Mold assembly and electronic equipment glue pouring method

Abstract

The embodiment of the invention provides a mold assembly and an electronic equipment glue pouring method. The mold assembly comprises a first matching piece and a second matching piece; the first matching piece and the second matching piece define a first cavity, at least one of the first matching piece and the second matching piece has elasticity, so that the mold assembly has a trend of recovering from a first state to a second state, and in the first state, the first matching piece and the second matching piece are separated to form an opening communicated with the first cavity; in the second state, the first matching piece abuts against the second matching piece to block the first cavity; the opening is used for glue pouring, and the first cavity is used for containing electronic equipment to be subjected to glue pouring. According to the invention, the first state is recovered to the second state after the glue filling is finished by virtue of the elastic force action of the matching part, so that the first cavity becomes a closed cavity, that is, the mold assembly after the glue filling is finished does not have a glue inlet, the post-processing procedure of grinding and polishing is avoided, the process complexity is reduced, and the product manufacturing efficiency is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of injection molding, and specifically relates to a mold assembly and a method for glue filling of electronic equipment. Background Art

[0002] Smart rings are a type of smart wearable electronic device that has emerged in the market in recent years. They have multiple functions such as health management, motion detection, and communication. The glue pouring process is used for injection molding of smart rings, and its process quality has a great impact on the product yield.

[0003] The conventional smart ring glue pouring process includes the mold dripping process, which is to pour the mixed dripping glue into the mold cavity from the glue inlet, and then form a product by baking or standing to cure, and then cool it down.

[0004] In conventional technology, since the mold has a glue inlet, the product needs to be ground, polished and chamfered before solidification and molding to reduce the roughness of the surface of the product glue inlet, which increases the process complexity to a certain extent and thus reduces the product manufacturing efficiency. Summary of the invention

[0005] The purpose of the embodiments of the present application is to provide a mold assembly and a method for filling glue in an electronic device, which can solve the problem that when using a conventional mold for filling glue, the surface of the glue inlet needs to be ground and polished, which makes the process more complicated.

[0006] In order to solve the above technical problems, this application is implemented as follows:

[0007] The embodiment of the present application provides a mold assembly, including a first matching piece and a second matching piece;

[0008] The first matching piece and the second matching piece are arranged to form a first cavity, and at least one of the first matching piece and the second matching piece is elastic, so that the mold assembly has a tendency to recover from a first state to a second state, the first state is a state in which the first matching piece is at least partially separated from the second matching piece to form an opening communicating with the first cavity, and the second state is a state in which the first matching piece is in contact with the second matching piece to block the first cavity;

[0009] The opening is used for glue filling, and the first cavity is used for accommodating the electronic device to be glue filled.

[0010] Optionally, the first matching member includes a supporting portion and an elastic portion connected to each other;

[0011] The support portion and the second matching piece are arranged to form the first cavity. The first state is a state in which the elastic portion is at least partially separated from the second matching piece. The second state is a state in which the elastic portion is in contact with the second matching piece.

[0012] Optionally, the mold assembly further includes a fixing seat and a sealing cover;

[0013] The fixing seat and the sealing cover are buckled and connected to form a second cavity, the first fitting member and the second fitting member are located in the second cavity, the sealing cover has a first through hole, and along the axial direction of the first through hole, the projection of the elastic part is located in the first through hole.

[0014] Optionally, the mold assembly further comprises a core;

[0015] The support portion has a second through hole, the core body is fixed in the first through hole and the second through hole, and is connected to the fixing seat. Along the axial direction of the first through hole, the core body and the fixing seat are coaxial.

[0016] Optionally, the mold assembly further comprises a first fastener;

[0017] The fixing seat is provided with a third through hole, and the first fastener is passed through and fixed in the third through hole and is threadedly connected with the core body.

[0018] Optionally, the core comprises a core body and an elastic mechanism connected to each other;

[0019] The core body is inserted and fixed in the first through hole and the second through hole. The elastic mechanism is located in the second through hole and abuts against the support portion. The support portion is elastic.

[0020] Optionally, the elastic mechanism includes a connecting column and a top ball;

[0021] One end of the connecting column is connected to the core body, and the other end is elastically connected to the top ball, and the top ball abuts against the supporting part.

[0022] Optionally, the support portion includes a support plate and a support cylinder;

[0023] The support plate is fixed to the outer circumference of the support tube, an annular mounting groove is formed between the support plate and the support tube, the support tube is provided with the second through hole along the axial direction, and the elastic part is fixed to the outer circumference of the support tube.

