Gluing and developing device for semiconductor manufacturing

Abstract

The invention provides a gluing and developing device for semiconductor manufacturing, and relates to the technical field of semiconductor processing devices.The gluing and developing device comprises a device box, a support of an L-shaped structure is fixedly installed on the rear end face of the device box, an electric cylinder is fixedly installed on the upper end face of the support, and a placing plate is fixedly installed on the tail end face of a telescopic part of the lower end of the electric cylinder; an annular rail groove is formed in the upper end face of the device box. In the invention, the gluing spray pipe and the developing spray pipe are respectively connected with the connecting pipe through threads, the detachable connecting mode facilitates the replacement and maintenance of the gluing spray pipe and the developing spray pipe, and the number of the gluing spray pipe and the developing spray pipe can be increased or reduced according to the size of a wafer; and the total length of the gluing spraying pipe and the developing spraying pipe is adjusted, so that the problems that the gluing operation and the developing operation cannot be completed in the same working procedure, the wafers are easily damaged during transferring, and inconvenience exists when workers fix the wafers with different sizes are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing equipment, in particular to a glue coating and developing device used in semiconductor manufacturing. Background Art

[0002] In the semiconductor manufacturing process, photolithography is an extremely critical step, and coating and development are indispensable links in the photolithography process. The coating process requires that the photoresist be evenly and accurately coated on the surface of the wafer to ensure the accurate formation of the subsequent photolithography pattern; the development process is to process the exposed photoresist and remove the part that needs to be removed, so as to show the desired photolithography pattern.

[0003] However, the current coating and developing equipment still has the following two deficiencies in the processing process: First, the coating and developing operations require two processes to complete. The two processes involve the transportation of the wafer, which is easy to cause damage to the wafer. Secondly, wafers of different specifications have different sizes, which makes it inconvenient for workers to fix different wafers. They also need to replace different glue coating nozzles and developing nozzles according to the size of the wafers, which reduces work efficiency. Summary of the invention

[0004] In view of this, the present invention provides a coating and developing device for semiconductor manufacturing to solve the problems that the coating operation and the developing operation cannot be completed in the same process, the wafer is easily damaged during transportation, and the wafers of different specifications have different sizes, which causes inconvenience for workers when fixing different wafers.

[0005] The present invention provides the purpose and effect of a glue coating and developing device for semiconductor manufacturing, which specifically includes: a device box; An L-shaped bracket is fixedly installed on the rear end surface of the device box, an electric cylinder is fixedly installed on the upper end surface of the bracket, a placement plate is fixedly installed on the end surface of the telescopic part of the lower end of the electric cylinder, and an annular track groove is opened on the upper end surface of the device box; A drive motor, wherein the drive motor is fixedly mounted on the outer end surface of the front side plate of the device box, the front end of the drive motor is drivingly connected to a drive shaft, and the end of the drive shaft is rotatably connected to the rear side plate of the device box; A placing plate, the lower end surface of the placing plate is annularly provided with six supporting slide blocks, the upper end surface of the placing plate is annularly provided with four transverse slide grooves, a connecting rod is fixedly provided at the middle position of the lower end surface of the placing plate, and the lower end of the connecting rod is rotatably connected to the bottom plate of the device box; A card seat, wherein four card seats are provided, the four card seats are arranged in a ring structure, and the card seats are located above the placement plate; A fixing box, wherein the fixing box is fixedly mounted on the upper end surface of the card holder, a mounting groove is provided inside the fixing box, and a main body of the mounting groove is a convex structure; A cardboard, wherein the outer end surface of the cardboard is an arc-shaped structure, and a slide plate is fixedly installed on the inner end surface of the cardboard; The connecting pipes are symmetrically provided with two groups, the two connecting pipes are fixedly installed on the surface of the placement plate, the connecting pipe body is an L-shaped structure, the outlet end of the connecting pipe is provided with an internal thread, the external thread of the connecting pipe at the front end is connected to the spraying mechanism, and the external thread of the connecting pipe at the rear end is connected to the developing mechanism.

