Server heat dissipation decoupling device and method

Abstract

The embodiment of the invention provides a server heat dissipation decoupling device and method. The server heat dissipation decoupling device comprises a mainboard circuit, a sensor arranged on the mainboard circuit, a connector and a substrate management controller. The temperature detection device is used for acquiring the real-time temperature of a specified position according to a remote signal of the sensor; the real-time temperature is transmitted to the sensor through the connector; the sensor is used for transmitting the real-time temperature to the substrate management controller; and the substrate management controller is used for performing data management on the real-time temperature. According to the technology, a sensor with a remote function and a temperature detection device are integrated in a mainboard circuit, so that accurate monitoring and data return of the real-time temperature of a remote position are realized, the system design is simplified, and the efficiency and the reliability of heat dissipation management are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of servers, and in particular to a server heat dissipation decoupling device and method. Background Art

[0002] With the development of AI technology and GPU servers, the internal temperature of GPU servers has gradually become a bottleneck for performance release, which has led to the development of liquid cooling technology. The current hardware architecture has a relatively backward way to read temperature.

[0003] Specifically, the baseboard management controller of the server is connected to other boards in the system through an I2C link, and the sensors are arranged on the boards according to the heat dissipation strategy. The baseboard management controller reads the register information according to the I2C address of the sensor and parses the temperature data. Furthermore, with the increase in server types and the gradual maturity of third-party development capabilities of peripheral boards, in addition to the main board, such as the switch board, OAM module UBB backplane, board suppliers independent of server manufacturers often develop boards in the form of components, which requires an increase in the number of sensors.

[0004] In general, the existing temperature data reading method of the baseboard management controller is greatly restricted by the system hardware and software design, which is inconvenient to use in the hardware and software decoupling scenario, has high investment cost and is difficult to adapt the cooling strategy. Summary of the invention

[0005] The purpose of the present invention is to provide a server heat dissipation decoupling device and method to alleviate the technical problems that the temperature data reading method of the existing baseboard management controller is greatly restricted by the system software and hardware design, is inconvenient to use in the software and hardware decoupling scenario, has high investment cost, and is difficult to adapt the heat dissipation strategy, thereby reducing costs and reducing system software and hardware design restrictions.

[0006] In the first aspect, an embodiment of the present invention provides a server heat dissipation decoupling device, comprising: a mainboard circuit, a sensor arranged on the mainboard circuit, a connector and a baseboard management controller; the above-mentioned sensor, the above-mentioned baseboard management controller and the above-mentioned connector are connected in sequence; the above-mentioned sensor has a remote function; the above-mentioned connector is connected to a temperature detection line; the above-mentioned temperature detection line is provided with a temperature detection device; the above-mentioned temperature detection device is arranged at a specified position at a specified distance from the above-mentioned mainboard circuit; the above-mentioned temperature detection device is used to obtain the real-time temperature of the above-mentioned specified position according to the remote signal of the above-mentioned sensor; and, the above-mentioned real-time temperature is transmitted to the above-mentioned sensor through the above-mentioned connector; the above-mentioned sensor is used to transmit the above-mentioned real-time temperature to the above-mentioned baseboard management controller; the above-mentioned baseboard management controller is used to perform data management on the above-mentioned real-time temperature.

[0007] In a preferred embodiment of the present invention, the above-mentioned device further comprises: a board card; and the above-mentioned temperature detection device is on the above-mentioned board card.

[0008] In a preferred embodiment of the present invention, the types of the above-mentioned board are switch board, OAM module board, and UBB backplane.

[0009] In a preferred embodiment of the present invention, the baseboard management controller is connected to the board via an I2C link.

[0010] In a preferred embodiment of the present invention, the baseboard management controller is also connected to a complex programmable logic device.

[0011] In a preferred embodiment of the present invention, the complex programmable logic device is communicatively connected to the board.

[0012] In a preferred embodiment of the present invention, the temperature detection device is disposed at an air inlet of a chassis where the server is placed.

