Cooling method and manufacturing system

Abstract

The invention relates to a cooling method (10) for the temperature control of a cooling device (16) taking into account a warming of at least one machine component (12) of a processing machine (14) during operation of the processing machine (14), comprising the following method steps: a. Ascertaining (24) an expected heat energy that acts on the machine component (12) during a temporal processing phase (22a-h) of a control program (18), the control program controls the operation of the processing machine (14); wherein an expected heat energy is ascertained for the machine component (12) on the basis of the machining power (26a-d) set in the temporal machining phase (22a-h); b. Determining (28) a heat derivation capability (30) of the cooling device (16) required to derive the expected heat energy; c. Preconditioning (32) the cooling device (16) with a time advance in order to provide the required heat removal capacity (30) ready until the expected heat energy acts on the machine component (12). The present application also relates to a manufacturing system (38).

Description

Technical Field

[0001] The present application relates to a cooling method. The present application also relates to a manufacturing system. Background Art

[0002] Such a manufacturing system typically has at least one processing machine for processing material, which has a plurality of machine parts. Often, some of the machine parts must be cooled to prevent overheating due to the material processing. It may also be necessary to cool the material to be processed or the reacted material. For this purpose, the aforementioned cooling method for regulating the temperature is performed on the manufacturing system.

[0003] This cooling method is particularly useful in processing machines in which material processing is carried out with a high heat input. Typical representatives of such processing machines are, for example, laser processing machines.

[0004] Manufacturing systems typically include cooling devices, which conduct the heat generated during material processing from the processing device. For this purpose, the processing device is usually attached to a cooling circuit, which has a cooling liquid, such as cooling water, circulating therein. The heat received by the processing device through the cooling liquid is output to the cooling device and then resupplied to the processing device. The cooling power of the cooling device can be adapted according to the heat generated in the processing device to ensure sufficient cooling of the processing device. For this purpose, modern manufacturing systems have an interface between the processing device and the cooling device, via which information about the required cooling power can be exchanged. For example, the cooling water temperature, flow rate or the power of the cooling water pump can be predetermined via the interface.

[0005] Different types of cooling devices and cooling methods are known from the prior art.

[0006] For example, it is known from CN 109332888 A to determine the flow rate of the coolant required for cooling the laser processing unit or the pumping power of the cooler as a function of the laser power used during processing and to predetermine this to the cooling device.

[0007] It is also known that during the machining process, the temperature of the cooling water in the return line of the cooling circuit or the temperature of the machine parts to be cooled or the material or charge to be cooled is measured in order to regulate the temperature and / or flow rate of the coolant, as described, for example, in CN 110102895 A or WO2020 / 096552A2.

[0008] DE 10 2017 206 074 A1 discloses a laser device which can dissipate the heat generated by a laser oscillator by means of a relatively small cooler. The laser device has a computing component which determines the maximum temperature of the individual components of the laser device during the laser processing. If the maximum temperature exceeds a limit value, a warning can be output before the laser processing begins and the production parameters can be changed if necessary.

[0009] However, the devices known from the prior art are designed only for sufficient cooling of the processing machine with respect to relatively constant process conditions. However, material processing on modern processing devices usually takes place under dynamic process conditions. For example, in laser processing, which is an example of a dynamic material processing process, the laser power is required only for certain time periods according to the processing task, changes with a fast temporal change process, or the laser is switched off during the positioning process of the machine. The same is true for the movement sequence of mechanical parts, such as moving machine axes. The aforementioned processes also take place dynamically and generate heat discontinuously in the processing machine.

[0010] If the machining process is carried out under dynamically changing process conditions, the cooling device can only react with a time delay in the above-mentioned examples of the prior art. As a result, during the initial operation of the cooling circuit, the coolant temperature can fluctuate by several degrees Celsius, as a result of which the generated heat can only be discharged inadequately. Therefore, by the time the cooling device has adapted to the changed process conditions, the temperature of the machine parts may have risen undesirably strongly. This can firstly affect the manufacturing quality of the processing machine. In more serious cases, the temperature increase leads to overheating of the machine parts and can cause production stops and / or damage to the machining device.

