Welding forming process of sapphire packaging shell

Abstract

The invention belongs to the technical field of welding, and particularly relates to a sapphire packaging shell welding forming process which comprises the following specific steps: heating active elements until the active elements are in a liquid state to obtain a solution A, heating a preservative until the preservative is in a liquid state to obtain a solution B, heating an anti-rust agent until the anti-rust agent is in a liquid state to obtain a solution C, and heating the solution C until the anti-rust agent is in a liquid state to obtain a solution D; the method comprises the following steps: adding active elements into a brazing filler metal to obtain a solution A, mixing the solution A, the solution B and the solution C to obtain a solution C, mixing the solution A, the solution B and the solution C to obtain a mixture, cooling the mixture, obtaining the brazing filler metal after cooling is completed, and welding sapphire on a metal shell through the brazing filler metal to serve as an insulating medium to connect a lead. The method has the beneficial effects that when sapphire and a metal shell are welded, the wettability of the surface of the sapphire can be improved, and then the welding effect between the sapphire and the metal shell can be improved.

Description

Technical Field

[0001] The present invention relates to the field of welding technology, and particularly to a welding and forming process for a sapphire encapsulation housing. Background Art

[0002] An encapsulation housing is a housing that protects electronic components. It can encapsulate electronic components (such as capacitors, resistors, integrated circuits, etc.) to protect the electronic components from the external environment. Some encapsulation housings can also provide heat dissipation functions and sometimes can transmit signals and energy. The encapsulation housing can isolate the components from the external environment, avoiding damage from a series of factors such as mechanical shock, moisture intrusion, sun and rain, corrosion, oxidation, etc., so that the components can still work normally in a harsh environment. The component encapsulation housing can effectively reduce the volume of the components and realize the manufacture of miniaturized electrical appliances, which is beneficial to improving the integration and stability of the circuit.

[0003] Currently, an insulating medium is usually provided on the encapsulation housing to connect leads / pins. However, when the insulating medium is selected as sapphire, during the process of welding sapphire to a metal housing, due to the high chemical stability of sapphire and the lack of chemical or diffusion reactions with many metals, it is very difficult to wet with the solder, which will affect the welding effect to a certain extent. Therefore, a welding and forming process for a sapphire encapsulation housing is invented. Summary of the Invention

[0004] In view of the above and / or problems existing in the current welding and forming process of sapphire encapsulation housings, the present invention is proposed.

[0005] Therefore, the object of the present invention is to provide a welding and forming process for a sapphire encapsulation housing. By adding active elements to the solder, it can solve the problem that due to the high chemical stability of sapphire and the lack of chemical or diffusion reactions with many metals, it is very difficult to wet with the solder, which will affect the welding effect to a certain extent.

[0006] To solve the above technical problems, according to one aspect of the present invention, the following technical solutions are provided:

[0007] A welding and forming process for a sapphire encapsulation housing, which specifically includes the following steps:

[0008] Step 1: Heat the active element until it becomes liquid to obtain solution A, heat the preservative until it becomes liquid to obtain solution B, and heat the rust inhibitor until it becomes liquid to obtain solution C;

[0009] Step 2: Mix solution A, solution B, and solution C to obtain a mixture;

[0010] Step 3: Cool the mixture. After cooling is complete, the solder can be obtained.

[0011] Step 4: Use the solder to weld the sapphire to the metal casing to connect the lead wires as an insulating medium.

[0012] As a preferred solution of the welding and forming process of the sapphire encapsulation casing described in the present invention, wherein: the heating temperature of the active element in Step 1 is 350°C - 400°C, the heating temperature of the preservative in Step 1 is 400°C - 450°C, and the heating temperature of the rust inhibitor in Step 1 is 200°C - 300°C.

[0013] As a preferred solution of the welding and forming process of the sapphire encapsulation casing described in the present invention, wherein: the mixing temperature of Solution A, Solution B, and Solution C in Step 2 is 650°C - 700°C, and the mixing time is 16 min - 20 min.

[0014] As a preferred solution of the welding and forming process of the sapphire encapsulation casing described in the present invention, wherein: the raw materials of the active element include, by weight: 10 parts - 14 parts of potassium, 8 parts - 10 parts of sodium, 8 parts - 12 parts of zinc, 6 parts - 10 parts of tin, and 8 parts - 10 parts of lead.

