Sensor assembly

Abstract

The invention relates to a sensor assembly having a micromechanical sensor element and a glass substrate. The micromechanical sensor element has a body, a void, and a membrane across the void. The body, the void, and the film are made of a material. The glass base is provided with a through opening. The micromechanical sensor element is fastened to the glass base such that the cavity is connected to the through opening. The micromechanical sensor element has an unloading structure in a transition region adjacent to the glass base. The unloading structure comprises a cavity of the body. The geometry of the unloading structure is selected such that mechanical stresses between the glass base and the body are reduced.

Description

Technical Field

[0001] The invention relates to a sensor component and a manufacturing method for a sensor component. Background Art

[0002] Sensor assemblies are known from the prior art which have a micromechanical sensor element which is arranged on a carrier and is mounted via the carrier on, for example, a metal base or housing. The micromechanical sensor element has a membrane which spans a cavity with an opening on the rear side. The carrier has a through-opening and is connected to the rear side of the sensor element by means of the through-opening so that the through-opening leads into the rear opening of the cavity. Such sensor assemblies can be suitable for detecting high voltages.

[0003] The micromechanical (MMS) or microelectromechanical (MEMS) pressure sensor currently used to detect high pressure (10-70 bar) is a sensor assembly based on a micromechanical sensor element, which is arranged on a glass base and assembled on a metal base or in a housing through the glass base. The sensor element has a cavity on its rear side, which defines the membrane of the sensor element. The glass base has a through opening, which is connected to the cavity of the sensor element so that the pressure medium to be sensed is introduced into the rear side of the membrane through the through opening of the glass base. This sensor assembly is described in principle in the German open document DE 10 2004006199A1. On the membrane of the silicon sensor element exposed by trench etching, a piezoresistance is located on its front side, and the piezoresistance realizes signal detection when the membrane is deflected. The silicon sensor element is bonded to a glass carrier. Its metallized back side can be soldered to the metal carrier here. The glass base is used to reduce the mechanical stress caused to the silicon sensor element during temperature changes. When detecting high pressures, overload safety is particularly important due to the particular stress load on the entire sensor assembly.

[0004] It has been shown that due to the different fracture strengths of glass and silicon materials and the given geometry of the sensor assembly, the points of contact of the cavity edge with the glass carrier surface are subject to the greatest stress loads. Due to the presence of manufacturing-related micro-defects in the side walls of the glass through-opening, cracks are more likely to occur there under load. The upper side of the glass carrier is again largely free of such micro-defects, thus achieving a higher desired overload resistance of the sensor assembly. It is therefore advantageous to select a smaller diameter for the glass through-opening than for the cavity opening on the back side.

[0005] A possible improvement of the pressure resistance of such a sensor assembly is shown in the publication DE 10 2009 002 004 A1, in which an annular recess is proposed, which is arranged at the edge region of the through-opening of the glass carrier so that the connecting surface between the silicon sensor element and the glass carrier never rests on the edge of the through-opening. However, at a given pressure, due to the large area, high forces still act on the contact points of the silicon sensor element and the glass substrate which are critical for the overload resistance. Summary of the invention

[0006] The object of the present invention is to provide an improved sensor device. Another object of the present invention is to provide a method for manufacturing such an improved sensor device. Compared to the sensor components described in the prior art to date, the improved sensor components should be suitable in particular for higher pressures. These objects are solved by the subject matter of the independent claims. Advantageous expansion solutions are given in the dependent claims.

[0007] According to a first aspect, the invention relates to a sensor assembly with a micromechanical sensor element and a glass base. The micromechanical sensor element has a body, a cavity and a membrane spanning the cavity. The body, the cavity and the membrane are made of one material. The glass base has a through opening. The micromechanical sensor element is fastened to the glass base so that the cavity is connected to the through opening. The micromechanical sensor element has a relief structure in the transition region to the glass base. The relief structure includes a recess in the body. The geometry of the relief structure is selected so that mechanical stresses between the glass base and the body are reduced.

[0008] In particular, the micromechanical sensor element can be mounted on a metal base by means of a glass base or in a housing. The pressure medium to be sensed can be guided to the membrane via a through opening in the glass base. This results in a deflection of the membrane with the pressure, which is then evaluated. In order to read out the deflection of the membrane, it can be provided that a piezoelectric element is integrated into the membrane or arranged on the membrane, which converts the mechanical deflection of the membrane into a piezoelectric voltage, wherein the piezoelectric voltage can be evaluated accordingly. If the piezoelectric element is integrated into the membrane, the micromechanical sensor element can also be referred to as a microelectromechanical sensor element.

