Full-automatic laser etching equipment for computer chip cooling fin

Abstract

The invention discloses computer chip cooling fin full-automatic laser etching equipment, and relates to the field of laser etching, the computer chip cooling fin full-automatic laser etching equipment comprises a main box, supporting legs are uniformly arranged at the bottom of the main box, fixing blocks are symmetrically arranged on the outer surface of the main box, and the outer surfaces of the fixing blocks are rotatably connected with first supporting rods; one end, far away from the fixed block, of the support rod I is fixedly connected with a glass top cover; the etching unit is used for carrying out laser etching on the computer chip cooling fin; the accommodating unit is used for accommodating the computer chip cooling fin; the positioning unit is used for driving the etching unit to move according to the shape of an image needing to be etched; the positioning unit, the etching unit and the containing unit are all arranged at the top of the storage box, computer chip cooling fins needing to be etched need to be placed in the containing unit, and then the positioning unit drives the etching unit to move according to the shape needing to be etched. And meanwhile, the etching unit can generate high-voltage laser and etch the computer chip cooling fin.

Description

Technical Field

[0001] The invention relates to the technical field of laser etching, in particular to a fully automatic laser etching device for a computer chip heat sink. Background Art

[0002] With the rapid development of information technology, computer performance continues to improve, and the integration and computing speed of chips continue to increase, which causes a sharp increase in the heat generated by chips during operation. Computer chip heat sinks are key components to ensure the stable operation of chips. In the manufacturing process of heat sinks, etching technology plays a vital role. Traditional etching methods, such as chemical etching, have many disadvantages. The chemical reagents used in the chemical etching process not only pollute the environment, but also have limited etching accuracy, which makes it difficult to meet the increasingly sophisticated design requirements of today's computer chip heat sinks.

[0003] When the computer chip heat sink laser etching equipment is working, the liquid after the heat sink is melted by laser heating may flow or accumulate on the surface of the heat sink if it is not discharged or processed in time, changing the laser etching action area and energy distribution and causing the etched lines or patterns to deviate and deform, affecting the etching accuracy and quality. Summary of the invention

[0004] In view of the shortcomings of the prior art, the present invention adopts a technical solution to solve the technical problems: the fully automatic laser etching equipment for computer chip heat sinks of the present invention comprises a main box with support feet evenly arranged on the bottom, the outer surface of the main box is symmetrically provided with fixed blocks, the outer surface of the fixed block is rotatably connected to a support rod 1, and the end of the support rod 1 away from the fixed block is fixedly connected to a glass top cover, and further comprises: An etching unit for laser etching a computer chip heat sink, a holding unit for placing the computer chip heat sink, and a positioning unit for moving the etching unit according to the shape of the image to be etched; The positioning unit, etching unit and containing unit are all arranged on the top of the storage box; The holding unit comprises a central plate, the outer surface of which is fixedly connected to a controller, the outer surface of which is also provided with a servo motor 1, the output end of which is fixedly connected to a rotating shaft 1, the end of which away from the servo motor 1 is fixedly connected to a holding plate, the top of which is provided with four placement slots matching the size of a computer chip heat sink, the two ends of which are symmetrically provided with collecting mechanisms, the center of which is provided with a wind press capable of ejecting high-pressure gas, the top of which is provided with a heating device, and the two sides of which are symmetrically provided with air outlets; The wind compressor sucks in the protective gas and heats it, and then pressurizes the hot protective gas and sprays it toward the placement slot through the air outlet.

[0005] Preferably, the bottom of the center plate is fixedly connected to the top center of the main box, and the controller controls the servo motor.

[0006] Preferably, the collecting mechanism comprises a side box, the inner wall of the side box is provided with a collecting plate, the outer surface of the collecting plate is fixedly connected with a handle, two ends of the side box are symmetrically provided with a supporting plate 1, the outer surface of the supporting plate 1 is fixedly connected with a telescopic rod 1, the output end of the telescopic rod 1 is fixedly connected with a scraper, the side of the side box close to the wind compressor is provided with a micro motor, the output end of the micro motor is fixedly connected with a baffle plate with a liquid carrying surface provided on the surface; When the air compressor is working, the micro motor controls the baffle plate to rotate close to the placement slot.

