Display panel, display device, and tiled display device

Abstract

The embodiment of the present disclosure provides a display panel, a display device and a spliced display device. The display panel comprises: a substrate; a control line board located on the second surface side of the substrate; a buffer structure comprising a first buffer part in contact with the second selected side surface, the first buffer part being located on the side of the second selected side surface facing the first selected side surface; a connecting lead extending from the first surface, passing through the first selected side surface, and extending through the buffer structure surface on the second surface facing the second electrode, and being connected with the second electrode; the second surface of the substrate is provided with at least a first groove, the first groove comprises a first groove section and a second groove section which are in communication with each other, the first groove section is located outside the control line board and the buffer structure; at least a part of the second groove section is located between the control line board and the second surface, and / or at least a part of the second groove section is located between the first buffer part and the second surface. The present disclosure is beneficial for effectively removing bubbles and avoiding the breakage of the connecting lead.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display panel, display device, and splicing display device. Background Technology

[0002] Mini LED (Mini Light Emitting Diode) and Micro LED (Micro Light Emitting Diode) have extremely high application prospects in the display field due to their unique design characteristics. Compared with traditional LEDs, Mini LED and Micro LED display panels have advantages such as low power consumption, high brightness, high resolution, color saturation, fast response, long lifespan, and high efficiency, which can greatly meet people's demand for excellent picture quality in display panels.

[0003] For Mini LED and Micro LED display products, large-size display panels are usually made up of multiple small-size display panels spliced ​​together. How to reduce the frame width of the display panel and achieve seamless display when splicing large-size display panels has become the development direction of the product. Summary of the Invention

[0004] This disclosure provides a display panel, a display device, and a splicing display device to solve or alleviate one or more technical problems in the prior art.

[0005] As a first aspect of the present disclosure, the present disclosure provides a display panel, including:

[0006] The substrate includes a first surface and a second surface disposed opposite to each other, and at least one first selected side surface connecting the first surface and the second surface;

[0007] A control circuit board is disposed on the second surface of a substrate. The control circuit board includes a third surface and a fourth surface disposed opposite to each other, and at least one second selected side surface connecting the third surface and the fourth surface. The third surface is close to the second surface relative to the fourth surface. The second selected side surface corresponds to the first selected side surface. The control circuit board also includes a second electrode disposed on the fourth surface.

[0008] A buffer structure is disposed on one side of the second surface of the substrate. The buffer structure includes at least a first buffer portion, which contacts the second selected side surface and is located on the side of the second selected side surface facing the first selected side surface.

[0009] The connecting lead extends from one side of the first surface of the substrate, through the first selected side surface, and through the buffer structure surface on one side of the second surface of the substrate toward the second electrode, and connects to the second electrode.

[0010] The second surface of the substrate is provided with a trench structure, which includes at least a first trench. The first trench includes a first trench segment and a second trench segment that are interconnected. The first trench segment is located outside the orthographic projection of the control circuit board and the buffer structure on the second surface.

[0011] At least a portion of the second slot is located between the control circuit board and the second surface, and / or at least a portion of the second slot is located between the first buffer portion and the second surface.

[0012] In some embodiments, a portion of the second slot is located between the control circuit board and the second surface, and a portion is located between the first buffer portion and the second surface.

[0013] In some embodiments, the orthographic projection of the first buffer portion on the second surface has a first projection boundary, the first projection boundary being located between the first common edge and the second projection boundary, the second projection boundary being the orthographic projection of the second common edge on the second surface, and the second common edge being the intersection edge of the third surface and the second selected side surface.

[0014] The first slot segment is located between the first common edge line and the first projected boundary.

[0015] In some embodiments, there is a first preset distance between the first common edge and the first projected boundary, the size of the first groove segment in the first direction is less than or equal to the first preset distance, and the first direction is perpendicular to the extension direction of the first common edge.

[0016] In some embodiments, the distance between the end of the first groove segment closest to the first common edge and the first common edge ranges from 600 μm to 800 μm.

[0017] In some embodiments, the first groove extends from one end of the first groove segment near the first common edge along a third direction, and extends at least to the inside of the first projected boundary, the third direction intersecting the extension direction of the first common edge.

[0018] In the first direction, the distance between the end of the first groove near the first common edge and the second projected boundary is in the range of 450μm to 600μm, and the first direction is perpendicular to the extension direction of the first common edge.

[0019] In some embodiments, the third direction is perpendicular to the extension direction of the first common edge.

[0020] In some embodiments, the trench structure includes a plurality of first trenches, which are spaced apart along the extension direction of the first projected boundary.

[0021] In some embodiments, the distance between two adjacent first slot segments is greater than the width of the connecting lead.

[0022] In some embodiments, the number of connecting leads is multiple, and the connecting leads include a third segment lead located on one side of the second surface of the substrate, and the multiple third segment leads are arranged at intervals along the extension direction of the first common edge line.

[0023] The first slot segment satisfies at least one of the following:

[0024] The width of the first slot is less than the distance between the two adjacent third lead wires;

[0025] The width of the first slot is less than the width of the third lead wire;

[0026] The first slot is located between two adjacent third-segment lead wires.

[0027] In some embodiments, the width of the first trench is less than 300 μm.

[0028] In some embodiments, the orthographic projection of the first buffer portion on the second surface has a first projection boundary, the first projection boundary being located between the first common edge and the second projection boundary, the second projection boundary being the orthographic projection of the second common edge on the second surface, and the second common edge being the intersection edge of the third surface and the second selected side surface.

[0029] The angle between the surface of the first buffer section and the second surface is less than or equal to the first preset angle θ, the thickness of the control circuit board is T, the distance d4 between the first projection boundary and the second projection boundary is greater than or equal to T / tanθ, and the first preset angle θ is less than or equal to 20°.

[0030] In some embodiments, the surface of the first buffer portion is an inclined plane; or, the surface of the first buffer portion is a curved surface that convexes toward the direction away from the second surface.

[0031] In some embodiments, the buffer structure further includes a second buffer portion connected to the first buffer portion, the second buffer portion being located on a fourth surface, and the surface of the second buffer portion being smoothly connected to the surface of the first buffer portion.

[0032] In some embodiments, the distance between the second projected boundary and the first common edge is greater than or equal to 1200 μm.

