Packaging method and packaging body

Abstract

The invention discloses a packaging method and a packaging body. The packaging method comprises the following steps: manufacturing a plastic package body on one surface, on which a component is positioned, of a carrier plate, manufacturing a plated-through hole, and leading out a pin of the component through the plated-through hole; and manufacturing a circuit layer on one side of the plastic package body back to the carrier plate, the circuit layer comprising a plurality of bonding pads, connecting one side of each bonding pad with the plated-through hole, and extending the other side of each bonding pad in a direction far away from the component so as to reduce the overlapping area of the projection of the bonding pad and the metal medium on one side of the component back to the bonding pad in the thickness direction of the component. When the bonding pad is manufactured, one side of the bonding pad is connected with the plated-through hole, and the other side of the bonding pad extends in the direction far away from the component, so that the opposite area of the bonding pad and a metal medium on the back surface of the component can be reduced, the parasitic capacitance generated by the bonding pad and the metal medium is reduced, and the influence of the parasitic capacitance on the performance of a packaged product is reduced. In addition, the pins are directly led out from the plated-through holes above the chip, the leading-out path is shorter, and parasitic inductance and packaging internal resistance are reduced.

Description

Technical Field

[0001] The present application relates to the technical field of packaging product manufacturing, and in particular to a packaging method and a packaging body. Background Art

[0002] Packaging refers to the process of encapsulating multiple electrically connected components together through a plastic layer, and leading the circuit pins out of the plastic layer to connect with other devices. Packaging plays a role in installation, fixing, sealing, protecting components and enhancing electrical and thermal performance.

[0003] Among them, the package will inevitably have parasitic capacitance. The parasitic capacitance is formed by factors such as the electric field between the package pins and the metal matrix, the electric field between the packaging materials, etc. Among them, the parasitic capacitance will affect the performance of the packaged product. For example, the parasitic capacitance will reduce the high-frequency response speed of the circuit and increase the noise of the circuit. Summary of the invention

[0004] The main technical problem solved by the present application is to provide a packaging method and a packaging body to reduce the parasitic capacitance of the packaging body.

[0005] In order to solve the above technical problems, the first technical solution adopted in the present application is to provide a packaging method, which includes: making a frame and positioning components in the frame, wherein a carrier is attached to one side of the frame; making a plastic package body on the side of the carrier where the components are positioned, and making metallized holes, through which the pins of the components are led out; making a circuit layer on the side of the plastic package body facing away from the carrier, the circuit layer including a plurality of pads, so that one side of the pad is connected to the metallized hole, and the other side of the pad extends away from the component, so as to reduce the overlapping area between the pad and the projection of the metal medium on the side of the component facing away from the pad in the thickness direction of the component.

[0006] In a possible implementation, the step of making the frame specifically includes: obtaining a plate to be processed, making a through groove on the plate to be processed, and attaching the carrier plate to one side of the plate to be processed so that an opening on one side of the through groove is covered by the carrier plate.

[0007] In a possible implementation manner, the step of attaching the carrier plate to one side of the plate to be processed specifically includes: attaching an adhesive plate to one side of the plate to be processed, and positioning the component in the through groove by means of the adhesive plate.

[0008] In a possible implementation manner, after the step of making the plastic package body, the method further includes: pressing a protective plate on the side to which the adhesive plate is attached.

[0009] In a possible implementation, the step of attaching the carrier plate to one side of the plate to be processed specifically includes: attaching an adhesive plate to one side of the plate to be processed and pressing a protective plate, and positioning the component in the through groove by means of the adhesive plate.

[0010] In a possible implementation, the method further includes: removing the carrier; and obtaining components before positioning the components in the frame, wherein one side of the obtained components is made with a metal medium, and after removing the carrier, the metal medium is exposed.

[0011] In a possible implementation, the method further includes: making a blind hole on the pad area above the metallized hole, the blind hole penetrating the pad and leaking out of the metallized hole, and injecting a conductive agent into the blind hole so that the conductive agent is electrically connected to the pad and the conductive agent is also electrically connected to the metallized hole.

[0012] In a possible embodiment, the step of making the metallized holes specifically includes: making the metallized holes in the pin area of ​​the plastic package corresponding to the component and the frame area of ​​the plastic package corresponding to both sides of the component, so that the pins of the component are connected to the frame through the metallized holes, the circuit layer and the frame, and the pins of the component facing the plastic package are led out to the side of the component facing away from the plastic package.

