An etching and soaking device and method for manufacturing an anti-glare layer of AG glass

Abstract

The present invention relates to the field of etching technology and discloses an etching and immersion device and method for manufacturing an anti-glare layer on AG glass. The device comprises a body and a protective housing mounted on top of the body. The body is internally provided with an etching tank and two cleaning tanks, with the etching tank located between the two cleaning tanks. The body is provided with a liftable stabilizing frame, on which a placement rack for AG glass is placed. The stabilizing frame drives the AG glass on the placement rack to repeatedly move up and down in the etching solution in the etching tank to remove bubbles attached to the surface. The invention employs multi-electric field zoning technology, forming an independent electric field through staggered anode and cathode electrode sheets. Each piece of AG glass is in its own dedicated electric field region, effectively avoiding the problem of edge electric field attenuation. Under the action of the electric field, ions can be driven to migrate, thereby improving etching uniformity.

Description

Technical Field

[0001] The present invention relates to the technical field of etching, in particular to an etching and immersion device and method for manufacturing an anti-glare layer of AG glass. Background Art

[0002] Etching the anti-glare layer on AG glass is a key technology that uses a specific process to create microstructures on the glass surface, reducing reflected light and glare. It is widely used in numerous fields. Etching the anti-glare layer on AG glass is primarily based on the principles of chemical etching and physical etching. Chemical etching typically uses an etching solution such as hydrofluoric acid to react with the silicon dioxide in the glass. By controlling the reaction conditions, tiny concave and convex structures are formed on the glass surface, altering the reflection and scattering properties of light, thereby achieving the desired anti-glare effect. Physical etching uses high-energy beams such as ion beams and lasers to bombard the glass surface, stripping away atoms from the surface and forming microstructures that provide anti-glare properties.

[0003] Immersing the glass in an etching solution allows for chemical etching. This method requires simple equipment and is relatively low cost. However, the etching process suffers from low ion utilization, high consumption of etching solution (such as hydrofluoric acid), and significant local concentration variations, further exacerbating the problem of uneven etching. This makes it difficult to meet the demands of modern high-precision, high-quality AG glass anti-glare coating manufacturing. Therefore, a device and method for etching and immersing AG glass anti-glare coatings is needed. Summary of the Invention

[0004] In response to the above-mentioned deficiencies in the prior art, the present invention provides an etching and immersion device and method for manufacturing an anti-glare layer of AG glass, which adopts electric field technology to drive the directional migration of hydrogen ions and fluoride ions, reduce the thickness of the diffusion layer, and greatly improve the etching accuracy and consistency.

[0005] The present invention provides the following technical solution: an etching and immersion device for manufacturing an anti-glare layer of AG glass, comprising a body and a protective shell installed on the top of the body, wherein an etching tank and two cleaning tanks are provided inside the body, and the etching tank is located between the two cleaning tanks;

[0006] The machine body is provided with a lifting stabilizing frame, on which a placement frame for AG glass is placed. The stabilizing frame drives the AG glass on the placement frame to move up and down repeatedly in the etching solution of the etching tank to remove bubbles attached to the surface;

[0007] The stabilizing frame is provided with an electric field structure, which constructs multiple separate electric fields inside the etching tank through the electric field structure, and each AG glass on the placement frame is placed in each local electric field, and the local electric field drives the ions to migrate, thereby improving the etching uniformity. After the stabilizing frame drives the electric field structure out of the etching tank, the positive and negative electrodes of the electric field structure are separated and introduced into two cleaning tanks for separate cleaning;

[0008] The electric field structure includes flippable anode electrode sheets and cathode electrode sheets that are staggered and equidistantly distributed. A single electric field is formed between each anode electrode sheet and cathode electrode sheet, and under the action of the electric field, etching of the AG glass is assisted.

