Silicon wafer cleaning device based on polishing

Abstract

The invention belongs to the technical field of silicon wafer cleaning, and discloses a silicon wafer cleaning device based on polishing, which comprises a main body, a cleaning tank is arranged on the top surface of the main body, a silicon wafer is arranged in the cleaning tank, and a cleaning assembly for cleaning impurities on the surface of the silicon wafer is arranged in the cleaning tank. After the air guide plate and the positioning block are in butt joint with a silicon wafer for clamping and positioning, the air guide plate is filled with air under the action of the air blower, then the air enters the cleaning tank through the cleaning holes in the surface of the positioning block, and generated bubbles float and move in cleaning liquid and are in contact with the surface of the silicon wafer in the floating process, so that the surface of the silicon wafer is cleaned. The cleaning assembly is arranged in the cleaning tank to take away stains on the surfaces of the silicon wafers, the cleaning assembly can be overturned in the cleaning tank, bubbles can be repeatedly utilized, the device can efficiently clean the multiple silicon wafers through the design, reciprocating cleaning of the silicon wafers is achieved through a simple overturning structure, and energy is saved.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer cleaning, and in particular to a silicon wafer cleaning device based on polishing. Background Art

[0002] Silicon wafer cleaning device is a device used to clean the surface of silicon wafers. It usually uses chemical and physical methods to remove pollutants and impurities on the surface of silicon wafers to improve the surface quality and performance of silicon wafers. In the field of semiconductor cleaning technology, the control of mechanical damage and defect rate are two difficult problems. As the size of semiconductor chips continues to shrink, the particles that affect the yield of wafers (such as silicon carbide wafers) are getting smaller and smaller. The smaller the particles, the more difficult it is to clean; at the same time, the gate electrode and capacitor structure of chips below 65 nanometers are becoming more and more fragile, and the difficulty of avoiding damage to the chip microstructure during cleaning is also increasing.

[0003] The invention with the announcement number CN101764048B provides a microbubble generating device and a silicon wafer cleaning device, which can supply microbubbles with a smaller bubble size with a higher cleaning effect to the outside, and can make the device miniaturized and improve its processing flexibility. The microbubble generating device 1 is provided with a microbubble generating mechanism 10 and a guide conduit 20 for guiding the microbubbles to the outside. The guide conduit 20 is provided with a widening portion 21 and a tube portion 22, and the widening portion 21 and the tube portion 22 are connected and communicated with each other in the guide conduit 20. The widening portion has a hollow cylindrical shape with the axis Z as the central axis, and has bottom surfaces 23, 24 and a cylindrical outer peripheral surface, and leads to the nozzle 11 of the microbubble generating mechanism 10 via one bottom surface 23 of the widening portion 21, and leads to the tube portion 22 via the other bottom surface 24. The area of ​​the cross section perpendicular to the flow channel axis Z of the microbubbles of the widening portion 21 is larger than the area of ​​the cross section perpendicular to the flow channel axis Z of the tube portion 22.

[0004] The prior art has the following problems: the existing silicon wafer cleaning device has a relatively simple function. When the device cleans a single silicon wafer, the cleaning efficiency of the device will be reduced. When the device cleans multiple silicon wafers, the high-density arrangement of the silicon wafers causes the cleaning liquid to be unable to be evenly sprayed onto the surface of the silicon wafers, affecting the cleaning effect of the silicon wafers. However, when the cleaning liquid is sprayed directly, the high-pressure liquid is easy to avoid damaging the microstructure of the silicon wafer during cleaning.

[0005] For this purpose, a silicon wafer cleaning device based on polishing is proposed. Summary of the invention

[0006] The purpose of the present invention is to solve the problem that the existing silicon wafer cleaning device has a relatively single function. When the device cleans a single silicon wafer, the cleaning efficiency of the device will be reduced. When the device cleans multiple silicon wafers, the high-density arrangement of the silicon wafers causes the cleaning liquid to be unable to be evenly sprayed onto the surface of the silicon wafers, affecting the cleaning effect of the silicon wafers. By directly spraying the cleaning liquid, the high-pressure liquid can easily avoid damaging the microstructure of the silicon wafer during cleaning. The present invention provides a silicon wafer cleaning device based on polishing.