[0013] In a preferred embodiment of the present invention, the temperature detection device is a metal oxide semiconductor field effect transistor.

[0014] In a second aspect, an embodiment of the present invention further provides a server heat dissipation decoupling method, which is applied to the above-mentioned server heat dissipation decoupling device; the above-mentioned method includes: obtaining the real-time temperature of the above-mentioned specified position through the above-mentioned temperature detection device; and transmitting the above-mentioned real-time temperature to the above-mentioned sensor through the above-mentioned connector; transmitting the above-mentioned real-time temperature to the above-mentioned baseboard management controller through the above-mentioned sensor; and performing data management of the above-mentioned real-time temperature through the above-mentioned baseboard management controller.

[0015] In a preferred embodiment of the present invention, the step of continuing data management of the real-time temperature through the baseboard management controller includes: recording the real-time temperature in a log file through the baseboard management controller.

[0016] The embodiments of the present invention have the following beneficial technical effects:

[0017] The embodiment of the present invention provides a server heat dissipation decoupling device and method, including: a mainboard circuit, a sensor set on the mainboard circuit, a connector and a baseboard management controller; the above sensor, the above baseboard management controller and the above connector are connected in sequence; the above sensor has a remote function; the above connector is connected with a temperature detection line; the above temperature detection line is provided with a temperature detection device; the above temperature detection device is set at a specified position at a specified distance from the above mainboard circuit; the above temperature detection device is used to obtain the real-time temperature of the above specified position according to the remote signal of the above sensor; and, the above real-time temperature is transmitted to the above sensor through the above connector; the above sensor is used to transmit the above real-time temperature to the above baseboard management controller; the above baseboard management controller is used to perform data management on the above real-time temperature. This technology realizes accurate monitoring and data feedback of the real-time temperature of the remote position by integrating a sensor and a temperature detection device with a remote function in the mainboard circuit, simplifies the system design and improves the efficiency and reliability of heat dissipation management. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 A schematic diagram of the structure of an existing baseboard management controller information reading system provided by an embodiment of the present invention;

[0020] Figure 2 A schematic diagram of the structure of a server heat dissipation decoupling device provided by an embodiment of the present invention;

[0021] Figure 3 A schematic diagram of the structure of a connector and a temperature detection device provided by an embodiment of the present invention;

[0022] Figure 4 A schematic flow chart of a control method for a server heat dissipation decoupling device provided in an embodiment of the present invention.

[0023] Icons: 10-mainboard circuit; 11-baseboard management controller; 12-board; 13-complex programmable logic device; 21-connector; 22-temperature detection line; 30-sensor; 31-chassis; 32-temperature detection device; 33-cable pin; 34-wire. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0025] The existing temperature data reading method of the baseboard management controller is greatly restricted by the system hardware and software design. It is inconvenient to use in the hardware and software decoupling scenario, the investment cost is high, and the adaptation of the heat dissipation strategy is difficult.

[0026] Based on this, the embodiment of the present invention provides a server heat dissipation decoupling device and method. This technology integrates a sensor with remote function and a temperature detection device in the mainboard circuit to achieve accurate monitoring and data feedback of the real-time temperature at the remote location, simplifying the system design and improving the efficiency and reliability of heat dissipation management. For ease of understanding, a server heat dissipation decoupling device is first introduced.

[0027] Example 1

[0028] In an embodiment of the present invention, Figure 1 A schematic diagram of the structure of an existing baseboard management controller information reading system provided by an embodiment of the present invention.

[0029] Depend on Figure 1 As can be seen, the baseboard management controller 11 provided in the mainboard circuit 10 is connected to the motherboard circuit 10 by I 2 The C link is connected to other boards 12 in the system, and the sensors are arranged on the boards 12 according to the heat dissipation strategy. 2 C address reads register information to parse temperature data. The current heat dissipation layout strategy for sensors is that there is no requirement for the air inlet sensor position, and the air outlet and mainboard position sensors are arranged near the heat source.

