Solution silicon carbide wafer cleaning device and method thereof

Abstract

The invention discloses a melt silicon carbide wafer cleaning device and method. The melt silicon carbide wafer cleaning device comprises a cleaning outer frame and a cleaning screen frame, and the cleaning screen frame is used for containing a melt silicon carbide wafer; the cleaning assembly is used for conducting auxiliary cleaning on the solution silicon carbide wafer, the clamping and fixing assembly is used for clamping and fixing the solution silicon carbide wafer, the height control assembly is used for adjusting the height of the cleaning net frame, the rotating assembly is pushed to operate in the height adjusting process of the cleaning net frame, and the cleaning net frame is rotated. According to the device, a solution silicon carbide wafer can be clamped and fixed through the clamping and fixing assembly, the solution silicon carbide wafer can be washed through the rotating assembly, meanwhile, the height of the cleaning net frame and the solution silicon carbide wafer can be adjusted through the height control assembly, and the cleaning net frame and the solution silicon carbide wafer can be rotated during height adjustment; the solution silicon carbide wafer is cleaned in a flushing and soaking combined mode, and therefore the cleaning effect is improved.

Description

Technical Field

[0001] The invention relates to the field of dissolved silicon carbide wafer cleaning, and in particular to a dissolved silicon carbide wafer cleaning device and a method thereof. Background Art

[0002] The main application areas of silicon carbide wafers are LED solid lighting and high-frequency devices. This material has excellent properties such as bandgap, drift velocity, breakdown voltage, thermal conductivity, and high temperature resistance that are several times higher than traditional silicon. It has irreplaceable advantages in electronic applications such as high temperature, high pressure, high frequency, high power, optoelectronics, radiation resistance, microwave, and extreme environment applications such as aerospace, military industry, and nuclear energy. In the application of semiconductor devices, as the production cost of silicon carbide decreases, silicon carbide may replace silicon as a chip due to its excellent performance, breaking the bottleneck of silicon chips due to the performance of the material itself, which will bring revolutionary changes to the electronics industry. The main application areas of silicon carbide are LED solid lighting and high-frequency devices. In the future, the background light market of mobile phones and laptops will provide huge demand growth for silicon carbide.

[0003] Silicon carbide is very hard, has excellent thermal and electrical conductivity, and can resist oxidation at high temperatures, but the body of the silicon carbide focusing ring is very brittle and is prone to breakage when it is hit by external forces during cleaning. Dissolved silicon carbide is a type of silicon carbide. In the invention patent with the authorized announcement number CN117766440A and the invention name of a dissolved silicon carbide wafer cleaning device and method thereof, the buffer limiter is set. When the wafer is placed in the wafer box, the buffer plate is suitable for slowing down the descent speed of the wafer to prevent the wafer from falling too fast and causing the bottom wall of the wafer to hit the transmission column; after the wafer abuts against the transmission column, the two buffer plates can limit the wafer from above to increase the friction between the circumferential wall of the wafer and the transmission column. However, in the above-mentioned prior art, the wafer is cleaned only by flushing, and the cleaning effect is poor. In addition, the contact area between the wafer box and the wafer is large, so there are many cleaning dead angles, which affects the cleaning effect of the wafer. Summary of the invention

[0004] The technical problem to be solved by the present invention is to overcome the defect of poor cleaning effect of dissolved silicon carbide wafers in the prior art and to provide a dissolved silicon carbide wafer cleaning device and method thereof.

[0005] The present invention solves the above technical problems through the following technical solutions: The present invention provides a molten silicon carbide wafer cleaning device and method thereof, wherein the cleaning device comprises a cleaning outer frame, A cleaning screen frame, wherein two cleaning screen frames are arranged in the inner cavity of the cleaning outer frame, and the cleaning screen frames are used to place the dissolved silicon carbide wafers; A cleaning module, wherein the cleaning module comprises a plurality of partition frames, wherein the cleaning net frame is provided with a plurality of partition frames, wherein a power assembly is provided inside the partition frames, wherein cleaning assemblies are provided on both sides of the partition frames, and the cleaning assemblies are connected to the power assembly, and a clamping and fixing assembly is provided between the two partition frames, wherein both ends of the clamping and fixing assembly are respectively connected to the cleaning assembly, wherein the cleaning assembly is used for auxiliary cleaning of the dissolved silicon carbide wafer, and the clamping and fixing assembly is used for clamping and fixing the dissolved silicon carbide wafer; An adjustment module, the adjustment module includes a height control component and a rotation component, the height control component is installed on the top of the inner cavity of the cleaning outer frame, the lower part of the height control component is connected to the rotation component, and the height control component and the rotation component are respectively connected to the cleaning net frame, the height control component is used to adjust the height of the cleaning net frame, and in the process of adjusting the height of the cleaning net frame, the rotation component is driven to operate to rotate the cleaning net frame; A cleaning component is installed on the top of the cleaning outer frame and is used to spray cleaning liquid into the cleaning outer frame.