[0011] In the reverse case, the cooling power set to the cooling device may be too high due to the changed process conditions. As a result, the processing machine is deprived of too much heat, which can also affect the production quality. In each case, excessive cooling of the laser processing device leads to increased operating costs. Summary of the invention

[0012] The object of the present application is to provide a device and a method for dynamic and energy-efficient cooling of a processing machine during a material processing process.

[0013] Description of this application

[0014] This object is achieved according to the present application by a cooling method having the features of claim 1. Furthermore, this object is achieved by a production system having the features of claim 11. The dependent claims relate to preferred embodiments.

[0015] According to the present application, a cooling method is provided which is in particular computer-assisted. In other words, the cooling method can be performed at least partially using a computer.

[0016] The cooling method is suitable for, in particular designed for, in particular unidirectional temperature control of a cooling device. The temperature control is carried out taking into account the heating of at least one machine part of the processing machine during operation of the processing machine. The processing machine can have a plurality of, in particular a large number of machine parts. The cooling method can be carried out taking into account the heating of a plurality of machine parts. Preferably, the temperature control can preferably take into account the heating of temperature-critical machine parts. The cooling method can preferably be used in conjunction with dynamic material processing processes using high-energy processing tools. The cooling method is particularly preferably designed for use in laser processing machines.

[0017] The cooling method is performed using a cooling device. The cooling device is designed to receive thermal energy from a processing machine. Typically, the cooling device is fluidically coupled to the processing machine via at least one cooling circuit. Typically, the processing machine is cooled during material processing.

[0018] The operation of the processing machine is typically controlled or predetermined by a control program. For example, the control program can set the production of the workpiece by cutting the workpiece blank with a laser beam. During the material processing, the process parameters predetermined in the control program can be changed in a time-dependent manner, in particular multiple times. For example, the laser power, feed speed, thermal power, power of the control drive, etc. can be changed during the material processing. The change of process parameters during the material processing can be understood as dynamic material processing.

[0019] The change of process parameters is predetermined in the control program. Usually, the processing machine performs material processing according to the control program. In other words, the process of material processing or the change of process parameters over time is known before the material processing to be performed.

[0020] The cooling method has at least the following method steps.

[0021] One method step provides for ascertaining the expected thermal energy or heat amount acting on the machine component during a temporal processing phase of the control program.

[0022] A processing phase is to be understood as a subphase of a control program. A control program may have a plurality of processing phases. A processing phase typically has the following material processing with process parameters that remain constant. Different processing phases may last for different lengths of time.

[0023] According to the present application, the thermal energy is determined based on the processing power of the processing machine set during the processing time. The processing power usually forms the largest share of the energy introduced. The processing power can therefore be the main part of the heat input into the processing machine or the individual machine parts. It can also be provided that when determining the expected thermal energy, other energy inputs of different machine parts are taken into account, such as the drive power of the regulating drive. Typically, in laser processing machines, the thermal energy is determined based on the laser power.

[0024] In order to be able to accurately predict the expected thermal energy, it can be provided that a processing data set with the relationship between the processing power of the processing machine, in particular the laser power of a laser processing machine, and the resulting heat input is stored in the processing machine, in particular the laser processing machine. The resulting heat input can be determined by simulation and / or measurement technology. Preferably, the processing data set contains a plurality of generated heat inputs associated with a plurality of different processing powers, in particular laser powers. Particularly preferably, the heat input associated with a specific processing power is based on a plurality of different simulations and / or measurements. This can increase the accuracy of the prediction.

[0025] In addition, the processing data set may take into account other processing parameters of the processing machine that are associated with the generated thermal energy input into the machine parts. Additional processing parameters can decisively influence the expected thermal energy. In a laser processing machine, for example, the thermal energy generated in the laser unit can be obtained by subtracting the output laser power from the pump power of the pump diode and adding a constant for cooling the switch cabinet components. In addition, for example, in a drive for axis movement in a laser processing machine, the thermal energy generated can be obtained from the power loss of the drive. In addition, for example, the thermal energy generated by absorption or scattering on the processing head of the laser processing machine can depend on the laser radiation on the optical and mechanical parts of the processing head. In addition, for example, during laser cutting or welding, the thermal energy generated in the participating components (laser diode, optical tool, drive, power electronics) depends on the length and processing speed of the contour to be processed of the corresponding material to be processed and the technical parameters (laser power, gas pressure, focus position, etc.).

