Substrate processing apparatus and substrate processing system

Abstract

The present invention provides a substrate processing apparatus and a substrate processing system which not only apply a processing liquid to a substrate, but also perform a predetermined post-processing after the coating process. The substrate processing apparatus includes: a coating unit that performs a coating process at a position separated from the substrate carrying-in / out apparatus in a first horizontal direction; a plurality of post-processing units for performing predetermined post-processing on the substrate after the coating process; and a substrate transfer unit that reciprocates the substrate in the first horizontal direction along a transfer path extending in the first horizontal direction between the substrate carrying-in / out device and the coating unit, the substrate transfer unit being capable of handing over the substrate with respect to each post-processing unit by suspending at a position facing the post-processing unit on the transfer path, the transfer path extending in the first horizontal direction between the substrate carrying-in / out device and the coating unit, and the transfer path extending in the second horizontal direction between the substrate carrying-in / out device and the coating unit. The plurality of post-processing units are disposed apart from the transfer path in a second horizontal direction orthogonal to the first horizontal direction, and the substrate transfer unit transfers the substrate received from the substrate carrying-in / out device to the coating unit and the post-processing units in sequence, and then transfers the substrate to the substrate carrying-in / out device.

Description

Technical Field

[0001] The present invention relates to a substrate processing device and a substrate processing system for applying a coating treatment liquid to substrates for semiconductor packaging such as substrates for FOWLP (fan out wafer level package), glass substrates for liquid crystal display devices, semiconductor substrates, glass substrates for PDPs, glass substrates for photomasks, substrates for color filters, substrates for recording disks, substrates for solar cells, substrates for electronic papers and other precision electronic device substrates, rectangular glass substrates, flexible substrates for thin-film liquid crystals, and substrates for organic EL (hereinafter simply referred to as "substrates").

[0002] The disclosures of the following Japanese application specifications, drawings, and claims are incorporated herein by reference in their entirety:

[0003] Japan Special Application No. 2023-206291 (applied on December 6, 2023). Background Art

[0004] As one of the manufacturing processes of semiconductor devices, there is a coating process in which a treatment liquid is applied to the surface of a substrate to form a coating film. In addition, in recent years, in the field of semiconductor devices, the requirements for miniaturization and thinning of devices are very high. In order to meet such requirements, the FOWLP technology of mounting a single high-integration semiconductor on the surface of a printed circuit board has attracted attention. In this FOWLP technology, in order to manufacture high-quality products, the importance of coating processing has also increased. Therefore, for example, a coating device described in Japanese Patent Gazette No. 2022-131177 is proposed.

[0005] Post-treatments such as reduced pressure drying treatment based on a reduced pressure drying device, heating drying treatment based on a heating plate, and cooling treatment based on a cooling plate are performed on the substrate on which the coating film is formed by the coating device. In addition, in the FOWLP technology, pre-treatments such as dehydration baking treatment for removing moisture contained in the printed circuit board are sometimes added. Therefore, a substrate processing device is proposed that can not only perform coating treatment, but also can perform reduced pressure drying treatment, heating treatment, cooling treatment, dehydration baking treatment, etc. in combination. For example, a substrate processing device is proposed, in which a dehydration baking device, a coating device, a reduced pressure drying device, a heating device and a cooling device for post-baking are linearly arranged, and a substrate is transported between these devices by a conveyor or other transporting device, and a dehydration baking treatment, a coating treatment, etc. are performed in each device. In addition, a substrate processing system is also proposed, in which EFEM (Equipment Front End Module) is arranged on both sides of the substrate processing device, and the substrate is automatically moved into the substrate processing device and automatically moved out of the substrate from the substrate processing device.

[0006] In such a proposed example (substrate processing device and substrate processing system), pre-processing devices such as a dehydration baking device and post-processing devices such as a reduced pressure drying process are arranged in a straight line with the coating device. Therefore, the substrate processing device and substrate processing system are inevitably enlarged in their arrangement direction, resulting in a problem of increasing the occupied area. Summary of the invention

[0007] The present invention has been made in view of the above problems, and an object of the present invention is to suppress an increase in the occupied area in a substrate processing apparatus and a substrate processing system that not only applies a processing liquid to a substrate but also performs a predetermined post-process after the coating process.

[0008] A substrate processing device in a first mode of the present invention performs a coating process on a substrate received from a substrate loading and unloading device by applying a processing liquid. The substrate processing device is characterized in that it comprises: a coating section that performs a coating process at a position separated from the substrate loading and unloading device along a first horizontal direction; a plurality of post-processing sections that perform specified post-processing on the substrate after the coating process; and a substrate conveying section that reciprocates and conveys the substrate in the first horizontal direction along a conveying path, and for each post-processing section, it is capable of pausing at a position on the conveying path opposite to the post-processing section and handing over the substrate to the post-processing section, the conveying path extending along the first horizontal direction between the substrate loading and unloading device and the coating section, the plurality of post-processing sections being separately arranged relative to the conveying path in a second horizontal direction orthogonal to the first horizontal direction, and the substrate conveying section transfers the substrate received from the substrate loading and unloading device to the coating section and the post-processing section in sequence, and then transfers the substrate to the substrate loading and unloading device.

