An energy-saving multi-stage compressor system and its energy-saving method

Abstract

The present invention belongs to the field of compressors, and discloses an energy-saving multi-stage compressor system and an energy-saving method thereof, which include a multi-stage compressor unit and a steam turbine. The multi-stage compressor unit includes several compression stages connected in series in sequence. Between at least two adjacent compression stages, a thermoelectric-cooling self-coupled composite inter-stage cooler is connected through pipelines. The thermoelectric-cooling self-coupled composite inter-stage cooler includes a thermoelectric conversion module, a water-cooling module, and an electro-cooling conversion module connected in sequence from the previous compression stage to the next compression stage. In the present invention, the thermoelectric conversion module in the thermoelectric-cooling self-coupled composite inter-stage cooler utilizes the heat of the gas discharged from the outlet of the previous compression stage to output direct current, reduces the gas temperature, and uses circulating cooling water to further cool the gas. The direct current output by the thermoelectric conversion module is directly supplied to the electro-cooling conversion module, and the low-temperature cold is used to further cool the gas, reduce the gas temperature entering the next compression stage, and improve the isothermal compression efficiency.

Description

Technical Field

[0001] The present invention relates to the field of compressors, and particularly to an energy-saving multi-stage compressor system and an energy-saving method thereof. Background Art

[0002] In various industries of the national economy such as metallurgy, petrochemical, and medicine, due to the need for gas pressure in chemical synthesis / polymerization, gas transportation, refrigeration, gas separation, and using compressed air as a power source, gases including air, gas, syngas, gas-phase refrigerant, hydrogen, etc. need to be compressed and boosted. During the compression process of the gas in the compressor, the temperature continuously rises. Different compressed gases have different adiabatic indices, and the temperature rise values are different under the same pressure boost condition. However, the temperature rise amplitude of various gases during the compression process is related to the pressure ratio. The larger the pressure ratio, the higher the temperature rise. Since the higher the gas temperature in the compressor, the lower the compressor efficiency and the increase in the power consumption of the compressor unit. Therefore, in the gas compression requirements with high pressure ratio, in order to reduce the average gas temperature in the compressor, improve the compression efficiency and reduce the energy consumption of the compressor unit, the compressor unit is generally designed as multi-stage compression, and an intercooler is arranged between each compression stage. The circulating cooling water is used to cool the high-temperature gas discharged from the previous compression stage, reduce the temperature of the gas entering the next compression stage, and reduce the power consumption of the unit.

[0003] The currently commonly configured intercooler uses circulating cooling water to indirectly cool the gas, and there are the following problems: the temperature of the circulating cooling water is affected by the ambient temperature, and indirect heat transfer requires a certain temperature difference. The cooling temperature that the traditional intercooler can achieve for high-temperature gas is limited. Generally, the gas temperature leaving the cooler is designed at 40°C. This will cause poor cooling effect on high-temperature gas, especially when the temperature of the circulating cooling water is relatively high in the high-temperature season in summer, resulting in low operating efficiency of the compressor unit. In extreme ambient temperature conditions, the compressor outlet temperature will be too high, leading to the unit alarm or even tripping.

[0004] Due to the need for a certain temperature difference in the heat transfer process, the temperature to which the gas can be cooled is directly related to the temperature of the cold source in contact with the gas. The traditional circulating cooling water intercooler cannot reach a lower cooling temperature.

[0005] In view of the problems existing in the multi-stage compressor system with the traditional configuration using circulating water-cooled intercoolers, for energy-saving and safety considerations, being able to cool the gas to a lower temperature is an urgent problem to be solved for large multi-stage compressor systems. Summary of the Invention

[0006] The purpose of the present invention is to provide an energy-saving multi-stage compressor system and an energy-saving method thereof to solve the problems proposed in the above background art.

