Cooling fin vacuum adsorption and heat dissipation blowing carrier

Abstract

The invention discloses a cooling fin vacuum adsorption and heat dissipation air blowing carrier, and aims to provide a cooling fin vacuum adsorption and heat dissipation air blowing carrier which is simple in structure, integrates a vacuum adsorption air path and an air blowing heat dissipation channel on the same carrier, and achieves rapid air blowing heat dissipation while meeting the requirement for vacuum adsorption heating of cooling fins. The carrier comprises a carrier body and a heating module, a heat dissipation channel and an adsorption channel are formed in the carrier body, a heating limiting groove is formed in one side of the upper end face of the carrier body, the heating module is in limiting fit with the heating limiting groove, and a heat dissipation connector module is arranged on the lower end face of the carrier body. The heat dissipation connector module is matched with the heating module on the heating limiting groove through the heat dissipation channel, a vacuum connector is further arranged on the lower end face of the carrier body, and the vacuum connector is matched with a product on the carrier body through the adsorption channel. The cooling fin carrier is applied to the technical field of cooling fin carriers.

Description

Technical Field

[0001] The present invention is applied to the technical field of heat sink carriers, and in particular relates to a heat sink vacuum adsorption and heat dissipation blowing carrier. Background Art

[0002] With the continuous development of science and technology, the sizes of various electronic products are becoming more and more refined, and the integration of various components is also getting higher and higher. With the continuous improvement of product integration, the heat generated by the operation of the equipment also increases. Therefore, during the use of the product, the heat dissipation structure will be used to dissipate the heat of the product to avoid high-temperature damage. For example, a layer of heat sink will be affixed to the motherboard of a mobile phone before the product leaves the factory. The mobile phone heat sink is a device used to solve the high temperature problem of the mobile phone. It can effectively take away the heat generated by the operation of the motherboard product. During the production process of the mobile phone heat sink, its heat dissipation performance needs to be tested. During the testing process, in order to prevent the tested heat sink from sticking to the carrier, additional pneumatic components will be added to the carrier or pneumatic parts will be added in the space outside the carrier. While testing the heat dissipation performance of the heat sink, it can achieve the effect of rapid separation from the heating device. However, this design is cumbersome and complicated. Adding additional pneumatic components will make the overall weight of the carrier heavier and the cost higher. If a simple structure can be designed that integrates the vacuum adsorption air path and the air blowing heat dissipation channel on the same carrier, and a heat sink vacuum adsorption and heat dissipation blowing carrier can be used to achieve rapid air blowing heat dissipation while meeting the requirements of vacuum adsorption heating of the heat sink, the above problems can be solved. Summary of the invention

[0003] The technical problem to be solved by the present invention is to overcome the shortcomings of the prior art and provide a heat sink vacuum adsorption and heat dissipation blowing carrier with a simple structure, which integrates the vacuum adsorption air path and the air blowing heat dissipation channel on the same carrier, and realizes rapid air blowing heat dissipation while meeting the requirements of vacuum adsorption heating of the heat sink.

[0004] The technical solution adopted by the present invention is: the present invention includes a carrier body and a heating module, wherein a heat dissipation channel and an adsorption channel are arranged inside the carrier body, a heating limit groove is arranged on one side of the upper end surface of the carrier body, the heating module is limitedly matched with the heating limit groove, a heat dissipation joint module is arranged on the lower end surface of the carrier body, the heat dissipation joint module is matched with the heating module on the heating limit groove through the heat dissipation channel, and a vacuum joint is also arranged on the lower end surface of the carrier body, and the vacuum joint is matched with the product on the carrier body through the adsorption channel.

[0005] Furthermore, the heat dissipation joint module includes a first heat dissipation joint and a second heat dissipation joint, the first heat dissipation joint and the second heat dissipation joint are respectively connected to the two ends of the heat dissipation channel, a heat dissipation groove is arranged inside the carrier body, the heat dissipation groove is connected and conducted with the middle part of the heat dissipation channel, and the heat dissipation groove cooperates with the heating module in the heating limit groove.

[0006] Furthermore, the heating limit groove is provided with a plurality of heat dissipation holes, and the plurality of heat dissipation holes are connected and conducted with the heat dissipation groove.

[0007] Furthermore, a plurality of adsorption columns are arranged on the upper end surface of the carrier body, and the plurality of adsorption columns are arranged in the middle and the other side of the upper end surface of the carrier body. The vacuum joint is connected to the plurality of adsorption columns through the adsorption channel, and the plurality of adsorption columns are adsorbed and cooperated with the lower end surface of the product to be heated at the upper end of the carrier body.

[0008] Furthermore, a plurality of first positioning pins are provided on the upper end surface of the carrier body, and the plurality of first positioning pins are matched with the product positioning on the upper end of the carrier body.

[0009] Furthermore, a plurality of second positioning pins are disposed on the upper end surface of the carrier body, and the plurality of second positioning pins are positioned and matched with the external pressing mechanism.