[0006] Furthermore, the spraying mechanism comprises: A glue spraying nozzle, wherein an outer thread is provided on one side of the inner end of the glue spraying nozzle, the inner end of the glue spraying nozzle is threadedly connected to the front connecting pipe, and an inner thread is provided on one side of the outer end of the glue spraying nozzle; The glue spray nozzle is fixedly installed at the middle position of the lower end surface of the glue spray nozzle.

[0007] Furthermore, the developing mechanism comprises: A developing nozzle, wherein an outer thread is provided on one side of the inner end of the developing nozzle, the inner end of the developing nozzle is threadedly connected to a connecting pipe at a rear end, and an inner thread is provided on one side of the outer end of the developing nozzle; The developing nozzles are symmetrically installed with two developing nozzles, and the developing nozzles are fixedly installed at the lower position of the developing nozzle pipe.

[0008] Furthermore, a driving bevel gear is installed on the surface of the driving shaft, and a passive bevel gear is installed on the surface of the connecting rod, and the driving bevel gear and the passive bevel gear are meshed with each other.

[0009] Furthermore, a group of scale lines are respectively provided at both ends of the transverse slide groove, a fastening block is slidably mounted inside the transverse slide groove, and a fastening screw is fixedly mounted on the upper end surface of the fastening block.

[0010] Furthermore, a through hole is formed on the upper end surface of the clamping seat, a fastening screw at the upper end of the fastening block is clamped in the through hole, and a nut is connected to the surface of the fastening screw.

[0011] Furthermore, the lower end portion of the supporting sliding block is divided into a trapezoidal structure, and the lower end portion of the supporting sliding block is slidably mounted in the annular track groove on the upper end surface of the device box.

[0012] Furthermore, the slide plate is slidably mounted in a device slot inside the fixing box, and three compression springs are installed inside the device slot, and the compression springs are fixedly connected to the slide plate.

[0013] The present invention provides a glue coating and developing device for semiconductor manufacturing, which has the following beneficial effects: 1. The lower end of the placement tray is provided with six supporting sliders installed in a ring shape. The lower end thereof is divided into a trapezoidal structure and is slidably mounted in the ring track groove on the upper end of the device box. This design effectively limits the movement track of the placement tray and prevents it from deflecting or shaking during rotation, further ensuring the stability of the rotation of the placement tray and helping to improve the uniformity and accuracy of glue coating and development.

[0014] 2. The glue nozzle is fixedly installed in the middle position of the lower end surface of the glue spray nozzle. When the wafer on the placement plate rotates, the glue liquid is sprayed out from the glue spray nozzle and can be evenly coated on the surface of the wafer. There are two symmetrically installed developing nozzles, which are fixed at the lower position of the developing nozzle. The developing liquid is sprayed from the two developing nozzles, which improves the developing effect and ensures that the developing process is more uniform and efficient, which helps to improve the processing quality of semiconductor wafers.

[0015] 3. The connecting tubes are divided into two groups, the front end is connected to the glue liquid supply equipment, and the rear end is connected to the developer supply equipment. When the glue coating operation is in progress, the rear end connecting tube is closed, and the front end connecting tube allows the glue liquid to pass through; when the developer operation is in progress, the front end connecting tube is closed, and the rear end connecting tube allows the developer to pass through. This design allows the glue coating and developer operations to be completed in one process, avoiding the transfer process of wafers between different equipment, greatly shortening the processing time and improving work efficiency.

[0016] 3. The glue coating nozzle and the developing nozzle are connected to the connecting pipe through threads respectively. This detachable connection method facilitates the replacement and maintenance of the glue coating nozzle and the developing nozzle. When the nozzle needs to be replaced or the equipment needs to be cleaned, it can be quickly disassembled and installed, which reduces equipment downtime and further improves production efficiency. In addition, the number of glue coating nozzles and developing nozzles can be increased or decreased according to the size of the wafer.

