Display panel manufacturing method and display panel

Abstract

This application belongs to the field of display technology, specifically relating to a light-emitting device, a method for manufacturing a display panel, and the display panel itself. The light-emitting device includes a light-emitting diode (LED), a cylindrical portion, and a supporting portion. The LED is disposed on the end face of a first end of the cylindrical portion, and the orthographic projection of the LED onto the end face of the first end of the cylindrical portion is located within or coincides with the end face of the first end of the cylindrical portion. The supporting portion is disposed on the end face of a second end of the cylindrical portion, and at least a portion of the orthographic projection of the supporting portion onto the end face of the second end of the cylindrical portion is located outside the end face of the second end of the cylindrical portion. When the light-emitting device is used to manufacture a display panel, light-emitting devices of different sizes can be manufactured and positioned at different positions on a transfer substrate. Light-emitting devices of different sizes may include LEDs of different emitting colors, thus enabling the simultaneous transfer of LEDs of different emitting colors, thereby improving the production efficiency of the display panel.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of display, and particularly relates to a manufacturing method of a display panel and the display panel. BACKGROUND

[0002] Mini / Micro LED display technology is a new generation of display technology, and has higher photoelectric efficiency, higher brightness, higher contrast, and lower power consumption compared with the existing liquid crystal display technology, and can also realize flexible display by combining with a flexible substrate.

[0003] When the mini light-emitting diode display panel is manufactured, a mass transfer technology is needed to transfer up to several million to tens of millions of mini light-emitting diodes from a growth substrate to a driving substrate. The mini light-emitting diode display panel includes red mini light-emitting diodes, green mini light-emitting diodes and blue mini light-emitting diodes to realize color (RGB) display.

[0004] In the prior art, different semiconductor materials and different manufacturing processes are used to manufacture mini light-emitting diodes of different light-emitting colors, and the mini light-emitting diodes of different light-emitting colors need to be transferred respectively, which not only is cumbersome and time-consuming, but also reduces the overall production efficiency. SUMMARY

[0005] The present application aims to provide a manufacturing method of a display panel and the display panel to realize simultaneous transfer of mini light-emitting diodes of different light-emitting colors, thereby improving the production efficiency of the display panel.

[0006] In order to achieve the above-mentioned purpose, the present application provides a light-emitting device including a light-emitting diode, the light-emitting device further comprising:

[0007] a columnar portion including opposite first and second ends, the light-emitting diode being disposed on an end face of the first end of the columnar portion, a normal projection of the light-emitting diode on the end face of the first end of the columnar portion being located within the end face of the first end of the columnar portion, or the normal projection of the light-emitting diode on the end face of the first end of the columnar portion coinciding with the end face of the first end of the columnar portion;

[0008] a support portion disposed on an end face of the second end of the columnar portion, at least part of a normal projection of the support portion on the end face of the second end of the columnar portion being located outside the end face of the second end of the columnar portion.

[0009] Optionally, the columnar portion includes a circular column, an elliptical column or a prismatic column.

[0010] Optionally, the light emitting diode comprises a first electrode, a first semiconductor layer and a second semiconductor layer which are sequentially stacked, and further comprises a second electrode, the second electrode comprises a first conductor portion, the first conductor portion connects the second semiconductor layer and the columnar portion, and a projection of the first electrode on an end face of the first end of the columnar portion is located in a central region of a projection of the first conductor portion on the end face of the first end of the columnar portion.

[0011] Optionally, the second electrode further comprises a second conductor portion and a conductive connecting portion, the second conductor portion surrounds the first electrode, the conductive connecting portion connects the first conductor portion and the second conductor portion, the light emitting diode further comprises a first insulating layer and a light emitting layer, the light emitting layer is formed between the first semiconductor layer and the second semiconductor layer, and the first insulating layer at least surrounds the first electrode, the first semiconductor layer and the light emitting layer, so that the first electrode, the first semiconductor layer and the light emitting layer are all insulated from the second electrode.

