High-boiling-point silicon wafer texturing additive spraying device

Abstract

The invention relates to a high-boiling-point silicon wafer texturing additive spraying device which comprises a device body, the device body comprises an L-shaped base, a spraying pipe is transversely and slidably arranged on the surface of the L-shaped base, and a plurality of atomizing nozzles are arranged on the lower surface of the spraying pipe at equal intervals; the driving assembly comprises a strip-shaped opening formed in the surface of the L-shaped base and a driving motor fixedly arranged on the side face of the L-shaped base, and through the arrangement of the driving assembly and the liquid supply assembly, in the actual use process of the device, the high-boiling-point silicon wafer texturing additive in the liquid storage tank can be conveyed into the spraying pipe through the liquid conveying hose; and the water is sprayed to the surface of the silicon wafer through a plurality of atomizing nozzles, so that the purpose of texturing the surface of the silicon wafer is achieved. According to the invention, uniform spraying is carried out on the surface of the silicon wafer, so that the suede uniformity of the surface of the silicon wafer is effectively ensured.

Description

Technical Field

[0001] The present application relates to the technical field of spraying devices, and in particular to a spraying device for high-boiling-point silicon wafer texturing additives. Background Art

[0002] In the process of preparing solar cells, in order to improve the performance and efficiency of solar cells, it is necessary to make a velvet surface on the surface of the silicon wafer. An effective velvet structure can make the incident sunlight reflect and refract multiple times on the surface of the silicon wafer, changing the direction of the incident light in the silicon.

[0003] At present, in the process of making a textured surface on a silicon wafer, a sprayer or a spray gun is usually used to spray a textured additive onto the surface of the silicon wafer to form a textured surface on the surface of the silicon wafer.

[0004] With respect to the above-mentioned related technologies, the inventors believe that the following defects exist: in the process of spraying the texturing additive with a sprayer or a spray gun, on the one hand, the texturing additive is easy to settle inside the storage liquid, resulting in uneven concentration of the sprayed texturing additive; on the other hand, during spraying, it is impossible to spray the surface of the silicon wafer evenly, resulting in uneven texturing surface formed on the silicon wafer. Summary of the invention

[0005] In order to improve the technical problem of being unable to evenly spray the surface of a silicon wafer, the present application provides a device for spraying a high-boiling-point silicon wafer texturing additive.

[0006] The high boiling point silicon wafer texturing additive spraying device provided in this application adopts the following technical solution:

[0007] A high-boiling-point silicon wafer texturing additive spraying device, comprising: a device body, the device body comprising an L-shaped base, a nozzle, an atomizing nozzle, a driving component and a liquid supply component, the L-shaped base is used to place the silicon wafer, the surface of the L-shaped base is provided with a nozzle for transverse sliding, and the lower surface of the nozzle is provided with a plurality of atomizing nozzles at equal intervals;

[0008] The driving assembly is used to drive the nozzle to move back and forth laterally, and the driving assembly includes a strip opening opened on the surface of the L-shaped base, and a driving motor fixedly mounted on the side of the L-shaped base, the output end of the driving motor extends to the inside of the strip opening and is fixedly provided with a reciprocating screw, and an L-shaped block is slidably arranged on the inner wall of the strip opening, and a threaded hole threadedly connected to the outer surface of the reciprocating screw is opened on the side of the L-shaped block;

[0009] The liquid supply component is used to supply high-boiling-point silicon wafer texturing additives to the interior of the nozzle, and the liquid supply component includes a liquid storage tank fixed on the back of the L-shaped base for storing the high-boiling-point silicon wafer texturing additives.

[0010] By adopting the above technical scheme, the spraying device controls the lateral reciprocating movement of the nozzle on the L-shaped base through the driving component, ensuring uniform coverage during the spraying process. At the same time, the multiple atomizing nozzles under the nozzle realize the atomization effect of the additive, so that it forms a fine and uniform coating on the surface of the silicon wafer, effectively improving the texturing quality; the L-shaped base design can firmly place the silicon wafer, ensure the stability of the silicon wafer position during the spraying process, and avoid uneven coating due to inaccurate position; the liquid supply component provides a stable supply of high-boiling point silicon wafer texturing additives to the spraying device through the liquid storage tank, ensuring the continuity and stability of the spraying process, so that the supply of the additive is accurate and consistent, avoiding unstable quality caused by liquid volume fluctuations.

