Packaging structure and forming method thereof

Abstract

The invention discloses a packaging structure and a forming method thereof. The structure comprises a substrate; the optical module is arranged at the top of the substrate, the optical module comprises an optical chip and an optical bridge fixed in the optical chip, an optical transmission channel penetrating through the optical bridge is arranged in the optical bridge, a converter is arranged in the optical chip, and the optical transmission channel is aligned and coupled with the converter; and the heat dissipation cover is fixed on the top surface of the substrate, the optical module is located in a semi-closed space defined by the heat dissipation cover and the substrate, and the light transmission channel of the optical bridge is exposed out of the semi-closed space. The optical bridge is fixed in the optical chip, and the optical bridge is internally provided with the optical transmission channel penetrating through the optical bridge, so that the optical connection module can be coupled with the optical chip in a pluggable manner through the optical bridge, the coupling difficulty of the optical connection module and the optical bridge is reduced, the probability of damage and pollution to the optical chip is also reduced, and the reliability of the optical connection module is improved. Therefore, the product quality of the packaging structure is improved, and the production cost is reduced.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of semiconductor manufacturing, and in particular to a packaging structure and a method for forming the same. Background Art

[0002] With the rapid development of information technology, higher and higher requirements are placed on the transmission rate, latency, energy efficiency and other aspects of optical modules. The structure of traditional optical modules with separated optical chips and electrical chips can no longer meet the current demand for high-speed and high-efficiency signal transmission. The combined optical-electrical-package (CPO) structure came into being, which encapsulates the optical chip and the electrical chip in the same package, which can effectively improve signal transmission efficiency and reduce power consumption.

[0003] In the optoelectronic package structure, the coupling of the optical chip and the optical fiber module is one of the key links. Currently, the common coupling methods include edge coupling and surface coupling, and there are the following problems: 1. During the packaging process of the optical chip, its fragile optical port area is very easy to be damaged and contaminated, so the packaging structure and process will be limited, and the packaging cost is high and the yield is low; 2. After CPO packaging, the process of directly coupling the optical fiber module on the optical chip is difficult to operate, the yield is low, and mass production cannot be achieved; 3. The coupled optoelectronic module is reflowed on the board with the fragile optical fiber pigtail, and the optical fiber is easily damaged and cannot be reworked when hanging; 4. The optical fiber module cannot be disassembled after coupling with the optical chip. Once the optical fiber is damaged, it cannot be reworked, which will cause the entire optoelectronic module to be scrapped; 5. When the number of optical chips in the package increases exponentially, the risks of packaging and coupling are greater, the yield is lower, and mass production cannot be achieved.

[0004] Therefore, the product quality and production capacity of optoelectronic sealing structures still need to be improved. Summary of the invention

[0005] The problem solved by the embodiments of the present invention is to provide a packaging structure and a method for forming the same, thereby improving the product quality and production capacity of the packaging structure and reducing the production cost.

[0006] To solve the above problems, the present invention provides a packaging structure, including: a substrate; an optical module, arranged on the top of the substrate, the optical module including an optical chip and an optical bridge fixed in the optical chip, the optical bridge has an optical transmission channel running through the optical bridge, a converter is arranged in the optical chip, and the optical transmission channel is aligned and coupled with the converter; a heat dissipation cover, fixed on the top surface of the substrate, the optical module is located in a semi-enclosed space surrounded by the heat dissipation cover and the substrate, and the optical transmission channel of the optical bridge is exposed in the semi-enclosed space.

[0007] Correspondingly, an embodiment of the present invention also provides a method for forming a packaging structure, including: providing a substrate; setting an optical module on the top of the substrate, the optical module including an optical chip and an optical bridge fixed in the optical chip, the optical bridge having an optical transmission channel running through the optical bridge, a converter being provided in the optical chip, and the optical transmission channel is aligned and coupled with the converter; fixing a heat dissipation cover on the top surface of the substrate, the optical module being located in a semi-enclosed space surrounded by the heat dissipation cover and the substrate, and the optical transmission channel of the optical bridge is exposed in the semi-enclosed space.

[0008] Compared with the prior art, the technical solution of the embodiment of the present invention has the following advantages:

[0009] In the packaging structure provided by the embodiment of the present invention, the optical module is arranged on the top of the substrate, the optical module includes an optical chip and an optical bridge fixed in the optical chip, the optical bridge has an optical transmission channel running through the optical bridge, the optical chip is provided with a converter, and the optical transmission channel is aligned and coupled with the converter. Compared with the existing solution in which the optical connection module is directly coupled to the optical chip and the optical connection module and the optical chip are inseparable, the present invention fixes the optical bridge in the optical chip, and the optical bridge has an optical transmission channel running through the optical bridge, so that the optical connection module can be plugged into the optical bridge in a pluggable manner, thereby enabling the optical connection module to be separated from the optical chip through the optical bridge. In the event that the optical connection module is damaged, only the optical connection module needs to be replaced, which greatly increases the service life of the optical chip and reduces the use cost of the optical chip. In addition, through the optical bridge fixed in the optical chip, the optical connection module and the optical chip are coupled in a pluggable manner, thereby reducing In summary, by fixing the optical bridge in the optical chip, the optical bridge has an optical transmission channel running through the optical bridge, so that the optical connection module can be coupled to the optical chip in a pluggable manner through the optical bridge, which reduces the coupling difficulty between the optical connection module and the optical bridge, improves the product yield of the packaging structure, greatly increases the service life of the optical chip and reduces the cost of using the optical chip. At the same time, it also reduces the probability of damage and contamination to the optical chip, thereby improving the product quality and production capacity of the packaging structure, reducing the production cost, and realizing the mass production of the packaging structure.

[0010] In the method for forming a packaging structure provided by an embodiment of the present invention, an optical module is arranged on the top of a substrate, and the optical module includes an optical chip and an optical bridge fixed in the optical chip, the optical bridge has an optical transmission channel running through the optical bridge, a converter is provided in the optical chip, and the optical transmission channel is aligned and coupled with the converter. Compared with the existing solution in which the optical connection module is directly coupled to the optical chip and the optical connection module and the optical chip are inseparable, the present invention fixes an optical bridge in the optical chip, and the optical bridge has an optical transmission channel running through the optical bridge, so that the optical connection module can be plugged into the optical bridge in a pluggable manner, thereby enabling the optical connection module to be separated from the optical chip through the optical bridge. In the event that the optical connection module is damaged, only the optical connection module needs to be replaced, which greatly increases the service life of the optical chip and reduces the use cost of the optical chip. In addition, through the optical bridge fixed in the optical chip, the optical connection module and the optical chip are coupled in a pluggable manner, thereby reducing In summary, by fixing the optical bridge in the optical chip, the optical bridge has an optical transmission channel running through the optical bridge, so that the optical connection module can be coupled to the optical chip in a pluggable manner through the optical bridge, which reduces the coupling difficulty between the optical connection module and the optical bridge, improves the product yield of the packaging structure, greatly increases the service life of the optical chip and reduces the cost of using the optical chip. At the same time, it also reduces the probability of damage and contamination to the optical chip, thereby improving the product quality and production capacity of the packaging structure, reducing the production cost, and realizing the mass production of the packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figures 1 to 4 It shows a schematic structural diagram corresponding to the first embodiment of the packaging structure of the present invention;

[0012] Figure 5 It shows a schematic structural diagram corresponding to the second embodiment of the packaging structure of the present invention;

[0013] Figure 6 It shows a schematic structural diagram corresponding to the third embodiment of the packaging structure of the present invention;

[0014] Figure 7 It shows a schematic structural diagram corresponding to the fourth embodiment of the packaging structure of the present invention;

[0015] Figures 8 to 19 It shows a schematic structural diagram corresponding to each step in the first embodiment of the method for forming a packaging structure of the present invention;

[0016] Figure 20 to Figure 25 It shows a schematic structural diagram corresponding to each step in the second embodiment of the method for forming a packaging structure of the present invention;

[0017] Figure 26 to Figure 27It shows a schematic structural diagram corresponding to each step in the third embodiment of the method for forming a packaging structure of the present invention;

[0018] Fig.28 It shows a schematic structural diagram corresponding to each step in a fourth embodiment of a method for forming a packaging structure of the present invention;

[0019] Fig.29 A schematic structural diagram corresponding to each step in the fifth embodiment of the method for forming a packaging structure of the present invention is shown. DETAILED DESCRIPTION

[0020] As can be seen from the background technology, the product quality, production cost and production capacity of the optoelectronic sealing structure still need to be improved.

[0021] In order to solve the above technical problems, the present invention provides a packaging structure, including: a substrate; an optical module, arranged on the top of the substrate, the optical module includes an optical chip and an optical bridge fixed in the optical chip, the optical bridge has an optical transmission channel running through the optical bridge, a converter is arranged in the optical chip, and the optical transmission channel is aligned and coupled with the converter; a heat dissipation cover, fixed on the top surface of the substrate, the optical module is located in a semi-enclosed space surrounded by the heat dissipation cover and the substrate, and the optical transmission channel of the optical bridge is exposed in the semi-enclosed space.

