Dual-frequency dual-polarization tile type TR module

By integrating KA and KU radio frequency processing units in the dual-band TR module, and using hot ball welding and PCB step version integrated control power supply unit design, the existing dual-band TR module has been solved, and a dual-band dual-polarized tile TR module with high integration and compact structure is realized.

CN120109535APending Publication Date: 2025-06-06成都智芯雷通微系统技术有限公司
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Patent Information

Application Number
CN202510192854.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-02-21
Publication Date
2025-06-06

AI Technical Summary

Technical Problem

The existing dual-band TR modules are not very integrated, with large size and thickness.

Method used

A dual-frequency dual-polarized tile TR module is designed, through the integration of KA radio frequency processing unit and KU radio frequency processing unit, the electrical connection and mechanical fixation are achieved using multiple soldering balls, and the power supply unit is integrated on the PCB step plate.

Benefits of technology

The integration of the dual-band dual-polarized tile TR module is improved, the module size is reduced, and the assembly process is simplified.

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Abstract

The invention relates to the field of phased-array antennas, and relates to a dual-frequency dual-polarization tile-type TR module, and the module comprises a KA radio frequency processing unit which is used for accessing a radio frequency signal; the KA radio frequency processing unit is a single polarization unit; the KU radio frequency processing unit is used for sequentially carrying out amplitude-phase adjustment, phase adjustment and amplification on the radio frequency signal; the KU radio frequency processing unit is in a dual polarization mode. The KA radio frequency processing unit is located above the KU radio frequency processing unit; the KA radio frequency processing unit and the KU radio frequency processing unit are welded through a plurality of solder balls. According to the invention, the KA radio frequency processing unit and the KU radio frequency processing unit are integrated in the structural member in a unified manner, so that the integration level of the dual-frequency dual-polarization tile-type TR module is improved, the size of the tile-type TR module is reduced, and the assembly process is simple.
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Description

Technical Field

[0001] The present invention relates to the field of phased array antennas, and in particular to a dual-frequency dual-polarization tile-type TR module. Background Art

[0002] As the performance of phased array antenna systems improves, the assembly process of phased array antennas is gradually developing towards ultra-miniaturization, three-dimensionalization, and high integration. At present, active phased arrays are mainly divided into two types of integration: brick-type and tile-type. Conventional tile-type TR modules use structural parts to connect various functional components layer by layer, resulting in low integration of TR modules and large size and thickness.

[0003] In view of this, this application is hereby filed. Summary of the invention

[0004] The technical problem to be solved by the present invention is that the existing dual-band TR module has a low integration level and is large in size and thickness.

[0005] In order to solve the above technical problems, the present invention is implemented by the following technical solutions:

[0006] A dual-frequency dual-polarization tile-type TR module is proposed, comprising: a KA radio frequency processing unit, used for accessing a radio frequency signal; the KA radio frequency processing unit is single-polarized; a KU radio frequency processing unit, used for sequentially performing amplitude and phase adjustment, phase adjustment and amplification on the radio frequency signal; the KU radio frequency processing unit is dual-polarized; the KA radio frequency processing unit is located above the KU radio frequency processing unit; the KA radio frequency processing unit and the KU radio frequency processing unit are welded via a plurality of solder balls.

[0007] Furthermore, the KU RF processing unit includes: a power division network and multiple signal channels; the power division network includes: multiple first-level power dividers and multiple second-level power dividers; the inlet of the first-level power divider is connected to the signal input port, one outlet of the first-level power divider corresponds to the inlet of the second-level power divider, and one outlet of the second-level power divider corresponds to the inlet of the signal channel.

[0008] Furthermore, the signal channel includes: an amplitude adjuster, a phase adjuster and a bidirectional amplifier; the amplitude adjuster, the phase adjuster and the bidirectional amplifier are connected in sequence; and the inlet of the amplitude adjuster is connected to the outlet of the secondary power divider.

[0009] Furthermore, the dual-frequency dual-polarization tile-type TR module also includes: a control power supply unit; the control power supply unit and the KU RF processing unit are located on the same layer of the PCB step version; the steps of the PCB step version are bonded with gold wires; the control power supply layer is connected to the RF chip through the gold wires.

[0010] Furthermore, the KU radio frequency processing unit is pressed into the PCB step plate.

[0011] Furthermore, the KA radio frequency processing unit and the KU radio frequency processing unit are integrated in a cavity; the KA radio frequency processing unit has 32 channels, the KU radio frequency processing unit has 16 channels, and the size of the cavity is: 40mm×40mm×12mm.

[0012] Compared with the prior art, the present invention has the following advantages and beneficial effects: the KA radio frequency processing unit and the KU radio frequency processing unit are uniformly integrated in the structural member, thereby improving the integration of the dual-frequency dual-polarization tile-type TR module, reducing the size of the tile-type TR module, and simplifying the assembly process. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions of the exemplary embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0014] Figure 1 A schematic diagram of the positional relationship between the KA radio frequency processing unit and the KU radio frequency processing unit provided in an embodiment of the present invention;

[0015] Figure 2 A schematic diagram of the internal structure of a KU radio frequency processing unit provided in an embodiment of the present invention;

[0016] Figure 3 A schematic diagram of the connection relationship between the control power supply layer and the RF chip provided in an embodiment of the present invention.