[0007] Preferably, the etching unit includes a second support plate, the top of which is fixedly connected to a power supply system, a support column is also provided on the top of the second support plate, a laser generator is fixedly connected to the top of the support column, a beam transmission component is provided on the laser generator, a laser emission head is provided at the bottom of the beam transmission component, a focusing unit that can form a light spot with high energy density is also provided on the outer surface of the beam transmission component, and a cleaning mechanism for cleaning the focusing unit is also provided on the beam transmission component.

[0008] Preferably, the power supply system supplies a stable power supply to the laser generator through a wire and realizes a population inversion through an excitation medium, thereby generating a laser with a specific wavelength, power and pulse characteristics; The light beam transmission component is composed of optical elements such as reflectors, lenses, optical fibers, etc.

[0009] Preferably, the focusing unit includes side panels symmetrically arranged on the outer surface of the light beam transmission component, the bottom of the side panel is fixedly connected to a telescopic rod three, the output end of the telescopic rod three is fixedly connected to a support block, the outer surface of the support block on one side is rotatably connected to a rotating handle one, one end of the rotating handle one is fixedly connected to a supporting plate, a focusing lens is arranged on the supporting plate, and the outer surface of the support block on the other side is rotatably connected to a rotating handle two, the outer surface of the rotating handle two is provided with a support plate four, one end of the support plate four is fixedly connected to an optical sensor that can detect the energy intensity of the laser after passing through the focusing lens.

[0010] Preferably, the cleaning mechanism includes a support frame, a telescopic rod 2 is provided at the bottom of the support frame, the output end of the telescopic rod 2 is fixedly connected to a support plate 3, the outer surface of the support plate 3 is fixedly connected to a servo motor 2, the output end of the servo motor 2 is fixedly connected to a flexible plate, and the outer surface of the flexible plate is evenly provided with cleaning brush heads synthesized from nanofiber materials with strong adsorption capacity.

[0011] Preferably, the top of the support frame is fixedly connected to the outer surface of the light beam transmission component, and the outer surfaces of the side panels are fixedly connected to the two sides of the light beam transmission component.

[0012] Preferably, the positioning unit comprises a longitudinal motor, the output end of the longitudinal motor is fixedly connected to a reciprocating screw rod 1, the outer surface of the reciprocating screw rod 1 is threadedly connected to a moving block 1, and the top of the moving block 1 is fixedly connected to a transverse plate 1; The positioning unit also includes a guide rod arranged on the top of the main box and parallel to the reciprocating screw rod 1, the outer surface of the guide rod is slidably connected to the moving block 2, the top of the moving block 2 is fixedly connected to the transverse plate 2, the outer surface of the transverse plate 2 is fixedly connected to the transverse motor, the output end of the transverse motor is fixedly connected to the reciprocating screw rod 2, and the outer surface of the reciprocating screw rod 2 is threadedly connected to the moving block 3.

[0013] Preferably, the longitudinal motor is arranged on the outer surface of the main box, and the top of the moving block three is fixedly connected to the bottom of the supporting plate two.

[0014] The beneficial effects of the present invention are as follows: 1. The present invention sets a holding unit. During the etching process, the controller controls the servo motor to drive the rotating shaft and the holding plate to rotate according to the position of the computer chip heat sink, so that the end of the computer chip heat sink is tilted downward. Then the wind compressor absorbs the protective gas for pressurized heating and finally sprays it out from the air outlet. The generated high-pressure gas heat blows the molten metal liquid from the surface of the computer chip heat sink to the collecting mechanism, so that the liquid metal is finally condensed in the collecting mechanism, reducing the generation of defects. At the same time, the vaporized metal will also be blown to both sides to prevent the vaporized metal from floating into the etching unit and affecting the work of the focusing lens and other components.

