Heat dissipation device and server

Abstract

The invention relates to a heat dissipation device and a server, a first side is provided with a cooling groove and is used for being connected with a to-be-cooled part, a second side is provided with a first communicating hole and a second communicating hole, and the first communicating hole and the second communicating hole are both communicated with the cooling groove; the mounting part is assembled with the second side, one side, facing the cover body, of the mounting part is provided with a first liquid cooling groove and a second liquid cooling groove, the first liquid cooling groove and the second side are encircled to form a first liquid cooling cavity, the second liquid cooling groove and the second side are encircled to form a second liquid cooling cavity, the first liquid cooling cavity is communicated with the first communication hole, and the second liquid cooling cavity is communicated with the second communication hole; the mounting piece is further provided with a first liquid conveying opening and a second liquid conveying opening, the first liquid conveying opening is communicated with the first liquid cooling cavity, and the second liquid conveying opening is communicated with the second liquid cooling cavity; the cooling part is assembled with the first side, a cooling cavity is defined by the cooling part and the cooling groove, and at least two of the projection of the cooling cavity towards the to-be-cooled part, the projection of the first liquid cooling cavity towards the to-be-cooled part and the projection of the second liquid cooling cavity towards the to-be-cooled part are staggered.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation, and in particular to a heat dissipation device and a server. Background Art

[0002] With the development of AI technology, the power consumption of GPU chips is getting higher and higher, resulting in higher and higher heat generation. In traditional technology, cold plates are usually used to dissipate heat from GPUs. However, traditional cold plates cannot dissipate heat in a targeted manner in the high-heat areas of the GPU, resulting in poor heat dissipation of the GPU and affecting the GPU's computing speed. Summary of the invention

[0003] Based on this, it is necessary to provide a heat dissipation device and a server to address the problem that the traditional cold plate causes poor GPU heat dissipation effect and affects the GPU computing speed.

[0004] The technical solution is as follows:

[0005] One embodiment provides a heat dissipation device, comprising:

[0006] A cover body, the cover body having a first side and a second side opposite to each other, the first side being provided with a cooling groove and used to connect with the heat dissipation element, the second side being provided with a first communicating hole and a second communicating hole, the first communicating hole and the second communicating hole both being communicated with the cooling groove;

[0007] A mounting member, the mounting member is assembled with the second side, the mounting member is provided with a first liquid cooling groove and a second liquid cooling groove on one side facing the cover body, the first liquid cooling groove and the second side are surrounded to form a first liquid cooling cavity, the second liquid cooling groove and the second side are surrounded to form a second liquid cooling cavity, the first liquid cooling cavity is communicated with the first communicating hole, the second liquid cooling cavity is communicated with the second communicating hole, the mounting member is further provided with a first infusion port and a second infusion port, the first infusion port is communicated with the first liquid cooling cavity, and the second infusion port is communicated with the second liquid cooling cavity;

[0008] A cooling member, the cooling member is assembled with the first side, the cooling member and the cooling groove are arranged to form a cooling cavity, and at least two of the projections of the cooling cavity toward the heat member to be cooled, the projections of the first liquid-cooling cavity toward the heat member to be cooled, and the projections of the second liquid-cooling cavity toward the heat member to be cooled are misaligned.

[0009] In the above-mentioned heat dissipation device, the cooling groove is arranged on the first side of the cover body, the cooling element covers the cooling groove to form a cooling cavity on the first side, and the second side of the cover body covers the first liquid cooling groove and the second liquid cooling groove, thereby forming the first liquid cooling cavity and the second liquid cooling cavity on the second side; the cooling liquid enters the first liquid cooling cavity from the first infusion port, enters the cooling cavity through the first connecting hole, then enters the second cooling cavity through the second connecting hole, and is finally discharged through the second infusion port. When the first side of the cover body is connected to the heat dissipation element to be cooled, due to at least two misalignments in the projections of the cooling cavity, the first liquid cooling cavity and the second liquid cooling cavity toward the heat dissipation element to be cooled, a more stable heat dissipation effect can be provided to the heat dissipation element to be cooled. In addition, since the cooling cavity is located on the first side of the cover body, the heat dissipation device can achieve more sufficient heat dissipation of the area corresponding to the cooling element on the heat dissipation element to be cooled. Compared with the conventional technology, the above-mentioned heat dissipation device can carry out targeted heat dissipation on the high-heating area of ​​the heat dissipation element to be cooled, improve the heat dissipation effect of the heat dissipation element to be cooled, and ensure that the heat dissipation element to be cooled can be at a normal operating temperature and operate normally.