[0007] In order to achieve the above-mentioned purpose, the present invention specifically adopts the following technical solutions:

[0008] A silicon wafer cleaning device based on polishing comprises a main body, a cleaning groove is provided on the top surface of the main body, a silicon wafer is arranged in the cleaning groove, a cleaning component for cleaning impurities on the surface of the silicon wafer is provided in the cleaning groove, and the cleaning component is movably connected to the main body, an adjustment component for placing the silicon wafer is provided on the side of the main body, and a hidden groove is provided on the inner side of the cleaning groove.

[0009] As a further solution of the present invention, the cleaning component includes a rotating seat, and the rotating seat is rotatably connected to the main body, and the rotating seat passes through the side of the main body. The side of the main body is provided with a fixed bracket, and a rotating motor is fixed on the surface of the fixed bracket, and the output end of the rotating motor is fixedly connected to the rotating seat.

[0010] As a further solution of the present invention, an air guide plate is provided on the surface of the rotating seat, and the air guide plate is movably connected to the rotating seat, a positioning screw is provided on the side of the rotating seat, and the positioning screw is respectively threadedly connected to the air guide plate, a positioning motor is fixed to one end of the positioning screw, a sealing ring is nested on the surface of the rotating seat, and the sealing ring is made of rubber thermoplastic.

[0011] As a further solution of the present invention, the surface array of the air guide plate is provided with a positioning block, the surface of the positioning block is evenly provided with cleaning holes, and the cleaning holes respectively penetrate the surface of the positioning block and the air guide plate, the surface of the rotating seat is provided with a blower, the output end of the blower is provided with an air guide duct, and the air guide duct penetrates the rotating seat, one end of the air guide duct is provided with a telescopic tube, and one end of the telescopic tube penetrates the surface of the air guide plate.

[0012] As a further solution of the present invention, the adjusting assembly includes a fixed sleeve, and the fixed sleeve is fixed in the main body, a lifting cylinder is fixed at the bottom end of the fixed sleeve, an adjusting motor is provided in the fixed sleeve, and the adjusting motor is movably connected to the fixed sleeve, and the output end of the lifting cylinder is fixedly connected to the adjusting motor, and a rotating shaft is provided at the output end of the adjusting motor, and the rotating shaft passes through the top surface of the main body.

[0013] As a further solution of the present invention, a support frame is fixed to the top of the rotating shaft, and the support frame is movably connected to the hidden groove, fixed seats are fixed on both sides of the support frame, and placement frames are provided on both sides of the support frame, and the placement frames are axially symmetrical with respect to the support frame.

[0014] As a further solution of the present invention, a through groove is opened in the placement frame, and the through groove passes through the placement frame, a placement groove is opened in the inner array of the through groove, and the silicon wafer is movably connected to the placement groove, a stabilizing frame is fixed on the side of the placement frame, and the stabilizing frame is movably connected to the fixing seat, a flipping motor is fixed in the fixing seat, and the output end of the flipping motor is fixedly connected to the stabilizing frame, and the diameter length of the silicon wafer is equal to the height of the placement frame.

[0015] As a further solution of the present invention, an electric telescopic rod is provided in the main body, and the top end of the electric telescopic rod passes through the top surface of the main body, and a cover plate is fixed to the top end of the electric telescopic rod.

[0016] As a further solution of the present invention, a controller is fixed on the surface of the main body, and the controller is electrically connected to the rotating motor, the blower, the positioning motor, the adjusting motor, the flipping motor and the electric telescopic rod respectively.

[0017] The beneficial effects of the present invention are as follows:

[0018] 1. The present invention provides a cleaning component in the cleaning tank. In the cleaning component, when the air guide plate and the positioning block are docked with the silicon wafer to clamp and position it, the air guide plate will be filled with gas through the action of the blower, and then the gas enters the cleaning tank through the cleaning hole on the surface of the positioning block. Then the generated bubbles will float and move in the cleaning liquid. In the process of the bubbles floating up, they will contact the surface of the silicon wafer and take away the stains on the surface of the silicon wafer. Moreover, the cleaning component can be turned over in the cleaning tank, so that the bubbles can be repeatedly used. This design not only enables the device to efficiently clean multiple silicon wafers, but also realizes the reciprocating cleaning of the silicon wafer through a simple turning structure, saving energy.

