Planar transformer PCB (printed circuit board) process

Abstract

The invention relates to the technical field of circuit board production, in particular to a planar transformer PCB process. The method comprises the following steps: S1, cutting; s2, drilling is conducted; s3, primary copper deposition; s4, primary electroplating; s5, secondary outer layer preparation; s6, performing press fit; s7, drilling is conducted; s8, secondary copper deposition; s9, secondary electroplating is carried out; s10, wiring is carried out; s11, performing solder mask; s12, character jet printing; s13, carrying out surface treatment; s14, forming is conducted; s15, testing is carried out; s16, performing appearance inspection; and S17, packaging. The process provided by the invention can be applied to a planar transformer PCB with a blind hole design and a planar transformer PCB without a blind hole design; the planar transformer PCB process provided by the invention is simple in manufacturing process, low in cost, stable in performance, high in reliability, small in size and light in weight, and meets the requirements of miniaturization and light weight of electronic products.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board production, in particular to a planar transformer PCB board process. Background Art

[0002] With the continuous development of electronic technology, electronic products are becoming increasingly miniaturized, lightweight and high-performance. As a new type of transformer, planar transformers have the advantages of small size, light weight, high efficiency and good heat dissipation, and are widely used in electronic equipment.

[0003] However, the existing planar transformer PCB board process has some shortcomings, such as complex manufacturing process, high cost, unstable performance, etc.

[0004] Based on this, the present invention provides a planar transformer PCB board process to solve the above-mentioned technical problems. Summary of the invention

[0005] The purpose of the present invention is to provide a planar transformer PCB board process. The provided planar transformer PCB board process not only has a simple manufacturing process and low cost, but also has stable performance and high reliability. In addition, it has a small size and light weight, and is suitable for the miniaturization and lightweight requirements of electronic products.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] The present invention provides a planar transformer PCB board process, comprising the following steps:

[0008] S1. Cutting: Position and cut the CCL material, and bake the resulting substrate at a temperature 5-10°C higher than the TG value of the CCL material;

[0009] S2, drilling: mechanically drilling the buried holes of the baked substrate;

[0010] S3, one-time copper deposition: using CuCL 2 The solution deposits copper on the substrate and in the holes;

[0011] S4, primary electroplating: using electricity to convert copper phosphorus balls into copper ions from the anode to the cathode substrate surface;

[0012] S5, Second outer layer: Use micro-etching solution to clean the board surface of the substrate, cover it with photosensitive ink for drying and curing, and use an exposure machine to irradiate it with ultraviolet light to make it polymerize. Take 5 to 10 pieces of each of the obtained different core boards for expansion and contraction measurement, take the average to make expansion and contraction compensation, and use a DES line to develop, etch, and remove the film after exposure;

[0013] S6, Lamination: After all the inner layers are browned, they are fused and riveted, and then X-Ray is used to confirm the layer deviation of each layer, and then pre-stacked, pressed by a press, and then targeted and trimmed;

[0014] S7, drilling: select different drilling parameters for different types of product materials and copper thickness;

[0015] S8, Secondary copper deposition: using CuCL 2 The solution deposits copper on the entire board and in the holes;

[0016] S9, secondary electroplating: using electricity to convert copper phosphorus balls into copper ions from the anode to the cathode substrate surface;

[0017] S10, circuit: Use micro-etching solution and brushing process to clean the board surface, and press a layer of photosensitive dry film, use ultraviolet light exposure machine to make it polymerize, the exposure energy is 6-8 grids, and after exposure, use DES line to develop, etch and remove the film;

[0018] S11, solder mask: Use volcanic ash and brushing process to clean the board surface, print a layer of photosensitive ink on the board surface and dry it for pre-baking, use an exposure machine to irradiate it with ultraviolet light to make it polymerize, and use a developing line to develop the required windows after exposure;

[0019] S12, text printing: use a text printer to print text according to needs;

[0020] S13, surface treatment: surface treatment according to requirements;

[0021] S14, molding: final molding of the product;

[0022] S15, Testing: Testing the product;

[0023] S16, Appearance inspection: Use AVI100% scanning and comparison on products according to standards, and select products that do not meet the requirements for repair or scrapping;

[0024] S17. Packaging: Packaging protection for qualified products.

[0025] The present invention is further configured as follows: in the step S1, the baking time is 220 to 260 minutes.

[0026] The present invention is further configured as follows: in the step S3, the thickness of the deposited copper is 1 to 3 um.

[0027] The present invention is further configured as follows: in step S5, the exposure energy of the exposure machine is selected to be 6 to 8 grids.

[0028] The present invention is further configured as follows: in the step S8, the thickness of the deposited copper is 1-3 um.

[0029] The present invention is further configured as follows: in step S10, the exposure energy of the exposure machine is selected to be 6 to 8 grids.