[0013] In a possible implementation manner, the method further includes: manufacturing a solder resist layer so that the solder resist layer covers the circuit layer.

[0014] In order to solve the above technical problem, the second technical solution adopted in the present application is to provide a packaging body, which is manufactured by the packaging method described above.

[0015] The beneficial effects of the present application are as follows: Different from the prior art, the present application provides a packaging method and a packaging body, the packaging method comprising: making a frame, positioning components in the frame, wherein a carrier is attached to one side of the frame; making a plastic package body on the side of the carrier where the components are positioned, and making metallized holes, through which the pins of the components are led out; making a circuit layer on the side of the plastic package body facing away from the carrier, the circuit layer comprising a plurality of pads, so that one side of the pad is connected to the metallized hole, and the other side of the pad extends away from the component, so as to reduce the overlapping area of ​​the projection of the pad and the metal medium on the side of the component facing away from the pad in the thickness direction of the component. When making the pad, one side of the pad is connected to the metallized hole, and the other side of the pad extends away from the component, which can reduce the facing area of ​​the pad and the metal medium on the back of the component, thereby reducing the parasitic capacitance generated by the two, and reducing the influence of the parasitic capacitance on the performance of the packaged product. In addition, the pins are directly led out from the metallized hole above the chip, and the lead-out path is shorter, which reduces the parasitic inductance and the internal resistance of the package. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 It is a schematic diagram of the process of the first implementation method of the packaging method of the present application;

[0018] Figure 2a yes Figure 1 Schematic diagram of the plate structure after S11;

[0019] Figure 2b yes Figure 1 Schematic diagram of the plate structure after S12;

[0020] Figure 2c yes Figure 1 Schematic diagram of the plate structure after S13;

[0021] Figure 2d and Figure 2e yes Figure 1 Schematic diagram of the plate structure after S14;

[0022] Figure 3 It is a flow chart of the second implementation mode of the packaging method of the present application;

[0023] Figure 4a yes Figure 3 Schematic diagram of the plate structure after S21;

[0024] Figure 4b yes Figure 3 Schematic diagram of the plate structure after S22;

[0025] Figure 4c yes Figure 3 Schematic diagram of the structure of the rear plate of S23;

[0026] Figure 4d and Figure 4e yes Figure 3 Schematic diagram of the rear plate structure of S34.

[0027] Among them, 10 / 210, frame; 11 / 211, through slot; 21 / 221, adhesive board; 30 / 230, components; 40 / 240, metal medium; 50 / 250, plastic package; 60 / 260, metalized hole; 22 / 222, protection board; 20 / 220, carrier board; 71, pad; 70 / 270, circuit layer; 80 / 280, solder mask layer. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0029] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms of "a", "said", and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless otherwise clearly indicated above, and "multiple" generally includes at least two, but does not exclude the inclusion of at least one.

[0030] It should be understood that the term "and / or" used in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0031] It should be understood that the terms "include", "comprises" or any other variations used herein are intended to cover non-exclusive inclusion, so that a process, method, article or device that includes a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of more restrictions, the elements defined by the sentence "includes..." do not exclude the presence of other identical elements in the process, method, article or device that includes the elements.

[0032] The package body will inevitably have parasitic capacitance, which will affect the performance of the packaged product.

[0033] Based on the above problems, the present application proposes a packaging method and a packaging body, which can effectively reduce parasitic capacitance by reducing the overlapping area between the solder pads leading out of the components and the projected metal medium on one side of the components.

[0034] A packaging method and a packaging body provided by the present application are described in detail below in conjunction with the accompanying drawings and embodiments.

[0035] See also Figure 1 , Figure 1 : is a schematic diagram of a first embodiment of the packaging method of the present application. In a specific embodiment, the packaging method may include:

[0036] S11: making a frame and positioning components in the frame, wherein a carrier board is attached to one side of the frame.

[0037] Please refer to Figure 2a , Figure 2a yes Figure 1 Schematic diagram of the S11 rear plate structure.