[0017] Marks and corresponding parts names in the attached drawings:

[0018] 1-KA radio frequency processing unit, 2-KU radio frequency processing unit, 21-power division network, 22-signal channel, 211-primary power divider, 212-secondary power divider, 221-amplitude adjuster, 222-phase adjuster, 223-bidirectional amplifier. DETAILED DESCRIPTION

[0019] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with embodiments and drawings. The exemplary embodiments of the present invention and their description are only used to explain the present invention and are not intended to limit the present invention.

[0020] In the following description, a large number of specific details are set forth in order to provide a thorough understanding of the present invention. However, it is apparent to one of ordinary skill in the art that these specific details are not necessarily employed to practice the present invention. In other embodiments, in order to avoid obscuring the present invention, well-known structures, circuits, materials, or methods are not specifically described.

[0021] Throughout the specification, references to "one embodiment," "an embodiment," "an example," or "an example" mean that a particular feature, structure, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment of the present invention. Therefore, the phrases "one embodiment," "an embodiment," "an example," or "an example" appearing in various places throughout the specification do not necessarily all refer to the same embodiment or example. In addition, particular features, structures, or characteristics may be combined in one or more embodiments or examples in any suitable combination and / or sub-combination. In addition, it will be appreciated by those of ordinary skill in the art that the figures provided herein are for illustrative purposes and that the figures are not necessarily drawn to scale. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0022] In the description of the present invention, the directions or positional relationships indicated by terms such as “front”, “rear”, “left”, “right”, “up”, “down”, “vertical”, “horizontal”, “high”, “low”, “inside” and “outside” are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limiting the scope of protection of the present invention.

[0023] Example: Figure 1 As shown, a dual-frequency dual-polarization tile-type TR module is provided, which includes a KA radio frequency processing unit 1 and a KU radio frequency processing unit 2, and achieves high integration, compact structure and simplified assembly process through innovative design.

[0024] 1. Basic structure design

[0025] The KA RF processing unit 1 is located above the KU RF processing unit 2, and the two are electrically connected and mechanically fixed through multiple solder balls. The KA RF processing unit 1 is dedicated to accessing RF signals and is designed as a single polarization mode to optimize its signal access performance. The KU RF processing unit 2 is designed as a dual-polarization structure for precise amplitude and phase adjustment, phase adjustment, and signal amplification operations. This top-to-bottom stacking design effectively utilizes the spatial layout of the module, greatly reduces the overall size, and ensures the stability of the electrical connection.

[0026] 2. Signal distribution of KU radio frequency processing unit

[0027] The KU RF processing unit 2 includes a power division network 21 and 16 signal channels 22. The power division network 21 is composed of two primary power dividers 211 and two secondary power dividers 212. Among them, the primary power divider 211 is a one-to-two power divider, and the secondary power divider 212 is a one-to-four power divider. The inlet of each primary power divider 211 is connected to the signal input port, and its outlet is connected to the inlet of the secondary power divider 212 in a one-to-one correspondence. The outlet of the secondary power divider 212 is then connected to the inlet of the signal channel 22. This design ensures the uniform distribution of RF signals and improves the stability and efficiency of multi-channel signal processing.

[0028] 3. Signal channel internal design

[0029] The signal channel 22 is composed of an amplitude adjuster 221, a phase adjuster 222 and a bidirectional amplifier 223, which are connected in sequence to achieve refined processing of the RF signal. The inlet of the amplitude adjuster 221 is directly connected to the outlet of the secondary power divider 212 for preliminary adjustment of the signal amplitude and phase; the phase adjuster 222 further optimizes the signal phase; the bidirectional amplifier 223 amplifies the signal and supports bidirectional transmission of the signal, significantly improving the signal transmission quality and the overall performance of the module.

[0030] 4. Integrated design of control power supply unit

[0031] In another possible implementation, the KU RF processing unit 2 and the control power supply unit are placed on the same layer of the PCB step plate. The PCB step plate connects the control power supply layer with the RF chip MMIC through gold wire, ensuring the stable transmission of electrical signals and improving the overall reliability of the module. The KU RF processing unit 2 is installed in the PCB step plate by pressing, which further simplifies the module assembly process.

[0032] 5. Cavity and channel integration

[0033] In another possible implementation, the KA RF processing unit 1 and the KU RF processing unit 2 are integrated in a cavity with a size of 40mm×40mm×12mm. The KA RF processing unit 1 is designed as 32 channels, and the KU RF processing unit 2 is designed as 16 channels, which meets the requirements of multi-frequency and multi-channel applications while maximizing the use of the module's internal space. This highly integrated design greatly improves the space utilization efficiency of the TR module and significantly improves the module's performance and reliability.

