Conducting strip for electronic product and conducting strip production process

Abstract

The invention belongs to the technical field of electronic product production, and discloses a conducting strip for an electronic product and a conducting strip production process. The conducting strip for the electronic product comprises a first metal sheet and a second metal sheet, wherein a through hole is formed in the first metal sheet; a conductive coating is arranged on the surface of the second metal sheet, the second metal sheet is fixedly connected with the through hole of the first metal sheet through a press-in process, the density of the second metal sheet is larger than that of the first metal sheet, and the elastic modulus of the second metal sheet is larger than that of the first metal sheet; wherein the second metal sheet is in transition fit with the through hole, and interference amount is generated in the pressing-in process, so that the contact pressure between the second metal sheet and the first metal sheet reaches a preset value or above. According to the conducting strip for the electronic product, the structural strength and the conductivity of the conducting strip corresponding to the original gold plating position are not affected, the weight of the conducting strip is reduced, the weight of the electronic product can be reduced after the conducting strip is arranged on the electronic product, and therefore the portability and the user experience of the electronic product are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic product production, and in particular to a conductive sheet for electronic products and a production process of the conductive sheet. Background Art

[0002] The interior of electronic products is generally equipped with partially gold-plated conductive sheets, and the gold-plated locations are mostly contact locations to improve the local conductivity, corrosion resistance or oxidation resistance of the conductive sheets. For example, in mobile phone products, gold is plated at local locations on the middle plate, and the gold-plated locations are used to connect and ground to the counterpart (such as the antenna) to enhance the reception of mobile phone signals. In order to ensure the salt spray test performance of the gold-plated locations, that is, the corrosion resistance, the current substrate of the conductive sheet is generally made of stainless steel, and the corrosion resistance of stainless steel is used to improve the corrosion resistance of the gold-plated locations.

[0003] With the trend of lightweight electronic products, the current conductive sheet with stainless steel as the substrate is heavy, and the weight of electronic products will also increase accordingly, resulting in stagnation in the portability and user experience of electronic products; if a lower density aluminum sheet is used to directly replace the stainless steel substrate, not only will it be difficult to gold-plate the aluminum sheet, but the result of the product salt spray test will not meet the standard; if a gold-plated sheet is directly welded on the surface of the aluminum sheet, although it can solve the problem of failing the salt spray test, the conductivity between the aluminum sheet and the gold-plated sheet is poor, and the welding energy cannot be accurately controlled, resulting in the performance of the conductive sheet not meeting the standard.

[0004] Therefore, the existing conductive sheets have the above-mentioned defects and are in urgent need of improvement. Summary of the invention

[0005] The purpose of the present invention is to provide a conductive sheet for electronic products and a conductive sheet production process, which can reduce the weight of the conductive sheet while ensuring that the performance of the conductive sheet meets the standards, thereby reducing the overall weight of the electronic product and improving the portability and user experience of the electronic product.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] A conductive sheet for electronic products, comprising:

[0008] A first metal sheet, wherein the first metal sheet is provided with a through hole;

[0009] a second metal sheet, wherein the surface of the second metal sheet has a conductive plating layer and is fixedly connected to the through hole of the first metal sheet by a press-in process, the density of the second metal sheet is greater than the density of the first metal sheet, and the elastic modulus of the second metal sheet is greater than the elastic modulus of the first metal sheet;

[0010] There is a transition fit between the second metal sheet and the through hole, and interference is generated during the pressing process, so that the contact pressure between the second metal sheet and the first metal sheet reaches above a preset value.

[0011] Preferably, a chamfer is provided at one end of the through hole, and the second metal sheet is pressed into the through hole from the other end of the through hole. During the process of pressing the second metal sheet into the through hole, the chamfer is used to guide and accommodate the excess material of the first metal sheet that is squeezed out.

[0012] Preferably, the inner wall of the through hole and the outer wall of the second metal sheet are both provided with inclined surfaces, and when the second metal sheet is pressed into the through hole, excess material of the first metal sheet is compressed laterally.

[0013] Preferably, the first metal sheet is made of aluminum alloy or aluminum.

[0014] Preferably, the second metal sheet is made of stainless steel.