[0033] As a second aspect of the present disclosure, the present disclosure provides a display device, including a display panel as described in any embodiment of the present disclosure, wherein a substrate in the display panel is provided with a first electrode on a first surface, and a connecting lead is connected to the first electrode.

[0034] As a third aspect of the present disclosure, the present disclosure provides a splicing display device, including a plurality of display devices as described in the present disclosure.

[0035] The technical solution of this disclosure embodiment provides a trench structure on the second surface of a substrate. The trench structure includes at least a first trench, which includes a first segment and a second segment that are interconnected. The first segment is located outside the orthographic projection of the control circuit board and the buffer structure on the second surface. At least a portion of the second segment is located between the control circuit board and the second surface, and / or at least a portion of the second segment is located between the first buffer portion and the second surface. This allows the first trench to form a bubble discharge channel, thereby allowing bubbles in the second control circuit board and bubbles during the curing process of the buffer structure to be discharged through the first trench, preventing bubbles from causing breakage of the connecting leads and improving product yield.

[0036] The above overview is for illustrative purposes only and is not intended to be limiting in any way. Further aspects, embodiments, and features of this disclosure will become readily apparent from the accompanying drawings and the following detailed description, in addition to the illustrative aspects, embodiments, and features described above. Attached Figure Description

[0037] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments according to this disclosure and should not be construed as limiting the scope of this disclosure.

[0038] Figure 1 This is a schematic diagram of a cross-sectional structure of a display panel in related technologies;

[0039] Figure 2A This is a cross-sectional schematic diagram showing dispersed bubbles in a display panel according to one embodiment;

[0040] Figure 2B A planar schematic diagram of a product containing dispersed air bubbles in an actual product;

[0041] Figure 3A This is a cross-sectional schematic diagram showing compacted bubbles in a display panel according to one embodiment;

[0042] Figure 3B This is a schematic diagram illustrating how a bubble bursting in an actual product can cause the connecting lead to breakage.

[0043] Figure 4A This is a plan view of the display panel according to one embodiment of the present disclosure;

[0044] Figure 4B This is a plan view of the display panel in another embodiment of the present disclosure;

[0045] Figure 5 for Figure 4A A schematic diagram of the CC section in one embodiment;

[0046] Figure 6 This is a schematic diagram of the bulge detection results of a substrate in an actual product;

[0047] Figure 7 This is a plan view of the second surface side of the display panel in another embodiment;

[0048] Figure 8 This is a partial cross-sectional schematic diagram of the display panel in one embodiment of the present disclosure;

[0049] Figure 9 This is a schematic diagram showing the positional relationship between the first projected boundary BX1 of the first buffer section and the control circuit board.

[0050] Figure 10A , Figure 10B , Figure 10C This is a schematic diagram of three different included angles between the surface of the first buffer section and the second surface;

[0051] Figure 11 This is a cross-sectional schematic diagram of the display panel in another embodiment of the present disclosure;

[0052] Figure 12 This is a schematic diagram of a splicing display device according to an embodiment of the present disclosure.

[0053] Explanation of reference numerals in the attached figures:

[0054] 1. Substrate; 2. Control circuit board; 3. Buffer structure; 31. First buffer section; 32. Second buffer section; 4. Connecting lead; 41. First lead segment; 42. Second lead segment; 43. Third lead segment; 51. First trench; 511. First trench segment; 512. Second trench segment;

[0055] BX1, first projection boundary; BX2, first common edge; BX3, second projection boundary. Detailed Implementation

[0056] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this disclosure, and different embodiments can be combined arbitrarily without conflict. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0057] To achieve a smaller spacing between adjacent light-emitting elements on the display panel and thus a higher pixel resolution, related technologies involve placing light-emitting elements on the first surface 1a of the substrate 1 of the display panel, attaching a control circuit board 2 to the second surface 1b of the substrate 1, and connecting the control circuit board 2 on the second surface 1b to the circuitry on the first surface 1a via connecting leads 4. The second surface 1b of the substrate 1 is positioned opposite to the first surface 1a.

[0058] Figure 1 This is a schematic diagram of a cross-sectional structure of a display panel in related technologies, such as... Figure 1 As shown, the display panel includes a substrate 1, a control circuit board 2, and connecting leads 4. The substrate 1 includes a first surface 1a and a second surface 1b disposed opposite to each other, and a plurality of first side surfaces 1c connecting the first surface 1a and the second surface 1b. The first surface 1a is provided with a plurality of first electrodes 11. At least one of the plurality of first side surfaces 1c of the substrate 1 is a first selected side surface 1cc. The control circuit board 2 is disposed on the second surface 1b of the substrate 1. The control circuit board 2 includes a flexible printed circuit board (FPC). The control circuit board 2 includes a third surface 2a and a fourth surface 2b disposed opposite to each other, and a plurality of second side surfaces connecting the third surface 2a and the fourth surface 2b. The third surface 2a is close to the second surface 1b relative to the fourth surface 2b, and the third surface 2a is bonded to the second surface 1b of the substrate 1. At least one of the plurality of second side surfaces is a second selected side surface 2cc, and the second selected side surface 2cc corresponds to the first selected side surface 1cc. The control circuit board 2 also includes a plurality of second electrodes 21 disposed on the fourth surface 2b.

[0059] Multiple connecting leads 4 are correspondingly provided on the first selected side surface 1cc. These connecting leads 4 can be arranged side-by-side at intervals along the extension direction of the first selected side surface 1cc. Each connecting lead 4 extends from the first surface 1a side of the substrate 1, through the first selected side surface 1cc, to the second surface 1b side. That is, each connecting lead 4 includes a first lead 41 located on the first surface 1a side, a second lead 42 located on the first selected side surface 1cc side, and a third lead 43 located on the second surface 1b side. The first lead 41 is connected to the first electrode 11, and the third lead 43 extends from the first common edge line BX2 to the fourth surface 2b of the control circuit board 2 on the second surface 1b side of the substrate 1, and is connected to the second electrode 21.

[0060] The control circuit board 2 is attached to the second surface 1b via the third surface 2a, and the second electrode 21 is located on the fourth surface 2b of the control circuit board 2. There is a certain distance between the third surface 2a and the fourth surface 2b of the control circuit board 2, that is, the control circuit board 2 has a certain thickness. Therefore, when the control circuit board 2 is attached to the second surface 1b, there is a first discontinuity between the fourth surface 2b and the second surface 1b.