[0024] Optionally, the mold assembly further includes a positioning member;

[0025] The sealing cover is provided with a positioning hole, and the positioning member is connected to the fixing seat and fixed in the positioning hole.

[0026] Optionally, the mold assembly further comprises a second fastener;

[0027] The fixing seat is provided with a first threaded hole, the sealing cover is provided with a second threaded hole, and the second fastener is passed through and fixed in the first threaded hole and the second threaded hole.

[0028] The embodiment of the present application also provides a method for filling glue in an electronic device, the method being applied to a mold assembly, the mold assembly comprising a first matching piece and a second matching piece, the first matching piece and the second matching piece being arranged to form a first cavity, at least one of the first matching piece and the second matching piece being elastic, the method comprising:

[0029] separating at least a portion of the first fitting from the second fitting to form an opening communicating with the first cavity;

[0030] After the glue is poured from the opening, a vacuum degassing process is performed.

[0031] Optionally, the mold assembly further includes a fixing seat, a sealing cover, a core body and a first fastener, the fixing seat and the sealing cover are buckled and connected to form a second cavity, the first matching piece and the second matching piece are located in the second cavity, the sealing cover has a first through hole, the first matching piece includes a supporting portion and an elastic portion connected to each other, the supporting portion has a second through hole, the core body includes a core body and an elastic mechanism connected to each other, the elastic mechanism includes a connecting column and a top ball, one end of the connecting column is connected to the core body, and the other end is elastically connected to the top ball, and the method further includes:

[0032] The core body is inserted and fixed in the first through hole and the second through hole, so that the top ball abuts against the charging component of the electronic device through the support part, and the core body is fixed concentrically with the fixing seat by the first fastener;

[0033] The mold assembly and the electronic device are cured as a whole.

[0034] In the mold assembly provided by the embodiment of the present application, at least one of the first mating piece and the second mating piece is elastic. The first mating piece and the second mating piece are in contact and attached to form a first cavity, and the first cavity is used to accommodate the semi-finished electronic device to be glued. Before the glue filling begins, when an external force is applied to the first mating piece and / or the second mating piece so that the first mating piece is at least partially separated from the second mating piece, an opening connected to the first cavity is formed between the first mating piece and the second mating piece, and glue can be poured through the opening at this time, and the glue is injected into the first cavity from the opening and adhered to the surface of the electronic device. After the glue filling is completed, the external force is removed, and the first mating piece and the second mating piece restore their deformation under the action of elastic force, and the first mating piece and the second mating piece abut to block the first cavity. That is, the first cavity after the glue filling is completed is a closed cavity, and at this time, the mold assembly does not have a glue inlet, which avoids the glue overflowing at the glue inlet and the need for post-processing steps of grinding and polishing or chamfering and polishing, thereby reducing the process complexity and improving the product manufacturing efficiency.

[0035] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0037] Figure 1 It is a schematic diagram of the overall structure of the mold assembly provided in the embodiment of the present application;

[0038] Figure 2 is an internal cross-sectional view of the mold assembly structure provided in an embodiment of the present application;

[0039] Figure 3 is a schematic diagram of the structure of the first matching member in an embodiment of the present application;

[0040] Figure 4 is a schematic diagram of the first matching member and the second matching member in the embodiment of the present application when they are in the second state;

[0041] Figure 5 is a schematic diagram of the first matching member and the second matching member in the embodiment of the present application when they are in the first state;

[0042] Figure 6 In the embodiment of this application Figure 3 A cross-sectional view of

[0043] Figure 7 It is a schematic diagram of a part of the core structure in an embodiment of the present application;

[0044] Figure 8 is a cross-sectional view of the core structure in an embodiment of the present application;

[0045] Fig. 9 It is a schematic diagram of the process flow of the electronic device glue filling method provided in the embodiment of the present application.

[0046] Description of reference numerals:

[0047] 1. first matching piece, 11. supporting part, 110. second through hole, 111. supporting plate, 112. supporting cylinder, 113. annular mounting groove, 12. elastic part, 13. first cavity, 2. second matching piece, 3. fixing seat, 31. second cavity, 32. third through hole, 4. sealing cover, 41. first through hole, 42. positioning hole, 43. second threaded hole, 5. core, 51. core body, 510. mounting hole, 511. core plate, 5111. first connecting part, 5112. second connecting part, 512. core column, 513. third fastener, 52. elastic mechanism, 521. connecting column, 522. top ball, 6. first fastener, 7. positioning piece, 8. second fastener, 9. electronic device, 91. charging component. DETAILED DESCRIPTION

[0048] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0049] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0050] The mold assembly and the method for filling glue for electronic equipment provided in the embodiments of the present application are described in detail below with reference to the accompanying drawings through specific embodiments and their application scenarios.