[0009] In addition, a second aspect of the present invention provides a substrate processing system, characterized by comprising: a substrate loading and unloading device for loading and unloading a substrate; and the above-mentioned substrate processing device.

[0010] In the invention thus constituted, the coating unit and the substrate loading and unloading device such as the EFEM are arranged opposite to each other in the first horizontal direction, and the substrate is reciprocated along the linear conveying path formed between them. In addition, in the second horizontal direction orthogonal to the first horizontal direction, the plurality of post-processing units are arranged separately from the above-mentioned conveying path. Therefore, the substrate processing device becomes compact in the first horizontal direction and the second horizontal direction.

[0011] As described above, in a substrate processing apparatus that not only applies a processing liquid to a substrate but also performs a predetermined post-process after the coating process, and a substrate processing system equipped with the substrate processing apparatus, an increase in the occupied area can be suppressed.

[0012] The plurality of constituent elements of the above-mentioned various modes of the present invention are not all necessary. In order to solve part or all of the above-mentioned problems, or to achieve part or all of the effects described in this specification, some of the plurality of constituent elements can be appropriately changed, deleted, replaced with other new constituent elements, or part of the limited content can be deleted. In addition, in order to solve part or all of the above-mentioned problems, or to achieve part or all of the effects described in this specification, part or all of the technical features included in the above-mentioned one mode of the present invention can also be combined with part or all of the technical features included in the above-mentioned other modes of the present invention to form an independent mode of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a perspective view schematically showing a substrate processing system equipped with a substrate processing apparatus according to a first embodiment of the present invention.

[0014] Figure 2 It is schematically indicated Figure 1 A top view of a substrate processing system is shown.

[0015] Figure 3 It is schematically indicated Figure 2 A three-dimensional view of the structure of the coating portion shown.

[0016] Figure 4A The diagram schematically shows the sequence of conveying and processing a substrate performed by the substrate processing apparatus.

[0017] Figure 4B The diagram schematically shows the sequence of conveying and processing a substrate performed by the substrate processing apparatus.

[0018] Figure 4C The diagram schematically shows the sequence of conveying and processing a substrate performed by the substrate processing apparatus.

[0019] Figure 4D The diagram schematically shows the sequence of conveying and processing a substrate performed by the substrate processing apparatus.

[0020] Figure 5 It is a diagram schematically showing a substrate processing system equipped with a substrate processing apparatus according to a second embodiment of the present invention.

[0021] Figure 6 It is a diagram schematically showing a substrate processing system equipped with a substrate processing apparatus according to a third embodiment of the present invention.

[0022] Figure 7 It is a diagram schematically showing a substrate processing system equipped with a substrate processing apparatus according to a fourth embodiment of the present invention.

[0023] Description of reference numerals:

[0024] 1Coating Department

[0025] 2 Slit Nozzle

[0026] 100 substrate processing system

[0027] 200 substrate loading and unloading equipment

[0028] 300 substrate processing device

[0029] 310 coating unit

[0030] 320 First standby unit

[0031] 321 First loading platform

[0032] 321, 341 loading platform

[0033] 330 pre-processing unit

[0034] 331, 351 frame

[0035] 332, 353 Heating Tower

[0036] 333, 354 cooling tower

[0037] 340 Second standby unit

[0038] 341 Second loading platform

[0039] 350 post-processing unit

[0040] 352 vacuum drying tower

[0041] 360 substrate handling department

[0042] 510 Installation location

[0043] CPb cooling unit (post-processing unit)

[0044] CPf cooling section (pre-treatment section)

[0045] HPb heating unit (post-processing unit)

[0046] HPf heating section (pre-treatment section)

[0047] S substrate

[0048] TP transport path

[0049] TR1 first handling robot

[0050] TR2 Second Handling Robot

[0051] VD vacuum drying section (post-processing section) DETAILED DESCRIPTION

[0052] Figure 1 1 is a perspective view schematically showing a substrate processing system equipped with a substrate processing apparatus according to a first embodiment of the present invention. Figure 2 It is schematically indicated Figure 1 The top view of the substrate processing system shown in FIG. The substrate processing system 100 comprises: a substrate loading and unloading device 200 for loading and unloading a substrate S; and a substrate processing device 300 for coating a substrate S received from the substrate loading and unloading device 200 with a coating liquid. The substrate loading and unloading device 200 has a mechanism for delivering a storage box C on the front surface. In addition, the substrate loading and unloading device 200 has a transport robot TR0. The transport robot TR0 has the following functions: taking out the substrate S contained in the storage box C and delivering it to the substrate processing device 300; receiving the substrate S that has been subjected to coating treatment by the substrate processing device 300 and returning it to the storage box C. In addition, in this specification, in order to clarify the configuration and operation of each part constituting the substrate processing system 100, a coordinate system with the Z axis as the vertical direction and the XY plane as the horizontal plane is appropriately added. In addition, in each coordinate system, the direction in which the top of the arrow points is the + (positive) direction, and the opposite direction is the - (negative) direction.