[0015] As a preferred solution of the welding and forming process of the sapphire encapsulation casing described in the present invention, wherein: the preparation steps of the active element are as follows:

[0016] Process 1: Mix potassium, sodium, and zinc.

[0017] Process 2: Mix tin and lead.

[0018] Process 3: Mix the mixture in Process 1 and the mixture in Process 2 to obtain the active element.

[0019] As a preferred solution of the welding and forming process of the sapphire encapsulation casing described in the present invention, wherein: the raw materials of the preservative include, by weight: 8 parts - 14 parts of urushiol resin, 8 parts - 16 parts of phenolic resin, 8 parts - 16 parts of furan resin, 8 parts - 20 parts of polyurethane resin, 10 parts - 14 parts of waterborne epoxy resin, 8 parts - 14 parts of benzene, 10 parts - 12 parts of benzoic acid, and 8 parts - 10 parts of glycine.

[0020] As a preferred solution of the welding and forming process of the sapphire encapsulation casing described in the present invention, wherein: the preparation steps of the preservative are as follows:

[0021] Process 1: Mix urushiol resin, phenolic resin, and furan resin.

[0022] Process 2: Mix polyurethane resin, waterborne epoxy resin, and benzene.

[0023] Process Three: Mix benzoic acid and glycine;

[0024] Process Four: Mix the mixture in Process One, the mixture in Process Two, and the mixture in Process Three to obtain a preservative.

[0025] As a preferred solution of the welding and forming process of the sapphire encapsulation housing described in the present invention, wherein: the mixing temperature in Process One is 60°C - 70°C, the mixing time is 8 min - 10 min, the mixing temperature in Process Two is 80°C - 100°C, the mixing time is 10 min - 12 min, the mixing temperature in Process Three is 80°C - 90°C, the mixing time is 8 min - 12 min, and the mixing temperature in Process Four is 80°C - 90°C, the mixing time is 6 min - 10 min.

[0026] As a preferred solution of the welding and forming process of the sapphire encapsulation housing described in the present invention, wherein: the rust inhibitor includes, by weight: 6 - 8 parts of oily wax, 8 - 10 parts of vaseline, 8 - 12 parts of trisodium phosphate, 6 - 8 parts of sodium propionate, and 8 - 10 parts of corrosion inhibitor.

[0027] As a preferred solution of the welding and forming process of the sapphire encapsulation housing described in the present invention, wherein: the preparation process of the rust inhibitor is as follows:

[0028] Process One: Mix oily wax, vaseline, and trisodium phosphate;

[0029] Process Two: Mix sodium propionate and corrosion inhibitor;

[0030] Process Three: Mix the mixture in Process One and the mixture in Process Two to obtain a rust inhibitor.

[0031] Compared with the prior art:

[0032] 1. By adding active elements to the solder, it can improve the wettability of the sapphire surface during the welding of the sapphire and the metal housing, and thus improve the welding effect between the sapphire and the metal housing.

[0033] 2. By adding a preservative to the solder, it can improve the anti-corrosion effect of the welding point between the sapphire and the metal housing, and thus improve the corrosion resistance of the welding point, and to a certain extent improve the maintenance life of the welding point.

[0034] 3. By adding a rust inhibitor to the solder, it can improve the rust prevention effect of the welding point between the sapphire and the metal housing, and thus improve the rust prevention performance of the welding point, further improving the maintenance life of the welding point. Detailed Implementation Modes

[0035] To make the objectives, technical solutions and advantages of the present invention clearer, the implementation modes of the present invention will be further described in detail below.

[0036] Example 1:

[0037] The present invention provides a welding and forming process for a sapphire encapsulation housing, including the following specific steps:

[0038] Step 1: Heat the active element until it becomes liquid to obtain Solution A, heat the preservative until it becomes liquid to obtain Solution B, and heat the rust inhibitor until it becomes liquid to obtain Solution C; wherein, the heating temperature of the active element is 350°C, the heating temperature of the preservative is 400°C, and the heating temperature of the rust inhibitor is 200°C;

[0039] Step 2: Mix Solution A, Solution B, and Solution C to obtain a mixture; wherein, the mixing temperature of Solution A, Solution B, and Solution C is 650°C, and the mixing time is 16 min;

[0040] Step 3: Cool the mixture, and after cooling is completed, the solder can be obtained;

[0041] Step 4: Use the solder to weld the sapphire to the metal housing to connect the lead as an insulating medium.