[0030] The present invention is further configured as follows: in the step S10, it further includes: if there is a blind hole design, repeating steps S6 to S10.

[0031] The present invention is further configured as follows: in step S11, the exposure energy of the exposure machine is selected to be 8 to 11 grids.

[0032] Compared with the prior art, the present invention has the following beneficial effects:

[0033] The process provided by the present invention can be applied to a planar transformer PCB board with a blind hole design and a planar transformer PCB board without a blind hole design; the planar transformer PCB board process provided by the present invention not only has a simple manufacturing process and low cost, but also has stable performance and high reliability. In addition, it has a small size and light weight, and is suitable for the miniaturization and lightweight requirements of electronic products. DETAILED DESCRIPTION

[0034] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] Example 1

[0036] This embodiment provides a planar transformer PCB board process without blind hole design, including the following steps:

[0037] S1. Cutting: Position and cut the CCL material, and bake the resulting substrate at a temperature 5 to 10°C higher than the TG value of the CCL material.

[0038] Among them, the baking time is 220 to 260 minutes.

[0039] S2. Drilling: Mechanically drill the buried holes of the baked substrate.

[0040] It should be noted that in this embodiment, the drilling parameters are matched to appropriate drilling parameters according to the material properties.

[0041] S3, one-time copper deposition: using CuCL 2 The solution deposits copper on the substrate and in the holes.

[0042] The thickness of the deposited copper is 1 to 3 um.

[0043] S4, primary electroplating: use electricity to convert copper phosphorus balls into copper ions from the anode to the cathode substrate surface.

[0044] It should be noted that in this embodiment, the copper plating thickness can be increased to meet the customer's hole copper requirements.

[0045] S5. Second outer layer: Use micro-etching solution to clean the board surface of the substrate, cover it with photosensitive ink for drying and curing, and use ultraviolet light exposure machine to make it polymerize. Take 5 to 10 pieces of each of the obtained different core boards for expansion and shrinkage measurement, take the average for expansion and shrinkage compensation, and use DES line for development, etching, and film removal after exposure.

[0046] Among them, the exposure energy of the exposure machine is selected to be 6 to 8 grids.

[0047] What needs to be explained in this embodiment is that all core board expansion and shrinkage coefficients must use the same expansion and shrinkage coefficient compensation in the exposure machine; after exposure, the DES line is used for development, etching, and film removal to achieve the required graphics and the gong groove positioning hole ring required for the next process on the copper clad board, which is convenient for equipment identification.

[0048] S6, Lamination: After browning all the inner layers, fuse and rivet them, use X-Ray to confirm the layer deviation of each layer, and then pre-stack them, press them together with a press, and then perform target trimming.

[0049] S7. Drilling: Select different drilling parameters for different types of product materials and copper thickness.

[0050] S8, Secondary copper deposition: using CuCL 2 The solution deposits copper on the entire board and in the holes.

[0051] The thickness of the deposited copper is 1 to 3 um.

[0052] S9, Secondary electroplating: Use electricity to convert copper phosphorus balls into copper ions from the anode to the cathode substrate surface.

[0053] It should be noted that in this embodiment, the copper plating thickness can be increased to meet the customer's hole copper requirements.

[0054] S10, circuit: Use micro-etching solution and brushing process to clean the board surface, and cover it with a layer of photosensitive dry film. Use ultraviolet light exposure machine to make it polymerize. The exposure energy is 6-8 grids. After exposure, use DES line for development, etching and film removal.

[0055] Among them, the exposure energy of the exposure machine is selected to be 6 to 8 grids.

[0056] In this embodiment, it should be noted that an exposure machine is used for ultraviolet irradiation to cause a polymerization reaction, the exposure energy is selected to be 6 to 8 grids, and the expansion and shrinkage compensation is performed based on the actual board. After exposure, a DES line is used for development, etching, and film removal to achieve the desired pattern on the copper clad board.

[0057] S11. Solder mask: Use volcanic ash and brushing process to clean the board surface, print a layer of photosensitive ink on the board surface and dry it for pre-bake, use exposure machine to irradiate with ultraviolet light to make it polymerize, and use developing line to develop the required windows after exposure.

[0058] Among them, the exposure energy of the exposure machine is selected to be 8 to 11 grids.

[0059] It should be noted that in this embodiment, the expansion and contraction compensation is performed based on the physical plate, and after exposure, a developing line is used to develop the window opening required by the customer.

[0060] S12, text printing: use a text printer to print text according to needs;

[0061] S13, Surface treatment: Surface treatment according to requirements.

[0062] S14, molding: final molding of the product.

[0063] It should be noted that in this embodiment, the forming accuracy is ±0.1mm; the special control accuracy is ±0.05mm.

[0064] S15. Testing: Test the product.

[0065] It should be noted that the present embodiment includes, but is not limited to, tests such as conduction and insulation.