[0011] Optionally, two symmetrical fixed blocks are fixed on the upper surface of the liquid storage tank, and push-type air pumps are fixed on the surfaces of the two fixed blocks. A pressure plate is fixed on the back of the L-shaped block, and both side surfaces of the pressure plate are fixedly connected to the pressing ends of the two push-type air pumps respectively.

[0012] By adopting the above technical solution, the interior of the liquid storage tank can be inflated and pressurized by two push-type air pumps.

[0013] Optionally, the ends of the push-type air pump are respectively provided with an air intake pipe and an air charging pipe which pass through the fixed block, the surface of the air intake pipe is provided with an air intake one-way valve, and the end of the air intake pipe is provided with a filter cover, the surface of the air charging pipe is provided with an air charging one-way valve, and the other end of the air charging pipe extends to the inner top of the liquid storage tank.

[0014] By adopting the above technical solution, through the suction pipe and the inflation pipe, when the pressure plate presses the push-type air pump, the interior of the liquid storage tank can be inflated through the inflation pipe, and when the pressure plate releases the push-type air pump, the suction pipe can be used to reset the push-type air pump.

[0015] Optionally, a filling pipe is provided on the upper surface of the liquid storage tank, and a sealing plug is provided at the top of the filling pipe, an infusion hose is provided on the outer surface of the liquid storage tank, and one end of the infusion hose extends to the inner bottom of the liquid storage tank, and the other end of the infusion hose extends to the inside of the nozzle.

[0016] By adopting the above technical solution, the high-boiling-point silicon wafer texturing additive can be transported to the inside of the nozzle through the infusion hose when the inside of the liquid storage tank is pressurized.

[0017] Optionally, a stirring assembly for stirring the high-boiling point silicon wafer texturing additive is provided inside the liquid storage tank, and the stirring assembly includes a rotating rod rotatably arranged on the bottom wall of the liquid storage tank, and a plurality of stirring blades equidistantly fixed on the surface of the rotating rod.

[0018] By adopting the above technical solution, through the rotating rod and the stirring blade, the rotation of the rotating rod can drive the stirring blade to fully stir the high-boiling point silicon wafer texturing additive inside the liquid storage tank.

[0019] Optionally, a cross bar is rotatably provided on the inner side wall of the liquid storage tank, and the end of the cross bar and the surface of the rotating rod are fixed with mutually meshing bevel gears.

[0020] By adopting the above technical solution, the bevel gear can drive the rotating rod to rotate through the rotation of the cross rod.

[0021] Optionally, one end of the reciprocating screw extends to the outer surface of the L-shaped base and is fixedly provided with a connecting shaft, and the other end of the cross bar extends to the outer surface of the liquid storage tank, and the ends of the connecting shaft and the cross bar are fixedly provided with transmission wheels, and the surfaces of the two transmission wheels are provided with transmission belts.

[0022] By adopting the above technical solution, the cross bar can be driven to rotate through the rotation of the reciprocating screw via the transmission wheel and the transmission belt.

[0023] In summary, the present application includes at least one of the following beneficial technical effects:

[0024] 1. The present application sets a driving component and a liquid supply component so that during actual use of the device, the high-boiling point silicon wafer texturing additive inside the liquid storage tank can be transported to the nozzle through the infusion hose, and sprayed onto the surface of the silicon wafer through a number of atomizing nozzles, thereby achieving the purpose of texturing the surface of the silicon wafer and achieving the purpose of uniformly spraying the surface of the silicon wafer, thereby effectively ensuring the uniformity of the texturing surface of the silicon wafer.