[0022] In the packaging structure provided by the embodiment of the present invention, the optical module is arranged on the top of the substrate, the optical module includes an optical chip and an optical bridge fixed in the optical chip, the optical bridge has an optical transmission channel running through the optical bridge, the optical chip is provided with a converter, and the optical transmission channel is aligned and coupled with the converter. Compared with the existing solution in which the optical connection module is directly coupled to the optical chip and the optical connection module and the optical chip are inseparable, the present invention fixes the optical bridge in the optical chip, and the optical bridge has an optical transmission channel running through the optical bridge, so that the optical connection module can be plugged into the optical bridge in a pluggable manner, thereby enabling the optical connection module to be separated from the optical chip through the optical bridge. In the event that the optical connection module is damaged, only the optical connection module needs to be replaced, which greatly increases the service life of the optical chip and reduces the use cost of the optical chip. In addition, through the optical bridge fixed in the optical chip, the optical connection module and the optical chip are coupled in a pluggable manner, thereby reducing In summary, by fixing the optical bridge in the optical chip, the optical bridge has an optical transmission channel running through the optical bridge, so that the optical connection module can be coupled to the optical chip in a pluggable manner through the optical bridge, which reduces the coupling difficulty between the optical connection module and the optical bridge, improves the product yield of the packaging structure, greatly increases the service life of the optical chip and reduces the cost of using the optical chip. At the same time, it also reduces the probability of damage and contamination to the optical chip, thereby improving the product quality and production capacity of the packaging structure, reducing the production cost, and realizing the mass production of the packaging structure.

[0023] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present invention more obvious and understandable, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0024] in, Figures 1 to 4 The corresponding structural schematic diagram of the first embodiment of the packaging structure of the present invention is shown.

[0025] The packaging structure includes: a substrate 630; an optical module 690, which is arranged on the top of the substrate 630, the optical module 690 includes an optical chip 610 and an optical bridge 611 fixed in the optical chip 610, the optical bridge 611 has an optical transmission channel 612 running through the optical bridge 611, a converter 606 is arranged in the optical chip 610, and the optical transmission channel 612 is aligned and coupled with the converter 606; a heat dissipation cover 622, which is fixed on the top surface of the substrate 630, the optical module 690 is located in a semi-enclosed space surrounded by the heat dissipation cover 622 and the substrate 630, and the semi-enclosed space exposes the optical transmission channel 612 of the optical bridge 611.

[0026] Specifically, the optical module 690 is arranged on the top of the substrate 630. The optical module 690 includes an optical chip 610 and an optical bridge 611 fixed in the optical chip 610. The optical bridge 611 has an optical transmission channel 612 that runs through the optical bridge 611. A converter 606 is arranged in the optical chip 610, and the optical transmission channel 612 is aligned and coupled with the converter 606. Compared with the existing solution in which the optical connection module is directly coupled to the optical chip 610 and the optical connection module and the optical chip 610 are inseparable, the present embodiment fixes an optical bridge 611 in the optical chip 610, and the optical bridge 611 has an optical transmission channel 612 that penetrates the optical bridge 611, so that the optical connection module can be plugged into the optical bridge 611, so that the optical connection module can be separated from the optical chip 610 through the optical bridge 611. In the event that the optical connection module is damaged, only the optical connection module needs to be replaced, which greatly increases the service life of the optical chip 610 and reduces the use cost of the optical chip 610. In addition, through the optical bridge 611 fixed in the optical chip 610, the optical connection module and the optical chip 610 are coupled in a pluggable manner. Thereby, the coupling difficulty between the optical connection module and the optical chip 610 is reduced, and the risk of damage and contamination of the optical chip 610 is also reduced. In summary, by fixing the optical bridge 611 in the optical chip 610, the optical bridge 611 has an optical transmission channel 612 that runs through the optical bridge 611, so that the optical connection module can be pluggably coupled with the optical chip 610 through the optical bridge 611, thereby reducing the coupling difficulty between the optical connection module and the optical bridge 611, improving the product yield of the packaging structure, greatly increasing the service life of the optical chip 610 and reducing the use cost of the optical chip 610. At the same time, it also reduces the probability of damage and contamination to the optical chip 610, thereby improving the product quality and production capacity of the packaging structure, reducing the production cost, and realizing the mass production of the packaging structure.

[0027] Specifically, the substrate 630 provides a process platform for setting up the optical module 690 .

[0028] It should be noted that the substrate 630 has a circuit line inside, so that the optical module 690 disposed on the substrate 630 can be electrically connected to an external circuit through the substrate 630 and to other chips disposed on the substrate 630 .

[0029] As an example, the substrate 630 includes one or more of an organic substrate, a ceramic substrate, and a glass substrate.

[0030] In this embodiment, the substrate 630 has a first notch 631 .

[0031] Specifically, the substrate 630 has a first notch 631, and the first notch 631 exposes the optical coupling area 600B of the optical chip 610, wherein the optical coupling area 600B is the area for subsequently fixing the optical bridge 611. The first notch 631 is set on the substrate 630 to provide sufficient operating space for fixing the optical bridge 611. At the same time, it also provides a plug-in and unplug space for the subsequent detachable optical connection module 643 to be inserted into the optical bridge 611, thereby reducing the operating difficulty between the detachable optical connection module 643 and the optical bridge 611.

[0032] It should be noted that the first notch 631 provides sufficient operating space for fixing the optical bridge 611 , which means that after the optical chip 610 is flip-chip mounted on the substrate 630 , the first notch 631 provides operating space for subsequently fixing the optical bridge 611 in the optical chip 610 .

[0033] In this embodiment, in the step of disposing the optical module 690 on the top of the substrate 630 , the number of the optical module 690 is one.

[0034] It should be noted that, for the convenience of illustration, the number of optical modules 690 shown is one, and in other embodiments, the number of optical modules 690 may also be multiple, which is not limited here.

[0035] In this embodiment, the optical chip 610 includes an optical coupling region 600B and an interconnection region 600A adjacent thereto, and the thickness of the optical coupling region 600B of the optical chip 610 is smaller than the thickness of the interconnection region 600A of the optical chip 610 , and the optical bridge 611 is fixed in the optical coupling region 600B of the optical chip 610 .

[0036] It should be noted that the optical coupling region 600B is a region where the optical bridge 611 is disposed, so that the optical chip 610 can be coupled and aligned with an external optical connector through the optical bridge 611 .

[0037] Specifically, the optical coupling region 600B is located at an edge region of the optical chip 610 .

[0038] The interconnection area 600A is an area where the first conductive bump 602 is subsequently set, so that the electrical properties of the optical chip 610 can be brought out through the first conductive bump 602, so that the optical chip 610 can be electrically connected to the substrate 630, or the optical chip 610 can be electrically connected to other chips (such as the electrical chip 620).

[0039] It should be noted that the top surface of the optical coupling area 600B is lower than the top surface of the interconnection area 600A, which means that the thickness of the optical coupling area 600B of the optical chip 610 is less than the thickness of the interconnection area 600A of the optical chip 610, thereby providing a spatial position for subsequently fixing the optical bridge 611 in the optical coupling area 600B. In addition, the top surface of the optical coupling area 600B is lower than the top surface of the interconnection area 600A, which also enables the optical coupling area 600B to expose the side wall of the optical chip 610 in the interconnection area 600A, so that the converter 606 facing the optical coupling area 600B can be set on the side wall of the optical chip 610 in the interconnection area 600A, so that the optical bridge 611 fixed to the optical coupling area 600B can be coupled and aligned with the converter 606.

[0040] Specifically, the optical bridge 611 and the converter 606 are coupled and aligned to avoid coupling loss between the optical chip 610 and the optical bridge 611 due to mode field size mismatch, ensuring that optical signals can be efficiently transmitted between different media, thereby improving the coupling efficiency between the optical bridge 611 and the optical chip 610.

[0041] In this embodiment, the optical chip 610 is flipped and arranged on the top of the substrate 630, and the packaging structure also includes: a first conductive bump 602, which is located on the front side of the interconnection area 600A of the optical chip 610, and the first conductive bump 602 is electrically connected to the optical chip 610 and the substrate 630, and the first notch 631 exposes the optical bridge 611 of the optical coupling area 600B.

[0042] Specifically, the first conductive bump 602 is used to electrically lead out the optical chip 610 . After the optical chip 610 is inverted and disposed on the substrate 630 , the optical chip 610 can be electrically connected to the substrate 630 through the first conductive bump 602 .

[0043] It should be noted that the first conductive bump 602 is formed on the front side of the interconnection region 600A of the optical chip 610 . After the optical chip 610 is inverted and disposed on the substrate 630 , the front side of the optical chip 610 faces the substrate 630 .

[0044] In this embodiment, a plurality of grooves extending in the same direction are disposed on the optical coupling region 600B of the optical chip 610 , and a converter 606 is disposed on the side of the optical chip 610 where the interconnection region 600A is exposed from the optical coupling region 600B.

[0045] It should be noted that the groove is used to align with the protrusion 613 on the optical bridge 611. By placing the protrusion 613 in the groove and applying fixing glue to the protrusion 613 and the groove, the optical bridge 611 can be fixed on the optical coupling area 600B of the optical chip 610.

[0046] It should also be noted that a converter 606 is provided on the side of the optical chip 610 in the interconnection area 600A exposed in the optical coupling area 600B, so that the optical bridge 611 fixed in the optical coupling area 600B can be coupled and aligned with the converter 606, thereby avoiding coupling loss between the optical chip 610 and the optical bridge 611 due to mode field size mismatch.

[0047] In this embodiment, the groove extends from a position close to the interconnection area 600A to the side of the optical coupling area 600B, so that the protrusion 613 on the optical bridge 611 can slide into the groove and be fixed, and then fixing glue is applied to the protrusion 613 and the groove, so that the optical bridge 611 can be fixed on the optical coupling area 600B of the optical chip 610.

