Image generation unit and head-up display device

Abstract

The invention provides an image generation unit and a head-up display device, and relates to the technical field of display, the image generation unit comprises a display panel and a heat dissipation structure, the display panel comprises an array substrate and a light-emitting element arranged on the array substrate; the heat dissipation structure is located on the side, away from the light-emitting element, of the array substrate and comprises heat dissipation elements and a gap filling layer, and the gap filling layer is located between the two heat dissipation elements or located between the heat dissipation elements and the array substrate; pressure stress exists between the gap filling layer and the adjacent film layer on at least one side, and the adjacent film layer comprises an array substrate arranged adjacent to the gap filling layer or a heat dissipation element arranged adjacent to the gap filling layer. According to the invention, the gap filling layer can be tightly pressed and fully contacted with the adjacent array substrate or heat dissipation element, the contact thermal resistance is reduced, and the heat transfer efficiency is improved, so that the use reliability and the display reliability of the image generation unit are improved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to an image generation unit and a head-up display device. Background Art

[0002] With the development of science and technology, display devices have been widely used. On this basis, display devices need to have stronger display effects, which often leads to more heat generated by the display devices. Therefore, how to achieve rapid heat dissipation of display devices has become a key research direction for major manufacturers. Summary of the invention

[0003] The embodiments of the present invention provide an image generation unit and a head-up display device to achieve rapid heat dissipation and improve reliability.

[0004] According to one aspect of the present invention, there is provided an image generation unit, comprising:

[0005] The display panel comprises an array substrate and a light emitting element arranged on the array substrate;

[0006] The heat dissipation structure is located on a side of the array substrate away from the light-emitting element, and includes a heat dissipation element and a gap filling layer, wherein the gap filling layer is located between two heat dissipation elements, or between the heat dissipation element and the array substrate;

[0007] There is compressive stress between the gap filling layer and an adjacent film layer on at least one side, and the adjacent film layer includes an array substrate arranged adjacent to the gap filling layer, or a heat dissipation element arranged adjacent to the gap filling layer.

[0008] According to another aspect of the present invention, a head-up display device is provided, comprising the above-mentioned image generating unit.

[0009] The technical solution of the present invention can release the heat generated by the display panel and improve the use reliability and display reliability of the image generation unit by arranging a heat dissipation structure on the side of the array substrate away from the light-emitting element; and by allowing compressive stress to exist between the gap filling layer in the heat dissipation structure and the adjacent film layer on at least one side, the gap filling layer can be tightly pressed and fully contacted with the adjacent array substrate or heat dissipation element, thereby reducing contact thermal resistance, improving heat transfer efficiency, and further improving the use reliability and display reliability of the image generation unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 is a structural schematic diagram of an image generating unit provided by an embodiment of the present invention;

[0011] Figure 2 is a structural schematic diagram of another image generating unit provided by an embodiment of the present invention;

[0012] Figure 3 is a structural schematic diagram of another image generating unit provided by an embodiment of the present invention;

[0013] Figure 4 is a structural schematic diagram of another image generating unit provided by an embodiment of the present invention;

[0014] Figure 5 is a structural schematic diagram of another image generating unit provided by an embodiment of the present invention;

[0015] Figure 6 is a structural schematic diagram of another image generating unit provided by an embodiment of the present invention;

[0016] Figure 7 is a schematic diagram of a top view structure of an image generating unit provided by an embodiment of the present invention;

[0017] Figure 8 is a schematic diagram of a top view structure of another image generating unit provided by an embodiment of the present invention;

[0018] Fig. 9 is a structural schematic diagram of another image generating unit provided by an embodiment of the present invention;

[0019] Fig.10 is a structural schematic diagram of another image generating unit provided by an embodiment of the present invention;

[0020] Fig.11 is a structural schematic diagram of another image generating unit provided by an embodiment of the present invention;

[0021] Fig.12 is a structural schematic diagram of another image generating unit provided by an embodiment of the present invention;

[0022] Fig.13 is a structural schematic diagram of another image generating unit provided by an embodiment of the present invention;

[0023] Fig.14 It is a structural schematic diagram of a head-up display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0024] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0025] During the use of the display device, in some cases, a lot of heat will be generated inside the display device. Taking the in-vehicle display as an example, the outgoing light of the in-vehicle head-up display device needs to be reflected by multiple mirrors before the corresponding image can be displayed on the windshield in front of the driver. In this case, the in-vehicle head-up display device needs to emit a brightness of more than 10,000 nits, and higher brightness often means a lot of heat. If a lot of heat is accumulated in the display device, various problems are likely to occur.

[0026] Based on this, an embodiment of the present invention provides an image display unit, Figure 1 is a schematic diagram of the structure of an image generation unit provided by an embodiment of the present invention, with reference to Figure 1 , the image generation unit includes a display panel 10 and a heat dissipation structure 20. The display panel 10 includes an array substrate 11 and a light emitting element 121 disposed on the array substrate 11. The heat dissipation structure 20 is located on a side of the array substrate 11 away from the light emitting element 121, and the heat dissipation structure 20 includes a heat dissipation element 21 and a gap filling layer 22, and the gap filling layer 22 is located between two heat dissipation elements 21, or between the heat dissipation element 21 and the array substrate 11. There is a compressive stress between the gap filling layer 22 and the adjacent film layer on at least one side, and the adjacent film layer includes the array substrate 11 disposed adjacent to the gap filling layer 22, or the heat dissipation element 21 disposed adjacent to the gap filling layer 22.