[0038] In this embodiment, the step of making the frame 10 specifically includes: obtaining a plate to be processed, and making a through groove 11 on the plate to be processed. Specifically, in this embodiment, the frame 10 is used to position and protect the components 30. The plate to be processed can be a dielectric plate, a double-sided copper-clad plate, a single-sided copper-clad plate, a metal plate, etc., which are not specifically limited. In this embodiment, the plate to be processed is a metal plate, and the through groove 11 is used to bury the components 30, which plays a role in limiting and protecting the components 30. The shape of the through groove 11 can be square, circular, polygonal, etc., and can be adaptively adjusted according to the shape of the embedded components 30, which is not specifically limited. In this embodiment, the through groove 11 is square. In addition, the number of through grooves 11 on the plate to be processed can be any reasonable number such as one or more, which is adjusted according to the number of components 30 to be packaged, which is not specifically limited. In the schematic diagram of this embodiment, the number of through grooves 11 shown is two.

[0039] The through groove 11 can be made in the plate to be processed by mechanical processing such as milling or laser ablation.

[0040] In this embodiment, a carrier is attached to one side of the plate to be processed for making the through groove 11, so that the opening of one side of the through groove 11 is covered by the carrier, wherein the step of attaching the carrier to one side of the plate to be processed specifically includes: attaching an adhesive plate 21 to one side of the plate to be processed, and positioning the component 30 in the through groove 11 through the adhesive plate 21. The adhesive plate 21 is adhesive, and can be a sticky polyester film, a sticky polyethylene film, a sticky polypropylene film, etc., which is not specifically limited. The adhesive plate 21 covers the opening of one side of the through groove 11 so that the component 30 can be temporarily positioned in the through groove 11 through the adhesive plate 21.

[0041] In a preferred embodiment, the adhesive plate 21 is a single-sided adhesive film, and the adhesive side of the adhesive plate 21 is attached to the plate to be processed.

[0042] S12: A plastic package is made on the side of the carrier board where the components are positioned, and metallized holes are made, through which pins of the components are led out.

[0043] Please refer to Figure 2b , Figure 2b yes Figure 1 Schematic diagram of the S12 rear plate structure.

[0044] The material of the plastic package 50 may specifically include one or more of epoxy resin, polyimide, bismaleimide triazine, and ceramic matrix. The specific material is not limited here. The purpose of making the plastic package 50 is to fix the component 30 in the frame 10 and to protect the component 30.

[0045] Among them, in this embodiment, the carrier plate 20 includes an adhesive plate 21 and a protective plate 22. After the step of making the plastic package body 50, it also includes: pressing the protective plate 22 on the side to which the adhesive plate 21 is attached. Specifically, the protective plate 22 plays a protective role and is used to protect the back of the component 30 in the subsequent process. Among them, the protective plate 22 is preferably a rigid plate, and the pressing of the rigid protective plate 22 is used to improve the strength of the plate and avoid the problem of deformation and damage of the plate due to extrusion in the subsequent process. Among them, the protective plate 22 can be a ceramic plate, a metal steel plate, etc., without specific limitation. In this embodiment, the protective plate 22 is a metal steel plate, and the pressing process can use or not use an adhesive, and is a method of combining two or more layers of the same or different materials into a whole by heating and pressurizing. In a preferred embodiment, before being pressed into the protective plate 22 of the metal steel plate, one side of the metal steel plate is subjected to browning treatment. Specifically, the surface of the metal steel plate is first micro-etched with a browning liquid to generate an extremely thin and uniform organic metal conversion film, so that the surface of the steel plate has a smooth microscopic uneven surface shape. At the same time, the organic additives in the browning liquid and the surface of the metal steel plate generate a layer of organic metal conversion film. This film can be effectively embedded in the metal surface to form a brown grid conversion layer. Such treatment can increase the bonding force of the metal steel plate pressed on the surface of the adhesive plate 21.

[0046] In this embodiment, a metallized hole 60 is made in the area of ​​the pin of the plastic package 50 corresponding to the side of the component 30 facing away from the carrier 20, so that the pin of the component 30 can be led out through the metallized hole 60. Specifically, the pin is led out through the metallized hole 60 just above the surface of the component 30. Compared with the solution of wiring to lead out the pin of the component 30 through the lead wire, the lead-out path is shorter, which can reduce parasitic inductance and make the signal transmission efficiency faster. In addition, the metallized hole 60 leads out the pin, and its transmission cross-section is larger than the solution of lead wire leading out, and it has a smaller package internal resistance, which can reduce the heat generation of the packaged product. Among them, the manufacturing process of the metallized hole 60 can be specifically, drilling a hole in the pin area of ​​the plastic package 50 corresponding to the component 30, and then metalizing the hole. The hole metallization can be specifically performed by copper deposition in the hole, electroplating, or burying a metal part in the hole to metallize the hole.

