Liquid ejecting head and liquid ejecting apparatus

Abstract

The invention provides a liquid ejecting head and a liquid ejecting apparatus capable of inhibiting liquid from intruding into the liquid ejecting head. The liquid ejecting head includes: a head chip; a fixed plate having a first surface facing the ejection direction, a second surface on the opposite side from the first surface, and a side surface; and a holder that holds the head chip between the holder and the fixing plate, the first surface including a waterproof region having a waterproof property and a hydrophilic region having a hydrophilic property when viewed in plan view toward the first surface, the waterproof region being a region having a waterproof property and the hydrophilic region being a region having a hydrophilic property. The hydrophilic region is disposed between the waterproof region and the side surface and has lower waterproofness than the waterproof region, and in the hydrophilic region of the first surface, a part of the model disposed between the side surface and at least one of the head chip and the holder is bonded to the hydrophilic region of the first surface.

Description

Technical Field

[0001] The present disclosure relates to a liquid ejecting head and a liquid ejecting device. Background Art

[0002] Conventionally, there is known a liquid jet head comprising: a plurality of head chips each having a nozzle plate having a plurality of nozzles formed thereon, a fixing plate to which the plurality of head chips are fixed by an adhesive, and a holder for holding the plurality of head chips between the fixing plate and the fixing plate (Patent Document 1). In the prior art, a liquid-repellent film is formed on the surface of the fixing plate, and a plurality of exposure openings are formed for exposing each nozzle plate to the outside.

[0003] In the prior art, a waterproof film is formed on the surface of the fixed plate and the surface of the nozzle plate, and an adhesive as a model is filled between the inner circumference of the nozzle plate and the exposed opening of the fixed plate, and between the outer circumference of the fixed plate and the inner circumference of the outer wall of the retaining frame. Hereinafter, when the inner circumference of the exposed opening of the fixed plate and the outer circumference of the fixed plate are not distinguished, they are sometimes referred to as the side of the fixed plate. Due to the waterproof film formed on the surfaces of the fixed plate and the nozzle plate, it is difficult for the adhesive to adhere to these surfaces. In addition, since the fixed plate is relatively thin, the bonding strength between the side of the fixed plate and the adhesive as a model is not high. Therefore, the liquid attached to the model may penetrate into the interior of the liquid injection head through the bonding interface between the model and the inner circumference of the exposed opening of the fixed plate or the outer circumference of the fixed plate.

[0004] Patent Document 1: Japanese Patent Application Publication No. 2021-53882 Summary of the invention

[0005] According to the first embodiment of the present disclosure, a liquid jet head can be provided. The liquid jet head comprises: a head chip that jets liquid in a jetting direction; a fixing plate that has a first surface facing the jetting direction, a second surface on which the head chip is fixed and which is opposite to the first surface, and a side surface that connects the first surface and the second surface; a retaining frame that retains the head chip between the fixing plate, wherein the first surface includes a waterproof area and a hydrophilic area when viewed from above toward the first surface, wherein the waterproof area is an area with waterproof properties, and the hydrophilic area is an area that is arranged between the waterproof area and the side surface and has lower waterproof properties than the waterproof area, and a part of a model that is arranged between the side surface and at least one of the head chip and the retaining frame is bonded to the hydrophilic area of ​​the first surface.

[0006] According to a second aspect of the present disclosure, there is provided a liquid ejecting device including: the liquid ejecting head of the above aspect; and a liquid storage portion that stores the liquid supplied to the liquid ejecting head. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 It is a structural diagram of the liquid ejecting device in the embodiment.

[0008] Figure 2 A stereogram of the head module.

[0009] Figure 3 This is an exploded perspective view of a liquid ejecting head.

[0010] Figure 4 This is a cross-sectional view illustrating the structure of a holder, a head chip, and a fixing plate.

[0011] Figure 5 This is a diagram showing a plan view of the head unit viewed toward the first surface.

[0012] Figure 6 for Figure 5 Partial cross-sectional view of FIG. VI-VI.

[0013] Figure 7 is a schematic cross-sectional view of a region including the second model.

[0014] Figure 8 A diagram for explaining another embodiment 1.

[0015] Fig. 9 A diagram for illustrating another embodiment 2.

[0016] Fig.10 A diagram for illustrating another embodiment 3. DETAILED DESCRIPTION

[0017] A. Implementation method:

[0018] In the following description, it is assumed that the X-axis, Y-axis, and Z-axis are orthogonal to each other. Figure 2As illustrated, a direction along the X-axis when observed from an arbitrary location is marked as the X1 direction, and the direction opposite to the X1 direction is recorded as the X2 direction. Similarly, directions opposite to each other along the Y-axis when observed from an arbitrary location are recorded as the Y1 direction and the Y2 direction, and directions opposite to each other along the Z-axis when observed from an arbitrary location are recorded as the Z1 direction and the Z2 direction. The XY plane including the X-axis and the Y-axis is equivalent to a horizontal plane. The Z-axis is an axis along the vertical direction, and the Z2 direction is equivalent to the downward direction in the vertical direction. In addition, the X-axis, the Y-axis, and the Z-axis only need to intersect each other at an angle of approximately 90 degrees. In addition, in the drawings, the size and scale of each part are appropriately different from the actual size and scale, and there are also parts that are schematically shown for easy understanding. And, as needed, the same dimensions and scales are also shown in other drawings. Figure 2 The corresponding X-axis, Y-axis, and Z-axis are illustrated.

[0019] Figure 1 : is a structural diagram of a liquid ejection device 100 in an embodiment. The liquid ejection device 100 is an inkjet printing device that ejects ink, which is an example of a liquid, as droplets onto a medium 11. The medium 11 is typically a printing paper. However, a printing object of any material such as a resin film or cloth can be used as the medium 11. For example, as inks, solvent inks and ultraviolet curing inks can be listed. Solvent inks are inks that contain an organic solvent, and after being given to the medium 11, the organic solvent corrodes the medium 11 to form a receiving layer so that the color material is fixed on the receiving layer. Ultraviolet curing inks are inks that contain ultraviolet curing components, and after being given to the medium 11, the ultraviolet curing components are cured by irradiating ultraviolet rays, thereby fixing the color material in the film formed thereby.

[0020] like Figure 1 As illustrated, in the liquid ejecting device 100, a liquid container 12 is provided as a liquid storage portion for storing ink. The liquid container 12 stores ink supplied to the liquid ejecting head 252 described later. For example, a cartridge that is detachable from the liquid ejecting device 100, a bag-shaped ink pack formed by a flexible film, or an ink tank capable of replenishing ink is used as the liquid container 12. The liquid container 12 includes a first liquid container 12a and a second liquid container 12b. The first ink is stored in the first liquid container 12a, and the second ink is stored in the second liquid container 12b. The first ink and the second ink are different types of inks. As an example of the first ink and the second ink, there is a case where the first ink is a cyan ink and the second ink is a magenta ink.

[0021] In the liquid ejecting device 100, a sub-tank 13 for temporarily storing ink is provided. In the sub-tank 13, ink supplied from the liquid container 12 is stored. The sub-tank 13 includes a first sub-tank 13a storing a first ink and a second sub-tank 13b storing a second ink. The first sub-tank 13a is connected to the first liquid container 12a, and the second sub-tank 13b is connected to the second liquid container 12b. In addition, the sub-tank 13 is connected to the head module 25, and supplies ink to the head module 25 and recovers ink from the head module 25.

[0022] The liquid ejection device 100 includes a control unit 21, a conveying mechanism 23, a moving mechanism 24, and a head module 25. The control unit 21 is a control unit that controls various elements of the liquid ejection device 100. The control unit 21 includes, for example, one or more processing circuits such as a CPU (Central Processing Unit) or an FPGA (Field Programmable Gate Array) and one or more storage circuits such as a semiconductor memory.

[0023] The conveying mechanism 23 conveys the medium 11 along the Y axis under the control of the control unit 21. The moving mechanism 24 moves the head module 25 back and forth along the X axis under the control of the control unit 21. The moving mechanism 24 of this embodiment includes a substantially box-shaped conveying body 241 for accommodating the head module 25, and an endless belt 242 to which the conveying body 241 is fixed. Alternatively, a structure in which the liquid container 12 and the sub-tank 13 are mounted on the conveying body 241 together with the head module 25 may be adopted.

