A dissolution silicon carbide wafer cleaning device and method

Abstract

The present invention discloses a device and method for cleaning dissolved silicon carbide wafers, comprising a cleaning outer frame, a cleaning screen frame, and a cleaning screen frame for placing dissolved silicon carbide wafers; a cleaning component for assisting in cleaning the dissolved silicon carbide wafers; a clamping and fixing component for clamping and fixing the dissolved silicon carbide wafers; a height control component for adjusting the height of the cleaning screen frame; and a rotating component for driving the cleaning screen frame to rotate during the height adjustment process. The present invention utilizes the clamping and fixing component to clamp and fix the dissolved silicon carbide wafers, utilizes the rotating component to rinse the dissolved silicon carbide wafers, and simultaneously utilizes the height control component to adjust the height of the cleaning screen frame and the dissolved silicon carbide wafers, and when the height is adjusted, the cleaning screen frame and the dissolved silicon carbide wafers can be rotated, thereby achieving a method of cleaning the dissolved silicon carbide wafers by combining rinsing and immersion, thereby improving the cleaning effect.

Description

Technical Field

[0001] The present invention relates to the field of dissolution silicon carbide wafer cleaning, and in particular to a dissolution silicon carbide wafer cleaning device and method. Background Art

[0002] Silicon carbide wafers are primarily used in LED solid-state lighting and high-frequency devices. This material boasts superior properties, including bandgap, drift velocity, breakdown voltage, thermal conductivity, and high-temperature resistance, several times higher than those of conventional silicon. This material offers irreplaceable advantages in electronics applications involving high temperature, high voltage, high frequency, high power, optoelectronics, radiation resistance, and microwave resistance, as well as in extreme environments such as aerospace, military, and nuclear power. In semiconductor device applications, as silicon carbide production costs decrease, its superior performance could potentially replace silicon as a chip, breaking the inherent performance bottleneck of silicon chips and revolutionizing the electronics industry. Silicon carbide's primary applications include LED solid-state lighting and high-frequency devices. In the future, the mobile phone and laptop backlighting market will drive significant demand growth for silicon carbide.

[0003] Silicon carbide is very hard, has excellent thermal and electrical conductivity, and is resistant to oxidation at high temperatures. However, the silicon carbide focusing ring itself is very brittle and easily shattered when subjected to external forces during cleaning. Dissolved silicon carbide is a type of silicon carbide. In the invention patent with publication number CN117766440A, entitled "Dissolved Silicon Carbide Wafer Cleaning Device and Method," a buffer stop is provided. During placement of the wafer into the wafer cassette, the buffer plate is adapted to slow the wafer's descent, preventing the wafer from descending too quickly and causing the bottom wall of the wafer to strike the transmission post. After the wafer contacts the transmission post, the two buffer plates can limit the wafer from above to increase the friction between the wafer's circumferential wall and the transmission post. However, in the above-mentioned prior art, the wafer is cleaned solely by flushing, resulting in poor cleaning results. Furthermore, the contact area between the wafer cassette and the wafer is large, resulting in numerous blind spots, which affect the cleaning effect of the wafer. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the defect of poor cleaning effect of dissolved silicon carbide wafers in the prior art and to provide a dissolved silicon carbide wafer cleaning device and method.

[0005] The present invention solves the above technical problems through the following technical solutions:

[0006] The present invention provides a solution silicon carbide wafer cleaning device and method thereof, wherein the cleaning device comprises a cleaning outer frame,

[0007] Cleaning screen frames, two cleaning screen frames are provided in the inner cavity of the cleaning outer frame, and the cleaning screen frames are used to place the dissolved silicon carbide wafers;

[0008] A cleaning and consolidation module, comprising a plurality of partition frames, a plurality of partition frames being arranged inside the cleaning net frame, a power assembly being arranged inside the partition frames, a cleaning assembly being arranged on both sides of the partition frames, and the cleaning assembly being connected to the power assembly, a clamping and fixing assembly being arranged between the two partition frames, the two ends of the clamping and fixing assembly being respectively connected to the cleaning assembly, wherein the cleaning assembly is used to assist in cleaning the dissolved silicon carbide wafer, and the clamping and fixing assembly is used to clamp and fix the dissolved silicon carbide wafer;

[0009] An adjustment module, comprising a height control assembly and a rotation assembly. The height control assembly is mounted on the top of the inner cavity of the cleaning outer frame. The lower portion of the height control assembly is connected to the rotation assembly, and the height control assembly and the rotation assembly are respectively connected to the cleaning screen frame. The height control assembly is used to adjust the height of the cleaning screen frame. During the height adjustment process of the cleaning screen frame, the rotation assembly is driven to operate and rotate the cleaning screen frame.

[0010] A cleaning component is installed on the top of the cleaning outer frame and is used for spraying cleaning liquid into the cleaning outer frame.