[0047] S13: A circuit layer is fabricated on the side of the plastic package body facing away from the carrier board, wherein the circuit layer includes a plurality of pads, one side of the pads is connected to the metallized holes, and the other side of the pads extends away from the components, so as to reduce the overlapping area between the pads and the projection of the metal medium on the side of the component facing away from the pads in the thickness direction of the components.

[0048] Please refer to Figure 2c , Figure 2c yes Figure 1 Schematic diagram of the S13 rear plate structure.

[0049] Specifically, the circuit layer 70 is made by graphics, and the steps may include film pasting, exposure, development, etching and electroplating. The circuit layer 70 is made to form a number of pads 71 ​​connected to the metallized holes 60, and the pins of the components 30 are led out. The exposed pads 71 ​​can be used to connect the package to the load. In this embodiment, when making the pad 71, one side of the pad 71 is connected to the metallized hole 60, and the other side of the pad 71 extends away from the component 30, which can reduce the area of ​​the pad 71 facing the metal medium 40 on the back of the component 30, thereby reducing the parasitic capacitance generated by the two, and reducing the impact of the parasitic capacitance on the performance of the packaged product.

[0050] Among them, it is preferred that the other side of the pad 71 extends away from the component 30 and the metallized hole 60, and the projection of the edge of one side of the pad 71 in the thickness direction of the component 30 is located on the metallized hole 60. This arrangement can ensure that the area facing the pad 71 and the metal medium 40 on the back of the component 30 is reduced as much as possible.

[0051] It can be understood that the projection of one side edge of the pad 71 in the thickness direction of the component 30 is located on the metallized hole 60. This setting may cause the problem of reduced reliability of the connection between the pad 71 and the metallized hole 60. In a preferred embodiment, a blind hole is made in the area of ​​the pad 71 above the metallized hole 60, the blind hole penetrates the pad 71 and leaks out of the metallized hole 60, and a conductive agent is injected into the blind hole to electrically connect the pad 71, and the conductive agent is also electrically connected to the metallized hole 60. This setting causes the projection of one side edge of the pad 71 to be located on the metallized hole 60, thereby reducing the facing area, and at the same time, the reliability of the connection between the pad 71 and the metallized hole 60 is ensured by opening a blind hole and injecting a conductive agent.

[0052] The circuit layer 70 includes not only the pads 71 ​​but also other circuit patterns. Preferably, the circuit patterns are all made on the side of the pads 71 ​​away from the components 30 to reduce parasitic capacitance.

[0053] After the circuit layer 70 is manufactured, each pad 71 is used to connect the packaged product to each load, and the metal medium 40 on one side of the component 30 is used to connect to the power input.

[0054] S14: Remove the carrier board, make a solder mask layer, and perform cutting.

[0055] Please refer to Figure 2d and Figure 2e , Figure 2d and Figure 2e yes Figure 1 Schematic diagram of the rear plate structure of S14.

[0056] Specifically, removing the carrier 20 includes removing the adhesive plate 21 and the protective plate 22, and making a solder resist layer 80, which covers the other circuit patterns of the circuit layer 70 except the pad 71. The solder resist layer 80 is used to protect the other circuit patterns except the pad 71. After cutting, a number of packaged products can be obtained.

[0057] Furthermore, in this embodiment, before the step of positioning the component 30 in the frame 10, it also includes obtaining the component 30, wherein the obtained component 30 has a metal medium 40 made on one side, and after removing the carrier 20, the metal medium 40 leaks out, and the metal medium 40 can package the product to connect the power input. Specifically, the obtained component 30 has completed the production of the bottom metal in advance, and after removing the carrier 20, it is no longer necessary to deposit copper and electroplate to make patterns, thereby avoiding the risk of carding and breaking of the board when the board is too thin to make patterns after removing the carrier 20. In the above-made package, the metal medium 40 on one side is directly exposed for heat dissipation, and the other side is connected to the circuit layer 70 through the metallized hole 60 for heat dissipation, thereby realizing double-sided heat dissipation of the component 30. In some other embodiments, the carrier 20 is removed, and the metal medium 40 is patterned on the side of the component 30 where the carrier 20 is removed. In this embodiment, the obtained component 30 does not have a metal medium 40 made in advance, and the metal medium 40 needs to be patterned after removing the carrier 20.