[0006] In the technical scheme, the dissolved silicon carbide wafer can be clamped and fixed by the clamping and fixing component, and the dissolved silicon carbide wafer can be rinsed by the rotating component. At the same time, the height of the cleaning screen frame and the dissolved silicon carbide wafer can be adjusted by the height control component, and the cleaning screen frame and the dissolved silicon carbide wafer can be rotated when the height is adjusted, so that the dissolved silicon carbide wafer can be cleaned by combining rinsing and immersion, reducing the cleaning dead angle, thereby improving the cleaning effect; At the same time, the power component can be used to rotate the rotating tooth plate and the cleaning soft brush, and the cleaning soft brush can be used to scrub and clean the surface of the dissolved silicon carbide wafer. When the rotating tooth plate rotates, the one-way threaded column and the elastic fixing clamp can be driven to rotate, thereby driving the dissolved silicon carbide wafer to rotate, and the rotation direction is opposite to that of some cleaning soft brushes, which can improve the cleaning effect of the dissolved silicon carbide wafer, further improve the cleaning effect of the dissolved silicon carbide wafer, and improve the cleaning efficiency of the dissolved silicon carbide wafer.

[0007] Preferably, the power assembly comprises a transmission shaft, one end of which is rotatably connected to the inner wall of the partition frame, and the other end of which is rotatably connected to the partition frame and the cleaning screen frame respectively; A central bevel gear is fixedly connected to the surface of the transmission shaft, and side bevel gears are meshedly connected on both sides of the central bevel gear; An output shaft is connected to one side of the side bevel gear, and the output shaft is rotatably connected to the side surface of the partition frame, and one end of the output shaft away from the side bevel gear is connected to the cleaning component.

[0008] In the technical solution, the power component is used to provide driving force for the rotation of the cleaning component.

[0009] Preferably, a protective shell is installed on the surface of the cleaning screen frame, and a dual-axis power source is installed in the inner cavity of the protective shell; Both output ends of the dual-axis power source are connected to a mounting shaft, a surface of the mounting shaft is connected to a plurality of bevel gears 1, a side surface of the bevel gear 1 is meshingly connected to a bevel gear 2, and the bevel gear 2 is connected to one end of the transmission shaft.

[0010] In this technical solution, structures such as a protective housing can be used to provide driving force for multiple transmission shafts at the same time.

[0011] Preferably, the cleaning assembly comprises a rotating tooth plate, one side of the rotating tooth plate is connected to one end of the output shaft, and the side surface of the rotating tooth plate is meshedly connected with a ring gear; One side of the ring gear is slidably connected to a limiting track, and the limiting track is installed on the inner wall of the cleaning screen frame; A plurality of mounting plates are connected to one side of the rotating tooth plate away from the output shaft, and a cleaning soft brush is connected to both the mounting plate and one side of the rotating tooth plate.

[0012] In the technical solution, the cleaning component can be used to scrub the dissolved silicon carbide wafer.

[0013] Preferably, the end of the mounting plate away from the cleaning soft brush is connected with a rotating shaft, and the surface of the rotating shaft is rotatably connected with the rotating gear plate; The end of the rotating shaft away from the cleaning soft brush is connected to the rotating gear, and a plurality of rotating gears are arranged on the side of the rotating gear plate away from the mounting plate. The plurality of rotating gears are meshed and connected, and the rotating gears located at the edge are meshed and connected with the inner side of the inner gear ring, and the inner gear ring is installed on the inner wall of the cleaning screen frame.

[0014] In the technical solution, the mounting plate and the cleaning soft brush can be rotated along with the rotation of the rotating gear plate by utilizing structures such as the rotating gear and the inner gear ring.

[0015] Preferably, the clamping and fixing assembly comprises two one-way threaded columns, and the two one-way threaded columns are respectively rotatably connected to one side of the ring gear; The surface of the one-way threaded column is threadedly connected with a movable plate, and opposite sides of the two movable plates are connected with elastic fixing clips; A connecting gear is fixedly connected to the surface of the one-way threaded column, a side surface of the connecting gear is meshed and connected with the outer side of the outer gear ring, and one side of the outer gear ring is connected to one side of the rotating gear plate.

[0016] In the technical solution, when the rotating tooth plate rotates, the one-way threaded column and the elastic fixing clamp can be driven to rotate, thereby driving the dissolved silicon carbide wafer to rotate, and the rotation direction is opposite to that of some cleaning soft brushes, which can improve the cleaning effect of the dissolved silicon carbide wafer.

[0017] Preferably, the height control assembly comprises a bidirectional threaded column, one end of which is rotatably connected to the inner wall of the cleaning outer frame, the other end of which is rotatably connected to the side of the cleaning outer frame, and the end of which is away from the cleaning outer frame is connected to the output end of a single-axis power source, and the single-axis power source is installed on the outside of the cleaning outer frame; The surface of the bidirectional threaded column is threadedly connected with two symmetrically distributed sliding plates, a rotating column is arranged below the sliding plate, and both ends of the rotating column are rotatably connected with rotating frames, the rotating frame located at the top is connected to the bottom of the sliding plate, and the rotating frame located at the bottom is connected to the top of the connecting strip; Both ends of the connecting strip are connected with connecting side plates, and the connecting side plates are rotatably connected to the surface of the rotating shaft. Both ends of the cleaning screen frame are connected with the rotating shaft, and one end of the rotating shaft away from the cleaning screen frame is connected to the rotating component.

[0018] In the technical solution, the height of the cleaning screen frame and other structures can be adjusted by using a height control component.

