Tunnel type UV curing oven for semiconductor

Abstract

The invention discloses a tunnel type UV curing oven for semiconductors, and relates to the technical field of UV curing ovens, the tunnel type UV curing oven comprises a UV curing oven mechanism, the UV curing oven mechanism comprises a machine shell, the side face of the machine shell is fixedly connected with a limiting column, the limiting column is slidably connected with a light shielding plate, the side face of the light shielding plate is provided with a transverse groove, and mercury lamps are installed on the upper portion and the lower portion in the machine shell respectively; and the feeding mechanism is fixedly connected to the machine shell and comprises a machine frame fixedly connected to the side face of the machine shell, the machine frame is rotationally connected with a rotary drum, and an adjusting assembly is installed on the rotary drum. Intermittent feeding can be achieved through the feeding mechanism, the shading plate is opened during feeding, the shading plate is closed after feeding is completed, the situations that ultraviolet rays in the UV curing furnace leak to the external environment for a long time and external stray light interferes with UV wavelength accuracy are reduced, the reaction efficiency of a photoinitiator is improved, and the service life of the UV curing furnace is prolonged. And the uniformity of the semiconductor packaging adhesive or the photoresist is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of UV curing furnaces, and in particular to a tunnel-type UV curing furnace for semiconductors. Background Art

[0002] A semiconductor tunnel-type UV curing furnace is a device that uses ultraviolet (UV) radiation technology to rapidly cure materials. It is designed specifically for semiconductor manufacturing and related electronic component production scenarios. Its core principle is to excite photoinitiators in the material through a specific wavelength of UV light source (such as UVLED or high-pressure mercury lamp), triggering a polymerization reaction, so that liquid or semi-solid substances (such as UV glue, photoresist, encapsulation materials, etc.) are cured into a stable solid structure within seconds to minutes.

[0003] However, in practical applications, there are still some problems that have not been solved. The following are some common problems of the tunnel-type UV curing furnace for semiconductors: In the prior art, most semiconductor plates are continuously fed into the UV curing furnace by means of a conveyor belt. During this process, the light-shielding plate on the UV curing furnace cannot be closed, resulting in the possibility that ultraviolet rays in the UV curing furnace may leak to the external environment, directly irradiating non-target areas of the semiconductor plates on the conveyor belt, causing local over-curing or material denaturation, and external stray light interfering with the accuracy of the UV wavelength, resulting in a decrease in the reaction efficiency of the photoinitiator and affecting the uniformity of the semiconductor encapsulation glue or photoresist. Summary of the Invention

[0004] In view of the above problems existing in the existing tunnel-type UV curing furnace for semiconductors, the present invention is proposed.

[0005] Therefore, the problem to be solved by the present invention is how to solve the problem that most semiconductor plates are continuously fed into the UV curing furnace by means of a conveyor belt. During this process, the light-shielding plate on the UV curing furnace cannot be closed, resulting in the possibility that ultraviolet rays in the UV curing furnace may leak to the external environment, and external stray light interfering with the accuracy of the UV wavelength, resulting in a decrease in the reaction efficiency of the photoinitiator and affecting the uniformity of the semiconductor encapsulation glue or photoresist.

[0006] To solve the above technical problems, the present invention provides the following technical solution: A tunnel-type UV curing furnace for semiconductors, which includes,

[0007] A UV curing furnace mechanism, including a machine shell. A limiting column is fixedly connected to the side of the machine shell. A light-shielding plate is slidably connected to the limiting column. A horizontal groove is opened on the side of the light-shielding plate. Mercury lamps are respectively installed in the upper and lower parts of the machine shell; and,

[0008] The feeding mechanism is fixedly connected to the casing and includes a frame fixedly connected to the side of the casing. A rotating cylinder is rotatably connected to the frame. An adjusting component is installed on the rotating cylinder. A placing rack is fixedly connected to the adjusting component. A pushing component is fixedly connected to the frame. A rotation driving component is installed on the surface of the rotating cylinder and is arranged on the surface of the pushing component. A limiting component is fixedly connected to the pushing component and cooperates with the rotating cylinder. A transmission component is fixedly connected to the pushing component and is arranged on the surfaces of the casing and the light-shielding plate. A limiting hole is formed on the surface of the rotating cylinder.

[0009] As a preferred solution of the tunnel type UV curing furnace for semiconductors described in the present invention, wherein: the pushing component includes a support plate fixedly connected to the frame. A servo motor is fixedly connected to one side of the support plate. The output shaft of the servo motor is fixedly connected with a reciprocating roller. A moving block is sleeved on the reciprocating roller. A sliding column is fixedly connected inside the moving block and is slidably connected in a reciprocating groove on the reciprocating roller. A pushing piece is fixedly connected to the top of the moving block. A guide rod is slidably connected to the moving block and both ends of the guide rod are fixedly connected to the inner wall of the support plate.

[0010] As a preferred solution of the tunnel type UV curing furnace for semiconductors described in the present invention, wherein: the rotation driving component includes an L-shaped plate fixedly connected to the support plate. A worm is rotatably connected to the L-shaped plate. A cross bar is slidably connected inside the worm and one end of the cross bar is fixedly connected to the pushing piece. A first guide groove is formed in the cross bar. A guide post is fixedly connected to the inner wall of the worm and is slidably connected in the first guide groove. A ratchet member is sleeved on the rotating cylinder. A worm gear is sleeved on the ratchet member and is meshed with the worm.

[0011] As a preferred solution of the tunnel type UV curing furnace for semiconductors described in the present invention, wherein: the limiting component includes a driving plate fixedly connected to the pushing component. A second guide groove is formed in the driving plate. A trapezoidal block is rotatably connected to the driving plate. A first anti-falling block and a second anti-falling block are respectively formed in the second guide groove. A limiting member is fixedly connected to the support plate and is matched with the second guide groove. The upper end of the limiting member is inserted into the limiting hole. A short rod is rotatably connected to the driving plate and the trapezoidal block is sleeved on the surface of the short rod. A torsion spring is sleeved on the short rod and both ends of the torsion spring are respectively fixedly connected to the surface of the driving plate and the short rod. A guide rail is slidably connected to the driving plate and one end of the guide rail is fixedly connected to one side of the support plate. A reinforcing plate is fixedly connected to the guide rail and the lower end of the reinforcing plate is fixedly connected to the frame.