[0010] Furthermore, a plurality of magnetic blocks are disposed on the upper end of the carrier body, and the plurality of magnetic blocks cooperate with the products on the upper end of the carrier body.

[0011] Furthermore, a sealing plate is provided at the lower end of the carrier body, and the sealing plate cooperates with the bottom of the heat dissipation groove.

[0012] The beneficial effects of the present invention are as follows: when a mobile phone heat sink is placed on the upper end of the carrier body, preliminary positioning can be achieved through the first positioning pins. After the preliminary positioning is completed, the vacuum joint provides adsorption to adsorb the mobile phone heat sink onto the adsorption columns. After various tests are completed, the heat dissipation joint module and the adsorption channel realize rapid airflow to take away the heat generated by the heating module, and can be quickly separated to achieve a rapid peeling effect. The vacuum adsorption channel and the air blowing heat dissipation channel are independently designed and do not affect each other's work. When the test is completed, the vacuum circuit is responsible for adsorbing the product, and the air blowing heat dissipation channel performs air blowing heat dissipation to complete the heat dissipation, and finally the product is taken away. The structure is simple, compact and has better effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a stereoscopic view of the present invention; Figure 2 It is a stereoscopic view of another viewing angle of the present invention; Figure 3is a stereoscopic view of the vehicle body; Figure 4 is a cross-sectional view of the present invention. DETAILED DESCRIPTION

[0014] like Figures 1 to 4 As shown, in this embodiment, the present invention includes a carrier body 1 and a heating module 2. The carrier body 1 is provided with a heat dissipation channel 3 and an adsorption channel 4. A heating limit groove 5 is provided on one side of the upper end surface of the carrier body 1. The heating module 2 is limitedly matched with the heating limit groove 5. A heat dissipation joint module 6 is provided on the lower end surface of the carrier body 1. The heat dissipation joint module 6 is matched with the heating module 2 on the heating limit groove 5 through the heat dissipation channel 3. A vacuum joint 7 is also provided on the lower end surface of the carrier body 1. The vacuum joint 7 is matched with the product on the carrier body 1 through the adsorption channel 4. It can be seen that the heat dissipation channel 3 and the adsorption channel 4 are independent of each other. By replacing the external module with an internal pipeline, space can be effectively saved. The heat dissipation joint module can continuously circulate gas to take away the heat generated by the heating module 2, thereby achieving the purpose of heat dissipation. The adsorption channel 4 can effectively adsorb the product to the carrier body 1. The adsorption and blowing heat dissipation separation is achieved by controlling the ventilation time of the air nozzle. The structure is simple and the effect is better.

[0015] like Figures 1 to 3 As shown, in this embodiment, the heat dissipation joint module 6 includes a first heat dissipation joint 61 and a second heat dissipation joint 62, the first heat dissipation joint 61 and the second heat dissipation joint 62 are respectively connected to the two ends of the heat dissipation channel 3, and a heat dissipation groove 8 is provided inside the carrier body 1, the heat dissipation groove 8 is connected and communicated with the middle part of the heat dissipation channel 3, and the heat dissipation groove 8 cooperates with the heating module 2 in the heating limit groove 5. It can be seen that the first heat dissipation joint 61 realizes the air intake and air supply end, which is used to blow air to dissipate heat to the heating module 2, and then flows out from the second heat dissipation joint 62 to realize the flow heat exchange of gas.

[0016] like Figure 3 As shown, in this embodiment, the heating limit groove 5 is provided with a plurality of heat dissipation holes 9, and the plurality of heat dissipation holes 9 are connected and communicated with the heat dissipation groove 8. It can be seen that the plurality of heat dissipation holes 9 are honeycomb-designed, and the plurality of heat dissipation holes 9 can realize the gas flow into the heat dissipation groove 8 and discharge the hot gas in the heat dissipation groove 8.

[0017] like Figures 1 to 3As shown, in this embodiment, the upper end surface of the carrier body 1 is provided with a plurality of adsorption columns 10, which are arranged in the middle and the other side of the upper end surface of the carrier body 1, and the vacuum joint 7 is connected and conducted with the plurality of adsorption columns 10 through the adsorption channel 4, and the plurality of adsorption columns 10 are adsorbed and matched with the lower end surface of the product to be heated at the upper end of the carrier body 1. It can be seen that the plurality of adsorption columns 10 realize the adsorption of the entire product, and no deviation occurs during the detection process.

[0018] like Figure 1 As shown, in this embodiment, the upper end surface of the carrier body 1 is provided with a plurality of first positioning pins 11, and the plurality of first positioning pins 11 are matched with the product positioning at the upper end of the carrier body 1. It can be seen that the plurality of first positioning pins 11 realize the positioning of the product so that it can be heated evenly.

[0019] like Figure 1 As shown, in this embodiment, the upper end surface of the carrier body 1 is provided with a plurality of second positioning pins 12, and the plurality of second positioning pins 12 are positioned and matched with the external pressing mechanism. It can be seen that the plurality of second positioning pins 12 realize the positioning of the carrier body 1 with the external pressing assembly when it flows on the conveying assembly.