[0011] In this technical solution, the dissolved silicon carbide wafer can be clamped and fixed by using a clamping and fixing component, and the dissolved silicon carbide wafer can be rinsed by using a rotating component. At the same time, the height of the cleaning frame and the dissolved silicon carbide wafer can be adjusted by a height control component, and the cleaning frame and the dissolved silicon carbide wafer can be rotated during the height adjustment, thereby realizing the cleaning of the dissolved silicon carbide wafer by combining rinsing and immersion, reducing cleaning dead angles, and thus improving the cleaning effect;

[0012] At the same time, the power component can be used to rotate the rotating tooth plate and the cleaning soft brush, and the cleaning soft brush is used to scrub and clean the surface of the dissolved silicon carbide wafer. When the rotating tooth plate rotates, the one-way threaded column and the elastic fixing clip can be driven to rotate, thereby driving the dissolved silicon carbide wafer to rotate, and the rotation direction is opposite to that of some cleaning soft brushes, which can improve the cleaning effect of the dissolved silicon carbide wafer, further improve the cleaning effect of the dissolved silicon carbide wafer, and improve the cleaning efficiency of the dissolved silicon carbide wafer.

[0013] Preferably, the power assembly includes a transmission shaft, one end of which is rotatably connected to the inner wall of the partition frame, and the other end of which is rotatably connected to the partition frame and the cleaning screen frame respectively;

[0014] A central bevel gear is fixedly connected to the surface of the transmission shaft, and side bevel gears are meshed and connected on both sides of the central bevel gear;

[0015] An output shaft is connected to one side of the side bevel gear. The output shaft is rotatably connected to the side surface of the partition frame. One end of the output shaft away from the side bevel gear is connected to the cleaning component.

[0016] In this technical solution, the power component is used to provide driving force for the rotation of the cleaning component.

[0017] Preferably, a protective shell is installed on the surface of the cleaning screen frame, and a dual-axis power source is installed in the inner cavity of the protective shell;

[0018] Both output ends of the dual-shaft power source are connected to a mounting shaft, a surface of the mounting shaft is connected to a plurality of bevel gears 1, a side surface of the bevel gear 1 is meshedly connected to a bevel gear 2, and the bevel gear 2 is connected to one end of the transmission shaft.

[0019] In this technical solution, structures such as a protective shell can be used to provide driving force for multiple transmission shafts at the same time.

[0020] Preferably, the cleaning assembly includes a rotating gear plate, one side of the rotating gear plate is connected to one end of the output shaft, and the side surface of the rotating gear plate is meshedly connected with a ring gear;

[0021] One side of the ring gear is slidably connected to a limiting rail, and the limiting rail is installed on the inner wall of the cleaning screen frame;

[0022] A side of the rotating gear plate away from the output shaft is connected to a plurality of mounting plates, and a side of the mounting plates and the rotating gear plate are both connected to a cleaning soft brush.

[0023] In this technical solution, the cleaning component can be used to scrub the solution silicon carbide wafer.

[0024] Preferably, the end of the mounting plate away from the cleaning brush is connected to a rotating shaft, and the surface of the rotating shaft is rotatably connected to the rotating gear plate;

[0025] The end of the rotating shaft away from the cleaning soft brush is connected to the rotating gear, and a plurality of rotating gears are provided on the side of the rotating gear plate away from the mounting plate. The plurality of rotating gears are meshed and connected, and the rotating gears located at the edge are meshed and connected with the inner side of the inner gear ring, and the inner gear ring is installed on the inner wall of the cleaning screen frame.

[0026] In this technical solution, the mounting plate and the cleaning brush are rotated by utilizing structures such as the rotating gear and the inner gear ring as the rotating gear plate rotates.

[0027] Preferably, the clamping and fixing assembly includes two one-way threaded columns, and the two one-way threaded columns are respectively rotatably connected to one side of the ring gear;

[0028] The surface of the one-way threaded column is threadedly connected to a movable plate, and two opposite sides of the movable plates are connected to elastic fixing clips;

[0029] A connecting gear is fixedly connected to the surface of the one-way threaded column, a side surface of the connecting gear is meshed and connected with the outer side of the outer gear ring, and one side of the outer gear ring is connected to one side of the rotating gear plate.

[0030] In this technical solution, when the rotating tooth plate rotates, it can drive the one-way threaded column and the elastic fixing clamp to rotate, thereby driving the dissolved silicon carbide wafer to rotate, and the rotation direction is opposite to that of some cleaning soft brushes, which can improve the cleaning effect of the dissolved silicon carbide wafer.

[0031] Preferably, the height control assembly includes a bidirectional threaded column, one end of which is rotatably connected to the inner wall of the cleaning outer frame, and the other end of which is rotatably connected to the side surface of the cleaning outer frame. The end of the bidirectional threaded column away from the cleaning outer frame is connected to the output end of a single-axis power source, and the single-axis power source is installed on the outside of the cleaning outer frame.

[0032] The surface of the bidirectional threaded column is threadedly connected to two symmetrically distributed sliding plates, a rotating column is provided below the sliding plate, and both ends of the rotating column are rotatably connected to a rotating frame, the rotating frame located above is connected to the bottom of the sliding plate, and the rotating frame located below is connected to the top of the connecting bar;

[0033] Both ends of the connecting strip are connected with connecting side plates, and the connecting side plates are rotatably connected to the surface of the rotating shaft. Both ends of the cleaning screen frame are connected with rotating shafts, and the end of the rotating shaft away from the cleaning screen frame is connected to the rotating component.

[0034] In this technical solution, the height of the cleaning screen frame and other structures can be adjusted by using a height control component.