[0015] 2. The present invention sets a collecting mechanism, and the micro motor drives the baffle plate to rotate to a state in contact with the downward inclined end of the holding plate, so that the molten metal blown by the air press flows to the liquid-carrying surface of the baffle plate. After the molten metal has completely flowed to the liquid-carrying surface, the heating device on the air press stops working, so that the temperature angle of the blown protective gas causes the molten metal to condense on the liquid-carrying surface. Then the micro motor drives the baffle plate to rotate to contact the liquid-carrying surface with a scraper, and then the telescopic rod contracts back, driving the scraper to scrape the condensed metal on the liquid-carrying surface onto the collecting plate.

[0016] 3. The present invention sets a focusing unit, and drives the carrier plate and the focusing lens to move up and down through the telescopic rod, so as to change the distance between the focusing lens and the laser emission head, thereby increasing or decreasing the intensity of the laser after passing through the focusing lens. At the same time, the optical sensor at the bottom can detect the intensity of the laser after passing through the focusing lens. If the laser intensity is always low, it means that the surface of the focusing lens has adsorbed tiny particles and dust generated during the etching process, resulting in increased laser energy loss and a gradual decrease in etching quality.

[0017] 4. The present invention sets a cleaning mechanism, and rotates the rotating handle 1 to rotate the carrier plate and the focusing lens 90 degrees. Then the telescopic rod 2 will extend and drive the flexible plate and the cleaning brush head to come into contact with the focusing lens. Then the servo motor 2 will drive the flexible plate and the cleaning brush head to rotate, thereby removing particles and dust on the surface of the focusing lens without scratching the surface of the optical element. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of the present invention.

[0019] Figure 2 It is a structural cross-sectional view of the present invention.

[0020] Figure 3 It is a structural schematic diagram of the containing unit of the present invention.

[0021] Figure 4 It is a structural cross-sectional view of the containing unit of the present invention.

[0022] Figure 5 It is a structural schematic diagram of the collecting mechanism of the present invention.

[0023] Figure 6 It is a partial structural schematic diagram of the collecting mechanism of the present invention.

[0024] Figure 7 It is a structural schematic diagram of the etching unit of the present invention.

[0025] Figure 8 It is a structural schematic diagram of the cleaning mechanism of the present invention.

[0026] Fig. 9 It is a schematic structural diagram of the focusing unit of the present invention.

[0027] Fig.10 It is a structural schematic diagram of the positioning unit of the present invention.

[0028] In the figure: 1, main box; 2, support foot; 3, storage box; 4, inner groove; 5, positioning unit; 6, etching unit; 7, holding unit; 8, operating table; 9, fixing block; 10, support rod 1; 11, glass top cover; 71, center plate; 72, controller; 73, servo motor 1; 74, rotating shaft 1; 75, holding plate; 76, placement slot; 77, collecting mechanism; 78, air compressor; 79, heating device; 710, air outlet; 771, side box; 772, collecting plate; 773, handle; 774, support plate 1; 775, telescopic rod 1; 776, scraper; 777, micro motor; 778, baffle plate; 779, liquid surface; 61, support plate 2; 62, power supply system; 63, support column; 64, laser generator; 65, laser head; 66, laser head; 67, laser head; 68, laser head; 69, laser head; 70, laser head; 710, laser head; 720, laser head; 730, laser head; 731, laser head; 732, laser head; 733, laser head; 734, laser head; 735, laser head; 736, laser head; 737, laser head; 738, laser head; 739, laser head; 740, laser head; 741, laser head; 742, laser head; 743, laser head; 744, laser head; 745, laser head; 746, laser head; 747, laser head; 748, laser head; 749, laser head; 750, laser head; 751, laser head; 752, laser head; 753, laser head; 7 5. Wire; 66. Beam transmission component; 67. Laser emission head; 68. Focusing unit; 69. Cleaning mechanism; 691. Support frame; 692. Telescopic rod 2; 693. Support plate 3; 694. Servo motor 2; 695. Flexible board; 696. Cleaning brush head; 681. Side board; 682. Telescopic rod 3; 683. Rotating handle 1; 684. Support block; 685. Loading plate; 686. Focusing lens; 687. Support plate 4; 688. Rotating handle 2; 689. Optical sensor; 51. Longitudinal motor; 52. Reciprocating screw rod 1; 53. Moving block 1; 54. Guide rod; 55. Moving block 2; 56. Transverse plate 2; 57. Transverse motor; 58. Reciprocating screw rod 2; 59. Moving block 3; 510. Transverse plate 1. DETAILED DESCRIPTION