[0026] Another method step provides for determining the required heat removal capacity of the cooling device for the processing phase. The cooling device is typically constructed with the aid of a cooling medium to remove or store the expected thermal energy for the duration of the processing phase. The heat removal capacity is to be understood as the overall capacity for receiving thermal energy by the cooling device or the cooling medium. In other words, the thermal compensation required for the expected heat input is determined. The heat receiving capacity can be suitable for rapid reception or for continuous reception of thermal energy. The heat removal capacity typically includes a heat receiving capacity for receiving thermal energy on machine parts by a cooling medium, a heat conduction capacity within the cooling device, a heat storage capacity of the cooling device, and a heat release capacity of the cooling device for releasing thermal energy to the surroundings of the cooling device. The determination of the required heat removal capacity can be understood as the determination of the heat receiving capacity, the heat conduction capacity, the heat storage capacity and / or the heat release capacity.

[0027] The cooling medium may, for example, have a cooling liquid circulating in a cooling circuit between the cooling device and the processing machine and a cooling body arranged or constructed on the cooling device. In this case, the heat receiving capacity may be determined by the temperature and / or the circulation speed of the cooling liquid. In addition, the heat conduction capacity of the cooling medium may be determined by the temperature difference between the cooling liquid and the cooling body and the circulation speed of the cooling liquid. In addition, the heat capacity of the cooling body may, for example, determine the heat storage capacity. In addition, the ambient temperature and / or the connected cooling body may, for example, determine the heat release capacity.

[0028] The required heat removal capacity of the cooling medium can be derived from the fact that despite the heat input, the temperature of the machine components does not increase, in particular does not exceed a maximum temperature.

[0029] Another method step provides that the cooling device is pre-adjusted with a time advance so that the required heat removal capacity is already available until the expected thermal energy acts (begins to act) on the machine parts. In other words, the cooling device or the cooling medium is prepared for the expected heat input. The time advance is preferably maintained for a long time to support energy-efficient operation of the cooling device. The time advance can be several minutes in this example, for example, so that a slow cooling of the cooling medium can be achieved. In other cases, it may be necessary due to the control program to cause the cooling device to be pre-adjusted as quickly as possible. The time advance can be less than one minute in this case.

[0030] In order to enable accurate pre-adjustment of the cooling device according to the expected thermal energy, it can be provided to store a control data set having a relationship between the heat removal capacity of the cooling device and the possible control parameters of the cooling device. The control parameters of the cooling device that cause the specific heat removal capacity of the cooling device are preferably obtained in a simulated and / or experimental manner. Preferably, the control data set contains a plurality of combinations of control parameters that cause the specific heat removal capacity of the cooling device. Preferably, different combinations of control parameters related to the specific heat removal capacity of the cooling device can be evaluated in terms of energy efficiency and / or speed of provision of readiness. The control data set preferably includes a plurality of generated heat removal capacities associated with a plurality of different combinations of control parameters. Particularly preferably, the generated heat removal capacity associated with a certain combination of control parameters is based on a plurality of different simulations and / or tests. This can improve the accuracy of the prediction.

[0031] Typical control parameters of the cooling system are, for example, the cooling capacity, the number of compressor stages involved, the temperature of the cooling medium, the circulation rate of the cooling medium, the ambient temperature of the cooling system and / or the processing machine, etc. The above list is not to be understood as exhaustive.

[0032] The control parameter can influence one or more subcapacities of the heat removal capacity of the cooling device, thereby enabling an optimal pre-setting of the cooling device or the coolant depending on the ascertained thermal energy.

[0033] Preferably, the cooling device is controlled in such a way that the cooling device is always operated in the lowest energy operating mode with respect to electrical power consumption. This leads to an increase in the energy efficiency of the cooling device.