[0019] Preferably, the rotating assembly comprises a rotating gear, and the rotating gear is connected to an end of the rotating shaft away from the cleaning screen frame; The side surface of the rotating gear is meshed and connected with the fixed rack, and the upper and lower ends of the fixed rack are respectively connected with the inner wall of the cleaning outer frame.

[0020] In the technical solution, the rotating assembly can be used to rotate the cleaning screen frame when the height of the height control assembly is adjusted.

[0021] Preferably, the cleaning assembly comprises a central water storage tank, which is mounted on the top of the cleaning outer frame, and one side of the central water storage tank is connected to a water inlet port; A plurality of spraying ends are connected to the bottom of the central water storage tank, and the bottom ends of the spraying ends extend to the inner cavity of the cleaning outer frame.

[0022] In the technical solution, the cleaning component can be used to spray cleaning liquid into the cleaning outer frame.

[0023] Preferably, the method comprises the following steps: Step 1: Install the dissolved silicon carbide wafer. Install the dissolved silicon carbide wafer between two elastic fixing clamps, and use the elasticity and clamping function between the two elastic fixing clamps to clamp and fix the dissolved silicon carbide wafer. Step 2: Clean the dissolved silicon carbide wafers. Place a certain volume of cleaning liquid in the lower part of the inner cavity of the cleaning outer frame. Then connect the cleaning liquid delivery device to the central water storage tank. Then use the spraying end to spray the cleaning liquid to the cleaning frame. Use the cleaning liquid to clean the dissolved silicon carbide wafers. Step 3: Change the height of the dissolved silicon carbide wafer, and use the height control component to drive the cleaning screen frame to move up and down, so as to adjust the height of the cleaning screen frame, so that the dissolved silicon carbide wafer can be cleaned by immersion and showering, and when the height control component moves, the rotating component can be rotated, thereby driving the cleaning screen frame to rotate, so that the dissolved silicon carbide wafer can be rotated when the height is adjusted; Step 4: scrub the dissolved silicon carbide wafer. During cleaning, use a power assembly to drive the rotating toothed plate to rotate, and the rotation of the ring gear can drive a single cleaning soft brush to rotate. Use the cleaning soft brush to scrub and clean the surface of the dissolved silicon carbide wafer. When the rotating toothed plate rotates, it can drive the one-way threaded column and the elastic fixing clip to rotate, thereby driving the dissolved silicon carbide wafer to rotate, and the rotation direction is opposite to that of some cleaning soft brushes, which can improve the cleaning effect of the dissolved silicon carbide wafer.

[0024] On the basis of being in accordance with the common sense in the art, the above-mentioned preferred conditions can be arbitrarily combined to obtain the preferred embodiments of the present invention.

[0025] The positive and progressive effects of the present invention are: The present invention can clamp and fix the dissolved silicon carbide wafer by using a clamping and fixing component, and can rinse the dissolved silicon carbide wafer by using a rotating component. At the same time, the height of the cleaning net frame and the dissolved silicon carbide wafer can be adjusted by a height control component, and the cleaning net frame and the dissolved silicon carbide wafer can be rotated when the height is adjusted, so that the dissolved silicon carbide wafer can be cleaned by combining rinsing and immersion, reducing cleaning dead angles, thereby improving the cleaning effect; At the same time, the power component can be used to rotate the rotating tooth plate and the cleaning soft brush, and the cleaning soft brush can be used to scrub and clean the surface of the dissolved silicon carbide wafer. When the rotating tooth plate rotates, the one-way threaded column and the elastic fixing clamp can be driven to rotate, thereby driving the dissolved silicon carbide wafer to rotate, and the rotation direction is opposite to that of some cleaning soft brushes, which can improve the cleaning effect of the dissolved silicon carbide wafer, further improve the cleaning effect of the dissolved silicon carbide wafer, and improve the cleaning efficiency of the dissolved silicon carbide wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 The figure is a schematic structural diagram of a dissolve silicon carbide wafer cleaning device and method according to an embodiment of the present invention.

[0027] Figure 2 for Figure 1 The overall internal structure schematic diagram of the dissolved silicon carbide wafer cleaning device and method is shown.

[0028] Figure 3 for Figure 1 The overall side view structural schematic diagram of the dissolved silicon carbide wafer cleaning device and method is shown.

[0029] Figure 4 for Figure 1 The schematic diagram of the power component structure of the dissolved silicon carbide wafer cleaning device and method thereof is shown.

[0030] Figure 5 for Figure 1 The schematic diagram of the structure of the connection relationship between the rotating gear box and the rotating shaft of the internal gear ring box of the melt silicon carbide wafer cleaning device and method thereof is shown.

[0031] Figure 6 for Figure 1 The structure schematic diagram of the connection relationship between the rotating gear plate, the ring gear, the limiting track, the side bevel gear and the output shaft of the dissolved silicon carbide wafer cleaning device and method thereof is shown.

[0032] Figure 7 for Figure 2 The schematic diagram of the partially enlarged structure at position A of the dissolved silicon carbide wafer cleaning device and method shown.

[0033] Figure 8 for Figure 1 The structure schematic diagram of the connection relationship between the clamping and fixing assembly, the ring gear, the rotating gear plate and the outer gear ring of the dissolved silicon carbide wafer cleaning device and method thereof is shown.

[0034] Fig. 9 for Figure 1 The schematic diagram of the height control component structure of the dissolved silicon carbide wafer cleaning device and method thereof is shown.