[0030] Furthermore, the decoupling trend of server hardware and software development is that with the increase in server types and the gradual maturity of third-party development capabilities of peripheral boards and cards, in addition to the mainboard, other boards and cards12, such as switch boards, OAM modules and UBB backplanes, are often developed in the form of components by board and card suppliers independent of server manufacturers, and are promoted and imported into the board and card products.

[0031] Furthermore, the baseboard management controller 11 is also connected to a complex programmable logic device 13 .

[0032] Here, the complex programmable logic device 13 is also connected to the above board 12. Among them, RST is a reset signal; SGPIO is a serial communication protocol signal.

[0033] Furthermore, Figure 2 A schematic structural diagram of a server heat dissipation decoupling device provided in an embodiment of the present invention.

[0034] Depend on Figure 2 As can be seen, the device includes: a mainboard circuit 10, a sensor 30 arranged on the mainboard circuit 10, a connector 21 and a baseboard management controller 11; the above-mentioned sensor 30, the above-mentioned baseboard management controller 11 and the above-mentioned connector 21 are connected in sequence; the above-mentioned sensor 30 has a remote function; the above-mentioned connector 21 is connected to a temperature detection line 22; the above-mentioned temperature detection line 22 is provided with a temperature detection device 32; the above-mentioned temperature detection device 32 is arranged at a specified position at a specified distance from the above-mentioned mainboard circuit; the above-mentioned temperature detection device 32 is used to obtain the real-time temperature of the above-mentioned specified position according to the remote signal of the above-mentioned sensor 30; and, the above-mentioned real-time temperature is transmitted to the above-mentioned sensor 30 through the above-mentioned connector; the above-mentioned sensor 30 is used to transmit the above-mentioned real-time temperature to the above-mentioned baseboard management controller 11; the above-mentioned baseboard management controller 11 is used to perform data management on the above-mentioned real-time temperature.

[0035] The device further comprises: a board 12; and the temperature detection device 32 is on the board.

[0036] Furthermore, the types of the above-mentioned board 12 are switch board, OAM module board, and UBB backplane.

[0037] Furthermore, the baseboard management controller 11 is connected to the board via an I2C link.

[0038] Furthermore, the baseboard management controller 11 is also connected to a complex programmable logic device 13 .

[0039] Furthermore, the complex programmable logic device 13 is communicatively connected with the board.

[0040] Furthermore, the temperature detection device 32 is disposed at the air inlet of the chassis 31 where the server is placed.

[0041] Furthermore, the temperature detection device 32 is of a metal oxide semiconductor field effect transistor type.

[0042] For ease of understanding, Figure 3 A schematic structural diagram of a connector and a temperature detection device provided in an embodiment of the present invention.

[0043] Depend on Figure 3As can be seen, the connector 21 is connected to the temperature detection device 32 through wires 34 led out from multiple sets of cable pins 33; the number of the multiple sets of cable pins 33 and the temperature detection device 32 is the same and multiple; the sensor 30 obtains the real-time temperature of the specified position through the temperature detection device 32.

[0044] The embodiment of the present invention provides a server heat dissipation decoupling device, including: a mainboard circuit, a sensor arranged on the mainboard circuit, a connector and a baseboard management controller; the sensor, the baseboard management controller and the connector are connected in sequence; the sensor has a remote function; a temperature detection line is connected to the connector; a temperature detection device is arranged on the temperature detection line; the temperature detection device is arranged at a specified position at a specified distance from the mainboard circuit; the temperature detection device is used to obtain the real-time temperature of the specified position according to the remote signal of the sensor; and the real-time temperature is transmitted to the sensor through the connector; the sensor is used to transmit the real-time temperature to the baseboard management controller; the baseboard management controller is used to perform data management on the real-time temperature. This technology realizes accurate monitoring and data feedback of the real-time temperature of the remote position by integrating a sensor and a temperature detection device with a remote function in the mainboard circuit, simplifies the system design and improves the efficiency and reliability of heat dissipation management.