[0012] As a preferred embodiment of the tunnel type UV curing furnace for semiconductors of the present invention, wherein: the transmission assembly includes a connecting plate fixedly connected to the support plate, a first synchronous disc is sleeved on the surface of one end of the reciprocating roller, a rotating rod is rotatably connected to the connecting plate, a second synchronous disc is fixedly connected to one end of the rotating rod, a synchronous belt is sleeved on the first synchronous disc and the second synchronous disc, a sprocket is fixedly connected to the other end of the rotating rod, a chain is sleeved on the sprocket, a lifting column is fixedly connected to the chain, and one end of the lifting column is slidably connected in the transverse groove, a linkage member is installed on the light shielding plate and is arranged on the machine shell, a limiting buckle is sleeved on the chain and is fixedly connected to the connecting plate.

[0013] As a preferred embodiment of the tunnel type UV curing furnace for semiconductors of the present invention, wherein: the adjusting assembly includes a screw rod rotatably connected to the rotating cylinder, connecting blocks are threadedly connected to both ends of the screw rod and are slidably connected to the rotating cylinder, a handle is fixedly connected to one end of the screw rod, a fixing bolt is threadedly connected to the handle and one end of the fixing bolt contacts the surface of the rotating cylinder.

[0014] As a preferred embodiment of the tunnel type UV curing furnace for semiconductors of the present invention, wherein: an energy detection assembly and an adjustable conveying member are respectively installed in the machine shell, an operating member, a power switch and an emergency stop button are respectively installed on the outer surface of the machine shell, an exhaust port is installed on the top of the machine shell, a pulley is rotatably connected to the light shielding plate and the surface of the pulley contacts the surface of the machine shell.

[0015] As a preferred embodiment of the tunnel type UV curing furnace for semiconductors of the present invention, wherein: the energy detection assembly includes a bottom plate fixedly connected in the machine shell, a conveying assembly is installed on the bottom plate, a stepping motor for driving the operation of the conveying assembly is installed on the conveying assembly and is fixedly connected to the bottom plate, a conveying plate is installed on the conveying assembly, a flipping cylinder is fixedly connected to the conveying plate, a swing arm is fixedly connected to the output end of the flipping cylinder, and a bottom plate detection probe and a plate surface detection probe are respectively fixedly connected to the swing arm.

[0016] As a preferred embodiment of the tunnel type UV curing furnace for semiconductors of the present invention, wherein: a guide wheel is rotatably connected to the inner wall of the placement rack, and a cover body is fixedly connected to the rack.

[0017] As a preferred embodiment of the tunnel type UV curing furnace for semiconductors of the present invention, wherein: the linkage member includes a square rod fixedly connected to the machine shell, a square block is sleeved on the square rod, a movable plate is rotatably connected between the square block and the light shielding plate, a fourth spring is sleeved on the square rod and both ends of the fourth spring are respectively fixedly connected to the surface of the machine shell and the square block, and an anti - detachment block is fixedly connected to one end of the square rod.

[0018] The beneficial effects of the present invention are as follows: The intermittent feeding can be realized by the feeding mechanism of the present invention. When feeding, the light-shielding plate is opened, and after the feeding is completed, the light-shielding plate is closed, reducing the long-term leakage of ultraviolet rays in the UV curing furnace to the external environment and the interference of external stray light on the accuracy of the UV wavelength, improving the reaction efficiency of the photoinitiator, and enhancing the uniformity of the semiconductor encapsulation adhesive or photoresist. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0020] Figure 1 It is a three-dimensional structure diagram of a partial structure of a tunnel-type UV curing furnace for semiconductors.

[0021] Figure 2 It is a three-dimensional structure diagram of the casing and cover of a tunnel-type UV curing furnace for semiconductors.

[0022] Figure 3 It is a three-dimensional structure diagram of a partial structure of the feeding mechanism of a tunnel-type UV curing furnace for semiconductors.

[0023] Figure 4 It is a three-dimensional structure diagram of the light-shielding plate and the frame of a tunnel-type UV curing furnace for semiconductors.

[0024] Figure 5 It is a sectional plan structure diagram of a partial structure of a tunnel-type UV curing furnace for semiconductors.

[0025] Figure 6 For the tunnel-type UV curing furnace for semiconductors Figure 5 The enlarged structure diagram of A.

[0026] Figure 7 For the tunnel-type UV curing furnace for semiconductors Figure 5 The enlarged structure diagram of B.

[0027] Figure 8 It is a three-dimensional sectional structure diagram of the worm of a tunnel-type UV curing furnace for semiconductors.

[0028] Figure 9 It is a three-dimensional sectional structure diagram of a partial structure of a tunnel-type UV curing furnace for semiconductors.

[0029] Figure 10 For the tunnel-type UV curing furnace for semiconductors Figure 9 The enlarged structure diagram of C.

[0030] Figure 11 The enlarged structural diagram of D in Figure 9 a tunnel-type UV curing furnace for semiconductors.

[0031] Figure 12 The enlarged structural diagram of E in Figure 9 a tunnel-type UV curing furnace for semiconductors.

[0032] Figure 13 The exploded three-dimensional structural diagram of the sleeve and the drive plate of a tunnel-type UV curing furnace for semiconductors.

[0033] Figure 14 The partial sectional three-dimensional structural diagram of the rotating cylinder and the placement rack of a tunnel-type UV curing furnace for semiconductors.

[0034] Figure 15 The partial structural three-dimensional structural diagram of the transmission component of a tunnel-type UV curing furnace for semiconductors.

[0035] Figure 16 The three-dimensional structural diagram of the lifting column and the chain of a tunnel-type UV curing furnace for semiconductors.

[0036] Figure 17 The three-dimensional structural diagram of the casing and the control parts of a tunnel-type UV curing furnace for semiconductors.

[0037] Figure 18 The three-dimensional structural diagram of the mercury lamp and the light shield of a tunnel-type UV curing furnace for semiconductors.

[0038] Figure 19 The three-dimensional structural diagram of the adjustable conveying part of a tunnel-type UV curing furnace for semiconductors.