[0053] A substrate processing device 300 is disposed adjacent to the substrate loading and unloading device 200 on the (+X) direction side. In the substrate processing device 300, a coating unit 310 is disposed at a position separated from the substrate loading and unloading device 200 on the (+X) direction side. In addition, between the substrate loading and unloading device 200 and the coating unit 310, a first standby unit 320, a pre-processing unit 330, a second standby unit 340, and a post-processing unit 350 are sequentially disposed along the (+X) direction. In addition, inside these components, as shown in FIG. Figure 2 As shown by the single-dot chain line in FIG. 1 , a linear transport path TP is extended in the X direction, and a substrate transport unit 360 ( Figure 2 ) is arranged inside the substrate processing device 300.

[0054] In the coating unit 310, as Figure 1 As shown in FIG. 1 , a coating unit 1 is arranged in the internal space, and a downflow is formed in the internal space by clean air sent from a fan filter unit FFU installed on the top surface. The coating unit 1 moves along the Y direction while spraying a processing liquid from a slit nozzle, and supplies the processing liquid to the surface of the substrate S to apply a coating film. The formation of a downflow of clean air in the internal space is also the same in the first standby unit 320, the pre-processing unit 330, the second standby unit 340, and the post-processing unit 350 described later.

[0055] Figure 3 It is schematically indicated Figure 2 The coating unit 1 basically has the same structure as the coating device described in Japanese Patent Application Laid-Open No. 2022-131177. Therefore, in this specification, only the main part of the coating unit 1 will be described.

[0056] The coating unit 1 is a coating device called a slit coating device that uses a slit nozzle 2 (hereinafter, simply referred to as "nozzle 2") to apply a processing liquid to a surface Sf of a substrate S as an example of a coated object. In addition, in this specification, "the surface Sf of the substrate S" refers to the main surface of the two main surfaces of the substrate S on the side where the processing liquid is applied.

[0057] The coating section 1 includes: a stage 4 capable of holding the substrate S in a horizontal posture by suction; and a coating treatment section 5 for applying a coating treatment to the substrate S held by the stage 4 using a nozzle 2. The stage 4 is made of a stone material such as granite having a substantially rectangular parallelepiped shape, and has a holding surface 41 on the (-Y) direction side of its upper surface, the holding surface 41 being processed into a substantially horizontal flat surface, and holding the substrate S transported by the substrate transport section 360 along the transport path TP. The substrate S is placed on the holding surface 41 via lift pins not shown in the figure. In addition, a plurality of vacuum suction ports not shown in the figure are dispersedly formed on the holding surface 41. By using these vacuum suction ports to adsorb the substrate S, the substrate S is horizontally held at a predetermined position during the coating treatment. In addition, the holding method of the substrate S is not limited to this, and for example, the substrate S may be mechanically held. In addition, in the stage 4, a nozzle adjustment area RA is provided at a position closer to the (+Y) direction side than the area occupied by the holding surface 41, and a nozzle maintenance unit (not shown in the figure) is arranged in the nozzle adjustment area RA.

[0058] The nozzle 2 is extended in the X direction. In addition, in the YZ section, the lower end portion (nozzle lip) has a shape that becomes thinner as it goes downward. In addition, at the lower end portion, a slit-shaped ejection port 21 is extended in the X direction, and the processing liquid pressure-sent from the processing liquid supply portion (not shown) is ejected from the ejection port 21 toward the surface Sf of the substrate S. Thus, the processing liquid is applied to the surface Sf of the substrate S.

[0059] The coating processing section 5 has a nozzle support body 51 that supports the nozzle 2. The nozzle support body 51 has: a support member 51a that extends parallel to the X direction above the stage 4; and two lifting mechanisms 51b that support the support member 51a from both sides of the X direction and lift the support member 51a. The support member 51a is made of carbon fiber reinforced resin or the like, and is a rod member with a rectangular cross-section. The lower surface of the support member 51a becomes the mounting portion 510 of the nozzle 2, and the support member 51a supports the nozzle 2 at the mounting portion 510 so that it can be loaded and unloaded. In addition, as a mechanism for loading and unloading the nozzle 2 at the mounting portion 510 of the support member 51a, various fastening mechanisms such as latches or screws can be appropriately used.