[0024] The head module 25 ejects the ink supplied from the sub-tank 13 from each of the plurality of nozzles N to the medium 11 under the control of the control unit 21. The head module 25 ejects the ink to the medium 11 in parallel with the conveyance of the medium 11 by the conveyance mechanism 23 and the repeated reciprocating movement of the conveyance body 241, thereby forming an image on the surface of the medium 11. Ink that is not ejected from the plurality of nozzles is discharged to the sub-tank 13.

[0025] In the present embodiment, the sub-tank 13 constitutes a part of an external flow channel portion (not shown) provided outside the head module 25. The external flow channel portion includes a flow channel connecting the head module 25 and the sub-tank 13, and a circulation pump for conveying ink from the head module 25 to the sub-tank 13.

[0026] Figure 22 is a three-dimensional diagram of the head module 25. The head module 25 includes a support body 251 and a plurality of liquid ejection heads 252. The support body 251 is a plate-shaped member that supports the plurality of liquid ejection heads 252. A plurality of mounting holes 253 are formed on the support body 251. Each liquid ejection head 252 is supported by the support body 251 while being inserted into the mounting hole 253. The plurality of liquid ejection heads 252 are arranged in a matrix along the X-axis and the Y-axis. However, the number of the liquid ejection heads 252 and the arrangement and configuration of the plurality of liquid ejection heads 252 are not limited to the above examples.

[0027] Figure 3 2 is an exploded perspective view of the liquid ejecting head 252. The liquid ejecting head 252 includes a flow channel structure 300, a wiring substrate 32, a plurality of head chips Hn, a fixing plate 36, and a cover 38. The flow channel structure 300 includes a flow channel member 31 and a holder 33.

[0028] The flow channel member 31 is a member in which a liquid flow channel through which ink flows is formed. The flow channel member 31 includes a base 311, a first supply protrusion 312a, a second supply protrusion 312b, a first discharge protrusion 313a, and a second discharge protrusion 313b.

[0029] The base 311 is formed by stacking substrates Su1, Su2, Su3, Su4 and Su5. Substrate Su1 is located at the uppermost layer in the vertical direction, and substrate Su5 is located at the lowermost layer in the vertical direction. Multiple substrates Su1, Su2, Su3, Su4 and Su5 are formed, for example, by injection molding of a resin material. In addition, hereinafter, when substrates Su1, Su2, Su3, Su4 and Su5 are not distinguished, they are recorded as substrate Su. Adjacent substrates Su1, Su2, Su3, Su4 and Su5 are bonded together by an adhesive. The adhesive can also use the same material as the first adhesive described later.

[0030] Inside the base body 311, a first supply channel Sa, a second supply channel Sb, a first discharge channel Da, and a second discharge channel Db are provided as liquid flow channels. Figure 1 The first supply flow path Sb is a flow path for supplying the first ink in the first sub-tank 13a to the plurality of head chips Hn. Figure 1The second ink in the second sub-tank 13b shown is supplied to the plurality of head chips Hn. The first discharge flow channel Da is a flow channel for discharging the first ink that has not been ejected from the plurality of head chips Hn to the first sub-tank 13a. The second discharge flow channel Db is a flow channel for discharging the second ink that has not been ejected from the plurality of head chips Hn to the second sub-tank 13b. The first supply flow channel Sa, the second supply flow channel Sb, the first discharge flow channel Da, and the second discharge flow channel Db are respectively formed in the space in the base 311. The space is formed by one or both of the grooves along the XY plane provided on each of the two adjacent substrates Su.

[0031] like Figure 3 As shown in the example, the first supply protrusion 312a, the second supply protrusion 312b, the first discharge protrusion 313a, and the second discharge protrusion 313b protrude from the base 311 in the Z1 direction, respectively. The first supply protrusion 312a is a supply pipe provided with a first supply port Sa_in for supplying the first ink from the first sub-tank 13a to the first supply flow path Sa. The second supply protrusion 312b is a supply pipe provided with a second supply port Sb_in for supplying the second ink from the second sub-tank 13b to the second supply flow path Sb. The first discharge protrusion 313a is a discharge pipe provided with a first discharge port Da_out for discharging the first ink from the first discharge flow path Da to the first sub-tank 13a. The second discharge protrusion 313b is a discharge pipe provided with a second discharge port Db_out for discharging the second ink from the second sub-tank 13b to the second discharge flow path Db.

[0032] The holder 33 is a component that accommodates a plurality of head chips H1, H2, H3, and H4 and holds these head chips between the fixing plate 36. In addition, in the following text, when the head chips H1, H2, H3, and H4 are not distinguished, they are recorded as head chips Hn. The holder 33 is made of metal materials such as stainless steel. In addition, the holder 33 can also be made of materials such as carbon steel, aluminum, and thermosetting resin. Moreover, the surface of the holder 33 can also be electroplated with nickel or the like. The holder 33 is provided with a plurality of recesses 331, a plurality of ink holes 332, and a plurality of wiring holes 333. A head chip Hn is arranged in each recess 331. Each ink hole 332 is a flow channel for allowing ink to flow between the flow channel component 31 and the head chip Hn. Each wiring hole 333 is a hole through which the wiring (not shown) that connects the head chip Hn and the wiring substrate 32 passes. In addition, the retaining frame 33 has a Figure 2 The flange 334 on the illustrated support body 251. The flange 334 is a fixing portion provided with a plurality of screw holes 335 for screw fixing to the support body 251.

[0033] Each head chip Hn ejects the ink supplied from the flow channel member 31 in an ejection direction. The ejection direction is the downward direction in the vertical direction, which is the Z2 direction. Figure 3 Although not shown in the figure, each head chip Hn has a nozzle plate 41 having a plurality of nozzles N for ejecting ink. In each head chip Hn, the plurality of nozzles N include a plurality of nozzles N for ejecting the first ink and a plurality of nozzles N for ejecting the second ink.

[0034] The wiring substrate 32 is used to connect the liquid ejecting head 252 with Figure 1 The control unit 21 shown in the example is electrically connected to the mounting component. The wiring substrate 32 is arranged on the flow channel component 31. A connector 35 is provided on the wiring substrate 32. The connector 35 is a connecting component for electrically connecting the liquid ejecting head 252 and the control unit 21. In addition, although not shown in the figure, wiring connected to a plurality of head chips Hn is connected to the wiring substrate 32. In addition, the wiring can also be formed integrally with the wiring substrate 32.

[0035] like Figure 3 As shown, the fixing plate 36 is a plate member for fixing a plurality of head chips Hn on the retaining frame 33 of the flow channel structure 300. The fixing plate 36 is configured in a state where a plurality of head chips Hn are sandwiched between the fixing plate 36 and the retaining frame 33. The fixing plate 36 is, for example, a plate made of a metal material such as stainless steel. The fixing plate 36 has a first surface 36fa facing the ejection direction, a second surface 36fb on the opposite side of the first surface 36fa, and a side surface 36s connecting the first surface 36fa and the second surface 36fb. In addition, the fixing plate 36 has a plurality of exposure openings 361 for exposing the nozzle plate 41 of the head chip Hn to the outside. The exposure openings 361 penetrate the fixing plate 36 in the direction along the ejection direction. The plurality of exposure openings 361 are individually provided for each head chip Hn. The side surface 36s of the fixing plate 36 has an outer peripheral surface 36s1 that defines the outer periphery of the fixing plate 36, and an inner peripheral surface 36s2 that defines the exposure openings 361.

[0036] The cover 38 is a box-shaped member that accommodates the base 311 of the flow channel member 31 and the wiring substrate 32. The cover 38 is made of, for example, a resin material. Four protrusion holes 381 and an opening 382 are provided on the cover 38. The first supply protrusion 312a, the second supply protrusion 312b, the first discharge protrusion 313a or the second discharge protrusion 313b are inserted into each protrusion hole 381. The connector 35 is inserted into the opening 382. In addition, a through hole may be provided on the side of the cover 38. When the ink is ejected, the gas containing the ink component may invade the cover 38. By providing the through hole, even if the gas containing the ink component invades the cover 38, the gas containing the ink component can be discharged to the outside through the through hole. In addition, the tubular member can also be connected to the pump in the through hole. According to this embodiment, by driving the pump, the gas containing the ink component in the cover 38 can be forcibly released to the outside through the tubular member.