[0035] Preferably, the rotating assembly includes a rotating gear, and the rotating gear is connected to an end of the rotating shaft away from the cleaning frame;

[0036] The side surface of the rotating gear is meshed and connected with the fixed rack, and the upper and lower ends of the fixed rack are respectively connected to the inner wall of the cleaning outer frame.

[0037] In this technical solution, the rotating component can be used to rotate the cleaning screen frame when the height of the height control component is adjusted.

[0038] Preferably, the cleaning assembly includes a central water storage tank, which is installed on the top of the cleaning outer frame, and one side of the central water storage tank is connected to a water inlet port;

[0039] The bottom of the central water storage tank is connected to a plurality of spraying ends, and the bottom ends of the spraying ends extend to the inner cavity of the cleaning outer frame.

[0040] In this technical solution, the cleaning component can be used to spray cleaning liquid into the cleaning outer frame.

[0041] Preferably, the method comprises the following steps:

[0042] Step 1: Install the solution silicon carbide wafer. Install the solution silicon carbide wafer between two elastic fixing clamps. Use the elasticity and clamping function between the two elastic fixing clamps to clamp and fix the solution silicon carbide wafer.

[0043] Step 2: Clean the dissolved silicon carbide wafers. Place a certain volume of cleaning liquid in the lower part of the inner cavity of the cleaning outer frame. Then connect the cleaning liquid delivery device to the central water tank. Then use the spray head to spray the cleaning liquid onto the cleaning frame to clean the dissolved silicon carbide wafers.

[0044] Step 3: Changing the height of the dissolved silicon carbide wafer by using a height control assembly to drive the cleaning frame to move up and down, thereby adjusting the height of the cleaning frame so that the dissolved silicon carbide wafer can be cleaned by immersion and showering. When the height control assembly moves, the rotating assembly can rotate, thereby driving the cleaning frame to rotate, so that the dissolved silicon carbide wafer can be rotated when the height is adjusted;

[0045] Step 4: Brush the dissolved silicon carbide wafer. During cleaning, use the power component to drive the rotating tooth plate to rotate, and the rotation of the ring gear can drive the individual cleaning soft brushes to rotate. Use the cleaning soft brush to brush and clean the surface of the dissolved silicon carbide wafer. When the rotating tooth plate rotates, it can drive the one-way threaded column and the elastic fixing clip to rotate, thereby driving the dissolved silicon carbide wafer to rotate, and the rotation direction is opposite to that of some cleaning soft brushes, which can improve the cleaning effect of the dissolved silicon carbide wafer.

[0046] On the basis of conforming to the common sense in this field, the above-mentioned preferred conditions can be arbitrarily combined to obtain the preferred embodiments of the present invention.

[0047] The positive progress effect of the present invention is:

[0048] The present invention utilizes a clamping and fixing assembly to clamp and fix the dissolved silicon carbide wafer, utilizes a rotating assembly to rinse the dissolved silicon carbide wafer, and simultaneously utilizes a height control assembly to adjust the height of the cleaning screen frame and the dissolved silicon carbide wafer. The cleaning screen frame and the dissolved silicon carbide wafer can be rotated during the height adjustment, thereby realizing the cleaning of the dissolved silicon carbide wafer by combining rinsing and immersion, reducing cleaning dead angles, and thus improving the cleaning effect.

[0049] At the same time, the power component can be used to rotate the rotating tooth plate and the cleaning soft brush, and the cleaning soft brush is used to scrub and clean the surface of the dissolved silicon carbide wafer. When the rotating tooth plate rotates, the one-way threaded column and the elastic fixing clip can be driven to rotate, thereby driving the dissolved silicon carbide wafer to rotate, and the rotation direction is opposite to that of some cleaning soft brushes, which can improve the cleaning effect of the dissolved silicon carbide wafer, further improve the cleaning effect of the dissolved silicon carbide wafer, and improve the cleaning efficiency of the dissolved silicon carbide wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] Figure 1 Schematic diagram of the structure of a dissolve silicon carbide wafer cleaning device and method according to an embodiment of the present invention.

[0051] Figure 2 for Figure 1 The figure shows the overall internal structure of the melt silicon carbide wafer cleaning device and method thereof.

[0052] Figure 3 for Figure 1 The figure shows an overall side view of the structure of a dissolve silicon carbide wafer cleaning device and method thereof.

[0053] Figure 4 for Figure 1 The figure shows a schematic diagram of the power component structure of the melt silicon carbide wafer cleaning device and method thereof.

[0054] Figure 5 for Figure 1 The schematic diagram of the structure of the connection relationship between the rotating gear box and the rotating shaft of the internal gear ring box of the melt silicon carbide wafer cleaning device and method thereof is shown.

[0055] Figure 6 for Figure 1 The diagram shows a structural diagram of the connection relationship between the rotating gear plate, the ring gear, the limiting rail, the side bevel gear and the output shaft of the melt silicon carbide wafer cleaning device and method thereof.

[0056] Figure 7 for Figure 2 The diagram shows a partially enlarged structural diagram of position A of a dissolve silicon carbide wafer cleaning device and method thereof.

[0057] Figure 8 for Figure 1 The diagram shows the structural connection relationship between the clamping and fixing components, the ring gear, the rotating gear plate and the outer gear ring of the melt silicon carbide wafer cleaning device and method thereof.

