the surface of the transparent pressing plate facing the first substrate. The pressure applying device further includes: A vacuum adsorption mechanism connected to the plurality of adsorption through holes. The vacuum adsorption mechanism is configured to evacuate the adsorption through holes.

16. The pressure applying device according to claim 15, characterized in that the vacuum adsorption mechanism includes: A vacuum pump connected to the adsorption through holes; A vacuum pressure regulating valve connected between the vacuum pump and the adsorption through holes; A negative pressure gauge connected to the adsorption through holes.

17. The pressure applying device according to claim 16, characterized in that the pressure applying device further includes: A first solenoid valve connected between the adsorption through holes and the vacuum pressure regulating valve. The first solenoid valve has at least three interfaces; An air compressor connected to one of the interfaces of the first solenoid valve.

18. The pressure applying device according to claim 17, characterized in that the pressure applying device further includes: A second solenoid valve connected between the air compressor and the first solenoid valve; An air filter connected between the adsorption through holes and the first solenoid valve.

19. A light-emitting chip transfer device, characterized in that it includes: A pressing device, which is the pressing device according to any one of claims 1 to 18; A carrier stage, which is disposed opposite to the pressing device in the axial direction, and the carrier stage is used for carrying a second substrate; A laser irradiation device, which is used for generating a laser with a target wavelength and irradiating the laser onto the transparent pressing plate.

20. The light-emitting chip transfer device according to claim 19, wherein, the light-emitting chip transfer device further includes: a heating member, which is connected to the carrier stage, and the heating member is used for heating the carrier stage.

21. A method for transferring a light-emitting chip, wherein, it includes: transferring the light-emitting chip from a source substrate to an intermediate substrate, and then from the intermediate substrate to a target substrate; wherein, the light-emitting chip transfer device according to claim 19 or 20 is used to transfer the light-emitting chip from the source substrate to the intermediate substrate, the first substrate is the source substrate, and the second substrate is the intermediate substrate; and / or, the light-emitting chip transfer device according to claim 19 or 20 is used to transfer the light-emitting chip from the intermediate substrate to the target substrate, the first substrate is the intermediate substrate, and the second substrate is the target substrate.

22. A method for transferring a light-emitting chip, wherein, it includes using the light-emitting chip transfer device according to claim 19 or 20 to perform pressing and laser irradiation on a first substrate and a second substrate, the first substrate allows the laser with the target wavelength to pass through axially, and the light-emitting chip is initially located on the first substrate: wherein, the driving mechanism drives the rotating cylinder to rotate, so that the transparent pressing plate moves towards the carrier stage to perform pressing, so that the first substrate and the second substrate are in contact and generate an interaction force; the laser generated by the laser irradiation device passes through the transparent pressing plate to perform laser irradiation on the first substrate and the second substrate, so that the light-emitting chip on the first substrate is transferred to the second substrate.

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