[0048] In this embodiment, the groove is V-shaped.

[0049] Specifically, the width of the V-shaped groove gradually decreases toward the bottom of the groove. After the optical bridge 611 is placed in the groove, the side walls of the groove can support the protrusion 613, reducing the risk of the optical bridge 611 shaking in the groove, thereby reducing the difficulty of subsequently fixing the optical bridge 611 in the optical chip 610 by fixing glue, and also reducing the risk of failure to achieve alignment coupling between the optical bridge 611 and the converter 606.

[0050] Specifically, the optical bridge 611 is fixed in the optical coupling region 600B of the optical chip 610 , so that the optical connection module subsequently inserted into the optical bridge 611 can transmit signals with the optical chip 610 through the optical bridge 611 .

[0051] In this embodiment, see Figure 2 The optical bridge 611 has a plurality of protrusions 613 on the surface facing the optical chip 610, and an optical transmission channel 612 is provided inside the optical bridge 611 and penetrates the optical bridge 611. The extension direction of the protrusions 613 is the same as the extension direction of the grooves. The positions of the protrusions 613 and the grooves correspond one to one and are fixed in the grooves. The optical transmission channel 612 is aligned and coupled with the converter 606.

[0052] As an example, the material of the optical bridge 611 includes one or more of ceramic, resin, glass, and polymer.

[0053] Specifically, the extension direction of the protrusion 613 is the same as the extension direction of the groove, and the positions of the protrusion 613 and the groove correspond one to one, so that each protrusion 613 can be accurately placed in the groove, thereby improving the bonding strength between the optical bridge 611 and the chip.

[0054] In this embodiment, see Figure 1The optical bridge 611 includes a fixed area 601B and a light transmission area 601A located between adjacent fixed areas 601B, the protrusion 613 is located on the surface of the optical bridge 611 in the fixed area 601B, the light transmission channel 612 is located inside the optical bridge 611 in the light transmission area 601A, and the extension direction of the protrusion 613 is the same as the extension direction of the light transmission channel 612.

[0055] It should be noted that the optical bridge 611 includes a fixed area 601B and a light transmission area 601A located between adjacent fixed areas 601B, which means that the fixed area 601B is located at the edge areas on both sides of the optical bridge 611, and the light transmission area 601A is located at the middle area of ​​the optical bridge 611. By arranging protrusions 613 at the edge areas on both sides of the optical bridge 611, while fixing the optical bridge 611 to the optical chip 610, sufficient space is reserved for the light transmission channel 612.

[0056] In this embodiment, the optical transmission channel 612 includes one or both of an optical fiber channel and an optical waveguide.

[0057] Specifically, both the optical fiber channel and the optical waveguide can realize the transmission of optical signals, which is not limited here.

[0058] In this embodiment, the packaging structure further includes: a fixing glue covering the protrusion 613 and the groove, suitable for fixing the protrusion 613 in the groove.

[0059] Specifically, the fixing glue plays a fixing role, and can fasten the optical bridge 611 to the optical chip 610 , thereby reducing the risk of positional displacement and falling off between the optical bridge 611 and the optical chip 610 .

[0060] In this embodiment, the packaging structure further includes: optical glue, which is located at the coupling position between the optical transmission channel 612 and the converter 606 and is suitable for aligning and coupling the optical transmission channel 612 and the converter 606 .

[0061] It should be noted that the optical glue has excellent light transmittance and matches the refractive index of the coupling material, which can ensure that all optical signals in the optical transmission channel 612 enter the converter 606, reducing the probability of scattering loss of the optical signal.

[0062] It should also be noted that the optical adhesive is a dual-curing adhesive that combines ultraviolet curing and thermal curing.

[0063] In this embodiment, the length of the groove in the extension direction is equal to or unequal to the length of the protrusion 613 in the extension direction.

[0064] Specifically, the length of the groove in the extension direction is equal to the length of the protrusion 613 in the extension direction, or the length of the protrusion 613 in the extension direction is longer than the length of the groove in the extension direction, so that the protrusion 613 can completely occupy the space of the groove in the extension direction, reducing the probability of gaps in the groove in the extension direction, thereby reducing the risk of shaking between the optical bridge 611 and the groove.

[0065] In this embodiment, the optical chip 610 is flipped and disposed on top of the substrate 630 , and the packaging structure further includes: a bottom filling layer 621 filled between the interconnection area of ​​the optical chip 610 and the substrate 630 and covering the first conductive bump 602 .

[0066] Specifically, the bottom filling layer 621 protects the exposed first conductive bumps 602 and also electrically isolates adjacent first conductive bumps 602 .

[0067] In this embodiment, the packaging structure further includes: an electric chip 620 disposed on a substrate 630 , the electric chip 620 is electrically connected to the substrate 630 , and the electric chip 620 is spaced apart from the optical module 690 .

[0068] It should be noted that an electric chip 620 is arranged on the substrate 630, and the electric chip 620 is electrically connected to the substrate 630, so that the electric chip 620 can be electrically connected to the optical chip 610 through the substrate 630. After the optical chip 610 converts the optical signal into an electric signal, it is transmitted to the electric chip 620 through the substrate 630 for processing. In addition, through the close integration of the electric chip 620 with the optical chip 610, the electric chip 620 can reduce the loss of electric signal transmission and reduce the overall power consumption of the packaging structure.

[0069] It should also be noted that the electronic chip 620 can be disposed on the substrate 630 in a face-up or flip-down manner, which is not limited here.

[0070] Specifically, the heat dissipation cover 622 is used to dissipate the heat generated by the optical chip 610 and the electrical chip 620 in a timely manner, reducing the probability of electrical failure of the optical chip 610 and the electrical chip 620 due to excessive heat concentration, thereby improving the reliability of the packaging structure.

[0071] It should be noted that after the heat dissipation cover 622 is fixed on the top surface of the substrate 630, heat dissipation glue is provided on the top surfaces of the optical chip 610 and the electric chip 620, and the heat dissipation cover 622 is in contact with the optical chip 610 and the electric chip 620 through the heat dissipation glue, so that the heat of the optical chip 610 and the electric chip 620 can be diffused into the heat dissipation cover 622 through the heat dissipation glue, and then the heat is dissipated through the heat dissipation cover 622.

[0072] In this embodiment, the semi-enclosed space exposes the optical transmission channel 612 of the optical bridge 611 , and reserves an operable space for subsequently inserting the detachable optical connection module 643 into the optical transmission channel 612 .

[0073] It should be noted that if Figure 4 As shown, the inner surface of the heat dissipation cover 622 facing the optical chip 610 and the electrical chip 620 is a flat surface, which means that the top surfaces of the optical chip 610 and the electrical chip 620 are flush. In other embodiments, the top surfaces of the optical chip 610 and the electrical chip 620 may not be flush, and accordingly, the inner surface of the heat dissipation cover 622 facing the optical chip 610 and the electrical chip 620 also has a convex surface, which is in contact with the electrical chip 620 or the optical chip 610, so that the inner surface of the heat dissipation cover 622 can be in contact with the optical chip 610 and the electrical chip 620.

[0074] In this embodiment, the packaging structure further includes: a second conductive bump 640 formed on the back side of the substrate 630 .

[0075] Specifically, the second conductive bumps 640 are used to electrically lead out the optical chip 610 , the electrical chip 620 and the substrate 630 , so that the optical chip 610 and the electrical chip 620 can be electrically connected to the circuit carrier 641 through the second conductive bumps 640 .

[0076] In this embodiment, the packaging structure further includes: a circuit carrier 641 , a device module consisting of a substrate 630 , an optical module 690 and a heat dissipation cover 622 is welded on the circuit carrier 641 , and the device module is electrically connected to the circuit carrier 641 via a second conductive bump 640 .

[0077] In this embodiment, the packaging structure further includes: a detachable optical connection module 643 inserted into the optical bridge 611 .

[0078] It should be noted that the detachable optical connection module 643 is inserted into the optical bridge 611, so that the detachable optical connection module 643 and the optical chip 610 are coupled in a pluggable manner, thereby reducing the difficulty of coupling the optical connection module and the optical chip 610, and also reducing the risk of damage and contamination of the optical chip 610. Moreover, in the event that the detachable optical connection module 643 is damaged, it is only necessary to replace the detachable optical connection module 643, which greatly increases the service life of the optical chip 610 and reduces the use cost of the optical chip 610, thereby improving the product quality, production cost and production capacity of the packaging structure, and realizing mass production of the packaging structure.

[0079] As an example, the detachable optical connection module 643 has multiple optical connection ferrules, and the positions of the optical connection ferrules correspond one-to-one to the positions of the optical transmission channel 612 , and the optical connection ferrules of the detachable optical connection module 643 are inserted into the optical transmission channel 612 .

[0080] Figure 5 The corresponding structural schematic diagram of the second embodiment of the packaging structure of the present invention is shown.

[0081] The similarities between the embodiment of the present invention and the first embodiment are not repeated here. The differences between the embodiment of the present invention and the first embodiment are as follows:

[0082] In this embodiment, the heat dissipation cover 770 has a second notch 760 .

[0083] Specifically, the heat dissipation cover 770 has a second notch 760, and the second notch 760 exposes the optical coupling area of ​​the optical chip 710, wherein the optical coupling area is the area for fixing the optical bridge 711. By setting the second notch 760, sufficient operating space is provided for fixing the optical bridge 711. At the same time, a plugging and unplugging space is provided for inserting a detachable optical connection module into the optical transmission channel of the optical bridge 711, thereby reducing the operating difficulty between the detachable optical connection module and the optical bridge 711.