[0025] 2. The present application sets a stirring component so that the device can fully stir the high-boiling point silicon wafer texturing additive inside the liquid storage tank during the process of evenly spraying by driving the nozzle back and forth through the rotation of the driving motor, so that the high-boiling point silicon wafer texturing additive in the liquid storage tank is more uniform, thereby ensuring the uniform composition of the sprayed high-boiling point silicon wafer texturing additive. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic diagram of the three-dimensional structure of a high-boiling point silicon wafer texturing additive spraying device according to an embodiment of the present application.

[0027] Figure 2 This is a schematic diagram of the rear view structure of a high-boiling point silicon wafer texturing additive spraying device according to an embodiment of the present application.

[0028] Figure 3 for Figure 2 Enlarged structural diagram at A in the middle.

[0029] Figure 4This is a schematic diagram of the internal structure of a liquid storage tank of a high-boiling point silicon wafer texturing additive spraying device in an embodiment of the present application.

[0030] Description of reference numerals:

[0031] 100, L-shaped base; 200, nozzle; 300, atomizing nozzle; 400, driving assembly; 401, driving motor; 402, reciprocating screw; 403, L-shaped block; 500, liquid supply assembly; 501, liquid storage tank; 502, fixing block; 503, push-type air pump; 504, pressing plate; 505, suction pipe; 506, inflation pipe; 507, suction one-way valve; 508, inflation one-way valve; 509, infusion hose; 600, stirring assembly; 601, rotating rod; 602, stirring blade; 603, cross bar; 604, bevel gear; 605, connecting shaft; 606, transmission wheel; 607, transmission belt; 900, device body. DETAILED DESCRIPTION

[0032] The following is combined with Figure 1-4 This application is described in further detail.

[0033] The embodiment of the present application discloses a device for spraying a high-boiling-point silicon wafer texturing additive.

[0034] Example 1

[0035] Reference Figures 1 to 4 A high-boiling-point silicon wafer texturing additive spraying device, comprising: a device body 900, the device body 900 comprises a combination of an L-shaped base 100, a nozzle 200, an atomizing nozzle 300, a driving component 400 and a liquid supply component 500. Through the combination of the L-shaped base, the nozzle, the atomizing nozzle, the driving component and the liquid supply component, the high-boiling-point silicon wafer texturing additive is accurately sprayed and evenly covered, ensuring that the silicon wafer surface is evenly coated during the spraying process, thereby improving the texturing quality; the driving component 400 controls the reciprocating motion of the nozzle 200 to optimize the distribution of the additive during the spraying process, and the liquid supply component 500 provides a stable liquid supply to avoid uneven coating caused by fluctuations in the liquid volume, thereby improving production efficiency and product consistency;

[0036] The L-shaped base 100 is used to place silicon wafers. A nozzle 200 is arranged on the surface of the L-shaped base 100 for horizontal sliding, and a plurality of atomizing nozzles 300 are arranged equidistantly on the lower surface of the nozzle 200. The stable placement function of the L-shaped base allows the silicon wafer to remain stable during the spraying process. The horizontal sliding design of the nozzle 200 cooperates with the atomizing nozzles 300 arranged equidistantly below to achieve uniform spraying and efficient coverage of high-boiling-point silicon wafer texturing additives, ensuring uniform distribution of the texturing additives on the surface of the silicon wafer, avoiding quality fluctuations caused by uneven coating, and improving consistency and stability in the texturing process, thereby significantly improving the texturing effect and production efficiency of the silicon wafer;

[0037] The driving assembly 400 is used to drive the nozzle 200 to move back and forth laterally. The driving assembly 400 includes a strip opening provided on the surface of the L-shaped base 100, and a driving motor 401 fixedly mounted on the side of the L-shaped base 100. The output end of the driving motor 401 extends to the inside of the strip opening and is fixedly provided with a reciprocating screw 402. An L-shaped block 403 is slidably provided on the inner wall of the strip opening. A threaded hole threadedly connected to the outer surface of the reciprocating screw 402 is provided on the side of the L-shaped block 403. The driving motor 401 drives the reciprocating screw 402 to realize the transverse reciprocating motion of the nozzle. The cooperation of the strip opening and the L-shaped block ensures the smooth sliding of the nozzle on the L-shaped base, thereby realizing the precise transverse back and forth motion of the nozzle, and ensuring the uniform spraying of the high-boiling point silicon wafer texturing additive. The structure can accurately control the movement range of the nozzle, improve the stability and repeatability of the spraying process, avoid uneven spraying due to position deviation, thereby optimizing the silicon wafer texturing effect, and improving production efficiency and product quality.