[0035] Fig.10 for Figure 2 The schematic diagram of the partially enlarged structure at position B of the dissolved silicon carbide wafer cleaning device and method shown.

[0036] Fig.11 for Figure 2 The schematic diagram of the partially enlarged structure at position C of the dissolved silicon carbide wafer cleaning device and method shown.

[0037] Description of Reference Numerals 1. Clean the outer frame; 2. Clean the screen frame; 3. Separation frame; 4. Power assembly; 41. Transmission shaft; 42. Center bevel gear; 43. Side bevel gear; 44. Output shaft; 45. Dual-axis power source; 46. Mounting shaft; 47. Bevel gear one; 48. Bevel gear two; 49. Protective shell; 5. Cleaning assembly; 51. Rotating gear plate; 52. Ring gear; 53. Limiting track; 54. Mounting plate; 55. Cleaning soft brush; 56. Rotating shaft; 57. Rotating gear; 58. Internal gear ring; 6. Clamping and fixing assembly; 61. One-way threaded column; 62. Moving plate; 63. Elastic fixing clip; 64. Connecting gear; 65. External gear ring; 66. Limiting column; 7. Height control assembly; 71. Two-way threaded column; 72. Single-axis power source; 73. Sliding plate; 74. Rotating column; 75. Rotating frame; 76. Connecting strip; 77. Connecting side plate; 78. Rotating shaft; 79. Positioning column; 8. Rotating assembly; 81. Rotating gear; 82. Fixed rack; 9. Cleaning assembly; 91. Central water tank; 92. Spraying end; 10. Moving wheel. DETAILED DESCRIPTION

[0038] The present invention is further described below by way of examples, but the present invention is not limited to the scope of the examples.

[0039] Figures 1 to 11 The figure shows a schematic diagram of the structure of an embodiment of the present invention of a dissolving silicon carbide wafer cleaning device and method. The dissolving silicon carbide wafer cleaning device and method, the cleaning device comprises a cleaning outer frame 1, A cleaning screen frame 2, wherein two cleaning screen frames 2 are arranged in the inner cavity of the cleaning outer frame 1, and the cleaning screen frames 2 are used to place the dissolved silicon carbide wafer; A cleaning module, the cleaning module comprises a plurality of partition frames 3, a plurality of partition frames 3 are arranged in the cleaning net frame 2, a power assembly 4 is arranged inside the partition frame 3, cleaning assemblies 5 are arranged on both sides of the partition frame 3, and the cleaning assemblies 5 are connected to the power assembly 4, a clamping and fixing assembly 6 is arranged between the two partition frames 3, and both ends of the clamping and fixing assembly 6 are respectively connected to the cleaning assembly 5, wherein the cleaning assembly 5 is used for auxiliary cleaning of the dissolved silicon carbide wafer, and the clamping and fixing assembly 6 is used for clamping and fixing the dissolved silicon carbide wafer; An adjustment module, the adjustment module includes a height control component 7 and a rotating component 8, the height control component 7 is installed on the top of the inner cavity of the cleaning outer frame 1, the lower part of the height control component 7 is connected to the rotating component 8, and the height control component 7 and the rotating component 8 are respectively connected to the cleaning net frame 2, the height control component 7 is used to adjust the height of the cleaning net frame 2, and the rotating component 8 is pushed to operate during the height adjustment of the cleaning net frame 2 to rotate the cleaning net frame 2; A cleaning component 9 is installed on the top of the cleaning outer frame 1 , and is used for spraying cleaning liquid into the cleaning outer frame 1 .

[0040] In the present technical solution, the soluble silicon carbide wafer can be clamped and fixed by the clamping and fixing component 6, and the soluble silicon carbide wafer can be rinsed by the rotating component 8. At the same time, the height of the cleaning screen frame 2 and the soluble silicon carbide wafer can be adjusted by the height control component 7, and the cleaning screen frame 2 and the soluble silicon carbide wafer can be rotated when the height is adjusted, so that the soluble silicon carbide wafer can be cleaned by combining rinsing and immersion, reducing the cleaning dead angle, thereby improving the cleaning effect; At the same time, the power component 4 can be used to rotate the rotating tooth plate 51 and the cleaning soft brush 55, and the cleaning soft brush 55 can be used to scrub and clean the surface of the dissolved silicon carbide wafer. When the rotating tooth plate 51 rotates, the one-way threaded column 61 and the elastic fixing clip 63 can be driven to rotate, thereby driving the dissolved silicon carbide wafer to rotate, and the rotation direction is opposite to that of part of the cleaning soft brush 55, which can improve the cleaning effect of the dissolved silicon carbide wafer, further improve the cleaning effect of the dissolved silicon carbide wafer, and improve the cleaning efficiency of the dissolved silicon carbide wafer.

[0041] The power assembly 4 includes a transmission shaft 41, one end of which is rotatably connected to the inner wall of the partition frame 3, and the other end of which is rotatably connected to the partition frame 3 and the cleaning screen frame 2 respectively; A central bevel gear 42 is fixedly connected to the surface of the transmission shaft 41, and side bevel gears 43 are meshedly connected on both sides of the central bevel gear 42; An output shaft 44 is connected to one side of the side bevel gear 43 . The output shaft 44 is rotatably connected to the side surface of the partition frame 3 . One end of the output shaft 44 away from the side bevel gear 43 is connected to the cleaning assembly 5 .