[0084] In this embodiment, the optical chip 710 includes an optical coupling region and an interconnection region adjacent thereto, and the thickness of the optical coupling region of the optical chip 710 is smaller than the thickness of the interconnection region of the optical chip 710 , and the optical bridge 711 is fixed in the optical coupling region of the optical chip 710 .

[0085] In this embodiment, the optical chip 710 is disposed upright on the top of the substrate, and the packaging structure further includes: a patch adhesive 799 located on the back of the optical chip 710, and a second notch 760 exposes the optical bridge 711 of the optical coupling area.

[0086] It should be noted that the back side of the optical chip 710 is mounted on the substrate, which means that the optical chip 710 is a front-mounted chip.

[0087] It should also be noted that the patch adhesive 799 serves to fix the optical chip 710 on the substrate.

[0088] As an example, the patch adhesive 799 can be a conductive adhesive or a non-conductive adhesive, and the patch adhesive 799 is only used to physically bond the optical chip 710 to the substrate and has no electrical connection function.

[0089] Specifically, the electrical connection between the optical chip 710 and the substrate needs to be made through wire bonding.

[0090] In this embodiment, the packaging structure further includes: an electrical chip 720, which is disposed on the optical chip 710 of the optical module. The electrical chip 720 is electrically connected to the optical module, and the optical module and the electrical chip 720 are used as an optoelectronic co-sealed module.

[0091] Specifically, the electrical chip 720 is electrically connected to the optical module. The optical chip 710 converts the optical signal into an electrical signal and then transmits it to the electrical chip 720 for processing. In addition, the electrical chip 720 is arranged on the optical module. The electrical chip 720 can reduce the loss of electrical signal transmission and reduce the overall power consumption of the packaging structure. At the same time, the electrical chip 720 is arranged on the optical module, which also provides a spatial location for arranging other electronic components on the side of the optoelectronic co-sealed module.

[0092] As an example, the electrical chip 720 is disposed on the optical module by flip-chip mounting.

[0093] As an example, when an optoelectronic co-sealed module is disposed on the substrate, the packaging structure further includes: an application specific integrated circuit chip 798 (ASIC), which is located on the substrate at the side of the optoelectronic co-sealed module.

[0094] It should be noted that the dedicated integrated electrical chip 798 is highly optimized for specific application scenarios to achieve higher performance, lower power consumption and smaller size, so that the dedicated integrated electrical chip 798 can provide higher processing speed and efficiency for the electrical chip 720 and the optical chip 710.

[0095] Figure 6 The corresponding structural schematic diagram of the third embodiment of the packaging structure of the present invention is shown.

[0096] The similarities between the embodiment of the present invention and the first embodiment are not repeated here. The differences between the embodiment of the present invention and the first embodiment are as follows:

[0097] In this embodiment, the packaging structure further includes: an electric chip 820 disposed on a substrate 830 , and the electric chip 820 is electrically connected to the substrate 830 .

[0098] Specifically, an electric chip 820 is disposed on the substrate 830 and is electrically connected to the substrate 830. The optical chip 810 converts the optical signal into an electric signal and then transmits the electric signal to the electric chip 820 for processing and calculation. Furthermore, by closely integrating the electric chip 820 with the optical chip 810, the electric chip 820 can reduce the loss of electric signal transmission and reduce the overall power consumption of the packaging structure.

[0099] It should be noted that the electrical chip 820 is a chip having interconnected through silicon vias (TSV).

[0100] In other embodiments, the electrical chip 820 may also be a wafer-level chip fan-out structure.

[0101] In this embodiment, the optical module 890 is disposed on the electrical chip 820 , the optical module 890 is electrically connected to the electrical chip 820 , and the optical module 890 and the electrical chip 820 are used as an optoelectronic co-sealed module.

[0102] Specifically, the optical module 890 is electrically connected to the electrical chip 820 , so that the optical chip 810 can be electrically connected to the substrate 830 through the electrical chip 820 .

[0103] It should be noted that the optical chip 810 is a flip chip.

[0104] Specifically, the optical module 890 and the electrical chip 820 serve as an optoelectronic co-sealed module, which also provides a space for arranging other electronic components (such as a dedicated integrated electrical chip) on the side of the optoelectronic co-sealed module.

[0105] Figure 7 A corresponding structural schematic diagram of the fourth embodiment of the packaging structure of the present invention is shown.

[0106] The similarities between the embodiment of the present invention and the first embodiment are not repeated here. The differences between the embodiment of the present invention and the first embodiment are as follows:

[0107] In this embodiment, there are multiple optical modules 910 disposed on the top of the substrate 900 .

[0108] Specifically, a plurality of optical modules 910 are disposed on the top of the substrate 900, which can further improve the integration of the packaging structure.

[0109] In this embodiment, when there are multiple optical modules 910 , the multiple optical modules 910 are located on the same side of the substrate 900 ; or, when there are multiple optical modules 910 , the multiple optical modules 910 are located on different sides of the substrate 900 .

[0110] It should be noted that, in combination with different design requirements, multiple optical modules 910 are located on the same side of the substrate 900, or multiple optical modules 910 are located on different sides of the substrate 900, which is not limited here.

[0111] Accordingly, an embodiment of the present invention further provides a method for forming a packaging structure. Figures 8 to 19 The schematic diagram of the structure corresponding to each step in the first embodiment of the method for forming a packaging structure of the present invention is shown.

[0112] refer to Figure 8 , providing a substrate 130.

[0113] Specifically, the substrate 130 provides a process platform for the subsequent arrangement of the optical module.

[0114] It should be noted that the substrate 130 has a circuit line inside, so that the optical module subsequently arranged on the substrate 130 can be electrically connected to the external circuit through the substrate 130 and to other chips arranged on the substrate 130.

[0115] As an example, the substrate 130 includes one or more of an organic substrate, a ceramic substrate, and a glass substrate.

[0116] In this embodiment, in the step of providing the substrate 130 , the substrate 130 has a first notch 131 .

[0117] Specifically, the substrate 130 has a first notch 131, and the first notch 131 exposes an optical coupling area of ​​a subsequently arranged optical chip, wherein the optical coupling area is an area for subsequently fixing the optical bridge. By setting the first notch 131 on the substrate 130, sufficient operating space is provided for fixing the optical bridge. At the same time, a plugging and unplugging space is provided for the subsequent detachable optical connection module to be inserted into the optical bridge, thereby reducing the operating difficulty between the detachable optical connection module and the optical bridge.

[0118] It should be noted that the first notch 131 provides sufficient operating space for fixing the optical bridge, which means that after the optical chip is flip-chip mounted on the substrate 130 , the first notch 131 provides operating space for subsequently fixing the optical bridge in the optical chip.

[0119] refer to Figures 9 to 13 An optical module 190 is arranged on the top of the substrate 130. The optical module 190 includes an optical chip 110 and an optical bridge 111 fixed in the optical chip 110. The optical bridge 111 has an optical transmission channel 112 running through the optical bridge 111. A converter 106 (Spot Size Converter, SSC) is arranged in the optical chip 110, and the optical transmission channel 112 is aligned and coupled with the converter 106.

[0120] Specifically, by fixing the optical bridge 111 in the optical chip 110, the optical bridge 111 has an optical transmission channel 112 that penetrates the optical bridge 111, so that the optical connection module can be plugged into the optical bridge 111, so that the optical connection module can be separated from the optical chip 110 through the optical bridge 111. In the case where the optical connection module is damaged, only the optical connection module needs to be replaced, which greatly increases the service life of the optical chip 110 and reduces the cost of using the optical chip 110. In addition, by fixing the optical bridge 111 in the optical chip 110, the optical connection module and the optical chip 110 are coupled in a pluggable manner, thereby reducing the optical The coupling difficulty of the connection module and the optical chip 110 is increased, and the risk of damage and contamination of the optical chip 110 is also reduced. In summary, by fixing the optical bridge 111 in the optical chip 110, the optical bridge 111 has an optical transmission channel 112 that runs through the optical bridge 111, so that the optical connection module can be coupled with the optical chip 110 in a pluggable manner through the optical bridge 111, which greatly increases the service life of the optical chip 110 and reduces the use cost of the optical chip 110. At the same time, it also reduces the probability of damage and contamination to the optical chip 110, thereby improving the product quality and production capacity of the packaging structure, reducing the production cost, and realizing the mass production of the packaging structure.

[0121] In this embodiment, in the step of disposing the optical module 190 on the top of the substrate 130 , the number of the optical module 190 is one.

[0122] It should be noted that, for the convenience of illustration, the number of optical modules 190 shown is one, and in other embodiments, the number of optical modules 190 may also be multiple, which is not limited here.

[0123] Combined with reference Figures 9 to 13 , the steps of setting the optical module 190 on the substrate 130 are described in detail.

[0124] refer to Fig. 9 , providing a device wafer 100, the device wafer 100 includes a plurality of optical chips 110, the optical chip 110 includes an optical coupling region 100B and an interconnection region 100A adjacent thereto, and a top surface of the optical coupling region 100B of the optical chip 110 is lower than a top surface of the interconnection region 100A of the optical chip 110.

[0125] Specifically, the device wafer 100 includes a plurality of optical chips 110 , which facilitates subsequent cutting of adjacent optical chips 110 to form a plurality of optical modules 190 , thereby achieving mass production of the optical modules 190 .