[0058] Figure 9 for Figure 1 The diagram shows a schematic diagram of the height control component structure of a melt silicon carbide wafer cleaning device and method thereof.

[0059] Figure 10for Figure 2 The diagram shows a partially enlarged structural diagram of position B of the dissolve silicon carbide wafer cleaning device and method thereof.

[0060] Figure 11 for Figure 2 The schematic diagram of the partially enlarged structure at position C of the dissolution silicon carbide wafer cleaning device and method is shown.

[0061] Description of Reference Numerals

[0062] 1. Cleaning the outer frame; 2. Cleaning the screen frame; 3. Separation frame; 4. Power assembly; 41. Drive shaft; 42. Center bevel gear; 43. Side bevel gear; 44. Output shaft; 45. Dual-axis power source; 46. Mounting shaft; 47. Bevel gear 1; 48. Bevel gear 2; 49. Protective housing; 5. Cleaning assembly; 51. Rotating gear plate; 52. Ring gear; 53. Limiting rail; 54. Mounting plate; 55. Cleaning brush; 56. Rotating shaft; 57. Rotating gear; 58. Inner gear ring; 6. Clamping and fixing assembly; 61. One-way threaded column; 62. Moving plate; 63. Elastic fixing clip; 64. Connecting gear; 65. External gear ring; 66. Limiting column; 7. Height control assembly; 71. Two-way threaded column; 72. Single-axis power source; 73. Sliding plate; 74. Rotating column; 75. Rotating frame; 76. Connecting strip; 77. Connecting side plate; 78. Rotating shaft; 79. Positioning column; 8. Rotating assembly; 81. Rotating gear; 82. Fixed rack; 9. Cleaning assembly; 91. Central water tank; 92. Spraying end; 10. Moving wheel. DETAILED DESCRIPTION

[0063] The present invention is further described below by way of examples, but the present invention is not limited to the scope of the examples.

[0064] Figures 1 to 11 The figure shows a schematic diagram of the structure of an embodiment of the present invention of a dissolving silicon carbide wafer cleaning device and method. The dissolving silicon carbide wafer cleaning device and method, the cleaning device comprises a cleaning outer frame 1,

[0065] Cleaning screen frame 2: two cleaning screen frames 2 are provided in the inner cavity of the cleaning outer frame 1, and the cleaning screen frames 2 are used to place the dissolved silicon carbide wafer;

[0066] A cleaning module includes a plurality of partition frames 3. The cleaning net frame 2 is provided with a plurality of partition frames 3. A power assembly 4 is provided inside the partition frames 3. Cleaning assemblies 5 are provided on both sides of the partition frames 3, and the cleaning assemblies 5 are connected to the power assembly 4. A clamping and fixing assembly 6 is provided between the two partition frames 3. Both ends of the clamping and fixing assembly 6 are respectively connected to the cleaning assembly 5. The cleaning assembly 5 is used to assist in cleaning the dissolved silicon carbide wafer, and the clamping and fixing assembly 6 is used to clamp and fix the dissolved silicon carbide wafer.

[0067] An adjustment module includes a height control component 7 and a rotation component 8. The height control component 7 is installed on the top of the inner cavity of the cleaning outer frame 1. The lower part of the height control component 7 is connected to the rotation component 8. The height control component 7 and the rotation component 8 are respectively connected to the cleaning frame 2. The height control component 7 is used to adjust the height of the cleaning frame 2. During the height adjustment process of the cleaning frame 2, the rotation component 8 is driven to operate and rotate the cleaning frame 2.

[0068] A cleaning component 9 is installed on the top of the cleaning outer frame 1 , and is used to spray cleaning liquid into the cleaning outer frame 1 .

[0069] In this technical solution, the clamping and fixing component 6 can be used to clamp and fix the dissolved silicon carbide wafer, and the rotating component 8 can be used to rinse the dissolved silicon carbide wafer. At the same time, the height of the cleaning frame 2 and the dissolved silicon carbide wafer can be adjusted by the height control component 7. When the height is adjusted, the cleaning frame 2 and the dissolved silicon carbide wafer can be rotated, thereby realizing the cleaning of the dissolved silicon carbide wafer by combining rinsing and immersion, reducing the cleaning dead angle, and thus improving the cleaning effect.

[0070] At the same time, the power component 4 can be used to rotate the rotating tooth plate 51 and the cleaning soft brush 55, and the cleaning soft brush 55 can be used to brush and clean the surface of the dissolved silicon carbide wafer. When the rotating tooth plate 51 rotates, the one-way threaded column 61 and the elastic fixing clip 63 can be driven to rotate, thereby driving the dissolved silicon carbide wafer to rotate, and the rotation direction is opposite to that of part of the cleaning soft brush 55, which can improve the cleaning effect of the dissolved silicon carbide wafer, further improve the cleaning effect of the dissolved silicon carbide wafer, and improve the cleaning efficiency of the dissolved silicon carbide wafer.

[0071] The power assembly 4 includes a transmission shaft 41, one end of which is rotatably connected to the inner wall of the partition frame 3, and the other end of which is rotatably connected to the partition frame 3 and the cleaning screen frame 2;

[0072] A central bevel gear 42 is fixedly connected to the surface of the transmission shaft 41 , and both sides of the central bevel gear 42 are meshedly connected to side bevel gears 43 ;

[0073] An output shaft 44 is connected to one side of the side bevel gear 43 . The output shaft 44 is rotatably connected to the side surface of the partition frame 3 . One end of the output shaft 44 away from the side bevel gear 43 is connected to the cleaning assembly 5 .