[0034] In summary, the cooling method of the present application provides for proactive control of the cooling device. The control of the cooling device can be determined using a control program of the processing machine, from which the required changes in the cooling behavior can be derived from a predetermined change in the processing parameters. Due to the predetermined sequence of material processing in the control program, the cooling behavior of the cooling device can be adapted with a time advance before the corresponding processing parameter changes. The required change in the cooling behavior is thus already completed when the processing parameters are changed, so that the thermal energy generated can be discharged by the cooling device or the cooling medium. Temperature fluctuations in the cooling circuit that can cause overheating of machine parts can thus be effectively avoided.

[0035] Preferred is an embodiment in which the processing machine is a laser processing machine or a processing machine for forming materials or a processing machine for temperature control of media or a processing machine for electron beam processing or a processing machine for a process whose expected thermal energy acting within the temporal processing phase of a control program is predictable.

[0036] The cooling method is suitable, for example, for cooling a brazing system. A brazing system is typically designed to produce soldering points. In this case, the number of soldering points, the time intervals for producing the soldering points and / or the amount of solder to be used can be known in advance from a control program, here a brazing plan. This allows the expected heat at the respective time to be determined and the required heat removal capacity to be determined.

[0037] In addition, the cooling method is suitable, for example, for cooling injection molding equipment for manufacturing plastic parts. Here, the amount of plastic material to be injected and the temporal course of the injection process can be acquired by the control program. Then, the expected thermal energy can be determined and the required heat dissipation capacity can be determined.

[0038] Furthermore, the cooling method can be suitable, for example, for cooling the rollers used to extrude the film. The control program typically includes the thickness, length and material of the film, from which the expected thermal energy can be determined and the required heat removal capacity can be determined.

[0039] In a preferred embodiment of the cooling method, aging of the at least one machine component is taken into account when determining the expected thermal energy. An aged machine component can, for example, lead to an increased heat input, which determines an increased heat removal capacity of the cooling medium. For example, it can be provided that the machine component is monitored with a sensor in order to detect, in particular, slow changes in thermal energy caused by aging.

[0040] Preferred is an embodiment of the cooling method in which the expected temperature of the machine component is taken into account when determining the required heat removal capacity. In other words, the initial temperature of the machine component before it is heated up by the expected thermal energy is taken into account. This can be done by comparing a target temperature of the machine component with the actual temperature of the machine component. For example, a possible heating up of the machine component to the operating temperature can be envisaged. In this case, for example, the existing cooling performance can be maintained or reduced by the cooling device.

[0041] Furthermore, an embodiment of the cooling method is preferred in which the maximum temperature of the machine component is taken into account when determining the required heat removal capacity. In other words, the actual temperature of the machine component can be compared with the maximum temperature. From this, a temperature tolerance can be derived. A small temperature tolerance can, for example, lead to a prioritization of the heat absorption capacity, while a large temperature tolerance can lead to a prioritization of the energy-efficient operation of the cooling device.

[0042] In a preferred embodiment of the cooling method, the ambient temperature of the laser processing machine and / or the cooling device is taken into account when determining the required heat removal capacity. The ambient temperature can be influenced, for example, depending on the location of the processing machine and / or the cooling device and / or the time of day or season and can have different effects on the operating mode of the cooling device. For example, the heat release capacity of the cooling medium increases at low ambient temperatures, which can reduce the heat storage capacity. Thus, by taking into account the ambient temperature, the determination of the heat removal capacity can be improved in an energy-optimized operating mode of the cooling device.

[0043] Furthermore, the following embodiments of the cooling method are preferred, in which the processing time of the processing phase is taken into account when determining the required heat removal capacity and / or pre-regulation. In other words, the duration of the processing phase is taken into account. The expected thermal energy in a short processing time can, for example, lead to high thermal intensity, wherein the thermal energy must be removed in a short time in this case. In this case, the heat removal capacity can be pre-regulated in terms of the heat receiving capacity. In addition, the expected thermal energy in a long processing time can, for example, lead to a continuous thermal load, wherein the thermal energy must be removed over a longer time. In this case, the heat removal capacity can be pre-regulated in terms of the heat conduction capacity. Thus, by recognizing the processing time, the pre-regulation can be adapted to the expected thermal energy, or the control of the cooling device can be performed accordingly. For example, the setting of the control parameters can be set so that the high thermal intensity is removed by briefly connecting an additional compressor stage and increasing the circulation speed of the cooling liquid, wherein the other control parameters of the cooling device remain constant. In addition, for example, the cooling power of the cooling device can be continuously increased in the case of a continuous thermal load.

