Online Detection Device for Surface Defects of Semiconductor Wafers

Abstract

The present invention discloses an on-line detection device for surface defects of semiconductor wafers, which relates to the technical field of wafer detection. It solves the problem that the part where the wafer is attached to the carrier ring is blocked by the carrier ring, and the vision detection system cannot image the part where the wafer is attached to the carrier ring, resulting in a lack of integrity in the detection of surface defects of semiconductor wafers. The device includes a machine base, on the upper end of which a machine cover is fixedly installed. Inside the machine cover, a first detection probe is fixedly installed. Inside the machine base, a second detection probe is fixedly installed. It also includes a feeding mechanism for feeding the semiconductor wafer into the machine cover for detection, and the feeding mechanism is installed on the upper end of the machine base. By installing the feeding mechanism and the material loading component, the two high-transparency films in the material loading component can clamp the semiconductor wafer, prevent the wafer from displacement, and facilitate the first detection probe and the second detection probe to completely detect the semiconductor wafer.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer detection, and particularly to an on-line detection device for surface defects of semiconductor wafers. Background Art

[0002] A wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits, and its raw material is silicon. High-purity polysilicon is dissolved and doped with a silicon crystal seed, and then slowly pulled out to form a cylindrical single-crystal silicon. After the silicon ingot is ground, polished, and sliced, a silicon wafer is formed, that is, a wafer. After the semiconductor wafer is processed, it is necessary to detect whether there are defects such as cracks and scratches on the surface of the wafer. These defects may cause a decline or failure in the performance of semiconductor devices. Therefore, they must be detected and processed in a timely manner during the production process.

[0003] The existing wafer surface detection platforms on the market transport the wafer to the detection position between the upper vision system and the lower vision system through a detection table, and can simultaneously image the front and back sides of the wafer, reducing the number of pick-and-place operations for the wafer and improving the wafer detection efficiency. However, during the use of the above device, in order for the detection table to hold the semiconductor wafer and at the same time image the front and back sides of the wafer, a carrier ring is installed on the detection table, and a groove is opened on the upper end surface of the carrier ring to ensure that the wafer can be embedded on the carrier ring through a negative pressure device. However, this means that the part of the wafer that fits with the carrier ring will be blocked by the carrier ring, and the vision detection system cannot image the part of the wafer that fits with the carrier ring, resulting in a lack of integrity in the detection of surface defects of the semiconductor wafer. Summary of the Invention

[0004] The purpose of the present invention is to provide an on-line detection device for surface defects of semiconductor wafers to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the present invention provides the following technical solutions:

[0006] An on-line detection device for surface defects of semiconductor wafers includes a machine base, an engine hood is fixedly installed at the upper end of the machine base, a first detection probe is fixedly installed inside the engine hood, a second detection probe is fixedly installed inside the machine base, and further includes a feeding mechanism for feeding the semiconductor wafer into the engine hood for detection, the feeding mechanism is installed at the upper end of the machine base; a material loading component for clamping the semiconductor wafer, the material loading component is installed on the upper side of the feeding mechanism; a suction component for pumping out the gas inside the material loading component, the number of the suction components is two groups and they are symmetrically distributed.

[0007] Preferably, the feeding mechanism includes two guide rails fixedly installed at the upper end of the machine base. Two symmetrically distributed sliding seats are movably sleeved on the outer sides of the guide rails, and the four sliding seats are fixedly connected by a connecting plate. A support column is fixedly installed at the upper end of the sliding seat. Two symmetrically distributed electric push rods are fixedly installed at the upper end of the machine base corresponding to the outer sides of the two guide rails.

[0008] Preferably, a connecting block is fixedly connected to the rear end of the electric push rod, and the connecting block is fixedly connected to the sliding seat located at the rear side. Two symmetrically distributed first ball bearings are movably embedded in the inner side of the sliding seat, and the connection mode between the first ball bearing and the guide rail is rolling contact.

[0009] Preferably, the loading component includes an upper frame and a lower frame. Four support blocks are fixedly installed on the outer side of the lower frame, and the support blocks are movably embedded in the interior of the support column. Embedding frames are fixedly embedded in the interiors of the upper frame and the lower frame. A high-permeability film is fixedly sleeved on the outer side of the embedding frame. The high-permeability film is cut from a PDMS film. Two symmetrically distributed first connecting seats are fixedly installed at the lower end of the upper frame, and connecting shafts are fixedly embedded at both ends of the first connecting seat.