[0010] In one embodiment, the mounting member is provided with a first flow groove, the first flow groove is connected to the first liquid cooling groove, the first flow groove and the second side are arranged to form a first flow channel, the first connecting hole is a strip-shaped through hole, the first direction of the strip-shaped through hole matches the extension direction of the first flow channel, and the strip-shaped through hole is connected to the first flow channel.

[0011] In one embodiment, the mounting member is provided with a second flow groove, the second flow groove is connected to the second liquid cooling groove, the second flow groove and the second side are arranged to form a second flow channel, the second connecting hole is a strip-shaped through hole, the second direction of the strip-shaped through hole matches the extension direction of the second flow channel, and the strip-shaped through hole is connected to the second flow channel.

[0012] In one embodiment, the heat dissipation device further includes a first heat exchange mechanism, and the first heat exchange mechanism is disposed in the first liquid cooling tank and abuts against the second side.

[0013] In one embodiment, the first heat exchange mechanism includes at least two first fin groups, and all of the first fin groups are arranged around the outer periphery of the first infusion port.

[0014] In one of the embodiments, the first heat exchange mechanism further includes two first fin groups and a blocking member, wherein one of the first fin groups is spaced apart from the other first fin group to form a heat exchange channel, and the blocking member is located at at least one end of the heat exchange channel.

[0015] In one embodiment, the heat dissipation device further includes a second heat exchange mechanism, and the second heat exchange mechanism is disposed in the second liquid cooling tank and abuts against the second side.

[0016] In one embodiment, the second heat exchange mechanism includes at least two second fin groups, and all of the second fin groups are arranged around the outer periphery of the second infusion port.

[0017] In one of the embodiments, the cooling element includes a cooling plate and heat exchange shovel teeth, the cooling plate and the cooling groove are arranged to form the cooling cavity, and the heat exchange shovel teeth are arranged on one side of the cooling plate and located in the cooling cavity.

[0018] Another embodiment provides a server, the server comprising a heat dissipation component and the heat dissipation device as described above, wherein the heat dissipation device is arranged on the heat dissipation component. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 Schematic diagram of the installation of a heat dissipation device in one embodiment of the present application.

[0021] Figure 2 It is an exploded schematic diagram of a heat dissipation device in one embodiment of the present application.

[0022] Figure 3 FIG. 1 is a schematic exploded view of a heat dissipation device in an embodiment of the present application from another angle.

[0023] Figure 4 It is a schematic diagram of the structure of a mounting member in one embodiment of the present application.

[0024] Figure 5 Schematic diagram of the structure of the second side of the cover in another embodiment of the present application.

[0025] Figure 6 Schematic diagram of the structure of the first side of the cover in another embodiment of the present application.

[0026] Figure 7 This is a top view of a mounting member in another embodiment of the present application.

[0027] Figure 8 This is a top view of a mounting component in another embodiment of the present application.

[0028] Notes on the attached drawings:

[0029] 10. heat dissipation device; 100. cover; 110. first side; 111. cooling groove; 112. cooling cavity; 120. second side; 121. first communication hole; 122. second communication hole; 200. mounting member; 210. first liquid cooling groove; 211. first liquid cooling cavity; 212. first flow divider; 220. second liquid cooling groove; 221. second liquid cooling cavity; 222. second flow divider; 231. first infusion port; 232. second infusion port; 2 40, first flow groove; 241, first flow channel; 250, second flow groove; 251, second flow channel; 300, cooling element; 310, cooling plate; 320, heat exchange shovel teeth; 400, first heat exchange mechanism; 410, first fin group; 420, blocking element; 430, heat exchange flow channel; 500, second heat exchange mechanism; 510, second fin group; 20, heat element to be cooled; 21, first area; 22, second area; 23, third area. DETAILED DESCRIPTION