[0037] Figure 4 4 is a cross-sectional view illustrating the structure of the holder 33, the head chip Hn, and the fixing plate 36. The head chip Hn includes a nozzle plate 41, a communication plate 42, a pressure chamber substrate 43, a vibration plate 44, a plurality of driving elements E, a protection portion 46, a frame portion 47, and a compliance substrate 45.

[0038] The head chip Hn includes a first liquid ejection unit Qa and a second liquid ejection unit Qb. The first liquid ejection unit Qa ejects the first ink supplied from the first sub-tank 13a from the corresponding plurality of nozzles N. The second liquid ejection unit Qb ejects the second ink supplied from the second sub-tank 13b from the corresponding other plurality of nozzles N. The first liquid ejection unit Qa includes a first liquid storage chamber Ra as a common liquid chamber continuous across the plurality of nozzles N corresponding to the first ink. The second liquid ejection unit Qb includes a second liquid storage chamber Rb as a common liquid chamber continuous across the plurality of nozzles N corresponding to the second ink. In addition, the first liquid ejection unit Qa and the second liquid ejection unit Qb each include a plurality of pressure chambers C and a plurality of drive elements E. The pressure chamber C and the drive element E are formed for each nozzle N. In addition, in the head chip Hn, supply holes Ra_in and Rb_in for supplying ink, which are not shown in the figure, and discharge holes Ra_out and Rb_out for discharging ink are provided. The supply hole Ra_in and the discharge hole Ra_out are connected to the first liquid storage chamber Ra. Furthermore, the supply hole Rb_in and the discharge hole Rb_out communicate with the second liquid storage chamber Rb.

[0039] The nozzle plate 41, the connecting plate 42, the pressure chamber substrate 43, the vibration plate 44, the frame portion 47 and the plastic substrate 45 are respectively long plate-shaped parts along the Y axis. The pressure chamber substrate 43 and the frame portion 47 are arranged in the Z1 direction in the connecting plate 42. On the other hand, the nozzle plate 41 and the plastic substrate 45 are arranged in the Z2 direction in the connecting plate 42. In addition, the elements included in the first liquid injection portion Qa and the elements included in the second liquid injection portion Qb are structures arranged in a roughly plane-symmetrical manner. Therefore, in the following description, the elements corresponding to the first liquid injection portion Qa are described in detail, and the description of the elements corresponding to the second liquid injection portion Qb is appropriately omitted.

[0040] The nozzle plate 41 is a plate-shaped component having a plurality of nozzles N. Each nozzle N is a through hole for ejecting ink. The nozzle plate 41 is manufactured, for example, by processing a single crystal substrate of silicon using semiconductor manufacturing techniques such as photolithography and etching. However, any known material and manufacturing method can be used for the manufacture of the nozzle plate 41. Ink is supplied to the nozzle N from the liquid flow channel of the flow channel component 31 via the first liquid storage chamber Ra and the like. In addition, in the present embodiment, a waterproof film is formed on at least the surface of the nozzle plate 41 facing the ejection direction, so that the surface of the nozzle plate 41 has waterproof properties.

[0041] A connecting channel R1 and a supply channel R2 are provided on the connecting plate 42. The connecting channel R1 is provided for each nozzle N and is connected to the nozzle N. The supply channel R2 is connected to the nozzle N and the first liquid storage chamber Ra, and supplies ink from the first liquid storage chamber Ra to the nozzle N. In addition, a plurality of pressure chambers C are provided on the pressure chamber substrate 43. The pressure chamber C is a space connected to the nozzle N via the connecting channel R1. In addition, the pressure chamber C is connected to the first liquid storage chamber Ra via the supply channel R2. The connecting plate 42 and the pressure chamber substrate 43 are manufactured, for example, by processing a single crystal substrate of silicon using semiconductor manufacturing technology. However, for the manufacture of the connecting plate 42 and the pressure chamber substrate 43, any known material and manufacturing method can be adopted.

[0042] A vibration plate 44 capable of elastic deformation is arranged on the upper part of the pressure chamber C. The vibration plate 44 is stacked on the pressure chamber substrate 43 and is in contact with the surface of the pressure chamber substrate 43 on the opposite side to the connecting plate 42. In addition, a part or all of the vibration plate 44 may be a separate component from the pressure chamber substrate 43 or an integrated component. On the surface of the vibration plate 44 on the opposite side to the pressure chamber C, a driving element E is formed for each pressure chamber C. The driving element E changes the pressure of the ink in the pressure chamber C. The driving element E is, for example, a piezoelectric element that changes the volume of the pressure chamber C by deforming the wall surface of the pressure chamber C. In addition, the driving element E may also be a heating element that generates bubbles in the pressure chamber C by heating the ink in the pressure chamber C. The ink in the pressure chamber C is ejected from the nozzle N by changing the pressure of the ink in the pressure chamber C by the driving element E.

[0043] A protection portion 46 is disposed on the vibration plate 44. The protection portion 46 protects the plurality of driving elements E and reinforces the mechanical strength of the pressure chamber substrate 43 and the vibration plate 44. The protection portion 46 is manufactured, for example, by processing a single crystal substrate of silicon using semiconductor manufacturing technology. In addition, a wiring substrate (not shown) is bonded to the surface of the vibration plate 44. The wiring substrate is formed with a plurality of wirings for electrically connecting the control unit 21 and the liquid ejecting head 252.

[0044] The frame portion 47 is a housing for storing ink supplied to the plurality of pressure chambers C, and is formed, for example, by injection molding of a resin material. A first liquid storage chamber Ra and a second liquid storage chamber Rb are formed in the frame portion 47. The first liquid storage chamber Ra and the second liquid storage chamber Rb are connected to the liquid flow path of the flow path member 31 via the ink hole 332 of the holder 33, respectively.

[0045] The plastic substrate 45 constitutes a part of the wall surface of the supply flow channel R2. The plastic substrate 45 has a sealing film 451 and a support plate 452. The sealing film 451 is a flexible film and contacts the connecting plate 42. The sealing film 451 is formed of a resin material such as polyphenylene sulfide or aromatic polyamide. The support plate 452 is provided on the surface of the sealing film 451 that is opposite to the connecting plate 42. The support plate 452 is formed of a metal such as stainless steel. The support plate 452 has an opening that penetrates along the thickness direction thereof. Therefore, the portion of the plastic substrate 45 where the support plate 452 is not provided is constituted only by the sealing film 451. This portion has a buffering function of absorbing the pressure fluctuation of the ink in the first liquid storage chamber Ra and the second liquid storage chamber Rb. In other words, this portion functions as a buffer.

[0046] The holder 33 and the fixing plate 36 are bonded by the first adhesive 62a. In addition, the plastic substrate 45 of the head chip Hn and the fixing plate 36 are bonded by the second adhesive 62b. Since the first adhesive 62a and the second adhesive 62b are made of the same material, the adhesive 62 is used without distinguishing them. The adhesive 62 is composed of an organic adhesive. In the present embodiment, the adhesive 62 is a silicone adhesive that cures at room temperature. The silicone adhesive has the advantages of being easy to handle and having excellent heat resistance. In addition, the silicone adhesive is preferably a moisture-curing type. By adopting a moisture-curing type, the handling of the adhesive 62 is particularly easy, so that the bonding of the nozzle plate 41 to the holder 33 and the bonding of the nozzle plate 41 to the plastic substrate 45 can be achieved efficiently. However, as the adhesive 62, an epoxy adhesive can also be used. For example, the adhesive 62 can also use an adhesive containing bisphenol A epoxy resin. Alternatively, the adhesive 62 may contain calcium carbonate or polyoxyalkylene glycidyl ether as a main component.