[0042] In the present technical solution, the power assembly 4 can provide driving force for the rotation of the cleaning assembly 5 .

[0043] A protective shell 49 is installed on the surface of the cleaning screen frame 2, and a dual-axis power source 45 is installed in the inner cavity of the protective shell 49; Both output ends of the dual-axis power source 45 are connected to a mounting shaft 46 , and a plurality of bevel gears 1 47 are connected to the surface of the mounting shaft 46 . The side of the bevel gear 1 47 is meshedly connected to a bevel gear 2 48 , and the bevel gear 2 48 is connected to one end of the transmission shaft 41 .

[0044] In this technical solution, a protective housing 49 and other structures can be used to provide driving force for multiple transmission shafts 41 at the same time.

[0045] During cleaning, the dual-axis power source 45 is used to drive the mounting shaft 46 to rotate, thereby driving the bevel gear 1 47 to rotate, and then driving the bevel gear 2 48 to rotate; When the bevel gear 2 48 rotates, the transmission shaft 41 can be driven to rotate, thereby driving the side bevel gear 43 to rotate, and at this time, the output shaft 44 can be driven to rotate.

[0046] The cleaning assembly 5 includes a rotating gear plate 51, one side of the rotating gear plate 51 is connected to one end of the output shaft 44, and the side of the rotating gear plate 51 is meshedly connected with a ring gear 52; One side of the ring gear 52 is slidably connected to a limiting rail 53, and the limiting rail 53 is installed on the inner wall of the cleaning screen frame 2; A plurality of mounting plates 54 are connected to a side of the rotating gear plate 51 away from the output shaft 44 , and a cleaning soft brush 55 is connected to each of the mounting plates 54 and a side of the rotating gear plate 51 .

[0047] In the present technical solution, the cleaning component 5 can be used to scrub the dissolved silicon carbide wafer.

[0048] The end of the mounting plate 54 away from the cleaning soft brush 55 is connected to a rotating shaft 56, and the surface of the rotating shaft 56 is rotatably connected to the rotating gear plate 51; One end of the rotating shaft 56 away from the cleaning soft brush 55 is connected to the rotating gear 57, and a plurality of rotating gears 57 are provided on the side of the rotating gear plate 51 away from the mounting plate 54. The plurality of rotating gears 57 are meshed and connected, and the rotating gear 57 located at the edge is meshed and connected with the inner side of the inner gear ring 58, and the inner gear ring 58 is installed on the inner wall of the cleaning screen frame 2.

[0049] In the present technical solution, the mounting plate 54 and the cleaning soft brush 55 can be rotated along with the rotation of the rotating gear plate 51 by utilizing structures such as the rotating gear 57 and the inner gear ring 58 .

[0050] When the rotating toothed plate 51 rotates, it can drive the rotating shaft 56 to rotate, thereby driving the rotating gear 57 to rotate. At this time, under the action of the inner gear ring 58, multiple rotating gears 57 can be driven to rotate by themselves, thereby driving the rotating shaft 56 and the mounting plate 54 to rotate by themselves, thereby driving the cleaning soft brush 55 to rotate by themselves, that is, the cleaning soft brush 55 can rotate and revolve, so that the clean soft brush 55 can be used to brush the dissolved silicon carbide wafer.

[0051] When the rotating gear plate 51 rotates, the ring gear 52 can be driven to rotate along the limiting track 53 .

[0052] The clamping and fixing assembly 6 includes two one-way threaded columns 61, and the two one-way threaded columns 61 are respectively rotatably connected to one side of the ring gear 52; The surface of the one-way threaded column 61 is threadedly connected with a moving plate 62, and two opposite sides of the moving plates 62 are connected with elastic fixing clips 63; A connecting gear 64 is fixedly connected to the surface of the one-way threaded column 61 . The side surface of the connecting gear 64 is meshed and connected with the outer side of the outer gear ring 65 . One side of the outer gear ring 65 is connected to one side of the rotating gear plate 51 .

[0053] In the present technical solution, when the rotating tooth plate 51 rotates, the one-way threaded column 61 and the elastic fixing clip 63 can be driven to rotate, thereby driving the dissolved silicon carbide wafer to rotate, and the rotation direction is opposite to that of the partial cleaning soft brush 55, which can improve the cleaning effect of the dissolved silicon carbide wafer.

[0054] When the ring gear 52 rotates, the one-way threaded column 61 can be driven to rotate, thereby driving the movable plate 62 and the elastic fixing clamp 63 to rotate, and then driving the dissolved silicon carbide wafer to rotate. The rotation direction of the dissolved silicon carbide wafer is opposite to that of the cleaning soft brush 55, so the cleaning soft brush 55 is used to brush the surface of the dissolved silicon carbide wafer, thereby improving the cleaning effect of the dissolved silicon carbide wafer.