[0044] In a preferred embodiment of the cooling method, the expected thermal energy and / or thermal removal capacity of at least one processing stage before, in particular immediately before, and / or after, in particular immediately after, the processing stage is taken into account when determining the required heat removal capacity and / or when presetting. As a result, the control of the cooling device can be carried out as a function of the preceding and / or succeeding processing stage. For example, the presetting of the cooling device can be reduced for a processing stage if the expected thermal energy in the subsequent processing stage is lower and a reduction in the heat removal capacity is determined.

[0045] Furthermore, an embodiment of the cooling method is preferred in which the expected thermal energy is determined for a plurality of temporal processing phases of the control program. These processing phases are in particular directly successive to one another. This makes it possible to achieve an energy-efficient and predictive operating mode over a large part of the control program, in particular over the entire control program.

[0046] A preferred embodiment of the cooling method provides that, for pre-adjusting the cooling device, at least one cooling circuit and / or compressor stage of the cooling device is switched on or off. This can in particular increase the heat transfer capacity and the heat storage capacity, whereby the thermal energy that can be discharged by the cooling medium can be greatly increased.

[0047] Furthermore, the underlying object is achieved by a production system having a processing machine, preferably a laser processing machine, and a temperature-controllable cooling device. The processing machine comprises at least one of the machine parts mentioned above and described below.

[0048] The manufacturing system is designed to carry out the cooling method mentioned above and described below.

[0049] For this purpose, the manufacturing system has a machine controller. The machine controller is designed to control and / or regulate individual machine parts and / or cooling devices of the processing machine. The machine controller can be arranged, in particular constructed, on the processing machine. The machine controller is also designed to execute, ie, to read and execute the control program.

[0050] The machine controller is preferably designed to determine the thermal energy acting on the machine component. This makes it possible to dispense with the transfer of the control program to another computing unit. To determine the thermal energy, the machine controller can be designed to read a storage medium and a processing data set stored thereon. In particular, the machine controller can be designed to interpolate between the data of the processing data set in order to determine the thermal energy.

[0051] The machine controller preferably has a data interface to the cooling device. By means of the data interface, instructions and / or data can be exchanged between the machine controller and the cooling device. For example, it can be provided that the machine controller transmits the desired thermal energy to the cooling device.

[0052] In a preferred embodiment of the production system, the machine controller is designed to determine the required heat removal capacity of the cooling medium. As a result, the main method steps can be performed by the machine controller, so that the cooling method can be performed more quickly.

[0053] Furthermore, preferred embodiments of the production system are those in which the machine controller is designed and / or configured to control or pre-regulate the cooling device. In other words, the machine controller can be configured to implement control parameters on the cooling device. This makes it particularly easy to use the cooling method for different cooling devices.

[0054] In a preferred embodiment of the production system, the cooling device is designed to control the cooling capacity steplessly between zero and one hundred percent. The cooling device can thus be pre-adjusted particularly precisely to the required heat removal capacity.

[0055] Furthermore, an embodiment is preferred in which the production system has at least one controllable proportional valve for fluidically separating and / or merging at least two refrigeration circuits. In other words, the cooling device can also have controllable components in the cooling circuits in addition to controlling the internal refrigerator of the cooling device. By separating and / or merging the refrigeration circuits, for example, the starting temperature of the cooling circuits can be pre-adjusted. In other words, mixing of refrigeration circuits with different temperatures can be performed.

[0056] Furthermore, an embodiment of the production system is preferred, in which the cooling device has at least two controllable cooling stages, at least two operating modes, at least two compressors and / or at least one free cooler. The use of one or more additional components of the cooling device increases the possibility of pre-adjusting the cooling device according to the expected thermal energy. This ensures an energy-efficient operating mode.