[0017] 4. The two ends of the horizontal slide groove on the upper end of the placement plate are respectively provided with scale lines, and the internal sliding card is equipped with a fastening block. The fastening screw at the upper end of the fastening block passes through the through hole on the card holder and is tightened with a nut. According to the size of the wafer, the staff can fix the card holder in the appropriate position on the placement plate by observing the scale lines and sliding the fastening block, thereby achieving the fixation of wafers of different sizes. This design enables the device to adapt to the processing needs of semiconductor wafers of various specifications, improving the versatility and applicability of the equipment.

[0018] 5. A compression spring is installed inside the fixing box on the card holder, and the compression spring is fixedly connected to the slide plate on the inner end face of the card plate. When the wafer is placed on the card holder, the card plate is squeezed, the slide plate slides in the device slot, and the compression spring generates elastic force to make the card plate tightly clamp the wafer. This elastic fixing method can adapt to wafers of different shapes and surface characteristics, ensuring that the wafer remains stable during the coating and development process, and avoiding the impact of the processing quality due to the shaking of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings of the embodiment are briefly introduced below.

[0020] The drawings described below are only related to some embodiments of the present invention, but are not intended to limit the present invention.

[0021] In the attached picture: Figure 1 It is a schematic diagram of the overall device structure of the present invention; Figure 2 It is a schematic diagram of the structure of the gluing nozzle and the developing nozzle of the present invention; Figure 3 It is a schematic diagram of the exploded structure of the gluing nozzle and the developing nozzle of the present invention; Figure 4 It is a schematic diagram of the internal device structure of the device box of the present invention; Figure 5 The present invention Figure 4 A schematic diagram of the partially enlarged structure at center A; Figure 6 It is a schematic diagram of the structure of the placement plate and the supporting sliding block of the present invention; Figure 7 It is a schematic diagram of the structure of the transverse slide groove on the surface of the placement plate of the present invention; Figure 8 It is a schematic diagram of the connection structure between the fastening block and the socket of the present invention.

[0022] List of reference numerals: 1. Device box; 101. Bracket; 102. Annular track groove; 2. Electric cylinder; 201. Placement plate; 3. Driving motor; 301. Driving shaft; 3011. Active bevel gear; 4. Placement plate; 401. Horizontal slide groove; 4011. Scale line; 402. Support slider; 403. Connecting rod; 4031. Passive bevel gear; 5. Fastening block; 501. Fastening screw; 6. Card seat; 601. Through hole; 7. Fixing box; 701. Device groove; 702. Compression spring; 8. Card plate; 801. Slide plate; 9. Connecting pipe; 10. Gluing nozzle; 1001. Gluing nozzle; 11. Developing nozzle; 1101. Developing nozzle. DETAILED DESCRIPTION

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of specific embodiments of the present invention.

[0024] Example 1: Please refer to Figures 1 to 8 As shown: The present invention provides a glue coating and developing device for semiconductor manufacturing, comprising a device box 1; An L-shaped bracket 101 is fixedly mounted on the rear end face of the device box 1, an electric cylinder 2 is fixedly mounted on the upper end face of the bracket 101, a placement plate 201 is fixedly mounted on the end face of the telescopic part at the lower end of the electric cylinder 2, and an annular track groove 102 is opened on the upper end face of the device box 1; The driving motor 3 is fixedly mounted on the outer end surface of the front side plate of the device box 1, the front end of the driving motor 3 is drivingly connected with a driving shaft 301, and the end of the driving shaft 301 is rotatably connected with the rear end side plate of the device box 1; The placing plate 4 has six supporting slide blocks 402 installed in a ring shape on the lower end surface of the placing plate 4, and four transverse slide grooves 401 are opened in a ring shape on the upper end surface of the placing plate 4. A connecting rod 403 is fixedly installed in the middle position of the lower end surface of the placing plate 4, and the lower end of the connecting rod 403 is rotatably connected to the bottom plate of the device box 1; A card seat 6, wherein four card seats 6 are provided, and the four card seats 6 are arranged in a ring structure, and the card seat 6 is located above the placement plate 4; The fixing box 7 is fixedly mounted on the upper end surface of the card holder 6, and a mounting groove 701 is provided inside the fixing box 7, and the main body of the mounting groove 701 is a convex structure; A card plate 8, the outer end surface of the card plate 8 is an arc-shaped structure, and a slide plate 801 is fixedly installed on the inner end surface of the card plate 8; The connecting tube 9 has two symmetrical groups, and the two connecting tubes 9 are fixedly mounted on the surface of the placement plate 201. The main body of the connecting tube 9 is an L-shaped structure, and an internal thread is provided at the outlet end of the connecting tube 9. The external thread of the connecting tube 9 at the front end is connected to the spraying mechanism, and the external thread of the connecting tube 9 at the rear end is connected to the developing mechanism.