[0015] A conductive sheet production process, used to produce the conductive sheet for electronic products, comprises the following steps:

[0016] Prepare a first metal sheet, and open a through hole in the first metal sheet;

[0017] preparing a second metal sheet, wherein the surface of the second metal sheet has a conductive coating, the density of the second metal sheet is greater than the density of the first metal sheet, and the elastic modulus of the second metal sheet is greater than the elastic modulus of the first metal sheet;

[0018] Align the second metal sheet with the through hole, use a pressing head to apply a pressing force to the second metal sheet, and control the pressing depth to press the second metal sheet into the through hole to achieve a transition fit connection. After the second metal sheet is pressed into the through hole, the contact pressure between the second metal sheet and the first metal sheet reaches a preset value.

[0019] Preferably, the surface area of ​​one end of the pressing head abutting against the second metal sheet is larger than the cross-sectional area of ​​the through hole perpendicular to the axial direction thereof.

[0020] Preferably, the second metal sheet is pressed into the through hole by a pressing device; the pressing device comprises:

[0021] A pressing head capable of moving along a pressing direction of the second metal sheet;

[0022] The limiting mechanism is used to make the contact pressure between the pressing head and the first metal sheet less than a preset protection threshold when the depth of the second metal sheet pressed into the through hole reaches a predetermined value.

[0023] Preferably, the limiting mechanism comprises:

[0024] A pressing plate connected to a side of the pressing head facing away from the second metal sheet;

[0025] The limiting column is connected to a side of the pressing plate close to the second metal sheet. When the depth of the second metal sheet pressed into the through hole reaches a predetermined value, the limiting column can support the pressing plate.

[0026] Preferably, the through hole is formed by die punching, and the second metal sheet is formed by die punching.

[0027] Beneficial effects of the present invention:

[0028] The conductive sheet for electronic products of the present invention utilizes a first metal sheet with a lower density as a substrate, thereby greatly reducing the overall weight of the conductive sheet; at the same time, since the second metal sheet is transitionally matched with the through hole, and the first metal sheet is more easily deformed than the second metal sheet, after the second metal sheet with a conductive plating layer is pressed into the through hole through a pressing process, the first metal sheet can be deformed and fit tightly with the second metal sheet, thereby ensuring that the structural strength and conductive performance of the conductive sheet corresponding to the original gold-plated position are not affected, that is, the weight of the conductive sheet is reduced while the performance of the conductive sheet is guaranteed. The conductive sheet of the electronic product equipment after weight reduction can achieve weight reduction, thereby improving the portability and user experience of the electronic product.

[0029] The conductive sheet production process of the present invention can produce conductive sheets with unchanged performance but reduced weight, thereby reducing the weight of electronic products and improving the portability and user experience of electronic products. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 is a cross-sectional view of a conductive sheet for electronic products in Embodiment 1 of the present invention;

[0031] Figure 2 is a schematic structural diagram of a first metal sheet in Embodiment 1 of the present invention;

[0032] Figure 3 is a cross-sectional view of a state where the second metal sheet is not pressed into the through hole in the first embodiment of the present invention;

[0033] Figure 4 is a flow chart of a conductive sheet production process in Embodiment 1 of the present invention;

[0034] Figure 5 is a schematic structural diagram of a pressing device in Embodiment 1 of the present invention;

[0035] Figure 6 is a cross-sectional view of a conductive sheet for electronic products in Embodiment 2 of the present invention;

[0036] Figure 7 It is a cross-sectional view of the second metal sheet in the second embodiment of the present invention when it is not pressed into the through hole.

[0037] In the figure:

[0038] 100, first metal sheet; 110, through hole; 120, chamfer; 200, second metal sheet; 1, base; 2, pressure head; 3, pressure plate; 4, limiting column. DETAILED DESCRIPTION

[0039] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0040] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0042] In the description of this embodiment, the terms "upper", "lower", "right", etc., directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0043] Refer to the following Figures 1 to 7 The weight reduction process of the conductive sheet for electronic products, the conductive sheet and the pressing equipment provided by the present invention are described.

[0044] Embodiment 1

[0045] In the first aspect, the present embodiment discloses a conductive sheet for electronic products, which is mainly used in electronic products such as mobile phones, computers or tablets. The electronic products in the present embodiment take mobile phones as an example; the conductive sheet for electronic products includes a first metal sheet 100 and a second metal sheet 200, and the first metal sheet 100 is provided with a through hole 110, and the surface of the second metal sheet 200 has a conductive coating, and the second metal sheet 200 is fixedly connected to the through hole 110 of the first metal sheet 100 by a pressing process.