[0074] In this technical solution, the power component 4 can provide driving force for the rotation of the cleaning component 5.

[0075] The surface of the cleaning frame 2 is provided with a protective shell 49, and the inner cavity of the protective shell 49 is provided with a dual-axis power source 45;

[0076] Both output ends of the dual-axis power source 45 are connected to a mounting shaft 46 , and a plurality of bevel gears 47 are connected to the surface of the mounting shaft 46 . The side of the bevel gear 1 47 is meshed with a bevel gear 2 48 , and the bevel gear 2 48 is connected to one end of the transmission shaft 41 .

[0077] In this technical solution, structures such as the protective housing 49 can provide driving force for multiple transmission shafts 41 at the same time.

[0078] During cleaning, the dual-shaft power source 45 is used to drive the mounting shaft 46 to rotate, thereby driving the bevel gear 1 47 to rotate, and further driving the bevel gear 2 48 to rotate;

[0079] When the second bevel gear 48 rotates, the transmission shaft 41 is driven to rotate, thereby driving the side bevel gear 43 to rotate, and at this time, the output shaft 44 is driven to rotate.

[0080] The cleaning assembly 5 includes a rotating gear plate 51, one side of the rotating gear plate 51 is connected to one end of the output shaft 44, and the side of the rotating gear plate 51 is meshed with a ring gear 52;

[0081] One side of the ring gear 52 is slidably connected to a limiting rail 53, and the limiting rail 53 is installed on the inner wall of the cleaning frame 2;

[0082] A plurality of mounting plates 54 are connected to a side of the rotating gear plate 51 away from the output shaft 44 . A cleaning soft brush 55 is connected to each of the mounting plates 54 and one side of the rotating gear plate 51 .

[0083] In this technical solution, the cleaning component 5 can be used to scrub the solution silicon carbide wafer.

[0084] The end of the mounting plate 54 away from the cleaning brush 55 is connected to a rotating shaft 56, and the surface of the rotating shaft 56 is rotatably connected to the rotating gear plate 51;

[0085] The end of the rotating shaft 56 away from the cleaning soft brush 55 is connected to the rotating gear 57, and a plurality of rotating gears 57 are provided on the side of the rotating gear plate 51 away from the mounting plate 54. The plurality of rotating gears 57 are meshed and connected, and the rotating gears 57 located at the edge are meshed and connected with the inner side of the inner gear ring 58, and the inner gear ring 58 is installed on the inner wall of the cleaning screen frame 2.

[0086] In this technical solution, the mounting plate 54 and the cleaning brush 55 can be rotated along with the rotation of the rotating gear plate 51 by utilizing structures such as the rotating gear 57 and the inner gear ring 58 .

[0087] When the rotating gear plate 51 rotates, it can drive the rotating shaft 56 to rotate, thereby driving the rotating gear 57 to rotate. At this time, under the action of the inner gear ring 58, it can drive multiple rotating gears 57 to rotate on their own, thereby driving the rotating shaft 56 and the mounting plate 54 to rotate on their own, thereby driving the cleaning soft brush 55 to rotate on its own, that is, the cleaning soft brush 55 can rotate on its own and revolve around, so that the clean soft brush 55 can be used to brush the dissolve silicon carbide wafer.

[0088] When the rotating gear plate 51 rotates, the ring gear 52 can be driven to rotate along the limiting track 53 .

[0089] The clamping and fixing assembly 6 includes two one-way threaded columns 61, and the two one-way threaded columns 61 are respectively rotatably connected to one side of the ring gear 52;

[0090] The surface of the one-way threaded column 61 is threadedly connected to a movable plate 62 , and two opposite sides of the movable plates 62 are connected to elastic fixing clips 63 ;

[0091] A connecting gear 64 is fixedly connected to the surface of the one-way threaded column 61 . The side surface of the connecting gear 64 is meshed and connected with the outer side of the outer gear ring 65 . One side of the outer gear ring 65 is connected to one side of the rotating gear plate 51 .

[0092] In this technical solution, when the rotating tooth plate 51 rotates, it can drive the one-way threaded column 61 and the elastic fixing clip 63 to rotate, thereby driving the dissolved silicon carbide wafer to rotate, and the rotation direction is opposite to that of some cleaning soft brushes 55, which can improve the cleaning effect of the dissolved silicon carbide wafer.

[0093] When the ring gear 52 rotates, it can drive the one-way threaded column 61 to rotate, thereby driving the movable plate 62 and the elastic fixing clamp 63 to rotate, and then driving the dissolved silicon carbide wafer to rotate. The rotation direction of the dissolved silicon carbide wafer is opposite to that of the cleaning soft brush 55, so that the cleaning soft brush 55 is used to brush the surface of the dissolved silicon carbide wafer, thereby improving the cleaning effect of the dissolved silicon carbide wafer.

