A grinding device for blind vias of a high-density interconnect printed circuit board after blind via filling

Abstract

This application belongs to the technical field of circuit board processing, and in particular relates to a grinding device after blind hole filling of a high-density interconnect printed circuit board, including a grinding machine table. A linear moving seat is slidably installed on the top of the grinding machine table, and a circuit board fixture is fixedly installed on the top of the linear moving seat. The right side of the circuit board fixture is fixedly connected with an X-shaped mounting frame, and the right side of the X-shaped mounting frame is fixedly connected with a linear sliding plate. In the present invention, during the first grinding, the electric push rod drives the motor seat to move downward, and the grinding motor drives the grinding roller to rotate, so that the grinding roller grinds the resin on the circuit board, making the grinding surface of the resin close to the surface of the circuit board. After that, the circuit board fixture continues to move to the right, so that the second grinding module moves above the circuit board, thereby realizing the second grinding, making the surface of the resin flat, enabling the two grinding modules to automatically switch positions, and the circuit board is always fixed during this process, avoiding deviation and ensuring the processing quality.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and particularly relates to a grinding device for blind vias of a high-density interconnect printed circuit board after blind via filling. Background Art

[0002] The volume of electronic products is becoming increasingly thin, light, short and small. Directly stacking vias on blind vias is a design method to obtain high-density interconnection. To achieve good via stacking, the blind vias should be filled first to ensure the flatness of the board surface. The main function of blind vias in a circuit board is to achieve conduction between two layers, and the filling effect is mainly to avoid affecting subsequent soldering and the processing of high-order via stacking. At the same time, due to the surface-mounted components on the board surface, the board surface is required to be flat. Therefore, the blind vias at the component mounting positions on the board surface generally also need to be filled.

[0003] Common methods for filling blind vias include electroplating via filling, that is, through the action of special electroplating additives, the blind vias are filled during the electroplating process. However, during the electroplating process, problems such as via filling voids, insufficient filling fullness, and poor flatness of the board surface are likely to occur. For example, the patent with the authorization announcement number CN111295052B relates to a blind via filling process and a grinding device for a high-density interconnect printed circuit board. The process includes the following steps: Step S1: plating a layer of copper on the inner wall of the blind via; Step S2: manufacturing a connecting plate for via filling, and the positions of the through holes on the connecting plate correspond to the positions of the blind vias; Step S3: aligning and fixing the connecting plate on the circuit board; Step S4: filling the through holes and blind vias with resin; Step S5: drying and curing the resin; Step S6: grinding to make the surface of the circuit board flat; Step S7: performing surface copper plating on the surface of the circuit board. The above invention has the effects of full blind via filling, good filling quality, and high flatness of the board surface. In the above technology: although it can make the via filling more full and improve the flatness, the fixing effect of the circuit board is not good, and due to the fixation of the first grinding mechanism and the second grinding mechanism, the loading and unloading operations of the circuit board are hindered.

[0004] In view of this, the present invention designs a grinding device for blind vias of a high-density interconnect printed circuit board after blind via filling. Summary of the Invention

[0005] The main purpose of the present disclosure is to provide a grinding device for blind vias of a high-density interconnect printed circuit board after blind via filling, so as to effectively solve the problems raised by the inventor in the above background art.

[0006] To achieve the above object, the technical solution adopted by the present invention is as follows:

[0007] A grinding device for blind vias of a high - density interconnect printed circuit board after filling the vias, comprising a grinding machine table. A linear moving seat is slidably mounted on the top of the grinding machine table, and a circuit board fixture is fixedly mounted on the top of the linear moving seat. A right - hand side of the circuit board fixture is fixedly connected to an X - shaped mounting frame, and a right - hand side of the X - shaped mounting frame is fixedly connected to a linear sliding plate. A rotating shaft is rotatably mounted at an upper end of the linear sliding plate, and an angle switching disk is fixedly mounted at a top end of the rotating shaft. Two connecting frames arranged at a right angle are fixedly mounted on a side surface of the angle switching disk. The other ends of the two connecting frames are both fixedly mounted with positioning platforms. Grinding assemblies are mounted on the two positioning platforms, and the grinding assemblies are divided into a first grinding module and a second grinding module;

[0008] A propulsion assembly, which is used to drive the linear moving seat to move left and right;

[0009] A circuit board fixing assembly, which is used to position a high - density interconnect printed circuit board, and the circuit board fixing assembly cooperates with the propulsion assembly;

[0010] An accompanying sliding assembly, which is used to drive the linear sliding plate to move left and right;

[0011] An angle adjusting assembly, which is used to drive the angle switching disk to rotate, and the angle adjusting assembly cooperates with the propulsion assembly.