[0046] Specifically, both the first metal sheet 100 and the second metal sheet 200 are conductive, the density of the second metal sheet 200 is greater than that of the first metal sheet 100, and the elastic modulus of the second metal sheet 200 is greater than that of the first metal sheet 100. The second metal sheet 200 and the through hole 110 are in transitional fit, and interference is generated during the pressing process, so that the contact pressure between the second metal sheet 200 and the first metal sheet 100 reaches a preset value or more.

[0047] Based on the above, using the first metal sheet 100 with a lower density as a substrate with a larger area can greatly reduce the weight of the finished conductive sheet, while the second metal sheet 200 with a higher density and a conductive coating can enhance the local strength and improve the conductivity. At the same time, the first metal sheet 100 is squeezed by the second metal sheet 200 with a larger elastic modulus, and the first metal sheet 100 is more likely to deform during the squeezing process, so that the second metal sheet 200 fits closely to the side wall of the through hole 110, ensuring the conductive performance of the connection between the two. Finally, the weight of the conductive sheet is reduced while ensuring the performance of the conductive sheet, thereby improving the portability and user experience of electronic products.

[0048] It should be noted that the matching tolerance (i.e., interference amount) of the transition fit between the second metal sheet 200 and the through hole 110 needs to be determined by combining theory and experimental verification. Specifically, a certain interference amount is first calculated based on the mechanical properties theory of the material, and a reasonable pressing pressure is set, and then a certain number of test experiments are carried out to comprehensively evaluate the data to obtain the best matching tolerance. Specifically, the interference amount between the second metal sheet 200 and the through hole 110 on one side is 0.02-0.2mm. As a preferred embodiment, this embodiment takes the interference amount as 0.04mm and the matching pressure preset value as 200Kg as an example, while ensuring the connection strength, the pressing pressure is reduced to facilitate the pressing operation. In some other embodiments, the interference amount can also be designed to be 0.16mm, and the matching pressure preset value is about 1000kg.

[0049] Preferably, the first metal sheet 100 in this embodiment is made of aluminum. Firstly, aluminum has high conductivity, and its conductivity is better than that of stainless steel, which can improve the conductivity of the conductive sheet. Secondly, aluminum is lighter, and the current density of stainless steel is 7.9 g / cm 3 , while the density of aluminum is only 2.7g / cm 3 Compared with the stainless steel material in the prior art, the aluminum material can reduce the weight by about 65%, thereby greatly reducing the weight of the finished conductive sheet; in addition, aluminum has a certain corrosion resistance, and an oxidation reaction will occur in the air to form a protective film. This protective film has good corrosion resistance. Although it has a certain gap compared with stainless steel, it can also be arranged in a position where corrosion resistance is not required. Optionally, in some other embodiments, the first metal sheet 100 can also be made of aluminum alloy, magnesium or titanium, and the staff can adaptably select the material of the first metal sheet 100 according to the specific scene requirements.

[0050] Preferably, in this embodiment, the second metal sheet 200 is made of stainless steel, the conductive plating layer is a gold-plated layer, and the thickness of the second metal sheet 200 is consistent with the thickness of the first metal sheet 100, so that after the second metal sheet 200 is pressed into the through hole 110, the structural strength, conductivity and corrosion resistance of the gold-plated position can be improved. Of course, in some other embodiments, the material of the second metal sheet 200 can also be other conductive metals with better corrosion resistance, such as nickel. In some other embodiments, the conductive plating layer can also be a silver-plated layer.

[0051] Furthermore, the through hole 110 in this embodiment is a square hole, and the corners of the square hole can provide rigid support for the through hole 110, which is convenient for fixing the second metal sheet 200; and the plate punched by the square hole has strong anti-deformation ability, which is suitable for high-load scenarios, that is, the first metal sheet 100 is not easy to deform. In some other embodiments, the through hole 110 can also be a round hole.

