A financial device, an ultra-thin magnetic head, and a manufacturing method of the ultra-thin magnetic head

Abstract

The present invention discloses a financial device, an ultra-thin magnetic head, and a manufacturing method of the ultra-thin magnetic head. The ultra-thin magnetic head includes a housing, a PCB connected to the bottom of the housing, and at least one set of single-track components assembled between the housing and the PCB. The single-track component includes two sets of magnetic sheets, two sets of hollow coils, and a positioning bracket. By using a hollow coil with a first pin and a second pin wound around the tail of the magnetic sheet, it can replace the coiled wire structure in the existing magnetic head that uses a skeleton as a carrier and pins as electrical lead-out ends. The reduced structure can directly use the positioning bracket to achieve preliminary positioning and support between the two sets of magnetic sheets. Therefore, the present magnetic head can eliminate the skeleton, pins, and shrapnel structures in the existing magnetic head, reducing the height space of the magnetic head occupied by these components. It can achieve the reduction of the overall height of the magnetic head while not overly reducing the height of the internal components of the magnetic head, and at the same time, taking into account the effects of reducing the magnetic head height and ensuring the magnetic head performance.

Description

Technical Field

[0001] The present invention relates to the technical field of financial equipment, and particularly relates to a financial equipment, an ultra-thin magnetic head, and a manufacturing method of the ultra-thin magnetic head. Background Art

[0002] An existing magnetic head structure is as Figure 1 shown. The magnetic head includes components such as a left magnetic sheet group, a right magnetic sheet group, a shrapnel, a winding component, a spacer, and a housing. Specifically, the winding component includes a skeleton, pins, and a winding. The pins are inserted on both sides of the skeleton, the winding is wound around the skeleton, and the start and end of the winding are respectively wound and welded to the pins on both sides of the skeleton. To ensure easy assembly and tight fit between the components inside the magnetic head, the tails of the left magnetic sheet group and the right magnetic sheet group are respectively inserted into the hollow structures at the left and right ends of the skeleton of the winding component, and the spacer abuts between the heads of the left magnetic sheet group and the right magnetic sheet group. Moreover, the left magnetic sheet group, the right magnetic sheet group, and the winding component are all assembled and fixed on the shrapnel and fixed together with the shrapnel inside the housing. The height of the components such as the left magnetic sheet group, the right magnetic sheet group, the shrapnel, and the winding component after assembly determines the height of the magnetic head.

[0003] The current market demand for ultra-thin magnetic heads is increasing day by day because ultra-thin magnetic heads can save the assembly height in financial equipment such as POS machines and make the structure of financial equipment more concise. Therefore, magnetic head manufacturers are also working hard to develop ultra-thin magnetic heads to meet market demand. The currently more common design solution is to thin the components inside the magnetic head. Although this solution can reduce the height of the magnetic head, it is also likely to reduce the reliability of the structures of the components inside the magnetic head, resulting in a reduction in the output performance of the magnetic head. Moreover, the components inside the magnetic head cannot be thinned indefinitely. Therefore, it is difficult for the existing magnetic heads to simultaneously consider reducing the height of the magnetic head and ensuring the performance of the magnetic head by thinning the height of the components. Summary of the Invention

[0004] In order to overcome the deficiencies of the prior art, the purpose of the present invention is to provide an ultra-thin magnetic head that can simultaneously consider reducing the height of the magnetic head and ensuring the performance of the magnetic head.

[0005] To solve the above problems, the technical solution adopted by the present invention is as follows: An ultra-thin magnetic head includes a housing, a PCB connected to the bottom of the housing, and at least one set of single-track components assembled between the housing and the PCB. The single-track component includes two sets of magnetic sheets, two sets of hollow coils respectively wound around the tails of the two sets of magnetic sheets, and a positioning frame fixedly connected between the two sets of magnetic sheets. The heads of the two sets of magnetic sheets are fixedly connected to each other, and the tails are also fixedly connected to each other. The hollow coil has a first pin and a second pin. The first pins of the two sets of hollow coils are connected to each other and fixedly connected to the positioning frame together, and the second pins of the two sets of hollow coils are electrically connected to the PCB. The positioning frame includes a main body, a first positioning portion located at the lower part of the main body, and a second positioning portion located on both sides of the top of the main body. The first positioning portion is used for positioning and connecting the tails of the two sets of magnetic sheets. The head of the magnetic sheet has a lower side surface, and the second positioning portion is used for positioning and connecting the lower side surfaces of the two sets of magnetic sheets.