[0030] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0031] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0032] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0033] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0034] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0035] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0036] See also Figures 1 to 4An embodiment of the present application provides a heat dissipation device 10, including a cover body 100, a mounting member 200 and a cooling member 300, wherein the cover body 100 has a first side 110 and a second side 120 opposite to each other, wherein the first side 110 is provided with a cooling groove 111 and is used to connect with the heat dissipation member 20 to be cooled, and the second side 120 is provided with a first connecting hole 121 and a second connecting hole 122, wherein the first connecting hole 121 and the second connecting hole 122 are both connected with the cooling groove 111; the mounting member 200 is assembled with the second side 120, and a first liquid cooling groove 210 and a second liquid cooling groove 220 are provided on a side of the mounting member 200 facing the cover body 100, wherein the first liquid cooling groove 210 and the second side 120 are surrounded to form a first liquid cooling cavity 211 and a second liquid cooling groove 220. 20 is surrounded with the second side 120 to form a second liquid cooling cavity 221, the first liquid cooling cavity 211 is communicated with the first communicating hole 121, and the second liquid cooling cavity 221 is communicated with the second communicating hole 122, the mounting member 200 is further provided with a first infusion port 231 and a second infusion port 232, the first infusion port 231 is communicated with the first liquid cooling cavity 211, and the second infusion port 232 is communicated with the second liquid cooling cavity 221; the cooling member 300 is assembled with the first side 110, the cooling member 300 and the cooling groove 111 are surrounded to form a cooling cavity 112, and at least two of the projection of the cooling cavity 112 toward the heat dissipating member 20, the projection of the first liquid cooling cavity 211 toward the heat dissipating member 20, and the projection of the second liquid cooling cavity 221 toward the heat dissipating member 20 are misaligned.

[0037] In the above-mentioned heat dissipation device 10, the cooling groove 111 is provided on the first side 110 of the cover body 100, the cooling member 300 covers the cooling groove 111 to form a cooling cavity 112 on the first side 110, and the second side 120 of the cover body 100 covers the first liquid cooling groove 210 and the second liquid cooling groove 220, thereby forming the first liquid cooling cavity 211 and the second liquid cooling cavity 221 on the second side 120; the coolant enters the first liquid cooling cavity 211 from the first infusion port 231, and enters the cooling cavity 112 through the first connecting hole 121, then enters the second cooling cavity 112 through the second connecting hole 122, and finally is discharged through the second infusion port 232. When the first side 110 of the cover body 100 is connected to the heat dissipation member 200, the cooling liquid enters the first liquid cooling cavity 211 through the first connecting hole 121, and then enters the second cooling cavity 112 through the second connecting hole 122, and finally is discharged through the second infusion port 232. 0, due to at least two misalignments in the projections of the cooling chamber 112, the first liquid cooling chamber 211 and the second liquid cooling chamber 221 toward the heat dissipation element 20, a more stable heat dissipation effect can be provided to the heat dissipation element 20. In addition, since the cooling chamber 112 is located on the first side 110 of the cover body 100, the heat dissipation device 10 can achieve more sufficient heat dissipation of the area on the heat dissipation element 20 corresponding to the cooling element 300. Compared with the conventional technology, the heat dissipation device 10 can perform targeted heat dissipation on the high-heating area of ​​the heat dissipation element 20, improve the heat dissipation effect of the heat dissipation element 20, and ensure that the heat dissipation element 20 can be at a normal operating temperature and operate normally.

[0038] For explanation, since the cooling cavity 112 is located on the first side 110 of the cover body 100, and the first liquid cooling cavity 211 and the second liquid cooling cavity 221 are located on the second side 120 of the cover body 100, when the heat dissipation element 20 is assembled with the first side 110 of the cover body 100, the cooling cavity 112 is closer to the heat dissipation element 20 than the first liquid cooling cavity 211 and the second liquid cooling cavity 221, thereby achieving more sufficient heat dissipation for the area on the heat dissipation element 20 corresponding to the cooling element 300.

[0039] As a further explanation, at least two of the projections of the cooling chamber 112 toward the heat dissipation element 20, the projection of the first liquid cooling chamber 211 toward the heat dissipation element 20, and the projection of the second liquid cooling chamber 221 toward the heat dissipation element 20 are misaligned. Any two of the three projections may partially overlap, or all three projections may be misaligned with each other. The selection may be flexibly made according to the requirements of the heat dissipation element 20, and no specific limitation is made here.

[0040] Furthermore, the projection of the cooling cavity 112 toward the heat element 20 to be cooled, the projection of the first liquid cooling cavity 211 toward the heat element 20 to be cooled, and the projection of the second liquid cooling cavity 221 toward the heat element 20 to be cooled are staggered, thereby providing a more reliable heat dissipation effect for the heat element 20 to be cooled.