[0042] Among them:

[0043] The raw materials of the active element include, by weight: 10 parts of potassium, 8 parts of sodium, 8 parts of zinc, 6 parts of tin, and 8 parts of lead;

[0044] The preparation steps of the active element are as follows:

[0045] Process 1: Mix potassium, sodium, and zinc;

[0046] Process 2: Mix tin and lead;

[0047] Process 3: Mix the mixture in Process 1 and the mixture in Process 2 to obtain the active element.

[0048] The raw materials of the preservative include, by weight: 8 parts of urushiol resin, 8 parts of phenolic resin, 8 parts of furan resin, 8 parts of polyurethane resin, 10 parts of water-based epoxy resin, 8 parts of benzene, 10 parts of benzoic acid, and 8 parts of glycine;

[0049] The preparation steps of the preservative are as follows:

[0050] Process 1: Mix urushiol resin, phenolic resin, and furan resin, wherein the mixing temperature is 60°C and the mixing time is 8 min;

[0051] Process Two: Mix polyurethane resin, waterborne epoxy resin and benzene, where the mixing temperature is 80 °C and the mixing time is 10 min;

[0052] Process Three: Mix benzoic acid and glycine, where the mixing temperature is 80 °C and the mixing time is 8 min;

[0053] Process Four: Mix the mixture in Process One, the mixture in Process Two and the mixture in Process Three to obtain a preservative, where the mixing temperature is 80 °C and the mixing time is 6 min.

[0054] The rust inhibitor includes, by weight: 6 parts of oily wax, 8 parts of petrolatum, 8 parts of trisodium phosphate, 6 parts of sodium propionate, and 8 parts of corrosion inhibitor;

[0055] The preparation process of the rust inhibitor is as follows:

[0056] Process One: Mix oily wax, petrolatum and trisodium phosphate;

[0057] Process Two: Mix sodium propionate and corrosion inhibitor;

[0058] Process Three: Mix the mixture in Process One and the mixture in Process Two to obtain a rust inhibitor.

[0059] Example 2:

[0060] The present invention provides a welding and forming process for a sapphire encapsulation housing, including the following specific steps:

[0061] Step One: Heat the active element until it becomes liquid to obtain Solution A, heat the preservative until it becomes liquid to obtain Solution B, and heat the rust inhibitor until it becomes liquid to obtain Solution C; among them, the heating temperature of the active element is 375 °C, the heating temperature of the preservative is 425 °C, and the heating temperature of the rust inhibitor is 250 °C;

[0062] Step Two: Mix Solution A, Solution B and Solution C to obtain a mixture; among them, the mixing temperature of Solution A, Solution B and Solution C is 675 °C and the mixing time is 18 min;

[0063] Step Three: Cool the mixture, and after cooling is completed, a filler metal can be obtained;

[0064] Step Four: Use the filler metal to weld the sapphire on the metal housing to connect the lead wires as an insulating medium.

[0065] Among them:

[0066] The raw materials of the active element include, by weight: 12 parts of potassium, 9 parts of sodium, 10 parts of zinc, 8 parts of tin, and 9 parts of lead;

[0067] The preparation steps of the active element are as follows:

[0068] Process 1: Mix potassium, sodium, and zinc;

[0069] Process 2: Mix tin and lead;

[0070] Process 3: Mix the mixture in Process 1 and the mixture in Process 2 to obtain the active element.