[0019] 2. The present invention is provided with an adjustment component on the side of the main body. In the adjustment component, the placement frame is an axially symmetrical structure with respect to the supporting frame. When one of the placement frames is carrying silicon wafers for cleaning in the cleaning tank, the other placement frame will be exposed to the outside of the main body, so as to facilitate the preparation of the next batch of silicon wafers that need to be cleaned. This design enables the device to continuously clean the silicon wafers, thereby improving the cleaning efficiency of the device for the silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is an axonometric view of the present invention;

[0021] Figure 2is an overall cross-sectional view of the present invention;

[0022] Figure 3 It is an exploded view of the overall structure of the present invention;

[0023] Figure 4 is a front view of the present invention;

[0024] Figure 5 is a structural diagram of the cleaning assembly of the present invention;

[0025] Figure 6 is a cross-sectional view of the cleaning assembly of the present invention;

[0026] Figure 7 is an exploded view of the cleaning assembly of the present invention;

[0027] Figure 8 is a structural diagram of the regulating assembly of the present invention;

[0028] Fig. 9 is a cross-sectional view of the adjustment assembly of the present invention;

[0029] Fig.10 It is a structural exploded view of the adjustment assembly of the present invention.

[0030] 1. Cleaning assembly; 101. Cleaning hole; 102. Positioning block; 103. Air guide plate; 104. Sealing ring; 105. Rotating seat; 106. Rotating motor; 107. Blower; 108. Positioning screw; 109. Telescopic tube; 110. Air guide tube; 111. Positioning motor; 2. Adjusting assembly; 201. Placing frame; 202. Supporting frame; 203. Lifting cylinder; 204. Placing slot; 205. Through slot; 206. Fixed seat; 207. Adjusting motor; 208. Fixed sleeve; 209. Stabilizing frame; 210. Rotating shaft; 211. Flipping motor; 3. Main body; 4. Controller; 5. Cleaning tank; 6. Cover plate; 7. Electric telescopic rod; 8. Fixed bracket; 9. Hidden slot; 10. Silicon wafer. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0032] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. In addition, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0034] In the description of the embodiments of the present invention, it should be noted that the terms "inside", "outside", "upper", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the inventive product is usually placed when used. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0035] The following will be combined Figure 1-Figure 10 A silicon wafer cleaning device based on polishing according to an embodiment of the present invention is described in detail.

[0036] Embodiment 1: Embodiment 1 of the present application discloses a silicon wafer cleaning device based on polishing. Figure 1-Figure 10 , including a main body 3, a cleaning groove 5 is opened on the top surface of the main body 3, a silicon wafer 10 is arranged in the cleaning groove 5, a cleaning component 1 for cleaning impurities on the surface of the silicon wafer 10 is arranged in the cleaning groove 5, and the cleaning component 1 is movably connected to the main body 3, an adjusting component 2 for placing the silicon wafer 10 is arranged on the side of the main body 3, and a hidden groove 9 is opened on the inner side of the cleaning groove 5.

[0037] Specifically, before the device cleans the silicon wafer 10, it first places the silicon wafer 10 in the adjustment component 2, and the adjustment component 2 will rotate with the silicon wafer 10 to the top of the cleaning tank 5, and then the adjustment component 2 will be raised and lowered to move the silicon wafer 10 into the cleaning tank 5, and then the cleaning component 1 will rotate to wrap the silicon wafer 10 in the placement frame 201, and then the cleaning component 1 will generate bubbles to clean the silicon wafer 10.

[0038] The cleaning assembly 1 includes a rotating seat 105, and the rotating seat 105 is rotatably connected to the main body 3, and the rotating seat 105 passes through the side of the main body 3, the side of the main body 3 is provided with a fixed bracket 8, the surface of the fixed bracket 8 is fixed with a rotating motor 106, and the output end of the rotating motor 106 is fixedly connected to the rotating seat 105, the surface of the rotating seat 105 is provided with an air guide plate 103, and the air guide plate 103 is movably connected to the rotating seat 105, and the side of the rotating seat 105 is provided with a positioning screw 108, and the positioning screw 108 is respectively threadedly connected to the air guide plate 103, and one end of the positioning screw 108 is fixed with a positioning motor The surface of the rotating seat 105 is provided with a sealing ring 104, which is made of rubber thermoplastic. The surface array of the air guide plate 103 is provided with positioning blocks 102, and the surface of the positioning blocks 102 is evenly provided with cleaning holes 101, and the cleaning holes 101 respectively penetrate the surfaces of the positioning blocks 102 and the air guide plate 103. The surface of the rotating seat 105 is provided with a blower 107, and the output end of the blower 107 is provided with an air guide pipe 110, and the air guide pipe 110 penetrates the rotating seat 105. One end of the air guide pipe 110 is provided with a telescopic tube 109, and one end of the telescopic tube 109 penetrates the surface of the air guide plate.