[0041] See also Figures 2 to 3 In one embodiment, the heat dissipation element 20 is provided with a first area 21, a second area 22 and a third area 23. The first area 21 is a projection area of ​​the first liquid cooling chamber 211 onto the heat dissipation element 20, the second area 22 is a projection area of ​​the second liquid cooling chamber 221 onto the heat dissipation element 20, and the third area 23 is a projection area of ​​the cooling chamber 112 onto the heat dissipation element 20. The first area 21, the second area 22 and the third area 23 are misaligned. Usually, the third area 23 is a core heating area of ​​the heat dissipation element 20. For example, when the heat dissipation element 20 is a GPU, the third area 23 is an area where the GPU chip is located. For another example, when the heat dissipation element 20 is a computer motherboard, the third area 23 is a CPU. The area where the chip is located; in the above embodiment, the cooling cavity 112 located on the first side 110 of the cover body 100 is closer to the heat dissipation element 20 than the first liquid cooling cavity 211 and the second liquid cooling cavity 221 located on the second side 120 of the cover body 100. Therefore, when the coolant flows through the cooling cavity 112, the core heating area of ​​the heat dissipation element 20, that is, the third area 23, can be fully cooled, and the heat generation of the first area 21 and the second area 22 of the heat dissipation element 20 is smaller than that of the third area 23. Therefore, the first liquid cooling cavity 211 and the second liquid cooling cavity 221 located on the second side 120 of the cover body 100 are used to dissipate heat for the first area 21 and the second area 22 respectively, and the heat dissipation design is reasonable and the heat dissipation effect is better.

[0042] As a supplementary explanation, since the cooling capacity carried by the same flow rate of cooling liquid is limited, in order to ensure that most of the cooling capacity carried by the cooling liquid can be exchanged with the third area 23 of the heat dissipation element 20, when the cooling liquid enters the first liquid cooling cavity 211 through the first infusion port 231, since the first liquid cooling cavity 211 is located on the second side 120 of the cover body 100 and the heat generation of the first area 21 is relatively small, when the cooling liquid flows through the first liquid cooling cavity 211, the heat exchange with the first area 21 is relatively small, so that the cooling liquid still carries a relatively high cooling capacity when it enters the cooling cavity 112 through the first liquid cooling cavity 211, ensuring that most of the cooling capacity in the cooling liquid can be exchanged with the third area 23. The cooling liquid finally enters the second liquid cooling cavity 221. At this time, the cooling capacity carried by the cooling liquid is greatly reduced, but since the heat generation of the second area 22 is relatively small, even if the cooling capacity carried by the cooling liquid in the second liquid cooling cavity 221 is relatively small, the second area 22 can be fully cooled.

[0043] In one embodiment, the cooling member 300 is plate-shaped and can cover the cooling groove 111, thereby forming a cooling cavity 112 together with the cooling groove 111. The side of the cooling member 300 away from the cooling groove 111 can contact the heat dissipation member 20 to be cooled. The coolant in the cooling cavity 112 can exchange heat with the heat dissipation member 20 to be cooled through the cooling member 300, thereby cooling the third area 23 of the heat dissipation member 20 to be cooled.

[0044] In addition, the cover body 100, the mounting member 200 and the cooling member 300 are separately arranged so that the cover body 100, the mounting member 200 and the cooling member 300 can be separately modularly produced during production and then assembled after production, thereby improving production efficiency and reducing production costs.

[0045] See also Figure 3 In one embodiment, the first infusion port 231 and the second infusion port 232 are opened on a side of the mounting member 200 away from the cover body 100 .

[0046] Furthermore, there is no limit on the number of the first infusion port 231 and the second infusion port 232 , which can be flexibly arranged according to actual working conditions and are not specifically limited here.

[0047] Optionally, in some embodiments, the first infusion port 231 may be either a liquid inlet or a liquid outlet, and correspondingly, the second infusion port 232 may be either a liquid outlet or a liquid inlet, which will not be described in detail here.

[0048] See also Figures 1 to 3 In one embodiment, the shape of the mounting member 200 is a plate that matches the cover body 100, which will not be described in detail here.

[0049] See also Figures 2 to 4In one embodiment, the mounting member 200 is provided with a first flow groove 240, the first flow groove 240 is connected to the first liquid cooling groove 210, the first flow groove 240 and the second side 120 are surrounded to form a first flow channel 241, the first connecting hole 121 is a strip-shaped through hole, the first direction of the strip-shaped through hole matches the extension direction of the first flow channel 241, and the strip-shaped through hole is connected to the first flow channel 241.

[0050] The second side 120 of the cover body 100 covers the first flow groove 240, thereby forming a first flow channel 241 on the second side 120. In this way, after the coolant enters the first flow channel 241, it can enter the cooling cavity 112 through the first connecting hole 121; the first direction of the first connecting hole 121 matches the extension direction of the first flow channel 241, thereby forming a strip-shaped through hole. Such a setting can not only increase the speed of the coolant when it enters the cooling cavity 112 from the first flow channel 241 through the strip-shaped through hole, but also improve the flow uniformity of the coolant when it enters the cooling cavity 112 from the strip-shaped through hole, thereby improving the heat dissipation effect of the coolant in the cooling cavity 112 on the heat sink 20.