[0012] Optionally, a material of the columnar portion comprises a photodegradable adhesive or the columnar portion and the light emitting diode are connected by the photodegradable adhesive, and the photodegradable adhesive is an adhesive which can be debonded under light.

[0013] The application further provides a manufacturing method of a display panel, comprising:

[0014] The plurality of light emitting devices comprises a first light emitting device, a second light emitting device and a third light emitting device, the light emitting colors of the first light emitting device, the second light emitting device and the third light emitting device are different, and the cross-sectional dimensions of the columnar portions are different;

[0015] A transfer substrate is provided, the transfer substrate comprises a plurality of openings, the plurality of openings comprises a first opening, a second opening and a third opening, a size of the first opening matches a cross-sectional dimension of the columnar portion of the first light emitting device, a size of the second opening matches a cross-sectional dimension of the columnar portion of the second light emitting device, and a size of the third opening matches a cross-sectional dimension of the columnar portion of the third light emitting device;

[0016] The plurality of light emitting devices are transferred to the transfer substrate, the columnar portions of the light emitting devices are inserted into corresponding openings and hung on the transfer substrate through the support portions;

[0017] The light emitting devices are transferred to a driving substrate through the transfer substrate, and the light emitting diode is bound to a binding end of the driving substrate;

[0018] The light emitting diode is peeled off from the columnar portion.

[0019] Optionally, the transfer substrate is obliquely arranged so that the light emitting device can roll or slide on the transfer substrate.

[0020] Optionally, the transfer substrate is vibrated during the transferring of the plurality of light emitting devices onto the transfer substrate so that the column portion of the light emitting device is inserted into the corresponding opening.

[0021] Optionally, the column portion is made of a photodegradable glue, or the column portion and the light emitting diode are connected by the photodegradable glue, and the method for peeling the light emitting diode from the column portion comprises debonding the column portion and the light emitting diode by light.

[0022] The application further provides a display panel, which is manufactured by the method for manufacturing a display panel.

[0023] The method for manufacturing a display panel and the display panel disclosed by the application have the following beneficial effects:

[0024] In the application, the light emitting device comprises a light emitting diode, a column portion and a support portion. The light emitting diode is arranged on the end face of the first end of the column portion. The orthographic projection of the light emitting diode on the end face of the first end of the column portion is located within the end face of the first end of the column portion, or the orthographic projection of the light emitting diode on the end face of the first end of the column portion coincides with the end face of the first end of the column portion. The support portion is arranged on the end face of the second end of the column portion. At least part of the orthographic projection of the support portion on the end face of the second end of the column portion is located outside the end face of the second end of the column portion. When the light emitting device is used to manufacture a display panel, light emitting devices of different sizes can be manufactured and positioned at different positions on the transfer substrate. Light emitting devices of different sizes can comprise light emitting diodes of different light emitting colors, so that the simultaneous transfer of light emitting diodes of different light emitting colors can be realized, thereby improving the production efficiency of the display panel.

[0025] Other characteristics and advantages of the application will become apparent from the following detailed description, or will be learned by practice of the application.

[0026] It should be understood that the general description above and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0027] The drawings incorporated in the specification and constituting a part of it illustrate embodiments consistent with the present application and, together with the specification, serve to explain the principles of the application. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0028] Figure 1 This is a cross-sectional schematic diagram of the light-emitting device in Embodiment 1 of this application.

[0029] Figure 2 This is a bottom view of the light-emitting device in Embodiment 1 of this application.

[0030] Figure 3 This is a planar schematic diagram of the transfer substrate in Embodiment 1 of this application.

[0031] Figure 4 This is a cross-sectional schematic diagram of the light-emitting diode in Embodiment 1 of this application.

[0032] Figure 5 This is a schematic diagram of the structure of the driving substrate of the display panel in Embodiment 1 of this application.

[0033] Figure 6 This is a schematic diagram of the second conductor portion surrounding the first electrode in Embodiment 1 of this application.