[0009] Preferably, the electric field structure includes an anode shaft and a cathode shaft arranged on a stabilizing frame, and rectangular frames are installed on the anode shaft and the cathode shaft in an alternating manner. Anode electrode sheets and cathode electrode sheets are respectively installed in the rectangular frames of the anode shaft and the cathode shaft, and the anode electrode sheets and cathode electrode sheets are staggered and equidistantly distributed inside the etching groove to form multiple electric fields.

[0010] Preferably, the electric field structure also includes a transmission structure for driving the anode shaft and the cathode shaft to rotate, and the transmission structure drives the anode shaft and the cathode shaft to rotate, so that the anode electrode sheet and the cathode electrode sheet are flipped and separated, and introduced into two cleaning tanks for electrode cleaning.

[0011] Preferably, the stabilizing frame includes two movable platforms arranged in the machine body, and the two movable platforms are driven to rise and fall by the electric cylinder at the bottom. Two U-shaped brackets extending into the interior of the etching groove are installed between the two movable platforms. Several groups of equidistantly distributed concave blocks are installed on the U-shaped brackets, and the rectangular frame contacts the grooves of the concave blocks to stabilize the electric field structure.

[0012] Preferably, the placement rack includes four support beams, and fixed beams are installed on the top of both ends of the four support beams, handles are installed on two of the fixed beams, and positioning racks for fixing the AG glass are installed at equal distances on the top of the two support beams, so that the AG glass on the positioning rack is located between the anode electrode sheet and the cathode electrode sheet and distributed in each electric field.

[0013] Preferably, the positioning frame includes a support block and a guide column installed on the support block, the support block is provided with a positioning groove, the guide column is provided with a sliding counterweight block, and the side of the counterweight block is installed with a downward-facing L-shaped clip, the bottom of the AG glass is located in the positioning groove of the support block, and the top of the AG glass is inserted and fixed by the counterweight block and the L-shaped clip.

[0014] Preferably, the installation directions of two adjacent positioning frames are opposite, so that the fixing directions of the two adjacent positioning frames to the AG glass are opposite, so that the anti-glare layer of the AG glass always faces the anode in the electric field.

[0015] Preferably, the four support beams are respectively placed between the bottom of the U-shaped bracket, and the parts of the four support beams extending from the fixed beam at both ends are clamped on the side frame of the U-shaped bracket, which limits the placement position of the positioning frame and allows the positioning frame to be accurately placed on the placement frame.

[0016] Preferably, a guide shell is installed inside the etching tank, and a water pump is installed inside the guide shell, and a row of obliquely spraying drain pipes and water inlets are installed at the bottom of the guide shell, and the drain pipes and water inlets are respectively connected to the water pump through pipes. The etching liquid is pushed to circulate around the guide shell by the jetting through the drain pipe, driving the etching liquid to pass through the AG glass, thereby improving the uniformity of the anti-glare etching.

[0017] A method for manufacturing an anti-glare layer of AG glass by etching and immersion, the specific operations are as follows:

[0018] S1. Place the AG glass on a placement rack in the forward and reverse directions, and place the placement rack on a stable rack. Then, flip the electric field structure so that the anode electrode sheet and the cathode electrode sheet are inserted between each AG glass.

[0019] S2. The stabilizing frame drives the placement frame and the AG glass on it to move downward and immerse them in the etching solution in the etching tank. The stabilizing frame repeatedly drives the AG glass to move up and down in the etching solution to remove bubbles attached to the surface.