[0010] Preferably, a coil spring is fixedly sleeved on the outer side of the connecting shaft. A second connecting seat is fixedly sleeved on the outer side of the coil spring, and the connection mode between the second connecting seat and the lower frame is fixed connection. The connection mode between the connecting shaft and the second connecting seat is rotational connection. Two symmetrically distributed arc-shaped pressing rods are installed at the rear side of the upper frame, and the connection mode between the arc-shaped pressing rod and the machine cover is fixed connection. A plurality of second ball bearings are movably embedded on the outer side of the arc-shaped pressing rod at equidistant distribution, and the connection mode between the second ball bearing and the upper frame is rolling contact. A bent supporting rod is fixedly installed at the upper end of the machine base corresponding to the lower side of the arc-shaped pressing rod, and the bent supporting rod is in sliding contact with the lower end surface of the lower frame.

[0011] Preferably, a support component for supporting the support block is installed inside the support column. The support component includes a gasket that movably abuts against the lower end surface of the support block. A first spring is fixedly installed at the lower end of the gasket. A support block is installed at the lower side of the lower frame, and the support block is fixedly installed at the upper end of the machine base through a positioning rod.

[0012] Preferably, the upper end surface of the support block is movably abutted against a limit plate, and the connection between the limit plate and the support column is a plug-in connection. One end of the limit plate away from the support block is fixedly connected with a baffle corresponding to the outside of the support column. Two symmetrically distributed magnetic attraction blocks are fixedly embedded on one side of the support column close to the baffle, and the connection between the magnetic attraction block and the baffle is a movable magnetic attraction. A dial block is fixedly embedded on the upper side of one end of the limit plate away from the baffle.

[0013] Preferably, the suction assembly includes two symmetrically distributed rigid tubes fixedly embedded between the upper frame and the lower frame. A strip-shaped groove is formed on one side of the two rigid tubes close to each other. Two symmetrically distributed collar rings are fixedly sleeved on the outside of the rigid tubes, and the collar rings are movably clamped with the upper frame and the lower frame through semi-circular embedded grooves respectively. An embedded block is fixedly installed at the lower end of the collar ring, and the connection between the embedded block and the lower frame is a plug-in connection.

[0014] Preferably, a conduit communicated with the rigid tube is fixedly installed at the rear end of the rigid tube. One end of the conduit away from the rigid tube is fixedly connected with a sleeve. A piston is movably embedded in the sleeve. A connecting rod is fixedly embedded at the center of the rear end of the piston. One end of the connecting rod located outside the sleeve is fixedly connected with a dial plate, and the connection between the dial plate and the connecting block is a movable abutment.

[0015] Preferably, a telescopic rod is fixedly installed on one side of the dial plate away from the connecting rod, and the connection between the rear end of the telescopic rod and the machine cover is a fixed connection. A second spring is movably sleeved on the outside of the telescopic rod. A bent guide rod is fixedly installed inside the machine cover corresponding to the upper side of the conduit. A plurality of equidistantly distributed buckle sleeves are fixedly sleeved on the outside of the conduit, and the buckle sleeves are movably sleeved on the outside of the bent guide rod.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0017] 1. By installing a feeding mechanism and a loading component, when the electric push rod in the feeding mechanism drives the loading component to move into the machine cover, under the high transparency and elastic properties of the high-transparency film, two high-transparency films can clamp the semiconductor wafer, which can prevent the wafer from shifting during the detection of the wafer by the first detection probe and the second detection probe, and the high-transparency film does not hinder the imaging of the first detection probe and the second detection probe, which is beneficial for the first detection probe and the second detection probe to completely detect the semiconductor wafer.

[0018] 2. After the wafer is detected, the present invention installs a support component. By pressing the lower frame, the lower frame moves downward, and the support block supports the semiconductor wafer, which is beneficial for the edge of the semiconductor wafer to quickly separate from the high-transparency film, thus facilitating the operator to quickly remove the detected semiconductor wafer from the high-transparency film.