[0027] Among them, the array substrate 11 can be provided with structures such as a substrate layer, a conductor layer, a semiconductor layer, and an insulating layer. The conductor layer and the semiconductor layer can form a driving circuit (not shown in the figure) to drive the light-emitting element 121 to display light. The light-emitting element 121 can be an inorganic light-emitting diode, for example, a micro LED, a mini LED, etc. It should be noted that in addition to the array substrate 11 and the light-emitting element 121, the display panel 10 can also include other structures. The embodiment of the present invention does not limit the specific structural composition of the display panel 10; the light-emitting element 121 can be of various types, and the embodiment of the present invention does not limit the specific type of the light-emitting element 121.

[0028] During the display process of the display panel 10, the light emitting element 121 and the driving circuit in the array substrate 11 will generate heat. The heat dissipation function of the display panel 10 alone cannot meet the need for heat release in the display panel 10, which may cause the image generation unit to easily have display abnormalities or safety hazards. In view of the above problems, the embodiment of the present invention provides a heat dissipation structure 20 in the image generation unit, and the heat dissipation structure 20 is used to improve the reliability of the image generation unit.

[0029] The heat dissipation structure 20 includes a heat dissipation element 21 and a gap filling layer 22. The gap filling layer 22 is arranged between the display panel 10 and the heat dissipation element 21. The existence of the gap filling layer 22 can meet the need for heat transfer between the heat dissipation element 21 and the display panel 10. Due to the limitations of the preparation process or material characteristics, there are some grooves 01 on the surface of the side of the array substrate 11 away from the light-emitting element and / or the surface of the heat dissipation element 21. These grooves 01 will cause some gaps between the gap filling layer 22 and the array substrate 11, or between the gap filling layer 22 and the heat dissipation element 21, affecting the thermal conductivity of the gap filling layer 22, so that the heat in the display panel 10 cannot be quickly released. Considering the above problems, the embodiment of the present invention can fix the array substrate 11 and the heat dissipation element 21, or fix the heat dissipation element 21 and the heat dissipation element 21 by bonding, mechanical installation, etc., so that there is a compressive stress between the gap filling layer 22 and the adjacent film layer on at least one side, and the gap filling layer 22 is squeezed to fill the grooves 01, reduce the contact thermal resistance, and improve the heat transfer efficiency.

[0030] The gap filling layer 22 may be composed of a variety of materials, wherein the material in the gap filling layer 22 may have good thermal conductivity, and have a certain hardness and elasticity, so that it is fillable, for example, it may be a silicone thermal conductive pad, which may fill the groove 01 on the surface of the array substrate 11 and / or the surface of the heat dissipation element 21 when squeezed, so that the array substrate 11 and the heat dissipation element 21, or the heat dissipation element 21 and the heat dissipation element 21 are tightly pressed together and fully contact the gap filling layer 22. The gap filling layer 22 may quickly transfer the heat generated by the display panel 10 to the heat dissipation element 21, reduce the contact thermal resistance between the gap filling layer 22 and the adjacent film layer, thereby improving the transfer efficiency of the heat generated by the display panel 10 to the heat dissipation element 21. In addition, the elasticity of the gap filling layer 22 may improve the resilience of the heat dissipation structure 20, so that when the image generation unit is impacted, the impact energy may be absorbed, thereby improving the impact resistance of the image generation unit.

[0031] Exemplary, reference Figure 1In the display panel 10, a light-emitting layer 12 is provided on the side of the array substrate 11 away from the heat dissipation structure 20, and the light-emitting layer 12 includes a light-emitting element 121 and an encapsulation layer 122 that at least partially covers the light-emitting element 121 on the side away from the array substrate 11; a cover plate 13 is also provided on the side of the light-emitting layer 12 away from the array substrate 11, and the cover plate 13 can realize the functions of physical protection of the light-emitting layer 12 and optical performance optimization. The display panel 10 also includes a flexible circuit board 14 that is arranged on one side of the light-emitting layer 12 along a first direction X and is bound and electrically connected to the array substrate 11, wherein the first direction X intersects with the thickness direction Z of the display panel 10. The flexible circuit board 14 can be bound and electrically connected with a driving chip and a printed circuit board and other structures (not shown in the figure). In an optional embodiment, at least part of the heat dissipation element 21 in the heat dissipation structure 20 can be an electric drive device, which can generate a temperature difference between the two ends of the heat dissipation element 21 in the thickness direction Z of the display panel 10 under the control of an electrical signal, and the electric drive device can be bound and electrically connected to the flexible circuit board 14 or the printed circuit board (not shown in the figure).

[0032] For example, continue to refer to Figure 1 , the image generation unit may also be provided with a fixing member 30, along the thickness direction Z of the display panel 10, the projection of the fixing member 30 on the plane where the array substrate 11 is located does not overlap with the projection of the gap filling layer 22 on the plane where the array substrate 11 is located, and the projection of the fixing member 30 on the array substrate 11 overlaps with the projection of at least part of the heat dissipation element 21 on the array substrate 11. The fixing member 30 may be used to connect the array substrate 11 and the heat dissipation element 21. There may be a variety of connection methods between the fixing member 30 and the array substrate 11, or between the fixing member 30 and the heat dissipation element 21, for example, the fixing member 30 and the heat dissipation element 21 may be connected and fixed by welding, and similarly, the fixing member 30 and the array substrate 11 may also be connected and fixed by welding.