[0126] It should be noted that the optical coupling region 100B is a region where the optical bridge 111 is subsequently disposed, so that the optical chip 110 can be coupled and aligned with an external optical connector through the optical bridge 111 .

[0127] Specifically, the optical coupling region 100B is located at an edge region of the optical chip 110 .

[0128] The interconnection area 100A is an area where the first conductive bump is subsequently set, so that the electrical properties of the optical chip 110 can be brought out through the first conductive bump, so that the optical chip 110 can be electrically connected to the substrate 130, or the optical chip 110 can be electrically connected to other chips (such as electrical chips).

[0129] It should be noted that the top surface of the optical coupling area 100B of the optical chip 110 is lower than the top surface of the interconnection area 100A of the optical chip 110, which means that the thickness of the optical coupling area 100B of the optical chip 110 is less than the thickness of the interconnection area 100A of the optical chip 110, thereby providing a spatial position for subsequently fixing the optical bridge 111 in the optical chip 110 in the optical coupling area 100B. In addition, the top surface of the optical coupling area 100B is lower than the top surface of the interconnection area 100A, which also enables the optical coupling area 100B to expose the side wall of the optical chip 110 in the interconnection area 100A, thereby enabling a converter 106 facing the optical coupling area 100B to be set on the side wall of the optical chip 110 in the interconnection area 100A, so that the optical bridge 111 subsequently fixed to the optical coupling area 100B can be coupled and aligned with the converter 106.

[0130] Specifically, the optical bridge 111 and the converter 106 are coupled and aligned to avoid coupling loss caused by mode field size mismatch between the optical chip 110 and the optical bridge 111, ensuring that optical signals can be efficiently transmitted between different media, thereby improving the coupling efficiency between the optical bridge 111 and the optical chip 110.

[0131] As an example, in the step of providing the device wafer 100 , a first conductive bump 102 is formed on the front surface of the interconnection region 100A of the optical chip 110 , and the first conductive bump 102 is electrically connected to the optical chip 110 .

[0132] Specifically, the first conductive bump 102 is used to electrically lead out the optical chip 110 , and after the optical chip 110 is subsequently inverted and disposed on the substrate 130 , the optical chip 110 can be electrically connected to the substrate 130 through the first conductive bump 102 .

[0133] It should be noted that the first conductive bump 102 is formed on the front side of the interconnection region 100A of the optical chip 110 . After the optical chip 110 is subsequently inverted and disposed on the substrate 130 , the front side of the optical chip 110 faces the substrate 130 .

[0134] In this embodiment, in the step of providing the device wafer 100, a plurality of grooves 101 extending in the same direction are formed in the optical coupling region 100B of the optical chip 110, and a converter 106 is provided on the side of the optical chip 110 where the interconnection region 100A is exposed in the optical coupling region 100B.

[0135] It should be noted that the groove 101 is used to align with the protrusion on the optical bridge 111 later. By placing the protrusion in the groove 101 and applying fixing glue to the protrusion and the groove 101, the optical bridge 111 can be fixed in the optical coupling area 100B of the optical chip 110.

[0136] It should also be noted that a converter 106 is provided on the side of the optical chip 110 in the interconnection area 100A exposed in the optical coupling area 100B, so that the optical bridge 111 subsequently fixed in the optical coupling area 100B can be coupled and aligned with the converter 106, thereby avoiding coupling loss between the optical chip 110 and the optical bridge 111 due to mode field size mismatch.

[0137] As an example, the process of forming the groove 101 in the light coupling region 100B of the optical chip 110 includes a dry etching or laser etching process.

[0138] In this embodiment, the groove 101 is in a V-shape.

[0139] Specifically, the width of the V-shaped groove 101 gradually decreases toward the bottom of the groove 101. After the optical bridge 111 is placed in the groove 101, the side wall of the groove 101 can play a role in supporting the protrusion, reducing the risk of the optical bridge 111 shaking in the groove 101, thereby reducing the difficulty of subsequently fixing the optical bridge 111 in the optical chip 110 by fixing glue, and also reducing the risk of failure to achieve alignment coupling between the optical bridge 111 and the converter 106.

[0140] refer to Figures 10 to 12 , an optical bridge 111 is fixed in the optical coupling region 100B of the optical chip 110 .

[0141] Specifically, the optical bridge 111 is fixed in the optical coupling region 100B of the optical chip 110 , so that the optical connection module subsequently inserted into the optical bridge 111 can transmit signals with the optical chip 110 through the optical bridge 111 .

[0142] As an example, the step of fixing the optical bridge 111 in the optical coupling area 100B of the optical chip 110 includes: providing an optical bridge 111, and having a plurality of protrusions 113 on the surface of the optical bridge 111 facing the optical chip 110, and an optical transmission channel 112 is formed inside the optical bridge 111 and passes through the optical bridge 111, the extension direction of the protrusion 113 is the same as the extension direction of the groove 101, and the positions of the protrusion 113 and the groove 101 correspond one to one; fixing the protrusion 113 in the groove 101, and aligning and coupling the optical transmission channel 112 with the converter 106.

[0143] In this embodiment, the process of forming the light transmission channel 112 penetrating the optical bridge 111 inside the optical bridge 111 includes one or more of a 3D printing process, an ultrashort pulse laser direct writing process, and an exposure process.

[0144] As an example, the material of the optical bridge 111 includes one or more of ceramic, resin, glass, and polymer.

[0145] Specifically, the method for forming the optical bridge 111 includes: when the material of the optical bridge 111 is ceramic, using ultra-high precision 3D printing molding technology to print out a structure containing an internal light transmission channel 112 with ceramic slurry; when the material of the optical bridge 111 is resin, using ultra-high precision 3D printing molding technology to print out a structure containing an internal light transmission channel 112 with photosensitive resin; when the material of the optical bridge 111 is glass, using ultra-short pulse laser direct writing technology to process a structure containing a light transmission channel 112 inside the glass, wherein the light transmission channel 112 is an optical waveguide; when the material of the optical bridge 111 is polymer, using exposure technology to process fine optical circuits on the polymer material to form a flexible optical circuit film; when the material of the optical bridge 111 is glass and polymer, one or more layers of polymer optical waveguide flexible sheets and glass are laminated and combined to form an optical bridge 111 composed of glass + polymer.

[0146] In other embodiments, the optical bridge may be made of other materials, which are not limited here.

[0147] Specifically, the extension direction of the protrusion 113 is the same as that of the groove 101, and the positions of the protrusion 113 and the groove 101 correspond one to one, so that each protrusion 113 can be accurately placed in the groove 101, thereby improving the bonding strength between the optical bridge 111 and the chip.

[0148] In this embodiment, in the step of providing the optical bridge 111, the optical bridge 111 includes a fixed area 601B and a light transmission area 101A located between adjacent fixed areas 601B, the protrusion 113 is located on the surface of the optical bridge 111 in the fixed area 601B, the light transmission channel 112 is located inside the optical bridge 111 in the light transmission area 101A, and the extension direction of the protrusion 113 is the same as the extension direction of the light transmission channel 112.

[0149] It should be noted that the optical bridge 111 includes a fixed area 601B and a light transmission area 101A located between adjacent fixed areas 601B, which means that the fixed area 601B is located at the edge areas on both sides of the optical bridge 111, and the light transmission area 101A is located at the middle area of ​​the optical bridge 111. By arranging the protrusions 113 at the edge areas on both sides of the optical bridge 111, while fixing the optical bridge 111 to the optical chip 110, sufficient space is reserved for the light transmission channel 112.

[0150] In this embodiment, the optical transmission channel 112 includes one or both of an optical fiber channel and an optical waveguide.

[0151] Specifically, both the optical fiber channel and the optical waveguide can realize the transmission of optical signals, which is not limited here.

[0152] As an example, the steps of fixing the protrusion 113 in the groove 101 and aligning and coupling the optical transmission channel 112 with the converter 106 include: fixing the protrusion 113 in the groove 101 by fixing glue; after the protrusion 113 is fixed in the groove 101, aligning and coupling the optical transmission channel 112 with the converter 106 by optical glue.

[0153] Specifically, the fixing glue plays a fixing role, and can fasten the optical bridge 111 to the optical chip 110 , thereby reducing the risk of the optical bridge 111 and the optical chip 110 falling off.

[0154] refer to Fig.13 , adjacent optical chips 110 are cut.

[0155] Specifically, by cutting adjacent optical chips 110 of the device wafer 100 , the plurality of optical chips 110 of the device wafer 100 can be individually separated, so that the individually separated optical chips 110 and the optical bridges 111 fixed on the optical chips 110 can be processed separately.

[0156] refer to Fig.14 After the cutting process, the optical chip 110 is set on the substrate 130, and the optical chip 110 and the optical bridge 111 fixed in the optical chip 110 are used as the optical module 190.

[0157] It should be noted that the optical chip 110 is arranged on the substrate 130, and the optical chip 110 and the optical bridge 111 fixed in the optical chip 110 are used as the optical module 190, which means that the optical module 190 is arranged on the substrate 130, so that the optical chip 110 can be electrically connected to the circuit line in the substrate 130.

[0158] As an example, the step of disposing the optical chip 110 on the substrate 130 includes: inverting the optical chip 110 and disposing it on the substrate 130, the first conductive bump 102 is electrically connected to the substrate 130, and the first notch 131 exposes the optical chip 110 in the optical coupling area 100B.