[0039] Figure 20 The three-dimensional structural diagram of the energy detection component of a tunnel-type UV curing furnace for semiconductors.

[0040] In the figure: 100, UV curing furnace mechanism; 101, housing; 102, limit post; 103, light-shielding plate; 104, horizontal groove; 105, mercury lamp; 106, energy detection component; 107, adjustable conveying member; 108, control member; 109, power switch; 110, emergency stop button; 111, exhaust port; 112, pulley; 200, feeding mechanism; 201, frame; 202, rotating drum; 203, adjusting component; 204, placing rack; 205, pushing component; 206, rotating drive component; 207, limiting component; 208, transmission component; 209, limiting hole; 210, guide wheel; 211, cover body; 205a, support plate; 205b, servo motor; 205c, reciprocating roller; 205d, moving block; 205e, sliding column; 205f, pushing member; 205g, guide rod; 206a, L-shaped plate; 206b, worm; 206c, cross bar; 206d, first guide groove; 206e, guide column; 206f, ratchet member; 206g, worm gear; 207a, driving plate; 207b, second guide groove; 207c, trapezoidal block; 207d, first anti-toppling block; 207e, second anti-toppling block; 207f, limiting member; 207g, short rod; 207h, torsion spring; 207i, guide rail; 207j, reinforcing plate; 208a, connecting plate; 208b, first synchronous disk; 208c, rotating rod; 208d, second synchronous disk; 208e, synchronous belt; 208f, sprocket; 208g, chain; 208h, lifting column; 208i, linkage member; 208j, limiting buckle; 203a, screw rod; 203b, connecting block; 203c, handle; 203d, fixing bolt; 106a, bottom plate; 106b, conveying component; 106c, stepping motor; 106d, conveying plate; 106e, flipping cylinder; 106f, swing arm; 106g, bottom plate detection probe; 106h, plate surface detection probe; 205f-1, support plate; 205f-2, sliding rod; 205f-3, pushing plate; 205f-4, first spring; 207f-1, fixing plate; 207f-2, square plate; 207f-3, spline bolt; 207f-4, sleeve; 207f-5, second spring; 207f-6, sleeve; 207f-7, limiting rod; 207f-8, round block; 207f-9, third spring; 207f-10, guide plate; 207f-11, limiting groove; 207f-12, limiting block; 207f-13, fifth spring; 208i-1, square rod; 208i-2, square block; 208i-3, movable plate; 208i-4, fourth spring; 208i-5, anti-disengagement block. Detailed implementation manners

[0041] In order to make the above objects, features and advantages of the present invention more obvious and understandable, the following detailed description of the specific implementation manners of the present invention will be given in conjunction with the accompanying drawings of the specification.

[0042] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention may be practiced in other ways different from those described herein. Those skilled in the art can make similar generalizations without departing from the spirit of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0043] Secondly, as used herein, "an embodiment" or "embodiments" refer to specific features, structures, or characteristics that may be included in at least one implementation of the present invention. The phrase "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor is it an individual or alternative embodiment that is mutually exclusive with other embodiments.

[0044] Embodiment 1

[0045] Referring to Figures 1 - 9 , which is the first embodiment of the present invention. This embodiment provides a tunnel-type UV curing furnace for semiconductors. The tunnel-type UV curing furnace for semiconductors includes a UV curing furnace mechanism 100 and a feeding mechanism 200. The UV curing furnace mechanism 100 can rapidly cure the semiconductor after coating with glue, and the feeding mechanism 200 can achieve intermittent feeding and control the opening and closing of the light-shielding plate 103.

[0046] Specifically, for the UV curing furnace mechanism 100, the UV curing furnace mechanism 100 is a tunnel-type UV curing furnace and is prior art. The working principle and other aspects of this part are all prior art, and those skilled in the art can clearly understand them, so no detailed description will be given here. It can achieve the curing of the semiconductor after coating with glue. It includes a casing 101. A limiting column 102 is fixedly connected to the side of the casing 101. A light-shielding plate 103 is slidably connected to the limiting column 102. Two limiting columns 102 are installed on one light-shielding plate 103, and corresponding long holes are provided thereon, so that when the light-shielding plate 103 moves, it will not fall off the casing 101 and can move smoothly.

[0047] A horizontal groove 104 is provided on the side of the light-shielding plate 103. Through the setting of the horizontal groove 104, when the lifting column 208h on the transmission assembly 208 moves along with the chain 208g, the lifting column 208h moves therein. With the cooperation of the transmission assembly 208, the two opposite light-shielding plates 103 are separated for a period of time and then closed, and then closed for a period of time and then separated, so as to achieve opening during feeding and closing after feeding is completed, avoiding the light-shielding plate 103 being always open, resulting in the entry of other light sources, and improving the effect and efficiency of UV curing.

[0048] Mercury lamps 105 are respectively installed in the upper and lower parts inside the casing 101. The number of mercury lamps 105 is two, which are respectively installed above and below inside the casing 101 and are staggered with each other. Through such a setting, the glue at both ends of the semiconductor plate continuously fed into the UV curing furnace can be cured.

[0049] Specifically, the loading mechanism 200 is fixedly connected to the housing 101, and includes a frame 201 fixedly connected to the side of the housing 101, and a rotating drum 202 is rotatably connected to the frame 201. The rotating drum 202 is rotatably connected to the frame 201 through a bearing, and an adjusting component 203 is installed on the rotating drum 202. The distance between the placement racks 204 at both ends of the rotating drum 202 can be adjusted through the adjusting component 203, thereby completing the limiting of semiconductor boards of different specifications, and rotating them to the loading position as they rotate.

[0050] The adjusting component 203 is fixedly connected to a placement rack 204. Through the cooperation between the placement racks 204, the semiconductor boards transported by the conveying device can be inserted therein, and then rotated out of the original position, and the next group of corresponding placement racks 204 rotate to the corresponding position, thereby realizing cyclic loading. A conveying device is also provided on the loading mechanism 200, and the position of the conveying device can accurately deliver the semiconductor boards transported thereon into the placement rack 204.