[0038] The liquid supply component 500 is used to supply high-boiling point silicon wafer texturing additives to the interior of the nozzle 200. The liquid supply component 500 includes a liquid storage tank 501 fixedly mounted on the back of the L-shaped base 100 for storing the high-boiling point silicon wafer texturing additives. The liquid supply component 500 provides a stable supply of high-boiling point silicon wafer texturing additives to the nozzle 200 through the liquid storage tank 501, ensuring a continuous and stable supply of the additive during the spraying process, avoiding uneven spraying caused by fluctuations in the liquid volume, and thereby improving the accuracy and consistency of the texturing process; the liquid storage tank is convenient for large-capacity storage, ensuring the continuity of spraying under long-term operation, improving production efficiency, and ensuring the uniformity and quality of the silicon wafer surface coating through stable liquid supply, thereby optimizing the entire texturing process.

[0039] Reference Figure 2Two symmetrical fixed blocks 502 are fixed on the upper surface of the liquid storage tank 501, and the surfaces of the two fixed blocks 502 are fixed with push-type air pumps 503. A pressure plate 504 is fixed on the back of the L-shaped block 403, and the two side surfaces of the pressure plate 504 are respectively fixedly connected to the pressing ends of the two push-type air pumps 503. Specifically, by setting the push-type air pumps 503, the interior of the liquid storage tank 501 can be inflated and pressurized by the two push-type air pumps 503. By setting the push-type air pumps 503 and connecting them to the pressure plate, The liquid storage tank 501 can be inflated and pressurized to ensure that the high-boiling point silicon wafer texturing additive flows out at a stable and uniform pressure during the liquid supply process, avoiding the instability of liquid supply and improving the working efficiency and liquid supply accuracy of the spraying device; this pressurization mechanism effectively ensures the continuous supply of liquid, avoids the uneven spraying caused by the liquid level fluctuation in the liquid storage tank 501, ensures the uniform spraying of the additive and the texturing effect on the silicon wafer surface, thereby optimizing the liquid control in the production process and improving the texturing quality and stability.

[0040] Reference Figure 3 The ends of the push-type air pump 503 are respectively provided with an air intake pipe 505 and an air charging pipe 506 which penetrate the fixed block 502, the surface of the air intake pipe 505 is provided with an air intake one-way valve 507, and the end of the air intake pipe 505 is provided with a filter cover, the surface of the air charging pipe 506 is provided with an air charging one-way valve 508, and the other end of the air charging pipe 506 extends to the inner top of the liquid storage tank 501. Specifically, by arranging the air intake pipe 505 and the air charging pipe 506, when the pressing plate 504 presses the push-type air pump 503, the interior of the liquid storage tank 501 can be inflated through the air charging pipe 506, and when the pressing plate 504 relaxes the push-type air pump 503, the air intake pipe 505 is used to reset the push-type air pump 503, and the air charging pipe 506 is used to adjust the pressure of the liquid storage tank 501. The suction pipe 505 and the inflation pipe 506 cooperate with the suction one-way valve 507 and the inflation one-way valve 508. The push-type inflation pump 503 can inflate and pressurize the interior of the liquid storage tank 501 through the inflation pipe 506 when the pressure plate 504 is pressed, thereby ensuring a stable liquid supply pressure; when the pressure plate 504 is relaxed, the suction pipe 505 resets the inflation pump through the one-way valve and sucks back air from the inside of the liquid storage tank, avoiding the problems of liquid backflow and pressure instability, ensuring uniform pressurization and continuous supply of liquid in the liquid storage tank, avoiding the influence of pressure fluctuations on the spraying process, thereby ensuring the stable output and uniform spraying of the texturing additive, effectively improving the spraying accuracy and texturing effect, and optimizing the working performance of the entire spraying device.