[0029] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses. Example 1, using Figure 1-Figure 10 A fully automatic laser etching device for a computer chip heat sink according to an embodiment of the present invention is described as follows.

[0030] like Figure 1-Figure 2 As shown, a computer chip heat sink fully automatic laser etching equipment of the present invention comprises a main box 1 with support feet 2 evenly arranged on the bottom, a fixing block 9 symmetrically arranged on the outer surface of the main box 1, a support rod 10 rotatably connected to the outer surface of the fixing block 9, and a glass top cover 11 fixedly connected to the end of the support rod 10 away from the fixing block 9, an operating table 8 is arranged on the main box 1, and a storage box 3 evenly arranged with inner grooves 4 is fixedly connected to the side of the main box, and further comprises: An etching unit 6 for laser etching a computer chip heat sink, a holding unit 7 for placing the computer chip heat sink, and a positioning unit 5 for moving the etching unit 6 according to the shape of the image to be etched; The positioning unit 5, the etching unit 6 and the containing unit 7 are all arranged on the top of the main box 1; When the present invention is working, first, the computer chip heat sink to be etched needs to be placed in the containing unit 7, and then the positioning unit 5 will drive the etching unit 6 to move the shape to be etched, and at the same time, the etching unit 6 will generate high-voltage laser and etch the computer chip heat sink, and at the same time, the containing unit 7 will collect the molten metal liquid, thereby reducing the occurrence of etching defects.

[0031] like Figure 3-Figure 4 As shown, the holding unit 7 includes a central plate 71, a controller 72 is fixedly connected to the outer surface of the central plate 71, a servo motor 73 is also arranged on the outer surface of the central plate 71, a rotating shaft 74 is fixedly connected to the output end of the servo motor 73, a holding plate 75 is fixedly connected to the end of the rotating shaft 74 away from the servo motor 73, four placement slots 76 matching the size of the computer chip heat sink are arranged on the top of the holding plate 75, collecting mechanisms 77 are symmetrically arranged at both ends of the holding plate 75, a wind press 78 capable of spraying high-pressure gas is arranged in the center of the holding plate 75, a heating device 79 is arranged on the top of the wind press 78, and air outlets 710 are symmetrically arranged on both sides of the wind press 78; The air compressor 78 will suck in the protective gas and heat it, and then pressurize the hot protective gas and spray it toward the placement slot 76 through the air outlet 710.

[0032] When the computer chip heat sink placed on the placement groove 76 is laser-etched by the etching unit 6, the laser heating liquefies or vaporizes the heat sink. If the liquefied metal is not discharged or processed in time, it may flow or accumulate on the surface of the heat sink, changing the action area and energy distribution of the laser etching, which will cause the etched lines or patterns to deviate and deform, affecting the accuracy and quality of the etching. During the etching process, the controller 72 will control the servo motor 73 according to the position of the computer chip heat sink to drive the rotating shaft 74 and the holding plate 75 to rotate, so that the end of the computer chip heat sink is tilted downward, and then the air compressor 78 will absorb the protective gas for pressurized heating and finally spray it out from the air outlet 710. The generated high-pressure gas heat will blow the molten metal liquid from the surface of the computer chip heat sink to the collecting mechanism 77, so that the liquid metal will eventually condense in the collecting mechanism 77, reducing the generation of defects. At the same time, the vaporized metal will also be blown to both sides to prevent the vaporized metal from floating into the etching unit 6 and affecting the operation of the focusing lens 686 and other components.