[0012] Preferably, the grinding assembly includes an electric push rod, a motor seat, a grinding motor, and a grinding roller. The electric push rod is fixedly mounted on the positioning platform, and an output end of the electric push rod faces downward and is fixedly connected to the motor seat. The grinding motor is fixedly mounted on the motor seat. The grinding roller is rotatably mounted on the motor seat through a shaft, and an output end of the grinding motor is fixedly connected to a shaft of the grinding roller. The surface roughness of the two grinding rollers is different.

[0013] Preferably, a plurality of bag - type dust collectors are fixedly mounted on the positioning platform, and inlets of the bag - type dust collectors face downward.

[0014] Preferably, the propulsion assembly includes a linear chute, an X - axis one - way lead screw, and a servo motor. The linear chute is opened on the top of the grinding machine table. The X - axis one - way lead screw is rotatably mounted in the linear chute, and the linear moving seat is threadedly mounted on the X - axis one - way lead screw. The servo motor is fixedly mounted on a side surface of the grinding machine table, and an output end of the servo motor is fixedly connected to the X - axis one - way lead screw. The linear moving seat is limited and slidably connected in the linear chute, and an upper end of the linear moving seat is located outside the linear chute.

[0015] Preferably, the circuit board fixing assembly includes a guide plate, a reciprocating guide rod, a clamping plate, a hemispherical protrusion, a compression spring, and an external force application bar. The circuit board fixture is of a groove structure, and two symmetrically arranged guide plates are fixedly installed inside the circuit board fixture. The reciprocating guide rods are slidably penetrated through both of the guide plates, and clamping plates are fixedly installed at one ends of the two reciprocating guide rods close to each other. The other ends of the reciprocating guide rods are fixedly connected with hemispherical protrusions. Compression springs are sleeved on the outer ends of the reciprocating guide rods, and two ends of each compression spring are fixedly connected to the guide plate and the hemispherical protrusion respectively. Two parallel external force application bars are fixedly installed on the top of the grinding machine table, and two ends of each external force application bar are arc-shaped. The spherical end of the hemispherical protrusion is in sliding contact with the inner side of the external force application bar.

[0016] Preferably, the accompanying sliding assembly includes a first guide rail, a second guide rail, a first slider, and a second slider. The first guide rail and the second guide rail are fixedly installed on the top of the grinding machine table, and both the first guide rail and the second guide rail are located between the two external force application bars. The first slider is slidably sleeved on the first guide rail, the second slider is slidably connected to the second guide rail, and the first slider and the second slider are fixedly connected to the front and rear sides of the linear slide plate respectively.

[0017] Preferably, the angle adjustment assembly includes an X-axis linear rack, a transverse worm, a worm gear, and a circular gear. A rail groove is formed at the top of the second guide rail, and a long opening is formed at one side of the rail groove. The second slider is slidably connected in the long opening. The X-axis linear rack is fixedly installed at the bottom of the rail groove. An installation cavity is formed inside the linear slide plate, and a transverse worm is rotatably installed on the side wall of the installation cavity. The transverse worm movably penetrates through the linear slide plate, the second slider and extends into the rail groove. A circular gear is fixedly connected to one end of the transverse worm located in the rail groove, and the circular gear meshes with the X-axis linear rack. The bottom end of the rotating shaft is rotatably installed on the inner bottom wall of the installation cavity, and a worm gear is fixedly installed on the part of the rotating shaft located inside the installation cavity. The transverse worm meshes with the worm gear.

[0018] Preferably, the heights of the X-shaped mounting frame, the angle switching disk, and the positioning table are all higher than that of the circuit board fixture.

[0019] Preferably, the overall structures of the first grinding module and the second grinding module are the same, except that: the grinding rollers of the first grinding module and the second grinding module are different, so that two grinding operations can be completed.

