Online detection device for surface defects of semiconductor wafer

Abstract

The invention discloses an online detection device for surface defects of a semiconductor wafer, relates to the technical field of wafer detection, and solves the problems that the part, attached to a carrier ring, of the wafer is blocked by the carrier ring, and a visual detection system cannot take an image of the part, attached to the carrier ring, of the wafer, so that the detection of the surface defects of the semiconductor wafer is lack of integrity. Comprising a machine base, a machine cover is fixedly installed at the upper end of the machine base, a first detection probe is fixedly installed on the inner side of the machine cover, a second detection probe is fixedly installed in the machine base, the device further comprises a feeding mechanism used for feeding a semiconductor wafer into the machine cover for detection, and the feeding mechanism is installed at the upper end of the machine base; according to the invention, by installing the feeding mechanism and the material loading assembly, the two high-transmittance films in the material loading assembly can clamp the semiconductor wafer, so that the displacement of the wafer can be prevented, and the semiconductor wafer can be completely detected by the first detection probe and the second detection probe.

Description

Technical Field

[0001] The present invention relates to the field of wafer detection technology, in particular to an online detection device for semiconductor wafer surface defects. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its original material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing, and slicing, the silicon crystal rod forms a silicon wafer, that is, a wafer. After the semiconductor wafer is processed, it is necessary to detect whether there are defects such as cracks and scratches on the surface of the wafer. These defects may cause the performance of semiconductor devices to deteriorate or fail, so they must be discovered and handled in time during the production process.

[0003] The existing wafer surface inspection platforms on the market use an inspection table to transport the wafer to the inspection position between the upper visual system and the lower visual system, and can simultaneously image the front and back sides of the wafer, reducing the number of wafer placements and picking up times and improving wafer inspection efficiency. However, during the use of the above-mentioned device, in order for the inspection table to be able to hold semiconductor wafers while also being able to image both the front and back sides of the wafer, a carrier ring is installed on the inspection table, and a groove is provided on the upper end face of the carrier ring to ensure that the wafer can be embedded in the carrier ring through a negative pressure device. However, this means that the portion where the wafer fits the carrier ring will be blocked by the carrier ring, and the visual inspection system cannot image the portion where the wafer fits the carrier ring, resulting in a lack of completeness in the detection of surface defects on semiconductor wafers. ‌‌ Summary of the invention

[0004] The object of the present invention is to provide an online detection device for semiconductor wafer surface defects to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] The device for online detection of surface defects of semiconductor wafers comprises a machine base, a machine cover is fixedly mounted on the upper end of the machine base, a first detection probe is fixedly mounted on the inner side of the machine cover, a second detection probe is fixedly mounted inside the machine base, and the device also comprises a feeding mechanism for feeding semiconductor wafers into the machine cover for detection, the feeding mechanism is mounted on the upper end of the machine base; a loading assembly for clamping semiconductor wafers, the loading assembly is mounted on the upper side of the feeding mechanism; and a suction assembly for extracting the gas inside the loading assembly, the number of the suction assemblies is two, and the suction assemblies are symmetrically distributed.

[0007] Preferably, the feeding mechanism includes two guide rails fixedly mounted on the upper end of the machine base, two symmetrically distributed slides are movably sleeved on the outer sides of the guide rails, and the four slides are fixedly connected by connecting plates, a support column is fixedly mounted on the upper end of the slide, and two symmetrically distributed electric push rods are fixedly mounted on the outer sides of the two guide rails corresponding to the upper end of the machine base.

[0008] Preferably, the rear end of the electric push rod is fixedly connected with a connecting block, and the connecting block is fixedly connected to the sliding seat located at the rear side, two symmetrically distributed first balls are movably embedded on the inner side of the sliding seat, and the connection between the first balls and the guide rail is rolling contact.

[0009] Preferably, the loading assembly includes an upper frame and a lower frame, four support blocks are fixedly installed on the outer side of the lower frame, and the support blocks are movably embedded in the interior of the support column, the interior of the upper frame and the lower frame are fixedly embedded with an embedded frame, and a high-transmittance film is fixedly sleeved on the outer side of the embedded frame, and the high-transmittance film is made by cutting a PDMS film, and two symmetrically distributed first connecting seats are fixedly installed on the lower end of the upper frame, and connecting shafts are fixedly embedded at both ends of the first connecting seat.