[0033] The bottom of the center plate 71 is fixedly connected to the top center of the main box 1, and the controller 72 controls the servo motor 73.

[0034] like Figure 5-Figure 6 As shown, the collecting mechanism 77 includes a side box 771, the inner wall of the side box 771 is provided with a collecting plate 772, the outer surface of the collecting plate 772 is fixedly connected with a handle 773, the two ends of the side box 771 are symmetrically provided with a supporting plate 774, the outer surface of the supporting plate 774 is fixedly connected with a telescopic rod 775, the output end of the telescopic rod 775 is fixedly connected with a scraper 776, and the side of the side box 771 close to the air compressor 78 is provided with a micro motor 777, and the output end of the micro motor 777 is fixedly connected with a baffle plate 778 with a liquid carrier surface 779 on the surface; When the air compressor 78 is working, the micro motor 777 controls the baffle plate 778 to rotate close to the placement slot 76.

[0035] While the air press 78 is working, the micro motor 777 will drive the baffle plate 778 to rotate to a state in contact with the downward inclined end of the holding plate 75, so that the molten metal blown by the air press 78 flows to the liquid carrying surface 779 of the baffle plate 778. After the molten metal has all flowed to the liquid carrying surface 779, the heating device 79 on the air press 78 will stop working, so that the temperature angle of the blown protective gas will cause the molten metal to condense on the liquid carrying surface 779. Then the micro motor 777 drives the baffle plate 778 to rotate to the liquid carrying surface 779 so as to contact the scraper 776. Then the telescopic rod 775 retracts, driving the scraper 776 to scrape the condensed metal on the liquid carrying surface 779 into the collecting plate 772, so as to facilitate subsequent recycling.

[0036] The specific workflow is as follows: During operation, in the etching process, the controller 72 will control the servo motor 73 according to the position of the computer chip heat sink to drive the shaft 74 and the holding plate 75 to rotate, so that the end of the computer chip heat sink is tilted downward, and then the air compressor 78 will absorb the protective gas for pressurized heating and finally spray it out from the air outlet 710. The generated high-pressure gas heat will blow the molten metal liquid from the surface of the computer chip heat sink to the collecting mechanism 77, so that the liquid metal will eventually condense in the collecting mechanism 77. At the same time, the vaporized metal will also be blown to both sides to prevent the vaporized metal from floating into the etching unit 6 and affecting the operation of the focusing lens 686 and other components. When the air pressure is low, the micro motor 777 drives the baffle plate 778 to rotate to a state in which the downwardly inclined end of the holding plate 75 is in contact, so that the molten metal blown by the air press 78 flows to the liquid carrying surface 779 of the baffle plate 778. After the molten metal has completely flowed to the liquid carrying surface 779, the heating device 79 on the air press 78 stops working, so that the temperature of the blown protective gas is angled so that the molten metal condenses on the liquid carrying surface 779. Then the micro motor 777 drives the baffle plate 778 to rotate to the liquid carrying surface 779 and the scraper 776 contacts it. Then the telescopic rod 775 retracts, driving the scraper 776 to scrape the condensed metal on the liquid carrying surface 779 into the collecting plate 772.

[0037] Embodiment 2, use Figure 1-Figure 10 A fully automatic laser etching device for a computer chip heat sink according to an embodiment of the present invention is described as follows.

[0038] like Figure 7 As shown, a fully automatic laser etching device for a computer chip heat sink of the present invention is based on the first embodiment, and the etching unit 6 includes a support plate 61, the top of the support plate 61 is fixedly connected to a power supply system 62, the top of the support plate 61 is also provided with a support column 63, the top of the support column 63 is fixedly connected to a laser generator 64, the laser generator 64 is provided with a beam transmission component 66, the bottom of the beam transmission component 66 is provided with a laser emission head 67, the outer surface of the beam transmission component 66 is also provided with a focusing unit 68 that can form a high energy density light spot, and the beam transmission component 66 is also provided with a cleaning mechanism 69 for cleaning the focusing unit 68.