[0020] The steps of the blind via filling process for high density interconnect printed circuit boards are as follows:

[0021] The inner wall of the blind hole of the circuit board is copper plated; a connecting plate for filling the hole is made, a through hole is opened on the connecting plate, and the connecting plate is placed on the circuit board so that the through hole and the blind hole are aligned; the through hole and the blind hole are filled with liquid resin by screen printing; the circuit board is dried by a vacuum drying device to solidify the liquid resin; the connecting plate is removed, and the resin is polished by the first grinding module of the post-filling grinding device of the high-density interconnect printed circuit board blind hole so that the polished surface of the resin is close to the surface of the circuit board, and then the remaining resin is polished to the surface of the circuit board by the second grinding module to make it flat; the polished surface of the circuit board is copper plated.

[0022] By drying in a vacuum dryer, the bubbles generated during the filling of the liquid resin can be discharged in time to prevent the bubbles from remaining in the blind holes, thereby effectively avoiding the situation where the blind holes are not fully filled.

[0023] In view of this, compared with the prior art, the beneficial effects of the present invention are:

[0024] (I) In the present application, the circuit board is placed in the circuit board fixture. At this time, the distance between the two clamping plates is the largest, and the circuit board is located between the two clamping plates. The servo motor works, and the X-axis one-way screw rotates, causing the linear movable seat to slide along the linear slide groove, and the circuit board fixture moves to the right. The hemispherical protrusion is squeezed by the external force application bar, and the compression spring is compressed. The two reciprocating guide rods move toward each other, causing the two clamping plates to move together and fix the circuit board, so that the circuit board to be polished can be automatically fixed. When the hemispherical protrusion is separated from the external force application bar, it is automatically released, making the loading and unloading operations of the circuit board more convenient and the fixing effect better, preparing for subsequent polishing processing.

[0025] (ii) In the present application, during the movement of the circuit board fixture to the right, the X-shaped mounting frame pushes the linear slide, and the circular gear rolls along the X-axis linear rack, so that the transverse worm drives the worm wheel to rotate, and then the rotating shaft drives the angle switching disk to rotate, until a positioning table moves to the top of the circuit board fixture. There is a first grinding module on this positioning table. During the first grinding, the electric push rod drives the motor seat to move down, and the grinding motor drives the grinding roller to rotate, so that the grinding roller grinds the resin on the circuit board so that the polished surface of the resin is close to the surface of the circuit board. After that, the circuit board fixture continues to move to the right, so that the second grinding module moves to the top of the circuit board, and then the second grinding is realized to make the resin surface flat, so that the two grinding modules can automatically switch positions, and the circuit board is always fixed during this process to avoid offset and ensure processing quality.

[0026] (III) In this application, during the grinding process, the bag vacuum cleaner works to recycle the dust during the processing and provide a good working environment.

[0027] (4) In this application, after the processing is completed, the circuit board fixture resets and moves leftward until the hemispherical protrusion disengages from the external force application strip, and the circuit board is released from fixation. At this time, both positioning platforms move away from the circuit board fixture, leaving no obstruction above the circuit board, thus facilitating material loading and unloading.

[0028] (5) In this application, drying is performed by a vacuum dryer, and the bubbles generated during the liquid resin filling can be discharged in a timely manner, preventing the bubbles from remaining in the blind holes, and thus effectively avoiding the situation of incomplete filling of the blind holes. Through secondary grinding, the flatness of the circuit board surface is relatively good. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 The following shows a top view of the structure of the post - blind - hole filling grinding device for high - density interconnect printed circuit boards provided by the present invention;

[0030] Figure 2 The following shows Figure 1 a schematic structural diagram of the angle - switching disk and the positioning platform in;

[0031] Figure 3 The following shows Figure 1 a schematic structural diagram of the circuit board fixture in;

[0032] Figure 4 The following shows Figure 3 a schematic diagram after the two clamping plates move away from each other in;

[0033] Figure 5 a schematic structural diagram of the grinding assembly;

[0034] Figure 6 The following shows Figure 1 a schematic diagram after the linear moving seat moves to the right in;

[0035] Figure 7 The following shows Figure 1 an enlarged schematic diagram of part A in;

[0036] Figure 8 a side sectional view of the linear slide plate;

[0037] Figure 9 a three - dimensional structure diagram of the linear moving seat.