[0009] The relief structure reduces the mechanical stresses between the glass base and the body and, by means of the relief structure, the sensor assembly can be subjected to higher pressures than in the known embodiments of the prior art. The sensor assemblies known from the prior art to date have been designed for pressures of up to 70 bar and destroyed at pressures in the range of 120 to 150 bar. By means of the relief structure, it is possible to achieve destruction only at approximately 200 or approximately 300 bar and the sensor assembly can thus be designed for pressures of up to 100 or, if necessary, also up to 140 bar.

[0010] According to a second aspect, the invention relates to a sensor system with a sensor assembly according to the invention. The sensor system also has a readout device. The mechanical movement of the membrane can be evaluated and output by means of the readout device. For example, the readout device can include the piezoelectric element mentioned above, which can convert the mechanical deflection of the membrane into a piezoelectric voltage. In addition, the piezoelectric voltage can also be output, or the pressure value determined from the piezoelectric voltage can be output. This can be realized as an analog value or as a digital value and implemented by the readout device.

[0011] According to a third aspect, the present invention relates to a method for manufacturing a sensor component. A micromechanical sensor element is produced here, which has a body, a cavity and a membrane spanning the cavity. In addition, a relief structure is produced in the transition region, wherein the relief structure includes a recess of the body. If necessary, this can be done in the same step as the production of the micromechanical sensor element. Subsequently, a glass base is mounted on the micromechanical sensor element, wherein the glass base has a through opening. The micromechanical sensor element is fastened to the glass base so that the cavity is connected to the through opening. The glass base is also mounted on the micromechanical sensor element so that the transition zone is adjacent to the glass base. The geometry of the relief structure can be selected so that the mechanical stress between the glass base and the body is reduced.

[0012] For example, the micromechanical sensor element can be made of silicon or of another semiconductor material. The production of the micromechanical sensor element with the body, the cavity and the membrane, as well as the production of the relief structure, can be carried out in particular using techniques known for silicon or for other semiconductor materials. In particular, the cavity, the membrane and the relief structure can be produced by means of an etching process.

[0013] In one embodiment of the sensor assembly, the angle between the relief structure and the cavity wall is between sixty and one hundred and twenty degrees. This enables an advantageous absorption of forces and thus increases the stability of the sensor assembly.

[0014] In one embodiment of the sensor assembly, the unloading structure has at least one plate connected to the cavity. In particular, a plurality of plates connected to the cavity can be provided. For example, one or more plates can be perpendicular to the cavity wall. The stacking of plates, in particular the vertical plates, can be structured into the cavity wall in the following manner so that a plurality of body volumes are structured from the cavity wall with a minimum effective area. It can be provided here that if the micromechanical sensor element is produced by means of an etching process, the cavity and one or more plates can be produced by means of a trench etching process. Here, due to the ARDE effect (aspect ratio dependent etching), a self-limitation of the plate depth associated with the opening occurs in the direction of the membrane. This in particular achieves the production of a cavity and one or more plates in one etching process. Alternatively, one or more plates can also be produced by means of a double mask lithography process. Here, a cavity is first produced, and then one or more plates are produced.

[0015] In one embodiment of the sensor assembly, the relief structure has at least one transverse plate connected to the plate. The transverse plate can be oriented in particular parallel to the cavity wall or parallel to a tangent to the cavity wall. The transverse plate can be produced in the same step as the plate.

[0016] In one embodiment of the sensor assembly, the unloading structure comprises at least one cavity separated from the cavity. In particular, the unloading structure may comprise a plurality of cavities. The cavity significantly increases the ductility of the material of the body in the tensile load region without significantly impairing the stability of the body. In this arrangement, the likelihood of larger vertical surfaces forming vertical membranes that would bend outwards under compressive loads, thereby introducing additional mechanical stresses in the body, can be reduced.

[0017] In one embodiment of the sensor assembly, the plurality of cavities are arranged in a hexagonal shape. This can further reduce mechanical stresses in the body. In particular, the plurality of cavities can be arranged in a straight line parallel to the cavity wall or to a tangent to the cavity wall, and further cavities can be arranged behind the cavities.