[0007] To achieve the above object, the present invention provides the following technical solutions:

[0008] An energy-saving multi-stage compressor system includes a multi-stage compressor unit and a steam turbine for driving the multi-stage compressor unit. The multi-stage compressor unit includes a number of compression stages connected in series in sequence. At least two adjacent compression stages are connected by a pipeline to cooperate with a thermoelectric-cooling self-coupled inter-stage cooler. The thermoelectric-cooling self-coupled inter-stage cooler includes a thermoelectric conversion module, a water-cooling module, and an electro-cooling conversion module connected in sequence from the previous compression stage to the next compression stage.

[0009] The thermoelectric conversion module uses the Seebeck effect of semiconductor materials to convert the thermal energy of the gas into electrical energy and transmit it to the electro-cooling conversion module, and initially cools the gas.

[0010] The water-cooling module performs secondary cooling on the gas.

[0011] The electro-cooling conversion module receives the electrical energy transmitted by the thermoelectric conversion module and uses the Peltier effect of semiconductor materials to perform tertiary cooling on the gas.

[0012] Further, the thermoelectric conversion module includes a first metal gas channel, a semiconductor thermoelectric power generation layer disposed outside the first metal gas channel, and a first water cooling jacket disposed outside the semiconductor thermoelectric power generation layer. The first metal gas channel allows the gas to pass through. The semiconductor thermoelectric power generation layer includes a number of semiconductor thermoelectric generators. The semiconductor thermoelectric generators use the Seebeck effect of semiconductor materials to convert the thermal energy of the gas into electrical energy and transmit it to the electro-cooling conversion module. The first water cooling jacket cools the cold side of the semiconductor thermoelectric power generation layer through cooling water.

[0013] Further, the inner wall of the first metal gas channel is provided with first enhanced heat transfer fins.

[0014] Further, the water-cooling module includes a second metal gas channel and a second water cooling jacket disposed outside the second metal gas channel. The second metal gas channel allows the gas to pass through. The second water cooling jacket cools the gas through cooling water.

[0015] Further, the inner wall of the second metal gas channel is provided with second enhanced heat transfer fins.

[0016] Further, the electric-cooling conversion module includes a third metal gas channel, a semiconductor refrigeration layer disposed outside the third metal gas channel, and a third water cooling jacket disposed outside the semiconductor refrigeration layer. The third metal gas channel allows gas to pass through. The semiconductor refrigeration layer includes a plurality of semiconductor refrigerators. The semiconductor refrigerators receive the electric energy transmitted by the thermoelectric conversion module and use the Peltier effect of the semiconductor material to cool the gas three times. The third water cooling jacket cools the hot side of the semiconductor refrigeration layer through cooling water.

[0017] Further, the inner wall of the third metal gas channel is provided with third enhanced heat transfer fins.

[0018] Further, all adjacent compression stages are connected with a thermoelectric-cooling self-coupled composite inter-stage cooler through pipeline cooperation.

[0019] The present invention provides an energy-saving method for an energy-saving multi-stage compressor system as described above, including:

[0020] Step 1, the thermoelectric conversion module uses the Seebeck effect of the semiconductor material to convert the thermal energy of the gas discharged from the outlet of the previous compression stage into electric energy and transmit it to the electric-cooling conversion module, and perform a primary cooling on the gas;

[0021] Step 2, the water cooling module performs a secondary cooling on the gas;

[0022] Step 3, the electric-cooling conversion module receives the electric energy transmitted by the thermoelectric conversion module, uses the Peltier effect of the semiconductor material to perform a third cooling on the gas, and conveys the gas after the third cooling to the next compression stage.

[0023] Compared with the prior art, the beneficial effects of the present invention are as follows: The present invention uses the thermoelectric conversion module in the thermoelectric-cooling self-coupled composite inter-stage cooler to output direct current by using the heat of the gas discharged from the outlet of the previous compression stage, reduce the gas temperature, continue to cool the gas by using circulating cooling water, the direct current output by the thermoelectric conversion module directly supplies the electric-cooling conversion module, uses low-temperature cold to further cool the gas, reduce the gas temperature entering the next compression stage, improve the isothermal compression efficiency, reduce the energy consumption of the compressor system, and achieve the purpose of energy saving. Description of the Drawings

[0024] Figure 1 It is a schematic structural diagram of an energy-saving multi-stage compressor system of the present invention.