[0061] If the third segment 43 of the connecting lead 4 extends directly from the second surface 1b to the second electrode 21 on the fourth surface 2b, the third segment 43 is prone to breakage at the first breakage location due to the presence of the first discontinuity. To prevent the third segment 43 from breaking due to the first discontinuity, in related technologies, a buffer structure 3 is provided on the second surface 1b. The buffer structure 3 can extend from the first surface 1a to at least the second selected side surface 2cc of the control circuit board 2, thus compensating for the first discontinuity. Therefore, when forming the connecting lead 4, the third segment 43 of the connecting lead 4 extends from the first surface 1a, through the surface of the buffer structure 3, to the surface of the second electrode 21 on the fourth surface 2b and connects with the second electrode 21, reducing the risk of breakage of the third segment 43.

[0062] It is understood that the control circuit board 2 can be a flexible circuit board. To achieve the attachment of the flexible circuit board, it may include a body and an adhesive layer disposed on one side of the body, with the adhesive layer located on the side of the body facing the substrate 1. The surface of the adhesive layer facing away from the body is the third surface 2a of the control circuit board 2, and the surface of the body facing away from the adhesive layer is the fourth surface 2b of the control circuit board 2. During the fabrication of the flexible circuit board, air bubbles may exist between the body and the adhesive layer.

[0063] To achieve high-precision and rapid fabrication of the connecting lead 4, related technologies employ a printing process. This printing process can include at least one of screen printing, pad printing, transfer printing, and 3D printing. The fabrication process of the display panel can include the following steps:

[0064] S11: A substrate 1 is provided, and a plurality of first electrodes 11 are disposed on the first surface 1a of the substrate 1.

[0065] S12: A control circuit board 2 is attached to the second surface 1b of the substrate 1. A second electrode 21 is provided on the fourth surface 2b of the control circuit board 2, which is opposite to the substrate 1. The control circuit board 2 is attached to the second surface 1b of the substrate 1. During the attachment process, air bubbles may exist between the adhesive layer in the control circuit board 2 and the second surface 1b of the substrate 1.

[0066] S13: The initial buffer structure 3 is formed by a printing process. The material of the initial buffer structure 3 may include ink. The initial buffer structure 3 is cured to form the buffer structure 3. Air bubbles are generated during the curing process of the initial buffer structure 3.

[0067] S14: Using a printing process, a conductive paste for connecting leads 4 is formed on the first surface 1a, the first selected side surface 1cc, the second surface 1b, the surface of the buffer structure 3, and the surface of the control circuit board 2 of the substrate 1. After the conductive paste is cured, connecting leads 4 are formed. Connecting leads 4 extend from the first surface 1a of the substrate 1, through the first selected side surface 1cc, the second surface 1b, and the surface of the buffer structure 3 to the fourth surface 2b of the control circuit board 2, and are connected to the second electrode 21.

[0068] As can be seen from the above process, air bubbles may exist in several steps before the formation of the connecting lead 4. In the subsequent processes after the formation of the connecting lead 4, when the product is in a high-temperature environment, the unexpelled air bubbles will expand and burst, causing the connecting lead 4 to break, resulting in poor connection and reduced product yield.

[0069] The above analysis shows that, in order to prevent the connecting lead 4 from breaking, how to effectively remove air bubbles before forming the connecting lead 4 is an urgent problem to be solved.

[0070] To effectively remove air bubbles, the inventors of this case discovered that when dispersed air bubbles are present, and the maximum size 'a' of the bubbles is less than or equal to the maximum width of the connecting lead 4, it usually does not cause the connecting lead 4 to break after product reliability testing. Figure 2A and Figure 2B As shown, Figure 2A This is a cross-sectional schematic diagram showing dispersed bubbles in a display panel according to one embodiment. Figure 2B This is a schematic diagram of a product with dispersed air bubbles. For dispersed air bubbles, whether the bubbles are entirely within the buffer structure 3 or partially within the buffer structure 3 and partially overlapping the control circuit board 2, it will not cause the connecting lead 4 to break after reliability testing. This is because dispersed air bubbles ensure that the dispersed air bubbles generated by attaching to the control circuit board 2 during the heating process can be evenly discharged, achieving sufficient venting, thereby preventing sudden overflow of air bubbles during reliability testing and causing the connecting lead 4 to break.

[0071] Another type of bubble is locally compacted bubbles, such as... Figure 3A As shown, in Figure 3A In this process, multiple smaller bubbles connect to each other, merging into larger bubbles and causing a bulge on the control circuit board 2. The location of the bulge is uncertain; it may occur between the control circuit board 2 and the second surface 1b, or between the body of the control circuit board 2 and the adhesive layer. When a bulge occurs, in the subsequent processing after the formation of the connecting lead 4, the product is exposed to a high-temperature environment, causing the bulged bubbles to escape and resulting in the breakage of the connecting lead 4. Figure 3B As shown, Figure 3B This is a schematic diagram illustrating how a bubble bursting in an actual product can cause the connecting wire to break.

[0072] Therefore, if air bubbles can be effectively expelled before the connecting lead 4 is formed, so that there are no large air bubbles or bulges inside the product, the breakage of the connecting lead 4 caused by air bubbles can be effectively prevented. To this end, one embodiment of this disclosure provides a display panel.

[0073] For ease of description, the direction perpendicular to the extension direction of the first common edge is defined as the first direction, the extension direction of the first common edge is defined as the second direction, and the direction intersecting with the extension direction of the first common edge is defined as the third direction. For example, the third direction may be parallel to the first direction.

[0074] Figure 4A This is a plan view of the display panel according to one embodiment of the present disclosure. Figure 4B This is a plan view of the display panel according to another embodiment of the present disclosure, wherein, Figure 4A and Figure 4B The diagram in the diagram can be Figure 1 The diagram shown is a schematic representation of the display panel from direction A. To clearly show the first groove, Figure 4B Only the boundary lines of the control circuit board and the buffer structure are shown. For example... Figure 1 and Figure 4A As shown, the display panel may include a substrate 1, a control circuit board 2, a buffer structure 3, and connecting leads 4. The control circuit board 2 is disposed on the second surface 1b of the substrate 1. A first electrode 11 is disposed on the first surface 1a of the substrate 1, and a second electrode 21 is disposed on the fourth surface 2b of the control circuit board 2.