[0047] In addition, molds 51 are arranged between the holder 33 and the fixing plate 36, and between the nozzle plate 41 and the fixing plate 36, respectively. The mold 51 is formed of a thermosetting resin or a photocurable resin. The mold 51 is preferably formed of an epoxy resin, for example. By using an epoxy adhesive, it is easy to form a mold 51 with excellent filling properties. The mold 51 has a first mold 51a arranged between the outer peripheral surface 36s1 of the fixing plate 36 and the holder 33, and a second mold 51b arranged between the inner peripheral surface 36s2 and the nozzle plate 41 of the head chip Hn. Specifically, in a direction perpendicular to the Z direction along the ejection direction, for example, the X direction or the Y direction, at least a portion of the first mold 51a is located between the outer peripheral surface 36s1 and the holder 33. In addition, in a direction perpendicular to the Z direction along the ejection direction, at least a portion of the second mold 51b is arranged between the inner peripheral surface 36s2 and the nozzle plate 41.

[0048] The liquid resistance A1 of the model 51 including the first model 51a and the second model 51b is higher than the liquid resistance B1 of the binder 62. Regarding the reactivity of the ink as a liquid and the binder 62 or the model 51, the solubility parameters of the ink and the binder 62 and the solubility parameters of the ink and the model 51 can be numerically compared. Specifically, the liquid resistance A1 being higher than the liquid resistance B1 corresponds to the following situation, that is, when the solubility parameter of the binder 62 is SPa, the solubility parameter of the model 51 is SPb, and the solubility parameter of the ink is SPz, SPa and SPb satisfy the relationship of |SPb-SPz|>|SPa-SPz|. Satisfying the relationship of |SPb-SPz|>|SPa-SPz| means that the reactivity of the ink and the model 51 is smaller than the reactivity of the ink and the binder 62, that is, the liquid resistance is higher.

[0049] In the liquid jet head 252, generally, when the bonding strength between the two components is not high, that is, when the close contact between the two components is low, a gap will be generated on the bonding interface, so that the possibility of the ink as a liquid invading from the outside to the inside through the gap becomes high. For example, when the close contact between the mold 51 and the nozzle plate 41 is low, the ink may intrude the inside from the bonding interface between the mold 51 and the nozzle plate 41. In the case where the ink intrudes into the inside, the ink sometimes reaches the first adhesive 62a or the second adhesive 62b. In the present embodiment, the first adhesive 62a and the second adhesive 62b are silicone adhesives that are cured at room temperature and have low liquid resistance. Therefore, the possibility of the layers of the first adhesive 62a and the second adhesive 62b being destroyed by the ink that has arrived becomes high.

[0050] In addition, in the process of forming the waterproof film on the surface including the first surface 36fa and the second surface 36fb of the fixing plate 36, the waterproof film may be formed on the outer peripheral surface 36s1 or the inner peripheral surface 36s2. In such a case, since the bonding strength between the first pattern 51a and the outer peripheral surface 36s1 or the bonding strength between the second pattern 51b and the inner peripheral surface 36s2 is reduced, the bonding strength between the pattern 51 and the nozzle plate 41 is further reduced, and thus the above-mentioned problem of ink intrusion from the outside to the inside is likely to occur significantly.

[0051] Furthermore, when mechanical stress is applied to the fixing plate 36, there is a possibility that the mold 51 is peeled off from the side surface 36s at the bonding interface between the side surface 36s of the fixing plate 36 and the mold 51. When the mold 51 is peeled off from the side surface 36s, there is a possibility that ink may intrude into the inside of the liquid ejecting head 252 from the peeled portion. Furthermore, since it is difficult to stably bond the mold 51 to the entire side surface 36s of the fixing plate 36, there is a possibility that the mold 51 is bonded only to a portion of the side surface 36s. When the mold 51 is bonded only to a portion of the side surface 36s, the bonding strength between the mold 51 and the fixing plate 36 is likely to decrease.

[0052] Figure 5 This is a diagram when the liquid ejecting head 252 is viewed from above as viewed toward the first surface 36 fa . Figure 6 for Figure 5 Partial cross-sectional view of VI-VI. Figure 6 In the figure, the structure arranged in the recess 331 is omitted for easy understanding.

[0053] like Figure 5 As shown, when viewed from above, the first surface 36fa of the fixing plate 36 has a waterproof region Rt and a hydrophilic region Rh, wherein the waterproof region Rt is a region having waterproof properties, and the hydrophilic region Rh is a region having lower waterproof properties than the waterproof region Rt. The waterproof region Rt is a region where a waterproof film is formed on the first surface 36fa of the fixing plate 36. The waterproof film includes, for example, a functional group having fluorine. In addition, the side surface 36s also has waterproof properties by forming a waterproof film in the same manner as the waterproof region Rt. When viewed from above, the hydrophilic region Rh is arranged between the waterproof region Rt and the side surface 36s. For ease of understanding, in the first surface 36fa, a single hatching is marked for the hydrophilic region Rh, and a single hatching is not marked for the waterproof region Rt.

[0054] The hydrophilic region Rh includes a first region Rh1 arranged along the outer peripheral surface 36s1 of the fixing plate 36 and a second region Rh2 arranged along the inner peripheral surface 36s2 of the fixing plate 36. The first region Rh1 is arranged along the entire outer edge of the first surface 36fa. The second region Rh2 is arranged along the entire edge of the exposure opening 361.

[0055] The hydrophilic region Rh is formed, for example, by irradiating a laser beam to a region of the hydrophilic region Rh in a water-repellent film formed on the entire surface of the first surface 36fa by dip coating to remove the water-repellent film. Figure 3The second surface 36fb of the fixing plate 36 shown is composed of a hydrophilic region having lower water resistance than the water-repellent region Rt. The hydrophilic region of the second surface 36fb is formed, for example, by removing the water-repellent film formed on the entire surface of the second surface 36fb by laser irradiation, similarly to the hydrophilic region Rh of the first surface 36fa.

[0056] In this embodiment, "water repellent" means that the static contact angle with respect to pure water is 90 degrees or more. In addition, in the hydrophilic region Rh, the static contact angle with respect to pure water is preferably less than 90 degrees, more preferably less than 45 degrees, and further preferably less than 30 degrees.

[0057] like Figure 6 As shown, the holder 33 has an outer peripheral wall 338 that defines the recess 331 for storing the head chip Hn. The outer peripheral wall 338 is a side wall extending from the bottom of the recess 331 in the ejection direction. The outer peripheral wall 338 has a bottom surface 339 that forms an end portion on the ejection direction side. The bottom surface 339 faces the Z2 direction as the ejection direction. The bottom surface 339 has a groove 337 that is recessed in the direction opposite to the ejection direction. The inner bottom surface 339a of the bottom surface 339, which is located on the inner side compared to the groove 337, that is, between the groove 337 and the recess 331, is a plane facing the Z2 direction. The inner bottom surface 339a of the bottom surface 339 is fixed to the second surface 36fb by the adhesive 62. That is, the outer peripheral wall 338 is fixed to the second surface 36fb by the adhesive 62 using the inner bottom surface 339a. The groove 337 is formed at a position overlapping with the outer peripheral surface 36s1 of the fixing plate 36 when viewed from above toward the first surface 36fa. That is, in the direction along the plane of the fixing plate 36, the outer peripheral surface 36s1 of the fixing plate 36 protrudes outward compared to the inner bottom surface 339a. The adhesive 62 in this embodiment is located in the bonding area sandwiched by the inner bottom surface 339a and the second surface 36fb, and in the area protruding outward compared to the bonding area. In addition, in this embodiment, the adhesive 62 is not bonded to the edge portion 36t of the second surface 36fb where the second surface 36fb and the side surface 36s intersect, and the area of ​​a fixed distance from the edge portion 36t.

[0058] In the first region Rh1 of the first surface 36fa, a portion of the first pattern 51a disposed between the outer peripheral surface 36s1 of the side surface 36s and the retainer 33 is bonded. Specifically, the first pattern 51a is filled in the groove 337 so as to cover the first region Rh1. Thus, the first pattern 51a covers the first adhesive 62a disposed so as to extend into the groove 337. As described above, a portion of the first pattern 51a is disposed inside the groove 337. Since a portion of the first pattern 51a is disposed inside the groove 337, the contact area between the retainer 33 and the first pattern 51a can be increased, and therefore, the bonding strength between the retainer 33 and the first pattern 51a can be improved.