[0039] Specifically, in the cleaning component 1, when the air guide plate 103 and the positioning block 102 are docked with the silicon wafer 10 to clamp and position it, the air guide plate 103 will be filled with gas through the action of the blower 107, and then the gas enters the cleaning tank 5 through the cleaning hole 101 on the surface of the positioning block 102, and then the generated bubbles will float and move in the cleaning liquid. In the process of the bubbles floating, they will contact the surface of the silicon wafer 10 and take away the stains on the surface of the silicon wafer 10. In addition, the cleaning component 1 can be turned over in the cleaning tank 5, so that the bubbles can be repeatedly used.

[0040] The implementation principle of a silicon wafer cleaning device based on polishing in the first embodiment of the present application is as follows: in the cleaning component 1, when the silicon wafer 10 enters between the air guide plates 103, under the drive of the positioning motor 111, the positioning screw 108 will bring the air guide plates 103 to block the through groove 205 of the placement frame 201. When the air guide plates 103 and the positioning blocks 102 are docked with the silicon wafer 10 for clamping and positioning, the air guide plates 103 will be filled with gas through the action of the blower 107, and then the gas will enter the cleaning tank 5 through the cleaning holes 101 on the surface of the positioning blocks 102, and then the generated bubbles will float and move in the cleaning liquid. In the process of bubbles floating up, they will contact the surface of silicon wafer 10, taking away the stains on the surface of silicon wafer 10, and the cleaning component 1 can be turned over in the cleaning tank 5, so that the bubbles can be repeatedly used. Driven by the turning motor 211, the rotating seat 105 will turn over with the air guide plate 103, and the gas will be reciprocated between the air guide plates 103 through the bubbles. The function of the sealing ring 104 is to prevent the cleaning liquid in the cleaning tank 5 from flowing out of the gap. This design not only enables the device to efficiently clean multiple silicon wafers 10, but also realizes the reciprocating cleaning of silicon wafers 10 through a simple turning structure, saving energy.

[0041] Example 2: Reference Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 8 , Fig. 9 and Fig.10 The adjusting component 2 includes a fixed sleeve 208, and the fixed sleeve 208 is fixed in the main body 3. The bottom end of the fixed sleeve 208 is fixed with a lifting cylinder 203. The fixed sleeve 208 is provided with an adjusting motor 207, and the adjusting motor 207 is movably connected to the fixed sleeve 208. The output end of the lifting cylinder 203 is fixedly connected to the adjusting motor 207. The output end of the adjusting motor 207 is provided with a rotating shaft 210, and the rotating shaft 210 passes through the top surface of the main body 3. The top of the rotating shaft 210 is fixed with a supporting frame 202, and the supporting frame 202 is movably connected to the hidden groove 9. The two sides of the supporting frame 202 are respectively fixed with fixed seats 206. The supporting frame 20 2 is respectively provided with a placing frame 201 on both sides, and the placing frame 201 is an axisymmetric structure with respect to the supporting frame 202, a through slot 205 is opened in the placing frame 201, and the through slot 205 runs through the placing frame 201, a placing slot 204 is opened in the inner array of the through slot 205, and the silicon wafer 10 is movably connected to the placing slot 204, a stabilizing frame 209 is fixed on the side of the placing frame 201, and the stabilizing frame 209 is movably connected to the fixing seat 206, a flip motor 211 is fixed in the fixing seat 206, and the output end of the flip motor 211 is fixedly connected to the stabilizing frame 209, and the diameter length of the silicon wafer 10 is equal to the height of the placing frame 201.

[0042] Specifically, in the adjustment component 2, the placement frame 201 is axially symmetrical with respect to the support frame 202. When one of the placement frames 201 is carrying the silicon wafers 10 for cleaning in the cleaning tank 5, the other placement frame 201 will be exposed to the outside of the main body 3, so as to facilitate the preparation of the next batch of silicon wafers 10 that need to be cleaned.