[0051] As an explanation, the first direction in the above embodiment is the length direction of the strip-shaped through hole (that is, Figure 3 direction in the A direction).

[0052] Furthermore, the coolant enters the first flow channel 241 and flows in the first flow channel 241 to dissipate heat in the area on the heat sink 20 corresponding to the first flow channel 241. Therefore, when producing the heat dissipation device 10, the designer will design the extension direction of the first flow groove 240 according to the heating area of ​​the heat sink 20 to be cooled, thereby ensuring the heat dissipation effect of the coolant flowing in the first flow channel 241 on the heat sink 20.

[0053] See also Figures 2 to 4 In one embodiment, the mounting member 200 is provided with a second flow groove 250, the second flow groove 250 is connected to the second liquid cooling groove 220, the second flow groove 250 and the second side 120 are surrounded to form a second flow channel 251, the second connecting hole 122 is a strip-shaped through hole, the second direction of the strip-shaped through hole matches the extension direction of the second flow channel 251, and the strip-shaped through hole is connected to the second flow channel 251.

[0054] The second side 120 of the cover body 100 covers the second flow groove 250, thereby forming a second flow channel 251 on the second side 120, so that the coolant in the cooling chamber 112 can enter the second flow channel 251 through the second connecting hole 122, and enter the second liquid cooling chamber 221 from the second flow channel 251; the second direction of the second connecting hole 122 matches the extending direction of the second flow channel 251, thereby forming a strip-shaped through hole. Such a configuration can not only increase the speed of the coolant when it enters the second liquid cooling chamber 221 from the second flow channel 251 through the strip-shaped through hole, but also improve the flow uniformity of the coolant when it enters the second liquid cooling chamber 221 from the strip-shaped through hole, thereby improving the heat dissipation effect of the flowing coolant in the second liquid cooling chamber 221 on the heat sink 20.

[0055] As an explanation, the second direction in the above embodiment is the length direction of the strip-shaped through hole (ie Figure 3 B direction in the figure).

[0056] Furthermore, the coolant enters the second flow channel 251 and flows in the second flow channel 251 to dissipate heat in the area on the heat sink 20 corresponding to the second flow channel 251. Therefore, when producing the heat dissipation device 10, the designer will design the extension direction of the second flow groove 250 according to the heating area of ​​the heat sink 20 to be cooled, thereby ensuring the heat dissipation effect of the coolant flowing in the second flow channel 251 on the heat sink 20.

[0057] See also Figures 2 to 4 In one embodiment, at least two first flow grooves 240 are provided, and at least two first connecting holes 121 are provided and are arranged one-to-one corresponding to the first flow grooves 240 .

[0058] See also Figures 2 to 4 In one embodiment, at least two second flow grooves 250 are provided, and at least two second connecting holes 122 are provided and are arranged one-to-one corresponding to the second flow grooves 250.

[0059] For further information, see Figures 2 to 4, in one embodiment, there is one first flow channel 240, two second flow channels 250 are provided, the first flow channel 240 is located between the two second flow channels 250. Correspondingly, there is one first communication hole 121 which is correspondingly arranged with the first flow channel 240, and two second communication holes 122 are provided and are correspondingly arranged with the two second flow channels 250 one by one. The two second communication holes 122 are respectively located on both sides of the first communication hole 121. In this way, the coolant enters the liquid cooling cavity through the first communication hole 121 and flows out of the liquid cooling cavity through the second communication holes 122 on both sides of the first communication hole 121. On the premise that the total flow rate of the coolant remains unchanged, the flow area of the coolant flowing into the liquid cooling cavity through one first communication hole 121 is smaller. Therefore, the flow velocity of the coolant when flowing into the liquid cooling cavity is greater, the Reynolds number increases, so that the Nusselt number increases, and the convective heat transfer coefficient will also increase accordingly. Furthermore, the heat dissipation effect of the heat dissipation device 10 on the position of the heat generating component 20 corresponding to the liquid cooling cavity is better.

[0060] Furthermore, the two second flow channels 250 are respectively arranged on both sides of the first flow channel 240 to dissipate heat from the corner areas of the heat generating component 20 and ensure the heat dissipation effect on the heat generating component 20.