[0006] Compared with the prior art, the beneficial effects of the present invention are as follows: In this magnetic head, the hollow coils are directly wound around the tails of the magnetic sheets, and a positioning frame is used to achieve preliminary positioning and support between the two sets of magnetic sheets, avoiding misalignment or separation of the magnetic sheets, and ensuring that the components inside the magnetic head can be easily assembled and closely fitted. The first pins of the two sets of hollow coils are connected to each other and fixedly connected to the positioning frame together to serve as the relay line of the coil, and the second pins are electrically connected to the PCB to achieve line conduction between each track coil and the PCB. The hollow coils with the first pin and the second pin are wound around the tails of the magnetic sheets in this magnetic head, which can replace the coiled wire structure with a skeleton as the carrier and pins as the electrical lead-out ends in the existing magnetic head. The reduced structure can directly use the positioning frame to achieve preliminary positioning and support between the two sets of magnetic sheets, use the first positioning portion to position and connect the tails of the two sets of magnetic sheets, and the second positioning portion to position and connect the lower side surfaces of the magnetic sheets, thereby ensuring the compactness of the internal structure of the magnetic head and facilitating the subsequent manufacturing and shaping of the magnetic head. Therefore, this magnetic head can cancel the skeleton, pins, and elastic sheet structures in the existing magnetic head, reduce the height space of the magnetic head occupied by these components, and can realize the reduction of the height of the entire magnetic head without significantly reducing the height of the internal components of the magnetic head. And since the skeleton and pins are cancelled, the hollow coils can almost completely cover and wind around the tails of the entire magnetic sheet, and the reduced height of the coil can be compensated by increasing the coil length, so that the cross-sectional size of the coil in this magnetic head is the same as that in the existing magnetic head, and the effects of reducing the height of the magnetic head and ensuring the performance of the magnetic head can be achieved simultaneously. The height of this magnetic head can be significantly reduced, which can save the magnetic head installation height of financial equipment and has excellent performance.

[0007] The above-mentioned ultra-thin magnetic head, the head of the magnetic sheet further has a stepped surface and an upper side surface, the stepped surface is located between the lower side surface and the upper side surface of the magnetic sheet, the positioning frame further includes a third positioning portion located at the top of the main body, and the third positioning portion is used for positioning and connecting the stepped surfaces of two groups of magnetic sheets, and a spacer is abutted between the upper side surfaces of the two groups of magnetic sheets.

[0008] The above-mentioned ultra-thin magnetic head, both the first positioning portion and the second positioning portion are positioning grooves, and the third positioning portion is a positioning plane.

[0009] The above-mentioned ultra-thin magnetic head, the positioning frame is a "Y"-shaped bracket or an "A"-shaped bracket.

[0010] The above-mentioned ultra-thin magnetic head, the PCB is provided with positioning holes, the bottom of the magnetic sheet is provided with positioning bosses and limiting steps, the positioning bosses are positioned and inserted into the positioning holes, and the limiting steps are used for limiting and separating the PCB and the hollow coil.

[0011] The above-mentioned ultra-thin magnetic head, the housing is provided with an installation cavity for assembling a single-rail component and a window penetrating the installation cavity, the installation cavity has a first positioning surface, the magnetic sheet has a second positioning surface, the second positioning surface of the magnetic sheet is positioned and attached to the first positioning surface of the housing, and the head of the magnetic sheet is exposed in the window of the housing.

[0012] The above-mentioned ultra-thin magnetic head, one group, two groups or three groups of single-rail components are provided.

[0013] The present invention also provides a financial device, including the above-mentioned ultra-thin magnetic head, which at least has all the beneficial effects that the above-mentioned ultra-thin magnetic head can bring.

[0014] The present invention also provides a manufacturing method of an ultra-thin magnetic head for manufacturing the above-mentioned ultra-thin magnetic head, including the following steps:

[0015] Step S100: Provide magnetic sheets, hollow coils, a positioning frame and a spacer, wind the left and right groups of hollow coils around the tails of the left and right groups of magnetic sheets respectively, install the positioning frame between the left and right groups of magnetic sheets, and make the heads of the left and right groups of magnetic sheets clamp the spacer and the tails abut against each other to obtain a pre-assembled single-rail component;

[0016] Step S200: Place the pre-assembled single-rail component in a jig for positioning, press it tightly on the left and right sides, weld and fix the heads and tails of the left and right groups of magnetic sheets, and weld the first pins of the left and right groups of hollow coils to each other and then fix them on the positioning frame to obtain a single-rail component fixed as a whole;

[0017] Step S300: Provide a PCB and at least one set of single-rail components fixed as a whole, assemble the single-rail components on the PCB, and solder the second pins of the left and right sets of hollow coils to the lead-out pad on the PCB;

[0018] Step S400: Provide a housing and install the PCB with the assembled single-rail components into the housing;

[0019] Step S500: Apply a film to protect the soldering surface of the PCB and perform shallow potting on the interior of the housing through the potting hole of the PCB;

[0020] Step S600: Conduct arc surface grinding;

[0021] Step S700: Provide an FPC, install the FPC into the housing, and perform thermocompression soldering between the FPC and the PCB;

[0022] Step S800: Conduct secondary potting on the interior of the housing to obtain the required magnetic head.