[0010] Preferably, a coil spring is fixedly sleeved on the outer side of the connecting shaft, a second connecting seat is fixedly sleeved on the outer side of the coil spring, and the connection between the second connecting seat and the lower frame is a fixed connection, and the connection between the connecting shaft and the second connecting seat is a rotating connection, two symmetrically distributed arc pressure rods are installed on the rear side of the upper frame, and the connection between the arc pressure rod and the machine hood is a fixed connection, a plurality of second balls equidistantly distributed are movably embedded on the outer side of the arc pressure rod, and the connection between the second ball and the upper frame is rolling contact, a bent support rod is fixedly installed on the upper end of the machine base corresponding to the lower side of the arc pressure rod, and the bent support rod is in sliding contact with the lower end surface of the lower frame.

[0011] Preferably, a support assembly for supporting the support block is installed inside the support column, and the support assembly includes a gasket movably abutted against the lower end surface of the support block, a first spring is fixedly installed on the lower end of the gasket, a support block is installed on the lower side of the lower frame, and the support block is fixedly installed on the upper end of the base through a positioning rod.

[0012] Preferably, the upper end surface of the support block is movably abutted against the limit plate, and the connection between the limit plate and the support column is a plug-in connection, and the end of the limit plate away from the support block is fixedly connected with a baffle corresponding to the outer side of the support column, and two symmetrically distributed magnetic blocks are fixedly embedded on the side of the support column close to the baffle, and the connection between the magnetic block and the baffle is a movable magnetic attraction, and a shift block is fixedly embedded on the upper side of the end of the limit plate away from the baffle.

[0013] Preferably, the suction assembly includes two symmetrically distributed hard tubes fixedly embedded between the upper frame and the lower frame, and a strip groove is opened on one side of the two hard tubes close to each other. Two symmetrically distributed rings are fixedly sleeved on the outer side of the hard tube, and the rings are movably connected to the upper frame and the lower frame respectively through semicircular embedding grooves, and an embedding block is fixedly installed on the lower end of the ring, and the connection between the embedding block and the lower frame is a plug-in connection.

[0014] Preferably, a conduit communicating with the hard tube is fixedly installed at the rear end of the hard tube, and a sleeve is fixedly connected to the end of the conduit away from the hard tube, a piston is movably embedded in the sleeve, a connecting rod is fixedly embedded at the rear end center of the piston, a shift plate is fixedly connected to the end of the connecting rod located outside the sleeve, and the shift plate and the connecting block are connected in a movable abutment manner.

[0015] Preferably, a telescopic rod is fixedly installed on the side of the shift plate away from the connecting rod, and the connection between the rear end of the telescopic rod and the hood is a fixed connection, a second spring is movably sleeved on the outer side of the telescopic rod, a bending guide rod is fixedly installed on the inside of the hood corresponding to the upper side of the conduit, a plurality of buckles distributed at equal distances are fixedly sleeved on the outer side of the conduit, and the buckles are movably sleeved on the outer side of the bending guide rod.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. The present invention installs a feeding mechanism and a loading assembly. When the electric push rod in the feeding mechanism drives the loading assembly to move toward the inside of the machine cover, the two high-transmittance films can clamp the semiconductor wafer due to the high transparency and elasticity of the high-transmittance films, and can prevent the wafer from being displaced during the process of the first detection probe and the second detection probe detecting the wafer. The high-transmittance film will not hinder the first detection probe and the second detection probe from taking images, which is conducive to the first detection probe and the second detection probe to completely detect the semiconductor wafer.

[0018] 2. The present invention installs a support component. After the wafer inspection is completed, the lower frame is pressed to move downward, so that the support block supports the semiconductor wafer, which is conducive to the edge of the semiconductor wafer quickly detaching from the high-transmittance film, thereby facilitating personnel to quickly remove the inspected semiconductor wafer from the high-transmittance film.

[0019] 3. The present invention installs a suction component. When the feeding mechanism delivers the semiconductor wafer to the inside of the machine cover for inspection through the loading component, the hard tube in the suction component will suck the gas between the two high-transmittance films into the sleeve, so that the two high-transmittance films can fit tightly with the semiconductor wafer, which is beneficial for the edge of the semiconductor wafer to protrude more clearly, and is beneficial for the first detection probe and the second detection probe to detect the edge of the semiconductor wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 It is a schematic diagram of the side section structure of the machine base and the machine cover of the present invention;

[0022] Figure 3 This is a schematic diagram of the present invention with the base and cover removed;

[0023] Figure 4 It is a schematic diagram of the connection state between the feeding mechanism and the material loading assembly of the present invention;

[0024] Figure 5 It is a schematic diagram of the disassembly state of the material loading assembly and the material feeding mechanism of the present invention;

[0025] Figure 6 This is a schematic diagram of the disassembly state of the material loading assembly of the present invention;

[0026] Figure 7 It is a schematic diagram of the three-dimensional structure of the support column of the present invention;

[0027] Figure 8 It is a schematic diagram of the overall structure of the suction assembly of the present invention.