[0061] Please refer to Figures 7 and 8 , in one embodiment, a first flow dividing part 212 is arranged in the first liquid cooling tank 210. The arrangement of the first flow dividing part 212 can divide the space in the first liquid cooling tank 210 into multiple branches, making the flow process of the coolant in the first liquid cooling cavity 211 more complex. The coolant in each branch collides with each other, making the flow more intense, thereby increasing the local Reynolds number and further enhancing the heat transfer effect.

[0062] Please refer to Figures 7 and 8 , in one embodiment, a second flow dividing part 222 is arranged in the second liquid cooling tank 220. The effect of the second flow dividing part 222 is similar to that of the first flow dividing part 212, and will not be elaborated here.

[0063] Further, in the Figure 8 shown embodiment, the first flow dividing part 212 can divide the space in the first liquid cooling tank 210 into branches in a "field" shape. The coolant collides with each other in the branches, further enhancing the heat transfer effect; the second flow dividing part 222 can divide the space in the second liquid cooling tank 220 into branches in a "field" shape. Similar to the first flow dividing part 212, it will not be elaborated here.

[0064] Please refer to Figures 5 and 6In one embodiment, a plurality of first connecting holes 121 are provided, and a plurality of second connecting holes 122 are provided, and all the first connecting holes 121 and all the second connecting holes 122 are combined to form a hole array structure. In this way, when the extension direction of the first liquid cooling tank 210 and the second liquid cooling tank 220 changes, the hole array structure formed by the combination of the first connecting holes 121 and the second connecting holes 122 does not need to be changed, thereby realizing unified and standardized production of the cover body 100 and reducing production costs.

[0065] See also Figure 2 and Figure 4 In one embodiment, the heat dissipation device 10 further includes a first heat exchange mechanism 400 , which is disposed in the first liquid cooling tank 210 and abuts against the second side 120 .

[0066] The first heat exchange mechanism 400 can exchange heat with the cooling liquid in the first liquid cooling chamber 211. The first heat exchange mechanism 400 abuts against the second side 120, thereby achieving heat exchange with the second side 120 of the cover body 100, and further achieving heat exchange between the cooling liquid and the second side 120 of the cover body 100, thereby improving the heat exchange effect between the cooling liquid and the first area 21 of the heat dissipation element 20 to be cooled.

[0067] Optionally, the first heat exchange mechanism 400 may be a structure such as heat exchange fins, heat exchange teeth, etc. that can increase the heat exchange area with the coolant, which is not specifically limited here.

[0068] Furthermore, the first heat exchange mechanism 400 can have a certain blocking and diverting effect on the coolant, thereby further enhancing the heat exchange effect of the coolant.

[0069] See also Figure 4 In one embodiment, the first heat exchange mechanism 400 includes at least two first fin groups 410 , and all the first fin groups 410 are arranged around the outer periphery of the first infusion port 231 .

[0070] With such a configuration, when the coolant enters the first liquid cooling tank 210 through the first infusion port 231 , it can pass through the first fin group 410 , so that the coolant and the first fin group 410 can achieve sufficient heat exchange, ensuring the coolant located in the first liquid cooling cavity 211 has a heat dissipation effect on the first area 21 of the heat sink 20 .

[0071] Optionally, adjacent first fin groups 410 may be spaced apart along the width direction of the mounting member 200 , or may be spaced apart along the length direction of the mounting member 200 , which is not specifically limited herein.

[0072] Further, the first fin group 410 includes at least two first fins. In some embodiments, two adjacent first fin groups 410 are spaced apart along the width direction of the mounting member 200, and all the first fins are spaced apart along the length direction of the mounting member 200; in other embodiments, two adjacent first fin groups 410 are spaced apart along the length direction of the mounting member 200, and all the first fins are spaced apart along the width direction of the mounting member 200.

[0073] See also Figure 4 In one embodiment, the first heat exchange mechanism 400 further includes two first fin groups 410 and a blocking member 420 , wherein one first fin group 410 is spaced apart from the other first fin group 410 to form a heat exchange channel 430 , and the blocking member 420 is located at at least one end of the heat exchange channel 430 .

[0074] The coolant enters the heat exchange channel 430 through the first connecting hole 121. The blocking member 420 disposed at at least one end of the heat exchange channel 430 can block the coolant and prevent the coolant from directly flowing out of the heat exchange channel 430, thereby ensuring that the coolant can fully exchange heat with the first fin group 410, thereby further enhancing the heat exchange effect between the coolant in the first liquid cooling tank 210 and the heat element 20 to be cooled.