[0075] A buffer structure 3 is disposed on one side of the second surface 1b of the substrate 1, and the buffer structure 3 includes at least a first buffer portion 31. The first buffer portion 31 contacts the second selected side surface 2cc and is located on the side of the second selected side surface 2cc facing the first selected side surface 1cc. A connecting lead 4 extends from the first surface 1a of the substrate 1, through the first selected side surface 1cc, and on the second surface 1b of the substrate 1, through the surface of the buffer structure 3 toward the second electrode 21, and connects to the second electrode 21.

[0076] The second surface 1b of the substrate 1 is provided with a trench structure, which includes at least a first trench 51. The first trench 51 can be formed by removing material from the second surface 1b. The first trench 51 includes a first trench segment 511 and a second trench segment 512 that are interconnected. The first trench segment 511 is located outside the orthogonal projection of the control circuit board 2 and the buffer structure 3 on the second surface 1b. That is, the first trench segment 511 is located outside the orthogonal projection of the control circuit board 2 and the buffer structure 3 on the second surface 1b, so that the first trench segment 511 is not covered by the control circuit board 2 and the buffer structure 3.

[0077] In one embodiment, at least a portion of the second groove segment 512 is located between the control circuit board 2 and the second surface 1b, allowing the first trench 51 to form a bubble discharge channel for the control circuit board 2. Thus, during the process of attaching the control circuit board 2 to the second surface 1b of the substrate 1, bubbles between the control circuit board 2 and the second surface 1b can be discharged through the second groove segment 512 and the first groove segment 511 of the first trench 51, preventing bulges or large bubbles from forming between the control circuit board 2 and the second surface 1b. Furthermore, in subsequent processes, the high-temperature environment can further allow any remaining bubbles between the control circuit board 2 and the second surface 1b to be effectively discharged through the interconnected second groove segment 512 and the first groove segment 511, preventing bulges from forming between the control circuit board 2 and the second surface 1b and preventing bubbles from causing the connecting leads 4 to break.

[0078] In one embodiment, at least a portion of the second groove segment 512 is located between the first buffer portion 31 and the second surface 1b, such that the first groove 51 can form a bubble discharge channel for the buffer structure 3. Thus, after the initial buffer structure is formed, bubbles generated during the curing process of the initial buffer structure can be effectively discharged through the interconnected second groove segment 512 and first groove segment 511, preventing bubbles from causing the connecting lead 4 to break.

[0079] In one embodiment, a portion of the second groove segment 512 is located between the control circuit board 2 and the second surface 1b, and a portion is located between the first buffer portion 31 and the second surface 1b, such that the first groove 51 simultaneously forms a bubble discharge channel for both the control circuit board 2 and the buffer structure 3. Therefore, bubbles between the control circuit board 2 and the second surface 1b, as well as bubbles generated during the initial buffer structure curing process, can be effectively discharged through the interconnected second groove segment 512 and first groove segment 511, preventing bubbles from causing the connecting lead 4 to break.

[0080] like Figure 4B As shown, a portion of the second slot segment 512 is located between the control circuit board 2 and the second surface 1b, and a portion is located between the first buffer portion 31 and the second surface 1b. That is, the second slot segment 512 is not located outside the control circuit board 2 and the first buffer portion 31.

[0081] By setting the second groove segment 512, the roughness of the second surface 1b can also be increased. When the second groove segment 512 is located between the control circuit board 2 and the second surface 1b, the bonding strength between the control circuit board 2 and the second surface 1b can be increased. When the second groove segment 512 is located between the first buffer part 31 and the second surface 1b, the adhesion of the first buffer part 31 on the second surface 1b can be increased, and the first buffer part 31 can be prevented from falling off.

[0082] The first slot segment 511 is not covered by the control circuit board 2 and the buffer structure 3. The specific position of the first slot segment 511 can be set as needed, as long as the first slot segment 511 is outside the orthogonal projection of the control circuit board 2 and the buffer structure 3 on the second surface 1b. For example, the first slot segment 511 can be located at... Figure 4B The position shown in the diagram is B1, or the first slot segment 511 may be located at... Figure 4B The position B2 is shown in the image.

[0083] In one embodiment, as shown in FIG4, the orthographic projection of the first buffer portion 31 on the second surface 1b has a first projection boundary BX1, which is located between the first common edge line BX2 and the second projection boundary BX3. The first common edge line BX2 is the intersection line of the second surface 1b and the first selected side surface 1cc, and the second projection boundary BX3 is the orthographic projection of the second common edge line on the second surface 1b. The second common edge line is the intersection line of the third surface 2a and the second selected side surface 2cc. The first groove segment 511 is located between the first common edge line BX2 and the first projection boundary BX1.

[0084] Typically, before forming the initial buffer structure, the second surface 1b between the second projected boundary BX3 and the first common edge BX2 needs to be laser cleaned. By setting the first groove segment 511 between the first common edge BX2 and the first projected boundary BX1, the first groove segment 511 can be formed simultaneously with laser cleaning, thereby improving cleaning efficiency.

[0085] In one embodiment, the extending direction of the first groove 51 may be parallel to the extending direction of the first projected boundary BX1, such as... Figure 4B The first groove shown in B1; or, the extension direction of the first groove 51 may intersect with the extension direction of the first projected boundary BX1, such as... Figure 4B The first trench is shown in B2.

[0086] When the first groove segment 511 is disposed between the first common edge line BX2 and the first projected boundary BX1, since at least a portion of the first groove 51 is located between the first buffer portion 31 and the second surface 1b, and the second groove segment 512 is connected to the first groove segment 511, the extension direction of the first groove 51 is not parallel to the first projected boundary BX1. That is, the extension direction of the first groove 51 intersects with the first projected boundary BX1, while the first projected boundary BX1 is parallel to the first common edge line BX2. Therefore, the extension direction of the first groove 51 intersects with the first common edge line BX2, and one end of the first groove segment 511 is closer to the first common edge line BX2 than the other end.