[0023] This manufacturing method is used to manufacture the above-mentioned ultra-thin magnetic head, which at least has all the beneficial effects that the above-mentioned ultra-thin magnetic head can bring. Moreover, since the internal structure of the ultra-thin magnetic head is reduced in configuration, the manufacturing method is simplified, and the manufacturing efficiency of the magnetic head is improved. In addition, since a positioning frame is provided between the two sets of magnetic sheets in the ultra-thin magnetic head, during manufacturing, the positioning frame can not only perform preliminary positioning on the two sets of magnetic sheets to facilitate the pre-assembly of the single-rail components, but also separate the two hollow coils to prevent the displacement of the hollow coils from blocking subsequent laser soldering. At the same time, it can also provide a fixed support for soldering the relay wire to the second pins of the two hollow coils. During subsequent arc surface grinding, the positioning frame can also support the magnetic sheets to resist the grinding pressure, further ensuring the reliability of the internal structure of the magnetic head.

[0024] The following further elaborates on the present invention in detail with reference to the accompanying drawings and specific embodiments. Description of the Drawings

[0025] Figure 1 is an exploded view of an existing magnetic head structure;

[0026] Figure 2 is an exploded view of the ultra-thin magnetic head according to the embodiment of the present invention;

[0027] Figure 3 is a top view of the ultra-thin magnetic head according to the embodiment of the present invention;

[0028] Figure 4 is Figure 3 a cross-sectional view taken along the A-A direction in

[0029] Figure 5 is Figure 3 a cross-sectional view taken along the B-B direction in

[0030] Figure 6 In the manufacturing method of the ultra-thin magnetic head according to an embodiment of the present invention, a schematic diagram of a magnetic sheet, a coil, a positioning bracket, and a spacer is provided;

[0031] Figure 7 In the manufacturing method of the ultra-thin magnetic head according to an embodiment of the present invention, a schematic diagram of placing the pre-assembled single-track assembly into a jig;

[0032] Figure 8 In the manufacturing method of the ultra-thin magnetic head according to an embodiment of the present invention, a schematic diagram when pressing both sides of the single-track assembly and welding and fixing the tails of the left and right magnetic sheets;

[0033] Figure 9 In the manufacturing method of the ultra-thin magnetic head according to an embodiment of the present invention, a schematic diagram when welding and fixing the heads of the left and right magnetic sheets;

[0034] Figure 10 In the manufacturing method of the ultra-thin magnetic head according to an embodiment of the present invention, a schematic diagram of obtaining a single-track assembly fixed as a whole;

[0035] Figure 11 In the manufacturing method of the ultra-thin magnetic head according to an embodiment of the present invention, a schematic diagram of providing a PCB and multiple groups of single-track assemblies;

[0036] Figure 12 In the manufacturing method of the ultra-thin magnetic head according to an embodiment of the present invention, a schematic diagram when assembling multiple groups of single-track assemblies on a PCB;

[0037] Figure 13 It is Figure 12 a top view of the structure shown;

[0038] Figure 14 In the manufacturing method of the ultra-thin magnetic head according to an embodiment of the present invention, a schematic diagram of providing a housing and a PCB with assembled single-track assemblies;

[0039] Figure 15 In the manufacturing method of the ultra-thin magnetic head according to an embodiment of the present invention, a schematic diagram when installing the PCB with assembled single-track assemblies into the housing;

[0040] Figure 16 In the manufacturing method of the ultra-thin magnetic head according to an embodiment of the present invention, a schematic diagram when performing arc grinding;

[0041] Figure 17 In the manufacturing method of the ultra-thin magnetic head according to an embodiment of the present invention, a schematic diagram after performing arc grinding;

[0042] Figure 18 In the manufacturing method of the ultra-thin magnetic head according to an embodiment of the present invention, a schematic diagram of providing an FPC;

[0043] Figure 19 In the manufacturing method of the ultra-thin magnetic head according to the embodiment of the present invention, it is a schematic diagram after the FPC is loaded into the housing and welded and fixed to the PCB;

[0044] Figure 20 It is an exploded view of a single-track component according to another embodiment of the present invention;

[0045] Figure 21 It is Figure 20 a schematic diagram after the structures in are assembled together.

[0046] Explanation of the reference numerals in the drawings:

[0047] 100 housing, 110 installation cavity, 120 window, 130 first positioning surface;

[0048] 200 PCB, 210 positioning hole, 220 lead pad, 230 glue injection hole, 240 PCB thermocompression bonding pad;

[0049] 300 single-track component, 310 magnetic disc, 311 head, 3111 lower side, 3112 stepped surface, 3113 upper side, 3114 second positioning surface, 312 tail, 313 positioning boss, 314 limiting step, 320 hollow coil, 321 first pin, 322 second pin, 323 relay wire, 330 positioning bracket, 331 main body, 332 first positioning part, 333 second positioning part, 334 third positioning part, 340 spacer;

[0050] 400 fixture, 410 positioning groove, 420 pressing block;

[0051] 500 FPC, 510 FPC thermocompression bonding pad. Detailed implementation manners