[0094] The height control assembly 7 includes a bidirectional threaded column 71, one end of which is rotatably connected to the inner wall of the cleaning outer frame 1, and the other end of which is rotatably connected to the side of the cleaning outer frame 1. The end of the bidirectional threaded column 71 away from the cleaning outer frame 1 is connected to the output end of a single-axis power source 72, and the single-axis power source 72 is installed on the outside of the cleaning outer frame 1;

[0095] The surface of the bidirectional threaded column 71 is threadedly connected to two symmetrically distributed sliding plates 73. A rotating column 74 is provided below the sliding plates 73. Both ends of the rotating column 74 are rotatably connected to rotating frames 75. The rotating frame 75 located above is connected to the bottom of the sliding plate 73, and the rotating frame 75 located below is connected to the top of the connecting bar 76.

[0096] Both ends of the connecting bar 76 are connected to connecting side plates 77, and the connecting side plates 77 are rotatably connected to the surface of the rotating shaft 78. Both ends of the cleaning screen frame 2 are connected to the rotating shaft 78, and the end of the rotating shaft 78 away from the cleaning screen frame 2 is connected to the rotating component 8.

[0097] In this technical solution, the height of the cleaning frame 2 and other structures can be adjusted by using the height control component 7.

[0098] During cleaning, a single-axis power source 72 is used to drive the bidirectional threaded column 71 to rotate, thereby driving the sliding plates 73 on both sides to move toward or away from each other along the positioning column 79, so that the rotating column 74 is rotated with the cooperation of the rotating frame 75, and then the connecting bar 76 is driven to move up and down. At this time, the connecting side plate 77 and the rotating shaft 78 can be driven to move in the same direction, and then the cleaning network frame 2 and other structures can be driven to move in the same direction, so that the dissolved silicon carbide wafer can be moved up and down. When the dissolved silicon carbide wafer is on the upper side, it can be sprayed and rinsed, and when the dissolved silicon carbide wafer is on the lower side, it can be immersed and cleaned.

[0099] The rotating assembly 8 includes a rotating gear 81, and the rotating gear 81 is connected to the end of the rotating shaft 78 away from the cleaning frame 2;

[0100] The side surface of the rotating gear 81 is meshed with the fixed rack 82 , and the upper and lower ends of the fixed rack 82 are respectively connected to the inner wall of the cleaning outer frame 1 .

[0101] In this technical solution, the rotating component 8 can be used to rotate the cleaning screen frame 2 when the height of the height control component 7 is adjusted.

[0102] When the rotating shaft 78 moves, it can drive the rotating gear 81 to move. At this time, under the action of the rotating gear 81, the rotating gear 81 can rotate, thereby driving the rotating shaft 78 and the cleaning screen frame 2 and other structures to rotate, so that the cleaning screen frame 2 and other structures can rotate while moving in height.

[0103] The cleaning assembly 9 includes a central water tank 91, which is installed on the top of the cleaning outer frame 1, and one side of the central water tank 91 is connected to a water inlet port;

[0104] The bottom of the central water storage tank 91 is connected to a plurality of spraying ends 92 , and the bottom ends of the spraying ends 92 extend to the inner cavity of the cleaning outer frame 1 .

[0105] In this technical solution, the cleaning component 9 can be used to spray cleaning liquid into the cleaning outer frame 1.

[0106] The water inlet port is raised to connect the cleaning liquid delivery device to the central water storage tank 91 , and then the cleaning liquid is sprayed toward the cleaning frame 2 using the spraying end 92 , and the dissolved silicon carbide wafer is cleaned using the cleaning liquid.

[0107] The front of the cleaning outer frame 1 is hinged with a take-in and place door, the side of the cleaning net frame 2 is equipped with multiple placement doors, and one side of the cleaning outer frame 1 is equipped with a discharge port.

[0108] The cleaning frame 2 is connected to two symmetrically distributed reinforcing side plates on its side, and one end of the transmission shaft 41 away from the dual-axis power source 45 is rotatably connected to the reinforcing side plates.

[0109] Limiting columns 66 are respectively provided on both sides of the one-way threaded column 61. The surface of the limiting column 66 is slidably connected to the movable plate 62. The two ends of the limiting column 66 are respectively connected to the ring gear 52. When in use, the movable plate 62 moves along the limiting column 66. The limiting column 66 can limit the moving trajectory of the movable plate 62.

[0110] The inner wall of the cleaning outer frame 1 is connected with a plurality of positioning posts 79, and the surfaces of the positioning posts 79 are slidably connected to the sliding plate 73. When the sliding plate 73 moves, it moves along the positioning posts 79, and the positioning posts 79 define the movement trajectory of the sliding plate 73.

[0111] A plurality of moving wheels 10 are installed at the bottom of the cleaning outer frame 1 , and the moving wheels 10 can be used to facilitate the movement of the cleaning outer frame 1 .

[0112] The method comprises the following steps:

[0113] Step 1: Install the solution silicon carbide wafer. Install the solution silicon carbide wafer between the two elastic fixing clamps 63. Use the elasticity and clamping function of the two elastic fixing clamps 63 to clamp and fix the solution silicon carbide wafer.

[0114] Step 2: Clean the dissolved silicon carbide wafers. Place a certain volume of cleaning liquid in the lower part of the inner cavity of the cleaning outer frame 1. Then connect the cleaning liquid delivery device to the central water storage tank 91. Then use the spray end 92 to spray the cleaning liquid onto the cleaning frame 2. Use the cleaning liquid to clean the dissolved silicon carbide wafers.