[0059] As described above, the waterproof region Rt is a region where the waterproof film Ly is formed. In addition, although not shown in the figure, the side 36s is also waterproof by forming a waterproof film on the side 36s. In the present embodiment, the first region Rh1 of the first surface 36fa is formed between the waterproof region Rt and the outer peripheral surface 36s1 in a manner adjacent to the outer peripheral surface 36s1 as the side 36s. That is, the first region Rh1 extends from the first edge portion 36p1 where the outer peripheral surface 36s1 and the first surface 36fa intersect to the end of the waterproof region Rt. Similarly, Figure 5 As shown, the second region Rh2 of the first surface 36fa is formed between the waterproof region Rt and the inner peripheral surface 36s2 so as to be adjacent to the inner peripheral surface 36s2 as the side surface 36s. That is, the second region Rh2 extends from the second edge portion 36p2 where the inner peripheral surface 36s2 and the first surface 36fa intersect to the outer periphery of the waterproof region Rt.

[0060] In addition, if Figure 6 As shown, a part of the first pattern 51a is bonded to the second surface 36fb. Specifically, a part of the first pattern 51a is bonded to the area adjacent to the edge portion 36t in the second surface 36fb. When viewed along the spraying direction, a part of the first pattern 51a on the hydrophilic area Rh overlaps a part of the first pattern 51a on the second surface 36fb. That is, the first pattern 51a exists on both sides of the fixing plate 36. Since the first pattern 51a exists across the first surface 36fa and the second surface 36fb, the bonding strength between the fixing plate 36 and the first pattern 51a can be further improved.

[0061] In a plan view of the liquid ejecting head 252 viewed toward the first surface 36fa, the arrangement direction of the mutually adjacent outer peripheral surfaces 36s1 and first regions Rh1 (in Figure 6The dimension Lh1 of the first region Rh1 in the X direction (corresponding to the X direction) is larger than the thickness Lt of the fixing plate 36. In addition, the thickness Lt of the fixing plate 36 is the maximum thickness and is the thickness of the portion where the waterproof film Ly is formed in the present embodiment. Thus, since the area of ​​the first region Rh1 to which the first model 51a is bonded can be increased, the bonding strength of the first model 51a to the first region Rh1 can be improved. Thus, the situation in which the ink attached to the first model 51a and the like intrudes from the outside into the interior of the liquid injection head 252 through the bonding interface between the first model 51a and the outer peripheral surface 36s1 can be further suppressed. In addition, the dimension Lh1 is more preferably greater than twice the thickness Lt. Since the area of ​​the first region Rh1 to which the first model 51a is bonded can be further increased in this way, the bonding strength of the first model 51a to the first region Rh1 can be further improved. Therefore, the situation in which the ink intrudes from the outside into the interior of the liquid injection head 252 can be further suppressed.

[0062] In addition, when the liquid ejecting head 252 is viewed from above while being viewed toward the first surface 36fa, the outer peripheral surface 36s1 as the side surface 36s and the first region Rh1 adjacent to each other are arranged in the direction (in the Figure 6 In the X direction, the dimension Lh1 of the first region Rh1 is smaller than the dimension Lp of the portion of the first model 51a disposed between the outer peripheral surface 36s1 and the retaining frame 33. Here, in the case where the portion of the first model 51a bonded to the fixing plate 36 is wider, there is a possibility that a portion of the first model 51a may be peeled off from the first region Rh1 due to the stress generated by the contraction of the first model 51a during solidification. On the other hand, by having the above relationship, the portion of the first model 51a bonded to the first region Rh1 can be made less susceptible to the stress generated by the contraction during solidification, thereby reducing the possibility that a portion of the first model 51a may be peeled off from the first region Rh1. In addition, by having the above relationship, the area of ​​the first model 51a bonded to the first surface 36fa can be reduced, so that the sealing area where the capping member that covers the nozzle N to prevent the drying of the ink in the nozzle N abuts against the first surface 36fa can be sufficiently ensured.

[0063] In addition, the first region Rh1 is preferably formed in the region Rp1 between the first edge portion 36p1 of the fixing plate 36 and a position that is spaced inward by a dimension Lp from the first edge portion 36p1. Thus, since the amount of the first pattern 51a can be further reduced, the possibility that a part of the first pattern 51a is peeled off from the first region Rh1 can be further reduced. In addition, thereby, the sealing region where the capping member for covering the nozzle N abuts against the first surface 36fa can be more fully ensured.

[0064] As described above, the fixing plate 36 and the retaining frame 33 are fixed by the first adhesive 62 disposed between the second surface 36fb of the fixing plate 36 and the inner bottom surface 339a of the retaining frame 33. In addition, a portion of the first model 51a is bonded to the second surface 36fb. Specifically, a portion of the first model 51a is bonded to the portion of the second surface 36fb from the edge portion 36t to the portion where the first adhesive 62a is located. In the present embodiment, since the first model 51a is disposed from the first surface 36fa of the fixing plate 36 to the second surface 36fb, the bonding strength between the fixing plate 36 and the first model 51a can be further improved. Moreover, since the liquid resistance A1 of the first model 51a is higher than the liquid resistance B1 of the adhesive 62, the intrusion of liquid from the outside into the liquid ejecting head 252 can be suppressed, thereby protecting the adhesive 62 with lower liquid resistance.

[0065] Figure 7 Schematic cross-sectional view of the area including the second model 51b. The second model 51b is arranged between the inner peripheral surface 36s2 as the side surface 36s and the head chip Hn. In detail, the second model 51b is arranged in a manner to fill the gap between the inner peripheral surface 36s2 and the nozzle plate 41. A portion of the second model 51b is located on the second area Rh2 and is bonded to the second area Rh2. Since the second area Rh2 is less waterproof than the waterproof area Rt, the bonding strength between the second area Rh2 and the second model 51b can be improved. Thus, it is possible to suppress the situation in which the external ink attached to the second model 51b and the like intrudes into the interior of the liquid ejection head 252 through the bonding interface between the second model 51b and the inner peripheral surface 36s2.

[0066] In addition, when the liquid ejecting head 252 is viewed from above while being viewed toward the first surface 36fa, the inner peripheral surface 36s2 of the side surface 36s adjacent to each other and the arrangement direction of the second region Rh2 (in the Figure 7 In the X direction), the size Lh2 of the second region Rh2 is Figure 6The dimension Lh2 is larger than the thickness Lt of the fixing plate 36 shown in FIG. 2 . Thus, since the area of ​​the second region Rh2 to which the second model 51b is bonded can be increased, the bonding strength of the second model 51b to the second region Rh2 can be improved. Thus, the situation that the ink attached to the second model 51b and the like intrudes from the outside into the interior of the liquid ejecting head 252 through the bonding interface between the second model 51b and the inner peripheral surface 36s2 can be further suppressed. In addition, the dimension Lh2 is more preferably greater than twice the thickness Lt. Since the area of ​​the second region Rh2 to which the second model 51b is bonded can be further increased in this way, the bonding strength of the second model 51b to the second region Rh2 can be further improved. Thus, the situation that the ink intrudes from the outside into the interior of the liquid ejecting head 252 can be further suppressed.

[0067] In addition, when the liquid ejecting head 252 is viewed from above while being viewed toward the first surface 36fa, the inner peripheral surface 36s2 of the side surface 36s adjacent to each other and the arrangement direction of the second region Rh2 (in the Figure 7 In the X direction, the dimension Lh2 of the second region Rh2 is smaller than the dimension Lr of the portion of the second pattern 51b disposed between the inner circumferential surface 36s2 and the nozzle plate 41. Here, when the portion of the second pattern 51b bonded to the fixing plate 36 is wide, there is a possibility that a portion of the second pattern 51b will be peeled off from the second region Rh2 due to the stress generated by the shrinkage of the second pattern 51b during curing. On the other hand, by having the above relationship, the portion of the second pattern 51b bonded to the second region Rh2 can be less susceptible to the stress generated by the shrinkage during curing, and thus the possibility that a portion of the second pattern 51b will be peeled off from the second region Rh2 can be reduced.