[0034] Figure 7 This is a flowchart illustrating the manufacturing method of the display panel in Embodiment 2 of this application.

[0035] Figure 8 This is a schematic diagram of the transfer of the light-emitting device onto the transfer substrate in Embodiment 2 of this application.

[0036] Figure 9 This is a schematic diagram of the opening in the transfer substrate through which the light-emitting device is inserted in Embodiment 2 of this application.

[0037] Figure 10 This is a schematic diagram of the bonding between the light-emitting diode and the driving substrate in Embodiment 2 of this application.

[0038] Figure 11 This is a schematic diagram of the light-emitting diode being peeled off from the column portion in Embodiment 2 of this application.

[0039] Figure 12 This is a schematic diagram of the display panel structure in Embodiment 3 of this application.

[0040] Explanation of reference numerals in the attached figures:

[0041] 100, Light-emitting device; 100a, First light-emitting device; 100b, Second light-emitting device; 100c, Third light-emitting device; 110, Light-emitting diode; 111, First electrode; 112, First semiconductor layer; 113, Second semiconductor layer; 114, Second electrode; 1141, First conductor portion; 1142, Second conductor portion; 1143, Conductive connection portion; 115, Light-emitting layer; 116, First insulating layer; 117, Second insulating layer; 120, Pillar portion; 130, Support portion;

[0042] 200, transfer substrate; 210a, first opening; 210b, second opening; 210c, third opening;

[0043] 300, drive substrate; 310, base substrate; 320, bonding end; 321, first connection electrode; 322, second connection electrode. DETAILED DESCRIPTION

[0044] Example implementations are now described with reference to the following drawings. Example implementations can, however, be implemented in many different forms and should not be construed as limited to the examples set forth herein; rather, these implementations are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the example implementations to those skilled in the art.

[0045] Moreover, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the application. One skilled in the relevant art will recognize, however, that the

[0046] The application is further described in the detailed description that follows, in connection with the accompanying drawings and the specific embodiments. It should be noted that the application can claim any technique features described in the various embodiments as long as there is no conflict. The embodiments described below with reference to the drawings are illustrative and are intended to be used to explain the application, and should not be understood as limiting the application.

[0047] Embodiment One

[0048] Referring to Figure 1 and Figure 2 As shown in FIGS. 1 and 2, the light emitting device 100 according to the present embodiment includes a light emitting diode 110, a columnar portion 120, and a support portion 130. The light emitting diode 110 includes a mini / micro light emitting diode (Mini / Micro LED) having a size of less than 200 micrometers.

[0049] The columnar portion 120 includes opposite first and second ends, the light emitting diode 110 is disposed on an end face of the first end of the columnar portion 120, a projection of the light emitting diode 110 on the end face of the first end of the columnar portion 120 is located within the end face of the first end of the columnar portion 120, or the projection of the light emitting diode 110 on the end face of the first end of the columnar portion 120 coincides with the end face of the first end of the columnar portion 120. That is, the light emitting diode 110 does not exceed the edge of the columnar portion 120. It should be noted that after the light emitting device 100 is transferred to the driving substrate 300, the light emitting diode 110 can be peeled off from the columnar portion 120, and the driving substrate 300 and the light emitting diode 110 form a display panel.

[0050] The support portion 130 is disposed on an end face of the second end of the columnar portion 120, at least part of a projection of the support portion 130 on the end face of the second end of the columnar portion 120 is located outside the end face of the second end of the columnar portion 120. That is, the support portion 130 protrudes relative to the edge of the columnar portion 120.

[0051] The display panel includes the light emitting diode 110, when the light emitting device 100 is used to manufacture the display panel, light emitting devices 100 of different sizes can be manufactured, the light emitting diodes 110 of the light emitting devices 100 of different sizes are of different light emitting colors, and the transfer substrate 200 includes openings of different sizes matched with the columnar portions 120, so that the light emitting devices 100 of different sizes can be positioned at different positions on the transfer substrate 200, thereby realizing simultaneous transfer of the light emitting diodes 110 of different light emitting colors. When the light emitting device 100 is used to manufacture the display panel, the specific method of transferring the light emitting diode 110 to the driving substrate 300 to form the display panel will be described in detail below.