[0055] The height control assembly 7 includes a bidirectional threaded column 71, one end of which is rotatably connected to the inner wall of the cleaning outer frame 1, and the other end of which is rotatably connected to the side of the cleaning outer frame 1, and the end of the bidirectional threaded column 71 away from the cleaning outer frame 1 is connected to the output end of a single-axis power source 72, and the single-axis power source 72 is installed on the outside of the cleaning outer frame 1; The surface of the bidirectional threaded column 71 is threadedly connected with two symmetrically distributed sliding plates 73, a rotating column 74 is arranged below the sliding plate 73, and both ends of the rotating column 74 are rotatably connected with a rotating frame 75, the rotating frame 75 located at the top is connected to the bottom of the sliding plate 73, and the rotating frame 75 located at the bottom is connected to the top of the connecting bar 76; Both ends of the connecting strip 76 are connected with connecting side plates 77, and the connecting side plates 77 are rotatably connected to the surface of the rotating shaft 78. Both ends of the cleaning screen frame 2 are connected with the rotating shaft 78, and the end of the rotating shaft 78 away from the cleaning screen frame 2 is connected to the rotating component 8.

[0056] In the present technical solution, the height of the cleaning screen frame 2 and other structures can be adjusted by using the height control component 7 .

[0057] During cleaning, a single-axis power source 72 is utilized to drive the bidirectional threaded column 71 to rotate, thereby driving the sliding plates 73 on both sides to move toward or away from each other along the positioning columns 79, thereby causing the rotating column 74 to rotate with the cooperation of the rotating frame 75, thereby driving the connecting bar 76 to move up and down. At this time, the connecting side plates 77 and the rotating shaft 78 can be driven to move in the same direction, thereby driving the cleaning screen frame 2 and other structures to move in the same direction, so that the dissolved silicon carbide wafer can move up and down, and the dissolved silicon carbide wafer can be sprayed and rinsed when it is at the top, and can be immersed and cleaned when it is at the bottom.

[0058] The rotating assembly 8 includes a rotating gear 81, and the rotating gear 81 is connected to an end of the rotating shaft 78 away from the cleaning screen frame 2; The side surface of the rotating gear 81 is meshed and connected with the fixed rack 82 , and the upper and lower ends of the fixed rack 82 are respectively connected to the inner wall of the cleaning outer frame 1 .

[0059] In the present technical solution, the rotating assembly 8 can be used to rotate the cleaning screen frame 2 when the height control assembly 7 is adjusted in height.

[0060] When the rotating shaft 78 moves, the rotating gear 81 can be driven to move. At this time, under the action of the rotating gear 81, the rotating gear 81 can be rotated, thereby driving the rotating shaft 78 and the cleaning screen frame 2 and other structures to rotate, so that the cleaning screen frame 2 and other structures can rotate while moving at a high altitude.

[0061] The cleaning assembly 9 includes a central water storage tank 91, which is installed on the top of the cleaning outer frame 1, and one side of the central water storage tank 91 is connected to a water inlet port; A plurality of spray heads 92 are connected to the bottom of the central water storage tank 91 , and the bottom ends of the spray heads 92 extend to the inner cavity of the cleaning outer frame 1 .

[0062] In the present technical solution, the cleaning component 9 can be used to spray cleaning liquid into the cleaning outer frame 1 .

[0063] The water inlet port is raised to connect the cleaning liquid delivery device to the central water storage tank 91, and then the cleaning liquid is sprayed toward the cleaning frame 2 by the spraying end 92, and the dissolved silicon carbide wafer is cleaned by the cleaning liquid.

[0064] The front of the cleaning outer frame 1 is hinged with a pick-up and placement door, the side of the cleaning net frame 2 is equipped with a plurality of placement doors, and one side of the cleaning outer frame 1 is equipped with a discharge port.

[0065] The cleaning screen frame 2 is connected to two symmetrically distributed reinforcing side plates, and one end of the transmission shaft 41 away from the dual-axis power source 45 is rotatably connected to the reinforcing side plates.

[0066] Limiting columns 66 are respectively arranged on both sides of the one-way threaded column 61. The surface of the limiting column 66 is slidably connected with the movable plate 62. Both ends of the limiting column 66 are respectively connected to the ring gear 52. When in use, the movable plate 62 moves along the limiting column 66. The limiting column 66 can limit the moving trajectory of the movable plate 62.

[0067] The inner wall of the cleaning outer frame 1 is connected with a plurality of positioning posts 79, and the surfaces of the positioning posts 79 are slidably connected to the sliding plate 73. When the sliding plate 73 moves, it moves along the positioning posts 79, and the positioning posts 79 limit the moving track of the sliding plate 73.

[0068] A plurality of moving wheels 10 are installed at the bottom of the cleaning outer frame 1 , and the cleaning outer frame 1 can be conveniently moved by using the moving wheels 10 .