[0033] The size of the fixing part 30 in the thickness direction Z of the display panel 10 determines the distance between the heat dissipation element 21 and the array substrate 11 in the thickness direction Z of the display panel 10. The fixing part 30 and the heat dissipation element 21, as well as the fixing part 30 and the array substrate 11 can be connected and fixed when the gap filling layer 22 is squeezed, so that there is compressive stress between the gap filling layer 22 and the adjacent film layer on at least one side. The deformability of the gap filling layer 22 is conducive to the gap filling layer 22 filling the groove 01 of the adjacent film layer, thereby improving the thermal conductivity and heat dissipation effects. The resilience of the gap filling layer 22 is also conducive to keeping the position between the heat dissipation structure 20 and the display panel 10 relatively fixed, thereby avoiding deflection and dislocation due to vibration and other reasons.

[0034] In an optional embodiment, the fixing member 30 may be disposed around the gap filling layer 22 to improve the structural reliability of the heat dissipation structure 20. In another optional embodiment, the fixing member 30 may be made of a non-thermal conductive material to prevent the heat released by the heat dissipation element 21 from flowing back to the display panel 10 through the fixing member 30, causing display abnormalities or safety hazards.

[0035] It should be noted that the figure only exemplarily shows the connection between the array substrate 11 and the heat dissipation element 21 through the fixing member 30, so that compressive stress exists between the gap filling layer 22 and the adjacent film layer on at least one side. In other optional embodiments, compressive stress can also be caused between the gap filling layer 22 and the adjacent film layer on at least one side by elastic adhesive bonding, mechanical structure locking, etc. The embodiment of the present invention does not limit the specific implementation method of causing the compressive stress between the gap filling layer 22 and the adjacent film layer.

[0036] The image generating unit provided by the embodiment of the present invention can release the heat generated by the display panel and improve the use reliability and display reliability of the image generating unit by arranging a heat dissipation structure on the side of the array substrate away from the light-emitting element; and by allowing compressive stress to exist between the gap filling layer in the heat dissipation structure and the adjacent film layer on at least one side, the gap filling layer can be tightly pressed and fully contacted with the adjacent array substrate or heat dissipation element, thereby reducing contact thermal resistance, improving heat transfer efficiency, and further improving the use reliability and display reliability of the image generating unit.

[0037] Optional, Figure 2 is a schematic diagram of the structure of another image generating unit provided by an embodiment of the present invention, referring to Figure 2 The gap filling layer 22 includes a first gap filling layer 221 and / or a second gap filling layer 222. The plurality of heat dissipation elements 21 include a semiconductor refrigerator 211 and a heat dissipation fin 212, and the semiconductor refrigerator 211 is located between the array substrate 11 and the heat dissipation fin 212. The first gap filling layer 221 fills the gap between the array substrate 11 and the semiconductor refrigerator 211, and the second gap filling layer 222 fills the gap between the semiconductor refrigerator 211 and the heat dissipation fin 212.

[0038] Among them, the semiconductor refrigerator 211 refers to a heat dissipation device made by using the Peltier effect of semiconductor materials, wherein the Peltier effect refers to when direct current passes through a couple formed by two different semiconductor materials in series, an electron-hole pair is generated at one end, the internal energy is reduced, the temperature is lowered, and a cold end is formed, and the other end increases the internal energy and the temperature rises due to the recombination of the electron-hole pairs, forming a hot end to achieve the purpose of cooling. The heat dissipation fins 212 are mainly composed of a substrate and fins, the substrate is usually flat, and the fins are protruding parts on the substrate, the substrate can transfer heat to the fins, and the fins can increase the contact area, exchange heat with air, and complete heat dissipation.

[0039] Specifically, the side of the semiconductor cooler 211 close to the display panel 10 can be a cold end, and the side of the semiconductor cooler 211 away from the display panel 10 can be a hot end. The semiconductor cooler 211 can transfer the heat released by the display panel 10 at the cold end to the heat sink fins 212 at the hot end, and the heat sink fins 212 can dissipate the heat at the hot end of the semiconductor cooler 211 to improve the cooling and cooling effect of the semiconductor cooler 211. The first gap filling layer 221 can be tightly pressed with the array substrate 11 or the semiconductor cooler 211, fully contacted, and accelerate the transfer of heat from the display panel 10 to the semiconductor cooler 211; the second gap filling layer 222 can be tightly pressed with the semiconductor cooler 211 or the heat sink fins 212, fully contacted, and accelerate the transfer of heat from the semiconductor cooler 211 to the heat sink fins 212.

[0040] In an optional embodiment, the semiconductor refrigerator 211 may include multiple pairs of PN units (not shown in the figure) composed of P-type semiconductors and N-type semiconductors, and at least one pair of positive and negative electrodes (not shown in the figure). In a single pair of PN units, current can flow from the N-type semiconductor to the P-type semiconductor, so that electron-hole pairs are generated between the N-type semiconductor flow and the P-type semiconductor, absorbing heat, and the N-type semiconductor flow and the outer electron-hole pairs of the P-type semiconductor are recombined to release heat. Multiple pairs of PN units can be connected in series or in parallel, so that a large temperature difference between the cold end and the hot end of the semiconductor refrigerator 211 is formed, thereby realizing active cooling and cooling of the display panel 10, and improving the use reliability and display reliability of the image generation unit.

[0041] In an optional embodiment, continue to refer to Figure 2 , in a direction perpendicular to the plane where the array substrate 11 is located, the area of ​​the first gap filling layer 221 is greater than or equal to the area of ​​the semiconductor cooler 211; and / or, in a direction perpendicular to the plane where the array substrate 11 is located, the area of ​​the second gap filling layer 222 is greater than or equal to the area of ​​the semiconductor cooler 211.