[0025] Figure 2 It is a schematic structural diagram of a thermoelectric-cooling self-coupled composite inter-stage cooler in an energy-saving multi-stage compressor system of the present invention.

[0026] Figure 3Schematic diagram of the internal structure of the thermoelectric conversion module in an energy-saving multi-stage compressor system of the present invention.

[0027] Figure 4 Schematic diagram of the radial cross-sectional structure of the thermoelectric conversion module in an energy-saving multi-stage compressor system of the present invention.

[0028] Figure 5 Schematic diagram of the internal structure of the water-cooling module in an energy-saving multi-stage compressor system of the present invention.

[0029] Figure 6 Schematic diagram of the internal structure of the electro-cooling conversion module in an energy-saving multi-stage compressor system of the present invention.

[0030] Figure 7 Schematic diagram of the radial cross-sectional structure of the electro-cooling conversion module in an energy-saving multi-stage compressor system of the present invention.

[0031] Figure 8 Flowchart of the energy-saving method for an energy-saving multi-stage compressor system of the present invention.

[0032] In the figure: 1 is a steam turbine, 2 is a compression stage, 3 is a thermoelectric-cooling self-coupled composite inter-stage cooler, 30 is a thermoelectric conversion module, 300 is a first metal gas channel, 301 is a semiconductor thermoelectric generator, 302 is a first water cooling jacket, 303 is a first enhanced heat transfer fin, 31 is a water-cooling module, 310 is a second metal gas channel, 311 is a second water cooling jacket, 312 is a second enhanced heat transfer fin, 32 is an electro-cooling conversion module, 320 is a third metal gas channel, 321 is a semiconductor refrigerator, 322 is a third water cooling jacket, 323 is a third enhanced heat transfer fin. Specific embodiments

[0033] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0034] Please refer to Figures 1-7, An energy-saving multi-stage compressor system includes a multi-stage compressor unit and a steam turbine 1 that drives the multi-stage compressor unit. The multi-stage compressor unit includes two series-connected compression stages 2, and the compression stage 2 is a compressor. The two adjacent compression stages 2 are connected by a pipeline to cooperate with a thermoelectric-cooling self-coupled composite inter-stage cooler 3. The thermoelectric-cooling self-coupled composite inter-stage cooler 3 is composed of three sections of heat exchange modules in series, and from the air inlet end to the air outlet end, it includes a thermoelectric conversion module 30, a water-cooling module 31, and an electro-cooling conversion module 32 connected in sequence. The thermoelectric conversion module 30 uses the Seebeck effect of semiconductor materials to convert the thermal energy of the gas into electrical energy and transmit it to the electro-cooling conversion module 32, and initially cools the gas. The water-cooling module 31 performs secondary cooling on the gas. The electro-cooling conversion module 32 receives the electrical energy transmitted by the thermoelectric conversion module 30 and uses the Peltier effect of semiconductor materials to perform tertiary cooling on the gas.

[0035] It should be noted that the multi-stage compressor unit may also include three or more compression stages 2, and the thermoelectric-cooling self-coupled composite inter-stage cooler 3 can be connected by a pipeline between any two adjacent compression stages 2.