[0052] An existing magnetic head structure is as Figure 1 shown. The magnetic head includes components such as a left magnetic disc group, a right magnetic disc group, a spring piece, a winding part, a spacer, and a housing. Specifically, the winding part includes a skeleton, pins, and a winding. The pins are inserted on both sides of the skeleton, the winding is wound around the skeleton, and the starting end and the terminal end of the winding are respectively wound and welded to the pins on both sides of the skeleton. To ensure that the components inside the magnetic head can be easily assembled and closely cooperate, the tails of the left magnetic disc group and the right magnetic disc group are respectively inserted into the hollow structures at the left and right ends of the skeleton of the winding part, the spacer abuts between the heads of the left magnetic disc group and the right magnetic disc group, and the left magnetic disc group, the right magnetic disc group, and the winding part are all assembled and fixed on the spring piece and fixed in the housing together with the spring piece. The height of the components such as the left magnetic disc group, the right magnetic disc group, the spring piece, and the winding part after assembly determines the height of the magnetic head.

[0053] The current market has an increasing demand for ultra-thin magnetic heads because ultra-thin magnetic heads can save the assembly height in financial devices such as POS machines, making the structure of financial devices more streamlined. Therefore, magnetic head manufacturers are also working hard to develop ultra-thin magnetic heads to meet market demand. The currently more common design solution is to thin down the various components inside the magnetic head. Although this solution can reduce the height of the magnetic head, it is also likely to lead to a decrease in the reliability of the structures of the various components inside the magnetic head, resulting in a reduction in the output performance of the magnetic head. Moreover, the internal parts of the magnetic head cannot be thinned indefinitely. Therefore, it is difficult to simultaneously reduce the height of the magnetic head and ensure the performance of the magnetic head by thinning the height of the components in the existing magnetic head.

[0054] To simultaneously reduce the height of the magnetic head and ensure the performance of the magnetic head, embodiments of the present invention provide a financial device, an ultra-thin magnetic head, and a manufacturing method for the ultra-thin magnetic head. The embodiments of the present invention are described in detail below:

[0055] Referring to Figures 2 to 6 , the ultra-thin magnetic head includes a housing 100, a PCB 200 connected to the bottom of the housing 100, and at least one set of single-rail components 300 assembled between the housing 100 and the PCB 200. The single-rail components 300 can be set to one set, two sets, or three sets, corresponding to single-rail magnetic heads, two-rail magnetic heads, and three-rail magnetic heads respectively. Of course, in some special devices, the single-rail components 300 can also be set to other quantities for manufacturing multi-rail magnetic heads.

[0056] Furthermore, the housing 100 is provided with an installation cavity 110 for assembling the single-rail components 300 and a window 120 penetrating the installation cavity 110. After the PCB 200 is connected to the bottom of the housing 100, the installation cavity 110 can be enclosed to form an internal space for accommodating the single-rail components 300. The outer surface of the top of the housing 100 is an arc surface to adapt to existing financial devices. Among them, the inner surface of the housing 100, that is, the inner surface of the installation cavity 110, has a first positioning surface 130, and the shoulder of the magnetic sheet 310 correspondingly has a second positioning surface 3114. Both the first positioning surface 130 and the second positioning surface 3114 are arc surfaces. When the single-rail component 300 is assembled into the installation cavity 110, the second positioning surface 3114 of the magnetic sheet 310 is positioned and fitted to the first positioning surface 130 of the housing 100 to achieve the positioning of the single-rail component 300 inside the housing 100, facilitating subsequent assembly and manufacturing, making the internal structure of the magnetic head compact. The head 311 of the magnetic sheet 310 is exposed in the window 120 of the housing 100 and protrudes from the window 120 for subsequent arc surface grinding.

[0057] Furthermore, referring to Figures 4 to 6, each set of single-rail components 300 includes two sets of magnetic chips 310. The magnetic chips 310 have a head 311 and a tail 312. The single-rail component 300 further includes two sets of hollow coils 320 respectively wound around the tails 312 of the two sets of magnetic chips 310 and a positioning frame 330 positioned and connected between the two sets of magnetic chips 310. For the already manufactured and formed magnetic head, the heads 311 of the two sets of magnetic chips 310 are fixedly connected to each other, and the tails 312 are also fixedly connected to each other. Specifically, laser welding can be used for fixation. The hollow coil 320 is a hollow structure wound with enameled wire, and its head end and terminal end have self-bringing pins, that is, the first pin 321 and the second pin 322. After the two sets of hollow coils 320 are respectively wound around the tails 312 of the two sets of magnetic chips 310, the first pins 321 of the two sets of hollow coils 320 are located on the side close to each other, and the second pins 322 are located on the side far from each other. After the first pins 321 of the two sets of hollow coils 320 are welded to each other, they can be fixedly connected to the positioning frame 330 together by means of bonding, etc. as the relay line 323 of the coil, while the second pins 322 of the two sets of hollow coils 320 are electrically connected to the PCB 200 by welding to realize the line conduction between the single-rail component 300 and the PCB 200.