[0042] In this way, on the one hand, it is beneficial to maximize the heat conduction efficiency, minimize the thermal resistance, and avoid the situation where part of the surface of the semiconductor cooler 211 facing the array substrate 11 or part of the surface of the semiconductor cooler 211 facing the heat dissipation fins 212 is not in contact with the gap filling layer 22, resulting in the ineffective transfer of heat and affecting the heat dissipation; on the other hand, it is beneficial to uniform stress and avoid stress concentration on the surface of the semiconductor cooler 211, which may cause delamination or rupture of the semiconductor cooler 211.

[0043] In yet another optional embodiment, Figure 3 is a schematic diagram of the structure of another image generating unit provided by an embodiment of the present invention, referring to Figure 3In a direction perpendicular to the plane where the array substrate 11 is located, the area of ​​the first gap filling layer 221 is larger than the area of ​​the semiconductor cooler 211, and the side of the first gap filling layer 221 facing the semiconductor cooler 211 includes a recess, and the recess accommodates a partial thickness of the semiconductor cooler 211; and / or, in a direction perpendicular to the plane where the array substrate 11 is located, the area of ​​the second gap filling layer 222 is larger than the area of ​​the semiconductor cooler 211, and the side of the second gap filling layer 222 facing the semiconductor cooler 211 includes a recess, and the recess accommodates a partial thickness of the semiconductor cooler 211.

[0044] Specifically, the area of ​​the first gap filling layer 221 is set larger, which can make the temperature distribution of the surface of the side of the array substrate 11 close to the heat dissipation structure 20 more uniform, and the heat of the display panel 10 can be evenly dispersed in the first gap filling layer 221, and transferred to the semiconductor cooler 211 through the first gap filling layer 221, reducing the local temperature gradient of the display panel 10, and avoiding the local temperature being too high to affect the display effect of the display panel 10. The area of ​​the second gap filling layer 222 is set larger, which is conducive to reducing the contact thermal resistance and increasing the heat transfer efficiency. It can also ensure that the second gap filling layer 222 can fully contact with the semiconductor cooler 211, reduce the process difficulty, and reduce the uncovered area caused by alignment deviation, thereby avoiding the increase of contact thermal resistance.

[0045] In addition, the first gap filling layer 221 and / or the second gap filling layer 222 are recessed toward the semiconductor cooler 211 to accommodate a portion of the thickness of the semiconductor cooler 211, which is conducive to fixing the semiconductor cooler 211 and effectively avoiding the movement of the semiconductor cooler 211 due to vibration and other reasons, resulting in the semiconductor cooler 211 and the first gap filling layer 221 and / or the second gap filling layer 222 being skewed or misaligned, affecting heat dissipation. When the image generation unit is applied to a vehicle-mounted head-up display device, the image generation unit needs to vibrate for a long time. The first gap filling layer 221 and / or the second gap filling layer 222 can provide more stable mechanical support for the semiconductor cooler 211 to prevent partial disengagement due to vibration.

[0046] Optional, Figure 4 is a schematic diagram of the structure of another image generating unit provided by an embodiment of the present invention, referring to Figure 4 The display panel 10 further includes a cover plate 13, which is located on a side of the light emitting element LED away from the array substrate 11. The image generating unit further includes a first fixing member 31, a second fixing member 32 and a connecting member 33, wherein the first fixing member 31 is used to fix the cover plate 13, the second fixing member 32 is used to fix the heat dissipation fin 212, and the connecting member 33 connects the first fixing member 31 and the second fixing member 32.

[0047] Specifically, the connecting member 33 can connect and fix the first fixing member 31 and the second fixing member 32, so that the first fixing member 31 provides a force to the cover plate 13 toward the heat dissipation fins 212, and the second fixing member 32 provides a force to the heat dissipation fins 212 toward the cover plate 13, thereby squeezing the first gap filling layer 221 and / or the second gap filling layer 222 located between the cover plate 13 and the heat dissipation fins 212, so that the first gap filling layer 221 and / or the second gap filling layer 222 can fully fill the groove 01 of the adjacent film layer, increase the contact area between the first gap filling layer 221 and / or the second gap filling layer 222 and the surface of the adjacent film layer, reduce the contact thermal resistance, and improve the heat dissipation effect.

[0048] Exemplarily, the first fixing member 31 may be located on a side of the cover plate 13 away from the heat dissipation fins 212, and the first fixing member 31 may also be provided with an opening, and the opening of the first fixing member 31 may expose at least a portion of the cover plate 13; the second fixing member 32 may be located on a side of the heat dissipation fins 212 away from the cover plate 13, and the second fixing member 32 may also be provided with an opening, and the opening of the second fixing member 32 may expose at least a portion of the heat dissipation fins 212; the connecting member 33 may connect and fix the first fixing member 31 and the second fixing member 32 by welding, bonding, mechanical installation, etc., so that the first fixing member 31 and the second fixing member 32 can squeeze the first gap filling layer 221 and / or the second gap filling layer 222 located between the cover plate 13 and the heat dissipation fins 212. In an optional embodiment, the first fixing member 31 and the second fixing member 32 may both be an integral structure, or at least one of the first fixing member 31 and the second fixing member 32 may not be an integral structure, for example, the first fixing member 31 or the second fixing member 32 may be composed of multiple structures, which is not limited in the embodiment of the present invention.