[0159] Specifically, the first notch 131 exposes the optical chip 110 in the optical coupling area 100B, providing a plugging space for the subsequent detachable optical connection module to be inserted into the optical transmission channel 112 of the optical bridge 111 , thereby reducing the difficulty of operation between the detachable optical connection module and the optical bridge 111 .

[0160] refer to Fig.15 After the optical chip 110 is inverted and soldered on the substrate 130 , the formation method further includes: a bottom filling layer 121 is filled between the interconnection area 100A of the optical chip 110 and the substrate 130 , and covers the first conductive bump 102 .

[0161] Specifically, the bottom filling layer 121 protects the exposed first conductive bumps 102 and also electrically isolates adjacent first conductive bumps 102 .

[0162] refer to Figure 14 to Figure 15 Before fixing the heat dissipation cover on the top surface of the substrate 130 , the forming method further includes: disposing an electric chip 120 on the substrate 130 , the electric chip 120 being electrically connected to the substrate 130 , and the electric chip 120 being spaced apart from the optical module 190 .

[0163] It should be noted that an electric chip 120 is arranged on the substrate 130, and the electric chip 120 is electrically connected to the substrate 130, so that the electric chip 120 can be electrically connected to the optical chip 110 through the substrate 130. After the optical chip 110 converts the optical signal into an electric signal, it is transmitted to the electric chip 120 through the substrate 130 for processing. In addition, through the close integration of the electric chip 120 with the optical chip 110, the electric chip 120 can reduce the loss of electric signal transmission and reduce the overall power consumption of the packaging structure.

[0164] It should also be noted that the electronic chip 120 can be disposed on the substrate 130 in a face-up or flip-down manner, which is not limited here.

[0165] refer to Fig.16The heat dissipation cover 122 is fixed on the top surface of the substrate 130 , and the optical module 190 is located in a semi-enclosed space surrounded by the heat dissipation cover 122 and the substrate 130 , and the optical transmission channel 112 of the optical bridge 111 is exposed in the semi-enclosed space.

[0166] Specifically, the heat dissipation cover 122 is used to dissipate the heat generated by the optical chip 110 and the electrical chip 120 in a timely manner, reducing the probability of electrical failure of the optical chip 110 and the electrical chip 120 due to excessive heat concentration, thereby improving the reliability of the packaging structure.

[0167] It should be noted that after the heat dissipation cover 122 is fixed on the top surface of the substrate 130, heat dissipation glue is formed on the top surfaces of the optical chip 110 and the electric chip 120, and the heat dissipation cover 122 is in contact with the optical chip 110 and the electric chip 120 through the heat dissipation glue, so that the heat of the optical chip 110 and the electric chip 120 can be diffused into the heat dissipation cover 122 through the heat dissipation glue, and then the heat is dissipated through the heat dissipation cover 122.

[0168] As an example, the heat dissipation cover 122 is fixed on the top surface of the substrate 130 by using a fixing glue.

[0169] In this embodiment, the semi-enclosed space exposes the optical transmission channel 112 of the optical bridge 111 , and reserves an operable space for subsequently inserting the detachable optical connection module into the optical transmission channel 112 .

[0170] It should be noted that if Fig.16 As shown, the inner surface of the heat dissipation cover 122 facing the optical chip 110 and the electrical chip 120 is a flat surface, which means that the top surfaces of the optical chip 110 and the electrical chip 120 are flush. In other embodiments, the top surfaces of the optical chip 110 and the electrical chip 120 may not be flush, and accordingly, the inner surface of the heat dissipation cover 122 facing the optical chip 110 and the electrical chip 120 also has a convex surface, which is in contact with the electrical chip 120 or the optical chip 110, so that the inner surface of the heat dissipation cover 122 can be in contact with the optical chip 110 and the electrical chip 120.

[0171] refer to Figures 17 to 19 After fixing the heat dissipation cover 122 on the top surface of the substrate 130, the forming method further includes: forming a second conductive bump 140 on the back surface of the substrate 130; welding a device module consisting of the substrate 130, the optical module 190 and the heat dissipation cover 122 on the circuit carrier 141, and the device module is electrically connected to the circuit carrier 141 through the second conductive bump 140; and inserting the detachable optical connection module 143 into the optical bridge 111.

[0172] Specifically, the second conductive bumps 140 are used to electrically lead out the optical chip 110 , the electrical chip 120 and the substrate 130 , so that the optical chip 110 and the electrical chip 120 can be electrically connected to the circuit carrier 141 through the second conductive bumps 140 .

[0173] In this embodiment, the step of inserting the detachable optical connection module 143 into the optical bridge 111 includes: providing a detachable optical connection module 143, the detachable optical connection module 143 having multiple optical connection cores, and the positions of the optical connection cores correspond one-to-one to the positions of the optical transmission channel 112 in the optical bridge 111; inserting the optical connection cores of the detachable optical connection module 143 into the optical transmission channel 112.

[0174] Figure 20 to Figure 25 The schematic diagram of the structure corresponding to each step in the second embodiment of the method for forming a packaging structure of the present invention is shown.

[0175] The similarities between the embodiment of the present invention and the first embodiment are not repeated here. The differences between the embodiment of the present invention and the first embodiment are as follows:

[0176] refer to Figure 20 to Figure 25 The step of setting an optical module on a substrate 230 includes: providing a device wafer 200, the device wafer 200 includes a plurality of optical chips 210, the optical chip 210 includes an optical coupling region 200B and an interconnection region 200A adjacent thereto, and the top surface of the optical coupling region 200B is lower than the top surface of the interconnection region 200A; cutting adjacent optical chips 210; after cutting, setting the optical chip 210 on the substrate 230; after the optical chip 210 is set on the substrate 230, fixing an optical bridge 211 in the optical coupling region 200B of the optical chip 210, and using the optical bridge 211 and the optical chip 210 as an optical module.

[0177] Specifically, the device wafer 200 includes a plurality of optical chips 210 , which facilitates subsequent cutting of adjacent optical chips 210 to form a plurality of optical modules, thereby realizing mass production of optical modules.

[0178] It should be noted that the optical coupling area 200B is a region where an optical bridge 211 is subsequently disposed, so that the optical chip 210 can be coupled and aligned with an external optical connector through the optical bridge 211 .

[0179] Specifically, the optical coupling region 200B is located at an edge region of the optical chip 210 .

[0180] The interconnection area 200A is an area where the first conductive bump 202 is subsequently set, so that the electrical properties of the optical chip 210 can be brought out through the first conductive bump 202, so that the optical chip 210 can be electrically connected to the substrate 230, or the optical chip 210 can be electrically connected to other chips (such as electrical chips).

[0181] It should be noted that the top surface of the optical coupling area 200B is lower than the top surface of the interconnection area 200A, which means that the thickness of the optical coupling area 200B of the optical chip 210 is less than the thickness of the interconnection area 200A of the optical chip 210, thereby providing a spatial position for subsequently fixing the optical bridge 211 in the optical coupling area 200B. In addition, the top surface of the optical coupling area 200B is lower than the top surface of the interconnection area 200A, which also enables the optical coupling area 200B to expose the side wall of the optical chip 210 in the interconnection area 200A, so that the converter 206 facing the optical coupling area 200B can be set on the side wall of the optical chip 210 in the interconnection area 200A, so that the optical bridge 211 subsequently fixed to the optical coupling area 200B can be coupled and aligned with the converter 206.

[0182] Specifically, the optical bridge 211 and the converter 206 are coupled and aligned, thereby avoiding coupling loss caused by mode field size mismatch between the optical chip 210 and the optical bridge 211, ensuring that optical signals can be efficiently transmitted between different media, thereby improving the coupling efficiency between the optical bridge 211 and the optical chip 210.

[0183] It should also be noted that, compared to the solution of setting the optical bridge 211 on the device wafer 200 and then cutting the adjacent optical chips 210, in this embodiment, the adjacent optical chips 210 are cut first, so that the multiple optical chips 210 of the device wafer 200 can be separated separately, and then the optical chip 210 is set on the substrate 230. After the optical chip 210 is set on the substrate 230, the optical bridge 211 is fixed in the optical coupling area 200B of the optical chip 210. That is to say, the optical chip 210 is set on the substrate 230, and the optical bridge 211 can be fixed in the optical chip 210 according to actual needs, thereby providing more flexibility for fixing the optical bridge 211 in the optical chip 210.

[0184] refer to Fig.24 After the optical chip 210 is set on the substrate 230, before the optical bridge 211 is subsequently fixed in the optical coupling area 200B of the optical chip 210, the heat dissipation cover 222 is fixed to the top surface of the substrate 230, and the optical chip 210 is located in a semi-enclosed space surrounded by the heat dissipation cover 222 and the substrate 230, and the semi-enclosed space exposes the side of the optical chip 210.

[0185] It should be noted that after the optical chip 210 is set on the substrate 230, the heat dissipation cover 222 is fixed to the top surface of the substrate 230. When the optical bridge 211 is subsequently fixed to the optical chip 210, in order to provide sufficient operating space for the optical bridge 211, it is necessary to invert the overall structure composed of the heat dissipation cover 222, the optical module and the substrate 230 so that the heat dissipation cover 222 plays a bearing role, providing a stable support for the optical bridge 211 to be fixed to the optical chip 210, thereby reducing the difficulty of fixing the optical bridge 211 to the optical chip 210.

[0186] Figure 26 to Figure 27 A schematic structural diagram corresponding to each step in the third embodiment of the method for forming a packaging structure of the present invention is shown.