[0020] S3, the stabilizing frame stops moving, the electric field structure starts to be energized, an electric field is generated between the anode electrode sheet and the cathode electrode sheet, and ion migration is accelerated;

[0021] S4. After etching, the electric field structure stops being energized, and the stabilizing frame drives the placement frame to move upward and out of the etching tank. Then the electric field structure flips over, so that the anode electrode sheet and the cathode electrode sheet flip 270 degrees, and the placement frame is taken out. The stabilizing frame drives the electric field structure to move downward, so that the anode electrode sheet and the cathode electrode sheet are respectively introduced into two cleaning tanks for cleaning.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] (1) The multi-electric field partitioning technology is adopted to form an independent electric field through the staggered distribution of anode electrode sheets and cathode electrode sheets. Each piece of AG glass is in a dedicated electric field area, which effectively avoids the problem of edge electric field attenuation. Under the action of the electric field, it can drive the migration of ions and improve the etching uniformity. At the same time, the electric field drives the directional migration of hydrogen ions and fluoride ions, reduces the thickness of the diffusion layer, and allows the reactants to quickly contact the glass surface, selectively enhance the target reaction, reduce the interference of inactive ions, strictly control the difference in etching depth within a reasonable range, and greatly improve the etching accuracy and consistency.

[0024] (2) The positioning frame on the placement frame can firmly fix the AG glass through the positioning groove, counterweight block and L-shaped clamp, and the adjacent positioning frames are installed in opposite directions to ensure that the anti-glare layer of the AG glass always faces the anode in the electric field; at the same time, the cooperation of the support beam and the U-shaped bracket accurately defines the placement position of the positioning frame to avoid excessive obstruction of the anti-glare layer of the AG glass, which affects the etching effect.

[0025] (3) The stabilizing frame can drive the AG glass on the placement frame to move up and down repeatedly in the etching liquid in the etching tank, effectively removing bubbles attached to the surface, preventing bubbles from affecting the etching process, and preventing uneven etching, thereby improving the etching quality; in addition, the etching liquid is driven to circulate in the etching tank by a water pump, and bubbles on the glass can be removed before the electric field is established, further ensuring the etching effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0027] Figure 2 Schematic diagram of the internal structure of the body of the present invention;

[0028] Figure 3 Schematic diagram of the internal structure of the etching tank of the present invention;

[0029] Figure 4 A schematic diagram of the positions of the stabilizing frame, placement frame and electric field structure of the present invention;

[0030] Figure 5 This is a schematic diagram of the coordination structure of the stabilizing frame and the placement frame of the present invention;

[0031] Figure 6 It is a structural schematic diagram of the placement rack of the present invention;

[0032] Figure 7 It is a structural schematic diagram of the positioning frame of the present invention;

[0033] Figure 8 This is a schematic structural diagram of the guide housing of the present invention;

[0034] Figure 9 For the present invention Figure 8 Schematic diagram of the internal structure.

[0035] In the figure: 1. Machine body; 2. Protective shell; 3. Etching tank; 4. Cleaning tank; 5. Stabilizing frame; 6. Placement frame; 7. Electric field structure; 8. Guide shell; 9. Drain pipe; 10. Water inlet; 71. Anode shaft; 72. Cathode shaft; 73. Rectangular frame; 74. Anode electrode sheet; 75. Cathode electrode sheet; 51. Movable table; 52. U-shaped bracket; 53. Concave block; 54. Electric cylinder; 61. Support beam; 62. Fixed beam; 63. Handle; 64. Positioning frame; 641. Support block; 642. Guide column; 643. Positioning groove; 644. Counterweight block; 645. L-shaped clip. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. In order to keep the following description of the embodiments of the present disclosure clear and concise, the present disclosure omits detailed descriptions of known functions and known components to avoid unnecessary confusion of the concepts of the present invention.

[0037] See also Figure 1 The present invention comprises an AG glass anti-glare coating manufacturing, etching, and immersion device. The device's body 1 serves as the basic support structure for the entire device, providing mounting space for various internal components. A protective housing 2 is mounted on top of the device and includes an observation window for monitoring the etching process. This effectively protects the internal structure from environmental factors and provides a degree of safety for the operator.

[0038] See Figure 2 and Figure 3 An etching tank 3 and two cleaning tanks 4 are located within the housing 1, with the etching tank 3 located between the two cleaning tanks 4, forming a rational functional zoning layout. The etching tank 3 is used to hold the etching solution for etching the AG glass; the cleaning tank 4 is used to clean the electrodes of the electric field structure 7, ensuring their cleanliness and maintaining their good working performance.