[0051] In the first embodiment, referring to Figure 1 to Figure 2, an embodiment of the present application provides a mold assembly, including a first mating piece 1 and a second mating piece 2; the first mating piece 1 and the second mating piece 2 are arranged to form a first cavity 13, at least one of the first mating piece 1 and the second mating piece 2 has elasticity, so that the mold assembly has a tendency to recover from a first state to a second state, the first state is a state when the first mating piece 1 is at least partially separated from the second mating piece 2 to form an opening connected to the first cavity 13, and the second state is a state when the first mating piece 1 and the second mating piece 2 are abutted to block the first cavity 13; the opening is used for glue filling, and the first cavity 13 is used to accommodate an electronic device 9 to be glued.

[0052] Specifically, if Figure 2 and Figure 3 As shown, the mold assembly includes a first fitting part 1 and a second fitting part 2, and the first fitting part 1 and the second fitting part 2 can be connected separately or formed into an integral part by injection molding process. The first fitting part 1 and the second fitting part 2 are at least partially in contact and attached to each other to enclose and form a first cavity 13, which is used to accommodate the electronic device 9 to be filled with glue, such as a semi-finished smart ring. At least one of the first fitting part 1 and the second fitting part 2 is elastic, and is more likely to deform under external force conditions and has a certain plasticity, and can restore the deformation under the action of elastic force after the external force is removed. The material includes but is not limited to silicone, plastic, rubber or polyurethane, wherein the plastic can be polyvinyl chloride or polypropylene, and the rubber can be natural rubber, butadiene rubber or styrene-butadiene rubber. By way of example, at least one of the first fitting part 1 and the second fitting part 2 of this embodiment is made of silicone material, which has stable chemical properties, strong plasticity, good elasticity and hardness, and is resistant to high temperatures to meet the temperature requirements of baking molding. The first fitting part 1 is in contact with one part of the second fitting part 2, and the other part of the first fitting part 1 and the second fitting part 2 can change their state through elastic deformation: the first state is that when subjected to external force, the other part of the first fitting part 1 and the second fitting part 2 are separated, and an opening is formed between the first fitting part 1 and the second fitting part 2, and this opening is connected to the first cavity 13, that is, the deformation state of the mold assembly; the second state is that when there is no external force or the external force is withdrawn, the first fitting part and / or the second fitting part 2 rely on their own elastic force to restore the deformation, so that the first fitting part abuts against the second fitting part 2, and then the opening is closed to block the first cavity 13, that is, the initial undeformed state of the mold assembly. It should be noted that the shape and appearance shell of the first fitting part 1 and the second fitting part 2 of this embodiment are designed accordingly according to the sizes of different smart ring products, and can be compatible with ring products of different models and specifications.

[0053] By using the mold assembly provided in the embodiment of the present application, when the first mating part and / or the second mating part are deformed, an opening is formed between the two to facilitate glue pouring; when the first mating part and / or the second mating part recover their deformation, the first mating part and / or the second mating part abut against each other to make the first cavity a closed cavity. Then, after the glue pouring is completed, there is no exposed glue inlet in the mold assembly, which avoids glue overflowing from the glue inlet and requiring post-processing steps such as grinding and polishing or chamfering and polishing, thereby reducing the process complexity and improving product manufacturing efficiency.

[0054] In the second embodiment, referring to Figures 2 to 5 The first fitting part 1 includes a supporting portion 11 and an elastic portion 12 that are connected to each other; the supporting portion 11 and the second fitting part 2 are arranged to form the first cavity 13, the first state is a state when the elastic portion 12 is at least partially separated from the second fitting part 2, and the second state is a state when the elastic portion 12 is in contact with the second fitting part 2.

[0055] Specifically, if Figure 2 and Figure 3 As shown, in this embodiment, the elastic part 12 of the first fitting part 1 is elastic. For example, the elastic part 12 of this embodiment is made of silicone material, and the mold assembly is restored from the first state to the second state by means of elastic restoring force. The first fitting part 1 includes a supporting part 11 and an elastic part 12 that are connected to each other. The supporting part 11 has a rigid supporting function for the whole composed of the first fitting part 1 and the second fitting part 2. The elastic part 12 can be integrally injection molded with the supporting part 11 or mechanically connected after separate processing. And the surface of the elastic part 12 facing the first cavity 13 is a plane, which is convenient for flattening the glue in the first cavity 13 and reducing the surface roughness of the product. The upper ends of the first fitting part 1 and the second fitting part 2 are flat and pressed tightly, which is convenient for processing and positioning.