[0049] It can be understood that by setting the first fixing member 31, the second fixing member 32 and the connecting member 33, compressive stress can be created between the first gap filling layer 221 and / or the second gap filling layer 222 and the adjacent film layer on at least one side, so that the first gap filling layer 221 and / or the second gap filling layer 222 fills the groove 01 of the adjacent film layer. At this time, the image generation unit may no longer be provided with the fixing member 30, because the first fixing member 31, the second fixing member 32 and the connecting member 33 can create a certain compressive stress between the film layer structures of the display panel 10 and the heat dissipation structure 20, so as to connect and fix the display panel 10 and the heat dissipation structure 20. Of course, in an optional embodiment, the image generation unit may continue to be provided with the fixing member 30 to further improve the reliability of use and display reliability. The embodiment of the present invention does not limit whether the fixing member 30 is continued to be provided after the first fixing member 31, the second fixing member 32 and the connecting member 33 are provided.

[0050] In an alternative embodiment, Figure 5is a schematic diagram of the structure of another image generating unit provided by an embodiment of the present invention, referring to Figure 5 When the first fixing member 31 is located on the side of the cover plate 13 away from the heat dissipation fins 212, and the second fixing member 32 is located on the upper side of the heat dissipation fins 212 away from the cover plate 13, an adhesive layer 40 can be provided between the first fixing member 31 and the cover plate 13, or between the second fixing member 32 and the heat dissipation fins 212. In this way, the relative movement between the first fixing member 31 and the cover plate 13, and between the second fixing member 32 and the heat dissipation fins 212 caused by vibration and the like is effectively avoided, and the risk of deflection is reduced. Among them, the adhesive layer 40 preferably has good resistance to cold and hot alternation, aging resistance and electrical insulation performance, and has good moisture resistance, shock resistance, corona resistance, leakage resistance and chemical medium resistance, can be used continuously at -60°C to 280°C and maintain performance, and has good adhesion to most metal and non-metal materials.

[0051] In yet another possible embodiment, Figure 6 is a schematic diagram of the structure of another image generating unit provided by an embodiment of the present invention, referring to Figure 6 When the first fixing member 31 is located on the side of the cover plate 13 away from the heat dissipation fins 212, and the second fixing member 32 is located on the side of the heat dissipation fins 212 away from the upper side of the cover plate 13, a first step groove 301 with a reduced thickness may be provided on the side of the first fixing member 31 close to the cover plate 13, or a second step groove 302 with a reduced thickness may be provided on the side of the second fixing member 32 close to the heat dissipation fins 212. The first step groove 301 includes a first step surface ST1 close to the side of the cover plate 13 and perpendicular to the thickness direction Z of the display panel 10, and a second step surface ST2 adjacent to the first step surface ST1 and close to the connecting member 33. The first step surface ST1 and the second step surface ST2 may both contact the cover plate 13. The second step groove 302 includes a third step surface ST3 close to the side of the heat dissipation fins 212 and perpendicular to the thickness direction Z of the display panel 10, and a fourth step surface ST4 adjacent to the third step surface ST3 and close to the connecting member 33. The third step surface ST3 and the fourth step surface ST4 may both contact the heat dissipation fins 212. In this way, relative movement between the first fixing member 31 and the cover plate 13, and between the second fixing member 32 and the heat dissipation fins 212 can be avoided, thereby reducing the risk of deflection. At the same time, the preparation process can be reduced and the preparation cost can be reduced.

[0052] Based on the above embodiment, the material of the first fixing member 31 and / or the second fixing member 32 includes bakelite.

[0053] Specifically, the chemical name of bakelite is phenol formaldehyde plastic (PF), which has high mechanical strength, good insulation, heat resistance, and corrosion resistance. The thermal conductivity of bakelite is about 0.04W / m·K, which can prevent the heat released by the display panel 10 and the heat dissipation structure 20 from flowing back to the display panel 10 and the heat dissipation structure 20 through the first fixing member 31 and / or the second fixing member 32, affecting the heat dissipation of the image generation unit. In other embodiments, the material of the first fixing member 31 and / or the second fixing member 32 can also be any other material with low thermal conductivity and no deformation within 150°C.

[0054] Based on the above embodiment, the material of the connecting member 33 includes modified plastic.

[0055] Specifically, the connector 33 is a non-thermal conductive material or a low thermal conductivity material, such as polyetheretherketone (PEEK), polyimide (PI), etc., to prevent the heat released by the display panel 10 and the heat dissipation structure 20 from flowing back into the display panel 10 and the heat dissipation structure 20 through the connector 33, thereby affecting the heat dissipation of the image generation unit.

[0056] In an optional embodiment, continue to refer to Figure 4-Figure 6 The display panel 10 includes a display area DA and a frame area BA, and the frame area BA is located outside the display area DA. At least part of the first fixing member 31 is located in the frame area BA and on a side of the cover plate 13 away from the array substrate 11.

[0057] Specifically, in the direction perpendicular to the plane where the display panel 10 is located, the projection of the first fixing member 31 on the plane where the display panel 10 is located overlaps with the projection of the frame area BA on the plane where the display panel 10 is located, and the projection of the first fixing member 31 on the plane where the display panel 10 is located does not overlap with the projection of the display area DA on the plane where the display panel 10 is located. In this way, at least part of the first fixing member 31 can be located in the frame area BA, and provide a downward force to the cover plate 13 of the frame area BA, so that the display panel 10 can press the first gap filling layer 221 and / or the second gap filling layer 222 in the heat dissipation structure 20 downward; at the same time, it can ensure the normal display of the display panel 10, and avoid the first fixing member 31 blocking the display area DA of the display panel 10, affecting the display effect.