[0018] In one embodiment of the sensor assembly, at least one cavity has a circular cross section. The cavity can be designed in particular as a cavity cone or a cavity cylinder.

[0019] In one embodiment of the sensor assembly, at least one cavity has a trapezoidal cross section. Two parallel sides of the trapezoidal cross section are arranged parallel to the cavity wall and / or parallel to a tangent to the cavity wall. In particular, in this configuration, the shorter side of the parallel sides of the trapezoidal cross section is arranged closer to the cavity wall than the longer side of the parallel sides of the trapezoidal cross section. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Embodiments of the present invention are described with reference to the following drawings. In the schematic diagram, it is shown:

[0021] Figure 1 a first cross-section of the first sensor assembly;

[0022] Figure 2 a second cross-section of the first sensor assembly;

[0023] Figure 3 a third cross-section of the first sensor assembly;

[0024] Figure 4 a cross-sectional view of a second sensor assembly;

[0025] Figure 5 a cross section of a third sensor assembly;

[0026] Figure 6 a first cross-section of a fourth sensor assembly;

[0027] Figure 7 a second cross-section of a fourth sensor assembly;

[0028] Figure 8 a cross section of a fifth sensor assembly;

[0029] Fig. 9 a first cross-section of a sixth sensor assembly;

[0030] Fig.10 a second cross-section of the sixth sensor assembly; and

[0031] Fig.11 Cross section of the seventh sensor assembly. DETAILED DESCRIPTION

[0032] Figure 1 A first cross section through a first sensor component 100 is shown. The sensor component 100 has a micromechanical sensor element 110 and a glass substrate 150. The glass substrate 150 has a through opening 151. The micromechanical sensor element 110 has a body 111 and a cavity 112. The micromechanical sensor element 110 also has a relief structure 120, which is configured as a recess 121 of the body 111. The recess 121 is configured as a plate 122. To increase clarity, not all recesses 121 or plates 122 have reference numerals.

[0033] Figure 2 Shown through Figure 1The second cross-section of the first sensor component 100 is also shown in FIG. 1 , from which it can be seen that the micromechanical sensor element 110 has a membrane 113 spanning the cavity 112. In addition, the micromechanical sensor element 110 is fastened to the glass base 150 so that the cavity 112 is connected to the through opening 151. In addition, from Figure 2 It can be seen that the body 111 and the membrane 113 are made of one material. Optionally, the body 111 and the membrane 113 are integrally configured, wherein the cavity 112 is bounded by the body 111 and the membrane 113. The micromechanical sensor element 110 has a transition region 114 adjacent to the glass base 150, wherein the relief structure 120 is arranged in the transition region 114. The geometry of the relief structure 120 is selected to be micro, so that the mechanical stress between the glass base 150 and the body 111 is reduced.

[0034] In particular, the micromechanical sensor element 110 can be mounted on a metal base or in a housing by means of a glass base 150. In the region of the membrane 113, the micromechanical sensor element 110 also has an optional piezoelectric element 115. If the medium to be sensed is introduced into the cavity 112 through the through opening 151, the membrane 113 moves upward. This movement can be converted into a piezoelectric voltage by means of the piezoelectric element 115. For example, the piezoelectric voltage can be read out by means of an evaluation circuit 116. Therefore, the piezoelectric element 115 and the evaluation circuit 116 can be part of the readout device. However, in principle, other evaluation possibilities of the deflection of the membrane can also be possible, for example by means of laser radiation. The greater the pressure of the medium to be sensed, the greater the deflection of the membrane 113. This means that the sensor assembly can be used for a pressure sensor. The unloading structure 120 reduces the mechanical stress between the glass base 150 and the body 111, and compared with the known embodiments from the prior art, the sensor device 100 can be loaded with a greater pressure by means of the unloading structure. The sensor assemblies known from the prior art are designed for pressures up to approximately 70 bar and are destroyed at pressures in the range of 120 to 150 bar. By means of the relief structure 120, it can be achieved that destruction only occurs at pressures of approximately 200 or even 300 bar, and the sensor assembly 100 can therefore be designed for pressures of up to 100 or, if necessary, up to 140 bar.

[0035] Figure 3 Shown through Figure 1 and Figure 2 FIG. 1 is a third cross section of the first sensor assembly 100 . In the third cross section, the intermediate sheet 123 between the sheets 122 can be seen.