[0039] The power supply system 62 supplies a stable power supply to the laser generator 64 through the wire 65 and realizes the population inversion through the excitation medium, thereby generating a laser with a specific wavelength, power and pulse characteristics; The beam transmission assembly 66 is composed of optical elements such as reflectors, lenses, and optical fibers.

[0040] The laser generated by the laser generator 64 is emitted through the beam transmission component 66 and the laser emission head 67 and irradiated onto the computer chip, thereby etching a specific shape as the positioning unit 5 moves.

[0041] like Fig. 9 As shown, the focusing unit 68 includes a side panel 681 symmetrically arranged on the outer surface of the light beam transmission component 66, the bottom of the side panel 681 is fixedly connected with a telescopic rod three 682, the output end of the telescopic rod three 682 is fixedly connected with a support block 684, the outer surface of the support block 684 on one side is rotatably connected with a rotating handle one 683, one end of the rotating handle one 683 is fixedly connected with a supporting plate 685, and a focusing lens 686 is arranged on the supporting plate 685, and the outer surface of the support block 684 on the other side is rotatably connected with a rotating handle two 688, the outer surface of the rotating handle two 688 is provided with a support plate four 687, and one end of the support plate four 687 is fixedly connected with an optical sensor 689 that can detect the energy intensity of the laser after passing through the focusing lens 686.

[0042] Since the etching laser intensity required for metal heat sinks of different materials is different, the telescopic rod 3 682 can be used to drive the carrier plate 685 and the focusing lens 686 to move up and down, thereby changing the distance between the focusing lens 686 and the laser transmitter head 67, thereby increasing or decreasing the laser intensity after passing through the focusing lens 686. At the same time, the optical sensor 689 at the bottom can detect the laser intensity after passing through the focusing lens 686. If the laser intensity is always low, it means that the surface of the focusing lens 686 has adsorbed tiny particles and dust generated by the etching process, resulting in increased laser energy loss and a gradual decrease in etching quality.

[0043] like Figure 8 As shown, the cleaning mechanism 69 includes a support frame 691, a telescopic rod 2 692 is arranged at the bottom of the support frame 691, the output end of the telescopic rod 2 692 is fixedly connected to a support plate 3 693, the outer surface of the support plate 3 693 is fixedly connected to a servo motor 2 694, the output end of the servo motor 2 694 is fixedly connected to a flexible plate 695, and the outer surface of the flexible plate 695 is evenly provided with a cleaning brush head 696 synthesized from a nanofiber material with strong adsorption capacity.

[0044] After the optical sensor 689 can detect that the intensity of the laser after passing through the focusing lens 686 is always low, the equipment needs to be suspended. The staff will turn the rotating handle 1 683 to rotate the supporting plate 685 and the focusing lens 686 ninety degrees. Then the telescopic rod 2 692 will extend and drive the flexible plate 695 and the cleaning brush head 696 to come into contact with the focusing lens 686. Then the servo motor 2 694 will drive the flexible plate 695 and the cleaning brush head 696 to rotate, thereby removing the particles and dust on the surface of the focusing lens 686 without scratching the surface of the optical element.

[0045] The top of the support frame 691 is fixedly connected to the outer surface of the light beam transmission component 66 , and the outer surface of the side plate 681 is fixedly connected to the two sides of the light beam transmission component 66 .

[0046] The positioning unit 5 comprises a longitudinal motor 51, the output end of the longitudinal motor 51 is fixedly connected to a reciprocating screw rod 52, the outer surface of the reciprocating screw rod 52 is threadedly connected to a moving block 53, and the top of the moving block 53 is fixedly connected to a transverse plate 510; like Fig.10 As shown, the positioning unit 5 also includes a guide rod 54 arranged on the top of the main box 1 and parallel to the reciprocating screw rod 1 52, the outer surface of the guide rod 54 is slidably connected with a moving block 2 55, the top of the moving block 2 55 is fixedly connected with a transverse plate 2 56, the outer surface of the transverse plate 2 56 is fixedly connected with a transverse motor 57, the output end of the transverse motor 57 is fixedly connected with a reciprocating screw rod 2 58, and the outer surface of the reciprocating screw rod 2 58 is threadedly connected with a moving block 3 59.