[0060] Two lifting mechanisms 51b are connected to both ends of the support member 51a in the longitudinal direction, and each of them has an AC servo motor and a ball screw, etc. Through these lifting mechanisms 51b, the support member 51a and the nozzle 2 fixed to the support member 51a can be lifted and lowered in the vertical direction (Z direction), so that the interval between the ejection port 21 opened at the lower end of the nozzle 2 and the substrate S can be adjusted, that is, the relative height of the ejection port 21 relative to the substrate S can be adjusted. In addition, the vertical position of the support member 51a can be detected by, for example, a linear encoder (not shown), which is composed of a scale portion and a detection sensor, the scale portion being provided on the side of the lifting mechanism 51b, and the detection sensor being provided on the side of the nozzle 2 opposite to the scale portion.

[0061] like Figure 3 As shown, the nozzle support body 51 thus constructed has a bridging structure that is erected on the left and right ends of the stage 4 along the X direction and spans the holding surface 41. The coating processing unit 5 has a slit nozzle moving unit 53 that moves the nozzle support body 51 along the Y direction. The slit nozzle moving unit 53 functions as a relative movement mechanism that moves the nozzle support body 51 as a bridging structure and the nozzle 2 supported by the nozzle support body 51 relative to the substrate S held on the stage 4 along the Y direction. Specifically, the slit nozzle moving unit 53 has, on the ±X side, a guide rail 52 that guides the movement of the nozzle 2 along the Y direction; a linear motor 54 that serves as a drive source; and a linear encoder 55 that detects the position of the nozzle outlet 21 of the nozzle 2.

[0062] The two guide rails 52 are respectively arranged at the two ends of the stage 4 in the X direction, and are extended in the Y direction in a manner including a section where the nozzle adjustment area RA and the holding surface 41 are provided. Furthermore, the two guide rails 52 guide the movement of the two lifting mechanisms 51b in the Y direction. In addition, the two linear motors 54 are respectively arranged on both sides of the stage 4, and are AC coreless linear motors having a fixed part 54a and a movable part 54b. The fixed part 54a is arranged on the side of the stage 4 in the X direction along the Y direction. On the other hand, the movable part 54b is fixedly arranged on the outside of the lifting mechanism 51b. The two linear motors 54 respectively drive the two lifting mechanisms 51b in the Y direction by using the magnetic force generated between these fixed parts 54a and movable parts 54b.

[0063] In addition, each linear encoder 55 has a scale portion 55a and a detection portion 55b. The scale portion 55a is provided along the Y direction at the lower portion of the fixing member 54a of the linear motor 54 fixedly provided on the stage 4. On the other hand, the detection portion 55b is fixedly provided at a position further outward than the moving member 54b of the linear motor 54 fixedly provided on the lifting mechanism 51b, and the detection portion 55b is arranged opposite to the scale portion 55a. The linear encoder 55 detects the position of the ejection outlet 21 of the nozzle 2 in the Y direction based on the relative positional relationship between the scale portion 55a and the detection portion 55b.

[0064] The slit nozzle moving unit 53 configured in this way can move the nozzle 2 between above the nozzle adjustment area RA and above the substrate S held on the stage 4 by driving the nozzle support body 51 in the Y direction. Furthermore, the coating unit 1 forms a coating layer on the surface Sf of the substrate S by moving the nozzle 2 relative to the substrate S while ejecting the processing liquid from the ejection port 21 of the nozzle 2.

[0065] In addition, during the period when the coating process is not being performed on the stage 4, such as when the substrate S is transferred between the coating unit 1 and the substrate conveying unit 360 (when the substrate S is carried in and out), the nozzle 2 retreats to the nozzle adjustment area RA ( Figure 3 Also, the nozzle maintenance unit performs various maintenance on the nozzles 2 located in the nozzle adjustment area RA.

[0066] Next, return Figure 1 and Figure 2 , the structure of the first standby unit 320 is described. The first standby unit 320 is disposed adjacent to the substrate loading and unloading device 200. Figure 2As shown, a first loading table 321 configured to temporarily load the substrate S is provided in the internal space of the first standby unit 320. Therefore, the transport robot TR0 responds to the command from the control unit that controls the substrate loading and unloading device 200 and operates to take out the substrate S contained in the storage box C and load it on the first loading table 321. In this way, the substrate S before the coating process and the prescribed pre-processing and post-processing accompanying the coating process are temporarily put on standby. In addition, on the first loading table 321, as described later, the substrate S that has undergone the above-mentioned process is temporarily put on standby. Then, at an appropriate time, the transport robot TR0 enters the first loading table 321, receives the substrate S, and returns it to the storage box C. In this way, the first standby unit 320 plays a role in smoothly transferring the substrate S between the substrate loading and unloading device 200 and the substrate processing device 300, and adjusting the tact time between these devices.