[0038] ICONS:

[0039] 1 - grinding machine table; 101 - linear moving seat; 102 - linear chute; 103 - X - axis single - way lead screw; 104 - servo motor; 105 - first guide rail; 106 - second guide rail; 107 - X - axis linear rack;

[0040] 2 - Circuit board fixture; 201 - Guide plate; 202 - Reciprocating guide rod; 203 - Clamping plate; 204 - Hemispherical protrusion; 205 - Compression spring; 206 - External force application bar;

[0041] 3 - X - shaped mounting frame;

[0042] 4 - Angle switching disc; 401 - Rotating shaft; 402 - Connecting frame; 403 - Linear sliding plate; 404 - First slider; 405 - Second slider; 406 - Transverse worm; 407 - Worm gear; 408 - Circular gear;

[0043] 5 - Positioning table; 501 - Electric push rod; 502 - Grinding motor; 503 - Grinding roller; 504 - Bag - type dust collector. Detailed implementation manners

[0044] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

[0045] Please refer to Figures 1-9 , the present invention provides the following embodiments:

[0046] A grinding device for blind via filling of high - density interconnect printed circuit boards, including a grinding machine table 1. A linear moving seat 101 is slidably mounted on the top of the grinding machine table 1, and a circuit board fixture 2 is fixedly mounted on the top of the linear moving seat 101. The right side of the circuit board fixture 2 is fixedly connected to an X - shaped mounting frame 3, and the right side of the X - shaped mounting frame 3 is fixedly connected to a linear sliding plate 403. A rotating shaft 401 is rotatably mounted at the upper end of the linear sliding plate 403, and an angle switching disc 4 is fixedly mounted at the top end of the rotating shaft 401. Two connecting frames 402 arranged at a right angle are fixedly mounted on the side surface of the angle switching disc 4. The other ends of the two connecting frames 402 are both fixedly mounted with positioning tables 5. Grinding components are mounted on both positioning tables 5, and the grinding components are divided into a first grinding module and a second grinding module;

[0047] A propulsion component for driving the linear moving seat 101 to move left and right;

[0048] A circuit board fixing component for positioning high - density interconnect printed circuit boards, and the circuit board fixing component is matched with the propulsion component;

[0049] An accompanying sliding component for driving the linear sliding plate 403 to move left and right;

[0050] The angle adjustment component is used to drive the angle switching disc 4 to rotate, and the angle adjustment component cooperates with the propulsion component.

[0051] Specifically, the grinding component includes an electric push rod 501, a motor base, a grinding motor 502 and a grinding roller 503. The electric push rod 501 is fixedly installed on the positioning table 5, and the output end of the electric push rod 501 faces downward and is fixedly connected to the motor base. The grinding motor 502 is fixedly installed on the motor base. The grinding roller 503 is rotatably installed on the motor base through a shaft, and the output end of the grinding motor 502 is fixedly connected to the shaft of the grinding roller 503. The thicknesses of the surfaces of the two grinding rollers 503 are different. A plurality of bag dust collectors 504 are fixedly installed on the positioning table 5, and the inlets of the bag dust collectors 504 face downward. The heights of the X-shaped mounting frame 3, the angle switching disc 4 and the positioning table 5 are all higher than that of the circuit board fixture 2.

[0052] Specifically, the propulsion component includes a linear chute 102, an X-axis one-way lead screw 103 and a servo motor 104. The linear chute 102 is opened on the top of the grinding machine table 1. The X-axis one-way lead screw 103 is rotatably installed in the linear chute 102, and the linear moving seat 101 is threadedly installed on the X-axis one-way lead screw 103. The servo motor 104 is fixedly installed on the side of the grinding machine table 1, and the output end of the servo motor 104 is fixedly connected to the X-axis one-way lead screw 103. The linear moving seat 101 is limited and slidably connected in the linear chute 102, and the upper end of the linear moving seat 101 is located outside the linear chute 102.