[0052] Since the second metal sheet 200 and the through hole 110 are in transitional fit, and the elastic modulus of the second metal sheet 200 is greater than that of the first metal sheet 100, when the second metal sheet 200 is pressed into the through hole 110, there will be excess material of the first metal sheet 100 squeezed at the bottom of the through hole 110, and a thinner aluminum sheet will be formed, resulting in the second metal sheet 200 not being flush with the surface of the first metal sheet 100, and burrs will be generated, thereby affecting the product quality of the conductive sheet. In order to overcome this defect, one end of the through hole 110 in this embodiment is processed with a chamfer 120, and the chamfer 120 is used to guide and accommodate the excess material of the first metal sheet 100 squeezed out, and the second metal sheet 200 is pressed into the through hole 110 from the other end of the through hole 110.

[0053] Based on the above structure, the second metal sheet 200 can be pressed into the through hole 110 from the other end of the through hole 110, so that during the extrusion process, the excess material of the first metal sheet 100 is squeezed into the chamfer 120 position, so that a receiving groove for accommodating waste is formed at the chamfer 120, and finally the second metal sheet 200 can be pressed to a state flush with the first metal sheet 100, and the burrs of the conductive sheet can be reduced, thereby improving the product quality of the conductive sheet.

[0054] On the other hand, in order to produce the above-mentioned conductive sheet for electronic products, this embodiment also discloses a conductive sheet production process, comprising the following steps:

[0055] S1 . Prepare a first metal sheet 100 , and open a through hole 110 on the first metal sheet 100 .

[0056] S2. Prepare a second metal sheet 200 , wherein the surface of the second metal sheet 200 has a conductive coating, the density of the second metal sheet 200 is greater than that of the first metal sheet 100 , and the elastic modulus of the second metal sheet 200 is greater than that of the first metal sheet 100 .

[0057] S3. Align the second metal sheet 200 with the through hole 110, use the pressing head 2 to apply a pressing force to the second metal sheet 200, and control the pressing depth to press the second metal sheet 200 into the through hole 110 to achieve a transition fit connection. After the second metal sheet 200 is pressed into the through hole 110, the contact pressure between the second metal sheet 200 and the first metal sheet 100 reaches a preset value.

[0058] Specifically, in step S1, the through hole 110 is formed by die punching. Die punching the first metal sheet 100 has the following advantages:

[0059] 1. Higher production efficiency. The die punching can complete the processing of multiple holes or different processes at one time through structures such as compound die and continuous die. That is, in this embodiment, the aluminum sheet roll can be directly punched out with a single first metal sheet 100 with a through hole 110 after unwinding. The outer periphery of the single first metal sheet 100 and the inner wall of the through hole 110 are formed at the same time. Compared with laser cutting and other cutting processing methods, the processing cycle is significantly shortened, which is especially suitable for mass-produced electronic products. In addition, continuous and batch stamping can be achieved with the help of automated equipment, reducing manual intervention and further improving efficiency.

[0060] 2. The production precision is higher. The die punching precision can reach ±0.01mm level, and the hole edge is smooth and burr-free. Compared with the current situation that laser cutting is prone to slag and other cutting methods are prone to burrs, die punching can reduce the need for subsequent trimming, thereby greatly improving the processing accuracy of the through hole 110, which is especially suitable for electronic products with high precision requirements.

[0061] 3. The process is more flexible, and complex structures such as special-shaped holes and stepped holes can be realized by combining dies. That is, in this embodiment, the through hole 110 with the chamfer 120 is processed by die punching, and the chamfer 120 can be processed at the same time as punching, further improving the processing efficiency without the need for secondary processing. Of course, in some other embodiments, the chamfer 120 can also be performed after punching.

[0062] Preferably, in this embodiment, the second metal sheet 200 is made of stainless steel and has a gold-plated surface. In addition, in this embodiment, the second metal sheet 200 is also formed by die punching. Of course, in other embodiments, the first metal sheet 100 and the second metal sheet 200 can also be processed by cutting equipment.

[0063] It should be noted that, in some other embodiments, step S1 and step S2 may be performed simultaneously; or step S1 may be performed first, and then step S2.

[0064] In step S3, the second metal sheet 200 is pressed into the through hole 110 by a pressing device; specifically, the pressing device includes a base 1, a pressing head 2 and a limiting mechanism, the base 1 is used to place the first metal sheet 100, the pressing head 2 is arranged on one side of the base 1, and the pressing head 2 can move along the pressing direction of the second metal sheet 200; the limiting mechanism is used to make the contact pressure between the pressing head 2 and the first metal sheet 100 less than a preset protection threshold when the depth of the second metal sheet 200 pressed into the through hole 110 reaches a predetermined value, the predetermined value in this embodiment is the thickness of the second metal sheet 200.