[0087] In one embodiment, the first groove 51 may extend in a third direction from one end of the first groove segment 511 near the first common edge BX2, and extend at least to the inner side of the first projection boundary BX1. The inner side of the first projection boundary BX1 is the side of the first projection boundary BX1 that faces away from the first common edge BX2. Figure 4A and Figure 4B In this design, the inner side of the first projection boundary BX1 is the lower side of the first projection boundary BX1. The third direction intersects the extension direction of the first common edge line BX2. For example, the third direction can be perpendicular to the extension direction of the first common edge line BX2. The portion of the first groove 51 located inside the first projection boundary BX1 is the second groove segment 512, and the portion of the first projection boundary BX1 located on the side facing the first common edge line BX2 is the first groove segment 511. Thus, the first groove 51, the first groove segment 511, and the second groove segment 512 are all located between the second projection boundary BX3 and the first common edge line BX2. When laser cleaning is performed on the second surface 1b between the second projection boundary BX3 and the first common edge line BX2, the first groove 51 can be formed simultaneously, further improving cleaning efficiency.

[0088] The first groove 51 can also extend along a third direction from one end of the first groove segment 511 near the first common edge BX2, and extend at least to the second projected boundary BX3. With this arrangement, the second groove segment 512 is not only located between the first buffer portion 31 and the second surface 1b, but also connected to the third surface 2a of the control circuit board 2. Thus, when attaching the control circuit board 2, air bubbles generated during the attachment process can be discharged through the first groove 51, and air bubbles generated during the initial buffer structure curing process can also be discharged through the first groove 51.

[0089] For example, the first groove 51 may extend along a third direction to the inner side of the second projected boundary BX3, in Figure 4A and Figure 4B In this design, the inner side of the second projection boundary BX3 is the lower side of the second projection boundary BX3. Therefore, a portion of the second groove segment 512 is located between the first buffer portion 31 and the second surface 1b, and another portion is located between the control circuit board 2 and the second surface 1b, which is more conducive to the discharge of air bubbles generated during the attachment process of the control circuit board 2 through the first groove 51. Furthermore, under the high-temperature environment before the formation of the connecting lead 4, air bubbles between the control circuit board 2 and the second surface 1b, or between the body of the control circuit board 2 and the adhesive layer, can also be effectively discharged through the first groove 51, preventing the connecting lead 4 from breaking due to air bubbles.

[0090] In the first direction, the distance d3 between the end of the first groove 51 near the first common edge BX2 and the second projected boundary BX3 can be 450μm to 600μm. For example, d3 can be 450μm, 500μm, 550μm, or 600μm. This arrangement provides sufficient margin for the first buffer portion 31 of the buffer structure 3 to be formed on the second surface 1b, so that after the buffer structure 3 is formed, a portion of the first groove 51 can be left uncovered by the buffer structure 3 to form the first groove segment 511.

[0091] like Figure 4B As shown, there is a first preset distance d1 between the first common edge line BX2 and the first projected boundary BX1, and the dimension of the first slot segment 511 in the first direction is less than or equal to the first preset distance d1. It is understood that when the third segment lead 43 of the connecting lead 4 is formed on the second surface 1b, due to the presence of the first slot segment 511, there may be a situation where the third segment lead 43 is located above the first slot segment 511, posing a risk of the third segment lead 43 falling off due to being formed on an uneven surface. By setting the dimension of the first slot segment 511 in the first direction to be less than or equal to the first preset distance d1, a region without the first slot segment 511 can exist between the first common edge line BX2 and the first projected boundary BX1. Therefore, when the connecting lead 4 is formed on one side of the second surface 1b of the substrate 1, at least a portion of the third segment lead 43 can contact the second surface 1b, reducing the risk of the third segment lead 43 falling off.

[0092] In one embodiment, the distance d2 between the end of the first groove segment 511 closest to the first common edge BX2 and the first common edge BX2 ranges from 600 μm to 800 μm. This allows the third lead 43 to make sufficient contact with the second surface 1b, improving the adhesion of the third lead 43 to the second surface 1b and preventing the third lead 43 from falling off. Exemplarily, d2 can be 600 μm, 650 μm, 700 μm, 750 μm, or 800 μm.

[0093] The first groove 51 extends along a third direction. When the third direction is perpendicular to the extension direction of the first common edge line BX2, the third direction is parallel to the first direction X. Thus, the extension direction of the first groove 51 is perpendicular to the extension direction of the first common edge line BX2.

[0094] Figure 4A and Figure 4B The first groove 51 shown is in the shape of a straight line. In other embodiments, the first groove 51 can also be in the shape of a broken line or a curve, both of which can achieve the effect of venting air bubbles.

[0095] To further improve the bubble removal effect, the groove structure may include multiple first grooves 51, which are spaced apart along the extension direction of the first projected boundary BX1. It is understood that the buffer structure 3 is typically arranged along the extension direction of the second projected boundary BX3, thus having a certain length along the extension direction of the second projected boundary BX3. By setting multiple first grooves 51, and arranging them spaced apart along the extension direction of the first projected boundary BX1, bubbles generated by the buffer structure 3 can be uniformly discharged through the corresponding first grooves 51, avoiding the problem of bubbles failing to discharge.

[0096] Figure 5 for Figure 4A A schematic diagram of the CC section in one embodiment. Figure 5 The diagram illustrates three first slot segments 511, namely first slot segments 511a, 511b, and 511c, and two third segment leads 43, namely third segment leads 43a and 43b. Figure 4A and Figure 5 As shown, the distance d4 between two adjacent first slot segments 511 is greater than the width w2 of the connecting lead. Therefore, when a third lead 43 is provided between two adjacent first slot segments 511a and 511b, the orthographic projection of the first slot segment 511 on the second surface 1b and the orthographic projection of the third lead 43 on the second surface 1b do not overlap, allowing the third lead 43 to make full contact with the second surface 1b and further improving the adhesion of the third lead 43 to the second surface 1b.

[0097] For example, the orthographic projection of the third lead 43 on the second surface 1b of the substrate 1 does not overlap with the orthographic projection of the first slot segment 511 on the second surface 1b. For example, the first slot segment 511 may be located between two adjacent third leads 43, that is, the orthographic projection of the first slot segment 511 on the second surface 1b is located between the orthographic projections of two adjacent third leads 43 on the second surface 1b.

[0098] In one embodiment, there are multiple first electrodes 11, multiple second electrodes 21, and multiple connecting leads 4. Each first electrode 11 is connected to a second electrode 21 via a corresponding connecting lead 4. Specifically, a first lead 41 is connected to the first electrode 11, a third lead 43 is connected to the second electrode 21, and multiple third leads 43 are arranged at intervals along the extension direction of the first common edge line BX2.