[0053] Specifically, the circuit board fixing component includes a guide plate 201, a reciprocating guide rod 202, a clamping plate 203, a hemispherical protrusion 204, a compression spring 205 and an external force application bar 206. The circuit board fixture 2 is a groove structure, and two symmetrically arranged guide plates 201 are fixedly installed in the circuit board fixture 2. The reciprocating guide rods 202 are slidably penetrated and installed on the two guide plates 201, and clamping plates 203 are fixedly installed at the mutually approaching ends of the two reciprocating guide rods 202. The other ends of the reciprocating guide rods 202 are fixedly connected to the hemispherical protrusions 204. Compression springs 205 are sleeved on the outer ends of the reciprocating guide rods 202, and the two ends of the compression springs 205 are respectively fixedly connected to the guide plates 201 and the hemispherical protrusions 204. Two parallel external force application bars 206 are fixedly installed on the top of the grinding machine table 1, and the two ends of the external force application bars 206 are arc-shaped. The spherical ends of the hemispherical protrusions 204 are slidably in contact with the inner sides of the external force application bars 206.

[0054] Specifically, the sliding component includes a first guide rail 105, a second guide rail 106, a first slider 404, and a second slider 405. The top of the grinding machine table 1 is fixedly installed with the first guide rail 105 and the second guide rail 106, and both the first guide rail 105 and the second guide rail 106 are located between two external force application strips 206. The first slider 404 is slidably sleeved on the first guide rail 105, the second slider 405 is slidably connected to the second guide rail 106, and the first slider 404 and the second slider 405 are respectively fixedly connected to the front and rear sides of the linear slide plate 403.

[0055] Specifically, the angle adjustment component includes an X-axis linear rack 107, a transverse worm 406, a worm gear 407, and a circular gear 408. A rail groove is formed at the top of the second guide rail 106, and a long opening is formed on one side of the rail groove. The second slider 405 is slidably connected in the long opening. The bottom of the rail groove is fixedly installed with the X-axis linear rack 107. An installation cavity is formed inside the linear slide plate 403, and a transverse worm 406 is rotatably installed on the side wall of the installation cavity. The transverse worm 406 movably penetrates through the linear slide plate 403, the second slider 405, and extends into the rail groove. One end of the transverse worm 406 located in the rail groove is fixedly connected with the circular gear 408, and the circular gear 408 meshes with the X-axis linear rack 107. The bottom end of the rotating shaft 401 is rotatably installed on the inner bottom wall of the installation cavity, and a worm gear 407 is fixedly installed on the part of the rotating shaft 401 located inside the installation cavity. The transverse worm 406 meshes with the worm gear 407.

[0056] Specifically, the overall structures of the first grinding module and the second grinding module are the same, except that: the grinding rollers 503 of the first grinding module and the second grinding module are different, enabling two grinding operations to be completed, that is, the coarseness of the surfaces of the two grinding rollers 503 is different. The first grinding: the first grinding roller 503 is for rough grinding, used to grind the grinding surface of the resin to be close to the surface of the circuit board; the second grinding: the second grinding roller 503 is for fine grinding, used to grind the surface of the circuit board flat.

[0057] The steps of the blind via filling process for high-density interconnect printed circuit boards are as follows:

[0058] Copper plating is performed on the inner walls of the blind vias of the circuit board; a connection board for filling the vias is fabricated, through holes are formed on the connection board, the connection board is placed on the circuit board, and the through holes are aligned with the blind vias; liquid resin is filled into the through holes and the blind vias through screen printing; the circuit board is dried by a vacuum drying device to cure the liquid resin (the resin is epoxy resin); the connection board is removed, and the resin is ground by the first grinding module of the blind via filling and grinding device for high-density interconnect printed circuit boards to make the grinding surface of the resin close to the surface of the circuit board, and then the remaining resin is ground to the surface of the circuit board by the second grinding module to make it flat; copper plating treatment is performed on the flat surface of the circuit board.

[0059] Drying is carried out by a vacuum dryer, and the bubbles generated during the filling of the liquid resin can be discharged in time, avoiding the bubbles remaining in the blind holes, and thus effectively avoiding the situation of incomplete filling of the blind holes.