[0056] The initial state of the elastic portion 12 is as follows Figure 4 As shown, the elastic part 12 is in contact with the second matching part 2, and the first cavity 13 is in a closed state. Before the glue filling starts, an external force is applied to the elastic part 12 by manual operation or with the help of a machine to separate it from the second matching part 2, so that an opening is formed between the elastic part 12 and the second matching part 2, and the opening is connected to the first cavity 13, that is, the elastic part 12 is deformed, and the mold assembly changes from the second state to the first state, as shown in FIG. Figures 4 to 5 Schematic diagram. For example, the compressible elastic part 12 causes the elastic part 12 to be squeezed and separated from the second matching part 2; or the elastic part 12 is deformed away from the second matching part 2 and separated from the second matching part 2 through the negative pressure suction; or the elastic part 12 is propped open by a tool. At this time, AB glue (two-component mixed curing adhesive) can be injected into the first cavity 13 from the opening until the AB glue fills the first cavity 13 and is bonded to the surface of the electronic device 9 to be formed. After the glue is poured, the external force is removed, such as Figure 5 to Figure 4 During the change process, the mold assembly recovers from the first state to the second state, that is, the elastic part 12 recovers its deformation under the action of elastic force, and the elastic part 12 abuts against the second matching part 2 to block the first cavity 13, so that the first cavity 13 is a closed cavity at this time. Therefore, by designing the elastic part 12 on the first matching part 1, the elastic restoring force of the elastic part 12 makes the mold assembly have no sprue after the glue filling is completed.

[0057] Based on the second embodiment, refer to Figure 2 The mold assembly also includes a fixing seat 3 and a sealing cover 4; the fixing seat 3 and the sealing cover 4 are snap-fitted together to form a second cavity 31, the first fitting part 1 and the second fitting part 2 are located in the second cavity 31, and the sealing cover 4 has a first through hole 41, and along the axial direction of the first through hole 41, the projection of the elastic part 12 is located in the first through hole 41.

[0058] Specifically, if Figure 2 As shown, the first mating part 1 and the second mating part 2 are molds for glue pouring and molding, and are made of a softer flexible material such as silicone. The fixing seat 3 and the sealing cover 4 are fastening molds, and are made of a harder rigid material including but not limited to tool steel, aluminum alloy, copper alloy or ceramic. The fixing seat 3 and the sealing cover 4 are snap-fitted and connected to form a second cavity 31 therebetween. Exemplarily, the fixing seat 3 and the sealing cover 4 can be fastened by means of a snap connection, a mortise and tenon connection or a bolt connection. The first mating part 1 and the second mating part 2 are located in the second cavity 31, and the fixing seat 3 is used to fix the first mating part 1, and the sealing cover 4 is used to press the second mating part 2, that is, the fixing seat 3 and the sealing cover 4 play a role of pressing and fixing the first mating part 1 and the second mating part 2 to avoid displacement and shaking of the first mating part 1 or the second mating part 2 during the glue pouring process. A first through hole 41 is provided on the sealing cover 4, as shown Figure 2 As shown, along the axial Z direction of the first through hole 41, the projection of the elastic part 12 is located inside the first through hole 41, that is, after the sealing cover 4 is installed, the first through hole 41 avoids the position of the elastic part 12, which is convenient for stretching the elastic part 12 for glue pouring. It should be noted that during the assembly process, the first matching piece 1, the second matching piece 2 and the electronic device 9 are first installed in the fixing seat 3 as a whole, and then the sealing cover 4 and the fixing seat 3 are locked and fixed, and then the glue pouring operation is performed.

[0059] Based on the second embodiment, refer to Figure 2 , Figure 7 and Figure 8 The mold assembly of this embodiment also includes a core body 5; the support portion 11 has a second through hole 110, the core body 5 is penetrated and fixed in the first through hole 41 and the second through hole 110, and is connected to the fixing seat 3, along the axial direction of the first through hole 41, the core body 5 and the fixing seat 3 are coaxial.