[0069] The method comprises the following steps: Step 1: Install the dissolved silicon carbide wafer. Install the dissolved silicon carbide wafer between the two elastic fixing clamps 63, and use the elasticity and clamping function between the two elastic fixing clamps 63 to clamp and fix the dissolved silicon carbide wafer. Step 2: Clean the dissolved silicon carbide wafers. A certain volume of cleaning liquid is stored in the lower part of the inner cavity of the cleaning outer frame 1. Then, the cleaning liquid delivery device is connected to the central water storage tank 91. Then, the cleaning liquid is sprayed toward the cleaning net frame 2 by the spraying end 92. The dissolved silicon carbide wafers are cleaned by the cleaning liquid. Step 3: Change the height of the dissolved silicon carbide wafer, and use the height control component 7 to drive the cleaning frame 2 to move up and down, so as to adjust the height of the cleaning frame 2, so that the dissolved silicon carbide wafer can be cleaned by immersion and showering, and when the height control component 7 moves, the rotating component 8 can be rotated, thereby driving the cleaning frame 2 to rotate, so that the dissolved silicon carbide wafer can be rotated when the height is adjusted; Step 4, scrubbing the dissolved silicon carbide wafer. During cleaning, the power assembly 4 is used to drive the rotating toothed plate 51 to rotate, and the rotation of the ring gear 52 can respectively drive a single cleaning soft brush 55 to rotate. The cleaning soft brush 55 is used to scrub and clean the surface of the dissolved silicon carbide wafer. When the rotating toothed plate 51 rotates, the one-way threaded column 61 and the elastic fixing clip 63 can be driven to rotate, thereby driving the dissolved silicon carbide wafer to rotate, and the rotation direction is opposite to that of some cleaning soft brushes 55, which can improve the cleaning effect of the dissolved silicon carbide wafer.

[0070] The dual-axis power source 45 is a dual-axis motor or other equipment that can output bidirectional rotational kinetic energy.

[0071] The bidirectional threaded column 71 is a single-axis motor or other equipment that can output rotational kinetic energy.

[0072] Although the specific embodiments of the present invention are described above, it should be understood by those skilled in the art that this is only for illustration. Those skilled in the art may make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, but these changes and modifications all fall within the scope of protection of the present invention.

Claims

1. A solution silicon carbide wafer cleaning device, comprising a cleaning outer frame (1), characterized in that: The dissolved silicon carbide wafer cleaning device further comprises: a cleaning screen frame (2), wherein two cleaning screen frames (2) are arranged in the inner cavity of the cleaning outer frame (1), and the cleaning screen frames (2) are used for placing the dissolved silicon carbide wafer; A cleaning module, the cleaning module comprising a plurality of partition frames (3), the plurality of partition frames (3) being arranged inside the cleaning net frame (2), a power assembly (4) being arranged inside the partition frames (3), cleaning assemblies (5) being arranged on both sides of the partition frames (3), and the cleaning assemblies (5) being connected to the power assembly (4), a clamping and fixing assembly (6) being arranged between the two partition frames (3), and both ends of the clamping and fixing assembly (6) being respectively connected to the cleaning assembly (5), wherein the cleaning assembly (5) is used for auxiliary cleaning of the dissolved silicon carbide wafer, and the clamping and fixing assembly (6) is used for clamping and fixing the dissolved silicon carbide wafer; An adjustment module, the adjustment module comprising a height control component (7) and a rotating component (8), the height control component (7) being mounted on the top of the inner cavity of the cleaning outer frame (1), the lower portion of the height control component (7) being connected to the rotating component (8), and the height control component (7) and the rotating component (8) being connected to the cleaning net frame (2) respectively, the height control component (7) being used to adjust the height of the cleaning net frame (2), and in the process of adjusting the height of the cleaning net frame (2), the rotating component (8) is driven to operate, thereby rotating the cleaning net frame (2); A cleaning component (9), the cleaning component (9) being mounted on the top of the cleaning outer frame (1), the cleaning component (9) being used to spray cleaning liquid into the cleaning outer frame (1).

2. The molten silicon carbide wafer cleaning device according to claim 1, characterized in that: The power assembly (4) comprises a transmission shaft (41), one end of the transmission shaft (41) being rotatably connected to the inner wall of the partition frame (3), and the other end of the transmission shaft (41) being rotatably connected to the partition frame (3) and the cleaning screen frame (2) respectively; A central bevel gear (42) is fixedly connected to the surface of the transmission shaft (41); and side bevel gears (43) are meshingly connected to both sides of the central bevel gear (42); An output shaft (44) is connected to one side of the side bevel gear (43), and the output shaft (44) is rotatably connected to the side of the partition frame (3). An end of the output shaft (44) away from the side bevel gear (43) is connected to the cleaning assembly (5).

3. The molten silicon carbide wafer cleaning device according to claim 2, characterized in that: A protective shell (49) is installed on the surface of the cleaning screen frame (2), and a dual-axis power source (45) is installed in the inner cavity of the protective shell (49); Both output ends of the dual-shaft power source (45) are connected to a mounting shaft (46), a plurality of bevel gears (47) are connected to the surface of the mounting shaft (46), a bevel gear (47) is meshingly connected to a bevel gear (48) on the side of the bevel gear (47), and the bevel gear (48) is connected to one end of the transmission shaft (41).

4. The molten silicon carbide wafer cleaning device according to claim 1, characterized in that: The cleaning assembly (5) comprises a rotating toothed plate (51), one side of the rotating toothed plate (51) is connected to one end of the output shaft (44), and the side surface of the rotating toothed plate (51) is meshingly connected to a ring gear (52); One side of the ring gear (52) is slidably connected to a limiting rail (53), and the limiting rail (53) is mounted on the inner wall of the cleaning screen frame (2); A plurality of mounting plates (54) are connected to a side of the rotating toothed plate (51) away from the output shaft (44), and a cleaning soft brush (55) is connected to one side of the mounting plates (54) and the rotating toothed plate (51).