[0058] Different from the prior art, the present application provides a packaging method, in which one side of the pad 71 is connected to the metallized hole 60 when making the pad 71, and the other side of the pad 71 extends away from the component 30, which can reduce the area of ​​the pad 71 facing the metal medium 40 on the back of the component 30, thereby reducing the parasitic capacitance generated by the two and reducing the impact of the parasitic capacitance on the performance of the packaged product. In addition, the pins are directly led out from the metallized hole 60 above the chip, and the lead-out path is shorter, which reduces the parasitic inductance and the internal resistance of the package.

[0059] See also Figure 3 , Figure 3 It is a flow chart of the second implementation mode of the packaging method of the present application.

[0060] S21: obtaining a plate to be processed, making a through groove on the plate to be processed, and attaching a carrier plate to one side of the plate to be processed so that the opening of one side of the through groove is covered by the carrier plate, and positioning the components in the frame.

[0061] Please refer to Figure 4a , Figure 4a yes Figure 3 Schematic diagram of the S21 rear plate structure.

[0062] In this embodiment, the step of attaching the carrier plate 220 to one side of the plate to be processed specifically includes: attaching the adhesive plate 221 to one side of the plate to be processed and pressing the protection plate 222 together, and positioning the component 230 in the through groove 211 through the adhesive plate 221 .

[0063] Specifically, different from the first embodiment, in this embodiment, after the groove 211 is opened on the plate to be processed, the adhesive plate 221 and the protective plate 222 are directly disposed on one side of the plate to be processed at the same time.

[0064] For other details of this step, please refer to S11 and will not be described in detail here.

[0065] S22: Making a plastic package on the side of the carrier where the components are positioned.

[0066] Please refer to Figure 4b , Figure 4b yes Figure 3 Schematic diagram of the S22 rear plate structure.

[0067] The process of making the plastic package body 250 can be referred to in S12 and will not be described in detail here.

[0068] S23: Make metallized holes in the pin area of ​​the plastic package body corresponding to the components and in the frame areas on both sides of the plastic package body corresponding to the components, and make a circuit layer on the side of the plastic package body facing away from the carrier board, the circuit layer including a plurality of pads, so that one side of the pad is connected to the metallized hole, and the other side of the pad extends away from the component to reduce the overlapping area of ​​the pad and the projection of the metal medium on the side of the component facing away from the pad in the thickness direction of the component; make the pins of the component conduct through the metallized hole, the circuit layer and the frame, and lead the pins of the component facing the plastic package body to the side of the component facing away from the plastic package body.

[0069] Please refer to Figure 4c , Figure 4c yes Figure 3 Schematic diagram of the S23 rear plate structure.

[0070] Specifically, unlike the first embodiment, in which the pins on the upper surface of the component 230 are directly led out to the surface directly above the component 230 and exposed, in this embodiment, the pins on the upper surface of the component 230 are led out to the lower surface of the component 230 through the metallized holes 260, the circuit layer 270, and the frame 210, and are arranged on the same surface as the metal medium 240 on the lower surface of the component 230. When making the metallized holes 260, in addition to making the metallized holes 260 in the pin area of ​​the component 230, it is also necessary to make the metallized holes 260 in the metal frame 210 areas on both sides of the component 230.

[0071] Among them, the pins are led out through the metallized holes 260 just above the surface of the component 230. Compared with the solution of leading out the pins of the component 230 through the leads by wiring, the lead-out path is shorter, which can reduce parasitic inductance and make the signal transmission efficiency faster. In addition, the metallized holes 260 lead out the pins, and compared with the solution of lead-out, the transmission cross-section is larger and the package internal resistance is smaller, which can reduce the heat generation of the packaged product. Among them, the manufacturing process of the metallized holes 260 can be specifically to drill holes in the pin area of ​​the plastic package 250 corresponding to the component 230, and then metallize the holes. The hole metallization can be specifically performed by copper deposition and electroplating, or by burying metal parts in the holes to metallize the holes. In this embodiment, the frame 210 leaking out of one side of the packaged product acts as a pad.