[0060] Specifically, if Figure 2 , Figure 7 and Figure 8 As shown, the support portion 11 has a second through hole 110, and the second through hole 110 is coaxial with the first through hole 41 of the sealing cover 4. The core 5 is inserted and fixed in the first through hole 41 and the second through hole 110, and is connected to the fixing seat 3, and the core 5 is coaxial with the fixing seat 3, and the core 5 is crimped on the upper ends of the first fitting 1 and the second fitting 2. After the glue filling is completed, the core 5 is installed to correct the relative position of the first fitting 1 and the second fitting 2 in the second cavity 31, and to compensate for the slight shaking of the first fitting 1 and the second fitting 2 during the glue filling process. Through the coaxial positioning of the core 5 and the fixing seat 3, the glue is evenly distributed on the surface of the product, that is, the glue filling surface is concentric with the product shell, so as to improve the glue filling molding quality and product yield. It should be noted that the core 5 and the fixing seat 3 can be fixed by plugging or positioned and locked by fasteners.

[0061] Based on the second embodiment, refer to Figure 2 On the basis of the embodiment in which the mold assembly includes a core body 5, the mold assembly also includes a first fastener 6; the fixing seat 3 is provided with a third through hole 32, the first fastener 6 is passed through and fixed in the third through hole 32, and is threadedly connected to the core body 5.

[0062] Specifically, if Figure 2 As shown, in this embodiment, fasteners are used to position and lock the core body 5 and the fixing seat 3. The fixing seat 3 is provided with a third through hole 32, and the core body 5 is provided with a mounting hole 510. The first fastener 6 is passed through and fixed in the third through hole 32 and the mounting hole 510, and the first fastener 6 is threadedly connected with the fixing seat 3 and the core body 5. That is, by passing and fixing the first fastener 6 between the fixing seat 3 and the core body 5, the core body 5 and the fixing seat 3 are coaxially arranged, which is convenient for the concentricity control of the glue pouring. The third through hole 32 and the mounting hole 510 have internal threads, and the first fastener 6 has external threads, which can be bolts, screws or pins.

[0063] Based on the second embodiment, refer to Figure 2 , Figure 7 and Figure 8 On the basis of an embodiment in which the mold assembly includes a core body 5, the core body 5 includes a core body 51 and an elastic mechanism 52 that are interconnected; the core body 51 is penetrated and fixed in the first through hole 41 and the second through hole 110, the elastic mechanism 52 is located in the second through hole 110 and abuts against the support portion 11, and the support portion 11 is elastic.

[0064] Specifically, if Figure 2 , Figure 7 and Figure 8As shown, the core 5 includes a core body 51 and an elastic mechanism 52. The core body 51 includes a core disc 511 and a core column 512, and the core disc 511 and the core column 512 are locked and fixed by a third fastener 513. The core body 51 is passed through and fixed in the first through hole 41 and the second through hole 110. The core disc 511 includes a first connecting portion 5111 and a second connecting portion 5112, and the outer diameter of the first connecting portion 5111 is larger than the outer diameter of the second connecting portion 5112. The outer diameter of the first connecting portion 5111 is slightly smaller than the aperture of the first through hole 41 and larger than the inner diameter of the second matching member 2, and the outer diameter of the second connecting portion 5112 is slightly smaller than the inner diameter of the second matching member 2, as shown in FIG. Figure 2 As shown, the surface of the first connecting portion 5111 along the negative Z direction is pressed against the surface of the second matching piece 2 along the positive Z direction. A through mounting hole 510 is provided on the core column 512, and the third fastener 513 is fixed to the upper end of the mounting hole 510, and the first fastener 6 is fixed to the lower end. The elastic mechanism 52 is located in the second through hole 110 and is connected to the core column 512. After the core 5 is assembled, the elastic mechanism 52 abuts against the support portion 11 by its own elastic force. The support portion 11 and the elastic portion 12 in this embodiment are integrally injection molded. The elastic and flexible support portion 11 is deformed to press against the charging component 91 of the electronic device 9, such as the charging column, and the glue that flows to the surface of the charging component 91 during the glue filling process is squeezed and dispersed to avoid the glue covering the surface of the charging component 91 and affecting the charging function of the electronic device, that is, to avoid glue overflow. In this embodiment, the support portion 11 and the elastic portion 12 are processed by an integrated molding process to form the first matching piece 1, and the silicone material is used.

[0065] Based on the second embodiment, refer to Figure 2 , Figure 7 and Figure 8 On the basis of an embodiment in which the core 5 includes a core body 51 and an elastic mechanism 52, the elastic mechanism 52 includes a connecting column 521 and a top ball 522; one end of the connecting column 521 is connected to the core body 51, and the other end is elastically connected to the top ball 522, and the top ball 522 abuts against the support portion 11.

[0066] Specifically, if Figure 2 , Figure 7 and Figure 8 As shown, the elastic mechanism 52 includes a connecting column 521 and a top ball 522. One end of the connecting column 521 is connected to the core column 512, and the other end is elastically connected to the top ball 522. The top ball 522 abuts against the support portion 11 under the action of elastic force, and squeezes the charging component 91 of the electronic device 9 through the support portion 11. In this embodiment, the connecting column 521 and the top ball 522 are connected by a spring.