[0058] Compared with Figure 1 the magnetic head structure in

[0059] Therefore, the present head can eliminate the skeleton, pins, and shrapnel structures in the existing head, reducing the height space of the head occupied by these components. It can achieve the reduction of the overall height of the head without significantly thinning the height of the internal components of the head. And due to the elimination of the skeleton and pins, the hollow coil 320 can almost completely cover and wind around the tail 312 of the entire magnetic sheet 310. The reduced height of the coil can be compensated by increasing the coil length, so that the cross-sectional size of the winding in the present head is consistent with that in the existing head, achieving the effects of both reducing the head height and ensuring the head performance. The height of the present head can be significantly reduced, saving the head installation height of financial equipment and having excellent performance.

[0060] It should be noted that the winding cross-section mentioned in the present invention refers to the length×height direction. Due to the elimination of the skeleton structure, the height of the hollow coil 320 is reduced compared to the original winding. However, at the same time as the skeleton structure is eliminated, the original structural limitations of the skeleton structure are also eliminated. Therefore, the entire tail 312 of the magnetic sheet 310 can almost completely cover and wind around the hollow coil 320, making full use of the length of the tail 312 of the magnetic sheet 310. Thus, the length of the hollow coil 320 is increased compared to the original winding, and the reduction in height can be compensated by increasing the length of the hollow coil 320, so that the cross-sectional size of the winding in the present head is consistent with that in the existing head. In addition, of course, while ensuring the performance, the cross-sectional height of the hollow coil 320 can be further reduced, and the lengths of the magnetic sheet 310 and the housing 100 can be additionally increased, so as to ensure the output performance of the head while further reducing the head height.

[0061] Furthermore, in some embodiments, the structure of the magnetic sheet 310 can adopt the original structure, that is, Figure 1 the magnetic sheet structure in. The magnetic sheet 310 has a head 311 and a tail 312, and there is a gap between the head 311 and the tail 312. In the original structure, this gap can facilitate the insertion of the tail 312 of the magnetic sheet 310 into the hollow structure of the skeleton. In the head structure of the present invention, this gap can facilitate the winding of the hollow coil 320 around the tail 312 of the magnetic sheet 310. The head 311 of the magnetic sheet 310 has a lower side surface 3111, a stepped surface 3112, and an upper side surface 3113. The stepped surface 3112 is located between the lower side surface 3111 and the upper side surface 3113 of the magnetic sheet 310, and the lower side surface 3111, the stepped surface 3112, and the upper side surface 3113 are connected in sequence. Among them, for the magnetic sheet 310 with the same structure as the original structure, the lower side surface 3111 is an inclined surface to provide space for the skeleton and pins. Therefore, referring to Figure 5 and Figure 6, the positioning bracket 330 includes a main body 331, a first positioning portion 332 located at the lower part of the main body 331, second positioning portions 333 located on both sides of the top of the main body 331, and a third positioning portion 334 located at the top of the main body 331. The first positioning portion 332 is used to position and connect the tails 312 of two groups of magnetic chips 310. The second positioning portions 333 are used to position and connect the lower side surfaces 3111 of two groups of magnetic chips 310. The third positioning portion 334 is used to position and connect the stepped surfaces 3112 of two groups of magnetic chips 310. A spacer 340 is abutted between the upper side surfaces 3113 of two groups of magnetic chips 310. The second positioning portions 333 protrude from the first positioning portion 332 to both sides, making the positioning bracket 330 present a "Y" shape, and the second positioning portions 333 on both sides can better position the lower side surfaces 3111 in the form of inclined surfaces. Further, both the first positioning portion 332 and the second positioning portions 333 are positioning grooves, and the third positioning portion 334 is a positioning plane. During assembly, the tail 312 of the magnetic chip 310 is positioned and inserted into the positioning groove of the first positioning portion 332, the lower side surface 3111 of the magnetic chip 310 is positioned and inserted into the positioning groove of the second positioning portion 333, the stepped surface 3112 abuts against the positioning plane of the third positioning portion 334, and the upper side surfaces 3113 of the heads 311 of two groups of magnetic chips 310 are positioned and abutted against the spacer 340, so as to provide reliable pre-positioning and support for two groups of magnetic chips 310 through multiple positionings.

[0062] Further, in some other embodiments, since the skeleton of this magnetic head is cancelled and the structural limitation of the skeleton is reduced, the lower side surface 3111 of the head 311 of the magnetic chip 310 can be filled with materials, so that the lower side surface 3111 presents a right angle instead of an inclined surface. At this time, as Figure 20 and Figure 21 shown, the positioning bracket 330 still includes a main body 331, a first positioning portion 332, second positioning portions 333 and a third positioning portion 334. The displacement or misalignment of the left and right magnetic chips 310 can still be avoided through multiple positioning effects. Only the second positioning portions 333 may no longer protrude from the first positioning portion 332 to both sides, but may contract inward, making the positioning bracket 330 present an "A" shape. For the corresponding structure in Figure 6 , the original structure of the magnetic chip 310 can be maintained, and thus the original mold can be retained, reducing the cost of modifying the mold. For the corresponding structure in Figure 20 and Figure 21 , the structural strength of the magnetic chip 310 can be increased and the positioning reliability can be improved.