[0072] S24: Remove the carrier board, make a solder mask layer, and perform cutting.

[0073] Removing the carrier 220 includes removing the adhesive plate 221 and the protective plate 222. In this embodiment, the preparation of the solder resist layer 280 is different from that in the first embodiment. In this embodiment, since the pad layer is not on the circuit layer 270, but is led out to the same surface as the metal medium 240 layer, in this embodiment, when the solder resist layer 280 is prepared, the solder resist layer 280 completely covers the plastic package 250 to protect the circuit layer 270.

[0074] Please refer to Figure 4d and Figure 4e , Figure 4d and Figure 4e yes Figure 3 Schematic diagram of the rear plate structure of S34.

[0075] Through the second embodiment, the pins of the component 230 are led out to the same side of the metal medium 240 as the component 230 through the metallized hole 260, the circuit layer 270, and the frame 210. The lead-out path is shorter than the lead-out path of the wiring method and has a smaller package internal resistance. One side of the pad is connected to the metallized hole 260, and the other side of the pad extends away from the component 230. The facing area of ​​the pad and the metal medium 240 on the back side of the component 230 can be reduced, thereby reducing the parasitic capacitance generated by the two and reducing the impact of the parasitic capacitance on the performance of the packaged product.

[0076] Correspondingly, the present application also proposes a package body, which is manufactured by the packaging method described in the above embodiment.

[0077] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent principle transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A packaging method, It is characterized in that include: Making a frame and positioning the components in the frame, wherein a carrier board is attached to one side of the frame; Making a plastic package body on one side of the carrier board where the component is positioned, and making metallized holes, through which the pins of the component are led out; A circuit layer is made on the side of the plastic package body facing away from the carrier board, and the circuit layer includes a plurality of pads, so that one side of the pad is connected to the metallized hole, and the other side of the pad extends away from the component to reduce the overlapping area of ​​the projection of the pad and the metal medium on the side of the component facing away from the pad in the thickness direction of the component.

2. The packaging method according to claim 1, It is characterized in that The steps of making the framework specifically include: A plate to be processed is obtained, a through groove is made on the plate to be processed, and the carrier is attached to one side of the plate to be processed so that the opening of one side of the through groove is covered by the carrier.

3. The packaging method according to claim 2, It is characterized in that The step of attaching the carrier plate to one side of the plate to be processed specifically includes: An adhesive plate is attached to one side of the plate to be processed, and the component is positioned in the through groove by the adhesive plate.

4. The packaging method according to claim 3, It is characterized in that After the step of making the plastic package body, the method further comprises: A protective plate is pressed onto the side to which the adhesive plate is attached.

5. The packaging method according to claim 2, It is characterized in that The step of attaching the carrier plate to one side of the plate to be processed specifically includes: An adhesive plate is attached to one side of the plate to be processed and a protective plate is pressed, and the component is positioned in the through groove through the adhesive plate.

6. The packaging method according to claim 1, It is characterized in that Also includes: removing the carrier plate; Before the step of positioning the components in the frame, the step also includes obtaining the components, wherein one side of the obtained components is made with a metal medium, and after the carrier is removed, the metal medium is exposed.

7. The packaging method according to claim 1, It is characterized in that Also includes: A blind hole is made on the pad area above the metallized hole, the blind hole penetrates the pad and leaks out of the metallized hole, and a conductive agent is injected into the blind hole so that the conductive agent is electrically connected to the pad and the conductive agent is also electrically connected to the metallized hole.

8. The packaging method according to claim 1, It is characterized in that The step of making the metallized hole specifically includes: The metallized holes are made in the pin area of ​​the plastic package corresponding to the component and the frame area on both sides of the plastic package corresponding to the component, so that the pins of the component are connected to the frame through the metallized holes, the circuit layer and the frame, and the pins of the component facing the plastic package are led out to the side of the component facing away from the plastic package.

9. The packaging method according to claim 8, It is characterized in that Also includes: A solder resist layer is manufactured so as to cover the circuit layer.

10. A package, It is characterized in that The package body is made by the packaging method according to any one of claims 1 to 9.

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