[0075] For further information, see Figure 4 In one embodiment, one end of the heat exchange channel 430 is arranged toward the first flow groove 240, and the blocking member 420 is located between the one end of the heat exchange channel 430 and the first flow groove 240, thereby preventing the coolant entering the heat exchange channel 430 from the first connecting hole 121 from directly entering the first flow channel 241, ensuring that the coolant can fully achieve heat exchange with the first fin group 410.

[0076] In other embodiments, two blocking members 420 are provided, and the two blocking members 420 are respectively provided at opposite ends of the heat exchange channel 430 , thereby preventing the coolant entering the heat exchange channel 430 from the first connecting hole 121 from failing to fully exchange heat with the first fin group 410 .

[0077] See also Figure 2 and Figure 4 In one embodiment, the heat dissipation device 10 further includes a second heat exchange mechanism 500 , which is disposed in the second liquid cooling tank 220 and abuts against the second side 120 .

[0078] The second heat exchange mechanism 500 can exchange heat with the coolant in the second liquid cooling chamber 221. The second heat exchange mechanism 500 abuts against the second side 120, thereby achieving heat exchange with the second side 120 of the cover body 100, and further achieving heat exchange between the coolant and the second side 120 of the cover body 100, thereby improving the heat exchange effect between the coolant and the second area 22 of the heat dissipation element 20 to be cooled.

[0079] Optionally, the second heat exchange mechanism 500 may be a structure such as heat exchange fins, heat exchange teeth, etc. that can increase the heat exchange area with the coolant, which is not specifically limited here.

[0080] Furthermore, the second heat exchange mechanism 500 can have a certain blocking and diverting effect on the coolant, thereby further enhancing the heat exchange effect of the coolant.

[0081] See also Figure 4 In one embodiment, the second heat exchange mechanism 500 includes at least two second fin groups 510 , and all the second fin groups 510 are arranged around the outer periphery of the second infusion port 232 .

[0082] With such a configuration, when the coolant needs to be discharged from the second liquid cooling chamber 221 through the second infusion port 232 , it needs to pass through the second fin group 510 , thereby achieving sufficient heat exchange with the second fin group 510 , thereby ensuring the coolant in the second liquid cooling chamber 221 has a heat dissipation effect on the second area 22 of the heat sink 20 .

[0083] Optionally, two adjacent second fin groups 510 may be spaced apart along the width direction of the mounting member 200 , or may be spaced apart along the length direction of the mounting member 200 , which is not specifically limited herein.

[0084] Further, in Figure 4 In the illustrated embodiment, two second fin groups 510 are provided and are spaced apart along the width direction of the mounting member 200, and two second flow grooves 250 are provided, wherein one second flow groove 250 is provided on a side of one second fin group 510 away from the second infusion port 232, and the other second flow groove 250 is provided on a side of the other second fin group 510 away from the second infusion port 232. In this way, when the coolant in the cooling cavity 112 flows to the second liquid cooling cavity 221 through the two second flow channels 251, it will pass through the two second fin groups 510 and then flow out from the second infusion port 232, thereby ensuring sufficient heat exchange between the coolant and the second fin groups 510.

[0085] Furthermore, the second fin group 510 includes at least two second fins. In some embodiments, two adjacent second fin groups 510 are spaced apart along the width direction of the mounting member 200, and all the second fins are spaced apart along the length direction of the mounting member 200; in other embodiments, the second fin groups 510 are spaced apart along the length direction of the mounting member 200, and all the second fins are spaced apart along the width direction of the mounting member 200.

[0086] See also Figure 3 In one embodiment, the cooling member 300 includes a cooling plate 310 and a heat exchange shovel tooth 320 . The cooling plate 310 and the cooling groove 111 are arranged to form a cooling cavity 112 . The heat exchange shovel tooth 320 is arranged on one side of the cooling plate 310 and is located in the cooling cavity 112 .

[0087] The provision of the heat exchange scraper teeth 320 can increase the heat exchange area between the coolant and the cooling plate 310 , improve the heat exchange efficiency between the coolant and the heat dissipation element 20 , and ensure the heat dissipation effect of the heat dissipation device 10 on the heat dissipation element 20 .

[0088] Another embodiment of the present application provides a server, which includes a heat dissipation component 20 and a heat dissipation device 10 according to any of the above embodiments, wherein the heat dissipation device 10 is disposed on the heat dissipation component 20.