[0115] Step 3: Changing the height of the dissolved silicon carbide wafers. The height control assembly 7 is used to drive the cleaning frame 2 to move up and down, thereby adjusting the height of the cleaning frame 2 so that the dissolved silicon carbide wafers can be cleaned by immersion and showering. When the height control assembly 7 moves, the rotating assembly 8 rotates, thereby driving the cleaning frame 2 to rotate, so that the dissolved silicon carbide wafers can rotate when the height is adjusted.

[0116] Step 4: Brush the dissolved silicon carbide wafer. During cleaning, the power component 4 is used to drive the rotating tooth plate 51 to rotate, and the rotation of the ring gear 52 can drive the individual cleaning soft brushes 55 to rotate respectively. The cleaning soft brushes 55 are used to brush and clean the surface of the dissolved silicon carbide wafer. When the rotating tooth plate 51 rotates, the one-way threaded column 61 and the elastic fixing clip 63 can be driven to rotate, thereby driving the dissolved silicon carbide wafer to rotate, and the rotation direction is opposite to that of some cleaning soft brushes 55, which can improve the cleaning effect of the dissolved silicon carbide wafer.

[0117] The dual-axis power source 45 is a dual-axis motor or other equipment that can output bidirectional rotational kinetic energy.

[0118] The bidirectional threaded column 71 is a single-axis motor or other equipment that can output rotational kinetic energy.

[0119] Although the above describes specific embodiments of the present invention, it should be understood by those skilled in the art that these are merely illustrative. Those skilled in the art may make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, and such changes and modifications shall fall within the scope of protection of the present invention.

Claims

1. A solution silicon carbide wafer cleaning device, comprising a cleaning outer frame (1), characterized in that: The dissolving silicon carbide wafer cleaning device further comprises: a cleaning screen frame (2), two cleaning screen frames (2) are provided at the inner cavity of the cleaning outer frame (1), and the cleaning screen frames (2) are used for placing the dissolving silicon carbide wafer; A cleaning module, the cleaning module comprising a plurality of partition frames (3), a plurality of partition frames (3) being arranged in the cleaning net frame (2), a power assembly (4) being arranged in the partition frame (3), a cleaning assembly (5) being arranged on both sides of the partition frame (3), and the cleaning assembly (5) being connected to the power assembly (4), a clamping and fixing assembly (6) being arranged between the two partition frames (3), and both ends of the clamping and fixing assembly (6) being connected to the cleaning assembly (5), wherein the cleaning assembly (5) is used for auxiliary cleaning of the dissolved silicon carbide wafer, and the clamping and fixing assembly (6) is used for clamping and fixing the dissolved silicon carbide wafer; An adjustment module, the adjustment module comprising a height control component (7) and a rotation component (8), the height control component (7) being mounted on the top of the inner cavity of the cleaning outer frame (1), the lower portion of the height control component (7) being connected to the rotation component (8), and the height control component (7) and the rotation component (8) being connected to the cleaning net frame (2) respectively, the height control component (7) being used to adjust the height of the cleaning net frame (2), and pushing the rotation component (8) to operate during the height adjustment process of the cleaning net frame (2), thereby causing the cleaning net frame (2) to rotate; A cleaning component (9), the cleaning component (9) being mounted on the top of the cleaning outer frame (1), the cleaning component (9) being used to spray cleaning liquid into the cleaning outer frame (1); The power assembly (4) includes a transmission shaft (41), one end of the transmission shaft (41) is rotatably connected to the inner wall of the partition frame (3), and the other end of the transmission shaft (41) is rotatably connected to the partition frame (3) and the cleaning screen frame (2). A central bevel gear (42) is fixedly connected to the surface of the transmission shaft (41); and side bevel gears (43) are meshedly connected on both sides of the central bevel gear (42); An output shaft (44) is connected to one side of the side bevel gear (43), the output shaft (44) is rotatably connected to the side of the partition frame (3), and one end of the output shaft (44) away from the side bevel gear (43) is connected to the cleaning component (5); A protective shell (49) is installed on the surface of the cleaning screen frame (2), and a dual-axis power source (45) is installed in the inner cavity of the protective shell (49); Both output ends of the dual-shaft power source (45) are connected to a mounting shaft (46), a surface of the mounting shaft (46) is connected to a plurality of bevel gears (47), a side surface of the bevel gear (47) is meshedly connected to a bevel gear (48), and the bevel gear (48) is connected to one end of the transmission shaft (41).

2. The dissolve silicon carbide wafer cleaning device according to claim 1, wherein: The cleaning assembly (5) comprises a rotating tooth plate (51), one side of the rotating tooth plate (51) is connected to one end of the output shaft (44), and the side of the rotating tooth plate (51) is meshedly connected to a ring gear (52); One side of the ring gear (52) is slidably connected to a limiting rail (53), and the limiting rail (53) is mounted on the inner wall of the cleaning screen frame (2); A plurality of mounting plates (54) are connected to one side of the rotating tooth plate (51) away from the output shaft (44), and a cleaning soft brush (55) is connected to one side of the mounting plates (54) and the rotating tooth plate (51).