[0067] Based on the second embodiment, refer to Figure 3 and Figure 6The support portion 11 includes a support plate 111 and a support tube 112; the support plate 111 is fixed to the outer periphery of the support tube 112, and an annular mounting groove 113 is formed between the support plate 111 and the support tube 112. The support tube 112 is axially provided with the second through hole 110, and the elastic portion 12 is fixed to the outer periphery of the support tube 112.

[0068] Specifically, if Figure 3 and Figure 6 As shown, the support disc 111 is integrally sleeved on the outer periphery of the support tube 112, and an annular mounting groove 113 is formed between the inner periphery of the support disc 111 and the outer periphery of the support tube 112. The annular mounting groove 113 is located at the bottom of the first cavity 13 and is used to fix the electronic device 9. The second through hole 110 is provided on the support tube 112, the elastic part 12 is fixed to the outer periphery of the support tube 112, and the elastic part 12 and the support disc 111 are distributed along the axial direction of the support tube 112. In addition, the second fitting 2 is annular, and its lower end is located on the end face of the support disc 111, and its side surface is in contact with the elastic part 12, so that the first cavity 13 is formed between the second fitting 2 and the first fitting 1. The size and shape of the annular mounting groove 113 are determined according to the appearance size of the smart ring, and have a profiling feature, and the interior is a mirror-like high-gloss surface, which is convenient for glue injection molding.

[0069] Based on the second embodiment, refer to Figure 2 The mold assembly further includes a positioning member 7 ; a positioning hole 42 is formed on the sealing cover 4 , and the positioning member 7 is connected to the fixing seat 3 and fixed in the positioning hole 42 .

[0070] Specifically, if Figure 2 As shown, the positioning member 7 is a positioning pin or a positioning screw, one end of the positioning member 7 is fixed on the fixing seat 3, and the other end is passed through the positioning hole 42 fixed on the sealing cover 4. The structural positioning between the positioning member 7 and the positioning hole 42 realizes accurate positioning and foolproofing between the fixing seat 3 and the sealing cover 4. In this embodiment, two positioning members 7 are arranged along the circumference of the fixing seat 3, and two positioning holes 42 are arranged at corresponding positions on the sealing cover 4.

[0071] Based on the second embodiment, refer to Figure 2 The mold assembly also includes a second fastener 8; a first threaded hole is opened on the fixing seat 3, and a second threaded hole 43 is opened on the sealing cover 4, and the second fastener 8 is passed through and fixed in the first threaded hole and the second threaded hole 43.

[0072] Specifically, if Figure 2As shown, the fixing seat 3 is provided with two first threaded holes along the circumferential direction, the sealing cover 4 is provided with two second threaded holes 43 at corresponding positions along the circumferential direction, and the second fastener 8 has external threads. After the fixing seat 3 and the sealing cover 4 are precisely positioned by the positioning member 7, the second fastener 8 is inserted and fixed in the first threaded hole and the second threaded hole 43, and the fixing seat 3 and the sealing cover 4 are locked and fixed.

[0073] In the third embodiment, referring to Fig. 9 The present application also provides a method for filling glue in an electronic device, and the specific steps are as follows:

[0074] S1. Weigh the AB glue ratio, mix and stir evenly, degas the glue, and check the cleanliness of the mold components.

[0075] Specifically, before the glue filling begins, first, take out the electronic device to be filled with glue, such as a semi-finished smart ring, which has been wrapped and affixed with a protective film or evenly coated with lubricating isolation grease. Second, prepare AB glue, that is, weigh the AB glue ratio and mix it evenly, and then degas the glue for 3-5 minutes. Third, check the cleanliness of the mold assembly and check the internal high-gloss surface of the annular mounting groove 113 of the first mating part 1.

[0076] S2, fixing the electronic device 9 to be glued in the first cavity 13 between the first matching component 1 and the second matching component 2 to form an inner mold mechanism.

[0077] Specifically, the first matching piece 1 is a silicone lower mold, and the second matching piece 2 is a silicone upper mold. Figure 6 As shown, the electronic device to be glued, such as a semi-finished smart ring, is loaded into the annular mounting groove 113 of the first mating component 1, and then the second mating component 2 is installed on the first mating component 1, and a first cavity 13 for accommodating the semi-finished smart ring is formed between the second mating components 2.