[0060] The specific implementation manner of this embodiment is as follows: After removing the connecting plate, grinding is carried out. The circuit board is placed in the circuit board fixture 2 (initially, the hemispherical protrusion 204 does not contact the external force application bar 206). At this time, the distance between the two clamping plates 203 is the largest, and the circuit board is located between the two clamping plates 203. The servo motor 104 works, and the X-axis single lead screw 103 rotates, causing the linear moving seat 101 to slide along the linear chute 102. The circuit board fixture 2 then moves to the right, and the hemispherical protrusion 204 is squeezed by the external force application bar 206. The compression spring 205 is compressed, and the two reciprocating guide rods 202 move towards each other, causing the two clamping plates 203 to move together and fix the circuit board. As Figure 1 shown, so that the circuit board to be polished can be automatically fixed. When the hemispherical protrusion 204 disengages from the external force application bar 206, the fixation is automatically released, making the loading and unloading operations of the circuit board more convenient and having a good fixation effect, preparing for the subsequent grinding process; during the rightward movement of the circuit board fixture 2, the X-shaped mounting frame 3 pushes the linear slide plate 403, and the circular gear 408 rolls along the X-axis linear rack 107, causing the transverse worm 406 to drive the worm wheel 407 to rotate. Then the rotating shaft 401 drives the angle switching disk 4 to rotate until a positioning table 5 moves above the circuit board fixture 2. As Figure 6 shown, there is a first grinding module on this positioning table 5. During the first grinding, the electric push rod 501 drives the motor seat to move downward, and the grinding motor 502 drives the grinding roller 503 to rotate, so that the grinding roller 503 grinds the resin on the circuit board, making the grinding surface of the resin close to the surface of the circuit board. After that, the circuit board fixture continues to move to the right, causing the second grinding module to move above the circuit board, thereby realizing the second grinding, making the resin surface flat. The two grinding modules can automatically switch positions, and the circuit board is always fixed during this process, avoiding deviation and ensuring the processing quality; during grinding, the cloth bag vacuum cleaner 404 works to recycle the dust during processing, providing a good working environment. After the processing is completed, the circuit board fixture 2 resets and moves to the left until the hemispherical protrusion 204 disengages from the external force application bar 206, and the circuit board is released from fixation. At this time, both positioning tables 5 move away from the circuit board fixture 2, leaving no obstruction above the circuit board, thus facilitating the picking and placing of materials.

[0061] In the description of this specification, the descriptions referring to terms such as "one embodiment", "example", "specific example", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.

[0062] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and variations can be made according to the content of this specification. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of the present invention, so that those skilled in the art can well understand and utilize the present invention. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A grinding device for blind vias of a high - density interconnect printed circuit board after via filling, characterized in that: It includes a grinding machine table (1), on the top of which a linear moving seat (101) is slidably installed, and a circuit board fixture (2) is fixedly installed on the top of the linear moving seat (101). A right side of the circuit board fixture (2) is fixedly connected to an X-shaped mounting frame (3), and a right side of the X-shaped mounting frame (3) is fixedly connected to a linear slide plate (403). A rotating shaft (401) is rotatably installed at an upper end of the linear slide plate (403), and an angle switching disk (4) is fixedly installed at a top end of the rotating shaft (401). Two connecting frames (402) arranged at a right angle are fixedly installed on a side surface of the angle switching disk (4). The other ends of the two connecting frames (402) are both fixedly installed with positioning platforms (5). Grinding assemblies are installed on the two positioning platforms (5), and the grinding assemblies are divided into a first grinding module and a second grinding module; A propulsion assembly for driving the linear moving seat (101) to move left and right; A circuit board fixing assembly for positioning a high-density interconnect printed circuit board, and the circuit board fixing assembly cooperates with the propulsion assembly; An accompanying sliding assembly for driving the linear slide plate (403) to move left and right; An angle adjusting assembly for driving the angle switching disk (4) to rotate, and the angle adjusting assembly cooperates with the propulsion assembly.

2. The grinding device after blind via filling of a high-density interconnect printed circuit board according to claim 1, wherein: The grinding assembly includes an electric push rod (501), a motor seat, a grinding motor (502) and a grinding roller (503). The electric push rod (501) is fixedly installed on the positioning platform (5), and an output end of the electric push rod (501) faces downward and is fixedly connected to the motor seat. The grinding motor (502) is fixedly installed on the motor seat. The grinding roller (503) is rotatably installed on the motor seat through a shaft, and an output end of the grinding motor (502) is fixedly connected to a shaft of the grinding roller (503). The thicknesses of surfaces of the two grinding rollers (503) are different.