[0071] The raw materials of the preservative include, by weight: 11 parts of urushiol resin, 12 parts of phenolic resin, 12 parts of furan resin, 14 parts of polyurethane resin, 12 parts of waterborne epoxy resin, 11 parts of benzene, 11 parts of benzoic acid, and 9 parts of glycine;

[0072] The preparation steps of the preservative are as follows:

[0073] Process 1: Mix urushiol resin, phenolic resin, and furan resin, where the mixing temperature is 65°C and the mixing time is 9 min;

[0074] Process 2: Mix polyurethane resin, waterborne epoxy resin, and benzene, where the mixing temperature is 90°C and the mixing time is 11 min;

[0075] Process 3: Mix benzoic acid and glycine, where the mixing temperature is 85°C and the mixing time is 10 min;

[0076] Process 4: Mix the mixture in Process 1, the mixture in Process 2, and the mixture in Process 3 to obtain the preservative, where the mixing temperature is 85°C and the mixing time is 8 min.

[0077] The rust inhibitor includes, by weight: 7 parts of oily wax, 9 parts of petrolatum, 10 parts of trisodium phosphate, 7 parts of sodium propionate, and 9 parts of corrosion inhibitor;

[0078] The preparation process of the rust inhibitor is as follows:

[0079] Process 1: Mix oily wax, petrolatum, and trisodium phosphate;

[0080] Process 2: Mix sodium propionate and corrosion inhibitor;

[0081] Process 3: Mix the mixture in Process 1 and the mixture in Process 2 to obtain the rust inhibitor.

[0082] Example 3:

[0083] The present invention provides a welding and forming process for a sapphire encapsulation housing, including the following specific steps:

[0084] Step 1: Heat the active element until it becomes liquid to obtain Solution A, heat the preservative until it becomes liquid to obtain Solution B, and heat the rust inhibitor until it becomes liquid to obtain Solution C. Among them, the heating temperature of the active element is 400 °C, the heating temperature of the preservative is 450 °C, and the heating temperature of the rust inhibitor is 300 °C.

[0085] Step 2: Mix Solution A, Solution B, and Solution C to obtain a mixture. Among them, the mixing temperature of Solution A, Solution B, and Solution C is 700 °C, and the mixing time is 20 min.

[0086] Step 3: Cool the mixture. After cooling is completed, the solder can be obtained.

[0087] Step 4: Use the solder to weld the sapphire to the metal shell to connect the lead as an insulating medium.

[0088] Among them:

[0089] The raw materials of the active element include, by weight: 14 parts of potassium, 10 parts of sodium, 12 parts of zinc, 10 parts of tin, and 10 parts of lead.

[0090] The preparation steps of the active element are as follows:

[0091] Process 1: Mix potassium, sodium, and zinc.

[0092] Process 2: Mix tin and lead.

[0093] Process 3: Mix the mixture in Process 1 and the mixture in Process 2 to obtain the active element.

[0094] The raw materials of the preservative include, by weight: 14 parts of urushiol resin, 16 parts of phenolic resin, 16 parts of furan resin, 20 parts of polyurethane resin, 14 parts of waterborne epoxy resin, 14 parts of benzene, 12 parts of benzoic acid, and 10 parts of glycine.

[0095] The preparation steps of the preservative are as follows:

[0096] Process 1: Mix urushiol resin, phenolic resin, and furan resin. Among them, the mixing temperature is 70 °C, and the mixing time is 10 min.

[0097] Process 2: Mix polyurethane resin, waterborne epoxy resin, and benzene. Among them, the mixing temperature is 100 °C, and the mixing time is 12 min.

[0098] Process 3: Mix benzoic acid and glycine. Among them, the mixing temperature is 90 °C, and the mixing time is 12 min.

[0099] Process Four: Mix the mixture in Process One, the mixture in Process Two, and the mixture in Process Three to obtain a preservative. The mixing temperature is 90 °C and the mixing time is 10 min.

[0100] The rust inhibitor, by weight, includes: 8 parts of oily wax, 10 parts of petrolatum, 12 parts of trisodium phosphate, 8 parts of sodium propionate, and 10 parts of corrosion inhibitor;

[0101] The preparation process of the rust inhibitor is as follows:

[0102] Process One: Mix the oily wax, petrolatum, and trisodium phosphate;

[0103] Process Two: Mix the sodium propionate and the corrosion inhibitor;

[0104] Process Three: Mix the mixture in Process One and the mixture in Process Two to obtain a rust inhibitor.