[0058] Based on the above embodiments, Figure 7 is a schematic diagram of a top view structure of an image generation unit provided by an embodiment of the present invention, with reference to Figure 7The frame area BA includes a first side area BA1, a second side area BA2, an upper frame area BA3 and a lower frame area BA4. The first side area BA1 and the second side area BA2 are opposite to each other, and the upper frame area BA3 and the lower frame area BA4 are opposite to each other. The display panel 10 also includes a flexible circuit board 14, which is located in the lower frame area BA4 and is bound to the array substrate 11. The first fixing member 31 includes a first fixing bar 311 and a second fixing bar 312, the first fixing bar 311 is located in the first side area BA1, and the second fixing bar 312 is located in the second side area BA2.

[0059] Exemplary, reference Figure 7 The first side area BA1 and the second side area BA2 can be arranged relatively along the second direction Y, the upper frame area BA3 and the lower frame area BA4 can be arranged relatively along the first direction X, the first direction X and the second direction Y intersect, and the first direction X and the second direction Y are parallel to the plane where the display panel 10 is located. The first fixing bar 311 and the second fixing bar 312 are also arranged relatively to the display area DA along the second direction Y, which is conducive to fixing the display panel 10 and providing a downward force to the display panel 10, and at the same time, it can also reduce the shielding of the display panel 10, which is conducive to the heat dissipation of the display panel 10, especially avoiding the shielding of the lower frame area BA4, and effectively avoiding the accumulation of heat, which affects the reliability of use and display reliability.

[0060] In other optional embodiments, Figure 8 is a schematic diagram of a top view structure of another image generating unit provided by an embodiment of the present invention, with reference to Figure 8 The first fixing member 31 further includes a third fixing bar 313 and / or a fourth fixing bar 314. The third fixing bar 313 is located in the upper frame area BA3, and the fourth fixing bar 314 is located in the lower frame area BA4.

[0061] Exemplary, reference Figure 8 , the third fixing bar 313 can connect the first fixing bar 311 and the second fixing bar 312, and the fourth fixing bar 314 can also connect the first fixing bar 311 and the second fixing bar 312. The first fixing bar 311 and the second fixing bar 312 can provide downward force to the display panel 10 in the first side area BA1 and the second side area BA2 respectively, the third fixing bar 313 can provide downward force to the display panel 10 in the upper frame area BA3, and the fourth fixing bar 314 can provide downward force to the display panel 10 in the lower frame area BA4. In this way, it is beneficial for the first fixing member 31 to provide a uniform force to the frame of the display panel 10, disperse stress, avoid stress concentration and damage to the display panel 10, and can also improve the fixing effect and avoid the first fixing member 31 and the display panel 10 from being skewed or misaligned.

[0062] Continue to refer Figure 7 and Figure 8The second fixing member 32 may include a fifth fixing bar 325 and a sixth fixing bar 326, which may be arranged opposite to each other along the first direction X, and the arrangement direction of the fifth fixing bar 325 and the sixth fixing bar 326 intersects with the arrangement direction of the first fixing bar 311 and the second fixing bar 312. In this way, the force applied to the display panel 10 and the heat dissipation structure 20 can be effectively dispersed, and the force applied to the display panel 10 and the heat dissipation structure 20 is prevented from being concentrated on one side, which may easily damage the display panel 10 and the heat dissipation structure 20. In an optional embodiment, the second fixing member 32 may also include a seventh fixing bar and an eighth fixing bar (not shown in the figure), and the seventh fixing bar and the eighth fixing bar may be arranged relatively to each other along the second direction Y, the seventh fixing bar may be connected to the fifth fixing bar 325 and the sixth fixing bar 326, and the eighth fixing bar may also be connected to the fifth fixing bar 325 and the sixth fixing bar 326, which is beneficial for the second fixing member 32 to provide a uniform force to the frame of the display panel 10, disperse stress, avoid stress concentration and damage to the heat dissipation structure 20, and can also improve the fixing effect and avoid the second fixing member 32 and the heat dissipation structure 20 from being skewed or misaligned.

[0063] In yet another optional embodiment, Fig. 9 is a schematic diagram of the structure of another image generating unit provided by an embodiment of the present invention, referring to Fig. 9 The cover plate 13 includes a first extension portion 51 , which is perpendicular to the direction of the plane where the cover plate 13 is located. The first extension portion 51 surrounds the orthographic projection of the array substrate 11 on the cover plate 13 , and the first extension portion 51 is reused as the first fixing member 31 .

[0064] Specifically, the area of ​​the cover plate 13 can be increased, and the first extension portion 51 of the cover plate 13 can be used to replace the first fixing member 31. The connecting member 33 can connect and fix the first extension portion 51 and the second fixing member 32 of the cover plate 13, which is beneficial to saving materials of the fixing members, reducing the preparation process, improving the integrity, and also beneficial to fixing the display panel 10 to avoid the position deviation and misalignment of the display panel 10.

[0065] In yet another optional embodiment, Fig.10 is a schematic diagram of the structure of another image generating unit provided by an embodiment of the present invention, referring to Fig.10 The heat dissipation fin 212 includes a side end surface SI, the side end surface SI is connected to the surface of the heat dissipation fin 212 facing the semiconductor refrigerator 211, and the second fixing member 32 is fixed to the side end surface SI.