[0036] Continue to refer to Figure 3 and Figure 4 , In an embodiment of the present invention, the thermoelectric conversion module 30 includes a first metal gas channel 300, a semiconductor thermoelectric power generation layer disposed outside the first metal gas channel 300, and a first water-cooling jacket 302 disposed outside the semiconductor thermoelectric power generation layer. The first metal gas channel 300 is a circular cylindrical structure, and the first metal gas channel 300 allows gas to pass through, and it has a gas inlet and a gas outlet. A number of first enhanced heat transfer fins 303 are also provided on the inner wall of the first metal gas channel 300. The semiconductor thermoelectric power generation layer is an annular structure surrounding the outer wall of the first metal gas channel 300, and it includes a number of evenly distributed semiconductor thermoelectric generators 301. The semiconductor thermoelectric generator 301 is also called a semiconductor thermoelectric power generation chip. It uses the Seebeck effect of semiconductor materials to convert the thermal energy of the gas into electrical energy and transmit it to the electro-cooling conversion module 32. The semiconductor thermoelectric power generation chip includes a cold side and a hot side. The cold side is close to the first water-cooling jacket 302, and the hot side is close to the first metal gas channel 300. The first water-cooling jacket 302 is also an annular structure surrounding the outside of the semiconductor thermoelectric power generation layer, and it cools the cold side of the semiconductor thermoelectric power generation layer through circulating cooling water. Among them, the output wires of a single semiconductor thermoelectric power generation chip adopt a parallel and series form, so that a number of semiconductor thermoelectric power generation chips are integrated into a semiconductor thermoelectric power generation stack to increase the output voltage, current, and power.

[0037] The above-mentioned thermoelectric conversion module 30 is arranged in the high-temperature section of the gas. A temperature difference is formed between the high-temperature gas inside the wall surface and the circulating cooling water outside the wall. The Seebeck effect of the semiconductor material is used to convert the thermal energy of the high-temperature gas inside into electrical energy, and the electrical energy is output through the lead-out wire of the power generation stack, and the temperature of the gas is reduced. In order to improve the power generation efficiency in this section, the outlet gas temperature of this section is designed to be 80 °C.

[0038] Continue to refer to Figure 5 , in an embodiment of the present invention, the water cooling module 31 includes a second metal gas channel 310 and a second water cooling jacket 311 arranged outside the second metal gas channel 310. The second metal gas channel 310 is a circular cylinder structure. The second metal gas channel 310 allows gas to pass through, and it has a gas inlet and a gas outlet. A number of second enhanced heat transfer fins 312 are also arranged on the inner wall of the second metal gas channel 310. The second water cooling jacket 311 is also an annular structure, which surrounds the outside of the second metal gas channel 310, and it cools the gas through circulating cooling water.

[0039] The water cooling module 31 is arranged behind the thermoelectric conversion module 30, and the gas is continuously cooled to 40 °C by the normal-temperature circulating cooling water. This temperature is also the temperature that the general circulating cooling water can cool the gas to.

[0040] Continue to refer to Figure 6 and Figure 7 , in an embodiment of the present invention, the electro-cooling conversion module 32 includes a third metal gas channel 320, a semiconductor refrigeration layer arranged outside the third metal gas channel 320, and a third water cooling jacket 322 arranged outside the semiconductor refrigeration layer. The third metal gas channel 320 is a circular cylinder structure. The third metal gas channel 320 allows gas to pass through, and it has a gas inlet and a gas outlet. A number of third enhanced heat transfer fins 323 are also arranged on the inner wall of the third metal gas channel 320. The semiconductor refrigeration layer is an annular structure surrounding the outer wall of the third metal gas channel 320, and it includes a number of uniformly distributed semiconductor refrigerators 321. The semiconductor refrigerator 321 is also called a semiconductor refrigeration chip. The semiconductor refrigerator 321 receives the electrical energy transmitted by the thermoelectric conversion module 30, and uses the Peltier effect of the semiconductor material to cool the gas three times. The semiconductor refrigeration chip includes a cold side and a hot side. The cold side is close to the third metal gas channel 320, and the hot side is close to the third water cooling jacket 322. The third water cooling jacket 322 is also an annular structure, which surrounds the outside of the semiconductor refrigeration layer, and it cools the cold side of the semiconductor thermoelectric power generation layer through circulating cooling water. Among them, the input wires of a single semiconductor refrigeration chip adopt a parallel and series form, so that a number of semiconductor refrigeration chips are integrated into a semiconductor refrigeration stack to improve the refrigeration capacity and refrigeration efficiency.