[0057] In a preferred embodiment of the manufacturing system, the cooling device is designed for multi-stage compression, evaporation and liquefaction of a refrigerant. This can greatly increase the heat removal capacity of the cooling medium. Preferably, the manufacturing system here has water as a refrigerant. The present application has determined that the cooling method can be carried out particularly energy-efficiently when using water. It is also preferred that the cooling device is designed to carry out a refrigeration cycle process under a rough vacuum. This allows different operating modes to be carried out on the cooling device.

[0058] Other features and advantages of the present application are derived from the description, the claims and the drawings. According to the present application, the features mentioned above and those to be mentioned below can be used individually or in any suitable combination of multiple features. The embodiments shown and described should not be understood as exhaustive, but have exemplary characteristics for explaining the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] Figure 1 The cooling method according to the application is shown schematically.

[0060] Figure 2 In conjunction with the heat removal plan, a control program or control plan for machining a workpiece is shown.

[0061] Figure 3 A schematic diagram shows a production system having a processing machine, a cooling device and a machine controller. DETAILED DESCRIPTION

[0062] Figure 1 A schematic diagram shows a cooling method 10 according to the present application. The cooling method 10 refers to Figure 2 and Figure 3 Explained later.

[0063] The cooling method 10 is configured to cool a cooling device 16 (see Figure 3) for temperature control. The temperature control is considered in the processing machine 14 in the form of a laser processing machine (see Figure 3 ) of at least one machine component 12 (see Figure 3 ) is carried out under the condition of heating.

[0064] The cooling or heat removal takes place during the operation of the processing machine 14, typically during the processing of at least one material (not shown) by the processing machine 14. The operation of the processing machine 14, in particular the processing of the processing machine 14 for processing the material, is controlled by the control program 18 (see Figure 2 ) is predetermined in advance. The control program 18 is, for example, executed before material processing in the machine controller 20 (see Figure 3 ) is provided in. The control program 18 may have a plurality of processing stages 22a-h as shown (see Figure 2 ).

[0065] The cooling method 10 has at least the following method steps.

[0066] In a first method step 24, it is provided that the expected thermal energy or the expected heat amount acting on the machine part 12 in the time processing phases 22a-h of the control program 18 is determined. The expected thermal energy is based on the processing power 26a-d set in the corresponding processing time 22a-h (see Figure 2 ), here the laser power is determined. In other words, the control program 18 can set different processing powers 26a-d for material processing in each processing stage 22a-h. Depending on the corresponding processing stage 22a-h, the thermal energy generated by the processing power 26a-d and acting on the machine component 12 will change dynamically.

[0067] In a further method step 28, it is provided that the heat removal capacity 30 (see FIG. 2 ) required for the cooling medium (not shown) to remove the expected thermal energy is determined. Figure 2 ). Typically, the heat removal capacity 30 is adapted to the amount of heat to be removed. If the heat removal capacity 30 of the cooling medium is too large, the machine part 12 will be cooled too strongly and / or the operation of the cooling device 16 will become uneconomical. On the other hand, if the heat removal capacity 30 is too small, the machine part 12 may overheat and production may stop.

[0068] A further method step 32 provides for pre-adjusting the cooling device 16 with a time advance so that the required heat removal capacity is available by the time the expected action of thermal energy on the machine component 12 (action start time). In other words, the heat removal capacity 30 is adapted to the expected heat input in advance. For example, the heat removal capacity 30 is increased or decreased. This prevents an adaptation of the heat removal capacity 30 as a reaction to the input thermal energy, thereby avoiding temperature fluctuations.

[0069] Figure 2 In conjunction with the heat removal plan 34 , a control program 18 for processing the material is shown.

[0070] The control program 18 has processing phases 22a-h. The processing phases 22a-h can be configured in the control program 18 to follow one another in time. The processing phases 22a-h can have different durations. Adjacent processing phases 22a-h typically have different processing powers 26a-d, wherein the processing power 26a is the minimum processing power 26a and the processing power 26d is the maximum processing power 26d. The minimum processing power 26a can be zero watts.

