Overwrap device on a blow molding machine and blow molding machine

Abstract

The present application discloses a sealing device on a blow molding machine and a blow molding machine, including a frame, a sealing module, a diagonal support mechanism and a displacement mechanism, wherein the diagonal support mechanism is symmetrically arranged on both sides of the sealing module, and the diagonal support mechanism includes a support rod and a first driving member for driving the support rod to move in a vertical direction in the sealing area; wherein the end of the support rod is higher than the upper end surface of the sealing plate, and the sealing plate is provided with a clearance gap on the side facing the sealing area, and when the two sealing plates move toward each other to seal the preform, the two clearance gaps enclose to form a guide space for the support rod to slide. By arranging the diagonal support mechanism, the preform inserted into the preform is tightened during the sealing process to reduce the swing of the lower part of the preform, thereby improving the sealing effect of the sealing module when sealing the preform.

Description

Technical Field

[0001] The present application relates to the technical field of blow molding machines, and in particular, to an encapsulation device on a blow molding machine and a blow molding machine. Background Art

[0002] The blow molding process belongs to one of the forming processes. It is a tubular plastic preform obtained by extrusion or injection molding of a thermoplastic material. While it is still hot, it is placed in a split mold. Before and after closing the mold, compressed air is continuously introduced into the preform, causing the plastic preform to expand and adhere tightly to the inner wall of the mold. After cooling and demolding, various hollow or flat plastic products are obtained. In order to achieve better inflation of the preform before and after closing the mold, generally, one side of the extruded preform is encapsulated, so that when compressed air is introduced with one side of the preform closed, the inflation effect can be better achieved.

[0003] In the prior art, according to the encapsulation time, it is divided into upper encapsulation and lower encapsulation. Upper encapsulation refers to closing one side of the preform during the process from the die head extrusion to the mold. At this time, introducing compressed air can better maintain the inflated state of the preform. Lower encapsulation refers to encapsulating the preform after it is extruded from the die head, passes through the mold, and descends to a specified position. During the forming process of large-sized products, when using the lower encapsulation process, as the preform is gradually extruded, its mass becomes larger and larger, which easily causes the lower edge area of the preform to swing or adhere, resulting in the compressed air blown from the die head being unable to always maintain the inflated state of the preform well, affecting the forming quality. The larger the size of the product, the higher the difficulty of forming using the blow molding process. Although the upper encapsulation process can solve the problem of swing or adhesion in the lower edge area of the preform, it is only applicable to the forming of small-sized products.

[0004] For example, the utility model patent with the authorization announcement number CN207594302U discloses an "encapsulation device for a blow molding machine", which belongs to a common structure of upper encapsulation. It mainly drives two encapsulation plates to rotate and open and close around a rotating shaft through a cylinder-linked gear assembly. When the two encapsulation plates are combined, they encapsulate the preform. In this kind of structure, due to the existence of the rotation radius of the encapsulation plate, when blow molding large-sized products, the combination time of the two encapsulation plates also increases. After the preform is extruded from the die head, its temperature will drop rapidly, and the encapsulation efficiency directly affects the forming quality. Therefore, an upper encapsulation device with a similar structure is generally applied to the forming of small-sized products. Summary of the Invention

[0005] In order to be applicable to the encapsulation operation during the forming process of large-sized products, the first object of the present application is to provide an encapsulation device on a blow molding machine.

[0006] The encapsulation device on a blow molding machine provided by the present application adopts the following technical solutions:

[0007] An encapsulation device on a blow molding machine includes:

[0008] Frame;

[0009] Enclosing module, slidably connected to the frame. The enclosing module includes two enclosing plates and a synchronization mechanism for driving the two enclosing plates to move towards / away from each other in the horizontal direction. There is a gap between the two enclosing plates to form an enclosing area for the parison to pass through;

[0010] Diagonal bracing mechanism, symmetrically arranged on both sides of the enclosing module. The diagonal bracing mechanism includes a strut and a first driving member for driving the strut to move vertically within the enclosing area; and

[0011] Displacement mechanism, connected to the diagonal bracing mechanism, for driving the two diagonal bracing mechanisms to move towards / away from each other;

[0012] Wherein, the end of the strut is higher than the upper end surface of the enclosing plate. A relief notch is formed on the side of the enclosing plate facing the enclosing area. When the two enclosing plates move towards each other to enclose the parison, the two relief notches enclose to form a guiding space for the strut to slide.