[0187] The similarities between the embodiment of the present invention and the first embodiment are not repeated here. The differences between the embodiment of the present invention and the first embodiment are as follows:

[0188] refer to Fig.26 The step of setting the optical chip 310 on the substrate 330 includes: mounting the back side of the optical chip 310 on the substrate 330 by using the patch adhesive 399 .

[0189] It should be noted that the back side of the optical chip 310 is mounted on the substrate 330 , which means that the optical chip 310 is a front-mounted chip.

[0190] It should also be noted that the patch adhesive 399 serves to fix the optical chip 310 on the substrate 330 .

[0191] As an example, the patch adhesive 399 can be a conductive adhesive or a non-conductive adhesive, and the patch adhesive 399 is only used to physically bond the optical chip 310 to the substrate 330 and has no electrical connection function.

[0192] Specifically, the electrical connection between the optical chip 310 and the substrate 330 needs to be made through wire bonding.

[0193] Continue to refer Fig.26 In the process of setting the optical module on the substrate 330, it also includes: setting an electric chip 320 on the optical module, the electric chip 320 is electrically connected to the optical module, and the optical module and the electric chip 320 are used as an optoelectronic co-sealed module.

[0194] Specifically, the electric chip 320 is electrically connected to the optical module. The optical chip 310 converts the optical signal into an electric signal and then transmits it to the electric chip 320 for processing. In addition, the electric chip 320 is arranged on the optical module. The electric chip 320 can reduce the loss of electric signal transmission and reduce the overall power consumption of the packaging structure. At the same time, the electric chip 320 is arranged on the optical module, which also provides a space for arranging other electronic components on the side of the optoelectronic co-sealed module.

[0195] As an example, the electrical chip 320 is disposed on the optical module by flip-chip mounting.

[0196] refer to Fig.26 When the optoelectronic co-sealed module is disposed on the substrate 330 , before the heat dissipation cover is fixed on the top surface of the substrate 330 , the forming method further includes: disposing an application specific integrated circuit chip 398 (ASIC) on the substrate 330 .

[0197] It should be noted that the dedicated integrated electrical chip 398 is highly optimized for specific application scenarios to achieve higher performance, lower power consumption and smaller size, so that the dedicated integrated electrical chip 398 can provide higher processing speed and efficiency for the electrical chip 320 and the optical chip 310.

[0198] refer to Fig. 27 In the step of fixing the heat dissipation cover 370 on the top surface of the substrate 330 , the heat dissipation cover 370 has a second notch 360 , and the second notch 360 exposes the optical coupling region of the optical chip 310 .

[0199] Specifically, the heat dissipation cover 370 has a second notch 360, and the second notch 360 exposes the optical coupling area of ​​the optical chip 310, wherein the optical coupling area is the area for subsequently fixing the optical bridge 311. By setting the second notch 360, sufficient operating space is provided for fixing the optical bridge 311. At the same time, a plug-in space is provided for the subsequent insertion of a detachable optical connection module into the optical transmission channel of the optical bridge 311, thereby reducing the operating difficulty between the detachable optical connection module and the optical bridge 311.

[0200] Fig.28 A schematic structural diagram corresponding to each step in a fourth embodiment of a method for forming a packaging structure of the present invention is shown.

[0201] The similarities between the embodiment of the present invention and the first embodiment are not repeated here. The differences between the embodiment of the present invention and the first embodiment are as follows:

[0202] refer to Fig.28 In the step of providing the substrate 430 , an electric chip 420 is disposed on the top surface of the substrate 430 , and the electric chip 420 is electrically connected to the substrate 430 .

[0203] Specifically, an electric chip 420 is disposed on a substrate 430 and is electrically connected to the substrate 430. The optical chip 420 converts the optical signal into an electric signal and then transmits the electric signal to the electric chip 420 for processing and calculation. Furthermore, the electric chip 420 is tightly integrated with the optical chip, so that the electric chip 420 can reduce the loss of electric signal transmission and reduce the overall power consumption of the packaging structure.

[0204] It should be noted that the electrical chip 420 is a chip having interconnected through silicon vias (TSV).

[0205] Continue to refer Fig.28 The step of setting the optical module 490 on the substrate 430 includes: setting the optical module 490 on the electrical chip 420, electrically connecting the optical module 490 to the electrical chip 420, and using the optical module 490 and the electrical chip 420 as an optoelectronic co-sealed module.

[0206] Specifically, the optical module 490 is electrically connected to the electrical chip 420 , so that the optical chip 410 can be electrically connected to the substrate 430 through the electrical chip 420 .

[0207] It should be noted that the optical chip 410 is a flip chip.

[0208] Specifically, the optical module 490 and the electrical chip 420 serve as an optoelectronic co-sealed module, which also provides a space for arranging other electronic components (such as a dedicated integrated electrical chip) on the side of the optoelectronic co-sealed module.

[0209] Fig.29 A schematic structural diagram corresponding to each step in the fifth embodiment of the method for forming a packaging structure of the present invention is shown.

[0210] The similarities between the embodiment of the present invention and the first embodiment are not repeated here. The differences between the embodiment of the present invention and the first embodiment are as follows:

[0211] refer to Fig.29 In the step of setting the optical module 510 on the top of the substrate 500, the number of the optical modules 510 is multiple, and the multiple optical modules 510 are located on the same side of the substrate 500; or, the multiple optical modules 510 are located on different sides of the substrate 500.

[0212] It should be noted that, in combination with different design requirements, the multiple optical modules 510 are located on the same side of the substrate 500, or the multiple optical modules 510 are located on different sides of the substrate 500, which is not limited here.

[0213] It should also be noted that a plurality of optical modules 510 are disposed on the top of the substrate 500, which can further improve the integration of the packaging structure.

[0214] As an example, Fig.29 Four optical modules 510 are shown.

[0215] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A packaging structure, characterized in that: include: substrate; An optical module is arranged on the top of the substrate, the optical module comprises an optical chip and an optical bridge fixed in the optical chip, the optical bridge has an optical transmission channel running through the optical bridge, a converter is arranged in the optical chip, and the optical transmission channel is aligned and coupled with the converter; The heat dissipation cover is fixed on the top surface of the substrate. The optical module is located in a semi-enclosed space surrounded by the heat dissipation cover and the substrate, and the optical transmission channel of the optical bridge is exposed in the semi-enclosed space.

2. The packaging structure according to claim 1, characterized in that: The substrate has a first notch; The optical chip comprises an optical coupling region and an interconnection region adjacent thereto, and the thickness of the optical coupling region of the optical chip is smaller than the thickness of the interconnection region of the optical chip, and the optical bridge is fixed in the optical coupling region of the optical chip; The optical chip is flip-chip mounted on the top of the substrate, and the packaging structure further comprises: a first conductive bump located on the front side of the interconnection area of ​​the optical chip, and the optical chip is electrically connected to the substrate through the first conductive bump, and the first notch exposes the optical bridge of the optical coupling area; or, The heat dissipation cover has a second notch; The optical chip comprises an optical coupling region and an interconnection region adjacent thereto, and the thickness of the optical coupling region of the optical chip is smaller than the thickness of the interconnection region of the optical chip, and the optical bridge is fixed in the optical coupling region of the optical chip; The optical chip is disposed upright on the top of the substrate, and the packaging structure further comprises: a patch adhesive located on the back of the optical chip, and the second notch exposes the optical bridge of the optical coupling area.

3. The packaging structure according to claim 2, characterized in that: The optical chip is flip-chip mounted on the top of the substrate, and the packaging structure further comprises: a bottom filling layer filled between the interconnection area of ​​the optical chip and the substrate and covering the first conductive bump.

4. The packaging structure according to claim 2, characterized in that: A plurality of grooves extending in the same direction are arranged in the optical chip of the optical coupling region, and a converter is arranged on the side of the optical chip of the interconnection region exposed by the optical coupling region; The optical bridge has a plurality of protrusions on the surface facing the optical chip, and a light transmission channel penetrating the optical bridge is arranged inside the optical bridge, the extension direction of the protrusions is the same as the extension direction of the grooves, the positions of the protrusions and the grooves correspond one-to-one and are fixed in the grooves, and the light transmission channel is aligned and coupled with the converter.

5. The packaging structure according to claim 4, characterized in that: The groove is in a V-shape.

6. The packaging structure according to claim 4, characterized in that: The packaging structure further includes: a fixing glue covering the protrusion and the groove and being suitable for fixing the protrusion in the groove; The optical glue is located at the coupling position between the optical transmission channel and the converter, and is suitable for aligning and coupling the optical transmission channel and the converter.

7. The packaging structure according to claim 4, characterized in that: The length of the groove in the extending direction is equal to the length of the protruding portion in the extending direction.

8. The packaging structure according to claim 4, characterized in that: The optical bridge includes a fixed area and a light transmission area located between adjacent fixed areas, the protrusion is located on the surface of the optical bridge in the fixed area, the light transmission channel is located inside the optical bridge in the light transmission area, and the extension direction of the protrusion is the same as the extension direction of the light transmission channel.

9. The packaging structure according to claim 1, characterized in that: The material of the optical bridge includes one or more of ceramics, resin, glass and polymer.

10. The packaging structure according to claim 1, wherein: The optical transmission channel includes one or both of an optical fiber channel and an optical waveguide.