[0065] Specifically, the base 1 is arranged horizontally, and the surface of the base 1 is flat, so that the base 1 can carry the sheet material processed with the through hole 110. The pressing head 2 moves in a direction perpendicular to the base 1, that is, the pressing head 2 is located above the base 1 and moves in a vertical direction. The surface area of ​​the abutting end of the pressing head 2 is larger than the cross-sectional area of ​​the through hole 110 perpendicular to its axial direction, that is, in this embodiment, the surface area of ​​the bottom end of the pressing head 2 is larger than the cross-sectional area of ​​the top end of the through hole 110.

[0066] When the depth of the second metal sheet 200 pressed into the through hole 110 reaches a predetermined value, the pressing head 2 acts on the first metal sheet 100. The pressing head 2 is limited by the first metal sheet 100, so that the second metal sheet 200 can only be pressed flush with the first metal sheet 100 without over-extruding the second metal sheet 200, thereby improving the flatness of the conductive sheet and protecting the second metal sheet 200.

[0067] Specifically, the limiting mechanism includes a pressure plate 3 and a limiting column 4. The pressure plate 3 is located on the side of the pressure head 2 away from the first metal sheet 100 and is connected to the pressure head 2. The pressure plate 3 is horizontally arranged above the pressure head 2, and the pressure plate 3 can move in a direction perpendicular to the base 1. The pressure plate 3 is driven by a linear driving component such as a cylinder or an electric cylinder. This embodiment takes a cylinder as an example.

[0068] The limiting column 4 is located between the pressing plate 3 and the base 1. When the depth of the pressing head 2 pressing the second metal sheet 200 into the through hole 110 reaches a predetermined value, the limiting column 4 can support the pressing plate 3. In this embodiment, two limiting columns 4 are vertically arranged, and the pressing head 2 is located between the limiting columns 4. Exemplarily, the height of the limiting column 4 is C (i.e., the dimension of the limiting column 4 in the direction perpendicular to the base 1), the thickness of the first metal sheet 100 is A, and the height of the pressing head 2 is B, C=A+B+D, wherein D is a correction amount, i.e., a correction amount calculated according to the yield strength of aluminum, the elastic modulus of stainless steel and the protection threshold, so that after the depth of pressing into the through hole 110 reaches a predetermined value, the contact pressure between the pressing head 2 and the first metal sheet 100 is less than the preset protection threshold. In this embodiment, the limiting column 4 is connected to the pressing plate 3. In some other embodiments, the limiting column 4 may also be connected to the base 1, or the limiting column 4 may be directly placed above the base 1.

[0069] Based on the above-mentioned setting, the pressure head 2 is driven to move by the pressure plate 3. When the pressure head 2 abuts against the first metal sheet 100, the limiting column 4 abuts against the base 1 at the same time. After ensuring that the pressure head 2 presses the second metal sheet 200 into the first metal sheet 100, the pressure head 2 does not directly act on the first metal sheet 100. At this time, the contact pressure between the pressure head 2 and the first metal sheet 100 is less than the preset protection threshold, thereby reducing damage to the first metal sheet 100, thereby further improving the quality of the conductive sheet.

[0070] Embodiment 2

[0071] The difference between this embodiment and the first embodiment is that, referring to Figure 6 and Figure 7 In this embodiment, the through hole 110 is not provided with a chamfer 120, but the inner wall of the through hole 110 and the outer wall of the second metal sheet 200 are both provided with inclined surfaces. Specifically, the through hole 110 is designed as a tapered hole, that is, along the axial direction of the through hole 110, the volume of the through hole 110 gradually decreases; correspondingly, in this embodiment, the second metal sheet 200 is also arranged in a quadrangular pyramid, that is, along the axial direction of the through hole 110, the volume of the second metal sheet 200 gradually decreases. Optionally, in some other embodiments, one or both side walls of the through hole 110 may also be arranged to be inclined.