5. The molten silicon carbide wafer cleaning device according to claim 4, characterized in that: One end of the mounting plate (54) away from the cleaning soft brush (55) is connected to a rotating shaft (56), and a surface of the rotating shaft (56) is rotatably connected to the rotating tooth plate (51); One end of the rotating shaft (56) away from the cleaning soft brush (55) is connected to a rotating gear (57); a plurality of rotating gears (57) are provided on a side of the rotating gear plate (51) away from the mounting plate (54); the plurality of rotating gears (57) are meshedly connected; and the rotating gears (57) located at the edge are meshedly connected to the inner side of an inner gear ring (58); and the inner gear ring (58) is mounted on the inner wall of the cleaning screen frame (2).

6. The molten silicon carbide wafer cleaning device according to claim 1, characterized in that: The clamping and fixing assembly (6) comprises two one-way threaded columns (61), and the two one-way threaded columns (61) are respectively rotatably connected to one side of the ring gear (52); A movable plate (62) is threadedly connected to the surface of the one-way threaded column (61), and elastic fixing clips (63) are connected to opposite sides of the two movable plates (62); A connecting gear (64) is fixedly connected to the surface of the one-way threaded column (61); a side surface of the connecting gear (64) is meshingly connected to the outside of an outer gear ring (65); and one side of the outer gear ring (65) is connected to one side of a rotating gear plate (51).

7. The molten silicon carbide wafer cleaning device according to claim 1, characterized in that: The height control assembly (7) comprises a bidirectional threaded column (71), one end of the bidirectional threaded column (71) is rotatably connected to the inner wall of the cleaning outer frame (1), the other end of the bidirectional threaded column (71) is rotatably connected to the side of the cleaning outer frame (1), and the end of the bidirectional threaded column (71) away from the cleaning outer frame (1) is connected to the output end of a single-axis power source (72), and the single-axis power source (72) is installed on the outside of the cleaning outer frame (1); The surface of the bidirectional threaded column (71) is threadedly connected to two symmetrically distributed sliding plates (73), a rotating column (74) is arranged below the sliding plate (73), and both ends of the rotating column (74) are rotatably connected to rotating frames (75), the rotating frame (75) located at the top is connected to the bottom of the sliding plate (73), and the rotating frame (75) located at the bottom is connected to the top of the connecting bar (76); Both ends of the connecting strip (76) are connected to connecting side plates (77), and the connecting side plates (77) are rotatably connected to the surface of the rotating shaft (78). Both ends of the cleaning screen frame (2) are connected to the rotating shaft (78), and one end of the rotating shaft (78) away from the cleaning screen frame (2) is connected to the rotating assembly (8).

8. The molten silicon carbide wafer cleaning device according to claim 1, characterized in that: The rotating assembly (8) comprises a rotating gear (81), wherein the rotating gear (81) is connected to an end of the rotating shaft (78) away from the cleaning screen frame (2); The side surface of the rotating gear (81) is meshedly connected with the fixed rack (82), and the upper and lower ends of the fixed rack (82) are respectively connected to the inner wall of the cleaning outer frame (1).

9. The molten silicon carbide wafer cleaning device according to claim 1, characterized in that: The cleaning assembly (9) comprises a central water storage tank (91), the central water storage tank (91) being mounted on the top of the cleaning outer frame (1), and one side of the central water storage tank (91) being connected to a water inlet port; The bottom of the central water storage tank (91) is connected to a plurality of spray heads (92), and the bottom ends of the spray heads (92) extend to the inner cavity of the cleaning outer frame (1).

10. A method for cleaning a dissolved silicon carbide wafer, using the dissolved silicon carbide wafer cleaning device according to any one of claims 1 to 9 for cleaning, characterized in that: The method comprises the following steps: Step 1: Install the dissolved silicon carbide wafer, install the dissolved silicon carbide wafer to the position between the two elastic fixing clamps (63), and use the elasticity and clamping function between the two elastic fixing clamps (63) to clamp and fix the dissolved silicon carbide wafer; Step 2: Cleaning the dissolved silicon carbide wafers, storing a certain volume of cleaning liquid in the lower part of the inner cavity of the cleaning outer frame (1), then connecting the cleaning liquid delivery device to the central water storage tank (91), and then using the spraying end (92) to spray the cleaning liquid onto the cleaning net frame (2), and using the cleaning liquid to clean the dissolved silicon carbide wafers; Step 3: Changing the height of the dissolved silicon carbide wafer, using the height control component (7) to drive the cleaning screen frame (2) to move up and down, thereby adjusting the height of the cleaning screen frame (2), so that the dissolved silicon carbide wafer can be cleaned by immersion and showering, and when the height control component (7) moves, the rotating component (8) rotates, thereby driving the cleaning screen frame (2) to rotate, so that the dissolved silicon carbide wafer rotates when the height is adjusted; Step 4: scrubbing the dissolved silicon carbide wafer. During cleaning, the power assembly (4) is used to drive the rotating toothed plate (51) to rotate, and the rotation of the ring gear (52) drives the individual cleaning soft brushes (55) to rotate. The cleaning soft brushes (55) are used to scrub and clean the surface of the dissolved silicon carbide wafer. When the rotating toothed plate (51) rotates, the one-way threaded column (61) and the elastic fixing clamp (63) are driven to rotate, thereby driving the dissolved silicon carbide wafer to rotate, and the rotation direction is opposite to that of some of the cleaning soft brushes (55), so as to improve the cleaning effect of the dissolved silicon carbide wafer.

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