[0045] Example 2

[0046] Based on the above embodiments, Figure 4 A schematic flow chart of a control method for a server heat dissipation decoupling device provided in an embodiment of the present invention.

[0047] Among them, the control method of the server heat dissipation decoupling device is applied to the server heat dissipation decoupling device of the above embodiment.

[0048] Depend on Figure 4 As can be seen, the method includes:

[0049] Step S101: acquiring the real-time temperature of the designated position through the temperature detection device; and transmitting the real-time temperature to the sensor through the connector.

[0050] Step S102: transmitting the real-time temperature to the baseboard management controller via the sensor.

[0051] Step S103: performing data management on the real-time temperature through the baseboard management controller.

[0052] Furthermore, the step of continuing data management of the real-time temperature through the baseboard management controller includes: recording the real-time temperature in a log file through the baseboard management controller.

[0053] The control method of the server heat dissipation decoupling device provided in the embodiment of the present invention has the same technical features as the server heat dissipation decoupling device provided in the above embodiment, so it can also solve the same technical problems and achieve the same technical effects. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working process of the method described above can refer to the corresponding process in the above embodiment, and will not be repeated here.

[0054] In addition, in the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0055] Finally, it should be noted that the above-mentioned embodiments are only specific implementation methods of the present invention, which are used to illustrate the technical solutions of the present invention rather than to limit it. The protection scope of the present invention is not limited thereto. Although the present invention has been described in detail with reference to the above-mentioned embodiments, ordinary technicians in this field should understand that any technician familiar with this technical field can still modify the technical solutions recorded in the above-mentioned embodiments within the technical scope disclosed by the present invention, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be covered within the protection scope of the present invention.

Claims

1. A server heat dissipation decoupling device, characterized in that: include: Mainboard circuit, sensor, connector and baseboard management controller arranged on the mainboard circuit; The sensor, the baseboard management controller and the connector are connected in sequence; the sensor has a remote function; a temperature detection line is connected to the connector; a temperature detection device is arranged on the temperature detection line; the temperature detection device is arranged at a specified position at a specified distance from the mainboard circuit; The temperature detection device is used to obtain the real-time temperature of the designated location according to the remote signal of the sensor; and, transmitting the real-time temperature to the sensor through the connector; The sensor is used to transmit the real-time temperature to the baseboard management controller; The baseboard management controller is used to perform data management on the real-time temperature.

2. The server heat dissipation decoupling device according to claim 1, characterized in that: The device further comprises: a board; and the temperature detection device is on the board.

3. The server heat dissipation decoupling device according to claim 2, characterized in that: The types of the boards are switch boards, OAM module boards, and UBB backplanes.

4. The server heat dissipation decoupling device according to claim 3, characterized in that: The baseboard management controller is connected to the board via an I2C link.

5. The server heat dissipation decoupling device according to claim 4, characterized in that: The baseboard management controller is also connected to a complex programmable logic device.

6. The server heat dissipation decoupling device according to claim 5, characterized in that: The complex programmable logic device is communicatively connected with the board.

7. The server heat dissipation decoupling device according to claim 1, characterized in that: The temperature detection device is arranged at the air inlet of the chassis where the server is placed.

8. The server heat dissipation decoupling device according to claim 1, characterized in that: The temperature detection device is a metal oxide semiconductor field effect transistor.

9. A server heat dissipation decoupling method, characterized in that: The server heat dissipation decoupling device applied to any one of claims 1 to 8; the method comprising: Acquiring the real-time temperature of the designated location through the temperature detection device; and transmitting the real-time temperature to the sensor through the connector; transmitting the real-time temperature to the baseboard management controller via the sensor; The real-time temperature is managed by the baseboard management controller.

10. The server heat dissipation decoupling method according to claim 9, characterized in that: The step of continuing data management of the real-time temperature by the baseboard management controller includes: The real-time temperature is recorded in a log file by the baseboard management controller.

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