[0067] The pre-processing unit 330, the second standby unit 340, and the post-processing unit 350 are connected in series to the (+X) direction side of the first standby unit 320. The second standby unit 340 has a second stage 341, similarly to the first standby unit 320. The second stage 341 temporarily stands by the substrate S that has been pre-processed by the pre-processing unit 330 or the substrate S that has been post-processed by the post-processing unit 350 after the coating process. Thus, the transfer of the substrate S between the coating unit 310, the pre-processing unit 330, and the post-processing unit 350 becomes smooth, and the tact time between these units can be adjusted.

[0068] The pre-processing unit 330 is disposed between the first standby unit 320 and the second standby unit 340. Figure 1As shown in FIG. 1 , the pre-processing unit 330 includes: a frame 331, the interior of which functions as a part of the transport path TP; a heating tower 332, in which a heating part HPf for performing a dehydration and baking treatment on the substrate S is stacked and arranged; and a cooling tower 333, in which a cooling part CPf for cooling the substrate S after the dehydration and baking treatment is stacked and arranged. The frame 331 is arranged adjacent to the first mounting table 321. In addition, in the Y direction, the heating tower 332 and the cooling tower 333 are separated from the housing 331. More specifically, the heating tower 332 is arranged on the (+Y) direction side of the frame 331, and the cooling tower 333 is arranged on the (-Y) direction side. In addition, a first transport robot TR1 is fixedly arranged in the frame 331. The first transport robot TR1 is configured to allow a hand (not shown) that can hold the substrate S to enter the first mounting table 321, the heating part HPf, the cooling part CPf and the second mounting table 341. Therefore, the first transport robot TR1 responds to the command from the control unit that controls the substrate processing apparatus 300 and moves, so that the substrate S can be reciprocated between the first stage 321 and the second stage 341 along the transport path TP, and the substrate S can be transported between the first stage 321, the heating unit HPf, the cooling unit CPf, and the second stage 341. It should be noted that, although in this embodiment, the number of the heating units HPf in the heating tower 332 is "three", and the number of the cooling units CPf in the cooling tower 333 is "three", their numbers are not limited to "three" but are arbitrary. In addition, the number of the heating tower 332 and the cooling tower 333 is also arbitrary.

[0069] The post-processing unit 350 is disposed on the (+X) direction side of the second standby unit 340 having the second mounting table 341. Figure 1 As shown, the post-processing unit 350 includes: a frame 351, the interior of which functions as a part of the conveying path TP; a vacuum drying tower 352, which is stacked with a vacuum drying section VD for performing a vacuum drying treatment on the substrate S after the coating treatment; a heating tower 353, which is stacked with a heating section HPb for heating the substrate S after the vacuum drying treatment; and a cooling tower 354, which is stacked with a cooling section CPb for cooling the substrate S after the heating treatment.

[0070] The frame 351 is provided between the second stage 341 and the coating unit 310. In addition, in the Y direction, the vacuum drying tower 352, the heating tower 353, and the cooling tower 354 are provided separately from the frame 351. More specifically, the vacuum drying tower 352 is arranged on the (+Y) direction side of the frame 351, and the heating tower 353 and the cooling tower 354 are arranged on the (-Y) direction side. In addition, in the frame 351, the second transport robot TR2 is arranged to be freely movable in the X direction. The second transport robot TR2 is configured so that a hand (not shown) that can hold the substrate S can enter the second stage 341, the heating unit HPb, the cooling unit CPb, and the coating unit 1. Therefore, the second transport robot TR2 responds to the instructions from the control unit that controls the substrate processing device 300 and moves, so that the substrate S can be reciprocated along the transport path TP between the second loading table 341 and the coating section 1, and can transport the substrate S between the second loading table 341, the reduced pressure drying section VD, the heating section HPb, the cooling section CPb and the coating section 1.

[0071] Thus, in this embodiment, a first transport robot TR1 and a second transport robot TR2 are provided. Furthermore, the first transport robot TR1 and the second transport robot TR2 cooperate to function as a substrate transport unit 360, so that after transporting the substrate S received from the substrate transport device 200 in the order described below, the substrate S is transferred to the substrate transport device 200. FIG. 4A to FIG. 4D , the conveyance of the substrate S in the substrate processing apparatus 300 and the processing in each unit are described. In order to facilitate understanding of the sequence of the above-mentioned conveyance and processing, the conveyance and processing are described focusing on one substrate S.

[0072] Figures 4A to 4D It means by Figure 1 and Figure 2 Schematic diagram of the sequence of conveying and processing a substrate performed by the substrate processing apparatus shown in FIG.

[0073] In the substrate processing system 100, when the substrate loading and unloading device 200 receives a loading instruction for an unprocessed substrate S, the control unit provided in the substrate loading and unloading device 200 controls the transport robot TR0 to take out the unprocessed substrate S from the storage box C and place it on the first mounting table 321 of the substrate processing device 300. On the other hand, in the substrate processing device 300, if a processing start instruction is given to the control unit for the substrate S waiting on the first mounting table 321, the control unit controls each unit of the device as follows, and after the substrate S is subjected to pre-processing (dehydration baking process, cooling process), coating process and post-processing (reduced pressure drying process, post-baking process, cooling process), the substrate S is placed on the first mounting table 321 to transfer the substrate S to the substrate processing device 300. Each process is performed as follows.