[0028] In the figure: 1, machine base; 2, machine cover; 3, first detection probe; 4, second detection probe; 5, guide rail; 6, slide seat; 7, support column; 8, connection block; 9, electric push rod; 10, first ball; 11, upper frame; 12, lower frame; 13, support block; 14, embedded frame; 15, high-transmittance film; 16, first connection seat; 17, connection shaft; 18, coil spring; 19, second connection seat; 20, arc pressure rod; 21, second ball; 22 , gasket; 23, first spring; 24, support block; 25, positioning rod; 26, limit plate; 27, baffle; 28, magnetic block; 29, shift block; 30, hard tube; 31, strip groove; 32, collar; 33, embedded block; 34, guide tube; 35, sleeve; 36, piston; 37, connecting rod; 38, shift plate; 39, telescopic rod; 40, second spring; 41, bent guide rod; 42, buckle; 43, semicircular embedded groove; 44, bent support rod. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] Example 1: Please refer to Figure 1-Figure 4 , Figure 6 The semiconductor wafer surface defect online detection device shown in the figure includes a base 1, a hood 2 is fixedly installed on the upper end of the base 1, a first detection probe 3 is fixedly installed on the inner side of the hood 2, and the first detection probe 3 is used to detect the upper end surface of the semiconductor wafer. A second detection probe 4 is fixedly installed inside the base 1, and the second detection probe 4 is used to detect the lower end surface of the semiconductor wafer. It also includes a feeding mechanism for feeding the semiconductor wafer into the hood 2 for detection, and the feeding mechanism is installed at the upper end of the base 1.

[0031] The feeding mechanism includes two guide rails 5 fixedly mounted on the upper end of the machine base 1, and two symmetrically distributed slides 6 are movably sleeved on the outer side of the guide rails 5, and the four slides 6 are fixedly connected by a connecting plate. The guide rails 5 can support the slides 6 while limiting the moving path of the slides 6. A support column 7 is fixedly mounted on the upper end of the slide 6, and two symmetrically distributed electric push rods 9 are fixedly mounted on the outer sides of the two guide rails 5 at the upper end of the machine base 1.

[0032] The rear end of the electric push rod 9 is fixedly connected to a connecting block 8, and the connecting block 8 is fixedly connected to the slide 6 located on the rear side. The electric push rod 9 can drive the four slides 6 to move on the guide rail 5 through the connecting block 8. Two symmetrically distributed first balls 10 are movably embedded on the inner side of the slide 6, and the connection between the first balls 10 and the guide rail 5 is rolling contact. The first balls 10 are used to reduce the friction resistance between the slide 6 and the guide rail 5.

[0033] The loading assembly is used to clamp the semiconductor wafer. The loading assembly is installed on the upper side of the feeding mechanism. The loading assembly includes an upper frame 11 and a lower frame 12. Four support blocks 13 are fixedly installed on the outer side of the lower frame 12, and the support blocks 13 are movably embedded in the interior of the support column 7. The support column 7 can support the loading assembly through the support blocks 13. The interior of the upper frame 11 and the lower frame 12 are fixedly embedded with an embedded frame 14. The outer side of the embedded frame 14 is fixedly sleeved with a high-transmittance film 15. The embedded frame 14 is used to assist the high-transmittance film 15 to unfold smoothly. The high-transmittance film 15 is made of PDMS film. The PDMS film has high light transmittance and good elasticity and resilience, which is beneficial for the first detection probe 3 and the second detection probe 4 to completely image the semiconductor wafer. The lower end of the upper frame 11 is fixedly installed with two symmetrically distributed first connecting seats 16, and both ends of the first connecting seat 16 are fixedly embedded with connecting shafts 17.