[0066] Specifically, in a direction perpendicular to the surface of the heat dissipation fin 212 facing the semiconductor refrigerator 211, the orthographic projection of the second fixing member 32 on the surface of the heat dissipation fin 212 facing the semiconductor refrigerator 211 does not overlap with the heat dissipation fin 212, and the second fixing member 32 is connected to and fixed to the side end surface SI of the heat dissipation fin 212. In this way, the heat dissipation of the heat dissipation fin 212 is facilitated, and the second fixing member 32 is prevented from blocking the fins of the heat dissipation fin 212 and affecting the contact area between the heat dissipation fin 212 and the air; at the same time, it is also conducive to reducing the thickness of the image generation unit, and is conducive to making the image generation unit thinner and lighter.

[0067] Based on the above embodiments, continue to refer to Fig.10 , further comprising a first bonding layer 41, the first bonding layer 41 being located between the side end surface SI and the second fixing member 32.

[0068] Specifically, the second fixing member 32 can be bonded to the side end surface SI of the edge of the heat dissipation fin 212 through the first bonding layer 41. The first bonding layer 41 preferably has good resistance to hot and cold alternation, aging resistance and electrical insulation performance, and has good moisture resistance, shock resistance, corona resistance, leakage resistance and chemical medium resistance. It can be used continuously at -60°C to 280°C and maintain performance, and has good adhesion to most metal and non-metal materials. In addition, the first bonding layer 41 is preferably non-thermal conductive, or has a thermal conductivity less than the first fixing member 31 and / or the second fixing member 32, so as to prevent the heat released by the heat dissipation fin 212 from being transferred back to the semiconductor refrigerator 211 and / or the display panel 10 through the first bonding layer 41.

[0069] In yet another optional embodiment, Fig.11 is a schematic diagram of the structure of another image generating unit provided by an embodiment of the present invention, referring to Fig.11 The heat sink 212 includes a second extension portion 52, which is perpendicular to the direction of the surface of the heat sink 212 facing the semiconductor refrigerator 211. The second extension portion 52 surrounds the positive projection of the array substrate 11 on the surface of the heat sink 212 facing the semiconductor refrigerator 211. The second extension portion 52 is reused as the second fixing member 32.

[0070] Specifically, the area of ​​the heat dissipation fin 212 can be increased, and the second extension portion 52 of the heat dissipation fin 212 can be used to replace the second fixing member 32. The connecting member 33 can connect and fix the first extension portion 51 of the cover plate 13 and the second extension portion 52 of the heat dissipation fin 212, which is beneficial to saving materials of the fixing member, reducing the preparation process, improving the integrity, and also beneficial to fixing the heat dissipation structure 20 to avoid the position deviation and misalignment of the heat dissipation structure 20.

[0071] In yet another optional embodiment, Fig.12 is a schematic diagram of the structure of another image generating unit provided by an embodiment of the present invention, referring to Fig.12 The first fixing member 31 is provided with a first through hole H01, and the second fixing member 32 is provided with a second through hole H02. The connecting member 33 includes a screw rod 331 and a nut 332. The screw rod 331 passes through the first through hole H01 and the second through hole H02, and is threadedly connected with the nut 332.

[0072] Exemplary, reference Fig.12 The rod of the screw 331 can pass through the first through hole H01 and the second through hole H02. The screw 331 also includes a screw head, which can be fixed above the first through hole H01. The screw 331 below the screw 331 also includes a thread, and at least part of the thread can be located below the second through hole H02. The threads of the screw 331 and the nut 332 are engaged and fixed with each other, and the nut 332 can be fixed below the second through hole H02. In this way, the first fixing member 31 and the second fixing member 32 can be connected and fixed, so that the first fixing member 31 and the second fixing member 32 can provide relative forces to the display panel 10 and the heat dissipation structure 20 respectively, so that the gap filling layer 22 in the heat dissipation structure 20 has compressive stress with the adjacent film layer on at least one side, thereby improving the thermal conductivity of the gap filling layer 22 and improving the use reliability and display reliability of the display panel 10.

[0073] In yet another optional embodiment, Fig.13 is a schematic diagram of the structure of another image generating unit provided by an embodiment of the present invention, referring to Fig.13 , the connecting member 33 includes a snap-fit ​​structure.

[0074] Exemplary, reference Fig.13 The connecting member 33 includes a male buckle 333 and a female buckle 334, and the male buckle 333 and the female buckle 334 form a snap-fit ​​structure. The first fixing member 31 and the second fixing member 32 can be connected and fixed by the snap-fit ​​structure. In an optional embodiment, the first fixing member 31 can be an integral structure with one of the male buckle 333 and the female buckle 334, and the second fixing member 32 can be an integral structure with the other of the male buckle 333 and the female buckle 334 (not shown in the figure).

[0075] In another optional embodiment, the connecting member 33 may further include a spring structure (not shown in the figure), which may have tensile stress. The rebound characteristics of the spring structure can pull the first fixing member 31 and the second fixing member 32 in opposite directions, so that the first fixing member 31 and the second fixing member 32 can respectively provide relative forces to the display panel 10 and the heat dissipation structure 20, so that the gap filling layer 22 in the heat dissipation structure 20 and the adjacent film layer on at least one side have compressive stress, thereby improving the thermal conductivity of the gap filling layer 22 and improving the use reliability and display reliability of the display panel 10.

[0076] Based on the same inventive concept, an embodiment of the present invention also provides a head-up display device, Fig.14 is a schematic diagram of the structure of a head-up display device provided by an embodiment of the present invention, such as Fig.14 As shown, the head-up display device 901 includes an image generating unit 902 provided by any embodiment of the present invention.