[0072] When the second metal sheet 200 needs to be pressed into the through hole 110, the first metal sheet 100 is first placed horizontally, with the end of the through hole 110 with a larger opening located above the other end, and then the end of the second metal sheet 200 with a smaller volume is placed downward inside the through hole 110, and then the second metal sheet 200 is pressed into the through hole 110. In the process of squeezing the second metal sheet 200, the through hole 110 can not only guide and limit the second metal sheet 200 to prevent the second metal sheet 200 from deflecting, but also can compress the excess aluminum material laterally, that is, the excess aluminum material shrinks along the axis perpendicular to the through hole 110, which can also prevent burrs from being generated at the bottom of the first metal sheet 100, thereby improving the flatness of the product.

[0073] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A conductive sheet for electronic products, characterized in that: include: A first metal sheet (100), wherein the first metal sheet (100) is provided with a through hole (110); a second metal sheet (200), wherein the surface of the second metal sheet (200) has a conductive coating and is fixedly connected to the through hole (110) of the first metal sheet (100) by a press-in process, the density of the second metal sheet (200) is greater than the density of the first metal sheet (100), and the elastic modulus of the second metal sheet (200) is greater than the elastic modulus of the first metal sheet (100); There is a transition fit between the second metal sheet (200) and the through hole (110), and interference is generated during the pressing process so that the contact pressure between the second metal sheet (200) and the first metal sheet (100) reaches a value above a preset value.

2. The conductive sheet for electronic products according to claim 1, characterized in that: A chamfer (120) is provided at one end of the through hole (110), and the second metal sheet (200) is pressed into the through hole (110) from the other end of the through hole (110). During the process of pressing the second metal sheet (200) into the through hole (110), the chamfer (120) is used to guide and accommodate excess material of the first metal sheet (100) that is extruded.

3. The conductive sheet for electronic products according to claim 1, characterized in that: The inner wall of the through hole (110) and the outer wall of the second metal sheet (200) are both provided with inclined surfaces, and when the second metal sheet (200) is pressed into the through hole (110), excess material of the first metal sheet (100) is compressed laterally.

4. A conductive sheet for electronic products according to any one of claims 1 to 3, characterized in that: The first metal sheet (100) is made of aluminum alloy or aluminum.

5. A conductive sheet for electronic products according to any one of claims 1 to 3, characterized in that: The second metal sheet (200) is made of stainless steel.

6. A conductive sheet production process, characterized in that: The method for producing the conductive sheet for electronic products according to any one of claims 1 to 5 comprises the following steps: Preparing a first metal sheet (100), and opening a through hole (110) on the first metal sheet (100); preparing a second metal sheet (200), wherein the surface of the second metal sheet (200) has a conductive coating, the density of the second metal sheet (200) is greater than the density of the first metal sheet (100), and the elastic modulus of the second metal sheet (200) is greater than the elastic modulus of the first metal sheet (100); The second metal sheet (200) is aligned with the through hole (110), and a pressing force is applied to the second metal sheet (200) using a pressing head (2), and the pressing depth is controlled to press the second metal sheet (200) into the through hole (110) to achieve a transition fit connection. After the second metal sheet (200) is pressed into the through hole (110), the contact pressure between the second metal sheet (200) and the first metal sheet (100) reaches a preset value.

7. A conductive sheet production process according to claim 6, characterized in that: The surface area of ​​one end of the pressing head (2) abutting against the second metal sheet (200) is larger than the cross-sectional area of ​​the through hole (110) perpendicular to the axial direction thereof.

8. A conductive sheet production process according to claim 6, characterized in that: The second metal sheet (200) is pressed into the through hole (110) by a pressing device; the pressing device comprises: A pressing head (2) capable of moving along a pressing direction of the second metal sheet (200); A limiting mechanism is used to ensure that the contact pressure between the pressing head (2) and the first metal sheet (100) is less than a preset protection threshold when the depth of the second metal sheet (200) pressed into the through hole (110) reaches a predetermined value.

9. A conductive sheet production process according to claim 8, characterized in that: The limiting mechanism comprises: A pressing plate (3) connected to a side of the pressing head (2) facing away from the second metal sheet (200); A limiting column (4) is connected to a side of the pressing plate (3) close to the second metal sheet (200), and when the depth of the second metal sheet (200) pressed into the through hole (110) reaches a predetermined value, the limiting column (4) can support the pressing plate (3).

10. A conductive sheet production process according to claim 6, characterized in that: The through hole (110) is formed by die punching, and the second metal sheet (200) is formed by die punching.

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