[0036] The plate 122 can have a smaller dimension, in particular parallel to the cavity wall 117, than in other directions, ie in particular in the direction towards the membrane 113 and away from the cavity 112. For example, the body 111 and the membrane 113 can be made of silicon or include silicon. The glass base 150 can be made of glass.

[0037] Figures 1 to 3 Other optional features are shown, which will be described below. The unloading structure 120 has at least one plate 122 connected to the cavity 112. In particular, a plurality of plates 122 are arranged. Thus, the medium to be sensed can enter the plate 122. The cavity 112 is optionally square, wherein the plate 122 emerges from the cavity wall 117. Figures 1 to 3 As shown in FIG. 1 , the plate 122 is perpendicular to the cavity wall 117. Alternatively, it can also be provided that the plate 122 is located at an angle between sixty degrees and one hundred and twenty degrees to the cavity wall 117. In general, the angle between the unloading structure 120 and the cavity wall 117 can be between sixty degrees and one hundred and twenty degrees. In particular, the unloading structure 120 is arranged on all sides of the cavity 112. Figures 1 to 3 Contrary to the illustration in FIG. 1 , it is also conceivable that not all sides of the cavity 112 have a relief structure 120. Figures 1 to 3 Contrary to the illustration in FIG. 1 , it is also conceivable that only a portion of the side surface of the cavity 112 has the relief structure 120 . The through-opening can optionally be arranged centrally in the cavity 112 .

[0038] Optionally, the size of the cavity 112 and the size of the membrane 112 may be approximately one millimeter. In particular, the side length of the square membrane 113 and the diameter of the circular membrane 113 are approximately one millimeter respectively. The membrane 113 may also have a thickness of approximately 200 micrometers. In particular, the through opening 151 may have a smaller size than the membrane 113 and may be, for example, circular.

[0039] Figure 4 A cross section through a second sensor assembly 100 is shown, which (as long as no difference is described below) is similar to Figures 1 to 3 Here, the illustration corresponds to the first sensor assembly 100 in FIG. Figure 1 In this embodiment, the cavity 113 is hexagonal, wherein the cross section of the cavity 113 is a regular hexagon. Here, all sides of the cavity 112 also have a relief structure 120 with a recess 121, which is configured in the form of a plate 122 as described above. Figure 4 Contrary to the illustration, it is conceivable that not all sides of the cavity 112 have a relief structure 120. Figure 4Contrary to the illustration in FIG. 1 , it is conceivable that only part of the side surfaces of the cavity 112 have the relief structure 120. Alternatively, the cavity 112 can also have other shapes, for example any polygonal shape.

[0040] Figure 5 A cross section through a third sensor assembly 100 is shown, which (as long as no differences are described hereinafter) is similar to Figures 1 to 3 The first sensor assembly 100 corresponds to the first sensor assembly 100. In the present embodiment, the cavity 113 is circular. The plate 122 of the relief structure 120 is also perpendicular to the cavity wall 117, wherein the cavity wall 117 is curved.

[0041] The following figure shows a square cavity 112. However, Figure 4 Hexagonal holes 112 or Figure 5 The circular cavity 112 may also be provided in a variation as shown in the following figure.

[0042] Figure 6 A first cross section through a fourth sensor assembly 100 is shown, which (as long as no difference is described below) is similar to Figures 1 to 3 The illustration corresponds to the first sensor assembly 100. Figure 1 The one with Figures 1 to 3 Compared with the embodiment of the present invention, fewer plates 122 are arranged. In addition, the unloading structure 120 has at least one transverse plate 124 connected to the plate 122. In particular, the plate 122 is connected to the transverse plate 124 on all four sides of the cavity 112. If the cavity is hexagonal, such as Figure 4 As shown, all plates can also be connected to the transverse plate 124. Figure 5 In the configuration of , the transverse plate 124 can be concentric with the cavity wall 117.

[0043] Figure 7 A second cross section through the fourth sensor assembly 100 is shown, in which the transverse web 124 is visible. The illustration corresponds here to Figure 3 The second cross section is not guided through one of the plates 122 . However, the transverse plate 124 is connected to the cavity 112 , in particular via the plate 122 . The medium to be sensed can therefore also enter the transverse plate 124 .