[0034] The outer side of the connecting shaft 17 is fixedly sleeved with a coil spring 18, and the outer side of the coil spring 18 is fixedly sleeved with a second connecting seat 19, and the connection between the second connecting seat 19 and the lower frame 12 is a fixed connection, and the connection between the connecting shaft 17 and the second connecting seat 19 is a rotational connection. The coil spring 18 can drive the upper frame 11 to rotate and open through the first connecting seat 16, the connecting shaft 17 and the second connecting seat 19. Two symmetrically distributed arc-shaped pressure rods 20 are installed on the rear side of the upper frame 11, and the connection between the arc-shaped pressure rod 20 and the hood 2 is a fixed connection. The arc-shaped pressure rod 20 can be rotated on the upper frame. During the backward movement of 11, it is determined that the upper frame 11 is rotated and closed, and a plurality of second balls 21 distributed at equal distances are movably embedded on the outer side of the arc pressure rod 20, and the connection between the second balls 21 and the upper frame 11 is rolling contact. The second balls 21 are used to reduce the friction between the upper frame 11 and the arc pressure rod 20. A bent support rod 44 is fixedly installed on the upper end of the machine base 1 corresponding to the lower side of the arc pressure rod 20, and the bent support rod 44 is in sliding contact with the lower end surface of the lower frame 12. During the process of the loading assembly entering the interior of the hood 2, the bent support rod 44 is used to prevent the lower frame 12 from moving downward.

[0035] Example 2: Please refer to Figure 5 , Figure 7This embodiment further explains the first embodiment. A support assembly for supporting the support block 13 is installed inside the support column 7. The support assembly includes a gasket 22 that is movably abutted against the lower end surface of the support block 13. A first spring 23 is fixedly installed at the lower end of the gasket 22. The first spring 23 can drive the support block 13 to move upward through the gasket 22. A support block 24 is installed on the lower side of the lower frame 12, and the support block 24 is fixedly installed on the upper end of the machine base 1 through a positioning rod 25. The support block 24 can support the semiconductor wafer on the high-transmittance film 15 through the positioning rod 25.

[0036] Example 3: Please refer to Figure 7 , this embodiment further explains the second embodiment, the upper end surface of the support block 13 is movably abutted against the limit plate 26, and the connection method between the limit plate 26 and the support column 7 is a plug-in connection, the limit plate 26 is used to prevent the support block 13 from separating from the support column 7, and the end of the limit plate 26 away from the support block 13 is fixedly connected with a baffle 27 on the outer side of the support column 7, and two symmetrically distributed magnetic blocks 28 are fixedly embedded on the side of the support column 7 close to the baffle 27, and the connection method between the magnetic blocks 28 and the baffle 27 is active magnetic attraction. The magnetic blocks 28 can position the limit plate 26 through the baffle 27, and a shift block 29 is fixedly embedded on the upper side of the end of the limit plate 26 away from the baffle 27, and the shift block 29 facilitates the movement of the limit plate 26.

[0037] Example 4: Please refer to Figure 3 , Figure 8 , this embodiment further explains the first embodiment, the suction assembly is used to extract the gas inside the loading assembly, the number of the suction assemblies is two groups, and they are symmetrically distributed, the suction assembly includes two hard tubes 30 fixedly embedded between the upper frame 11 and the lower frame 12, the two hard tubes 30 are close to each other and have a strip groove 31 on one side, the strip groove 31 facilitates the gas to enter the inside of the hard tube 30, the outer side of the hard tube 30 is fixedly sleeved with two symmetrically distributed rings 32, and the rings 32 are movably connected to the upper frame 11 and the lower frame 12 through semicircular embedding grooves 43, the lower end of the ring 32 is fixedly installed with an embedding block 33, and the connection between the embedding block 33 and the lower frame 12 is a plug-in connection, the ring 32 is stuck in the semicircular embedding groove 43 on the lower frame 12 through the embedding block 33, so as to position the hard tube 30.

[0038] A conduit 34 that is interconnected with the hard tube 30 is fixedly installed at the rear end thereof, and a sleeve 35 is fixedly connected to one end of the conduit 34 away from the hard tube 30, and a piston 36 is movably embedded inside the sleeve 35, and a connecting rod 37 is fixedly embedded at the rear end center of the piston 36, and a paddle 38 is fixedly connected to one end of the connecting rod 37 located outside the sleeve 35, and the paddle 38 is connected to the connecting block 8 in a movable abutment manner. When the connecting block 8 moves backward, it can abut against the paddle 38 to drive the piston 36 to move backward in the sleeve 35, and when the piston 36 moves backward in the sleeve 35, it can extract the gas between the two high-transmittance films 15 through the conduit 34 and the hard tube 30.