[0025] Among them, the spraying mechanism includes: a glue coating nozzle 10, an outer thread is provided on the inner end side of the glue coating nozzle 10, the inner end side of the glue coating nozzle 10 is threadedly connected to the connecting pipe 9 at the front end, and an inner thread is provided on the outer end side of the glue coating nozzle 10; a glue coating nozzle 1001, the glue coating nozzle 1001 is fixedly installed in the middle position of the lower end surface of the glue coating nozzle 10, when the wafer placed on the upper end of the tray 4 rotates, the glue liquid is sprayed from the glue coating nozzle 1001, and the glue can be evenly coated on the surface of the wafer.

[0026] Among them, the developing mechanism includes: a developing nozzle 11, an outer thread is provided on one side of the inner end of the developing nozzle 11, the inner end of the developing nozzle 11 is threadedly connected to the connecting pipe 9 at the rear end, and an inner thread is provided on one side of the outer end of the developing nozzle 11; a developing nozzle 1101, two developing nozzles 1101 are symmetrically installed, and the developing nozzle 1101 is fixedly installed at the lower position of the developing nozzle 11. During use, the developing nozzle 1101 at the lower end of the developing nozzle 11 can spray out the developing solution. There are two developing nozzles 1101, which can improve the developing effect.

[0027] The driving shaft 301 is provided with an active bevel gear 3011 , and the connecting rod 403 is provided with a passive bevel gear 4031 . The active bevel gear 3011 and the passive bevel gear 4031 mesh with each other, and the lateral rotation of the driving shaft 301 can be converted into the longitudinal rotation of the connecting rod 403 .

[0028] Among them, the lower end of the supporting slider 402 is divided into a trapezoidal structure, and the lower end part of the supporting slider 402 is slidably mounted in the annular track groove 102 on the upper end surface of the device box 1, which can ensure the smooth rotation of the placement plate 4.

[0029] Among them, the slide plate 801 is slidably mounted in the installation groove 701 inside the fixing box 7, and three compression springs 702 are installed inside the installation groove 701. The compression springs 702 are fixedly connected to the slide plate 801. The elastic force generated by the compression springs 702 enables the clamping plate 8 to tightly clamp the wafer to fix the wafer.

[0030] Embodiment 2: The present invention provides a coating and developing device for semiconductor manufacturing, based on the embodiment 1, as Figure 1-Figure 8 As shown, it also includes: connecting tubes 9, which are provided with two groups. The front connecting tubes 9 are connected to the glue liquid supply equipment, and the rear connecting tubes 9 are connected to the developer supply equipment. When the glue coating operation is performed, the rear connecting tubes 9 are in a closed state, and the front connecting tubes 9 can allow the glue liquid to pass through. When the developing operation is performed, the front connecting tubes 9 are closed, and the rear connecting tubes 9 can allow the developer to pass through. In this way, the glue coating and developing operations can be completed in one process, avoiding the transfer process of the wafer and improving work efficiency.

[0031] Embodiment 3: The present invention provides a coating and developing device for semiconductor manufacturing, based on the embodiment 1, such as Figure 1-Figure 8 As shown, it also includes: a group of scale lines 4011 are respectively opened at both ends of the horizontal slide groove 401, a fastening block 5 is slidably mounted inside the horizontal slide groove 401, and a fastening screw 501 is fixedly installed on the upper end surface of the fastening block 5; a through hole 601 is opened on the upper end surface of the holder 6, the fastening screw 501 at the upper end of the fastening block 5 is clamped in the through hole 601, and a nut is connected to the surface of the fastening screw 501.