[0043] The implementation principle of a silicon wafer cleaning device based on polishing in the second embodiment of the present application is as follows: in the adjustment component 2, under the action of the lifting cylinder 203, the adjustment motor 207 can be lifted and lowered in the fixed sleeve 208, and then driven by the adjustment motor 207, the rotating shaft 210 will rotate with the supporting frame 202 to realize the rapid movement and adjustment of the placement frame 201. The design of the stabilizing frame 209 and the fixing seat 206 on the side of the placement frame 201 makes the placement frame 201 more stable when rotating. Driven by the flip motor 211, the placement frame 201 can drive the silicon wafer 10 to rotate in the cleaning tank 5 as the rotating seat 105 rotates. The placement frame 201 is axially symmetrical with respect to the supporting frame 202. When one of the placement frames 201 is cleaning with the silicon wafer 10 in the cleaning tank 5, the other placement frame 201 will be exposed to the outside of the main body 3, so as to facilitate the preparation of the next batch of silicon wafers 10 that need to be cleaned. This design enables the device to continuously clean the silicon wafers 10, thereby improving the cleaning efficiency of the device for the silicon wafers 10.

[0044] Example 3: Reference Figure 1-Figure 10 An electric telescopic rod 7 is provided in the main body 3, and the top of the electric telescopic rod 7 passes through the top surface of the main body 3, a cover plate 6 is fixed to the top of the electric telescopic rod 7, and a controller 4 is fixed to the surface of the main body 3, and the controller 4 is electrically connected to the rotating motor 106, the blower 107, the positioning motor 111, the adjusting motor 207, the flipping motor 211 and the electric telescopic rod 7 respectively.

[0045] Specifically, under the action of the electric telescopic rod 7, the cover 6 can seal the top of the cleaning tank 5 to prevent the cleaning liquid from splashing out, and the design of the hidden groove 9 makes the cover 6 and the main body 3 more perfectly closed.

[0046] In summary: in the cleaning component 1, when the air guide plate 103 and the positioning block 102 are docked with the silicon wafer 10 for clamping and positioning, the air guide plate 103 will be filled with gas through the action of the blower 107, and then the gas will enter the cleaning tank 5 through the cleaning hole 101 on the surface of the positioning block 102, and then the generated bubbles will float and move in the cleaning liquid. In the process of the bubbles floating up, they will contact the surface of the silicon wafer 10 and take away the stains on the surface of the silicon wafer 10. In addition, the cleaning component 1 can be turned over in the cleaning tank 5, so that the bubbles can be repeatedly used. This design not only enables the device to efficiently clean multiple silicon wafers 10, but also realizes reciprocating cleaning of the silicon wafer 10 through a simple turning structure, saving energy. In the adjustment component 2, the placement frame 201 is relative to the support frame 202. Axisymmetrical structure, when one of the placement frames 201 is carrying the silicon wafer 10 for cleaning in the cleaning tank 5, the other placement frame 201 will be exposed on the outside of the main body 3, so as to facilitate the preparation of the next batch of silicon wafers 10 that need to be cleaned. This design enables the device to continuously clean the silicon wafers 10, thereby improving the cleaning efficiency of the device for the silicon wafers 10. Before cleaning the silicon wafer 10, the device first places the silicon wafer 10 in the adjustment component 2, and the adjustment component 2 will rotate with the silicon wafer 10 to the top of the cleaning tank 5, and then the adjustment component 2 will be raised and lowered to move the silicon wafer 10 into the cleaning tank 5, and then the cleaning component 1 will rotate to wrap the silicon wafer 10 in the placement frame 201, and then the cleaning component 1 will generate bubbles to achieve the cleaning of the silicon wafer 10.

[0047] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions only describe the principles of the present invention. The present invention may be subject to various changes and improvements without departing from the spirit and scope of the present invention. These changes and improvements fall within the scope of the present invention. The scope of protection claimed by the present invention is defined by the attached claims and their equivalents.