[0019] 3. During the process that the feeding mechanism sends the semiconductor wafer into the hood for detection through the loading component, the hard tube in the suction component will suck the gas between the two high-transparency films into the sleeve, enabling the two high-transparency films to closely fit the semiconductor wafer, which is beneficial for the edge of the semiconductor wafer to be more clearly protruded, and is conducive to the first detection probe and the second detection probe to detect the edge of the semiconductor wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 is a schematic diagram of the side-sectional structure of the machine base and the hood of the present invention;

[0022] Figure 3 is a schematic diagram of the state where the machine base and the hood are removed in the present invention;

[0023] Figure 4 is a schematic diagram of the connection state between the feeding mechanism and the loading component of the present invention;

[0024] Figure 5 is a schematic diagram of the split state between the loading component and the feeding mechanism of the present invention;

[0025] Figure 6 is a schematic diagram of the split state of the loading component of the present invention;

[0026] Figure 7 is a schematic diagram of the side-sectional three-dimensional structure of the support column of the present invention;

[0027] Figure 8 is a schematic diagram of the overall structure of the suction component of the present invention.

[0028] In the figure: 1, machine base; 2, machine cover; 3, first detection probe; 4, second detection probe; 5, guide rail; 6, sliding seat; 7, support column; 8, connecting block; 9, electric push rod; 10, first ball; 11, upper frame; 12, lower frame; 13, support block; 14, inlay frame; 15, high-transparency film; 16, first connection seat; 17, connecting shaft; 18, coil spring; 19, second connection seat; 20, arc-shaped pressing rod; 21, second ball; 22, gasket; 23, first spring; 24, supporting block; 25, positioning rod; 26, limiting plate; 27, baffle; 28, magnetic attraction block; 29, dialing block; 30, rigid tube; 31, strip-shaped groove; 32, collar; 33, inlay block; 34, conduit; 35, sleeve; 36, piston; 37, connecting rod; 38, dialing plate; 39, telescopic rod; 40, second spring; 41, bent guide rod; 42, sleeve buckle; 43, semi-circular inlay groove; 44, bent supporting rod. Detailed implementation manner

[0029] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0030] Embodiment 1: Please refer to Figures 1 - 4 , Figure 6 , in the illustrated on-line semiconductor wafer surface defect detection device, including a machine base 1, a machine cover 2 is fixedly installed at the upper end of the machine base 1, a first detection probe 3 is fixedly installed inside the machine cover 2, the first detection probe 3 is used to detect the upper end surface of the semiconductor wafer, a second detection probe 4 is fixedly installed inside the machine base 1, the second detection probe 4 is used to detect the lower end surface of the semiconductor wafer, and a feeding mechanism is further included, which is used to feed the semiconductor wafer into the machine cover 2 for detection, and the feeding mechanism is installed at the upper end of the machine base 1.

[0031] The feeding mechanism includes two guide rails 5 fixedly installed at the upper end of the machine base 1, two symmetrically distributed sliding seats 6 are movably sleeved outside the guide rails 5, and the four sliding seats 6 are fixedly connected by a connecting plate. While the guide rails 5 support the sliding seats 6, they can limit the moving path of the sliding seats 6. A support column 7 is fixedly installed at the upper end of the sliding seat 6, and two symmetrically distributed electric push rods 9 are fixedly installed at the upper end of the machine base 1 corresponding to the outside of the two guide rails 5.

[0032] A connecting block 8 is fixedly connected to the rear end of the electric push rod 9, and the connecting block 8 is fixedly connected to the rear slide block 6. The electric push rod 9 can drive the four slide blocks 6 to move on the guide rail 5 through the connecting block 8. Two symmetrically distributed first ball bearings 10 are movably embedded in the inner side of the slide block 6, and the connection between the first ball bearings 10 and the guide rail 5 is a rolling contact. The first ball bearings 10 are used to reduce the frictional resistance between the slide block 6 and the guide rail 5.

[0033] A material loading assembly for clamping a semiconductor wafer. The material loading assembly is installed on the upper side of the feeding mechanism. The material loading assembly includes an upper frame 11 and a lower frame 12. Four support blocks 13 are fixedly installed on the outer side of the lower frame 12, and the support blocks 13 are movably embedded in the inside of the support columns 7. The support columns 7 can support the material loading assembly through the support blocks 13. Embedding frames 14 are fixedly embedded in both the upper frame 11 and the lower frame 12. A high-transparency film 15 is fixedly sleeved on the outer side of the embedding frame 14. The embedding frame 14 is used to assist the high-transparency film 15 to unfold flatly. The high-transparency film 15 is cut from a PDMS film. The PDMS film has high light transmittance, good elasticity and resilience performance, which is beneficial for the first detection probe 3 and the second detection probe 4 to take a complete image of the semiconductor wafer. Two symmetrically distributed first connection seats 16 are fixedly installed at the lower end of the upper frame 11, and connection shafts 17 are fixedly embedded at both ends of the first connection seats 16.