[0099] Understandably, when forming the connecting lead 4 using a printing process, the conductive paste for the connecting lead 4 is first printed on one side of the second surface 1b. After the conductive paste cures, the connecting lead 4 is formed. During the curing process, the conductive paste may flow. To prevent short circuits caused by the flow of conductive paste between adjacent connecting leads 4, the width w1 of the first groove segment 511 can be smaller than the distance d5 between two adjacent third-segment leads 43. Therefore, when the first groove segment 511 is located between two adjacent third-segment leads 43, even if printing deviations occur, because the width w1 of the first groove segment 511 is smaller than the distance d5 between two adjacent third-segment leads 43, the conductive paste of two adjacent third-segment leads 43 will not both contact the same first groove segment 511, thus avoiding the problem of short circuits caused by the flow of conductive paste between adjacent third-segment leads 43.

[0100] In another embodiment, the width w1 of the first slot segment 511 can be set to be smaller than the width w2 of the third lead segment 43. Thus, when the first slot segment 511 is completely below the third lead segment 43, the third lead segment 43 can completely cover the first slot segment 511. This prevents the conductive paste of two adjacent third lead segments 43 from contacting the same first slot segment 511, thereby avoiding the problem of short circuits caused by the flow of conductive paste from two adjacent third lead segments 43.

[0101] like Figure 5 As shown, the depth h of the first trench 51 can be set as needed. For example, the depth h of the first trench 51 can be greater than the size of the large bubble. A first trench 51 of this depth can ensure that the first trench 51 effectively discharges the large bubble, preventing the large bubble from remaining in the control circuit board 2 or the buffer structure 3, thereby preventing the large bubble from bursting and causing the connecting lead 4 to break.

[0102] The width w2 of the first groove 51 can be less than or equal to 300 μm. Thus, when the third groove 511 is provided between two adjacent third leads 43a and 43b, the orthographic projection of the first groove 511 on the second surface 1b and the orthographic projection of the third lead 43 on the second surface 1b can be satisfied that do not overlap.

[0103] Figure 5 The bottom cross-sectional shape of the first groove 51 shown is an arc shape. It can be understood that the bottom cross-sectional shape of the first groove 51 is not limited to an arc shape. The bottom cross-sectional shape of the first groove 51 can also be a triangle, a broken line, or other shapes. The bottom cross-sectional shape of the first groove 51 is not limited here. The specific shape can be set as needed.

[0104] As described above, if bulging occurs during the attachment of the control circuit board 2, it increases the risk of breakage of the connecting lead 4. Regarding bulging, this disclosure provides a display panel fabrication process, referencing... Figure 4A or Figure 4B It may include the following steps:

[0105] S21: Before attaching the control circuit board 2, the first preset area of ​​the second surface 1b of the substrate 1 is laser cleaned to form a trench structure. The trench structure includes a first trench 51. The first trench 51 can extend along a third direction. The first trench 51 can extend from the preset second projection boundary BX3 toward the first common edge line BX2. The size of the first trench 51 in the first direction X can be 500μm.

[0106] S22: The control circuit board 2 is attached to the second preset area of ​​the second surface 1b of the substrate 1, and the orthographic projection of the second common edge of the control circuit board 2 on the second surface 1b coincides with the second projection boundary BX3.

[0107] S23: Perform bulge detection on the substrate 1 to which the control circuit board 2 is attached. A height sensor can be used for bulge detection. The detection diagram is shown below. Figure 6 As shown, Figure 6 This is a schematic diagram showing the bulge detection results of a substrate in an actual product. Figure 6 It can be seen that the control circuit board 2 of the substrate 1 has a bulge area, with the bulge size greater than 20μm. When the bulge size is less than or equal to 20μm, the product can be considered qualified, and subsequent processes can be directly performed on the second surface 1b: forming the buffer structure 3, preparing the connecting leads 4, etc. For products with a bulge size greater than 20μm, the product can be considered unqualified. Here, 20μm is used as the boundary for determining whether a product has a bulge. In other embodiments, other boundary sizes can be used. For example, the range of the bulge boundary size d0 can be 15μm to 25μm. When the bulge size is greater than d0, the product is unqualified; when the bulge size is less than or equal to d0, the product is qualified.

[0108] S24: For defective products, before forming the buffer structure 3, the product can be placed in a high-temperature environment to allow the bulges and bubbles in the control circuit board 2 to be fully and effectively discharged through the first groove 51, reducing the bulge size to below d0 or eliminating the bulges; then the buffer structure 3 and connecting leads 4 can be prepared. Thus, after reliability testing, the risk of connecting leads 4 breaking due to bubbles can be avoided.

[0109] Figure 7 This is a plan view of the second surface side of the display panel in another embodiment, as shown below. Figure 7As shown, the display panel may include a first control circuit board 2-1 and a second control circuit board 2-2. The substrate 1 includes two opposing first selected side surfaces 1cc. The second selected side surface 2cc of the first control circuit board 2-1 corresponds to the upper first selected side surface 1cc, and the second selected side surface 2cc of the second control circuit board 2-2 corresponds to the lower first selected side surface 1cc. The distance L1 between the second projection boundary BX3 and the corresponding first common edge BX2 can be greater than or equal to 1200 μm, thereby preserving sufficient width for the third lead 43 to directly contact the second surface 1b, increasing the adhesion of the second surface 1b to the third lead 43. For example, the distance L1 between the second projection boundary BX3 and the corresponding first common edge BX2 can be 1200 μm, and the width L2 of the laser cleaning can be 500 μm; therefore, the dimension of the first trench 51 in the first direction is 500 μm. The distance d6 between the first projection boundary BX1 and the second projection boundary BX3 is less than 500μm, therefore, the part of the first groove 51 located above the first projection boundary BX1 is the first groove segment 511.

[0110] Figure 8 This is a partial cross-sectional schematic diagram of the display panel in one embodiment of the present disclosure. Figure 8 The second surface 1b, control circuit board 2, second electrode 21, and buffer structure 3 are shown. Figure 8 As shown, the buffer structure 3 includes a first buffer section 31. The angle β between the surface of the first buffer section 31 and the second surface 1b can be less than or equal to a first preset angle θ. That is, the ramp angle β of the surface of the first buffer section 31 relative to the second surface 1b is less than or equal to the first preset angle θ. The thickness of the control circuit board 2 is T, which is the distance between the third surface 2a and the fourth surface 2b. The distance d6 between the first projection boundary BX1 and the second projection boundary BX3 is greater than or equal to T / tanθ. Therefore, the specific value of d6 is related to the first preset angle θ.