[0105] Compare the welding methods carried out in the above Examples 1 - 3 to obtain the following data:

[0106] Example 1 Example 2 Example 3 Anticorrosion level Sa2 Sa2.5 Sa2 Corrosion rate 0.01.4 mm / a 0.01.1 mm / a 0.01.6 mm / a

[0107] As can be seen from the above table, the welding methods carried out in Examples 1 - 3 have good performance in terms of anti - corrosion grade and corrosion rate. After use, the effect of Example 2 is the best.

[0108] Although the present invention has been described above with reference to the embodiments, various improvements can be made to it and components therein can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the various features in the disclosed embodiments of the present invention can be combined with each other in any way. The reason for not exhaustively describing the situations of these combinations in this specification is only to save space and resources. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. The welding forming process of the sapphire package shell is characterized in that: The specific steps are as follows: Step 1: heating the active element until the active element is in liquid form to obtain solution A, heating the preservative until the preservative is in liquid form to obtain solution B, and heating the rust inhibitor until the rust inhibitor is in liquid form to obtain solution C; Step 2: mixing solution A, solution B and solution C to obtain a mixture; Step 3: Cool the mixture, and after cooling, the solder can be obtained; Step 4: Use solder to solder the sapphire to the metal shell to serve as an insulating medium to connect the leads.

2. The welding forming process of the sapphire package shell according to claim 1, characterized in that: The heating temperature of the active element in the step 1 is 350°C-400°C, the heating temperature of the preservative in the step 1 is 400°C-450°C, and the heating temperature of the rust inhibitor in the step 1 is 200°C-300°C.

3. The welding forming process of the sapphire package shell according to claim 1, characterized in that: The mixing temperature of solution A, solution B and solution C in step 2 is 650° C.-700° C., and the mixing time is 16 min-20 min.

4. The welding forming process of the sapphire package shell according to claim 1, characterized in that: The raw materials of the active elements include, by weight: 10-14 parts of potassium, 8-10 parts of sodium, 8-12 parts of zinc, 6-10 parts of tin, and 8-10 parts of lead.

5. The welding forming process of the sapphire package shell according to claim 4, characterized in that: The preparation steps of the active element are as follows: Process 1: Mix potassium, sodium and zinc; Process 2: Mixing tin and lead; Process 3: The mixture in process 1 and the mixture in process 2 are mixed to obtain active elements.

6. The welding forming process of the sapphire package shell according to claim 1, characterized in that: The raw materials of the preservative include, by weight: 8-14 parts of urushiol resin, 8-16 parts of phenolic resin, 8-16 parts of furan resin, 8-20 parts of polyurethane resin, 10-14 parts of water-based epoxy resin, 8-14 parts of benzene, 10-12 parts of benzoic acid, and 8-10 parts of glycine.

7. The welding forming process of the sapphire package shell according to claim 6, characterized in that: The preparation steps of the preservative are as follows: Process 1: mixing urushiol resin, phenolic resin and furan resin; Process 2: Mixing polyurethane resin, waterborne epoxy resin and benzene; Process 3: mixing benzoic acid and glycine; Process 4: The mixture in process 1, the mixture in process 2 and the mixture in process 3 are mixed to obtain a preservative.

8. The welding forming process of the sapphire package shell according to claim 7, characterized in that: The mixing temperature in the process one is 60°C-70°C, and the mixing time is 8min-10min, the mixing temperature in the process two is 80°C-100°C, and the mixing time is 10min-12min, the mixing temperature in the process three is 80°C-90°C, and the mixing time is 8min-12min, and the mixing temperature in the process four is 80°C-90°C, and the mixing time is 6min-10min.

9. The welding forming process of the sapphire package shell according to claim 1, characterized in that: The rust inhibitor comprises, by weight: 6-8 parts of oily wax, 8-10 parts of vaseline, 8-12 parts of trisodium phosphate, 6-8 parts of sodium propionate, and 8-10 parts of corrosion inhibitor.

10. The welding forming process of the sapphire package shell according to claim 9, characterized in that: The preparation process of the rust inhibitor is as follows: Process 1: Mixing oily wax, vaseline and trisodium phosphate; Process 2: Mixing sodium propionate and corrosion inhibitor; Process 3: The mixture in process 1 and the mixture in process 2 are mixed to obtain a rust inhibitor.