[0032] By adopting the above scheme, the technical effect brought about is: the fastening block 5 slides inside the horizontal slide groove 401 to fix the wafers of different sizes, the fastening screw 501 at the upper end of the fastening block 5 passes through the through hole 601 on the holder 6, and then is tightened with a nut, so as to fix the holder 6 in a suitable position on the placement plate 4.

[0033] The specific usage and function of this embodiment: The present invention is mainly used for gluing and developing operations of semiconductor wafers. The core working process is to place the wafer on the placement plate 4, drive the placement plate 4 to rotate by the driving motor 3, and use the electric cylinder 2 to control the lifting of the gluing mechanism and the developing mechanism, so that the gluing mechanism and the developing mechanism can accurately perform gluing and developing operations on the wafer. The driving motor 3 at the front end of the device box 1 is started, and the driving shaft 301 will rotate. Due to the active bevel gear 3011 on the driving shaft 301 and the passive bevel gear on the connecting rod 403, the driving shaft 3011 is rotated. The wheels 4031 mesh with each other, and the lateral rotation of the driving shaft 301 drives the vertical rotation of the connecting rod 403, thereby causing the placement plate 4 to start rotating. The supporting slider 402 at the lower end of the placement plate 4 slides in the annular track groove 102 on the upper end surface of the device box 1 to ensure that the placement plate 4 rotates smoothly. When processing wafers of different sizes, the four card seats 6 at the upper end of the placement plate 4 are arranged above the placement plate 4 in an annular structure. The staff can adjust the fastening block 5 in the horizontal direction according to the size of the wafer by observing the scale lines 4011 at both ends of the horizontal slide groove 401. The wafer is slid into the slide groove 401 to fix the wafers of different sizes. The fastening screw 501 at the upper end of the fastening block 5 passes through the through hole 601 on the card seat 6 and is then tightened with a nut to fix the card seat 6 at a suitable position on the placement plate 4. The wafer is placed on the card seat 6. A compression spring 702 is installed in the device groove 701 in the fixing box 7 on the card seat 6. The compression spring 702 is fixedly connected to the slide plate 801 on the inner end surface of the card plate 8. When the wafer is placed on the card seat 6, the card plate 8 is squeezed and the slide plate 801 slides in the device groove 701. The elastic force generated by the compression spring 702 causes the clamping plate 8 to clamp the wafer tightly, thereby fixing the wafer. Then the electric cylinder 2 can be started, and its telescopic part drives the placement plate 201 to descend, so that the glue spray pipe 10 and the glue nozzle 1001 connected to the placement plate 201 are dropped to a suitable height, close to the wafer fixed on the placement plate 4. The glue spray pipe 10 is connected to an external glue liquid supply device, and the glue liquid passes through the glue spray pipe 10 and is sprayed from the glue nozzle 1001 to perform glue coating operations on the rotating wafer. Since the placement plate 4 is in continuous rotation, the coating liquid can evenly cover the surface of the wafer to complete the coating process. After the coating is completed, the developing nozzle 11 is connected to the external developing liquid supply equipment, and the developing liquid passes through the developing nozzle 11 and is sprayed from the developing nozzle 1101 to perform a developing operation on the rotating wafer. The developing liquid chemically reacts with the photoresist on the wafer to dissolve the exposed or unexposed parts, thereby forming a desired pattern on the wafer to complete the developing process.