[0047] The longitudinal motor 51 will drive the reciprocating screw rod 1 52 to rotate, thereby driving the moving block 1 53 and the moving block 2 55 to move along the direction of the guide rod 54, thereby controlling the longitudinal movement of the overall etching unit 6. The transverse unit will drive the reciprocating screw rod 2 58 to rotate, thereby driving the moving block 3 59 to move and control the longitudinal movement of the overall etching unit 6.

[0048] The longitudinal motor 51 is arranged on the outer surface of the main box 1 , and the top of the moving block 3 59 is fixedly connected to the bottom of the supporting plate 2 61 .

[0049] The specific workflow is as follows: During operation, the longitudinal motor 51 drives the reciprocating screw rod 1 52 to rotate, thereby driving the moving block 1 53 and the moving block 2 55 to move along the direction of the guide rod 54, thereby controlling the longitudinal movement of the entire etching unit 6. The transverse unit drives the reciprocating screw rod 2 58 to rotate, thereby driving the moving block 3 59 to move and control the longitudinal movement of the entire etching unit 6. After that, the laser generated by the laser generator 64 is emitted through the beam transmission component 66 and the laser emission head 67, and irradiates the computer chip, and the positioning unit 5 moves to etch out. Specific shape, after the optical sensor 689 can detect that the laser intensity after passing through the focusing lens 686 is always low, the equipment needs to be suspended, and the staff will turn the rotating handle 1 683 to rotate the supporting plate 685 and the focusing lens 686 ninety degrees, and then the telescopic rod 2 692 will extend and drive the flexible plate 695 and the cleaning brush head 696 to come into contact with the focusing lens 686, and then the servo motor 2 694 will drive the flexible plate 695 and the cleaning brush head 696 to rotate, thereby removing the particles and dust on the surface of the focusing lens 686.

[0050] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without creative work should fall within the scope of protection of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention are implemented according to the conventional means in the field unless otherwise specified and limited.

Claims

1. A fully automatic laser etching device for a computer chip heat sink, comprising a main box with support feet evenly arranged at the bottom, a fixing block symmetrically arranged on the outer surface of the main box, a support rod 1 rotatably connected to the outer surface of the fixing block, and a glass top cover fixedly connected to the end of the support rod 1 away from the fixing block, characterized in that: Also includes: An etching unit for laser etching a computer chip heat sink, a holding unit for placing the computer chip heat sink, and a positioning unit for moving the etching unit according to the shape of the image to be etched; The positioning unit, etching unit and containing unit are all arranged on the top of the storage box; The holding unit comprises a central plate, the outer surface of which is fixedly connected to a controller, the outer surface of which is also provided with a servo motor 1, the output end of which is fixedly connected to a rotating shaft 1, the end of which away from the servo motor 1 is fixedly connected to a holding plate, the top of which is provided with four placement slots matching the size of a computer chip heat sink, the two ends of which are symmetrically provided with collecting mechanisms, the center of which is provided with a wind press capable of ejecting high-pressure gas, the top of which is provided with a heating device, and the two sides of which are symmetrically provided with air outlets; The wind compressor sucks in the protective gas and heats it, and then pressurizes the hot protective gas and sprays it toward the placement slot through the air outlet.

2. The fully automatic laser etching equipment for computer chip heat sink according to claim 1, characterized in that: The bottom of the center plate is fixedly connected to the top center of the main box, and the controller controls the servo motor.