[0051] A pushing component 205 is fixedly connected to the frame 201, and the pushing component 205 can push the semiconductor board on the placement rack 204 rotated to the loading position into the UV curing furnace mechanism 100 for curing. A rotating drive component 206 is installed on the surface of the rotating drum 202 and is arranged on the surface of the pushing component 205. Through the arrangement of the rotating drive component 206, when the pushing component 205 pushes the loading, it will not drive the rotating drum 202 to rotate, and then will not cause the placement rack 204 to rotate, so that the semiconductor board can be smoothly pushed into the UV curing furnace. After the loading is completed, the rotating drum 202 will not be driven to rotate when the front half is moved back.

[0052] If during this process the push piece 205f moves the rotating drum 202 back and the placement rack 204 also rotates together, the push piece 205f may hinder the rotation of the semiconductor board and cause damage. This arrangement improves safety and protects the semiconductor board. In the latter half, the rotating drum 202 can be driven to rotate so that the placement rack 204 rotates a specified angle, and the next semiconductor board to be loaded is rotated to the loading position. During this process, the placement rack 204 is rotated again, and the push piece 205f will not affect the rotation of the semiconductor board thereon.

[0053] A limiting component 207 is fixedly connected to the pushing component 205 and cooperates with the rotating drum 202. When the pushing component 205 pushes the semiconductor plate to load the material, the rotating drum 202 is limited by the limiting component 207 to prevent it and the placement rack 204 from rotating. After the pushing and loading is completed, the rotating drum 202 is still limited when moving back the front half, and the limit is released in the back half. The rotating drive component 206 can rotate the rotating drum 202 and the placement rack 204, and the rotating drum 202 is limited after resetting.

[0054] A transmission component 208 is fixedly connected to the pushing component 205 and is arranged on the surfaces of the machine housing 101 and the light-shielding plate 103. Through the transmission component 208, two adjacent light-shielding plates 103 can be separated during feeding, and the two light-shielding plates 103 can be closed when resetting after the feeding is completed. A plurality of limiting holes 209 are formed on the surface of the rotating cylinder 202, and the number of the limiting holes 209 corresponds to the number of the placing racks 204. The limiting member 207f is inserted into the limiting holes 209 to limit and fix the rotated rotating cylinder 202.

[0055] The limiting component 207 includes a driving plate 207a fixedly connected to the pushing component 205. A second guiding groove 207b is formed on the driving plate 207a. Through the second guiding groove 207b, the sleeve 207f-4 on the limiting member 207f moves therein. During material pushing, the limiting member 207f limits the rotating cylinder 202. After the pushing and feeding are completed, the limiting member 207f still limits the rotating cylinder 202 during the first major part of the backward movement, and the limiting is released during the last minor part.

[0056] A trapezoidal block 207c is rotatably connected to the driving plate 207a. Through the arrangement of the trapezoidal block 207c, during pushing and feeding, the sleeve 207f-4 moves in the upper half part of the second guiding groove 207b, and the limiting member 207f limits the rotating cylinder 202. The trapezoidal block 207c rotates under the extrusion of the sleeve 207f-4 without affecting the movement of the sleeve 207f-4. During the return process, it first moves in the upper half part of the second guiding groove 207b, so that the limiting member 207f still limits the rotating cylinder 202 during the first major part of the backward movement after the pushing and feeding are completed. Then, under the obstruction of the trapezoidal block 207c, the sleeve 207f-4 enters the lower part of the second guiding groove 207b to move, and the limiting of the rotating cylinder 202 by the limiting member 207f is released during the last minor part.

[0057] A first anti-inversion block 207d and a second anti-inversion block 207e are respectively formed in the second guiding groove 207b. Through the arrangement of the first anti-inversion block 207d and the second anti-inversion block 207e, the sleeve 207f-4 will not move backward when being extruded during moving at the bending part in the second guiding groove 207b. The first anti-inversion block 207d and the second anti-inversion block 207e are in a shape of first an inclined surface and then a vertical surface. The inclined surface enables the sleeve 207f-4 to move normally along the track of the second guiding groove 207b, and the vertical surface enables the sleeve 207f-4 not to move backward after being extruded.

[0058] Embodiment 2

[0059] Referring to Figures 2 - 16 , this is the second embodiment of the present invention, and this embodiment is based on the previous embodiment.

[0060] Specifically, the pushing component 205 includes a support plate 205a fixedly connected to the frame 201. On one side of the support plate 205a, a servo motor 205b is fixedly connected. The output shaft of the servo motor 205b is fixedly connected with a reciprocating roller 205c. Through the arrangement of the reciprocating roller 205c and the sliding column 205e, under the drive of the servo motor 205b, the reciprocating roller 205c rotates, and the sliding column 205e reciprocally moves in the reciprocating groove on the reciprocating roller 205c. Further, the moving block 205d reciprocally moves, realizing that the reciprocating movement of the moving block 205d can be achieved by the one-way rotation of the output shaft of the servo motor 205b. A moving block 205d is sleeved on the reciprocating roller 205c. A sliding column 205e is fixedly connected inside the moving block 205d, and it is slidably connected in the reciprocating groove on the reciprocating roller 205c.

[0061] A pushing member 205f is fixedly connected to the top of the moving block 205d. Under the action of the movement of the moving block 205d, the pushing member 205f can push the semiconductor plate on the placement rack 204 into the UV curing furnace. A guide rod 205g is slidably connected to the moving block 205d, and both ends of the guide rod 205g are fixedly connected to the inner wall of the support plate 205a. The guide rod 205g guides and limits the moving block 205d.

[0062] The rotary driving component 206 includes an L-shaped plate 206a fixedly connected to the support plate 205a. A worm 206b is rotatably connected to the L-shaped plate 206a. The worm 206b is rotatably connected to the L-shaped plate 206a through a bearing. A cross bar 206c is slidably connected inside the worm 206b, and one end of the cross bar 206c is fixedly connected to the pushing member 205f. A first guide groove 206d is formed inside the cross bar 206c. The first guide groove 206d is divided into two parts. When the guide post 206e moves in the first part, the worm 206b can rotate. When the guide post 206e moves in the second part, the worm 206b cannot rotate.