[0039] See Figure 4 and Figure 5 , the stabilizing frame 5 plays a key role in the device. It includes two movable platforms 51 arranged in the body 1, and the two movable platforms 51 are driven by the electric cylinder 54 at the bottom to realize the lifting function. The electric cylinder 54 provides a stable and precise driving force, and can flexibly control the lifting height of the movable platform 51 according to the actual etching needs. Two U-shaped brackets 52 extending into the interior of the etching tank 3 are installed between the two movable platforms 51, and several groups of equidistantly distributed concave blocks 53 are installed on the U-shaped bracket 52. During actual installation, the rectangular frame 73 is in close contact with the groove of the concave block 53. Through this matching method, it plays a stabilizing supporting role for the electric field structure 7, ensuring that the electric field structure 7 remains stable during operation without shaking or offsetting.

[0040] The AG glass on the placement rack 6 is driven by the stabilizing rack 5 to move up and down repeatedly in the etching solution of the etching tank 3 to remove bubbles attached to the surface. Since the glass is immersed in the etching solution, air bubbles may be attached to the glass. These bubbles affect the etching process and therefore need to be removed.

[0041] See Figure 6The placement rack 6 is used to support the AG glass. It includes four support beams 61, each with a fixed beam 62 mounted on top of each end. Both fixed beams 62 are equipped with handles 63, which facilitate the operator's handling of the placement rack 6. Positioning brackets 64 are mounted equidistantly on top of each support beam 61 to secure the AG glass.

[0042] See Figure 7 The positioning frame 64 includes a support block 641 and a guide post 642 mounted on the support block 641. The support block 641 has a positioning slot 643, and the guide post 642 is equipped with a slidable counterweight 644. A downward-facing L-shaped clip 645 is mounted on the side of the counterweight 644. To secure the AG glass, the bottom of the AG glass is placed in the positioning slot 643 of the support block 641. The counterweight 644 is then slid so that the L-shaped clip 645 is inserted into the top of the AG glass, thereby firmly securing the AG glass.

[0043] The installation directions of two adjacent positioning frames 64 are opposite. This design ensures that the two adjacent positioning frames 64 fix the AG glass in opposite directions, ensuring that the anti-glare layer of the AG glass always faces the anode in the electric field, achieving better etching results. Four support beams 61 are placed between the bottoms of the U-shaped brackets 52, and the portions of the four support beams 61 extending from the fixed beams 62 at both ends are clamped to the side frames of the U-shaped brackets 52. In this way, the placement of the positioning frames 64 is precisely defined, ensuring that the positioning frames 64 are accurately placed on the placement frame 6, thereby ensuring the positional accuracy of the AG glass during the etching process.

[0044] The electric field structure 7 is one of the core components of this device. It includes an anode shaft 71, a cathode shaft 72, a rectangular frame 73, an anode electrode sheet 74, and a cathode electrode sheet 75. Rectangular frames 73 are staggered and installed on the anode shaft 71 and cathode shaft 72. Anode electrode sheets 74 and cathode electrode sheets 75 are respectively installed within the rectangular frames 73. The rectangular frames 73 are used to protect the anode electrode sheets 74 and cathode electrode sheets 75 from deformation. The anode electrode sheets 74 and cathode electrode sheets 75 are staggered and evenly spaced within the etching tank 3 to form multiple independent electric field regions. An electric field can be generated between each anode electrode sheet 74 and cathode electrode sheet 75. Under the action of the etching solution containing the mixed conductive liquid, it can drive ions to migrate, thereby improving etching uniformity.