Claims

1. A coating and developing device for semiconductor manufacturing, characterized in that: include: A device box (1), wherein an L-shaped bracket (101) is fixedly mounted on the rear end surface of the device box (1), an electric cylinder (2) is fixedly mounted on the upper end surface of the bracket (101), a placement plate (201) is fixedly mounted on the end surface of the telescopic portion of the lower end of the electric cylinder (2), and an annular track groove (102) is provided on the upper end surface of the device box (1); a drive motor (3), wherein the drive motor (3) is fixedly mounted on the outer end surface of the front end side plate of the device box (1), the front end of the drive motor (3) is transmission-connected to a drive shaft (301), and the end of the drive shaft (301) is rotationally connected to the rear end side plate of the device box (1); a placement plate (4), wherein six supporting sliders (402) are annularly mounted on the lower end surface of the placement plate (4), four transverse slide grooves (401) are annularly opened on the upper end surface of the placement plate (4), a connecting rod (403) is fixedly mounted at the middle position of the lower end surface of the placement plate (4), and the connecting rod (403) The lower end of the card seat (6) is rotatably connected to the bottom plate of the device box (1); a card seat (6), wherein four card seats (6) are provided, and the four card seats (6) are arranged in an annular structure, and the card seat (6) is located above the placement plate (4); a fixed box (7), wherein the fixed box (7) is fixedly installed on the upper end surface of the card seat (6), and a device groove (701) is provided inside the fixed box (7), and the main body of the device groove (701) is a convex structure; a card plate (8), wherein the outer end surface of the card plate (8) is an arc structure, and a slide plate (801) is fixedly installed on the inner end surface of the card plate (8); a connecting pipe (9), wherein two groups of the connecting pipes (9) are symmetrically provided, and the two connecting pipes (9) are fixedly installed on the surface of the placement plate (201), and the main body of the connecting pipe (9) is an L-shaped structure, and the outlet end of the connecting pipe (9) is provided with an internal thread, and the external thread of the front connecting pipe (9) is connected to the spraying mechanism, and the external thread of the rear connecting pipe (9) is connected to the developing mechanism.

2. The coating and developing device for semiconductor manufacturing as claimed in claim 1, characterized in that: The spraying mechanism comprises: A glue spraying nozzle (10), wherein an outer thread is formed on one side of the inner end of the glue spraying nozzle (10), the inner end of the glue spraying nozzle (10) is threadedly connected to the front connecting pipe (9), and an inner thread is formed on one side of the outer end of the glue spraying nozzle (10); The glue spray nozzle (1001) is fixedly mounted at the middle position of the lower end surface of the glue spray pipe (10).

3. The coating and developing device for semiconductor manufacturing as claimed in claim 1, characterized in that: The developing mechanism comprises: A developing nozzle (11), wherein an inner end of the developing nozzle (11) is provided with an external thread, the inner end of the developing nozzle (11) is threadedly connected to a connecting pipe (9) at the rear end, and an outer end of the developing nozzle (11) is provided with an internal thread; A developing nozzle (1101), two developing nozzles (1101) are symmetrically installed, and the developing nozzles (1101) are fixedly installed at a position below the developing nozzle pipe (11).

4. The coating and developing device for semiconductor manufacturing as claimed in claim 1, characterized in that: A driving bevel gear (3011) is installed on the surface of the driving shaft (301), and a passive bevel gear (4031) is installed on the surface of the connecting rod (403), and the driving bevel gear (3011) and the passive bevel gear (4031) are meshed with each other.

5. The coating and developing device for semiconductor manufacturing as claimed in claim 1, characterized in that: A set of scale lines (4011) are respectively provided at both ends of the transverse slide groove (401), a fastening block (5) is slidably mounted inside the transverse slide groove (401), and a fastening screw (501) is fixedly mounted on the upper end surface of the fastening block (5).

6. The coating and developing device for semiconductor manufacturing as claimed in claim 1, characterized in that: A through hole (601) is formed on the upper end surface of the clamping seat (6), and a fastening screw (501) at the upper end of the fastening block (5) is clamped inside the through hole (601), and a nut is connected to the surface of the fastening screw (501).

7. The coating and developing device for semiconductor manufacturing as claimed in claim 1, characterized in that: The lower end of the supporting sliding block (402) is divided into a trapezoidal structure, and the lower end portion of the supporting sliding block (402) is slidably mounted in the annular track groove (102) on the upper end surface of the device box (1).

8. The coating and developing device for semiconductor manufacturing as claimed in claim 1, characterized in that: The slide plate (801) is slidably mounted in a mounting groove (701) inside the fixing box (7), and three compression springs (702) are installed inside the mounting groove (701), and the compression springs (702) are fixedly connected to the slide plate (801).

Images