[0111] For example, the first preset angle θ can be less than or equal to 20°, so that d6 is greater than or equal to T / tan20°.

[0112] Experiments have shown that when the first preset angle θ is set to less than or equal to 20°, the third lead 43 slopes gently from the second surface 1b to the surface of the first buffer part 31, and then extends to the second electrode 21 and connects to the second electrode 21. Since the first preset angle θ is less than or equal to 20°, the discontinuity between the second surface 1b and the fourth surface 2b is greatly reduced, and a gentler surface is formed between the second surface 1b and the fourth surface 2b, which is conducive to forming a continuous third lead 43 and avoids the third lead 43 from breaking due to discontinuity.

[0113] Figure 9 This is a schematic diagram showing the positional relationship between the first projected boundary BX1 of the first buffer section and the control circuit board, as shown below. Figure 9 As shown, when forming the buffer structure 3, the distance between the first projection boundary BX1 of the first buffer section 31 and the second projection boundary BX3 of the control circuit board 2 has a significant impact on the ramp angle β of the first buffer section 31. When the first projection boundary BX1 is located at position C1, the ramp angle of the first buffer section 31 is β1; when the first projection boundary BX1 is located at position C2, the ramp angle of the first buffer section 31 is β2; when the first projection boundary BX1 is located at position C3, the ramp angle of the first buffer section 31 is β3, where β1 < β2 < β3. Therefore, how to set the position of the first projection boundary BX1 is very important for forming the ramp angle of the first buffer section 31. The farther the first projection boundary BX1 of the first buffer section 31 is from the second projection boundary BX3 of the control circuit board 2, the smaller the slope angle of the first buffer section 31, and the gentler the slope of the third lead 43, which can better prevent the third lead 43 from breaking due to discontinuity. The closer the first projection boundary BX1 of the first buffer section 31 is to the second projection boundary BX3 of the control circuit board 2, the larger the slope angle of the first buffer section 31, and the steeper the slope of the third lead 43, which is more likely to cause the third lead 43 to break due to discontinuity.

[0114] In this embodiment, the thickness of the control circuit board 2 is T, meaning the distance between the third surface 2a and the fourth surface 2b is T, and the distance d6 between the first projection boundary BX1 and the second projection boundary BX3 is greater than or equal to T / tanθ. Experiments have shown that this setting of the distance d6 between the first projection boundary BX1 and the second projection boundary BX3 ensures that the ramp angle of the final formed first buffer portion 31 surface is less than or equal to the first preset angle θ, preventing the third lead 43 from breaking due to an excessively large ramp angle.

[0115] Figure 10A , Figure 10B , Figure 10C This is a schematic cross-sectional view showing three different included angles between the surface of the first buffer section and the second surface. Figure 10A In the middle, the included angle β1 between the surface of the first buffer part 31 and the second surface 1b is approximately 26.2°, which is greater than the first preset angle θ. Experiments have proven that using... Figure 10A When the first ring shown is not filled with 31, the third segment of the connecting lead 43 formed has a problem of breakage due to discontinuity.

[0116] Figure 10BIn the process, the included angle β2 between the surface of the first buffer part 31 and the second surface 1b is approximately 36.4°, which is greater than the first preset angle θ. Tests have shown that the third segment 43 of the formed connecting lead 4 suffers from breakage due to discontinuity.

[0117] Figure 10C In the process, the included angle β2 between the surface of the first buffer part 31 and the second surface 1b is approximately 69.7°, which is greater than the first preset angle θ. Tests have shown that the third segment 43 of the formed connecting lead 4 suffers from breakage due to discontinuity.

[0118] It can be seen that when the first preset angle θ is 20°, and the included angle β between the surface of the first buffer part 31 and the second surface 1b can be less than or equal to 20°, the problem of the third section of the connecting lead 43 breaking due to discontinuity has been eliminated by testing.

[0119] The surface of the first buffer section 31 can be an inclined surface, such as... Figure 8 As shown, the slope angles of the surfaces of the first buffer section 31 are equal, both being β.

[0120] Figure 11 This is a cross-sectional schematic diagram of the display panel in another embodiment of the present disclosure. In another embodiment, such as... Figure 11 As shown, the surface of the first buffer part 31 is a curved surface that bulges out in a direction away from the second surface 1b. Thus, the ramp angle of the surface of the first buffer part 31 near the first projection edge is β. Then, the ramp angle of the surface of the first buffer part 31 gradually decreases, which is more conducive to forming a continuous third lead 43 and further prevents the third lead from breaking.

[0121] like Figure 8 and Figure 11 As shown, the buffer structure 3 may further include a second buffer section 32, which is connected to the first buffer section 31. The second buffer section 32 and the first buffer section 31 are connected as a single unit to form the buffer structure 3. The second buffer section 32 is located on the fourth surface 2b side of the control circuit board 2, and the surface of the second buffer section 32 is smoothly connected to the surface of the first buffer section 31. Thus, the third lead 43 passes through the second surface 1b, the surface of the first buffer section 31, and the surface of the second buffer section 32 before connecting to the second electrode 21.

[0122] like Figure 4A As shown, the buffer structure 3 can be a continuous structure in the extension direction of the second projection boundary BX3, or the buffer structure 3 can include multiple substructures, each substructure extending along the extension direction of the second projection boundary BX3, the multiple substructures being arranged along the extension direction of the second projection boundary BX3, and the third lead 43 passing through the surface of the corresponding substructure.

[0123] like Figure 1 As shown, one side of the first surface 1a of the substrate 1 is the front of the display panel. A display area AA and a bonding area BB are disposed on one side of the first surface 1a of the substrate 1. A driving circuit layer and light-emitting elements 12 are disposed in the display area AA. The light-emitting elements 12 include at least three colors: a first-color light-emitting element 12a, a second-color light-emitting element 12b, and a third-color light-emitting element 12c. The first, second, and third colors are three primary colors, such as red, green, and blue. The light-emitting elements 12 can be Micro LEDs or Mini LEDs. A first electrode 11 is disposed in the bonding area BB.