[0074] In pre-processing, Figure 4A As shown, the following operations are performed. That is, after the hand of the first transport robot TR1 receives the substrate S from the first mounting table 321, it enters the heating part HPf while holding the substrate S, and delivers the substrate S (action M1). Then, after the hand of the first transport robot TR1 retreats from the heating part HPf, the substrate S is subjected to a dehydration baking process in the heating part HPf.

[0075] After the heating process of the heating part HPf is completed, the hand of the first transport robot TR1 enters the heating part HPf, receives the substrate S that has been subjected to the dehydration and baking process, and transports it to the cooling part CPf (action M2). Then, when the hand of the first transport robot TR1 retreats from the cooling part CPf, and then the temperature of the substrate S is lowered to room temperature by the cooling part CPf, the hand of the first transport robot TR1 enters the cooling part CPf, receives the substrate S that has been subjected to the dehydration and baking process, and transports it to the second mounting table 341 (action M3). In this way, before the coating process is performed by the coating part 1, the moisture (liquid component) contained in the substrate S is removed, and in this state, the substrate S waits on the second mounting table 341 for the start of the next coating process.

[0076] like Figure 4B As shown, in the next coating process, the second transport robot TR2 moves to a position opposite to the second loading table 341. Then, the second transport robot TR2 receives the substrate S from the second loading table 341, and while holding the substrate S with its hand, moves to a position opposite to the coating unit 1 along the transport path TP, and pauses at this position. Next, the second transport robot TR2 moves the hand holding the substrate S into the coating unit 1, and places the substrate S on the loading table 4 (see Figure 3) (action M4). At this time, the nozzle 2 retreats in the Y direction relative to the stage 4, which can reliably prevent interference with the above-mentioned hand and substrate S. Then, after the hand of the second transport robot TR2 retreats from the coating unit 1, the coating unit 1 is used to perform the coating process.

[0077] like Figure 4C As shown, in the subsequent post-processing, the second transport robot TR2 moves along the transport path TP to a position opposite to the coating section 1, pauses at this position, and receives the substrate S that has been coated from the coating section 1. Then, if the hand retreats from the coating section 1 while holding the substrate S, the second transport robot TR2 moves along the transport path TP to a position opposite to the reduced pressure drying section VD in this state, and pauses at this position. Next, the second transport robot TR2 causes the hand holding the substrate S to enter the reduced pressure drying section VD and deliver the substrate S (action M5). Then, after the hand of the second transport robot TR2 retreats from the reduced pressure drying section VD, the reduced pressure drying section VD is used to perform reduced pressure drying as post-processing.

[0078] When the reduced pressure drying process is completed, the second transport robot TR2 moves along the transport path TP to a position opposite to the reduced pressure drying section VD and pauses at this position. Then, the second transport robot TR2 causes the hand to enter the reduced pressure drying section VD to receive the substrate S. Then, if the hand retreats from the reduced pressure drying section VD while holding the substrate S, the second transport robot TR2 moves along the transport path TP to a position opposite to the heating section HPb in this state and pauses at this position. Next, the second transport robot TR2 causes the hand holding the substrate S to enter the heating section HPb and deliver the substrate S (action M6). Then, after the hand of the second transport robot TR2 retreats from the heating section HPb, a post-baking process is performed using the heating section HPb as a post-processing.

[0079] When the post-bake process is completed, the second transport robot TR2 moves along the transport path TP to a position opposite to the heating part HPb and pauses at this position. Then, the second transport robot TR2 causes the hand to enter the heating part HPb to receive the substrate S. Then, if the hand retreats from the heating part HPb while holding the substrate S, the second transport robot TR2 moves along the transport path TP to a position opposite to the cooling part CPb in this state and pauses at this position. Next, the second transport robot TR2 causes the hand holding the substrate S to enter the cooling part CPb and hand over the substrate S (action M7). Then, the hand of the second transport robot TR2 retreats from the cooling part CPb and performs a cooling process as a post-processing using the cooling part CPb.

[0080] After that, if the temperature of the substrate S is lowered to room temperature by the cooling section CPb, the second transport robot TR2 moves along the transport path TP to a position opposite to the cooling section CPb and pauses at the position. Then, the second transport robot TR2 moves its hand into the cooling section CPb to receive the substrate S. Then, if the hand retreats from the cooling section CPb while holding the substrate S, the second transport robot TR2 moves along the transport path TP to a position opposite to the second mounting table 341 in this state and pauses at the position. Next, the second transport robot TR2 moves the hand holding the substrate S to the second mounting table 341 and places the substrate S on the second mounting table 341 (action M8).