[0052] In the embodiment, the light emitting device 100 includes the light emitting diode 110, the columnar portion 120, and the support portion 130, the light emitting diode 110 is disposed on an end face of the first end of the columnar portion 120, a projection of the light emitting diode 110 on the end face of the first end of the columnar portion 120 is located within the end face of the first end of the columnar portion 120, or the projection of the light emitting diode 110 on the end face of the first end of the columnar portion 120 coincides with the end face of the first end of the columnar portion 120, and the support portion 130 is disposed on an end face of the second end of the columnar portion 120, at least part of a projection of the support portion 130 on the end face of the second end of the columnar portion 120 is located outside the end face of the second end of the columnar portion 120. When the light emitting device 100 is used to manufacture the display panel, light emitting devices 100 of different sizes can be manufactured and positioned at different positions on the transfer substrate 200, the light emitting devices 100 of different sizes can include light emitting diodes 110 of different light emitting colors, so that simultaneous transfer of the light emitting diodes 110 of different light emitting colors can be realized, thereby improving the production efficiency of the display panel.

[0053] In some embodiments, the columnar portion 120 comprises a cylinder, an elliptic cylinder or a prism, and the prism comprises a quadrangular prism, a pentagonal prism, a hexagonal prism, etc. The orthogonal projection of the light-emitting diode 110 on the end face of the first end of the columnar portion 120 can be circular, rectangular, etc., and the specific shape is not limited.

[0054] When the columnar portion 120 is a cylinder, the orthogonal projection of the light-emitting diode 110 on the end face of the first end of the columnar portion 120 is circular. In this way, the columnar portion 120 is easier to be inserted into the opening of the transfer substrate 200, and the columnar portion 120 and the opening on the transfer substrate 200 do not need to be circumferentially aligned, which reduces the difficulty of transferring the light-emitting diode 110. When the columnar portion 120 is an elliptic cylinder or a prism, the orthogonal projection of the light-emitting diode 110 on the end face of the first end of the columnar portion 120 can be rectangular. In this way, the light-emitting diode 110 can be arranged in the row direction and the column direction on the display panel, and the positioning inaccuracy of the light-emitting diode 110 does not affect the pixel uniformity of the display panel.

[0055] In some embodiments, the light-emitting diode 110 comprises a first electrode 111, a first semiconductor layer 112 and a second semiconductor layer 113 which are sequentially stacked, and in the first semiconductor layer 112 and the second semiconductor layer 113: one is an N-type doped semiconductor and the other is a P-type doped semiconductor. The light-emitting diode 110 further comprises a second electrode 114, and the second electrode 114 comprises a first conductor portion 1141 which connects the second semiconductor layer 113 and the columnar portion 120. The light-emitting diode 110 can be peeled off from the columnar portion 120, that is, the second electrode 114 can be peeled off from the columnar portion 120.

[0056] The orthogonal projection of the first electrode 111 on the end face of the first end of the columnar portion 120 is located in the central region of the orthogonal projection of the first conductor portion 1141 on the end face of the first end of the columnar portion 120, that is, the edge region of the first conductor portion 1141 surrounds the first electrode 111, as shown in Figure 4 For example, the first electrode 111 and the first conductor portion 1141 are both cylinders, and the outer diameter of the first conductor portion 1141 is greater than the outer diameter of the first electrode 111.

[0057] Referring to Figure 5 As shown in the figure, the display panel comprises a driving substrate 300, and the driving substrate 300 comprises a substrate substrate 310, a driving circuit layer and a binding end 320 which are sequentially formed on the substrate substrate 310. The binding end 320 comprises a first connecting electrode 321 and a second connecting electrode 322 which are arranged at intervals, as shown in Figure 5 The first connecting electrode 321 is connected with the first electrode 111, and the second connecting electrode 322 is connected with the edge region of the first conductor portion 1141.