[0063] A guide post 206e is fixedly connected to the inner wall of the worm 206b, and it is slidably connected in the first guide groove 206d. A ratchet member 206f is sleeved on the rotating cylinder 202. A worm gear 206g is sleeved on the ratchet member 206f, and it meshes with the worm 206b. Through the arrangement of the ratchet member 206f, when the pushing member 205f drives the cross bar 206c to move during feeding, the guide post 206e moves in the first part, and when the worm 206b rotates to drive the worm gear 206g to rotate, the rotating cylinder 202 will not rotate under the action of the ratchet member 206f. Only after the feeding is completed by the pushing of the pushing member 205f and during the return movement when the cross bar 206c is driven to move, the guide post 206e moves in the first part, and when the worm 206b rotates to drive the worm gear 206g to rotate, under the action of the ratchet member 206f, it rotates together with the rotating cylinder 202. The worm gear 206g and the worm 206b are prior arts and will not be elaborated here.

[0064] A limiting member 207f is fixedly connected to the support plate 205a and is engaged with the second guide groove 207b. With the cooperation of the limiting member 207f in the second guide groove 207b, the limiting and fixing of the rotating cylinder 202 and the release of the limiting and fixing are realized. The upper end of the limiting member 207f is inserted into the limiting hole 209. A short rod 207g is rotatably connected to the driving plate 207a, and the trapezoidal block 207c is sleeved on the surface of the short rod 207g. A torsion spring 207h is sleeved on the short rod 207g, and its two ends are respectively fixedly connected to the surface of the driving plate 207a and the short rod 207g. Through the setting of the torsion spring 207h, after the trapezoidal block 207c drives the short rod 207g to rotate, it deforms, and the generated torsion provides a force for the reset of the short rod 207g and the trapezoidal block 207c.

[0065] A guide rail 207i is slidably connected to the driving plate 207a, and one end of it is fixedly connected to one side of the support plate 205a. The guide rail 207i guides and supports the driving plate 207a to make it more stable during movement. A reinforcing plate 207j is fixedly connected to the guide rail 207i, and its lower end is fixedly connected to the frame 201. The reinforcing plate 207j reinforces the guide rail 207i to make it more stable when connected to the frame 201.

[0066] The transmission assembly 208 includes a connecting plate 208a fixedly connected to the support plate 205a. A first synchronous disc 208b is sleeved on one end surface of the reciprocating roller 205c. A rotating rod 208c is rotatably connected to the connecting plate 208a, and the rotating rod 208c is rotatably connected to the connecting plate 208a through a bearing. A second synchronous disc 208d is fixedly connected to one end of the rotating rod 208c. A synchronous belt 208e is sleeved on the first synchronous disc 208b and the second synchronous disc 208d. Through the setting of the first synchronous disc 208b, the second synchronous disc 208d and the synchronous belt 208e, the two rotating rods 208c can be rotated simultaneously under the rotation of one reciprocating roller 205c, and then the two sprockets 208f can be rotated together.

[0067] A sprocket 208f is fixedly connected to the other end of the rotating rod 208c. A chain 208g is sleeved on the sprocket 208f. Through the setting of the sprocket 208f and the chain 208g, when it rotates, the lifting column 208h can be rotated around the trajectory of the chain 208g, and the lifting column 208h can move in the horizontal groove 104 in the light-shielding plate 103, so that the two opposite light-shielding plates 103 are separated for a period of time and then closed, and then closed for a period of time and then separated, thereby realizing the opening during feeding and the closing after the feeding is completed. The chain 208g is fixedly connected with the lifting column 208h, and one end of it is slidably connected in the horizontal groove 104.

[0068] A linkage member 208i is installed on the light-shielding plate 103 and is disposed on the casing 101. A limit buckle 208j is sleeved on the chain 208g and is fixedly connected to the connecting plate 208a. The number of limit buckles 208j is several. Through the arrangement of the limit buckles 208j, the chain 208g is limited, so that the sprocket 208f moves stably and does not hinder the normal movement of the lifting column 208h. When the lifting column 208h is stressed by the light-shielding plate 103, the chain 208g can then maintain a normal state.

[0069] The adjusting assembly 203 includes a screw rod 203a rotatably connected to a rotating cylinder 202. The screw rod 203a is rotatably connected to the rotating cylinder 202 through a bearing. The thread directions at both ends of the screw rod 203a are opposite. Connecting blocks 203b are threadedly connected to both ends of the screw rod 203a and are slidably connected to the rotating cylinder 202. A handle 203c is fixedly connected to one end of the screw rod 203a. By rotating the handle 203c to drive the screw rod 203a to rotate, the two connecting blocks 203b on the screw rod 203a can be moved closer to or away from each other, and then the distance between the placing racks 204 thereon can be adjusted to realize the limitation of semiconductor plates of different specifications.

[0070] A fixing bolt 203d is threadedly connected to the handle 203c, and one end thereof contacts the surface of the rotating cylinder 202. The fixing bolt 203d can fix the rotated handle 203c and the rotating cylinder 202 to prevent the handle 203c and the screw rod 203a from rotating under non-artificial conditions.

[0071] Embodiment 3

[0072] Refer to Figures 15 - 20 , which is the third embodiment of the present invention, and this embodiment is based on the first two embodiments.

[0073] Specifically, an energy detection component 106 and an adjustable conveying component 107 are respectively installed in the casing 101. By directly integrating the energy detection component 106 in the device, a method of multi-point detection and simulating the entry and exit of products of the board can be realized, without the need for manual cumbersome energy disk handling and detection. The data can be recorded in the software system for dynamic recording or abnormal alarm, which solves the time-consuming and laborious problem of manual energy detection, better controls the energy requirements for glue curing, improves the product qualification rate, can be used for the energy detection of mercury lamps 105 and LED lamps, is suitable for single lamps, multi-lamps, and various furnace shapes such as upper and lower contrasts, has high adaptability, reduces manpower and material resources for the workshop, constructs intelligent production, and improves the operation qualification rate.

[0074] The adjustable conveying component 107 is a prior art and will not be elaborated here. It can adjust the spacing according to the specifications of the semiconductor plate to meet the conveying of semiconductor plates of different widths in the UV curing furnace.