[0039] A telescopic rod 39 is fixedly installed on the side of the paddle plate 38 away from the connecting rod 37, and the rear end of the telescopic rod 39 is connected to the hood 2 in a fixed manner. A second spring 40 is movably sleeved on the outer side of the telescopic rod 39. The telescopic rod 39 is used to prevent the second spring 40 from bending. The second spring 40 can drive the piston 36 to move back inside the sleeve 35 through the paddle plate 38. A bending guide rod 41 is fixedly installed on the upper side of the corresponding conduit 34 inside the hood 2, and a plurality of buckles 42 distributed at equal distances are fixedly sleeved on the outer side of the conduit 34, and the buckle 42 is movably sleeved on the outer side of the bending guide rod 41. The bending guide rod 41 can hang the conduit 34 through the plurality of buckles 42 to prevent the conduit 34 from being entangled on other structures.

[0040] Working principle: When testing semiconductor wafers, the personnel first place the semiconductor wafer in the middle of the high-transmittance film 15 on the lower frame 12, and then control the electric push rod 9 to operate. The electric push rod 9 drives the slide 6, the loading assembly and the semiconductor wafer to enter the interior of the machine cover 2 through the connecting block 8. In the process of the loading assembly moving with the slide 6, the bent support rod 44 will first slide in contact with the lower frame 12 to prevent the lower frame 12 from moving downward. Then the arc pressure rod 20 will drive the upper frame 11 to rotate and close through its curved portion and multiple second balls 21, so that the high-transmittance films 15 on the upper frame 11 and the lower frame 12 respectively clamp the upper and lower surfaces of the semiconductor wafer, which can have It can effectively prevent the wafer from being displaced and affecting the detection result during the detection of the semiconductor wafer by the first detection probe 3 and the second detection probe 4, and because the high-transmittance film 15 is made of PDMS film, the high-transmittance film 15 has high light transmittance and good elasticity and resilience, so that the high-transmittance film 15 and the semiconductor wafer are attached without hindering the first detection probe 3 and the second detection probe 4 from taking images, which is beneficial for the first detection probe 3 and the second detection probe 4 to completely detect the semiconductor wafer. During the detection process, the first detection probe 3 and the second detection probe 4 can adjust their positions through the displacement mechanism (the displacement mechanism belongs to the existing public technology and will not be described here).

[0041] After the semiconductor wafer inspection is completed, the electric push rod 9 drives the loading assembly to move out of the machine cover 2. During this process, the upper frame 11 will automatically rotate and open under the drive of the coil spring 18. When the loading mechanism moves to the loading and unloading station, the lower frame 12 will be separated from the bent support rod 44. When the personnel remove the semiconductor wafer after the inspection, because the semiconductor wafer is thin and brittle, and the high-transmittance film 15 is elastic, when the personnel press one side of the wafer to tilt the wafer, the high-transmittance film 15 will still fit with the wafer, and when the semiconductor wafer is slid, the edge of the wafer will be blocked by the lower frame 12, so it is inconvenient to directly remove the wafer from the high-transmittance film 15. Therefore, at this time, the personnel can press the lower frame 12 to make the lower frame 12 drive the high-transmittance film 15 to move downward (according to Figure 3 and Figure 4 As shown, a bending portion is provided between the conduit 34 and the first buckle 42, so that the hard tube 30 can move downward with the lower frame 12 through the bending portion. The semiconductor wafer is supported by the support block 24 so that the edge of the semiconductor wafer can quickly detach from the high-transmittance film 15, thereby facilitating and quickly removing the wafer on the high-transmittance film 15, and effectively avoiding damage to the semiconductor wafer.

[0042] When the loading assembly clamps the semiconductor wafer and enters the hood 2, the connecting block 8 will press against the paddle 38 and drive the piston 36 to move backward in the sleeve 35 through the paddle 38. At this time, the inside of the sleeve 35 will be in a negative pressure state, and the gas between the two high-transmittance membranes 15 will be sucked into the sleeve 35 through the hard tube 30 and the conduit 34, which can make the two high-transmittance membranes 15 fit tightly with the semiconductor wafer, thereby facilitating the edge of the semiconductor wafer to protrude more clearly, and facilitating the first detection probe 3 and the second detection probe 4 to detect the edge of the semiconductor wafer.

[0043] When the loading assembly needs to be replaced, the personnel first removes the hard tube 30 from the lower frame 12, and then moves the limit plate 26 through the shift block 29 to release the restriction of the limit plate 26 on the support block 13. At this time, the support block 13 can be easily moved out from the inside of the support column 7. After installing the new loading assembly, the personnel pushes the baffle 27 to move the limit plate 26 back and reset it. The magnetic block 28 positions the limit plate 26 by adsorbing the baffle 27, and then inserts the embedding block 33 on the outside of the hard tube 30 into the corresponding semicircular embedding groove 43 on the lower frame 12.