[0068] In addition, the second region Rh2 is preferably formed in the region Rp2 between the second edge portion 36p2 of the fixing plate 36 and a position separated from the inner peripheral surface 36s2 by the dimension Lr from the second edge portion 36p2. Thus, since the amount of the second pattern 51b can be reduced, the possibility of a part of the second pattern 51b being peeled off from the second region Rh2 can be further reduced.

[0069] According to the above implementation, Figure 6 and Figure 7 As shown in FIG. 1 , a portion of the model 51 is bonded to the hydrophilic region Rh of the first surface 36fa. Specifically, Figure 6 As shown, a portion of the first mold 51a is bonded in the first region Rh1. Figure 7As shown, a part of the second model 51b is bonded to the second region Rh2. Since the hydrophilic region Rh has a high affinity with the model 51, the bonding strength between the hydrophilic region Rh and the model 51 can be improved. Therefore, the bonding strength between the fixing plate 36 and the model 51 can be improved. Thus, since the possibility of ink intruding from between the first surface 36fa and the model 51 to the inside can be reduced, the situation in which ink from the outside intrudes into the bonding interface between the side surface 36s and the model 51 can be suppressed. Therefore, since the ink can be suppressed from reaching the adhesive 62, the possibility of the adhesive 62 being damaged can be reduced. In addition, by bonding a part of the model 51 to the hydrophilic region Rh of the first surface 36fa that can be visually confirmed from the outside of the liquid ejecting head 252, it is possible to prevent the situation in which bubbles intrude into the model 51 that cannot be visually confirmed, so that the model 51 and the second surface 36fb or the side surface 36s are not fully bonded, resulting in poor bonding of the model 51.

[0070] In addition, according to the above embodiment, if Figure 6 as well as Figure 7 As shown, the hydrophilic region Rh of the first surface 36fa is arranged between the waterproof region Rt and the side surface 36s in a manner adjacent to the side surface 36s. Here, when the waterproof region Rt, the hydrophilic region Rh, and the waterproof region Rt are arranged in sequence from the edge portions 36p1 and 36p2 adjacent to the side surface 36s in the first surface 36fa, since the distance from the side surface 36s to the hydrophilic region Rh is long, the amount of the model 51 used will increase, and the height of the model will increase. On the other hand, according to this method, since the hydrophilic region Rh of the first surface 36fa is adjacent to the side surface 36s, it is possible to shorten the distance from the side surface 36s to the hydrophilic region Rh while forming the hydrophilic region Rh of a certain area or more. Therefore, the amount of the model 51 used can be reduced, and the height of the model 51 can be suppressed. Furthermore, since the amount of the mold 51 used can be reduced, the stress along the first surface 36fa caused by the curing shrinkage of the portion of the mold 51 disposed between the side surface 36s and at least one of the head chip Hn and the holder 33 can be reduced. Thus, the possibility of the mold 51 peeling off from the first surface 36fa can be further reduced.

[0071] Furthermore, according to the above-mentioned embodiment, the side 36s of the fixing plate 36 has waterproof properties. Here, in the case where the fixing plate 36 is waterproofed by dip coating, a waterproof film Ly is also formed on the side 36s. Although the waterproof film of the side 36s having a smaller size in the Z direction tends to be difficult to remove, even in the case where the side 36s has waterproof properties, by bonding a part of the mold 51 in the hydrophilic region Rh of the first surface 36fa, it is possible to suppress the intrusion of ink from the outside into the bonding interface between the side 36s and the mold 51. In other words, it is possible to suppress the intrusion of ink from the outside into the bonding interface between the side 36s and the mold 51 without removing the waterproof film of the side 36s.

[0072] B. Other implementations:

[0073] B-1. Other implementations 1:

[0074] In the above embodiment, if Figure 6 As shown in the figure, the first mold 51a is bonded not only to the first surface 36fa but also to the second surface 36fb. However, in other embodiments, this is not limited to this. Figure 8 FIG. 1 is a diagram for explaining another embodiment 1. Figure 8 The difference of the other embodiments shown is that the first adhesive 62a reaches the edge portion 36t. In other words, the first adhesive 62a is arranged on the entire area of ​​the second surface 36fb facing the groove 337. As a result, a part of the first model 51a is not located on the second surface 36fb and is not bonded to the second surface 36fb. Even if this method is adopted, since the liquid resistance A1 of the first model 51a is higher than the liquid resistance B1 of the adhesive 62, the intrusion of liquid from the outside into the liquid injection head 252 can be suppressed, and thus the adhesive 62 with lower liquid resistance can be protected.

[0075] B-2. Other implementations 2:

[0076] Fig. 9 FIG. 2 is a diagram for explaining another embodiment 2. The difference from the embodiment is that the outer peripheral wall 338a does not have Figure 6 This is the groove 337 shown. As for other structures, since it is the same as the first embodiment, the same reference numerals are attached to the same structures as those in the embodiment, and the description thereof is omitted as appropriate.

[0077] like Fig. 9As shown, the second surface 36fb of the fixing plate 36 is bonded to the bottom surface 339 of the outer peripheral wall 338a by the first adhesive 62a. A portion of the first adhesive 62a is arranged in a manner that extends outward from the area between the second surface 36fb and the bottom surface 339. The first mold 51a is arranged between the outer peripheral surface 36s1 and the outer peripheral wall 338a of the retainer 33 in a state where the first adhesive 62a extending toward the first area Rh1 and the bottom surface 339 is covered. A portion of the first mold 51a is bonded to the first area Rh1. Even in this manner, the same effect as the embodiment can be achieved at the point having the same structure as the above-mentioned embodiment. For example, by making the first area Rh1 less waterproof than the waterproof area Rt, the bonding strength between the first mold 51a and the first area Rh1 can be improved. Thus, since it is possible to suppress the ink attached to the first pattern 51 a from invading the bonding interface between the first pattern 51 a and the outer peripheral surface 36 s 1 , it is possible to suppress the ink from the outside from invading the inside of the liquid ejecting head 252 .

[0078] B-3. ​​Other implementations 3:

[0079] Fig.10 A diagram for explaining another embodiment 3. Figure 7The embodiment shown is different in that a part of the second mold 51b is bonded to the surface 41fa of the nozzle plate 41a in the other embodiment 3. In the above embodiment, the entire area of ​​the surface 41fa of the nozzle plate 41 facing the ejection direction is formed with a waterproof film in order to suppress the adhesion of ink. On the other hand, in the other embodiment 3, the surface 41fa of the nozzle plate 41a has a hydrophilic region Rh3 with low water resistance from which the waterproof film Ly is removed, similarly to the first surface 36fa of the fixing plate 36. Specifically, when viewed from above toward the first surface 36fa, the surface 41fa of the nozzle plate 41a has a nozzle forming region Rt3 and a hydrophilic region Rh3, wherein the nozzle forming region Rt3 is a region with water resistance in which a plurality of nozzles N are formed, and the hydrophilic region Rh3 is a region arranged between the outer peripheral surface 41s2 of the nozzle plate 41a and the nozzle forming region Rt3. The hydrophilic region Rh3 has a lower water resistance than the nozzle forming region Rt3. In another embodiment 3, the waterproof film Ly is removed by laser, so that the waterproofness of the hydrophilic region Rh3 is lower than that of the nozzle formation region Rt3. In addition, the outer peripheral surface 41s2 of the nozzle plate 41a is a side surface that defines the outer periphery of the nozzle plate 41a. A part of the second mold 51b is arranged in the hydrophilic region Rh3 of the nozzle plate 41a and is bonded to the hydrophilic region Rh3. Since the adhesion between the second mold 51b and the nozzle plate 41a can be improved by adopting this method, it is possible to suppress the situation where the ink enters the inside of the liquid ejecting head 252 from between the second mold 51b and the nozzle plate 41a.

[0080] B-4. Other implementation methods 4:

[0081] Although according to the above embodiment, Figure 6 as well as Figure 7 As shown, the hydrophilic region Rh of the first surface 36fa is adjacent to the side surface 36s, but the present invention is not limited thereto. For example, a waterproof region may be provided in the region adjacent to the side surface 36s in the first surface 36fa, and the hydrophilic region Rh may be provided adjacent to the waterproof region. In other words, the hydrophilic region Rh may be arranged in a manner that is spaced apart from the first edge portion 36p1 or the second edge portion 36p2 of the first surface 36fa. In addition, a portion of the hydrophilic region Rh of the first surface 36fa may be adjacent to the side surface 36s, and the remaining portion of the hydrophilic region Rh may be arranged in a manner that is spaced apart from the side surface 36s.