[0041] Reference Figure 3A filling pipe is provided on the upper surface of the liquid storage tank 501, and a sealing plug is provided on the top of the filling pipe. A liquid infusion hose 509 is provided on the outer surface of the liquid storage tank 501, and one end of the liquid infusion hose 509 extends to the inner bottom of the liquid storage tank 501, and the other end of the liquid infusion hose 509 extends to the inside of the nozzle 200. Specifically, by providing the liquid infusion hose 509, when the inside of the liquid storage tank 501 is pressurized, the high-boiling-point silicon wafer texturing additive can be transported to the inside of the nozzle 200 through the liquid infusion hose 509. By providing the filling pipe and the sealing plug, the safe filling and sealing of the liquid storage tank 501 are ensured. When the liquid storage tank is pressurized, the infusion hose 509 can stably and efficiently transport the high-boiling point silicon wafer texturing additive from the inside of the liquid storage tank to the nozzle 200, ensuring the continuous and stable supply of the additive in the nozzle. One end of the infusion hose is located at the bottom of the liquid storage tank, and the other end is connected to the nozzle, which optimizes the liquid flow path, reduces the resistance and fluctuation in the liquid delivery process, ensures the smooth delivery and spraying of the liquid, and effectively avoids the problem of unstable spraying caused by uneven pressurization or poor flow of the liquid during the delivery process, thereby improving the spraying accuracy and uniformity, thereby enhancing the consistency and stability of the texturing effect.

[0042] The implementation principle of Example 1 is as follows: by setting a driving component 400 and a liquid supply component 500, during actual use of the device, the high-boiling point silicon wafer texturing additive inside the liquid storage tank 501 can be transported to the nozzle 200 through the infusion hose 509, and sprayed to the surface of the silicon wafer through a plurality of atomizing nozzles 300, thereby achieving the purpose of texturing the surface of the silicon wafer, and achieving the purpose of uniformly spraying the surface of the silicon wafer, thereby effectively ensuring the uniformity of the texturing surface of the silicon wafer.

[0043] Example 2

[0044] Based on Example 1, Figure 3 and Figure 4A stirring assembly 600 for stirring the high-boiling-point silicon wafer texturing additive is arranged inside the liquid storage tank 501. The stirring assembly 600 includes a rotating rod 601 rotatably arranged on the bottom wall of the liquid storage tank 501, and a plurality of stirring blades 602 equidistantly fixed on the surface of the rotating rod 601. Specifically, by arranging the rotating rod 601 and the stirring blades 602, the rotation of the rotating rod 601 can drive the stirring blades 602 to fully stir the high-boiling-point silicon wafer texturing additive inside the liquid storage tank 501. Through the rotating rod 601 and the stirring blades 602, the high-boiling-point silicon wafer texturing additive can be fully stirred inside the liquid storage tank 501, ensuring that the additive is evenly mixed in the liquid storage tank, avoiding uneven spraying caused by precipitation or stratification of the additive. The rotation of the rotating rod drives the movement of the stirring blades, effectively enhancing the fluidity and stirring effect of the liquid, thereby maintaining the stability and uniformity of the additives, allowing the additives to be delivered to the nozzle through the infusion hose with constant properties, optimizing the mixing process of the additives, and improving the liquid stability during the spraying process. It avoids the influence of the texturing effect due to uneven additives, thereby improving the spraying accuracy and the texturing quality of the silicon wafer surface.

[0045] Reference Figure 4 A cross bar 603 is rotatably provided on the inner wall of the liquid storage tank 501, and the end of the cross bar 603 and the surface of the rotating rod 601 are fixedly provided with mutually meshing bevel gears 604. Specifically, by providing the bevel gear 604, the rotating rod 601 can be driven to rotate by the rotation of the cross bar 603. By providing the bevel gear 604, the rotation of the cross bar 603 can drive the rotating rod 601 to rotate, thereby ensuring the efficient operation of the stirring assembly. The meshing transmission structure of the bevel gears makes the power transmission more stable and accurate, improves the stirring effect of the stirring blade 602, helps to maintain the uniformity and stability of the high-boiling point silicon wafer texturing additive in the liquid storage tank 501, avoids the precipitation or stratification of the additive, ensures the uniformity and stability of the liquid during the spraying process, and thus improves the quality and consistency of the texturing effect.