[0045] The electric field structure 7 also includes a transmission structure for driving the anode shaft 71 and the cathode shaft 72 to rotate. The transmission structure can be a combination of a motor and a gear transmission. The transmission structure drives the anode shaft 71 and the cathode shaft 72 to rotate, thereby realizing the flipping and separation of the anode electrode sheet 74 and the cathode electrode sheet 75. After etching is completed, the anode electrode sheet 74 and the cathode electrode sheet 75 are flipped 270 degrees by the transmission structure and are respectively introduced into two cleaning tanks 4 for cleaning, effectively removing the etching solution and impurities remaining on the surface of the electrode sheet, ensuring the cleanliness and stable performance of the electrode sheet. At the same time, during the flipping process of the anode shaft 71 and the cathode shaft 72, the anode electrode sheet 74 and the cathode electrode sheet 75 will not come into contact with the anode shaft 71 and the cathode shaft 72, and the anode electrode sheet 74 and the cathode electrode sheet 75 can be flipped smoothly.

[0046] Electric field (usually 10-20VDC or pulse) drive (hydrogen ions) and (fluoride ions) directional migration, reducing the thickness of the diffusion layer, allowing the reactants to quickly contact the glass surface; the electric field selectively enhances the target reaction ( ), reducing inactive ions (such as ) interference; the electric field direction guides ion migration to form regular micro-pits (such as hexagonal honeycomb structure), which are used for anti-glare (Haze value 8±1%) or grating (periodic accuracy ±50nm); ion utilization is improved, HF consumption is reduced by 20-30%, and waste liquid treatment costs are reduced.

[0047] See Figure 8 and Figure 9 A guide housing 8 is installed within the etching tank 3, housing a water pump. A row of obliquely spraying drain pipes 9 and a water inlet 10 are installed at the bottom of the guide housing 8. These drain pipes 9 and the water inlet 10 are connected to the water pump via pipes. When the water pump is operating, it draws etching liquid from the water inlet 10 and then sprays it obliquely through the drain pipes 9, forcing the etching liquid to circulate around the guide housing 8. This circulating etching liquid evenly flows across the surface of the AG glass, further improving the uniformity of the anti-glare etching.

[0048] The etching liquid is driven to circulate by a water pump (flow rate 0.3-0.5m / s) to eliminate local concentration differences and avoid over-etching or under-etching. During the construction of the electric field, the etching liquid circulates to impact the glass and remove bubbles on the glass.

[0049] When actually using this device to etch and soak the anti-glare layer of AG glass, the specific operating steps are as follows:

[0050] S1. The operator accurately places the AG glass in the positioning frame 64 on the placement frame 6 in the forward and reverse directions. The positioning frame 64 secures the AG glass to ensure its stable position. The transmission mechanism of the electric field structure 7 is then activated, causing the anode electrode sheet 74 and cathode electrode sheet 75 to be flipped and inserted between the AG glass sheets, forming multiple electric field regions and preparing for subsequent etching.

[0051] S2. Activate the electric cylinder 54, and the stabilizing frame 5 moves the placement frame 6 and the AG glass on it downward, immersing them in the etching solution in the etching tank 3. During the immersion process, the stabilizing frame 5 repeatedly moves the AG glass up and down in the etching solution, effectively removing bubbles adhering to the surface of the AG glass. Because bubbles can affect the etching effect and cause uneven etching, removing bubbles is a crucial step in ensuring etching quality.

[0052] S3. After the stabilizing frame 5 stops moving, the electric field structure 7 is energized. At this time, an electric field is generated between the anode electrode sheet 74 and the cathode electrode sheet 75. Under the action of the electric field, ion migration is accelerated, thereby achieving efficient etching of the AG glass and improving etching uniformity and quality.