Claims

1. A silicon wafer cleaning device based on polishing, comprising a main body (3), characterized in that: A cleaning groove (5) is provided on the top surface of the main body (3), a silicon wafer (10) is provided in the cleaning groove (5), a cleaning component (1) for cleaning impurities on the surface of the silicon wafer (10) is provided in the cleaning groove (5), and the cleaning component (1) is movably connected to the main body (3), an adjustment component (2) for placing the silicon wafer (10) is provided on the side surface of the main body (3), and a hidden groove (9) is provided on the inner side of the cleaning groove (5).

2. A polishing-based silicon wafer cleaning device according to claim 1, characterized in that: The cleaning component (1) comprises a rotating seat (105), and the rotating seat (105) is rotatably connected to the main body (3), and the rotating seat (105) passes through the side of the main body (3), and a fixed bracket (8) is provided on the side of the main body (3), a rotating motor (106) is fixed on the surface of the fixed bracket (8), and the output end of the rotating motor (106) is fixedly connected to the rotating seat (105).

3. A polishing-based silicon wafer cleaning device according to claim 2, characterized in that: An air guide plate (103) is provided on the surface of the rotating seat (105), and the air guide plate (103) is movably connected to the rotating seat (105). A positioning screw (108) is provided on the side of the rotating seat (105), and the positioning screw (108) is respectively threadedly connected to the air guide plate (103). A positioning motor (111) is fixed to one end of the positioning screw (108). A sealing ring (104) is embedded on the surface of the rotating seat (105), and the sealing ring (104) is made of rubber thermoplastic.

4. A polishing-based silicon wafer cleaning device according to claim 3, characterized in that: The surface array of the air guide plate (103) is provided with positioning blocks (102), the surfaces of the positioning blocks (102) are evenly provided with cleaning holes (101), and the cleaning holes (101) respectively penetrate the surfaces of the positioning blocks (102) and the air guide plate (103), the surface of the rotating seat (105) is provided with a blower (107), the output end of the blower (107) is provided with an air guide pipe (110), and the air guide pipe (110) penetrates the rotating seat (105), and one end of the air guide pipe (110) is provided with a telescopic pipe (109), and one end of the telescopic pipe (109) penetrates the surface of the air guide plate.

5. A polishing-based silicon wafer cleaning device according to claim 4, characterized in that: The adjustment component (2) comprises a fixed sleeve (208), and the fixed sleeve (208) is fixed in the main body (3); a lifting cylinder (203) is fixed at the bottom end of the fixed sleeve (208); an adjustment motor (207) is provided in the fixed sleeve (208), and the adjustment motor (207) is movably connected to the fixed sleeve (208); the output end of the lifting cylinder (203) is fixedly connected to the adjustment motor (207); a rotating shaft (210) is provided at the output end of the adjustment motor (207), and the rotating shaft (210) passes through the top surface of the main body (3).

6. A polishing-based silicon wafer cleaning device according to claim 5, characterized in that: A support frame (202) is fixed to the top of the rotating shaft (210), and the support frame (202) is movably connected to the hidden groove (9). Fixed seats (206) are respectively fixed to both sides of the support frame (202). Placement frames (201) are respectively provided on both sides of the support frame (202), and the placement frames (201) are in an axisymmetric structure with respect to the support frame (202).

7. A polishing-based silicon wafer cleaning device according to claim 6, characterized in that: The placement frame (201) is provided with a through slot (205), and the through slot (205) penetrates the placement frame (201); a placement slot (204) is provided in an array inside the through slot (205), and the silicon wafer (10) is movably connected to the placement slot (204); a stabilizing frame (209) is fixed to the side of the placement frame (201), and the stabilizing frame (209) is movably connected to a fixing seat (206); a flipping motor (211) is fixed to the fixing seat (206), and an output end of the flipping motor (211) is fixedly connected to the stabilizing frame (209); and the diameter length of the silicon wafer (10) is equal to the height of the placement frame (201).

8. A polishing-based silicon wafer cleaning device according to claim 7, characterized in that: An electric telescopic rod (7) is provided in the main body (3), and the top end of the electric telescopic rod (7) passes through the top surface of the main body (3), and a cover plate (6) is fixed to the top end of the electric telescopic rod (7).

9. A polishing-based silicon wafer cleaning device according to claim 8, characterized in that: A controller (4) is fixed on the surface of the main body (3), and the controller (4) is electrically connected to the rotating motor (106), the blower (107), the positioning motor (111), the adjusting motor (207), the flipping motor (211) and the electric telescopic rod (7) respectively.

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