[0034] A coil spring 18 is fixedly sleeved on the outer side of the connection shaft 17. A second connection seat 19 is fixedly sleeved on the outer side of the coil spring 18, and the connection between the second connection seat 19 and the lower frame 12 is a fixed connection. The connection between the connection shaft 17 and the second connection seat 19 is a rotational connection. The coil spring 18 can drive the upper frame 11 to rotate and open through the first connection seat 16, the connection shaft 17 and the second connection seat 19. Two symmetrically distributed arc-shaped pressing rods 20 are installed at the rear side of the upper frame 11, and the connection between the arc-shaped pressing rods 20 and the machine cover 2 is a fixed connection. The arc-shaped pressing rods 20 can determine the rotation and closing of the upper frame 11 during the backward movement of the upper frame 11. A plurality of equidistantly distributed second ball bearings 21 are movably embedded on the outer side of the arc-shaped pressing rods 20, and the connection between the second ball bearings 21 and the upper frame 11 is a rolling contact. The second ball bearings 21 are used to reduce the friction between the upper frame 11 and the arc-shaped pressing rods 20. A bent supporting rod 44 is fixedly installed at the upper end of the machine base 1 corresponding to the lower side of the arc-shaped pressing rod 20, and the bent supporting rod 44 is in sliding contact with the lower end surface of the lower frame 12. During the process of the material loading assembly entering the inside of the machine cover 2, the bent supporting rod 44 is used to block the downward movement of the lower frame 12.

[0035] Example 2: Please refer to Figure 5 、 Figure 7, This embodiment further elaborates on Embodiment 1. A support assembly for supporting the support block 13 is installed inside the support column 7. The support assembly includes a gasket 22 that is movably abutted against the lower end face of the support block 13. A first spring 23 is fixedly installed at the lower end of the gasket 22. The first spring 23 can drive the support block 13 to move upward through the gasket 22. A support block 24 is installed on the lower side of the lower frame 12, and the support block 24 is fixedly installed at the upper end of the machine base 1 through a positioning rod 25. The support block 24 can support the semiconductor wafer on the high-transparency film 15 through the positioning rod 25.

[0036] Embodiment 3: Please refer to Figure 7 , This embodiment further elaborates on Embodiment 2. A limiting plate 26 is movably abutted against the upper end face of the support block 13, and the connection between the limiting plate 26 and the support column 7 is a plug-in connection. The limiting plate 26 is used to prevent the support block 13 from detaching from the support column 7. One end of the limiting plate 26 away from the support block 13 is fixedly connected to the outside of the support column 7 corresponding to a baffle 27. Two magnet attracting blocks 28 are symmetrically distributed and fixedly embedded on one side of the support column 7 close to the baffle 27, and the connection between the magnet attracting blocks 28 and the baffle 27 is a movable magnetic attraction. The magnet attracting blocks 28 can position the limiting plate 26 through the baffle 27. A dial block 29 is fixedly embedded on the upper side of one end of the limiting plate 26 away from the baffle 27, and the dial block 29 facilitates the movement of the limiting plate 26.

[0037] Embodiment 4: Please refer to Figure 3 , Figure 8 , This embodiment further elaborates on Embodiment 1. A suction assembly is used to extract the gas inside the material loading assembly. The number of the suction assemblies is two groups and they are symmetrically distributed. The suction assembly includes two hard pipes 30 fixedly embedded between the upper frame 11 and the lower frame 12. A strip-shaped groove 31 is opened on one side where the two hard pipes 30 are close to each other, and the strip-shaped groove 31 facilitates the gas to enter the inside of the hard pipes 30. Two symmetrically distributed collar rings 32 are fixedly sleeved on the outside of the hard pipes 30, and the collar rings 32 are movably clamped with the upper frame 11 and the lower frame 12 through semi-circular embedded grooves 43 respectively. A block 33 is fixedly installed at the lower end of the collar ring 32, and the connection between the block 33 and the lower frame 12 is a plug-in connection. The collar ring 32 is clamped in the semi-circular embedded groove 43 on the lower frame 12 through the block 33, and can position the hard pipe 30.