[0053] S4. After etching is completed, the electric field structure 7 is first de-energized, and then the electric cylinder 54 is activated. The stabilizing frame 5 drives the placement frame 6 upward and out of the etching tank 3. The transmission structure of the electric field structure 7 is then activated again, causing the anode electrode sheet 74 and the cathode electrode sheet 75 to flip 270 degrees, and then the placement frame 6 is removed. The stabilizing frame 5 continues to drive the electric field structure 7 downward, guiding the anode electrode sheet 74 and the cathode electrode sheet 75 into the two cleaning tanks 4 respectively. The cleaning solution in the cleaning tanks 4 is used to clean the electrode sheets, removing the residual etching solution and impurities on the electrode sheet surfaces, preparing for the next etching operation.

[0054] Through the above specific embodiments, the etching and immersion device for manufacturing the anti-glare layer of AG glass of the present invention can achieve efficient and uniform etching work, while ensuring the cleanliness of the electrode sheet and improving the service life and working stability of the device.

[0055] The above embodiments are merely exemplary embodiments of the present invention and are not intended to limit the scope of the present invention. The scope of protection of the present invention is defined by the claims. Those skilled in the art may make various modifications or equivalent substitutions to the present invention within the spirit and scope of protection of the present invention, and such modifications or equivalent substitutions shall also be deemed to fall within the scope of protection of the present invention.

Claims

1. An etching and immersion device for manufacturing an anti-glare layer of AG glass, characterized by: It comprises a body (1) and a protective shell (2) mounted on the top of the body (1); an etching tank (3) and two cleaning tanks (4) are provided inside the body (1), and the etching tank (3) is located between the two cleaning tanks (4); The machine body (1) is provided with a stabilizing frame (5) that can be raised and lowered, and a placement frame (6) for AG glass is placed on the stabilizing frame (5). The stabilizing frame (5) drives the AG glass on the placement frame (6) to move up and down repeatedly in the etching solution of the etching tank (3) to remove bubbles attached to the surface; The stabilizing frame (5) is provided with an electric field structure (7), and a plurality of separate electric fields are constructed inside the etching tank (3) through the electric field structure (7), and each AG glass on the placement frame (6) is placed in each local electric field, and the local electric field drives the ions to migrate, thereby improving the etching uniformity. After the stabilizing frame (5) drives the electric field structure (7) to move out of the etching tank (3), the positive and negative electrodes of the electric field structure (7) are separated and introduced into two cleaning tanks (4) for separate cleaning; The electric field structure (7) includes flippable anode electrode sheets (74) and cathode electrode sheets (75) that are staggered and equidistantly distributed, and a single electric field is formed between each anode electrode sheet (74) and cathode electrode sheet (75). Under the action of the electric field, etching of the AG glass is assisted; The electric field structure (7) includes an anode shaft (71) and a cathode shaft (72) arranged on a stabilizing frame (5), rectangular frames (73) are staggeredly installed on the anode shaft (71) and the cathode shaft (72), and anode electrode sheets (74) and cathode electrode sheets (75) are respectively installed in the rectangular frames (73) of the anode shaft (71) and the cathode shaft (72), and the anode electrode sheets (74) and the cathode electrode sheets (75) are staggered and equidistantly distributed inside the etching tank (3), forming multiple electric fields; The electric field structure (7) further includes a transmission structure for driving the anode shaft (71) and the cathode shaft (72) to rotate. The transmission structure drives the anode shaft (71) and the cathode shaft (72) to rotate, so that the anode electrode sheet (74) and the cathode electrode sheet (75) are flipped and separated, and introduced into two cleaning tanks (4) for electrode cleaning.

2. The etching and immersion device for manufacturing an anti-glare layer of AG glass according to claim 1, characterized in that: The stabilizing frame (5) includes two movable platforms (51) arranged in the machine body (1), and the two movable platforms (51) are driven to rise and fall by an electric cylinder (54) at the bottom. Two U-shaped brackets (52) extending into the interior of the etching groove (3) are installed between the two movable platforms (51). A plurality of groups of equidistantly distributed concave blocks (53) are installed on the U-shaped brackets (52), and the rectangular frame (73) contacts the grooves of the concave blocks (53) to stabilize the electric field structure (7).