[0044] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0045] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An online detection device for semiconductor wafer surface defects, comprising a machine base (1), a cover (2) being installed on the upper end of the machine base (1), a first detection probe (3) being installed on the inner side of the cover (2), and a second detection probe (4) being installed inside the machine base (1), characterized in that: Also includes: A feeding mechanism, used for feeding semiconductor wafers into the machine cover (2) for testing, the feeding mechanism being mounted on the upper end of the machine base (1); A loading assembly, used for clamping the semiconductor wafer, wherein the loading assembly is installed on the upper side of the feeding mechanism; The suction assembly is used to extract the gas inside the carrier assembly. The suction assembly is provided in two groups and is symmetrically distributed.

2. The semiconductor wafer surface defect online detection device according to claim 1, characterized in that: The feeding mechanism comprises a guide rail (5), the outer side of the guide rail (5) is sleeved with two slide seats (6), the upper end of the slide seat (6) is mounted with a support column (7), and the upper end of the machine base (1) is mounted with two electric push rods (9).

3. The semiconductor wafer surface defect online detection device according to claim 2, characterized in that: The rear end of the electric push rod (9) is connected to a connecting block (8), and two first balls (10) are embedded inside the sliding seat (6).

4. The semiconductor wafer surface defect online detection device according to claim 3, characterized in that: The material loading assembly comprises an upper frame (11) and a lower frame (12); four support blocks (13) are installed on the outer side of the lower frame (12), and the support blocks (13) are embedded in the support column (7); an embedding frame (14) is embedded in the inner side of the upper frame (11) and the lower frame (12); a high-transmittance film (15) is sleeved on the outer side of the embedding frame (14); two first connecting seats (16) are installed at the lower end of the upper frame (11), and connecting shafts (17) are embedded at both ends of the first connecting seat (16).

5. The semiconductor wafer surface defect online detection device according to claim 4, characterized in that: A coil spring (18) is sleeved on the outer side of the connecting shaft (17), a second connecting seat (19) is sleeved on the outer side of the coil spring (18), and the second connecting seat (19) is connected to the lower frame (12) in a fixed manner. Two arc-shaped pressure rods (20) are installed on the rear side of the upper frame (11), and a plurality of second balls (21) are embedded on the outer side of the arc-shaped pressure rods (20). A bent support rod (44) is installed on the upper end of the machine base (1), and the bent support rod (44) is in sliding contact with the lower end surface of the lower frame (12).

6. The semiconductor wafer surface defect online detection device according to claim 4, characterized in that: A support assembly is installed inside the support column (7), the support assembly comprising a gasket (22), a first spring (23) is installed at the lower end of the gasket (22), a support block (24) is installed at the lower side of the lower frame (12), and the support block (24) is fixedly installed on the upper end of the machine base (1) via a positioning rod (25).

7. The semiconductor wafer surface defect online detection device according to claim 4, characterized in that: The upper end surface of the support block (13) abuts against a limit plate (26), one end of the limit plate (26) is connected to a baffle (27), one side of the support column (7) is embedded with two magnetic blocks (28), and the upper side of one end of the limit plate (26) is embedded with a shift block (29).

8. The semiconductor wafer surface defect online detection device according to claim 4, characterized in that: The suction assembly comprises two hard tubes (30), one side of the two hard tubes (30) being close to each other and having a strip groove (31), the outer sides of the hard tubes (30) being sleeved with two sleeve rings (32), and the lower ends of the sleeve rings (32) being mounted with an insert (33).

9. The semiconductor wafer surface defect online detection device according to claim 8, characterized in that: A guide tube (34) is installed at the rear end of the hard tube (30), one end of the guide tube (34) is connected to a sleeve (35), a piston (36) is embedded in the sleeve (35), a connecting rod (37) is embedded at the rear end of the piston (36), one end of the connecting rod (37) is connected to a shift plate (38), and the shift plate (38) and the connecting block (8) are connected in a movable abutment manner.

10. The semiconductor wafer surface defect online detection device according to claim 9, characterized in that: A telescopic rod (39) is installed on one side of the shift plate (38), a second spring (40) is sleeved on the outer side of the telescopic rod (39), a bending guide rod (41) is installed inside the hood (2), a plurality of buckles (42) are sleeved on the outer side of the guide tube (34), and the buckles (42) are sleeved on the outer side of the bending guide rod (41).

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