[0081] Furthermore, in order to be able to take out the substrate S that has undergone a series of processes (=pre-processing + coating process + post-processing) from the substrate processing apparatus 300, as shown in FIG. Figure 4D As shown, the hand of the first transport robot TR1 enters the second stage 341 to receive the substrate S and transfers it to another first stage 321 (action M9). In this way, the processed substrate S waits on the first stage 321 to be transferred to the storage box C by the transport robot TR0 of the substrate loading and unloading device 200.

[0082] As described above, in the present embodiment, the coating unit 1 is arranged opposite to the substrate loading and unloading device 200 in the X direction (equivalent to the "first horizontal direction" of the present invention). And the substrate S is reciprocated along the conveying path TP formed between the above two. In addition, in the Y direction (equivalent to the "second horizontal direction" of the present invention), the heating unit HPf and the cooling unit CPf for pre-processing, and the reduced pressure drying unit VD, the heating unit HPb and the cooling unit CPb for post-processing are arranged separately relative to the conveying path TP. Therefore, the substrate processing device 300 is compact in the horizontal plane. As a result, the occupied area of ​​the substrate processing device 300 can be greatly reduced, the energy required for substrate processing and the use of clean air can be reduced, etc., which greatly contributes to SDGs (Sustainable Development Goals: United Nations Sustainable Development Goals).

[0083] In addition, in a substrate processing apparatus in which a pre-processing unit, a coating unit, and a post-processing unit are arranged in a straight line as in the proposed example, it is necessary to arrange substrate loading and unloading devices on both the loading and unloading sides of the substrate, and the increase in the cost and occupied area of ​​the substrate processing system is inevitable. In contrast, in the above-mentioned substrate processing system 100, it is sufficient to arrange the substrate loading and unloading device 200 only on the (-X) direction side of the substrate processing apparatus 300, which can effectively solve the above-mentioned problem.

[0084] In addition, in the above-mentioned embodiment, the coating unit 1 is arranged so that the horizontal movement direction of the nozzle 2 in the coating unit 1 is in the Y direction orthogonal to the X direction, which is the extension direction of the transport path TP. Therefore, the substrate S can be carried in and out of the coating unit 1 in a state where the nozzle 2 is separated from the extension line of the transport path TP. Therefore, not only the time required for the carrying in and out can be shortened, but also the time from carrying in the substrate to the start of the coating process and the time from the end of the coating to the start of the substrate being carried out can be shortened. As a result, the tact time required for the coating process can be shortened.

[0085] In addition, the arrangement order of the pre-processing unit 330 and the post-processing unit 350 in the X direction is arbitrary. Figure 2 The arrangement order shown has the following effects. In the direction from the substrate loading and unloading device 200 toward the coating section 1 in the X direction (equivalent to the "outward direction" of the present invention), the post-processing unit 350 is arranged more downstream than the pre-processing unit 330. That is, the post-processing unit 350 is arranged adjacent to the coating section 1. Therefore, after the coating treatment, the coating film has a higher fluidity and preferably starts to dry earlier. In this regard, since the distance from the coating section 1 to the post-processing unit 350 is short, the coating film can be dried earlier, so that the coating film can be dried well.

[0086] In the above-mentioned embodiment, the heating section HPf and the cooling section CPf are equivalent to an example of the "pre-processing section" of the present invention, and are respectively equivalent to an example of the "front heating section" and the "front cooling section" of the present invention. The reduced pressure drying section VD, the heating section HPb, and the cooling section CPb are equivalent to an example of the "post-processing section" of the present invention, and the heating section HPb and the cooling section CPb are respectively equivalent to an example of the "post-heating section" and the "post-cooling section" of the present invention. The first mounting table 321 and the second mounting table 341 are respectively equivalent to an example of the "first standby section" and the "second standby section" of the present invention.

[0087] In addition, the present invention is not limited to the above-mentioned embodiment, and various changes other than the above-mentioned contents can be made as long as they do not deviate from the main purpose. For example, in the above-mentioned embodiment, since the pre-processing unit and the post-processing unit can be arranged on the (+Y) direction side and the (-Y) direction side of the conveying path TP, it is easy to add the above-mentioned tower according to the time required for the dehydration baking process, the coating process, the reduced pressure drying process and the post-baking process. For example, in Figure 1 In the embodiment, the area opposite to the cooling tower 354 across the conveying path TP is an empty area. Figure 5 As shown, a reduced pressure drying tower 352 may be added according to the tact time of the reduced pressure drying process (second embodiment).

[0088] In addition, instead of the vacuum drying tower 352, for example, Figure 6 As shown, a heating tower 353 and a cooling tower 354 may also be added (third embodiment). In this way, since a layout is adopted in which the pre-processing unit and the post-processing unit are freely separated in the Y direction across the transport path TP, the structural freedom of the pre-processing unit and the post-processing unit can be improved, thereby obtaining a substrate processing apparatus and a substrate processing system with high versatility.