[0041] The electro-cooling conversion module 32 is arranged in the low-temperature section of the gas, that is, behind the water-cooling module 31. By introducing the electric energy output by the thermoelectric conversion module 30, a temperature difference of 60 °C is formed on both sides of the wall by using the Peltier effect of semiconductor materials, that is, the temperature of the inner cold surface is 60 °C lower than that of the outer hot surface. The outer side is cooled by circulating cooling water to maintain an average of 35 °C, so the temperature that can be reached on the inner side is -25 °C. Heat exchange is carried out between the gas through the inner enhanced heat transfer fins. On the basis of the temperature reduction range that the water-cooling module 31 can reach, the gas is cooled again to reduce the temperature of the gas in the next compression stage and reduce the compression power consumption.

[0042] The internal gas channels of the above-mentioned first metal gas channel 300, second metal gas channel 310 and third metal gas channel 320 are connected in series in three sections to form a closed channel, and the external circulating cooling water jacket is independently arranged for each section.

[0043] Since there is a certain proportional relationship between the reduction of the intake temperature of a single compression stage and the reduction of the energy consumption of this compression stage, preferably, the electro-cooling conversion module 32 is arranged in the front stage of the compression stage with a relatively large single-stage compression power consumption, which is more conducive to reducing the energy consumption of the compressor system.

[0044] Please refer to Figure 8 , an energy-saving method for an energy-saving multi-stage compressor system as described above, comprising the following steps:

[0045] Step 1, the high-temperature gas output by the previous compression stage 2 enters the thermoelectric conversion module 30 through the pipeline. The thermoelectric conversion module 30 uses the Seebeck effect of semiconductor materials to convert the thermal energy of the high-temperature gas into electric energy and transmit it to the electro-cooling conversion module 32, and initially cools the high-temperature gas. The gas after the initial cooling enters the water-cooling module.

[0046] Step 2, the water-cooling module 31 performs secondary cooling on the gas, and the gas after the secondary cooling enters the electro-cooling conversion module 32.

[0047] Step 3, the electro-cooling conversion module 32 receives the electric energy transmitted by the thermoelectric conversion module 30, uses the Peltier effect of semiconductor materials to perform tertiary cooling on the gas, and conveys the gas after the tertiary cooling to the next compression stage 2.

[0048] Embodiment

[0049] I. Gas compression requirements and the structural form of the traditional compressor system

[0050] An air compressor with a compressed air volume of 225,000 Nm³ / h is required to compress the air pressure to 0.8 MPa(a). It is driven by a condensing steam turbine, and the steam consumed by the steam turbine is 4.0 MPa(a), 400 °C superheated steam, and the work done per ton of steam is 220 kW.h / t. To improve the compression efficiency, the compressor system is configured with two compression stages, and a circulating water cooler is set in the middle. The traditional system parameter indicators are as follows:

[0051]

[0052] II. Design steps and methods of the present invention

[0053] Equip the heat-electricity-cooling self-coupled composite inter-stage cooler 3 in the present invention between the first and second compression stages to cool the gas.

[0054] (I) Component matching

[0055] 1. Calculate the heat released by the gas as 10,461 kW according to the temperature of 80 °C of the gas leaving the first-stage heat-electric conversion module 30 of the inter-stage cooler. Based on the technical indicators of the semiconductor thermoelectric generation chip produced by Shenzhen Dahuineng Technology Co., Ltd. (model: TEG-10-6230, matching voltage: 4.2 V, matching current: 7.3 A, output power: 30.6 W, thermoelectric conversion efficiency: 5.1%), 17,500 single components are required;

[0056] 2. Design the series-parallel connection of single components according to the output voltage of 110 V. The power generation stack is connected in series with the positive and negative poles of 100 pieces in each group. The output voltage of a single string is 420 V, the current is 7.3 A, and there are 175 strings in total; after connecting the 175 strings in parallel with the positive and negative poles at the head and tail, a power generation stack is formed, with a total voltage of 420 V, a total current of 1,277.5 A, and a total output electric energy of 536 kW;