[0044] Figure 8 A cross section through a fifth sensor assembly 100 is shown, which (as long as no differences are described below) is similar to Figures 1 to 3 The illustration corresponds to the first sensor assembly 100. Figure 1The one. The unloading structure 120 in turn has a plate 122 configured as a recess 121, wherein in the present embodiment, the plate 122 is not arranged perpendicular to the cavity wall 117. In particular, the angle between the cavity wall 117 and the plate 122 can be between sixty degrees and one hundred and twenty degrees. Here, an even number of plates 122 are arranged on each side of the cavity 112, wherein the plates 122 are symmetrical to each other. In particular, the first half of the plate 122 on each side of the cavity 112 can have a first angle, and the second half of the plate 122 on each side of the cavity 112 can have a second angle, wherein the first angle and the second angle add up to 180 degrees. Improved mechanical stability can be achieved by the inclined arrangement of the plate 122. In addition, it can be provided that Figure 1 Similarly, a plurality of vertical plates 122 are arranged centrally on each side of the cavity 112 .

[0045] Fig. 9 A first cross section through a sixth sensor assembly 100 is shown, which (as long as no difference is described below) is similar to Figures 1 to 3 Corresponding to the first sensor component 100. In the present embodiment, the unloading structure 120 does not have a plate. The recess 121 of the unloading structure 120 is configured as a cavity 125 separated from the cavity 112. Therefore, the extensibility of the material of the body 111 in the tensile load area can be significantly improved without significantly impairing the stability of the body. Optionally, four rows of cavities 125 are arranged triggered from the cavity wall 117. However, a different number of rows can also be set. The row of cavities 125 closest to the cavity 112 is between 100 and 300 microns away from the cavity wall 117, in particular 200 microns.

[0046] Fig.10 A second cross section through the sixth sensor assembly 100 is shown. Figure 3 Since the cavities 125 of the sixth sensor assembly 100 are selectively arranged in a hexagonal arrangement 126 , only two corresponding cavities 125 are visible in the second cross section.

[0047] As in Fig. 9 and Fig.10 As shown in , the cavity 125 has a circular cross section. The cavity 125 can be configured as a cavity cone or a cavity cylinder in particular. It can be provided that the depth of all cavities 125 is the same. Alternatively, it can also be provided that the depth of the cavity 125 decreases starting from the cavity wall 117. This means that the cavity 125 close to the cavity wall 117 is deeper than the cavity 125 away from the cavity wall 117. In addition, it can be provided that the diameter of the circular cross section of the cavity 125 increases starting from the cavity wall 117. This means that the cross-sectional area of ​​the cavity 125 close to the cavity wall 117 is smaller than the cross-sectional area of ​​the cavity 125 away from the cavity wall 117.

[0048] Fig.11 A cross section through a seventh sensor assembly 100 is shown, which (as long as no differences are described hereinafter) is similar to Fig. 9 and Fig.10 The sixth sensor assembly 100 corresponds to the diagram. Fig. 9 In this configuration, only one row of cavities 125 is provided. However, a plurality of such rows may also be provided. The cavities 125 have a trapezoidal cross section, wherein two parallel sides of the trapezoidal cross section are arranged parallel to the cavity wall 117. If the cavity 112 is circular, it may be provided that the two parallel sides of the trapezoidal cross section are parallel to the tangent of the cavity wall 117.

[0049] In particular, in this configuration, it is provided that the shorter side 131 of the parallel sides of the trapezoidal cross section is arranged closer to the cavity wall 117 than the longer side 132 of the parallel sides of the trapezoidal cross section. For example, the distance between the cavity 125 and the cavity wall can be between 100 and 300 microns, in particular 200 microns. The short side 131 can be between 10 and 30 microns, in particular 20 microns long. The long side 132 can be between 40 and 60 microns, in particular 50 microns long. It can also be provided that the distance between the cavity 125 is between 80 and 120 microns, in particular 100 microns. It can also be provided that the short side 131 and the long side 132 have a spacing in the range between 100 and 300 microns, in particular 200 microns.

[0050] Such a sensor assembly 100 can be used in a sensor system 180. The sensor system also has a readout device 181. The mechanical movement of the membrane 113 can be evaluated and output by means of the readout device 181. For example, the readout device 181 can include the aforementioned piezoelectric element 115, which can convert the mechanical deflection of the membrane 115 into a piezoelectric voltage. In addition, the piezoelectric voltage can be output, or the pressure value obtained from the piezoelectric voltage can be output. This can be realized as an analog value or a digital value, respectively, and is performed by the readout device 181. For this purpose, the evaluation device 181 can include an evaluation circuit 116.