[0077] For example, continue to refer to Fig.14 The head-up display device 901 may also include a plane mirror 903 and a curved mirror 904. The outgoing light of the image generating unit 902 may be reflected by the plane mirror 903 and the curved mirror 904 and transmitted to the windshield 905. The windshield 905 may reflect part of the light to the driver's line of sight and form a virtual image on the other side of the windshield, so that the driver can clearly see the key information of the vehicle without taking his eyes off the road, and timely understand the key information such as the vehicle's operating status, navigation guidance and safety warnings, so as to make corresponding driving decisions and operations.

[0078] The head-up display device provided by the embodiment of the present invention can be Fig.14 The vehicle-mounted head-up display device shown may also be any other product with a head-up display function, including but not limited to the following categories: eyeglass head-up display devices, mobile phone head-up display devices, home head-up display devices, aircraft head-up display devices, workshop head-up display devices, etc. The embodiments of the present invention do not specifically limit this.

[0079] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, combinations and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. An image generation unit, characterized in that: include: The display panel comprises an array substrate and a light emitting element arranged on the array substrate; A heat dissipation structure, located on a side of the array substrate away from the light emitting element, comprising a heat dissipation element and a gap filling layer, wherein the gap filling layer is located between two heat dissipation elements or between the heat dissipation element and the array substrate; Compressive stress exists between the gap filling layer and an adjacent film layer on at least one side, and the adjacent film layer includes the array substrate disposed adjacent to the gap filling layer, or the heat dissipation element disposed adjacent to the gap filling layer.

2. The image generation unit according to claim 1, characterized in that The gap-filling layer includes a first gap-filling layer and / or a second gap-filling layer; The plurality of heat dissipation elements include semiconductor refrigerators and heat dissipation fins, wherein the semiconductor refrigerators are located between the array substrate and the heat dissipation fins; The first gap-filling layer fills the gap between the array substrate and the semiconductor cooler, and the second gap-filling layer fills the gap between the semiconductor cooler and the heat dissipation fins.

3. The image generation unit according to claim 2, characterized in that In a direction perpendicular to the plane where the array substrate is located, an area of ​​the first gap filling layer is larger than an area of ​​the semiconductor refrigerator; The first gap filling layer includes a recess on a side facing the semiconductor cooler, and the recess accommodates a partial thickness of the semiconductor cooler.

4. The image generation unit according to claim 2, characterized in that: The display panel further comprises a cover plate, and the cover plate is located at a side of the light emitting element away from the array substrate; The image generation unit further includes a first fixing member, a second fixing member and a connecting member; the first fixing member is used to fix the cover plate, the second fixing member is used to fix the heat dissipation fins, and the connecting member connects the first fixing member and the second fixing member.

5. The image generation unit according to claim 4, characterized in that The display panel comprises a display area and a frame area, wherein the frame area is located at the periphery of the display area; At least a portion of the first fixing member is located in the border area and on a side of the cover plate away from the array substrate.

6. The image generation unit according to claim 5, characterized in that: The frame area includes a first side area, a second side area, an upper frame area and a lower frame area, the first side area is opposite to the second side area, and the upper frame area is opposite to the lower frame area; The display panel further includes a flexible circuit board, which is located in the lower frame area and is bound to the array substrate; The first fixing member includes a first fixing strip and a second fixing strip, the first fixing strip is located in the first side edge region, and the second fixing strip is located in the second side edge region.

7. The image generation unit according to claim 6, characterized in that The first fixing member further comprises a third fixing strip and / or a fourth fixing strip; The third fixing strip is located in the upper frame area, and the fourth fixing strip is located in the lower frame area.

8. The image generation unit according to claim 4, characterized in that: The cover plate includes a first extension portion, which is perpendicular to the direction of the plane where the cover plate is located, and the first extension portion surrounds the orthographic projection of the array substrate on the cover plate; The first extension portion is reused as the first fixing member.

9. The image generation unit according to claim 4, characterized in that: The heat dissipation fin comprises a side end surface, and the side end surface is connected to a surface of the heat dissipation fin facing the semiconductor refrigerator; The second fixing member is fixed to the side end surface.

10. The image generation unit according to claim 9, characterized in that: It also includes a first adhesive layer, which is located between the side end surface and the second fixing member.

11. The image generation unit according to claim 4, characterized in that: The heat dissipation fin comprises a second extension portion, which is perpendicular to the direction of the surface of the heat dissipation fin facing the semiconductor refrigerator, and the second extension portion surrounds the orthographic projection of the array substrate on the surface of the heat dissipation fin facing the semiconductor refrigerator; The second extension portion is reused as the second fixing member.

12. The image generation unit according to claim 11, characterized in that: The material of the connecting piece includes modified plastic.

13. The image generation unit according to claim 4, characterized in that: The material of the first fixing member and / or the second fixing member includes bakelite.

14. The image generation unit according to claim 4, characterized in that: The first fixing member is provided with a first through hole, and the second fixing member is provided with a second through hole; The connecting member includes a screw and a nut. The screw passes through the first through hole and the second through hole and is threadedly connected with the nut.

15. The image generation unit according to claim 4, characterized in that: The connecting piece includes a snap-fit ​​structure or a spring structure.

16. The image generation unit according to claim 1, characterized in that: The light emitting element includes an inorganic light emitting diode.

17. A head-up display device, characterized in that: The invention comprises the image generating unit as described in any one of claims 1 to 16.

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