[0124] Another embodiment of this disclosure provides a display device, which includes the display panel in any embodiment of this disclosure.

[0125] Figure 12 This is a schematic diagram of a splicing display device according to one embodiment of the present disclosure. Another embodiment of the present disclosure also provides a splicing display device, which includes the display device of the present disclosure. The first selected side surface 1cc in each display device extends along the second direction Y. Since the control circuit board 2 is disposed on the second surface 1b of the display panel, the control circuit board 2 no longer occupies the space of the first surface 1a. Furthermore, the connecting lead 4 connects the first electrode 11 and the second electrode 21 through the first selected side surface 1cc, thereby greatly reducing the seam between two adjacent display devices in the first direction X.

[0126] The display device disclosed herein can be any product or component with display function, such as electronic paper, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, navigator, wearable display device, etc.

[0127] In the description of this specification, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0128] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this disclosure, "multiple" means two or more, unless otherwise explicitly specified.

[0129] In this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0130] In this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0131] The foregoing disclosure provides many different implementations or examples for carrying out different structures of this disclosure. To simplify this disclosure, the components and arrangements of specific examples are described above. Of course, these are merely examples and are not intended to limit this disclosure. Furthermore, reference numerals and / or reference letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0132] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this disclosure. Different parts of different embodiments can be combined with each other without conflict, and these should all be covered within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A display panel, characterized by, The application relates to a substrate, a control circuit board, a buffer structure and a connecting lead line. The substrate comprises a first surface and a second surface arranged oppositely, and at least one first selected side surface connecting the first surface and the second surface. The control circuit board is arranged on the second surface of the substrate, and comprises a third surface and a fourth surface arranged oppositely, and at least one second selected side surface connecting the third surface and the fourth surface, the third surface is close to the second surface relative to the fourth surface, the second selected side surface corresponds to the first selected side surface, and the control circuit board further comprises a second electrode arranged on the fourth surface. The buffer structure is arranged on one side of the second surface of the substrate, and comprises at least a first buffer part, the first buffer part is in contact with the second selected side surface and is located on the side of the second selected side surface facing the first selected side surface. The connecting lead line extends from the side of the first surface of the substrate, passes through the first selected side surface, and extends on the side of the second surface of the substrate, passes through the surface of the buffer structure and faces the second electrode, and is connected with the second electrode. The second surface of the substrate is provided with a groove structure, the groove structure comprises at least a first groove, the first groove comprises a first groove segment and a second groove segment which are in communication with each other, the first groove segment is located outside the orthographic projection of the control circuit board and the buffer structure on the second surface. At least a part of the second groove segment is located between the control circuit board and the second surface, and / or at least a part of the second groove segment is located between the first buffer part and the second surface.

2. The display panel of claim 1, wherein, A part of the second groove segment is located between the control circuit board and the second surface, and a part of the second groove segment is located between the first buffer part and the second surface.

3. The display panel of claim 1, wherein, The orthographic projection of the first buffer part on the second surface has a first projection boundary, the first projection boundary is located between a first common edge line and a second projection boundary, the second projection boundary is the orthographic projection of a second common edge line on the second surface, and the second common edge line is the intersection edge line of the third surface and the second selected side surface. The first groove segment is located between the first common edge line and the first projection boundary.

4. The display panel of claim 3, wherein, The first common edge line and the first projection boundary have a first preset distance, the size of the first groove segment in a first direction is less than or equal to the first preset distance, and the first direction is perpendicular to the extension direction of the first common edge line.

5. The display panel of claim 4, wherein, The distance between the end of the first groove segment close to the first common edge line and the first common edge line ranges from 600 mu m to 800 mu m.

6. The display panel of claim 3, wherein, The first groove extends from the end of the first groove segment close to the first common edge line along a third direction and at least to the inside of the first projection boundary, and the third direction intersects the extension direction of the first common edge line. In the first direction, the distance between the end of the first groove segment close to the first common edge line and the second projection boundary ranges from 450 mu m to 600 mu m, and the first direction is perpendicular to the extension direction of the first common edge line.

7. The display panel of claim 6, wherein, The third direction is perpendicular to the extension direction of the first common side line.

8. The display panel of claim 3, wherein, The groove structure comprises a plurality of first grooves, and the plurality of first grooves are arranged at intervals along the extension direction of the first projection boundary.

9. The display panel of claim 8, wherein, The distance between the two adjacent first groove segments is greater than the width of the connecting lead.

10. The display panel of claim 8, wherein, The number of the connecting leads is multiple, and the connecting leads comprise third segments of leads located on the second surface side of the substrate, and the multiple third segments of leads are arranged at intervals along the extension direction of the first common side line. The first groove segment satisfies at least one of the following conditions: The width of the first groove segment is less than the distance between the two adjacent third segments of leads. The width of the first groove segment is less than the width of the third segment of leads. The first groove segment is located between the two adjacent third segments of leads.

11. The display panel of claim 1, wherein, The width of the first groove is less than or equal to 300 μm.

12. The display panel of any one of claims 1-11, wherein, The orthographic projection of the first buffer portion on the second surface has a first projection boundary, the first projection boundary is located between a first common side line and a second projection boundary, the second projection boundary is the orthographic projection of a second common side line on the second surface, and the second common side line is the intersection side line of the third surface and the second selected side surface; The included angle between the surface of the first buffer portion and the second surface is less than or equal to a first preset angle θ, the thickness of the control circuit board is T, the distance d4 between the first projection boundary and the second projection boundary is greater than or equal to T / tan θ, and the first preset angle θ is less than or equal to 20°.

13. The display panel of claim 12, wherein, The surface of the first buffer portion is an inclined plane, or the surface of the first buffer portion is a curved surface protruding away from the second surface.

14. The display panel of claim 12, wherein, The buffer structure further comprises a second buffer portion, the second buffer portion is connected with the first buffer portion, the second buffer portion is located on the fourth surface, and the surface of the second buffer portion is smoothly connected with the surface of the first buffer portion.

15. The display panel of claim 12, wherein, The distance between the second projection boundary and the first common side line is greater than or equal to 1200 μm.

16. A display device comprising: The display panel comprises the display panel of any one of claims 1-15, and the substrate in the display panel is provided with a first electrode on a first surface, and the connecting lead is connected with the first electrode.

17. A tiled display device comprising a plurality of display devices according to claim 16.

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