[0082] B-5. Other implementations 5:

[0083] Although according to the above embodiment, Figure 6 as well as Figure 7As shown, the side surface 36s is a surface extending in the Z direction, but is not limited thereto. For example, the side surface 36s may be an inclined surface extending in a direction intersecting the Z direction when viewed in a direction perpendicular to the Z direction as the thickness direction of the fixing plate 36, or may be a curved surface.

[0084] B-6. Other implementations 6:

[0085] According to the above embodiment, the holder 33 is formed integrally, but the holder 33 may be formed by fixing two or more members by bonding or the like.

[0086] C.Other methods:

[0087] The present disclosure is not limited to the above-mentioned embodiments, but can be implemented in various ways without departing from the scope of the present disclosure. For example, the present disclosure can also be implemented in the following ways. In order to solve part or all of the problems of the present disclosure, or to achieve part or all of the effects of the present disclosure, the technical features in the above-mentioned embodiments corresponding to the technical features in the various modes described below can be appropriately replaced or combined. In addition, as long as the technical feature is not described as a necessary technical feature in this specification, it can be appropriately deleted.

[0088] (1) According to a first aspect of the present disclosure, a liquid jet head can be provided. The liquid jet head comprises: a head chip that jets liquid in a jetting direction; a fixing plate that has a first surface facing the jetting direction, a second surface on which the head chip is fixed and which is opposite to the first surface, and a side surface that connects the first surface and the second surface; a retaining frame that retains the head chip between the fixing plate, wherein the first surface includes a waterproof region and a hydrophilic region when viewed from above toward the first surface, wherein the waterproof region is a region having waterproof properties, and the hydrophilic region is a region that is arranged between the waterproof region and the side surface and has lower waterproof properties than the waterproof region, and a part of a model that is arranged between the side surface and at least one of the head chip and the retaining frame is bonded to the hydrophilic region of the first surface. According to this aspect, since a part of the model is bonded to the hydrophilic region of the first surface, it is possible to suppress the situation in which ink from the outside invades the bonding interface between the side surface and the model.

[0089] (2) In the above-mentioned method, it can also be set that the hydrophilic area of ​​the first surface is arranged between the waterproof area and the side surface in a manner adjacent to the side surface. In the case where the waterproof area, the hydrophilic area, and the waterproof area are arranged in sequence from the edge portion adjacent to the side surface in the first surface, since the distance from the side surface to the hydrophilic area is long, the amount of the model used will increase, thereby making the height of the model higher. On the other hand, according to this method, since the hydrophilic area of ​​the first surface is adjacent to the side surface, the distance from the side surface to the hydrophilic area can be shortened. Therefore, the amount of the model used can be reduced, thereby suppressing the height of the model. In addition, since the amount of the model used can be reduced, the stress along the first surface caused by the curing shrinkage of the part of the model that is arranged between the side surface and at least one of the head chip and the retaining frame can be reduced. As a result, the possibility of the model peeling off from the first surface can be further reduced.

[0090] (3) In the above embodiment, the side surface may be waterproof. According to this embodiment, even when the side surface is waterproof, it is possible to suppress the intrusion of ink from the outside into the bonding interface between the side surface and the mold by bonding a part of the mold to the hydrophilic region of the first surface.

[0091] (4) In the above aspect, a portion of the model may be bonded to the second surface. According to this aspect, since the model spans both the first surface and the second surface, the bonding strength between the fixing plate and the model can be further increased.

[0092] (5) In the above aspect, the side surface may include the outer peripheral surface of the fixing plate, the mold may include a first mold arranged between the outer peripheral surface of the fixing plate and the retainer, the hydrophilic region of the first surface may include a first region arranged along the outer peripheral surface of the fixing plate, and a portion of the first mold may be bonded to the first region. According to this aspect, since a portion of the first mold is bonded to the first region as the hydrophilic region, the bonding strength between the fixing plate and the mold may be improved.

[0093] (6) In the above-mentioned embodiment, the size of the first region in the arrangement direction of the side surface and the first region adjacent to each other in the plan view may be larger than the thickness of the fixing plate. According to this embodiment, since the area of ​​the first region to which the first mold is bonded can be increased, the bonding strength of the first mold to the first region can be increased. Thus, the situation in which ink invades the inside of the liquid ejecting head from the outside can be further suppressed.

[0094] (7) In the above-mentioned manner, it is also possible to set that, in the arrangement direction of the side surface and the first area adjacent to each other when viewed from above, the size of the first area is smaller than the size of the portion of the first model arranged between the side surface and the retaining frame. Here, in the case where the portion of the model bonded to the fixed plate is wider, there is a possibility that a portion of the model will be peeled off from the first area due to the stress generated by the shrinkage of the model during solidification. On the other hand, by having the above-mentioned relationship, the portion of the model bonded to the first area can be made less susceptible to the stress generated by the shrinkage during solidification, thereby reducing the possibility of a portion of the model being peeled off from the first area. In addition, by having the above-mentioned relationship, the area of ​​the first model bonded to the first surface can be reduced, so that the sealing area where the pressure cover member that covers the nozzle to prevent the ink in the nozzle from drying out and abuts against the first surface can be fully ensured.

[0095] (8) In the above-mentioned method, it is also possible to set that the second surface and the retaining frame are fixed by an adhesive arranged between the second surface and the retaining frame, a part of the first model is bonded to the second surface, and the liquid resistance of the first model is higher than the liquid resistance of the adhesive. According to this method, since the first model is arranged from the first surface of the fixed plate to the second surface, the bonding strength between the fixed plate and the first model can be further improved. In addition, since the liquid resistance of the first model is higher than the liquid resistance of the adhesive, the intrusion of liquid from the outside into the liquid injection head can be suppressed, and therefore the adhesive with low liquid resistance can be protected.

[0096] (9) In the above-mentioned aspect, the second surface and the holder may be fixed by an adhesive disposed between the second surface and the holder, a portion of the first pattern is not bonded to the second surface, and the liquid resistance of the first pattern is higher than the liquid resistance of the adhesive. According to this aspect, since the liquid resistance of the first pattern is higher than the liquid resistance of the adhesive, the intrusion of liquid from the outside into the liquid ejecting head can be suppressed, and therefore the adhesive with low liquid resistance can be protected.

[0097] (10) In the above-mentioned aspect, the retainer may include an outer peripheral wall fixed to the second surface by an adhesive on the bottom surface facing the ejection direction, a groove is formed on the bottom surface of the outer peripheral wall at a position overlapping with the outer peripheral surface of the fixing plate when viewed from above, and a part of the first pattern is arranged inside the groove. According to this aspect, since the contact area between the retainer and the first pattern can be increased by arranging a part of the first pattern inside the groove, the bonding strength between the retainer and the first pattern can be improved.

[0098] (11) In the above aspect, the head chip may include a nozzle plate having a plurality of nozzles for ejecting liquid, the fixing plate may include an exposure opening for exposing the nozzle plate to the outside, the side surface may include an inner peripheral surface defining the exposure opening of the fixing plate, the mold may include a second mold arranged between the inner peripheral surface and the nozzle plate, the hydrophilic region of the first surface may include a second region arranged along the inner peripheral surface, and a portion of the second mold may be bonded to the second region. According to this aspect, since a portion of the second mold is bonded to the second region as the hydrophilic region, the bonding strength between the fixing plate and the mold may be improved.

[0099] (12) In the above-mentioned embodiment, the size of the second region may be larger than the thickness of the fixing plate in the arrangement direction of the side surface and the second region adjacent to each other when viewed from above. According to this embodiment, since the area of ​​the second region to which the second mold is bonded can be increased, the bonding strength of the second mold to the second region can be increased. Thus, the situation in which ink invades the interior of the liquid ejecting head from the outside can be further suppressed.