3. The melt silicon carbide wafer cleaning device according to claim 2, wherein: One end of the mounting plate (54) away from the cleaning brush (55) is connected to a rotating shaft (56), and the surface of the rotating shaft (56) is rotatably connected to the rotating tooth plate (51); One end of the rotating shaft (56) away from the cleaning soft brush (55) is connected to the rotating gear (57), and a plurality of rotating gears (57) are provided on the side of the rotating gear plate (51) away from the mounting plate (54). The plurality of rotating gears (57) are meshed and connected, and the rotating gears (57) located at the edge are meshed and connected with the inner side of the inner gear ring (58), and the inner gear ring (58) is installed on the inner wall of the cleaning screen frame (2).

4. The melt silicon carbide wafer cleaning device according to claim 1, wherein: The clamping and fixing assembly (6) comprises two one-way threaded columns (61), and the two one-way threaded columns (61) are respectively rotatably connected to one side of the ring gear (52); The surface of the one-way threaded column (61) is threadedly connected to a movable plate (62), and opposite sides of the two movable plates (62) are connected to elastic fixing clips (63); A connecting gear (64) is fixedly connected to the surface of the one-way threaded column (61), and a side surface of the connecting gear (64) is meshedly connected to the outside of the outer gear ring (65), and one side of the outer gear ring (65) is connected to one side of the rotating gear plate (51).

5. The melt silicon carbide wafer cleaning device according to claim 1, wherein: The height control assembly (7) includes a bidirectional threaded column (71), one end of the bidirectional threaded column (71) is rotatably connected to the inner wall of the cleaning outer frame (1), the other end of the bidirectional threaded column (71) is rotatably connected to the side of the cleaning outer frame (1), and the end of the bidirectional threaded column (71) away from the cleaning outer frame (1) is connected to the output end of a single-axis power source (72), and the single-axis power source (72) is installed on the outside of the cleaning outer frame (1); The surface of the bidirectional threaded column (71) is threadedly connected to two symmetrically distributed sliding plates (73), a rotating column (74) is provided below the sliding plate (73), and both ends of the rotating column (74) are rotatably connected to a rotating frame (75), the rotating frame (75) located above is connected to the bottom of the sliding plate (73), and the rotating frame (75) located below is connected to the top of the connecting bar (76); Both ends of the connecting bar (76) are connected to connecting side plates (77), and the connecting side plates (77) are rotatably connected to the surface of the rotating shaft (78). Both ends of the cleaning screen frame (2) are connected to the rotating shaft (78), and the end of the rotating shaft (78) away from the cleaning screen frame (2) is connected to the rotating component (8).

6. The dissolve silicon carbide wafer cleaning device according to claim 1, wherein: The rotating assembly (8) includes a rotating gear (81), and the rotating gear (81) is connected to an end of the rotating shaft (78) away from the cleaning screen frame (2); The side surface of the rotating gear (81) is meshed and connected with the fixed rack (82), and the upper and lower ends of the fixed rack (82) are respectively connected to the inner wall of the cleaning outer frame (1).

7. The dissolve silicon carbide wafer cleaning device according to claim 1, wherein: The cleaning assembly (9) comprises a central water storage tank (91), the central water storage tank (91) being mounted on the top of the cleaning outer frame (1), and a water inlet port being connected to one side of the central water storage tank (91); The bottom of the central water storage tank (91) is connected to a plurality of spraying ends (92), and the bottom ends of the spraying ends (92) extend to the inner cavity of the cleaning outer frame (1).

8. A method for cleaning a dissolve silicon carbide wafer, comprising: The method comprises the following steps: Step 1: Install the dissolved silicon carbide wafer. Install the dissolved silicon carbide wafer between the two elastic fixing clamps (63). Use the elasticity and clamping function between the two elastic fixing clamps (63) to clamp and fix the dissolved silicon carbide wafer. Step 2: Cleaning the dissolved silicon carbide wafers: a certain volume of cleaning liquid is stored in the lower part of the inner cavity of the cleaning outer frame (1); then the cleaning liquid delivery device is connected to the central water storage tank (91); and then the cleaning liquid is sprayed onto the cleaning frame (2) using the spraying end (92); and the dissolved silicon carbide wafers are cleaned using the cleaning liquid; Step 3: Changing the height of the dissolved silicon carbide wafer, using the height control component (7) to drive the cleaning frame (2) to move up and down, thereby adjusting the height of the cleaning frame (2), so that the dissolved silicon carbide wafer is cleaned by immersion and showering, and when the height control component (7) moves, the rotating component (8) rotates, thereby driving the cleaning frame (2) to rotate, so that the dissolved silicon carbide wafer rotates when the height is adjusted; Step 4: scrubbing the dissolved silicon carbide wafer. During cleaning, the power assembly (4) is used to drive the rotating tooth plate (51) to rotate, and the rotation of the ring gear (52) drives the individual cleaning soft brushes (55) to rotate. The cleaning soft brushes (55) are used to scrub and clean the surface of the dissolved silicon carbide wafer. When the rotating tooth plate (51) rotates, the one-way threaded column (61) and the elastic fixing clamp (63) are driven to rotate, thereby driving the dissolved silicon carbide wafer to rotate, and the rotation direction is opposite to that of some of the cleaning soft brushes (55), so as to improve the cleaning effect of the dissolved silicon carbide wafer.

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