[0063] Further, referring to Figures 10 to 13, the PCB 200 is provided with positioning holes 210. The bottom of the magnetic disc 310 is provided with a positioning boss 313 and a limiting step 314, and the positioning boss 313 protrudes downward from the limiting step 314. A plurality of positioning holes 210 and positioning bosses 313 are distributed and their positions correspond one by one. During assembly, the positioning boss 313 is inserted into the positioning hole 210 in a positioning manner, so that the position between the single-rail assembly 300 and the PCB 200 is accurate and subsequent assembly and fixation are facilitated. The limiting step 314 is used to limit and separate the PCB 200 and the hollow coil 320 to prevent the PCB 200 and the hollow coil 320 from contacting each other. Further, the inner side of the positioning hole 210 is an outgoing wire pad 220, and the outgoing wire pad 220 is welded and fixed to the second pin 322 of the hollow coil 320 on the magnetic disc 310. The inner side of the outgoing wire pad 220 is a PCB thermocompression bonding pad 240, and the PCB thermocompression bonding pad 240 is provided on both the top layer and the bottom layer of the PCB 200. The PCB thermocompression bonding pad 240 on the bottom layer is used for thermocompression welding with the FPC 500. The top layer PCB thermocompression bonding pad 240 and the bottom layer PCB thermocompression bonding pad 240 are conducted through a metallized via hole, and each track of the PCB thermocompression bonding pad 240 and the outgoing wire pad 220 are connected and conducted through the internal circuit of the PCB 200. That is, a conductive line is sequentially formed from the left PCB thermocompression bonding pad 240, the left outgoing wire pad 220, the left hollow coil 320, the relay wire 323, the right hollow coil 320, the right outgoing wire pad 220, and the right PCB thermocompression bonding pad 240 on the PCB 200.

[0064] Further, an embodiment of the present invention also provides a financial device, including the above ultra-thin magnetic head, which at least has all the beneficial effects that the above ultra-thin magnetic head can bring. Specifically, the financial device can be a card reader, a POS machine, or other card swiping devices, etc.

[0065] Further, an embodiment of the present invention also provides a manufacturing method of an ultra-thin magnetic head for manufacturing the above ultra-thin magnetic head, including the following steps:

[0066] Step S100, referring to Figure 6, two sets of magnetic disks 310, two sets of hollow coils 320, a positioning frame 330, and a spacer 340 are provided. The left and right sets of hollow coils 320 are respectively wound around the tails 312 of the left and right sets of magnetic disks 310, and the magnetic disks 310 and the hollow coils 320 are fixed by dispensing glue, so that the hollow coils 320 are fixed on the magnetic disks 310. A positioning frame 330 is installed between the left and right sets of magnetic disks 310, so that the left and right sets of magnetic disks 310 are mutually close and abutted against both sides of the positioning frame 330, and the spacer 340 is clamped between the upper sides 3113 of the heads 311 of the left and right sets of magnetic disks 310. At the same time, the tails 312 of the left and right sets of magnetic disks 310 are mutually abutted, so as to pre-assemble the six parts of the left and right sets of magnetic disks 310, the left and right sets of hollow coils 320, the positioning frame 330, and the spacer 340 together to obtain a pre-assembled single-rail assembly 300.

[0067] Step S200, referring to Figure 7 , place the pre-assembled single-rail assembly 300 into the positioning slot 410 of the jig 400 for positioning, so that the alignment between the left and right sets of magnetic disk groups is neat. Referring to Figure 8 , slide two pressing blocks 420 along the slideway, and press them on the left and right sides by using the pressing blocks 420, so that the heads 311 between the left and right sets of magnetic disks 310 press the spacer 340, and the tails 312 are mutually abutted and adhered tightly. Under the positioning effect of the jig 400 and the extrusion effect of the pressing blocks 420, the left and right sets of magnetic disk groups are always kept aligned, and the heads 311 and the tails 312 are always kept in a tightly adhered state. Continuing to refer to Figure 8 , under the action of the jig 400 and the pressing blocks 420, keep the tails 312 of the two sets of magnetic disks 310 abutted and fix them by laser welding. Referring to Figure 9 , clamp the spacer 340 between the heads 311 of the two sets of magnetic disks 310 and fix it by laser welding. After welding the tails 312 and the heads 311 of the two sets of magnetic disks 310, weld the first pins 321 of the left and right sets of hollow coils 320 to each other and fix them on the positioning frame 330 as a relay line 323 connecting the two hollow coils 320. Referring to Figure 10 , after welding is completed, a closed annular structure can be formed between the heads 311 and the tails 312 of the single-rail assembly 300, and a single-rail assembly 300 fixed as a whole is obtained.