3. The fully automatic laser etching equipment for computer chip heat sink according to claim 1, characterized in that: The collecting mechanism comprises a side box, the inner wall of the side box is provided with a collecting plate, the outer surface of the collecting plate is fixedly connected with a handle, two ends of the side box are symmetrically provided with a supporting plate 1, the outer surface of the supporting plate 1 is fixedly connected with a telescopic rod 1, the output end of the telescopic rod 1 is fixedly connected with a scraper, a side of the side box close to the air compressor is provided with a micro motor, the output end of the micro motor is fixedly connected with a baffle plate with a liquid carrying surface provided on the surface; When the air compressor is working, the micro motor controls the baffle plate to rotate close to the placement slot.

4. The fully automatic laser etching equipment for computer chip heat sink according to claim 1, characterized in that: The etching unit includes a second support plate, the top of which is fixedly connected to a power supply system, a support column is also provided on the top of the second support plate, a laser generator is fixedly connected to the top of the support column, a beam transmission component is provided on the laser generator, a laser emission head is provided at the bottom of the beam transmission component, a focusing unit capable of forming a light spot with high energy density is also provided on the outer surface of the beam transmission component, and a cleaning mechanism for cleaning the focusing unit is also provided on the beam transmission component.

5. The fully automatic laser etching equipment for computer chip heat sink according to claim 4, characterized in that: The power supply system supplies stable power to the laser generator through the wire and realizes the particle number inversion through the excitation medium, thereby generating laser with specific wavelength, power and pulse characteristics; The light beam transmission component is composed of optical elements such as reflectors, lenses, optical fibers, etc.

6. The fully automatic laser etching equipment for computer chip heat sink according to claim 4, characterized in that: The focusing unit includes side panels symmetrically arranged on the outer surface of the light beam transmission component, the bottom of the side panel is fixedly connected to a telescopic rod three, the output end of the telescopic rod three is fixedly connected to a support block, the outer surface of the support block on one side is rotatably connected to a rotating handle one, one end of the rotating handle one is fixedly connected to a bearing plate, and a focusing lens is arranged on the bearing plate, and the outer surface of the support block on the other side is rotatably connected to a rotating handle two, the outer surface of the rotating handle two is provided with a support plate four, and one end of the support plate four is fixedly connected to an optical sensor that can detect the energy intensity of the laser after passing through the focusing lens.

7. The fully automatic laser etching equipment for computer chip heat sink according to claim 6, characterized in that: The cleaning mechanism includes a support frame, a telescopic rod 2 is arranged at the bottom of the support frame, the output end of the telescopic rod 2 is fixedly connected to a support plate 3, the outer surface of the support plate 3 is fixedly connected to a servo motor 2, the output end of the servo motor 2 is fixedly connected to a flexible plate, and the outer surface of the flexible plate is evenly provided with cleaning brush heads synthesized from nanofiber materials with strong adsorption capacity.

8. The fully automatic laser etching equipment for computer chip heat sink according to claim 7, characterized in that: The top of the support frame is fixedly connected to the outer surface of the light beam transmission component, and the outer surfaces of the side plates are fixedly connected to the two sides of the light beam transmission component.

9. The fully automatic laser etching equipment for computer chip heat sink according to claim 4, characterized in that: The positioning unit comprises a longitudinal motor, the output end of the longitudinal motor is fixedly connected to a reciprocating screw rod 1, the outer surface of the reciprocating screw rod 1 is threadedly connected to a moving block 1, and the top of the moving block 1 is fixedly connected to a transverse plate 1; The positioning unit also includes a guide rod arranged on the top of the main box and parallel to the reciprocating screw rod 1, the outer surface of the guide rod is slidably connected to the moving block 2, the top of the moving block 2 is fixedly connected to the transverse plate 2, the outer surface of the transverse plate 2 is fixedly connected to the transverse motor, the output end of the transverse motor is fixedly connected to the reciprocating screw rod 2, and the outer surface of the reciprocating screw rod 2 is threadedly connected to the moving block 3.

10. The fully automatic laser etching equipment for computer chip heat sink according to claim 9, characterized in that: The longitudinal motor is arranged on the outer surface of the main box, and the top of the moving block three is fixedly connected to the bottom of the supporting plate two.

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