[0089] In the above-mentioned server, the cooling groove 111 is provided on the first side 110 of the cover body 100, the cooling member 300 covers the cooling groove 111 to form a cooling cavity 112 on the first side 110, and the second side 120 of the cover body 100 covers the first liquid cooling groove 210 and the second liquid cooling groove 220, thereby forming the first liquid cooling cavity 211 and the second liquid cooling cavity 221 on the second side 120; the coolant enters the first liquid cooling cavity 211 from the first infusion port 231, and enters the cooling cavity 112 through the first connecting hole 121, then enters the second cooling cavity 112 through the second connecting hole 122, and finally is discharged through the second infusion port 232. When the first side 110 of the cover body 100 is in contact with the heat dissipation member 20 When connected, due to at least two misalignments in the projections of the cooling chamber 112, the first liquid cooling chamber 211 and the second liquid cooling chamber 221 toward the heat dissipation element 20, a more stable heat dissipation effect can be provided to the heat dissipation element 20. In addition, since the cooling chamber 112 is located on the first side 110 of the cover body 100, the heat dissipation device 10 can achieve more sufficient heat dissipation of the area on the heat dissipation element 20 corresponding to the cooling element 300. Compared with the traditional technology, the above-mentioned heat dissipation device 10 can perform targeted heat dissipation on the high-heating area of ​​the heat dissipation element 20, improve the heat dissipation effect of the heat dissipation element 20, and ensure that the heat dissipation element 20 can be at a normal operating temperature and operate normally.

[0090] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0091] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A heat dissipation device, characterized in that: include: A cover body, the cover body having a first side and a second side opposite to each other, the first side being provided with a cooling groove and used to connect with the heat dissipation element, the second side being provided with a first communicating hole and a second communicating hole, the first communicating hole and the second communicating hole both being communicated with the cooling groove; A mounting member, the mounting member is assembled with the second side, the mounting member is provided with a first liquid cooling groove and a second liquid cooling groove on one side facing the cover body, the first liquid cooling groove and the second side are surrounded to form a first liquid cooling cavity, the second liquid cooling groove and the second side are surrounded to form a second liquid cooling cavity, the first liquid cooling cavity is communicated with the first communicating hole, the second liquid cooling cavity is communicated with the second communicating hole, the mounting member is further provided with a first infusion port and a second infusion port, the first infusion port is communicated with the first liquid cooling cavity, and the second infusion port is communicated with the second liquid cooling cavity; A cooling member, the cooling member is assembled with the first side, the cooling member and the cooling groove are arranged to form a cooling cavity, and at least two of the projections of the cooling cavity toward the heat member to be cooled, the projections of the first liquid-cooling cavity toward the heat member to be cooled, and the projections of the second liquid-cooling cavity toward the heat member to be cooled are misaligned.

2. The heat dissipation device according to claim 1, characterized in that: The mounting member is provided with a first flow groove, the first flow groove is connected to the first liquid cooling groove, the first flow groove and the second side are surrounded to form a first flow channel, the first connecting hole is a strip-shaped through hole, the first direction of the strip-shaped through hole matches the extension direction of the first flow channel, and the strip-shaped through hole is connected to the first flow channel.

3. The heat dissipation device according to claim 1, characterized in that: The mounting member is provided with a second flow groove, the second flow groove is connected with the second liquid cooling groove, the second flow groove and the second side are arranged to form a second flow channel, the second connecting hole is a strip-shaped through hole, the second direction of the strip-shaped through hole matches the extension direction of the second flow channel, and the strip-shaped through hole is connected with the second flow channel.

4. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device further includes a first heat exchange mechanism, which is disposed in the first liquid cooling tank and abuts against the second side.

5. The heat dissipation device according to claim 4, characterized in that: The first heat exchange mechanism includes at least two first fin groups, and all of the first fin groups are arranged around the outer periphery of the first infusion port.

6. The heat dissipation device according to claim 4, characterized in that: The first heat exchange mechanism further includes two first fin groups and a blocking member, wherein one of the first fin groups is spaced apart from the other first fin group to form a heat exchange channel, and the blocking member is located at at least one end of the heat exchange channel.

7. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device further includes a second heat exchange mechanism, which is disposed in the second liquid cooling tank and abuts against the second side.

8. The heat dissipation device according to claim 7, characterized in that: The second heat exchange mechanism includes at least two second fin groups, and all of the second fin groups are arranged around the outer periphery of the second infusion port.

9. The heat dissipation device according to claim 1, characterized in that: The cooling element comprises a cooling plate and heat exchange shovel teeth. The cooling plate and the cooling groove are arranged to form the cooling cavity. The heat exchange shovel teeth are arranged on one side of the cooling plate and are located in the cooling cavity.

10. A server, characterized in that: The server comprises a heat dissipation component and a heat dissipation device according to any one of claims 1 to 9, wherein the heat dissipation device is arranged on the heat dissipation component.

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