[0046] Reference Figure 3One end of the reciprocating screw 402 extends to the outer surface of the L-shaped base 100 and is fixed with a connecting shaft 605, and the other end of the cross bar 603 extends to the outer surface of the liquid storage tank 501. The ends of the connecting shaft 605 and the cross bar 603 are fixed with transmission wheels 606, and the surfaces of the two transmission wheels 606 are sleeved with transmission belts 607. Specifically, by setting the transmission wheels 606 and the transmission belts 607, the rotation of the reciprocating screw 402 can drive the cross bar 603 to rotate. Through the transmission wheels 606 and the transmission belts 607, the rotation of the reciprocating screw 402 drives the connecting shaft 605 to rotate, thereby driving the cross bar 603 to rotate. The transmission system ensures the precise matching of the cross bar 603 and the rotating rod 601 through a stable driving method, so that the stirring blade 602 can be stirred stably, ensuring the uniform mixing of the high-boiling point silicon wafer texturing additive in the liquid storage tank 501. The transmission belt effectively reduces the vibration and friction during the transmission process, and improves the reliability and stability of the entire stirring system.

[0047] The implementation principle of Example 2 is: by setting up a stirring component 600, the device can achieve the purpose of fully stirring the high-boiling point silicon wafer texturing additive inside the liquid storage tank 501 during the process of evenly spraying by driving the nozzle 200 to move back and forth through the rotation of the driving motor 401, so that the high-boiling point silicon wafer texturing additive in the liquid storage tank 501 is more uniform, thereby ensuring that the composition of the sprayed high-boiling point silicon wafer texturing additive is uniform and has strong practicality.

[0048] The working principle of a high-boiling-point silicon wafer texturing additive spraying device in an embodiment of the present application is as follows: during actual use of the device, the silicon wafer is first placed on the surface of the L-shaped base 100 below the nozzle 200, and the drive motor 401 is started. The rotation of the drive motor 401 drives the reciprocating screw 402 to rotate, and the rotation of the reciprocating screw 402 drives the L-shaped block 403 to move. The movement of the L-shaped block 403 drives the pressure plate 504 to reciprocate and press the two push-type air pumps 503, so that the two push-type air pumps 503 continuously reciprocate to pressurize the inside of the liquid storage tank 501, so that the high-boiling-point silicon wafer texturing additive inside the liquid storage tank 501 is transported to the nozzle 200 through the infusion hose 509, and is sprayed to the surface of the silicon wafer through a plurality of atomizing nozzles 300, so as to achieve the purpose of texturing the surface of the silicon wafer, and the back and forth movement of the L-shaped block 403 can drive the nozzle 200 to move on the silicon wafer The device reciprocates back and forth above the top, thereby achieving the purpose of uniformly spraying the surface of the silicon wafer, thereby effectively ensuring the uniformity of the velvet surface of the silicon wafer, and in the process of the device driving the nozzle 200 to move back and forth for uniform spraying through the rotation of the driving motor 401, the rotation of the reciprocating screw 402 can drive the connecting shaft 605 to rotate, and the rotation of the connecting shaft 605 drives the cross bar 603 to rotate under the action of the two transmission wheels 606 and the transmission belt 607. The rotation of the cross bar 603 drives the rotating rod 601 to rotate under the action of the two bevel gears 604. The rotation of the rotating rod 601 drives the stirring blade 602 to rotate, thereby achieving the purpose of fully stirring the high-boiling point silicon wafer texturing additive inside the liquid storage tank 501, making the high-boiling point silicon wafer texturing additive in the liquid storage tank 501 more uniform, thereby ensuring that the composition of the sprayed high-boiling point silicon wafer texturing additive is uniform, and the practicability is strong.