[0078] S3, insert the inner mold mechanism into the fixing seat 3, and snap-fit ​​the sealing cover 4 to the fixing seat 3.

[0079] Specifically, the inner mold mechanism formed by the first matching piece 1, the second matching piece 2 and the semi-finished smart ring is installed in the fixing seat 3, and after the positioning hole 42 on the sealing cover 4 is aligned with the positioning piece 7 on the fixing seat 3, the sealing cover 4 and the fixing seat 3 are positioned and installed. That is, the first matching piece 1 and the second matching piece 2 are located in the second cavity 31 formed by the buckled connection between the fixing seat 3 and the sealing cover 4. Then, the second fastener 8 is locked and fixed between the first threaded hole on the fixing seat 3 and the second threaded hole 43 on the sealing cover 4, so as to achieve a tight assembly between the sealing cover 4 and the fixing seat 3.

[0080] S4. Separate at least a portion of the first matching piece 1 from the second matching piece 2 to form an opening communicating with the first cavity 13 .

[0081] Specifically, at least one of the first matching piece 1 and the second matching piece 2 is elastic. In this embodiment, the elastic portion 12 of the first matching piece 1 is elastic, and an external force is applied to the elastic portion 12, so that the elastic portion 12 is deformed and separated from the second matching piece 2, and an opening is formed between the elastic portion 12 and the second matching piece 2, and the opening is connected to the first cavity 13.

[0082] S5. After the glue is poured from the opening, vacuum degassing treatment is performed.

[0083] Specifically, glue is poured into the first cavity 13 from the opening and bonded to the surface of the semi-finished smart ring to be formed. After the glue is poured, vacuum degassing is performed 3-5 times under a pressure of 0.1 MPa, each time for 50-70 seconds. Then check for bubbles and let it stand for 5-10 minutes under standard atmospheric pressure.

[0084] S6. Fix the core body 5 in the first through hole 41 and the second through hole 110 so that the top bead 522 abuts against the charging component 91 of the electronic device 9 through the support portion 11, and fix the core body 5 and the fixing seat 3 concentrically through the first fastener 6.

[0085] Specifically, the sealing cover 4 has a first through hole 41, the first matching piece 1 includes a supporting portion 11 and an elastic portion 12 connected to each other, the supporting portion 11 has a second through hole 110, the core 5 includes a core body 51 and an elastic mechanism 52 connected to each other, the elastic mechanism 52 includes a connecting column 521 and a top ball 522, one end of the connecting column 521 is connected to the core body 51, and the other end is elastically connected to the top ball 522. The core 5 is inserted and fixed in the first through hole 41 of the sealing cover 4 and the second through hole 110 of the first matching piece 1 until the top ball 522 of the core 5 is aligned with the charging component position, so that the top ball 522 abuts against the charging component 91 of the electronic device 9 through the supporting portion 11 of the first matching piece 1. The core 5 is concentrically locked and fixed to the fixing seat 3 by the first fastener 6.

[0086] S7, curing the mold assembly and the electronic device as a whole.

[0087] Specifically, the mold assembly and the glue-filled electronic device are cured as a whole, and the curing process includes but is not limited to thermal curing or room temperature curing. In this embodiment, thermal curing is used, and the temperature is controlled at 50°C-70°C for 2-2.5 hours. Then, the mold assembly is taken out and cooled to room temperature.

[0088] S8. Disassemble the mold assembly and take out the electronic device molded by glue.

[0089] Specifically, loosen the second fastener 8 and the first fastener 6, remove the sealing cover 4 and the second matching member 2, take out the glue-filled smart ring, and perform a product appearance inspection.

[0090] The method for filling glue for electronic devices provided in the embodiment of the present application avoids the process of grinding and polishing the glue inlet, avoids the problem of glue overflow near the charging column, and achieves concentricity between the glue filling surface and the product casing, thereby improving the glue filling quality and product yield.

[0091] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0092] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A mold assembly, characterized in that: It comprises a first matching piece (1) and a second matching piece (2); The first matching piece (1) and the second matching piece (2) are arranged to form a first cavity (13); at least one of the first matching piece (1) and the second matching piece (2) is elastic, so that the mold assembly has a tendency to recover from a first state to a second state; the first state is a state in which the first matching piece (1) is at least partially separated from the second matching piece (2) to form an opening communicating with the first cavity (13); and the second state is a state in which the first matching piece (1) and the second matching piece (2) are in contact to block the first cavity (13); The opening is used for glue pouring, and the first cavity (13) is used to accommodate the electronic device (9) to be poured with glue.