[0071] According to the control program 18, it can be provided that in the time course of the control program 18, the processing power 26a in the processing phase 22a is increased stepwise to the processing powers 26b, 26c and 26d via the processing phases 22b, 22c and 22d. The increase in the processing power 26a-d can be necessary, for example, in conjunction with the feed speed of the laser during material processing. In addition, it can then be provided that the processing power 26a-d is reduced to the minimum processing power 26a in the processing phase 22e. This minimum processing power can occur, for example, when the position of the switched-off laser is changed. It can then be provided that in the processing phase 22f, the processing power 26a-d is increased stepwise to the maximum processing power 26d and is reduced again stepwise in the subsequent processing phases 22g and 22h. In other words, the control program 18 can provide a dynamic change of the processing power 26a-d during material processing.

[0072] According to the cooling method 10 of the present application (see Figure 1 ) is designed to determine the heat input or the thermal energy acting on the machine component 12 in relation to the change in the processing output 26a-d. In addition, the cooling method 10 is designed to determine the heat removal capacity 30 required in the corresponding processing phase 22a-h.

[0073] The heat removal capacity 30 determined for each processing stage 22 a - h can be represented by way of example in the heat removal plan 34 shown.

[0074] The heat removal plan 34 can include the course of the heat removal capability 30 with respect to the processing phases of the control program 18, in particular all processing phases 22a-h. The heat removal plan 34 can be completed, for example, before the material processing begins. The heat removal plan 34 can preferably be provided to the processing machine 14 and / or the cooling device 16 via the machine controller 20. Particularly preferably, the heat removal plan 34 is completed by the machine controller 20.

[0075] The heat removal capability 30 can have different heat removal levels 36a-d. The heat removal levels 36a-d depend on the processing power 26a-d. The heat removal levels 36a-d can have an offset with respect to the processing power 26a-d. For example, it can be provided that the heat removal level 36a still enables the removal of thermal energy despite the associated processing power 26a having a value of zero watts. This can be determined by the machine component 12 which still has to be cooled despite the laser being switched off. This is the case, for example, with the power electronics of the processing machine 14.

[0076] The change in heat removal capacity 30 according to heat removal plan 34 shows that the adaptation of heat removal capacity 30 can be introduced in advance in time such that the required heat removal capacity 30 is already available when the thermal energy caused by the corresponding processing output 26 a - d occurs.

[0077] For example, the heat removal capacity 30 can be increased in the processing phase 22a to provide the required heat removal level 36b when the laser power 26a is changed to the processing power 26b. This can prevent the machine part 12 from overheating or keep the temperature of the machine part 12 constant despite the additional heat input.

[0078] Furthermore, for example, the heat removal capacity 30 can be reduced in the processing phase 22d before the processing power 26d is changed to the processing power 26a to such an extent that overheating of the machine part 12 in this case can be avoided. This makes it possible to achieve an energy-efficient operating mode.

[0079] Figure 3 A schematic diagram shows a production system 38 which has a processing machine 14 , a cooling device 16 and a machine control 20 .

[0080] The processing machine 14 can be fluidically connected to the cooling device 16 by means of at least one first cooling circuit 40. Preferably, the production system 38 has a further cooling circuit 42 which is designed for further cooling of the machine component 12.

[0081] The processing machine 14 can have a data interface 44 for communicating with the cooling device 16 . The machine controller 20 also has at least one data interface 46 to the processing machine 14 and a data interface 48 to the cooling device 16 .

[0082] Reference numerals list

[0083] Cooling method 10;

[0084] Machine parts 12;

[0085] Processing machine 14;

[0086] Cooling equipment 16;

[0087] Control program 18;

[0088] Machine controller 20;

[0089] Processing stages 22a-h;

[0090] Method step 24;

[0091] Processing power 26a-d;

[0092] Method step 28;

[0093] Heat transfer capacity 30;

[0094] Method step 32;

[0095] Heat export plan 34;

[0096] Heat extraction levels 36a-d;

[0097] Manufacturing system 38;

[0098] Cooling circuit 40;

[0099] Cooling circuit 42;

[0100] Data interface 44;

[0101] Data interface 46;

[0102] Data interface 48.