[0057] 3. The electric energy input to the third-stage electro-cooling conversion module 32 of the inter-stage cooler is the electric energy output by the first-stage heat-electric conversion module 30, that is, 536 kW. Based on the technical indicators of the semiconductor refrigeration chip produced by Anhui Fuxin Semiconductor Technology Co., Ltd. (model: TEC1-12715, rated voltage: 12 V, rated current: 15 A, input power: 180 W, refrigeration power: 150 W, refrigeration efficiency: 83.3%, temperature difference between the hot and cold surfaces: 60 °C), 2,975 single components are required, with a total refrigeration capacity of 446 kW. Each group of 35 pieces is connected in series with the positive and negative poles, and there are 85 strings in total. After connecting the 85 strings in parallel with the positive and negative poles at the head and tail, a refrigeration stack is formed, and the total voltage and current match the output parameters of the first-stage heat-electric conversion module 30.

[0058] (II) Design method of the inter-stage cooler

[0059] 1. The first-stage heat-electric conversion heat exchange module

[0060] Calculate the inner enhanced heat transfer structure and area according to factors such as the intake air temperature of 208 °C, the outlet air temperature of 80 °C, the gas heat transfer coefficient, and the gas channel flow velocity in accordance with the heat exchanger design specifications.

[0061] 2. The second-stage water-cooled heat exchange module

[0062] Calculate the inner enhanced heat transfer structure and area according to the intake air temperature of 80 °C, the outlet air temperature of 40 °C, and the circulating cooling water inlet temperature in accordance with the heat exchanger design specifications;

[0063] 3. The third-stage electric-cooling conversion heat exchange module

[0064] Based on the total refrigerating capacity, the gas temperature of the third-stage module is calculated to be 34.5 °C. Calculate the inner enhanced heat transfer structure and area according to the intake air temperature of 40 °C, the outlet air temperature of 34.5 °C, and the cold side wall temperature of -25 °C.

[0065] (III) Equipment integrated manufacturing

[0066] Perform processing and manufacturing according to the component matching results and the design results of the intermediate cooler cylinder body mechanism. After the overall assembly, connect it between the outlets and inlets of the two compression stages of the compressor.

[0067] III. Energy-saving operation effect

[0068] Using the technical solution of the present invention, by reducing the intake air temperature of the second compression stage, the power consumption of the second compression stage is reduced from the original 9464 kW to 9297 kW, and the overall compression system reduces the power consumption by 167 kW. According to the steam turbine work capacity of 220 kW·h / t, 0.76 t / h of steam is saved per hour. Calculated at a steam price of 250 yuan / t and an annual operation of 8400 h, the annual steam cost saved by this set of systems is 1.6416 million yuan. Calculated based on the compressor being used for 30 years, the cumulative savings is 49.248 million yuan, and the saved cost is much higher than the equipment procurement cost.

[0069] IV. Other preferred solutions of the present invention

[0070] According to the preferred solution of the present invention, preferentially reducing the inlet temperature of the compression stage with high energy consumption can achieve a better energy-saving effect. In the embodiment of the present invention, since the energy consumption of the first compression stage is 15277 kW, which is greater than the energy consumption of the second compression stage of 9464 kW, the electric-cooling conversion module is arranged at the inlet end of the first compression stage to reduce the inlet temperature of the first compression stage. The power consumption of the first compression stage can be reduced from 15277 kW to 14992 kW, and the steam compression system reduces the power consumption by 285 kW, which is 1.7 times that of the foregoing benefits.