3. The etching and immersion device for manufacturing an anti-glare layer of AG glass according to claim 1, characterized in that: The placement frame (6) includes four support beams (61), and fixed beams (62) are installed on the tops of both ends of the four support beams (61), and handles (63) are installed on the two fixed beams (62). Positioning frames (64) for fixing AG glass are installed at equal distances on the tops of the two support beams (61), so that the AG glass on the positioning frame (64) is located between the anode electrode sheet (74) and the cathode electrode sheet (75) and distributed in each electric field.

4. The etching and immersion device for manufacturing an anti-glare layer of AG glass according to claim 3, characterized in that: The positioning frame (64) includes a support block (641) and a guide column (642) installed on the support block (641); a positioning groove (643) is provided on the support block (641); a slidable counterweight block (644) is provided on the guide column (642); and a downward-facing L-shaped clamp (645) is installed on the side of the counterweight block (644); the bottom of the AG glass is located in the positioning groove (643) of the support block (641), and the top of the AG glass is inserted and fixed by the counterweight block (644) and the L-shaped clamp (645).

5. The etching and immersion device for manufacturing an anti-glare layer of AG glass according to claim 3, characterized in that: The installation directions of two adjacent positioning frames (64) are opposite, so that the fixing directions of the two adjacent positioning frames (64) on the AG glass are opposite, so that the anti-glare layer of the AG glass always faces the anode in the electric field.

6. The etching and immersion device for manufacturing an anti-glare layer of AG glass according to claim 3, characterized in that: The four support beams (61) are respectively placed between the bottoms of the U-shaped bracket (52), and the portions of the two ends of the four support beams (61) extending from the fixed beam (62) are clamped on the side frames of the U-shaped bracket (52), thereby limiting the placement position of the positioning frame (64) so that the positioning frame (64) is accurately placed on the placement frame (6).

7. The etching and immersion device for manufacturing an anti-glare layer of AG glass according to claim 1, characterized in that: A guide housing (8) is installed inside the etching tank (3), and a water pump is installed inside the guide housing (8). A row of obliquely spraying drain pipes (9) and a water inlet (10) are installed at the bottom of the guide housing (8), and the drain pipes (9) and the water inlet (10) are respectively connected to the water pump through pipelines. The etching liquid is pushed by the drain pipes (9) to circulate around the guide housing (8), driving the etching liquid to pass through the AG glass, thereby improving the uniformity of the anti-glare etching.

8. A method for etching and immersing AG glass anti-glare layer, characterized in that: The etching and immersion device for manufacturing the anti-glare layer of AG glass according to any one of claims 1 to 7 is specifically operated as follows: S1, placing the AG glass on the placement rack (6) in the forward and reverse directions, and placing the placement rack (6) on the stabilizing rack (5), and then flipping the electric field structure (7) so that the anode electrode sheet (74) and the cathode electrode sheet (75) are inserted between each AG glass; S2, the stabilizing frame (5) drives the placement frame (6) and the AG glass thereon to move downward and immerse them in the etching solution of the etching tank (3), and the stabilizing frame (5) repeatedly drives the AG glass to move up and down repeatedly in the etching solution to remove bubbles attached to the surface; S3, the stabilizing frame (5) stops moving, the electric field structure (7) starts to be energized, and an electric field is generated between the anode electrode sheet (74) and the cathode electrode sheet (75), accelerating ion migration; S4. After etching, the electric field structure (7) stops being energized, and the stabilizing frame (5) drives the placement frame (6) to move upward and out of the etching tank (3). Then, the electric field structure (7) is flipped, so that the anode electrode sheet (74) and the cathode electrode sheet (75) are flipped 270 degrees, and the placement frame (6) is taken out, and the stabilizing frame (5) drives the electric field structure (7) to move downward, so that the anode electrode sheet (74) and the cathode electrode sheet (75) are respectively introduced into the two cleaning tanks (4) for cleaning.

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