[0100] (13) In the above-mentioned method, the size of the second area may be smaller than the size of the portion of the second pattern arranged between the side and the nozzle plate in the arrangement direction of the side surface and the second area adjacent to each other when viewed from above. Here, when the portion of the pattern bonded to the fixing plate is wide, there is a possibility that a portion of the pattern will be peeled off from the second area due to stress generated by shrinkage during curing of the pattern. On the other hand, according to this method, since the portion of the pattern bonded to the second area is less susceptible to stress generated by shrinkage during curing, the possibility of a portion of the pattern being peeled off from the second area can be reduced.

[0101] (14) According to the above aspect, the surface of the nozzle plate may include a nozzle forming region and a hydrophilic region when viewed from above, wherein the nozzle forming region is a region having water repellency and formed with the plurality of nozzles, and the hydrophilic region is a region disposed between the outer peripheral surface of the nozzle plate and the nozzle forming region and having lower water repellency than the nozzle forming region, and a portion of the second pattern may be disposed on the hydrophilic region of the nozzle plate. According to this aspect, the adhesion between the second pattern and the nozzle plate can be improved.

[0102] (15) According to a second aspect of the present disclosure, a liquid ejecting device can be provided. The liquid ejecting device comprises: a liquid ejecting head according to the above aspect; and a liquid storage portion that stores the liquid supplied to the liquid ejecting head. According to this aspect, since a part of the mold is bonded to the hydrophilic region of the first surface, it is possible to suppress the intrusion of ink from the outside into the bonding interface between the side surface and the mold.

[0103] The present disclosure can be implemented in various forms other than the above-described forms, for example, in forms such as a liquid ejecting head and a method for manufacturing a liquid ejecting head.

[0104] Explanation of symbols

[0105] 11…medium; 12…liquid container; 12a…first liquid container; 12b…second liquid container; 13…sub-tank; 13a…first sub-tank; 13b…second sub-tank; 21…control unit; 23…transport mechanism; 24…movement mechanism; 25…head module; 26…liquid ejecting head; 31…flow channel component; 32…wiring substrate; 33…holder; 35…connector; 36…fixing plate; 36fa…first surface; 36fb…second surface; 36p1…first edge portion; 36p2…second edge portion; 36s…side surface; 36s1…outer peripheral surface; 36s2…inner peripheral surface; 36t…edge portion; 38…cover; 41, 41a…nozzle plate; 41fa ...surface; 41s2...peripheral surface; 42...connecting plate; 43...pressure chamber substrate; 44...vibration plate; 45...plastic substrate; 46...protection portion; 47...frame portion; 51...model; 51a...first model; 51b...second model; 62...adhesive; 62a...first adhesive; 62b...second adhesive; 100...liquid ejection device; 241...transport body; 242...endless belt; 251...support body; 252...liquid ejection head; 253...mounting hole; 300...flow channel structure; 311...base body; 312a...first supply protrusion; 312b...second supply protrusion; 313a...first discharge protrusion; 313b...second protrusion for discharge; 331...recess; 332...ink hole; 333...wiring hole; 334...flange; 335...screw hole; 337...groove; 338, 338a...peripheral wall; 339...bottom surface; 339a...inner bottom surface; 361...exposed opening; 381...protrusion hole; 382...opening; 451...sealing film; 452...support plate; C...pressure chamber; Da...first discharge flow channel; Da_out...first discharge outlet; Db...second discharge flow channel; Db_out...second discharge outlet; E...driving element; H1 to H4, Hn...head chip; Lh1...size; Lh2...size; Lp...size; Lr...size; Ly...waterproof film; N...spray nozzle; Qa…first liquid injection part; Qb…second liquid injection part; R1…connecting flow channel; R2…supply flow channel; Ra…first liquid storage chamber; Ra_in…supply hole; Ra_out…discharge hole; Rb…second liquid storage chamber; Rb_in…supply hole; Rb_out…discharge hole; Rh…hydrophilic area; Rh1…first area; Rh2…second area; Rh3…hydrophilic area; Rp1, Rp2…area; Rt…waterproof area; Rt3…nozzle forming area; Sa…first supply flow channel; Sa_in…first supply port; Sb…second supply flow channel; Sb_in…second supply port; Su, Su1 to Su5…substrate.

Claims

1. A liquid ejecting head, characterized in that: have: a head chip that ejects liquid in an ejection direction; a fixing plate having a first surface facing the ejection direction, a second surface on which the head chip is fixed and which is opposite to the first surface, and a side surface connecting the first surface and the second surface; a holding frame, which holds the head chip between the holding frame and the fixing plate, When viewed from above and toward the first surface, the first surface includes a waterproof region and a hydrophilic region, wherein the waterproof region is a region having waterproof properties, and the hydrophilic region is a region disposed between the waterproof region and the side surface and having lower waterproof properties than the waterproof region. A portion of a mold disposed between the side surface and at least one of the head chip and the holder is bonded to the hydrophilic region of the first surface.

2. The liquid ejecting head according to claim 1, wherein: The hydrophilic region of the first surface is arranged between the waterproof region and the side surface so as to be adjacent to the side surface.

3. The liquid ejecting head according to claim 1, wherein: The side surfaces are water-resistant.

4. The liquid ejecting head according to claim 1, wherein: A portion of the model is bonded to the second surface.

5. The liquid ejecting head according to claim 1, wherein: The side surface includes the outer peripheral surface of the fixing plate, The model includes a first model arranged between the outer peripheral surface of the fixing plate and the retaining frame, The hydrophilic region of the first surface includes a first region arranged along the outer peripheral surface of the fixing plate, A portion of the first pattern is bonded to the first region.

6. The liquid ejecting head according to claim 5, wherein: A size of the first region in the arrangement direction of the side surface and the first region adjacent to each other in the plan view is larger than a thickness of the fixing plate.

7. The liquid ejecting head according to claim 5, wherein: In the arrangement direction of the side surface and the first area adjacent to each other in the plan view, the size of the first area is smaller than the size of a portion of the first pattern arranged between the side surface and the retainer.

8. The liquid ejecting head according to claim 5, wherein: The second surface and the retainer are fixed by an adhesive arranged between the second surface and the retainer. A portion of the first model is bonded to the second surface, The liquid resistance of the first mold is higher than the liquid resistance of the adhesive.

9. The liquid ejecting head according to claim 5, wherein: The second surface and the retainer are fixed by an adhesive arranged between the second surface and the retainer. A portion of the first model is not bonded to the second surface, The liquid resistance of the first mold is higher than the liquid resistance of the adhesive.

10. The liquid ejecting head according to claim 5, wherein: The retainer has an outer peripheral wall fixed to the second surface by an adhesive on the bottom surface facing the ejection direction, A groove is formed on the bottom surface of the outer peripheral wall at a position overlapping with the outer peripheral surface of the fixing plate when viewed from above. A portion of the first pattern is arranged inside the groove.

11. The liquid ejecting head according to claim 1, wherein The head chip includes a nozzle plate having a plurality of nozzles for ejecting liquid, The fixing plate has an exposure opening for exposing the nozzle plate to the outside. The side surface includes an inner peripheral surface defining the exposed opening of the fixing plate, The model includes a second model arranged between the inner peripheral surface and the nozzle plate, The hydrophilic region of the first surface includes a second region arranged along the inner peripheral surface, A portion of the second pattern is bonded to the second region.

12. The liquid ejecting head according to claim 11, wherein: In the arrangement direction of the side surface and the second region adjacent to each other in the plan view, a size of the second region is larger than a thickness of the fixing plate.

13. The liquid ejecting head according to claim 11, wherein: In the arrangement direction of the side surface and the second area adjacent to each other in the plan view, the size of the second area is smaller than the size of a portion of the second pattern arranged between the side surface and the nozzle plate.

14. The liquid ejecting head according to claim 11, wherein: When observed from above, the surface of the nozzle plate has a nozzle forming area and a hydrophilic area, wherein the nozzle forming area is a water-repellent area where the plurality of nozzles are formed, and the hydrophilic area is an area disposed between the outer peripheral surface of the nozzle plate and the nozzle forming area and having lower water repellency than the nozzle forming area. A portion of the second pattern is disposed on the hydrophilic region of the nozzle plate.

15. A liquid ejection device, characterized in that: have: The liquid ejecting head according to any one of claims 1 to 14; The liquid storage portion stores the liquid supplied to the liquid ejecting head.

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