[0038] A conduit 34 is fixedly installed at the rear end of the rigid tube 30 and is interconnected with it. One end of the conduit 34 away from the rigid tube 30 is fixedly connected to a sleeve 35. A piston 36 is movably embedded inside the sleeve 35. A connecting rod 37 is fixedly embedded at the center of the rear end of the piston 36. One end of the connecting rod 37 located outside the sleeve 35 is fixedly connected to a dial plate 38. The connection between the dial plate 38 and the connecting block 8 is a movable abutment. During the backward movement of the connecting block 8, it can abut against the dial plate 38 to drive the piston 36 to move backward inside the sleeve 35. During the backward movement of the piston 36 inside the sleeve 35, the gas between the two high-transparency films 15 can be pumped out through the conduit 34 and the rigid tube 30.

[0039] A telescopic rod 39 is fixedly installed on the side of the dial plate 38 away from the connecting rod 37. The rear end of the telescopic rod 39 is fixedly connected to the machine cover 2. A second spring 40 is movably sleeved outside the telescopic rod 39. The telescopic rod 39 is used to prevent the second spring 40 from bending. The second spring 40 can drive the piston 36 to move back inside the sleeve 35 through the dial plate 38. A bent guide rod 41 is fixedly installed inside the machine cover 2 corresponding to the upper side of the conduit 34. A plurality of sleeve buckles 42 are fixedly sleeved on the outside of the conduit 34 and are equidistantly distributed. The sleeve buckles 42 are movably sleeved outside the bent guide rod 41. The bent guide rod 41 can hang the conduit 34 through the plurality of sleeve buckles 42 to prevent the conduit 34 from being wound around other structures.

[0040] Working principle: When detecting a semiconductor wafer, the operator first places the semiconductor wafer in the middle of the high-transparency film 15 on the lower frame 12. Then, the electric push rod 9 is controlled to operate. The electric push rod 9 drives the sliding seat 6, the loading component and the semiconductor wafer into the interior of the machine cover 2 through the connecting block 8. During the movement of the loading component along with the sliding seat 6, the bent supporting rod 44 will first come into sliding contact with the lower frame 12 to block the downward movement of the lower frame 12. Then, the arc-shaped pressing rod 20 will drive the upper frame 11 to rotate and close through its arc part and a plurality of second balls 21, so that the high-transparency films 15 on the upper frame 11 and the lower frame 12 respectively clamp the upper and lower surfaces of the semiconductor wafer, which can effectively prevent the wafer from shifting during the detection by the first detection probe 3 and the second detection probe 4, affecting the detection result. And since the high-transparency film 15 is cut from a PDMS film, the high-transparency film 15 has high light transmittance and good elasticity and resilience performance, so that the fitting of the high-transparency film 15 with the semiconductor wafer will not hinder the imaging of the first detection probe 3 and the second detection probe 4, which is beneficial for the first detection probe 3 and the second detection probe 4 to completely detect the semiconductor wafer. During the detection process, the first detection probe 3 and the second detection probe 4 can adjust their positions through a displacement mechanism (the displacement mechanism is a publicly available technology and will not be elaborated here).

[0041] After the inspection of the semiconductor wafer is completed, the electric push rod 9 drives the loading assembly to move out from the inside of the machine cover 2. During this process, the upper frame 11 will automatically rotate and open under the drive of the coil spring 18. When the loading mechanism moves to the loading and unloading station, the lower frame 12 will break away from the bent support rod 44. When the personnel removes the semiconductor wafer after the inspection, since the semiconductor wafer is thin and brittle, and the high-transmittance film 15 is elastic, when the personnel presses one side of the wafer to tilt the wafer, the high-transmittance film 15 will still fit with the wafer, and when sliding the semiconductor wafer, the edge of the wafer will be blocked by the lower frame 12, so it is inconvenient to directly remove the wafer from the high-transmittance film 15. Therefore, at this time, the personnel can press the lower frame 12 to make the lower frame 12 drive the high-transmittance film 15 to move downward (according to Figure 3 and Figure 4 As shown, a bend is provided between the conduit 34 and the first buckle 42, so that the hard tube 30 can move downward with the lower frame 12 through the bend. The semiconductor wafer is supported by the support block 24, so that the edge of the semiconductor wafer can be quickly separated from the high-transmittance film 15, thereby facilitating the quick removal of the wafer on the high-transmittance film 15 and effectively avoiding damage to the semiconductor wafer.