[0075] On the outer surface of the casing 101, an operating member 108, a power switch 109, and an emergency stop button 110 are respectively installed. The UV curing furnace can be conveniently controlled through the operating member 108. An exhaust port 111 is installed at the top of the casing 101, and a corresponding fan is arranged inside the casing 101. With the cooperation of the exhaust port 111, it is convenient to discharge the heat inside the UV curing furnace for ventilation and heat dissipation. A pulley 112 is rotatably connected to the light shielding plate 103, and its surface is in contact with the surface of the casing 101. Four pulleys 112 are arranged on one light shielding plate 103. The friction between the light shielding plate 103 and the casing 101 is reduced through the pulleys 112, making the movement of the light shielding plate 103 smoother.

[0076] The energy detection component 106 includes a bottom plate 106a fixedly connected inside the casing 101. A conveying component 106b is installed on the bottom plate 106a. A stepping motor 106c for driving the operation of the conveying component 106b is installed on the conveying component 106b and is fixedly connected to the bottom plate 106a. Through the setting of the conveying component 106b, the forward and reverse rotation of the output shaft of the stepping motor 106c is controlled, and the transport plate 106d can be reciprocally moved.

[0077] A transport plate 106d is installed on the conveying component 106b. A flipping cylinder 106e is fixedly connected to the transport plate 106d. The output end of the flipping cylinder 106e is fixedly connected to a swing arm 106f. A bottom plate detection probe 106g and a plate surface detection probe 106h are respectively fixedly connected to the swing arm 106f. Through the setting of the flipping cylinder 106e, when detection is required, the swing arm 106f can be rotated horizontally, and then multiple bottom plate detection probes 106g and plate surface detection probes 106h can be lowered. The flipping cylinder 106e and the swing arm 106f move along with the transport plate 106d.

[0078] When detection is not required, it rotates and retracts. The energy probes are retracted and lowered, mainly used to avoid normal product operations when not detecting. Multiple groups of energy probes can more accurately reflect the energy at multiple positions of product curing, are more accurate than traditional energy disk detection and have a data recording function. The energy following detection mechanism communicates with the software system of the curing equipment in real time to change the following speed, and turns on and off the energy probes to ensure the accuracy of energy detection.

[0079] Guide wheels 210 are rotatably connected to the inner wall of the placement rack 204. Multiple guide wheels 210 are arranged inside one placement rack 204 and are rotatably connected through a rotating shaft. Through the setting of the guide wheels 210, it is convenient to smoothly insert the semiconductor plate into the placement rack 204 and reduce the resistance. A cover body 211 is fixedly connected to the frame 201. The components on the feeding mechanism 200 are shielded by the cover body 211 to avoid harm to the human body during operation and improve safety.

[0080] The linkage 208i includes a square rod 208i-1 fixedly connected to the housing 101. A square block 208i-2 is sleeved on the square rod 208i-1, and the square block 208i-2 is slidably connected to the square rod 208i-1. The square rod 208i-1 guides and limits the square block 208i-2. There is a movable plate 208i-3 rotatably connected between the square block 208i-2 and the light-shielding plate 103. Through the arrangement of the movable plate 208i-3, when one light-shielding plate 103 moves, the square block 208i-2 can move on the square rod 208i-1, and then under the action of the other movable plate 208i-3, the other light-shielding plate 103 moves, realizing the mutual approach or separation of the two light-shielding plates 103, thus completing the closing and opening.

[0081] A fourth spring 208i-4 is sleeved on the square rod 208i-1, and its two ends are respectively fixedly connected to the surface of the housing 101 and the square block 208i-2. After being squeezed by the movement of the square block 208i-2 through the fourth spring 208i-4, the elastic force generated provides a force for the reset of the square block 208i-2 and makes the square block 208i-2 move more stably on the square rod 208i-1. One end of the square rod 208i-1 is fixedly connected with an anti-disengagement block 208i-5, which limits the square block 208i-2 to prevent it from disengaging from the square rod 208i-1.

[0082] Embodiment 4

[0083] Refer to Figures 7 - 13 , which is the fourth embodiment of the present invention, and this embodiment is based on the first three embodiments.

[0084] Specifically, the pushing member 205f includes a support plate 205f-1 fixedly connected to the top of the moving block 205d. A sliding rod 205f-2 is slidably connected to the support plate 205f-1, and one end of it is fixedly connected with a pushing plate 205f-3. A first spring 205f-4 is sleeved on the sliding rod 205f-2, and its two ends are respectively fixedly connected to the surface of the pushing plate 205f-3 and the support plate 205f-1. One end of the cross bar 206c is fixedly connected to one side of the support plate 205f-1. The sliding rod 205f-2 penetrates through the support plate 205f-1 and is slidably connected to it. The pushing plate 205f-3 is provided with an arc surface. Through such an arrangement and under the action of the first spring 205f-4, when there is a situation where the light-shielding plate 103 moves down and contacts the pushed-back pushing plate 205f-3, the light-shielding plate 103 can be pushed to move, compressing the first spring 205f-4, without affecting the movement of the pushing plate 205f-3 and the closing of the light-shielding plate 103.

[0085] The limiting member 207f includes a fixing plate 207f-1 fixedly connected to the support plate 205a. A square plate 207f-2 is slidably connected to the fixing plate 207f-1. The square plate 207f-2 penetrates through the fixing plate 207f-1 and is slidably connected thereto, enabling the square plate 207f-2 to move thereon without tilting. A spline bolt 207f-3 is slidably connected to the lower end of the square plate 207f-2. The spline bolt 207f-3 penetrates through the square plate 207f-2 and is slidably connected thereto. The spline bolt 207f-3 does not rotate when moving on the square plate 207f-2.

[0086] One end of the spline bolt 207f-3 is rotatably connected to a sleeve 207f-4, and it is slidably connected in the second guide groove 207b. By rotating the sleeve 207f-4, the resistance to its movement in the second guide groove 207b can be reduced, enabling the sleeve 207f-4 to move more smoothly in the second guide groove 207b. A second spring 207f-5 is sleeved on the spline bolt 207f-3, and its two ends are respectively fixedly connected to the surface of the spline bolt 207f-3 and the square plate 207f-2.