[0020] like Figure 1 As shown, in this embodiment, a plurality of magnetic blocks 13 are disposed on the upper end of the carrier body 1, and the plurality of magnetic blocks 13 cooperate with the products on the upper end of the carrier body 1. It can be seen that the plurality of magnetic blocks 13 do not deviate during the initial positioning.

[0021] like Figure 2 As shown, in this embodiment, a sealing plate 14 is provided at the lower end of the carrier body 1, and the sealing plate 14 cooperates with the bottom of the heat dissipation slot 8. It can be seen that the sealing plate 14 realizes the sealing of the heat dissipation slot 8, so that the airflow can only flow into the heat dissipation slot 8 in one direction.

[0022] The working principle of the present invention is as follows: before starting the equipment, the product to be tested is placed on the upper end of the carrier body 1, and the first positioning pins 1 are used for preliminary positioning. After positioning is completed, the vacuum joint 7 provides adsorption force to stably adsorb the product on the adsorption columns 10. After adsorption is completed, the heating module 2 is started for heating detection. After the detection is completed, the first heat dissipation joint 61 allows cooling gas to pass through, and the heat generated by the heating module 2 is taken away through the heat dissipation holes 9, so as to achieve the effect of rapid air blowing and heat dissipation, so that the product can be stably removed, thereby realizing efficient vacuum adsorption and air blowing heat dissipation of the product.

[0023] Although the embodiments of the present invention are described with practical solutions, they do not constitute limitations on the meaning of the present invention. For those skilled in the art, it is obvious to modify the implementation scheme and combine it with other solutions based on this description.

Claims

1. A heat sink vacuum adsorption and heat dissipation blowing carrier, comprising a carrier body (1) and a heating module (2), characterized in that: The carrier body (1) is provided with a heat dissipation channel (3) and an adsorption channel (4) inside; a heating limit groove (5) is provided on one side of the upper end surface of the carrier body (1); the heating module (2) is limitedly matched with the heating limit groove (5); a heat dissipation joint module (6) is provided on the lower end surface of the carrier body (1); the heat dissipation joint module (6) is matched with the heating module (2) on the heating limit groove (5) through the heat dissipation channel (3); a vacuum joint (7) is also provided on the lower end surface of the carrier body (1); the vacuum joint (7) is matched with the product on the carrier body (1) through the adsorption channel (4).

2. A heat sink vacuum adsorption and heat dissipation blowing carrier according to claim 1, characterized in that: The heat dissipation joint module (6) comprises a first heat dissipation joint (61) and a second heat dissipation joint (62), the first heat dissipation joint (61) and the second heat dissipation joint (62) being connected to two ends of the heat dissipation channel (3) respectively, a heat dissipation groove (8) is provided inside the carrier body (1), the heat dissipation groove (8) is connected and conducted to the middle part of the heat dissipation channel (3), and the heat dissipation groove (8) cooperates with the heating module (2) in the heating limit groove (5).

3. A heat sink vacuum adsorption and heat dissipation blowing carrier according to claim 2, characterized in that: The heating limit groove (5) is provided with a plurality of heat dissipation holes (9), and the plurality of heat dissipation holes (9) are connected and conducted with the heat dissipation groove (8).

4. The heat sink vacuum adsorption and heat dissipation blowing carrier according to claim 1, characterized in that: The upper end surface of the carrier body (1) is provided with a plurality of adsorption columns (10), and the plurality of adsorption columns (10) are arranged in the middle part and the other side of the upper end surface of the carrier body (1). The vacuum joint (7) is connected to the plurality of adsorption columns (10) through the adsorption channel (4), and the plurality of adsorption columns (10) are adsorbed and matched with the lower end surface of the product to be heated at the upper end of the carrier body (1).

5. The heat sink vacuum adsorption and heat dissipation blowing carrier according to claim 1, characterized in that: The upper end surface of the carrier body (1) is provided with a plurality of first positioning pins (11), and the plurality of first positioning pins (11) are in positioning cooperation with the product at the upper end of the carrier body (1).

6. The heat sink vacuum adsorption and heat dissipation blowing carrier according to claim 1, characterized in that: A plurality of second positioning pins (12) are provided on the upper end surface of the carrier body (1), and the plurality of second positioning pins (12) are positioned and matched with an external pressing mechanism.

7. The heat sink vacuum adsorption and heat dissipation blowing carrier according to claim 1, characterized in that: A plurality of magnetic blocks (13) are arranged on the upper end of the carrier body (1), and the plurality of magnetic blocks (13) cooperate with the products on the upper end of the carrier body (1).

8. The heat sink vacuum adsorption and heat dissipation blowing carrier according to claim 2, characterized in that: A sealing plate (14) is provided at the lower end of the carrier body (1), and the sealing plate (14) cooperates with the bottom of the heat dissipation groove (8).

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