[0089] In addition, the semiconductor package substrate S is mostly a resin substrate, which may absorb moisture when it is carried in from the substrate loading and unloading device 200. Therefore, in the substrate processing device 300 that applies the processing liquid to the semiconductor package substrate S, as in the first to third embodiments, performing a dehydration baking process as a pre-process before the coating process is very effective in improving product quality. On the other hand, in the substrate processing device 300 that applies the processing liquid to the substrate S with low hygroscopicity such as a glass substrate, as in Figure 7 As shown, the pre-processing unit 330 may be omitted, and one of the first mounting table 321 and the second mounting table 341 may be omitted (fourth embodiment).

[0090] In addition, in the above-described embodiment, the substrate S is transferred between the substrate loading / unloading apparatus 200 and the substrate processing apparatus 300 via the first stage 321 , but the substrate may be transferred directly between transport robots.

[0091] The invention has been described above according to specific embodiments, but the description is not intended to be interpreted in a limiting sense. With reference to the description of the invention, various modifications of the disclosed embodiments are obvious to those familiar with the art, as are other embodiments of the invention. Therefore, the attached claims should be considered to include such modifications or embodiments within the scope of the true scope of the invention.

[0092] The present invention can be applied to all substrate processing technologies that perform coating processing of a substrate with a processing liquid.

Claims

1. A substrate processing device for performing a coating process of a substrate received from a substrate loading and unloading device with a coating process liquid, wherein the substrate processing device is characterized in that: have: a coating section for performing the coating process at a position separated from the substrate carrying-in and carrying-out device along a first horizontal direction; A plurality of post-processing units for performing a predetermined post-processing on the substrate after the coating process; as well as a substrate transporting section that reciprocates the substrate in the first horizontal direction along a transport path, and that can pause at a position on the transport path opposite to the post-processing section for each post-processing section to receive the substrate from the post-processing section, wherein the transport path extends along the first horizontal direction between the substrate loading and unloading device and the coating section, The plurality of post-processing units are arranged separately from the conveying path in a second horizontal direction orthogonal to the first horizontal direction. The substrate transport section sequentially transports the substrate received from the substrate transport device to the coating section and the post-processing section, and then transfers the substrate to the substrate transport device.

2. The substrate processing apparatus according to claim 1, wherein: The plurality of post-processing units include: a post-heating unit for heating the substrate after the coating process; and The post-cooling unit cools the substrate after being heated by the post-heating unit.

3. The substrate processing apparatus according to claim 1, wherein: The plurality of post-processing units include: a reduced pressure drying section for drying a coating film of the processing liquid applied to the substrate by reducing pressure after the coating process; a post-heating unit for heating the substrate after the reduced-pressure drying unit has dried the substrate under reduced pressure, and The post-cooling unit cools the substrate after being heated by the post-heating unit.

4. The substrate processing apparatus according to claim 1, wherein: The substrate processing apparatus further includes a plurality of pre-processing units for performing a predetermined pre-processing on the substrate before the coating process. The plurality of pre-processing units are arranged separately from the plurality of post-processing units at positions different from those of the plurality of post-processing units in the first horizontal direction relative to the conveying path. The substrate conveying section is configured to be able to stop at a position on the conveying path facing the pre-processing section for each of the pre-processing sections and to receive the substrate from the pre-processing section. The substrate conveying section conveys the substrate received from the substrate carrying-in / out device to the pre-processing section before conveying the substrate received from the substrate carrying-in / out device to the coating section.

5. The substrate processing apparatus according to claim 4, wherein: The plurality of pre-processing units include: a front heating unit for heating the substrate before it is transported to the coating unit; The front cooling unit cools the substrate heated by the front heating unit.

6. The substrate processing apparatus according to claim 4, wherein: In the outward direction from the substrate loading and unloading device toward the coating section in the first horizontal direction, the plurality of post-processing sections are arranged on the downstream side relative to the plurality of pre-processing sections.

7. The substrate processing apparatus according to claim 5, wherein: The substrate processing device comprises: A first standby section that temporarily stands by the substrate between the substrate loading and unloading device and the plurality of pre-processing sections in the transport path; as well as A second standby section temporarily stands by the substrate between the plurality of pre-processing sections and the plurality of post-processing sections in the transport path. The substrate transport unit comprises: a first transport robot configured to reciprocate the substrate along the transport path between the first standby section and the second standby section, and to transport the substrate between the first standby section, the plurality of pre-processing sections, and the second standby section; as well as The second transport robot is configured to reciprocate the substrate along the transport path between the second standby section and the coating section, and to transport the substrate between the second standby section, the plurality of post-processing sections, and the coating section.

8. A substrate processing system, characterized in that: have: A substrate loading and unloading device for loading and unloading substrates; and The substrate processing apparatus according to any one of claims 1 to 7.

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