[0068] Step S300, referring to Figure 11 , provide a PCB 200 and at least one set of single-rail assemblies 300 fixed as a whole. Referring to Figures 12 to 13, and assemble the single-rail component 300 on the PCB 200, and solder the second pins 322 of the left and right hollow coils 320 to the pads on the PCB 200. Specifically, position and insert the positioning boss 313 of the magnetic sheet 310 into the positioning hole 210 of the PCB 200, and make the limiting step 314 of the magnetic sheet 310 block the PCB 200 to prevent the PCB 200 from contacting the hollow coil 320. Solder the second pins 322 of the two hollow coils 320 to the lead-out pad 220 of the PCB 200 to realize the conduction of each-rail hollow coil 320 and each-rail circuit on the PCB 200.

[0069] Step S400, referring to Figure 14 and Figure 15 , provide the housing 100, apply glue on the first positioning surface 130 in the installation cavity 110 of the housing 100, and install the PCB 200 with the required number of assembled single-rail components 300 into the housing 100, so that the second positioning surface 3114 on the magnetic sheet 310 fits on the first positioning surface 130 in the housing 100 to make the single-rail component 300 assembled in place, and fix the single-rail component 300 in the housing 100 with glue.

[0070] Step S500, apply a film on the welding surface of the PCB 200 to prevent the pads on the surface of the PCB 200 from being contaminated by the injection resin. Carry out shallow injection resin potting inside the housing 100 through the injection hole 230 of the PCB 200. The solidified injection resin will fill the internal space between the PCB 200 and the housing 100, providing strong support and positioning for the internal components of the magnetic head and preventing the components from shifting.

[0071] Step S600, referring to Figure 16 , after the single-rail component 300 and the PCB 200 are installed in the housing 100, the head 311 of the magnetic sheet 310 will protrude from the window 120 of the housing 100. At this time, the magnetic head can be subjected to arc grinding. As shown in Figure 16 , there are laser-welded solder joints between the heads 311 of the two groups of magnetic sheets 310, and the laser-welded solder joints protrude from the outer arc surface of the housing 100. When performing arc grinding, the solder joints will be ground off, leaving the working gap of the normal spacer 340. The structure after grinding is as shown in Figure 17 .

[0072] Step S700, referring to Figure 18 and Figure 19, an FPC500 is provided, the FPC500 is installed in the housing 100, and the FPC500 is thermocompression welded to the PCB200. Specifically, the welding surface of the FPC500 is provided with FPC thermocompression pads 510 corresponding to the positions of the PCB thermocompression pads 240 on the PCB200. The FPC thermocompression pads 510 are wired to connect the FPC500 gold fingers. There is MESH wiring on the back of the welding surface of the FPC500. The FPC thermocompression pads 510 of the FPC500 are abutted against the PCB thermocompression pads 240 on the PCB200 and thermocompression welded. The MESH wiring on the back of the FPC500 faces the outside of the magnetic head, which can protect the circuits inside the magnetic head.

[0073] Step S800: Inject glue into the housing 100 for the second time to cover the FPC500 located inside the magnetic head housing 100, and obtain the required magnetic head.

[0074] This manufacturing method is used to manufacture the above-mentioned ultra-thin magnetic head, and it at least has all the beneficial effects that the above-mentioned ultra-thin magnetic head can bring. Moreover, since the internal structure of the ultra-thin magnetic head is reduced in configuration, therefore, this manufacturing method is also simplified, and the manufacturing efficiency of the magnetic head is also improved. In addition, since a positioning frame 330 is provided between the two groups of magnetic sheets 310 in the ultra-thin magnetic head, during manufacturing, the positioning frame 330 can not only perform preliminary positioning on the two groups of magnetic sheets 310 to facilitate the pre-assembly of the single-track assembly 300, but also separate the two hollow coils 320 to prevent the hollow coils 320 from shifting and blocking subsequent laser welding. At the same time, it can also provide a fixed support for the relay welding wire heads of the second pins 322 of the two hollow coils 320. During subsequent arc surface grinding, the positioning frame 330 can also support the magnetic sheets 310 to resist the grinding pressure, further ensuring the reliability of the internal structure of the magnetic head.

[0075] It should be noted that in the description of the present invention, if there is a description of orientation, such as the orientation or positional relationship indicated by up, down, front, back, left, right, etc., it is all based on the orientation or positional relationship shown in the drawings, only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed or operate in a specific orientation, and should not be construed as a limitation of the present invention.

[0076] In the description of the present invention, the meaning of several is one or more, the meaning of multiple is two or more, greater than, less than, exceeding, etc. are understood as not including the number itself, above, below, within, etc. are understood as including the number itself. If there is a description of the first or the second, etc., it is only for the purpose of distinguishing technical features and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0077] In the description of the present invention, unless otherwise clearly defined, terms such as "set", "installed", "connected", etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific content of the technical solution.

[0078] The above embodiments are only the preferred embodiments of the present invention, and the scope of protection of the present invention cannot be limited thereby. Any non-substantive changes and substitutions made by those skilled in the art based on the present invention fall within the scope of protection required by the present invention.