[0049] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A high boiling point silicon wafer texturing additive spraying device, the device body (900), characterized in that: The device body (900) comprises an L-shaped base (100), a nozzle (200), an atomizing nozzle (300), a driving assembly (400) and a liquid supply assembly (500); the L-shaped base (100) is used to place a silicon wafer; the nozzle (200) is disposed on the surface of the L-shaped base (100) in a lateral sliding manner, and a plurality of atomizing nozzles (300) are disposed at equal intervals on the lower surface of the nozzle (200); The driving assembly (400) comprises a strip-shaped opening formed on the surface of the L-shaped base (100) and a driving motor (401) fixedly mounted on the side of the L-shaped base (100); the output end of the driving motor (401) extends into the interior of the strip-shaped opening and is fixedly mounted with a reciprocating screw (402); an L-shaped block (403) is slidably mounted on the inner wall of the strip-shaped opening; a threaded hole threadedly connected to the outer surface of the reciprocating screw (402) is formed on the side of the L-shaped block (403); the driving assembly (400) is used to drive the nozzle (200) to move back and forth laterally; The liquid supply component (500) is used to supply a high-boiling-point silicon wafer texturing additive to the interior of the nozzle (200), and the liquid supply component (500) comprises a liquid storage tank (501) fixedly mounted on the back of the L-shaped base (100) for storing the high-boiling-point silicon wafer texturing additive.

2. A high boiling point silicon wafer texturing additive spraying device according to claim 1, characterized in that: Two symmetrical fixing blocks (502) are fixedly provided on the upper surface of the liquid storage box (501), and push-type air pumps (503) are fixedly provided on the surfaces of the two fixing blocks (502). A pressing plate (504) is fixedly provided on the back of the L-shaped block (403), and the two side surfaces of the pressing plate (504) are respectively fixedly connected to the pressing ends of the two push-type air pumps (503).

3. A high boiling point silicon wafer texturing additive spraying device according to claim 2, characterized in that: The ends of the push-type air pump (503) are respectively provided with an air intake pipe (505) and an air charging pipe (506) penetrating the fixed block (502); the surface of the air intake pipe (505) is provided with an air intake one-way valve (507); and the end of the air intake pipe (505) is provided with a filter cover; the surface of the air charging pipe (506) is provided with an air charging one-way valve (508); and the other end of the air charging pipe (506) extends to the inner top of the liquid storage tank (501).

4. A high boiling point silicon wafer texturing additive spraying device according to claim 1, characterized in that: The upper surface of the liquid storage tank (501) is provided with a filling pipe, and the top end of the filling pipe is provided with a sealing plug. The outer surface of the liquid storage tank (501) is provided with an infusion hose (509), and one end of the infusion hose (509) extends to the inner bottom of the liquid storage tank (501), and the other end of the infusion hose (509) extends to the inside of the nozzle (200).

5. The high boiling point silicon wafer texturing additive spraying device according to claim 1, characterized in that: The interior of the liquid storage tank (501) is provided with a stirring assembly (600) for stirring the high-boiling point silicon wafer texturing additive, and the stirring assembly (600) comprises a rotating rod (601) rotatably arranged on the inner bottom wall of the liquid storage tank (501), and a plurality of stirring blades (602) equidistantly fixed on the surface of the rotating rod (601).

6. A high boiling point silicon wafer texturing additive spraying device according to claim 5, characterized in that: A cross bar (603) is rotatably provided on the inner side wall of the liquid storage box (501), and mutually meshing bevel gears (604) are fixedly provided at the end of the cross bar (603) and on the surface of the rotating rod (601).

7. A high boiling point silicon wafer texturing additive spraying device according to claim 6, characterized in that: One end of the reciprocating screw (402) extends to the outer surface of the L-shaped base (100) and is fixedly provided with a connecting shaft (605), and the other end of the cross bar (603) extends to the outer surface of the liquid storage tank (501), and the ends of the connecting shaft (605) and the cross bar (603) are fixedly provided with transmission wheels (606), and the surfaces of the two transmission wheels (606) are provided with transmission belts (607).

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