[0058] The edge region of the first conductor portion 1141 surrounds the first electrode 111. When the light emitting diode 110 is bonded to the driving substrate 300, the second connecting electrode 322 and the first conductor portion 1141 can be bonded only by aligning the first electrode 111 with the first connecting electrode 321, without worrying about the circumferential misalignment of the second connecting electrode 322 and the first conductor portion 1141.

[0059] It should be noted that the light emitting diode 110 can further include a light emitting layer 115 and a first insulating layer 116. The light emitting layer 115 is formed between the first semiconductor layer 112 and the second semiconductor layer 113. The first insulating layer 116 is arranged to surround at least the first electrode 111, the first semiconductor layer 112 and the light emitting layer 115, so that the first electrode 111, the first semiconductor layer 112 and the light emitting layer 115 are all insulated from the second electrode 114.

[0060] In some embodiments, the second connecting electrode 322 can be arranged to surround the first connecting electrode 321.

[0061] Since the distance between the first electrode 111 and the substrate substrate 310 is relatively closer, and the distance between the first conductor portion 1141 and the substrate substrate 310 is relatively farther, the height of the second connecting electrode 322 needs to be greater than the height of the first connecting electrode 321, so as to facilitate the bonding between the second connecting electrode 322 and the first conductor portion 1141. The second connecting electrode 322 is arranged to surround the first connecting electrode 321, and the second connecting electrode 322 can serve as a positioning structure to align the first electrode 111 with the first connecting electrode 321.

[0062] In some embodiments, the second electrode 114 further includes a second conductor portion 1142 and a conductive connecting portion 1143. The second conductor portion 1142 is arranged to surround the first electrode 111, and the conductive connecting portion 1143 connects the first conductor portion 1141 and the second conductor portion 1142, as shown in Figure 6 It should be noted that the outer surface of the second electrode 114 can further form a second insulating layer 117 to protect the light emitting diode 110.

[0063] The second conductor portion 1142 is arranged to surround the first electrode 111, and the conductive connecting portion 1143 connects the first conductor portion 1141 and the second conductor portion 1142. In this way, the height of the first connecting electrode 321 can be equal to the height of the second connecting electrode 322, thereby reducing the manufacturing cost of the driving substrate 300.

[0064] In some embodiments, the manufacturing material of the column portion 120 includes a photodegradable adhesive, which is an adhesive that can be debonded under light conditions.

[0065] The pillar portion 120 is made of a light-degradable glue. After the light-emitting diode 110 is transferred to the driving substrate 300 and is bonded with the bonding end 320, the pillar portion 120 and the light-emitting diode 110 can be separated by light irradiation.

[0066] It should be noted that the pillar portion 120 can be made of a light-degradable glue, but is not limited thereto. The pillar portion 120 can also be made of other organic or inorganic materials, and then the pillar portion 120 and the light-emitting diode 110 are bonded by a light-degradable glue. The specific material can be determined according to the actual situation.

[0067] In other embodiments, the pillar portion 120 can also be made of a light-degradable material. The light-degradable material can gradually decompose under light irradiation, so as to separate the pillar portion 120 and the light-emitting diode 110. The pillar portion 120 can also be made of an adhesive with reduced adhesion after heating or a material that gradually decomposes after heating. In addition, the pillar portion 120 can also be made of an organic or inorganic material with etching selectivity with the material of the light-emitting diode 110. After the light-emitting diode 110 is transferred to the driving substrate 300 and is bonded with the bonding end 320, part or all of the pillar portion 120 is etched and removed, so as to separate the pillar portion 120 and the light-emitting diode 110.

[0068] Embodiment Two

[0069] Referring to FIG. 1, Figure 7 to Figure 11 As shown in FIG. 1, the manufacturing method of the display panel includes steps S100-S500.