Claims

1. A cooling method (10) for temperature control of a cooling device (16) taking into account heating of at least one machine part (12) of a processing machine (14) during operation of the processing machine (14), comprising the following method steps: a. determining (24) the expected thermal energy acting on the machine part (12) during the processing phase (22a-h) in time of a control program (18) which controls the operation of the processing machine (14); in, determining the expected thermal energy for the machine component (12) based on the processing power (26a-d) set in the processing phase (22a-h) in time; b. determining (28) the heat removal capacity (30) of the cooling device (16) required to remove the expected thermal energy; c. Pre-adjusting (32) the cooling device (16) in advance in time so that the required heat removal capacity (30) is already provided before the expected thermal energy acts on the machine component (12).

2. The cooling method (10) according to claim 1, in, The processing machine (14) is a laser processing machine, or a processing machine for forming a material, or a processing machine for temperature control of a medium, or a processing machine for electron beam processing, or a processing machine for a process in which the expected thermal energy acting within the temporal processing phases (22a-h) of the control program (18) is predictable.

3. The cooling method (10) according to claim 1 or 2, in, When determining the expected thermal energy, aging of the at least one machine component (12) is taken into account.

4. The cooling method (10) according to any one of the preceding claims, in, When determining (28) the required heat removal capacity (30), the expected temperature of the machine component (12) is taken into account.

5. The cooling method (10) according to any one of the preceding claims, in, When determining (28) the required heat removal capacity (30), the maximum temperature of the machine component (12) is taken into account.

6. The cooling method (10) according to any one of the preceding claims, in, When determining (28) the required heat removal capacity (30), the ambient temperature of the processing machine (14) and / or the cooling device (16) is taken into account.

7. The cooling method (10) according to any one of the preceding claims, in, The processing times of the processing stages (22a-h) are taken into account when determining (28) the required heat removal capacity (30) and / or during preconditioning (32).

8. The cooling method (10) according to any one of the preceding claims, in, When determining (28) the required heat removal capacity (30) and / or when pre-regulating (32), the expected thermal energy and / or the required heat removal capacity (30) of at least one processing stage (22a-h) before the processing stage (22a-h), in particular the processing stage before the processing stage, and / or the expected thermal energy and / or the required heat removal capacity of at least one processing stage (22a-h) after the processing stage (22a-h), in particular the processing stage after the processing stage, are taken into account.

9. The cooling method (10) according to any one of the preceding claims, in, A thermal energy expectation is ascertained (24) for a plurality of temporal processing phases (22a-h) of a control program (18), the plurality of temporal processing phases being in particular successive to one another.

10. The cooling method (10) according to any one of the preceding claims, in, For pre-regulation (32) of a cooling device (16), at least one cooling circuit (40, 42) and / or a compressor stage of the cooling device (16) is switched on or off.

11. A manufacturing system (38) comprising a processing machine (14) and a temperature-controllable cooling device (16), wherein the processing machine comprises at least one machine component (12); in, The manufacturing system (38) is designed to carry out a cooling method (10) according to any one of the preceding claims; the manufacturing system also has a machine controller (20), which is in particular constructed on a processing machine (14); wherein the machine controller (20) is designed to execute a control program (18) and to determine (24) thermal energy acting on a machine component (12).

12. The manufacturing system (38) according to claim 11, in, The machine controller (20) is designed to determine (28) a required heat removal capacity (30) of the cooling device (16).

13. A manufacturing system (38) according to claim 11 or 12, in, The machine controller (20) is designed and / or constructed to control the cooling device (16).

14. A manufacturing system (38) according to any one of claims 11 to 13, in, The cooling device (16) is designed to control the cooling capacity steplessly between zero and one hundred percent.

15. The production system (38) according to any one of claims 11 to 14, comprising at least one controllable proportional valve for fluidically separating and / or combining at least two refrigeration circuits.

16. A manufacturing system (38) according to any one of claims 11 to 15, in, The cooling device (16) has at least two controllable refrigeration stages, at least two operating modes, at least two compressors and / or at least one free cooler.

17. The manufacturing system (38) according to claim 16, in, The cooling device (16) is configured for multi-stage compression, evaporation and liquefaction of a refrigerant; wherein the manufacturing system has water as the refrigerant; and wherein the cooling device (16) is configured for performing a refrigeration cycle process under a rough vacuum.

Images