[0066] S16. Appearance inspection: Use AVI100% scanning and comparison on products according to standards, and select products that do not meet the requirements for repair or scrapping.

[0067] S17. Packaging: Packaging protection for qualified products.

[0068] Example 2

[0069] This embodiment provides a planar transformer PCB board process with a blind hole design, including the following steps:

[0070] S1. Cutting: Position and cut the CCL material, and bake the resulting substrate at a temperature 5 to 10°C higher than the TG value of the CCL material.

[0071] Among them, the baking time is 220 to 260 minutes.

[0072] S2. Drilling: Mechanically drill the buried holes of the baked substrate.

[0073] It should be noted that in this embodiment, the drilling parameters are matched to appropriate drilling parameters according to the material properties.

[0074] S3, one-time copper deposition: using CuCL 2 The solution deposits copper on the substrate and in the holes.

[0075] The thickness of the deposited copper is 1 to 3 um.

[0076] S4, primary electroplating: use electricity to convert copper phosphorus balls into copper ions from the anode to the cathode substrate surface.

[0077] It should be noted that in this embodiment, the copper plating thickness can be increased to meet the customer's hole copper requirements.

[0078] S5. Second outer layer: Use micro-etching solution to clean the board surface of the substrate, cover it with photosensitive ink for drying and curing, and use ultraviolet light exposure machine to make it polymerize. Take 5 to 10 pieces of each of the obtained different core boards for expansion and shrinkage measurement, take the average for expansion and shrinkage compensation, and use DES line for development, etching, and film removal after exposure.

[0079] Among them, the exposure energy of the exposure machine is selected to be 6 to 8 grids.

[0080] What needs to be explained in this embodiment is that all core board expansion and shrinkage coefficients must use the same expansion and shrinkage coefficient compensation in the exposure machine; after exposure, the DES line is used for development, etching, and film removal to achieve the required graphics and the gong groove positioning hole ring required for the next process on the copper clad board, which is convenient for equipment identification.

[0081] S6, one-time pressing: After browning all the inner layers, fuse and rivet them, use X-Ray to confirm the layer deviation of each layer, and then pre-stack them, press them together with a press, and then target and trim them.

[0082] S7. One-time drilling: different drilling parameters are selected for different types of product materials and copper thickness.

[0083] S8, Secondary copper deposition: using CuCL 2 The solution deposits copper on the entire board and in the holes.

[0084] The thickness of the deposited copper is 1 to 3 um.

[0085] S9, Secondary electroplating: Use electricity to convert copper phosphorus balls into copper ions from the anode to the cathode substrate surface.

[0086] It should be noted that in this embodiment, the copper plating thickness can be increased to meet the customer's hole copper requirements.

[0087] S10, primary circuit: Use micro-etching solution and brushing process to clean the board surface, and laminate a layer of photosensitive dry film. Use ultraviolet light exposure machine to make it polymerize. The exposure energy is 6-8 grids. After exposure, use DES line to develop, etch and remove the film.

[0088] Among them, the exposure energy of the exposure machine is selected to be 6 to 8 grids.

[0089] In this embodiment, it should be noted that an exposure machine is used for ultraviolet irradiation to cause a polymerization reaction, the exposure energy is selected to be 6 to 8 grids, and the expansion and shrinkage compensation is performed based on the actual board. After exposure, a DES line is used for development, etching, and film removal to achieve the desired pattern on the copper clad board.

[0090] S11, Secondary Lamination: After all the inner layers are browned, they are fused and riveted, and then X-Ray is used to confirm the layer deviation of each layer, and then pre-stacked, pressed by a press, and then targeted and trimmed.

[0091] S12. Secondary drilling: Select different drilling parameters for different types of product materials and copper thickness.

[0092] S13, three-time copper deposition: using CuCL 2 The solution deposits copper on the entire board and in the holes.

[0093] The thickness of the deposited copper is 1 to 3 um.

[0094] S14, three-stage electroplating: use electricity to convert copper phosphorus balls into copper ions from the anode to the cathode substrate surface.

[0095] It should be noted that in this embodiment, the copper plating thickness can be increased to meet the customer's hole copper requirements.

[0096] S15, secondary circuit: Use micro-etching solution and brushing process to clean the board surface, and cover it with a layer of photosensitive dry film. Use ultraviolet light exposure machine to make it polymerize. The exposure energy is 6-8 grids. After exposure, use DES line for development, etching and film removal.

[0097] Among them, the exposure energy of the exposure machine is selected to be 6 to 8 grids.

[0098] In this embodiment, it should be noted that an exposure machine is used for ultraviolet irradiation to cause a polymerization reaction, the exposure energy is selected to be 6 to 8 grids, and the expansion and shrinkage compensation is performed based on the actual board. After exposure, a DES line is used for development, etching, and film removal to achieve the desired pattern on the copper clad board.