Claims

1. An ultra-thin magnetic head, characterized in that, It includes a housing (100), a PCB (200) connected to the bottom of the housing (100), and at least one set of single-rail components (300) assembled between the housing (100) and the PCB (200). The single-rail component (300) includes two sets of magnetic sheets (310), two sets of hollow coils (320) respectively wound around the tails (312) of the two sets of magnetic sheets (310), and a positioning frame (330) positioned and connected between the two sets of magnetic sheets (310). The heads (311) of the two sets of magnetic sheets (310) are fixedly connected to each other, and the tails (312) are also fixedly connected to each other. The hollow coil (320) has a first pin (321) and a second pin (322). The first pins (321) of the two sets of hollow coils (320) are connected to each other and fixedly connected to the positioning frame (330) together. The second pins (322) of the two sets of hollow coils (320) are electrically connected to the PCB (200). The positioning frame (330) includes a main body (331), a first positioning portion (332) located at the lower part of the main body (331), and second positioning portions (333) located on both sides of the top of the main body (331). The first positioning portion (332) is used for positioning and connecting the tails (312) of the two sets of magnetic sheets (310). The head (311) of the magnetic sheet (310) has a lower side surface (3111). The second positioning portion (333) is used for positioning and connecting the lower side surfaces (3111) of the two sets of magnetic sheets (310).

2. The ultra-thin magnetic head according to claim 1, characterized in that, The head (311) of the magnetic sheet (310) further has a stepped surface (3112) and an upper side surface (3113). The stepped surface (3112) is located between the lower side surface (3111) and the upper side surface (3113) of the magnetic sheet (310). The positioning frame (330) further includes a third positioning portion (334) located at the top of the main body (331). The third positioning portion (334) is used for positioning and connecting the stepped surfaces (3112) of the two sets of magnetic sheets (310). A spacer (340) is abutted between the upper side surfaces (3113) of the two sets of magnetic sheets (310).

3. The ultra-thin magnetic head according to claim 2, characterized in that, Both the first positioning portion (332) and the second positioning portion (333) are positioning grooves, and the third positioning portion (334) is a positioning plane.

4. The ultra-thin magnetic head according to any one of claims 1 to 3, characterized in that, The positioning frame (330) is a "Y"-shaped bracket or an "A"-shaped bracket.

5. The ultra-thin magnetic head according to claim 1, characterized in that, The PCB (200) is provided with positioning holes (210). The bottom of the magnetic sheet (310) is provided with a positioning boss (313) and a limiting step (314). The positioning boss (313) is positioned and inserted into the positioning hole (210). The limiting step (314) is used for limiting and separating the PCB (200) and the hollow coil (320).

6. The ultra-thin magnetic head according to claim 1, characterized in that, The housing (100) is provided with an installation cavity (110) for assembling the single-rail assembly (300) and a window (120) penetrating the installation cavity (110). The installation cavity (110) has a first positioning surface (130), and the magnetic sheet (310) has a second positioning surface (3114). The second positioning surface (3114) of the magnetic sheet (310) is positioned and fitted to the first positioning surface (130) of the housing (100), and the head (311) of the magnetic sheet (310) is exposed within the window (120) of the housing (100).

7. The ultra-thin magnetic head according to claim 1, characterized in that, One group, two groups or three groups of the single-rail assemblies (300) are provided.

8. A financial device, characterized in that, It includes the ultra-thin magnetic head according to any one of claims 1-7.

9. A manufacturing method of an ultra-thin magnetic head, characterized in that, For manufacturing the ultra-thin magnetic head according to any one of claims 1-7, it includes the following steps: Step S100. Provide a magnetic sheet (310), a hollow coil (320), a positioning bracket (330) and a spacer (340). Wind the left and right groups of hollow coils (320) around the tails (312) of the left and right groups of magnetic sheets (310) respectively. Insert the positioning bracket (330) between the left and right groups of magnetic sheets (310), and make the heads (311) of the left and right groups of magnetic sheets (310) clamp the spacer (340), and the tails (312) abut against each other to obtain a pre-assembled single-rail assembly (300); Step S200. Place the pre-assembled single-rail assembly (300) in a jig (400) for positioning, and press it tightly on the left and right sides. Weld and fix the heads (311) and tails (312) of the left and right groups of magnetic sheets (310), and weld the first pins (321) of the left and right groups of hollow coils (320) to each other and then fix them on the positioning bracket (330) to obtain a single-rail assembly (300) fixed as a whole; Step S300. Provide a PCB (200) and at least one group of single-rail assemblies (300) fixed as a whole, and assemble the single-rail assembly (300) on the PCB (200). Weld the second pins (322) of the left and right groups of hollow coils (320) on the lead-out pad (220) of the PCB (200); Step S400. Provide a housing (100), and install the PCB (200) assembled with the single-rail assembly (300) into the housing (100); Step S500. Apply a film to protect the welding surface on the surface of the PCB (200), and perform shallow injection molding on the inside of the housing (100) through the injection hole (230) of the PCB (200); Step S600. Perform arc surface grinding; Step S700. Provide an FPC (500), install the FPC (500) into the housing (100), and perform thermal compression welding on the FPC (500) and the PCB (200); Step S800. Perform a second injection molding on the inside of the housing (100) to obtain the required magnetic head.

Images