3. A grinding device after blind via filling for a high density interconnect printed circuit board according to claim 2, characterized in that: A plurality of bag dust collectors (504) are fixedly installed on the positioning platform (5), and inlets of the bag dust collectors (504) face downward.

4. A grinding device for blind via filling of a high-density interconnect printed circuit board according to claim 2, characterized in that: The propulsion assembly includes a linear chute (102), an X-axis single lead screw (103), and a servo motor (104). The linear chute (102) is opened on the top of the grinding machine table (1). The X-axis single lead screw (103) is rotatably installed in the linear chute (102), and the linear moving seat (101) is threadedly installed on the X-axis single lead screw (103). The servo motor (104) is fixedly installed on a side surface of the grinding machine table (1), and an output end of the servo motor (104) is fixedly connected to the X-axis single lead screw (103). The linear moving seat (101) is slidably and limit-connected in the linear chute (102), and an upper end of the linear moving seat (101) is located outside the linear chute (102).

5. A grinding device after blind via filling for a high-density interconnect printed circuit board according to claim 4, characterized in that: The circuit board fixing assembly includes a guide plate (201), a reciprocating guide rod (202), a clamping plate (203), a hemispherical protrusion (204), a compression spring (205) and an external force application bar (206). The circuit board fixture (2) is of a groove structure, and two symmetrically arranged guide plates (201) are fixedly installed inside the circuit board fixture (2). A reciprocating guide rod (202) is slidably penetrated through each of the two guide plates (201), and a clamping plate (203) is fixedly installed at one end of each of the two reciprocating guide rods (202) close to each other. The other end of the reciprocating guide rod (202) is fixedly connected with a hemispherical protrusion (204). A compression spring (205) is sleeved on the outer end of the reciprocating guide rod (202), and the two ends of the compression spring (205) are respectively fixedly connected to the guide plate (201) and the hemispherical protrusion (204). Two parallel external force application bars (206) are fixedly installed on the top of the grinding machine table (1), and the two ends of the external force application bar (206) are arc-shaped. The spherical end of the hemispherical protrusion (204) is in sliding contact with the inner side of the external force application bar (206).

6. The grinding device after blind via filling of a high-density interconnect printed circuit board according to claim 5, wherein: The accompanying sliding assembly includes a first guide rail (105), a second guide rail (106), a first slider (404) and a second slider (405). The first guide rail (105) and the second guide rail (106) are fixedly installed on the top of the grinding machine table (1), and both the first guide rail (105) and the second guide rail (106) are located between the two external force application bars (206). The first slider (404) is slidably sleeved on the first guide rail (105). The second slider (405) is slidably connected to the second guide rail (106), and the first slider (404) and the second slider (405) are respectively fixedly connected to the front and rear sides of the linear slide plate (403).

7. A grinding device for a blind via filled high-density interconnect printed circuit board according to claim 6, characterized in that: The angle adjustment assembly includes an X-axis linear rack (107), a transverse worm (406), a worm wheel (407) and a circular gear (408). A rail groove is opened at the top of the second guide rail (106), and a long opening is opened on one side of the rail groove. The second slider (405) is slidably connected in the long opening. The bottom of the rail groove is fixedly installed with an X-axis linear rack (107). An installation cavity is opened inside the linear slide plate (403), and a transverse worm (406) is rotatably installed on the side wall of the installation cavity. The transverse worm (406) movably penetrates through the linear slide plate (403), the second slider (405) and extends into the rail groove. One end of the transverse worm (406) located in the rail groove is fixedly connected with a circular gear (408), and the circular gear (408) meshes with the X-axis linear rack (107). The bottom end of the rotating shaft (401) is rotatably installed on the inner bottom wall of the installation cavity, and a worm wheel (407) is fixedly installed on the part of the rotating shaft (401) located inside the installation cavity. The transverse worm (406) meshes with the worm wheel (407).

8. A grinding device after blind via filling for a high-density interconnect printed circuit board according to claim 7, characterized in that: The heights of the X-shaped mounting frame (3), the angle switching disk (4) and the positioning table (5) are all higher than that of the circuit board fixture (2).

Images