[0051] The sensor assembly 100 can be produced using the following method. A micromechanical sensor element 110 is produced, which has a body 111, a cavity 112 and a membrane 113 spanning the cavity 112. In addition, a relief structure 120 is produced in the transition region 114, wherein the relief structure 120 includes a recess 121 of the body 111. This can be done in the same step as the production of the micromechanical sensor element 110, if necessary. Subsequently, a glass base 150 is mounted on the micromechanical sensor element 110, wherein the glass base 150 has a through opening 151. The micromechanical sensor element 110 is fastened to the glass base 150, so that the cavity 112 is connected to the through opening 151. The glass base 150 is also mounted on the micromechanical sensor element 110, so that the transition region 114 adjoins the glass base 150. The geometry of the relief structure 120 is selected so that the mechanical stress between the glass base 150 and the body 111 is reduced.

[0052] For example, micromechanical sensor element 110 can be made of silicon or other semiconductor materials. The production of micromechanical sensor element 110 with body 111, cavity 112 and membrane 113 and the production of relief structure 120 can be carried out in particular using techniques known for silicon or for other semiconductor materials. Cavity 112, membrane 113 and relief structure 120 can be produced in particular by means of an etching process.

[0053] Figures 1 to 11 The relief structures 120 shown can also be combined with one another, and both the plate 122 and the cavity 125 can be provided inside the sensor component 100. This enables the sensor component 100 to be configured flexibly.

[0054] Although the present invention has been described in detail through preferred embodiments, the present invention is not limited to the disclosed embodiments, and those skilled in the art may make other modifications thereto without departing from the scope of protection of the present invention.

Claims

1. A sensor assembly (100) having a micromechanical sensor element (110) and a glass base (150), in, The micromechanical sensor element (110) comprises a body (111), a cavity (112) and a membrane (113) spanning the cavity (112), wherein the body (111), the cavity (112) and the membrane (113) are composed of one material, wherein the glass base (150) has a through opening (151), wherein the micromechanical sensor element (110) is fastened to the glass base (150) such that the cavity (112) is connected to the through opening (151), wherein the micromechanical sensor element (110) has a relief structure (120) in a transition region adjacent to the glass base (150), wherein the relief structure (120) includes a recess (121) of the body (111), wherein the geometry of the relief structure (120) is selected so as to reduce mechanical stress between the glass base (150) and the body (111).

2. The sensor assembly (100) according to claim 1, in, The angle between the unloading structure (120) and the cavity wall (117) is between sixty and one hundred and twenty degrees.

3. The sensor assembly (100) according to claim 1 or 2, in, The unloading structure (120) includes at least one plate (122) connected to the cavity (112).

4. The sensor assembly (100) according to claim 3, in, The unloading structure (120) has at least one transverse plate (124) connected to the plate (122).

5. The sensor assembly (100) according to any one of claims 1 to 4, in, The unloading structure (120) includes at least one cavity (125) separated from the hole (112).

6. The sensor assembly (100) according to claim 5, in, The plurality of cavities (125) are arranged in a hexagonal shape (126).

7. The sensor assembly (100) according to claim 5 or 6, in, At least one cavity (125) has a circular cross-section.

8. The sensor assembly (100) according to any one of claims 5 to 7, in, At least one cavity (125) has a trapezoidal cross section, wherein two parallel sides (131, 132) of the trapezoidal cross section are parallel to the cavity wall (117) and / or parallel to a tangent to the cavity wall (117).

9. A sensor system (180) comprising a sensor assembly (100) according to any one of claims 1 to 8, the sensor system further comprising a readout device (181), in, The mechanical movement of the membrane (113) can be evaluated and output by means of the readout device (181).

10. A method for manufacturing a sensor component (100), comprising the following steps: - producing a micromechanical sensor element (110) having a body (111), a cavity (112) and a membrane (113) spanning the cavity (112); - generating a relief structure (120) in the transition region, in, The unloading structure (120) comprises a recess (121) of the body (111); - mounting a glass base (150) on the micromechanical sensor element (110), wherein the glass base (150) has a through-opening (151), wherein the micromechanical sensor element (110) is fastened to the glass base (150) such that the cavity (112) is connected to the through-opening (151), wherein the glass base (150) is mounted on the micromechanical sensor element (110) such that the transition region adjoins the glass base (150); The geometric shape of the unloading structure (120) is selected so as to reduce the mechanical stress between the glass base (150) and the body (111).

Images