[0087] Through the arrangement of the second spring 207f-5, when the sleeve 207f-4 moves in the second guide groove 207b and is affected by the inclined surfaces of the first anti-tipping block 207d and the second anti-tipping block 207e, the sleeve 207f-4 and the spline bolt 207f-3 move and are compressed. When the sleeve 207f-4 gradually moves out of the inclined surface and is in the vertical plane, the spline bolt 207f-3 and the sleeve 207f-4 are reset under the action of the springback.

[0088] A sleeve 207f-6 is sleeved on the upper end of the square rod 208i-1. The sleeve 207f-6 is slidably sleeved on the surface of the square plate 207f-2. The upper end of the sleeve 207f-6 is fixedly connected to a limiting rod 207f-7. The limiting rod 207f-7 is inserted into the limiting hole 209. When the limiting rod 207f-7 is inserted into the limiting hole 209, it can limit the rotating cylinder 202, and further limit and fix the placing rack 204.

[0089] A round block 207f-8 is fixedly connected to the upper end of the square plate 207f-2. By providing the round block 207f-8, the sleeve 207f-6 is limited to prevent the sleeve 207f-6 from detaching from the square plate 207f-2. The top of the round block 207f-8 is fixedly connected to a third spring 207f-9, and its upper end is fixedly connected to the inner wall of the sleeve 207f-6. By providing the third spring 207f-9, when the limiting rod 207f-7 is in surface contact with the rotating cylinder 202, it can prevent the limiting rod 207f-7 from being damaged by hard contact when moving upward.

[0090] When the square plate 207f-2 moves upward again to drive the round block 207f-8 to move upward, the third spring 207f-9 is compressed. As the rotating cylinder 202 rotates, the limiting rod 207f-7 aligns with the limiting hole 209. Under the action of the rebound of the third spring 207f-9, the limiting rod 207f-7 quickly inserts into the limiting hole 209 to realize the limitation of the rotating cylinder 202.

[0091] A guide plate 207f-10 is sleeved on the outer surface of the sleeve 207f-6, and it is fixedly connected to the support plate 205a. A limiting groove 207f-11 is provided on the inner wall of the sleeve 207f-6. A limiting block 207f-12 is fixedly connected to the round block 207f-8, and it is slidably connected in the limiting groove 207f-11. Through the limiting block 207f-12 and the limiting groove 207f-11, the square plate 207f-2 and the sleeve 207f-6 are limited, and when the square plate 207f-2 moves downward, it can pull the sleeve 207f-6 and the limiting rod 207f-7 downward.

[0092] A fifth spring 207f-13 is sleeved on the lower end of the square plate 207f-2, and its two ends are respectively fixedly connected to the surface of the square plate 207f-2 and the fixed plate 207f-1. Under the action of the elastic pull-back of the fifth spring 207f-13, when the sleeve 207f-6 moves in the second guide groove 207b, it is affected by the square plate 207f-2 to apply an upward force to the spline bolt 207f-3, so that the sleeve 207f-6 can move smoothly during the backward movement in the second guide groove 207b.

[0093] During use, the semiconductor plate is sent into the placement rack 204 through the conveying device. The operation of the servo motor 205b is controlled to make the reciprocating roller 205c rotate, and then the moving block 205d, the sliding column 205e and the pushing member 205f move. The rotation of the reciprocating roller 205c drives the sprocket 208f and the chain 208g to rotate through the transmission of the first synchronous disk 208b, the second synchronous disk 208d and the synchronous belt 208e. Then the lifting column 208h moves along the track of the chain 208g. With the cooperation of the horizontal groove 104 on the light-shielding plate 103 and the linkage member 208i, the two light-shielding plates 103 are separated and opened.

[0094] During this process, the pushing member 205f and the moving block 205d drive the movement of the cross bar 206c and the driving plate 207a, and will not cause the rotation drive assembly 206 to drive the rotating cylinder 202 to rotate, and the limiting member 207f will not lose the limiting fixation of the rotating cylinder 202. After the pushing member 205f pushes the semiconductor plate on the placement rack 204 into the UV curing furnace and moves back, the two light-shielding plates 103 approach and close at this time.

[0095] As the drive board 207a and the cross bar 206c move back, the limit rod 207f-7 on the limit member 207f disengages from the limit hole 209 to release the limit on the rotating cylinder 202. At the same time, the worm 206b drives the worm gear 206g and the ratchet member 206f to rotate, so that the rotating cylinder 202 rotates a certain angle, and the semiconductor board on the corresponding placement rack 204 is rotated to the loading position. After the moving block 205d and the pushing member 205f are reset, the limit rod 207f-7 on the limit member 207f is inserted into the limit hole 209 on the rotating cylinder 202 for limiting, and this process repeats in sequence.

[0096] In summary, the feeding mechanism 200 can achieve intermittent feeding, and open the light shielding plate 103 during feeding and close the light shielding plate 103 after feeding. Compared with the prior art, it reduces the situation that ultraviolet rays in the UV curing furnace leak to the external environment for a long time and the interference of external stray light on the accuracy of the UV wavelength, improves the reaction efficiency of the photoinitiator, and enhances the uniformity of the semiconductor encapsulation adhesive or photoresist.

[0097] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention, and they should all be covered within the scope of the claims of the present invention.

Claims

1. A tunnel type UV curing furnace for semiconductors, characterized in that: include, A UV curing furnace mechanism (100) comprises a housing (101), a limiting column (102) being fixedly connected to a side of the housing (101), a light shielding plate (103) being slidably connected to the limiting column (102), a transverse groove (104) being provided on a side of the light shielding plate (103), and mercury lamps (105) being respectively installed at the upper and lower parts of the housing (101); and, The feeding mechanism (200) is fixedly connected to the housing (101), and comprises a frame (201) fixedly connected to the side of the housing (101); a rotating drum (202) is rotatably connected to the frame (201); an adjusting component (203) is installed on the rotating drum (202); a placing frame (204) is fixedly connected to the adjusting component (203); a pushing component (205) is fixedly connected to the frame (201); a rotating driving component (206) is installed on the surface of the rotating drum (202) and is arranged on the surface of the pushing component (205); a limiting component (207) is fixedly connected to the pushing component (205) and cooperates with the rotating drum (202); a transmission component (208) is fixedly connected to the pushing component (205) and is arranged on the surfaces of the housing (101) and the light shielding plate (103); and a limiting hole (209) is provided on the surface of the rotating drum (202).