[0042] When the loading assembly clamps the semiconductor wafer and enters the interior of the machine cover 2, the connecting block 8 will press against the shift plate 38 and drive the piston 36 to move backward in the sleeve 35 through the shift plate 38. At this time, the interior of the sleeve 35 will be in a negative pressure state, and the gas between the two high-transmittance membranes 15 will be sucked into the sleeve 35 through the hard tube 30 and the conduit 34, which can make the two high-transmittance membranes 15 fit tightly with the semiconductor wafer, thereby facilitating the edge of the semiconductor wafer to protrude more clearly, and facilitating the first detection probe 3 and the second detection probe 4 to detect the edge of the semiconductor wafer.

[0043] When the loading assembly needs to be replaced, the personnel first removes the hard tube 30 from the lower frame 12, and then moves the limit plate 26 through the dial block 29 to release the restriction of the limit plate 26 on the support block 13. At this time, the support block 13 can be easily moved out from the inside of the support column 7. After installing the new loading assembly, the personnel pushes the baffle 27 to move the limit plate 26 back and reset it. The magnetic block 28 positions the limit plate 26 by adsorbing the baffle 27, and then inserts the embedded block 33 on the outside of the hard tube 30 into the corresponding semicircular embedded groove 43 on the lower frame 12.

[0044] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variation thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0045] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An on-line semiconductor wafer surface defect detection device, comprising a machine base, an engine hood is installed at the upper end of the machine base, a first detection probe is installed inside the engine hood, and a second detection probe is installed inside the machine base, characterized in that, Further comprising: A feeding mechanism for feeding a semiconductor wafer into the hood for detection, the feeding mechanism being installed at the upper end of the machine base; A material loading component for clamping the semiconductor wafer, the material loading component being installed on the upper side of the feeding mechanism; A suction component for pumping out the gas inside the material loading component, the number of suction components being two groups and being symmetrically distributed; The feeding mechanism includes guide rails, two sliding seats are sleeved outside the guide rails, support columns are installed at the upper ends of the sliding seats, two electric push rods are installed at the upper end of the machine base, a connecting block is connected to the rear end of the electric push rod, and two first balls are embedded inside the sliding seats; The material loading component includes an upper frame and a lower frame, four support blocks are installed outside the lower frame, and the support blocks are embedded inside the support columns. Embedding frames are embedded inside both the upper frame and the lower frame, a high-permeability film is sleeved outside the embedding frame, two first connecting seats are installed at the lower end of the upper frame, and connecting shafts are embedded at both ends of the first connecting seat; A support component is installed inside the support column, the support component includes a gasket, a first spring is installed at the lower end of the gasket, a support block is installed on the lower side of the lower frame, and the support block is fixedly installed at the upper end of the machine base through a positioning rod; The suction component includes two rigid tubes, a strip-shaped groove is opened on one side where the two rigid tubes are close to each other, a conduit is installed at the rear end of the rigid tube, one end of the conduit is connected to a sleeve, a piston is embedded inside the sleeve, a connecting rod is embedded at the rear end of the piston, one end of the connecting rod is connected to a dial plate, and the connection method between the dial plate and the connecting block is a movable abutment.

2. The on-line defect detection device for the surface of a semiconductor wafer according to claim 1, wherein: A coil spring is sleeved outside the connecting shaft, a second connecting seat is sleeved outside the coil spring, and the connection method between the second connecting seat and the lower frame is a fixed connection. Two arc-shaped pressing rods are installed at the rear side of the upper frame, a plurality of second balls are embedded outside the arc-shaped pressing rods, a bent support rod is installed at the upper end of the machine base, and the bent support rod is in sliding contact with the lower end surface of the lower frame.

3. The on-line semiconductor wafer surface defect detection device according to claim 1, characterized in that: A limiting plate abuts against the upper end surface of the support block, a baffle is connected to one end of the limiting plate, two magnetic attraction blocks are embedded on one side of the support column, and a dial block is embedded on the upper side of one end of the limiting plate.

4. The on-line detection device for surface defects of a semiconductor wafer according to claim 1, characterized in that: Two collar rings are sleeved outside the rigid tube, and an embedded block is installed at the lower end of the collar ring.

5. The on-line detection device for surface defects of a semiconductor wafer according to claim 1, characterized in that: A telescopic rod is installed on one side of the dial plate, a second spring is sleeved outside the telescopic rod, a bent guide rod is installed inside the hood, a plurality of sleeve buckles are sleeved outside the conduit, and the sleeve buckles are sleeved outside the bent guide rod.

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