2. The mold assembly according to claim 1, characterized in that: The first matching member (1) comprises a supporting portion (11) and an elastic portion (12) which are connected to each other; The support portion (11) and the second matching piece (2) are arranged to form the first cavity (13); the first state is a state in which the elastic portion (12) is at least partially separated from the second matching piece (2); and the second state is a state in which the elastic portion (12) is in contact with the second matching piece (2).

3. The mold assembly according to claim 2, characterized in that: The mold assembly also includes a fixing seat (3) and a sealing cover (4); The fixing seat (3) and the sealing cover (4) are snap-fitted together to form a second cavity (31); the first fitting member (1) and the second fitting member (2) are located in the second cavity (31); the sealing cover (4) has a first through hole (41); and along the axial direction of the first through hole (41), the projection of the elastic portion (12) is located in the first through hole (41).

4. The mold assembly according to claim 3, characterized in that: The mold assembly also includes a core (5); The support portion (11) has a second through hole (110), the core body (5) is inserted into and fixed in the first through hole (41) and the second through hole (110), and is connected to the fixing seat (3), and along the axial direction of the first through hole (41), the core body (5) and the fixing seat (3) are coaxial.

5. The mold assembly according to claim 4, characterized in that: The mold assembly also includes a first fastener (6); The fixing seat (3) is provided with a third through hole (32), and the first fastener (6) is passed through and fixed in the third through hole (32) and is threadedly connected to the core body (5).

6. The mold assembly according to claim 4, characterized in that: The core (5) comprises a core body (51) and an elastic mechanism (52) which are connected to each other; The core body (51) is inserted and fixed in the first through hole (41) and the second through hole (110); the elastic mechanism (52) is located in the second through hole (110) and abuts against the support portion (11); and the support portion (11) is elastic.

7. The mold assembly according to claim 6, characterized in that: The elastic mechanism (52) comprises a connecting column (521) and a top ball (522); One end of the connecting column (521) is connected to the core body (51), and the other end is elastically connected to the top bead (522), and the top bead (522) abuts against the support portion (11).

8. The mold assembly according to claim 4, characterized in that: The support portion (11) comprises a support plate (111) and a support tube (112); The support plate (111) is fixed to the outer periphery of the support tube (112), an annular mounting groove (113) is formed between the support plate (111) and the support tube (112), the support tube (112) is provided with the second through hole (110) along the axial direction, and the elastic part (12) is fixed to the outer periphery of the support tube (112).

9. The mold assembly according to claim 3, characterized in that: The mold assembly also includes a positioning member (7); The sealing cover (4) is provided with a positioning hole (42), and the positioning member (7) is connected to the fixing seat (3) and fixed in the positioning hole (42).

10. The mold assembly according to claim 3, characterized in that: The mold assembly also includes a second fastener (8); The fixing seat (3) is provided with a first threaded hole, the sealing cover (4) is provided with a second threaded hole (43), and the second fastener (8) is inserted through and fixed in the first threaded hole and the second threaded hole (43).

11. A method for glue filling of electronic equipment, characterized in that: The method is applied to a mold assembly, the mold assembly comprising a first matching piece (1) and a second matching piece (2), the first matching piece (1) and the second matching piece (2) being arranged to form a first cavity (13), at least one of the first matching piece (1) and the second matching piece (2) being elastic, and the method comprising: Separating at least a portion of the first fitting (1) from the second fitting (2) to form an opening communicating with the first cavity (13); After the glue is poured from the opening, a vacuum degassing process is performed.

12. The method for filling glue for electronic equipment according to claim 11, characterized in that: The mold assembly further comprises a fixing seat (3), a sealing cover (4), a core (5) and a first fastener (6); the fixing seat (3) and the sealing cover (4) are snap-fitted to form a second cavity (31); the first matching piece (1) and the second matching piece (2) are located in the second cavity (31); the sealing cover (4) has a first through hole (41); the first matching piece (1) comprises a supporting portion (11) and an elastic portion (12) connected to each other; the supporting portion (11) has a second through hole (110); the core (5) comprises a core body (51) and an elastic mechanism (52) connected to each other; the elastic mechanism (52) comprises a connecting column (521) and a top ball (522); one end of the connecting column (521) is connected to the core body (51); and the other end is elastically connected to the top ball (522); the method further comprises: The core body (5) is inserted and fixed in the first through hole (41) and the second through hole (110), so that the top ball (522) abuts against the charging component (91) of the electronic device (9) through the support portion (11), and the core body (5) and the fixing seat (3) are fixed concentrically by the first fastener (6); The mold assembly and the electronic device are cured as a whole.

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