[0070] S100: providing a plurality of light-emitting devices 100, the plurality of light-emitting devices 100 including a first light-emitting device 100a, a second light-emitting device 100b, and a third light-emitting device 100c, the light-emitting colors of the first light-emitting device 100a, the second light-emitting device 100b, and the third light-emitting device 100c being different, and the cross-sectional dimensions of the pillar portions 120 being different.

[0071] In this embodiment, the light-emitting device 100 can be the light-emitting device 100 disclosed in Embodiment One. The light-emitting colors of the first light-emitting device 100a, the second light-emitting device 100b, and the third light-emitting device 100c are different. For example, the light-emitting diode 110 of the first light-emitting device 100a emits red light, the light-emitting diode 110 of the second light-emitting device 100b emits green light, and the light-emitting diode 110 of the third light-emitting device 100c emits blue light. The cross-sectional dimensions of the pillar portions 120 of the first light-emitting device 100a, the second light-emitting device 100b, and the third light-emitting device 100c are different. For example, the cross-sectional dimension of the pillar portion 120 of the second light-emitting device 100b is the smallest, and the cross-sectional dimension of the pillar portion 120 of the third light-emitting device 100c is the largest.

[0072] The sizes of the light emitting diodes 110 of different light emitting colors can be different, for example, the size of the blue light emitting diode 110 is the largest, and the size of the green light emitting diode 110 is the smallest, but not limited to this, the red light emitting diode 110, the green light emitting diode 110 and the blue light emitting diode 110 can also be made into the same size, which can be determined according to the situation.

[0073] S200: A transfer substrate 200 is provided, the transfer substrate 200 includes a plurality of openings, the plurality of openings includes a first opening 210a, a second opening 210b and a third opening 210c, the size of the first opening 210a matches the cross-sectional size of the columnar portion 120 of the first light emitting device 100a, the size of the second opening 210b matches the cross-sectional size of the columnar portion 120 of the second light emitting device 100b, and the size of the third opening 210c matches the cross-sectional size of the columnar portion 120 of the third light emitting device 100c.

[0074] That is, the opening size of the transfer substrate 200 is equal to or slightly larger than the cross-sectional size of the columnar portion 120. The first light emitting device 100a can be inserted into the first opening 210a and hung on the transfer substrate 200 by the support portion 130 of the first light emitting device 100a, the columnar portion 120 of the first light emitting device 100a cannot be inserted into the second opening 210b, and the support portion 130 of the first light emitting device 100a can pass through the third opening 210c. Accordingly, the second light emitting device 100b can be inserted into the second opening 210b and hung on the transfer substrate 200 by the support portion 130 of the second light emitting device 100b, the support portion 130 of the second light emitting device 100b can pass through the first opening 210a and the third opening 210c; the third light emitting device 100c can be inserted into the third opening 210c and hung on the transfer substrate 200 by the support portion 130 of the third light emitting device 100c, and the columnar portion 120 of the third light emitting device 100c cannot be inserted into the first opening 210a and the second opening 210b.

[0075] S300: The plurality of light emitting devices 100 are transferred to the transfer substrate 200, so that the columnar portion 120 of the light emitting device 100 is inserted into the corresponding opening and hung on the transfer substrate 200 by the support portion 130.

[0076] S400: The light emitting device 100 is transferred to the driving substrate 300 by the transfer substrate 200, and the light emitting diode 110 is bound with the binding end 320 of the driving substrate 300.

[0077] S500: The light emitting diode 110 is peeled off from the columnar portion 120.

[0078] The different sizes of the light emitting devices 100 and the different sizes of the openings on the transfer substrate 200 correspond to each other, so that the different sizes of the light emitting devices 100 can be transferred at the same time, i.e., the light emitting diodes 110 of different light emitting colors can be transferred at the same time, thereby improving the production efficiency of the display panel. In addition, in the transfer process, the light emitting devices 100 that are not successfully dropped into the corresponding openings of the transfer substrate 200 or fall through the openings can be recycled for reuse, avoiding chip waste and significantly reducing production costs.