2. The semiconductor tunnel type UV curing furnace as claimed in claim 1, characterized in that: The pushing assembly (205) comprises a support plate (205a) fixedly connected to the frame (201); a servo motor (205b) is fixedly connected to one side of the support plate (205a); a reciprocating roller (205c) is fixedly connected to the output shaft of the servo motor (205b); a moving block (205d) is sleeved on the reciprocating roller (205c); a sliding column (205e) is fixedly connected inside the moving block (205d) and is slidably connected to a reciprocating groove on the reciprocating roller (205c); a pushing piece (205f) is fixedly connected to the top of the moving block (205d); a guide rod (205g) is slidably connected to the moving block (205d), and both ends of the guide rod are fixedly connected to the inner wall of the support plate (205a).

3. The semiconductor tunnel type UV curing furnace as claimed in claim 2, characterized in that: The rotary drive assembly (206) comprises an L-shaped plate (206a) fixedly connected to the support plate (205a); a worm (206b) is rotatably connected to the L-shaped plate (206a); a cross bar (206c) is slidably connected inside the worm (206b), and one end of the cross bar (206c) is fixedly connected to the push piece (205f); a first guide groove (206d) is provided inside the cross bar (206c); a guide column (206e) is fixedly connected to the inner wall of the worm (206b), and is slidably connected to the first guide groove (206d); a ratchet member (206f) is sleeved on the rotating cylinder (202); a worm wheel (206g) is sleeved on the ratchet member (206f), and the worm wheel (206g) is meshed with the worm (206b).

4. The semiconductor tunnel type UV curing furnace as claimed in claim 2, characterized in that: The limiting assembly (207) comprises a driving plate (207a) fixedly connected to the pushing assembly (205), a second guide groove (207b) being provided on the driving plate (207a), a trapezoidal block (207c) being rotatably connected to the driving plate (207a), a first anti-falling block (207d) and a second anti-falling block (207e) being provided in the second guide groove (207b), a limiting member (207f) being fixedly connected to the supporting plate (205a), and cooperating with the second guide groove (207b), an upper end of the limiting member (207f) being inserted into the limiting hole (209 ), the driving plate (207a) is rotatably connected to a short rod (207g), and the trapezoidal block (207c) is sleeved on the surface of the short rod (207g), the short rod (207g) is sleeved with a torsion spring (207h), and its two ends are respectively fixedly connected to the driving plate (207a) and the surface of the short rod (207g), the driving plate (207a) is slidably connected to a guide rail (207i), and one end of which is fixedly connected to one side of the support plate (205a), and the guide rail (207i) is fixedly connected to a reinforcement plate (207j), and its lower end is fixedly connected to the frame (201).

5. The semiconductor tunnel type UV curing furnace as claimed in claim 2, characterized in that: The transmission assembly (208) comprises a connecting plate (208a) fixedly connected to the support plate (205a); a first synchronous disk (208b) is sleeved on one end surface of the reciprocating roller (205c); a rotating rod (208c) is rotatably connected to the connecting plate (208a); a second synchronous disk (208d) is fixedly connected to one end of the rotating rod (208c); a synchronous belt (208e) is sleeved on the first synchronous disk (208b) and the second synchronous disk (208d); and the rotating rod (20 8c) is fixedly connected to a sprocket (208f) at the other end, the sprocket (208f) is sleeved with a chain (208g), the chain (208g) is fixedly connected with a lifting column (208h), and one end of the chain (208g) is slidably connected in the transverse groove (104), a linkage member (208i) is installed on the shading plate (103), and is arranged on the housing (101), and a limit buckle (208j) is sleeved on the chain (208g), and it is fixedly connected to the connecting plate (208a).

6. The semiconductor tunnel type UV curing furnace as claimed in claim 1, characterized in that: The adjustment assembly (203) comprises a screw rod (203a) rotatably connected to the rotating drum (202), both ends of the screw rod (203a) are threadedly connected to connecting blocks (203b), and the screw rod (203a) is slidably connected to the rotating drum (202), one end of the screw rod (203a) is fixedly connected to a handle (203c), and the handle (203c) is threadedly connected to a fixing bolt (203d), and one end of the handle (203c) is in contact with the surface of the rotating drum (202).

7. The semiconductor tunnel type UV curing furnace as claimed in claim 1, characterized in that: An energy detection component (106) and an adjustable conveying member (107) are respectively installed in the casing (101); a control member (108), a power switch (109) and an emergency stop button (110) are respectively installed on the outer surface of the casing (101); an exhaust port (111) is installed on the top of the casing (101); a pulley (112) is rotatably connected to the shading plate (103), and its surface is in contact with the surface of the casing (101).

8. The semiconductor tunnel type UV curing furnace as claimed in claim 7, characterized in that: The energy detection component (106) comprises a base plate (106a) fixedly connected to the housing (101), a transmission component (106b) being installed on the base plate (106a), a stepping motor (106c) driving the transmission component (106b) being installed on the transmission component (106b) and being fixedly connected to the base plate (106a), a transport plate (106d) being installed on the transmission component (106b), a flip cylinder (106e) being fixedly connected to the transport plate (106d), a swing arm (106f) being fixedly connected to the output end of the flip cylinder (106e), and a bottom detection probe (106g) and a surface detection probe (106h) being fixedly connected to the swing arm (106f), respectively.

9. The semiconductor tunnel type UV curing furnace as claimed in claim 1, characterized in that: The inner wall of the placement rack (204) is rotatably connected to a guide wheel (210), and the frame (201) is fixedly connected to a cover body (211).

10. The semiconductor tunnel type UV curing furnace as claimed in claim 5, characterized in that: The linkage member (208i) comprises a square rod (208i-1) fixedly connected to the housing (101); a square block (208i-2) is sleeved on the square rod (208i-1); a movable plate (208i-3) is rotatably connected between the square block (208i-2) and the shading plate (103); a fourth spring (208i-4) is sleeved on the square rod (208i-1), and its two ends are respectively fixedly connected to the housing (101) and the surface of the square block (208i-2); and an anti-dropping block (208i-5) is fixedly connected to one end of the square rod (208i-1).

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