[0099] S16, solder mask: Use volcanic ash and brushing process to clean the board surface, print a layer of photosensitive ink on the board surface and dry it for pre-bake, use exposure machine to irradiate ultraviolet light to make it polymerize, and use developing line to develop the required windows after exposure.

[0100] Among them, the exposure energy of the exposure machine is selected to be 8 to 11 grids.

[0101] It should be noted that in this embodiment, the expansion and contraction compensation is performed based on the physical plate, and after exposure, a developing line is used to develop the window opening required by the customer.

[0102] S17, text printing: use a text printer to print text according to needs;

[0103] S18, Surface treatment: Surface treatment according to requirements.

[0104] S14, molding: final molding of the product.

[0105] It should be noted that in this embodiment, the forming accuracy is ±0.1mm; the special control accuracy is ±0.05mm.

[0106] S19, Testing: Test the product.

[0107] It should be noted that the present embodiment includes, but is not limited to, tests such as conduction and insulation.

[0108] S20, Appearance inspection: Use AVI100% scanning and comparison on products according to standards, and select products that do not meet the requirements for repair or scrapping.

[0109] S21. Packaging: Packaging protection for qualified products.

[0110] The process provided by the present invention can be applied to a planar transformer PCB board with a blind hole design and a planar transformer PCB board without a blind hole design. The process provided not only has a simple manufacturing process and low cost, but also has stable performance and high reliability. In addition, it has a small size and light weight, and is suitable for the miniaturization and lightweight requirements of electronic products.

[0111] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0112] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A planar transformer PCB board process, characterized in that: The following steps are involved: S1. Cutting: Position and cut the CCL material, and bake the resulting substrate at a temperature 5-10°C higher than the TG value of the CCL material; S2, drilling: mechanically drilling the buried holes of the baked substrate; S3, primary copper deposition: using CuCL2 solution to deposit copper on the substrate and in the holes; S4, primary electroplating: using electricity to convert copper phosphorus balls into copper ions from the anode to the cathode substrate surface; S5, Second outer layer: Use micro-etching solution to clean the board surface of the substrate, cover it with photosensitive ink for drying and curing, and use an exposure machine to irradiate it with ultraviolet light to make it polymerize. Take 5 to 10 pieces of each of the obtained different core boards for expansion and contraction measurement, take the average to make expansion and contraction compensation, and use a DES line to develop, etch, and remove the film after exposure; S6, Lamination: After all the inner layers are browned, they are fused and riveted, and then X-Ray is used to confirm the layer deviation of each layer, and then pre-stacked, pressed by a press, and then targeted and trimmed; S7, drilling: select different drilling parameters for different types of product materials and copper thickness; S8, secondary copper deposition: use CuCL2 solution to deposit copper on the entire board and in the holes; S9, secondary electroplating: using electricity to convert copper phosphorus balls into copper ions from the anode to the cathode substrate surface; S10, circuit: Use micro-etching solution and brushing process to clean the board surface, and press a layer of photosensitive dry film, use ultraviolet light exposure machine to make it polymerize, the exposure energy is 6-8 grids, and after exposure, use DES line to develop, etch and remove the film; S11, solder mask: Use volcanic ash and brushing process to clean the board surface, print a layer of photosensitive ink on the board surface and dry it for pre-baking, use an exposure machine to irradiate it with ultraviolet light to make it polymerize, and use a developing line to develop the required windows after exposure; S12, text printing: use a text printer to print text according to needs; S13, surface treatment: surface treatment according to requirements; S14, molding: final molding of the product; S15, Testing: Testing the product; S16, Appearance inspection: Use AVI100% scanning and comparison on products according to standards, and select products that do not meet the requirements for repair or scrapping; S17. Packaging: Packaging protection for qualified products.

2. A planar transformer PCB board process according to claim 1, characterized in that: In the step S1, the baking time is 220 to 260 minutes.

3. A planar transformer PCB board process according to claim 1, characterized in that: In the step S3, the thickness of the deposited copper is 1-3 um.

4. A planar transformer PCB board process according to claim 1, characterized in that: In the step S5, the exposure energy of the exposure machine is selected to be 6 to 8 grids.

5. A planar transformer PCB board process according to claim 1, characterized in that: In the step S8, the thickness of the deposited copper is 1-3 um.

6. A planar transformer PCB board process according to claim 1, characterized in that: In the step S10, the exposure energy of the exposure machine is selected to be 6 to 8 grids.

7. A planar transformer PCB board process according to claim 1, characterized in that: In the step S10, it further includes: if there is a blind hole design, repeating steps S6 to S10.

8. A planar transformer PCB board process according to claim 1, characterized in that: In step S11, the exposure energy of the exposure machine is selected to be 8 to 11 grids.