[0079] In some embodiments, the transfer substrate 200 is inclined in step S300, so that the light emitting devices 100 can roll or slide on the transfer substrate 200.

[0080] The light emitting devices 100 can roll or slide on the transfer substrate 200, which can avoid the accumulation of light emitting devices 100 that do not fall into the openings on the transfer substrate 200.

[0081] In some embodiments, the transfer substrate 200 is vibrated during the process of transferring the plurality of light emitting devices 100 onto the transfer substrate 200, so that the columnar portions 120 of the light emitting devices 100 are inserted into the corresponding openings.

[0082] Vibrating the transfer substrate 200 can make the columnar portions 120 most accurate with the corresponding openings and inserted into the openings, thereby improving the transfer speed of the light emitting diodes 110.

[0083] It should be noted that in step S300, the transfer substrate 200 can be inclined and vibrated. In this design, the inclination angle of the transfer substrate 200 is reduced, which can avoid the speed of the light emitting devices 100 rolling or sliding on the transfer substrate 200 being too fast, thereby affecting the speed of the light emitting devices 100 being inserted into the corresponding openings.

[0084] In some embodiments, the material of the columnar portions 120 is photodegradable glue, or the columnar portions 120 and the light emitting diodes 110 are connected by photodegradable glue. The method of peeling the light emitting diodes 110 from the columnar portions 120 includes debonding the columnar portions 120 and the light emitting diodes 110 by light.

[0085] The photodegradable glue is an adhesive that can be debonded under light conditions. After the light emitting diodes 110 are transferred onto the driving substrate 300 and bonded with the bonding ends 320, the columnar portions 120 and the light emitting diodes 110 are debonded by light, so that the columnar portions 120 and the light emitting diodes 110 can be peeled.

[0086] It should be noted that the columnar portion 120 and the light emitting diode 110 can be connected or peeled off by photolysis glue, but are not limited thereto, and the material of the columnar portion 120 can also be an adhesive with reduced adhesion after being heated or a material that gradually decomposes after being heated. In addition, the material of the columnar portion 120 can also be an organic material or an inorganic material that has etching selectivity with the material of the light emitting diode 110, and after the light emitting diode 110 is transferred to the driving substrate 300 and bonded with the bonding end 320, the columnar portion 120 is partially or entirely etched and removed, thereby achieving the peeling of the columnar portion 120 and the light emitting diode 110.

[0087] Embodiment Three

[0088] The present application also provides a display panel, which is manufactured by the manufacturing method of the display panel disclosed in Embodiment Two. Referring to FIG. 1, Figure 12 As shown in FIG. 1, the display panel includes a driving substrate 300 and a light emitting diode 110 bonded on the driving substrate 300. The driving substrate 300 includes a substrate 310, a driving circuit layer, and a bonding end 320, and the pixel driving circuit in the driving circuit layer can drive the light emitting diode 110 to emit light, thereby realizing picture display.

[0089] In the present embodiment, since the light emitting devices 100 of different sizes and the openings of different sizes on the transfer substrate 200 are one-to-one corresponding, the light emitting devices 100 of different sizes can be simultaneously transferred, that is, the light emitting diodes 110 of different light emitting colors can be simultaneously transferred, thereby improving the production efficiency of the display panel. In addition, in the transfer process, the light emitting devices 100 that are not successfully dropped into the corresponding openings of the transfer substrate 200 or fall through the openings can be recycled for reuse, thereby avoiding chip waste and significantly reducing production cost.

[0090] The terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second", etc. can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified and limited.

[0091] In the present application, unless otherwise explicitly specified and limited, the terms "assembly", "connection", etc. should be understood in a broad sense, for example, can be fixed connection, can also be detachable connection, or integrated; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0092] In the description of the specification, the description of the terms "some embodiments", "exemplarily" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiments or examples are contained in at least one embodiment or example of the present application. In the specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the specification and the features of the different embodiments or examples without contradiction.