[0071] Although embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An energy-saving multi-stage compressor system, comprising a multi-stage compressor unit and a steam turbine (1) for driving the multi-stage compressor unit to operate. The multi-stage compressor unit includes a number of compression stages (2) connected in series in sequence, and is characterized in that, At least two adjacent compression stages (2) are connected with a thermoelectric-cooling self-coupled composite inter-stage cooler (3) through pipeline cooperation. The thermoelectric-cooling self-coupled composite inter-stage cooler (3) includes a thermoelectric conversion module (30), a water-cooling module (31), and an electro-cooling conversion module (32) that are sequentially connected from the previous compression stage to the next compression stage; The thermoelectric conversion module (30) uses the Seebeck effect of semiconductor materials to convert the thermal energy of the gas into electrical energy and transmit it to the electro-cooling conversion module (32), and initially cools the gas; The water-cooling module (31) performs secondary cooling on the gas; The electro-cooling conversion module (32) receives the electrical energy transmitted by the thermoelectric conversion module (30), and uses the Peltier effect of semiconductor materials to perform tertiary cooling on the gas.

2. The energy-saving multi-stage compressor system according to claim 1, characterized in that, The thermoelectric conversion module (30) includes a first metal gas channel (300), a semiconductor thermoelectric power generation layer arranged outside the first metal gas channel (300), and a first water-cooling jacket (302) arranged outside the semiconductor thermoelectric power generation layer. The first metal gas channel (300) allows the gas to pass through. The semiconductor thermoelectric power generation layer includes a plurality of semiconductor thermoelectric generators (301). The semiconductor thermoelectric generators (301) use the Seebeck effect of semiconductor materials to convert the thermal energy of the gas into electrical energy and transmit it to the electro-cooling conversion module (32). The first water-cooling jacket (302) cools the cold side of the semiconductor thermoelectric power generation layer through cooling water.

3. The energy-saving multi-stage compressor system according to claim 2, wherein The inner wall of the first metal gas channel (300) is provided with first enhanced heat transfer fins (303).

4. An energy-saving multi-stage compressor system according to claim 1, characterized in that, The water-cooling module (31) includes a second metal gas channel (310) and a second water-cooling jacket (311) arranged outside the second metal gas channel (310). The second metal gas channel (310) allows the gas to pass through. The second water-cooling jacket (311) cools the gas through cooling water.

5. An energy-saving multi-stage compressor system according to claim 4, characterized in that, The inner wall of the second metal gas channel (310) is provided with second enhanced heat transfer fins (312).

6. The energy-saving multi-stage compressor system according to claim 1, wherein, The electro-cooling conversion module (32) includes a third metal gas channel (320), a semiconductor refrigeration layer arranged outside the third metal gas channel (320), and a third water-cooling jacket (322) arranged outside the semiconductor refrigeration layer. The third metal gas channel (320) allows the gas to pass through. The semiconductor refrigeration layer includes a plurality of semiconductor refrigerators (321). The semiconductor refrigerators (321) receive the electrical energy transmitted by the thermoelectric conversion module (30), and use the Peltier effect of semiconductor materials to perform tertiary cooling on the gas. The third water-cooling jacket (322) cools the hot side of the semiconductor refrigeration layer through cooling water.

7. An energy-saving multi-stage compressor system according to claim 6, characterized in that, The inner wall of the third metal gas channel (320) is provided with third enhanced heat transfer fins (323).

8. An energy-saving multi-stage compressor system according to claim 1, characterized in that, All adjacent compression stages (2) are connected with a thermoelectric-cooling self-coupled composite inter-stage cooler (3) through pipeline cooperation.

9. An energy-saving method for an energy-saving multi-stage compressor system as described in any one of claims 1-8, characterized in that, Including: Step 1: The thermoelectric conversion module (30) utilizes the Seebeck effect of semiconductor materials to convert the thermal energy of the gas discharged from the outlet of the previous compression stage (2) into electrical energy and transmit it to the electro-cooling conversion module (32), and initially cools the gas. Step 2: The water-cooling module (31) conducts secondary cooling on the gas. Step 3: The electro-cooling conversion module (32) receives the electrical energy transmitted by the thermoelectric conversion module (30), utilizes the Peltier effect of semiconductor materials to conduct tertiary cooling on the gas, and conveys the gas after tertiary cooling to the next compression stage (2).

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