11. The packaging structure according to claim 1, characterized in that: The packaging structure further includes: an electric chip, which is disposed on the substrate, the electric chip is electrically connected to the substrate, and the electric chip is spaced apart from the optical module; or, The packaging structure further includes: an electric chip, which is disposed on the substrate, and the electric chip is electrically connected to the substrate; The optical module is disposed on the electrical chip, the optical module is electrically connected to the electrical chip, and the optical module and the electrical chip are used as an optoelectronic co-sealed module; or, The packaging structure further includes: an electric chip, which is disposed on the optical chip of the optical module. The electric chip is electrically connected to the optical module, and the optical module and the electric chip are used as an optoelectronic co-sealed module.

12. The packaging structure according to claim 11, characterized in that: When an optoelectronic co-sealing module is arranged on the substrate, the packaging structure further comprises: a dedicated integrated electronic chip located on the substrate at the side of the optoelectronic co-sealing module.

13. The packaging structure according to claim 1, characterized in that: The packaging structure further includes: a second conductive bump formed on the back side of the substrate; A circuit carrier, the device module consisting of the substrate, the optical module and the heat dissipation cover is welded on the circuit carrier, and the device module is electrically connected to the circuit carrier through the second conductive bump; The detachable optical connection module is inserted into the optical bridge.

14. The packaging structure according to claim 13, characterized in that: The detachable optical connection module has a plurality of optical connection ferrules, and the positions of the optical connection ferrules correspond to the positions of the optical transmission channels one by one. The optical connection ferrules of the detachable optical connection module are inserted into the optical transmission channels.

15. The packaging structure according to claim 1, characterized in that: The number of the optical modules disposed on the top of the substrate is one or more; When there are multiple optical modules, the multiple optical modules are located on the same side of the substrate; or, When there are multiple optical modules, the multiple optical modules are located on different sides of the substrate.

16. A method for forming a packaging structure, characterized in that: include providing a substrate; An optical module is arranged on the top of the substrate, the optical module comprises an optical chip and an optical bridge fixed in the optical chip, the optical bridge has an optical transmission channel running through the optical bridge, a converter is arranged in the optical chip, and the optical transmission channel is aligned and coupled with the converter; A heat dissipation cover is fixed on the top surface of the substrate, the optical module is located in a semi-enclosed space surrounded by the heat dissipation cover and the substrate, and the optical transmission channel of the optical bridge is exposed in the semi-enclosed space.

17. The method for forming a package structure according to claim 16, wherein: The step of arranging an optical module on the substrate comprises: Providing a device wafer, the device wafer comprising a plurality of optical chips, the optical chip comprising an optical coupling region and an interconnection region adjacent thereto, wherein a top surface of the optical coupling region is lower than a top surface of the interconnection region; fixing the optical bridge in the optical chip in the optical coupling region; Cutting adjacent optical chips; After the cutting process is performed, the optical chip is disposed on the substrate, and the optical chip and the optical bridge fixed in the optical chip are used as the optical module; or, The step of arranging an optical module on the substrate includes: providing a device wafer, wherein the device wafer includes a plurality of optical chips, wherein the optical chip includes an optical coupling region and an interconnection region adjacent thereto, and a top surface of the optical coupling region is lower than a top surface of the interconnection region; Cutting adjacent optical chips; After the cutting process is performed, the optical chip is arranged on the substrate; After the optical chip is disposed on the substrate, an optical bridge is fixed in the optical chip in the optical coupling region, and the optical bridge and the optical chip serve as the optical module.

18. The method for forming a package structure according to claim 17, wherein: In the step of providing a substrate, the substrate has a first notch; In the step of providing a device wafer, a first conductive bump is formed on the front surface of the optical chip in the interconnection region, and the first conductive bump is electrically connected to the optical chip; The step of placing the optical chip on the substrate includes: placing the optical chip upside down and placing it on the substrate, wherein the first conductive bump is electrically connected to the substrate, and the first notch exposes the optical coupling region of the optical chip; or, The step of placing the optical chip on the substrate includes: mounting the back side of the optical chip on the substrate by using a patch adhesive; In the step of fixing a heat dissipation cover on the top surface of the substrate, the heat dissipation cover has a second notch, and the second notch exposes the optical coupling region of the optical chip.

19. The method for forming a package structure according to claim 18, wherein: After the optical chip is inverted and soldered on the substrate, the forming method further includes: filling a bottom filling layer between the interconnection area of ​​the optical chip and the substrate, wherein the bottom filling layer covers the first conductive bump.

20. The method for forming a package structure according to claim 17, wherein: In the step of providing the device wafer, a plurality of grooves extending in the same direction are formed in the optical coupling region of the optical chip, and a converter is provided on the side of the optical chip of the interconnection region exposed by the optical coupling region; The step of fixing the optical bridge in the optical coupling area of ​​the optical chip comprises: providing an optical bridge, wherein the optical bridge has a plurality of protrusions on a surface facing the optical chip, and a light transmission channel penetrating the optical bridge is formed inside the optical bridge, the protrusions extend in the same direction as the grooves, and the protrusions correspond to the grooves in one-to-one position; The protrusion is fixed in the groove, and the light transmission channel is aligned and coupled with the converter.

21. The method for forming a package structure according to claim 20, wherein: The process of forming the groove in the optical chip of the optical coupling region includes a dry etching process.

22. The method for forming a package structure according to claim 20, wherein: The groove is in a V-shape.

23. The method for forming a package structure according to claim 20, wherein: The steps of fixing the protrusion in the groove and aligning and coupling the optical transmission channel with the converter include: fixing the protrusion in the groove by means of fixing glue; after the protrusion is fixed in the groove, aligning and coupling the optical transmission channel with the converter by means of the optical glue.

24. The method for forming a package structure according to claim 20, wherein: The length of the groove in the extension direction is equal to or unequal to the length of the protrusion in the extension direction.

25. The method for forming a package structure according to claim 20, wherein: In the step of providing the optical bridge, the optical bridge includes a fixed area and a light transmission area located between adjacent fixed areas, the protrusion is located on the surface of the optical bridge in the fixed area, the light transmission channel is located inside the optical bridge in the light transmission area, and the extension direction of the protrusion is the same as the extension direction of the light transmission channel.

26. The method for forming a package structure according to claim 17, wherein: After the optical chip is arranged on the substrate and before the optical bridge is fixed in the optical coupling area of ​​the optical chip, the heat dissipation cover is fixed to the top surface of the substrate, and the optical chip is located in a semi-enclosed space surrounded by the heat dissipation cover and the substrate, and the semi-enclosed space exposes the side of the optical chip.

27. The method for forming a package structure according to claim 16, wherein: The process of forming the optical bridge includes one or more of a 3D printing process, an ultrashort pulse laser direct writing process and an exposure process.

28. The method for forming a package structure according to claim 27, wherein: The material of the optical bridge includes one or more of ceramic, resin, glass and polymer; The method for forming the optical bridge includes: using ultra-high precision 3D printing technology to print a ceramic optical bridge containing an internal light transmission channel using ceramic slurry; or, Using ultra-high precision 3D printing technology, a resin optical bridge with an internal light transmission channel is printed with photosensitive resin; or, Using ultrashort pulse laser direct writing technology, a glass optical bridge containing a light transmission channel is processed inside the glass; or, Use exposure technology to process fine optical circuits on polymer materials to form polymer optical bridges for flexible optical circuit films; or, One or more layers of polymer optical waveguide flexible sheets are laminated and bonded to glass to form an optical bridge of glass and polymer combination.

29. The method for forming a package structure according to claim 16, wherein: The optical transmission channel includes one or both of an optical fiber channel and an optical waveguide.

30. The method for forming a package structure according to claim 16, wherein: Before fixing the heat dissipation cover on the top surface of the substrate, the forming method further includes: arranging an electric chip on the substrate, the electric chip is electrically connected to the substrate, and the electric chip is spaced apart from the optical module.

31. The method for forming a package structure according to claim 16, wherein: In the step of providing a substrate, an electric chip is disposed on the top surface of the substrate, and the electric chip is electrically connected to the substrate; The step of arranging an optical module on the substrate includes: arranging the optical module on the electrical chip, the optical module being electrically connected to the electrical chip, and the optical module and the electrical chip being used as an optoelectronic co-sealed module; or, The process of arranging the optical module on the substrate also includes: arranging an electric chip on the optical module, the electric chip is electrically connected to the optical module, and the optical module and the electric chip are used as an optoelectronic co-sealed module.

32. The method for forming a package structure according to claim 31, wherein: When an optoelectronic co-sealed module is disposed on the substrate, before a heat dissipation cover is fixed on the top surface of the substrate, the forming method further comprises: disposing a dedicated integrated circuit chip on the substrate.

33. The method for forming a package structure according to claim 16, wherein: After the heat dissipation cover is fixed on the top surface of the substrate, the forming method further includes: forming a second conductive bump on the back side of the substrate; The device module consisting of the substrate, the optical module and the heat dissipation cover is welded on the circuit carrier, and the device module is electrically connected to the circuit carrier through the second conductive bump; A removable optical connection module is inserted into the optical bridge.

34. The method for forming a package structure according to claim 33, wherein: The step of inserting a detachable optical connection module into the optical bridge includes: providing a detachable optical connection module, the detachable optical connection module having a plurality of optical connection ferrules, and the positions of the optical connection ferrules correspond one-to-one to the positions of the optical transmission channel; and inserting the optical connection ferrules of the detachable optical connection module into the optical transmission channel.

35. The method for forming a package structure according to claim 16, wherein: In the step of arranging an optical module on the top of the substrate, the number of the optical modules is one or more, and the multiple optical modules are located on the same side of the substrate; or, the multiple optical modules are located on different sides of the substrate.

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