[0093] Although the embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and cannot be construed as limiting the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application. Any changes or modifications made in accordance with the claims and specification of the present application shall be within the scope of the present application.

Claims

1. A method for manufacturing a display panel, characterized in that, The application comprises: providing a plurality of light emitting devices, the light emitting device comprising a light emitting diode, a columnar portion and a support portion, the columnar portion comprising a first end and a second end, the light emitting diode being disposed on the end face of the first end of the columnar portion, the orthographic projection of the light emitting diode on the end face of the first end of the columnar portion being within the end face of the first end of the columnar portion, or the orthographic projection of the light emitting diode on the end face of the first end of the columnar portion coinciding with the end face of the first end of the columnar portion, the support portion being disposed on the end face of the second end of the columnar portion, at least part of the orthographic projection of the support portion on the end face of the second end of the columnar portion being outside the end face of the second end of the columnar portion, the plurality of light emitting devices comprising a first light emitting device, a second light emitting device and a third light emitting device, the light emitting colors of the first light emitting device, the second light emitting device and the third light emitting device and the cross-sectional dimension of the columnar portion being different; providing a transfer substrate, the transfer substrate comprising a plurality of openings, the plurality of openings comprising a first opening, a second opening and a third opening, the size of the first opening matching the cross-sectional dimension of the columnar portion of the first light emitting device, the size of the second opening matching the cross-sectional dimension of the columnar portion of the second light emitting device, the size of the third opening matching the cross-sectional dimension of the columnar portion of the third light emitting device; transferring the plurality of light emitting devices onto the transfer substrate, inserting the columnar portion of the light emitting device into the corresponding opening and suspending the light emitting device on the transfer substrate by the support portion; transferring the light emitting device onto a driving substrate through the transfer substrate, binding the light emitting diode with the binding end of the driving substrate; peeling the light emitting diode from the columnar portion.

2. The method of manufacturing a display panel according to claim 1, wherein inclining the transfer substrate to enable the light emitting device to roll or slide on the transfer substrate.

3. The manufacturing method of a display panel according to claim 1 or 2, wherein, vibrating the transfer substrate during the transferring of the plurality of light emitting devices onto the transfer substrate, inserting the columnar portion of the light emitting device into the corresponding opening.

4. The manufacturing method of a display panel according to claim 1, wherein the material of the columnar portion comprises a photodegradable adhesive or the columnar portion and the light emitting diode are connected by a photodegradable adhesive.

5. The manufacturing method of a display panel according to claim 4, wherein the method of peeling the light emitting diode from the columnar portion comprises debonding the columnar portion and the light emitting diode by light.

6. The method of manufacturing a display panel according to claim 1, wherein the columnar portion comprises a cylinder, an elliptic cylinder or a prism.

7. The method of manufacturing a display panel according to claim 1, wherein the light emitting diode comprises a first electrode, a first semiconductor layer and a second semiconductor layer stacked in sequence, the light emitting diode further comprises a second electrode, the second electrode comprises a first conductor portion, the first conductor portion connecting the second semiconductor layer and the columnar portion, the orthographic projection of the first electrode on the end face of the first end of the columnar portion is in the center region of the orthographic projection of the first conductor portion on the end face of the first end of the columnar portion.

8. The manufacturing method of a display panel according to claim 7, wherein, The second electrode further comprises a second conductor portion and a conductive connecting portion, the second conductor portion is arranged around the first electrode, the conductive connecting portion connects the first conductor portion and the second conductor portion, the light emitting diode further comprises a first insulating layer and a light emitting layer, the light emitting layer is formed between the first semiconductor layer and the second semiconductor layer, the first insulating layer is arranged around at least the first electrode, the first semiconductor layer and the light emitting layer, so that the first electrode, the first semiconductor layer and the light emitting layer are all insulated from the second electrode.

9. A display panel, characterized by, The display panel is manufactured by the manufacturing method of the display panel according to any one of claims 1-8.

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