[0034] In order to ensure the high integration and performance stability of the dual-band dual-polarization tile-type TR module, the construction process has been optimized as follows:

[0035] 1. Solder ball welding process

[0036] A precise solder ball welding process is used between the KA RF processing unit 1 and the KU RF processing unit 2. This process ensures the reliability and mechanical strength of the electrical connection while avoiding the thermal stress damage that may occur in traditional welding. The diameter, spacing and arrangement of the solder balls are precisely controlled using automated solder ball implantation equipment to ensure low resistance and high conductivity of the signal path.

[0037] 2. Processing and assembly of PCB step board

[0038] The manufacturing of the PCB step plate adopts a high-precision multi-layer lamination process to ensure the thickness uniformity and good conductivity between the step layers. Gold wire bonding technology is used to connect the control power supply unit and the RF chip. Ultrasonic welding or hot pressing welding technology is used to improve the stability and durability of the connection while reducing the contact resistance.

[0039] 3. Module pressing process

[0040] When the KU RF processing unit 2 is pressed onto the PCB step plate, precise alignment technology is used to ensure the positioning accuracy between components. Vacuum pressing equipment is used to remove gap gas and avoid poor contact caused by microscopic unevenness. After the cavity is assembled, high-temperature curing treatment is performed to improve the overall mechanical strength and anti-seismic performance.

[0041] 4. Multi-channel alignment and testing process

[0042] When integrating the 32-channel KA RF processing unit 1 and the 16-channel KU RF processing unit 2 in the cavity, high-precision optical alignment technology is used to ensure the consistency of the multi-channel signal path. After assembly, the amplitude, phase and amplification performance of each signal channel are calibrated one by one through the automated test system to ensure that the overall performance of the module meets the design standards.

[0043] 5. Cavity structure optimization and heat dissipation process

[0044] The cavity is designed with a heat sink or heat dissipation channel made of high thermal conductivity material, combined with a low thermal resistance packaging process to improve the heat dissipation performance of the module and ensure the stability of the RF chip under high power operation. The surface is coated with a high temperature resistant insulation layer to further enhance the environmental adaptability of the module.

[0045] In summary, the dual-frequency dual-polarization tile-type TR module proposed in this embodiment effectively integrates the KA and KU radio frequency processing units through a clever structural design, which not only realizes the dual-frequency dual-polarization function, but also greatly reduces the module size. The design of the module also pays special attention to the simplification of the assembly process, making the production process more efficient and economical, and suitable for large-scale production applications.

[0046] The specific implementation methods described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific implementation method of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A dual-frequency dual-polarization tile TR module, characterized in that: include: A KA radio frequency processing unit (1) is used for accessing a radio frequency signal; the KA radio frequency processing unit (1) is single-polarized; A KU radio frequency processing unit (2), used for sequentially performing amplitude and phase adjustment, phase adjustment and amplification on the radio frequency signal; the KU radio frequency processing unit (2) is dual-polarized; The KA radio frequency processing unit (1) is located above the KU radio frequency processing unit (2); the KA radio frequency processing unit (1) and the KU radio frequency processing unit are soldered via a plurality of solder balls.

2. A dual-frequency dual-polarization tiled TR module according to claim 1, characterized in that: The KU radio frequency processing unit (2) comprises: a power division network (21) and a plurality of signal channels (22); the power division network (21) comprises: a plurality of primary power dividers (211) and a plurality of secondary power dividers (212); an inlet of the primary power divider (211) is connected to a signal input port, an outlet of the primary power divider (211) is correspondingly connected to an inlet of the secondary power divider (212), and an outlet of the secondary power divider (212) is correspondingly connected to an inlet of the signal channel (22).

3. A dual-frequency dual-polarization tiled TR module according to claim 2, characterized in that: The signal channel (22) comprises: an amplitude adjuster (221), a phase adjuster (222) and a bidirectional amplifier (223); the amplitude adjuster (221), the phase adjuster (222) and the bidirectional amplifier (223) are connected in sequence; and an inlet of the amplitude adjuster (221) is connected to an outlet of the secondary power divider (212).

4. A dual-frequency dual-polarization tiled TR module according to any one of claims 1 to 3, characterized in that: Also includes: A control power supply unit; the control power supply unit and the KU radio frequency processing unit (2) are located on the same layer of the PCB step plate; the steps of the PCB step plate are bonded with gold wires; the control power supply layer is connected to the radio frequency chip via the gold wires.

5. A dual-frequency dual-polarization tiled TR module according to claim 4, characterized in that: The KU radio frequency processing unit (2) is pressed into the PCB step plate.

6. A dual-frequency dual-polarization tiled TR module according to any one of claims 1 to 3, characterized in that: The KA radio frequency processing unit (1) and the KU radio frequency processing unit (2) are integrated in a cavity; the KA radio frequency processing unit (1) has 32 channels, and the KU radio frequency processing unit (2) has 16 channels; the dimensions of the cavity are: 40 mm×40 mm×12 mm.