[0013] By adopting the above technical solution, after the parison is extruded from the die head, it enters the enclosing area. The two enclosing plates move towards the parison side under the drive of the synchronization mechanism. During the displacement of the enclosing plates, the strut of the diagonal bracing mechanism enters the parison and moves towards the inner surface of the parison under the drive of the displacement mechanism, and finally tightens the two ends of the lower edge of the parison, which can reduce the swing of the parison after extrusion. Subsequently, the two enclosing plates squeeze the parison in the horizontal direction to complete the enclosing operation, realizing the enclosing of large-sized products. Secondly, the end of the strut is higher than the upper end surface of the enclosing plate. When enclosing the parison as much as possible, the enclosing position is close to the lower edge, which can reduce the cutting area of the material and improve the material utilization rate.

[0014] Preferably, a heat medium flow channel for the heat medium to flow is provided in the enclosing plate.

[0015] By adopting the above technical solution, after the material is extruded from the die head, the extrusion temperature is often about 200°. The enclosing plate uses the heat medium flow channel provided for the heat medium to flow, which can make the enclosing plate itself have a certain temperature. The surface temperature of the parison will drop rapidly after extrusion, and the enclosing plate with a certain temperature can also reduce the heat loss during the enclosing process of the parison and improve the quality of subsequent forming.

[0016] Preferably, the enclosing module further includes a secondary enclosing assembly, and the secondary enclosing assembly includes:

[0017] Enclosing wheel; and

[0018] A second driving member for driving the enclosing wheel to roll along the traveling direction perpendicular to the enclosing plate;

[0019] Wherein, the encapsulating plate is provided with a cam track on one side, the cam track is placed below the upper end surface of the encapsulating plate and the length of the cam track is greater than the maximum spacing between the two support rods, the encapsulating wheel is rollingly connected to the cam track, and the cam track includes an encapsulating section and at least one descending section connected to the encapsulating section; when the encapsulating wheel rolls on the encapsulating section, the encapsulating wheel protrudes from the side of the encapsulating plate, and when the encapsulating wheel is placed in the descending section, the cross-section of the encapsulating wheel is within the forward projection of the encapsulating plate.

[0020] By adopting the above technical solution, the secondary encapsulation component can perform secondary encapsulation on the preform to improve the encapsulation quality. Secondly, during the secondary encapsulation process, the second driving member is used to drive the encapsulation wheel to roll on the cam track to achieve the encapsulation of the preform. When the encapsulation wheel is placed in the encapsulation section, the side plate of the encapsulation wheel protruding from the encapsulation plate can extrude the preform for encapsulation. At the same time, the protruding setting of the encapsulation wheel can provide an extrusion force greater than that of the encapsulation plate on the preform, which can be used for encapsulation operations when the number of preform layers is large and the thickness is large; at the same time, because the cam track is lower than the upper end surface of the encapsulation plate, the secondary encapsulation position on the preform is lower than the first encapsulation of the preform by the encapsulation plate, and the secondary encapsulation is lower than the position of the primary encapsulation to achieve double encapsulation of the preform instead of superimposed encapsulation. , better improve the encapsulation effect, and the length of the cam track should be greater than the maximum distance between the two struts. This design is due to the fact that when the struts are tightening the parison, some clearance gaps are opened on the encapsulation plates to avoid interference with the struts, resulting in the parison not being encapsulated at the strut position when the two encapsulation plates are performing the first encapsulation, and the travel distance of the encapsulation wheel during the second encapsulation is greater than the maximum distance between the two struts. Then, when the struts are retracted, the encapsulation wheel can also encapsulate the strut position that was not encapsulated during the first encapsulation operation, thereby better improving the encapsulation effect and allowing the parison to be better inflated when compressed air is introduced.

[0021] Preferably, the secondary encapsulation component further comprises:

[0022] A swing arm, two ends of which are rotatably connected to the second driving member and the encapsulating wheel respectively; and

[0023] The elastic member is connected to the swing arm and always forces the swing arm to have a movement tendency of moving toward a side away from the enclosed area.

[0024] By adopting the above technical solution, when the encapsulating wheel moves on the cam track, the elastic member can realize floating adjustment of the encapsulating wheel. When moving from the descending section to the encapsulating section, the elastic potential energy of the elastic member is overcome, and one end of the swing arm swings toward the side of the encapsulating area to realize the switching of the traveling track of the encapsulating wheel; and when the encapsulating section reaches the descending section, the elastic member can be used to drive the encapsulating wheel to be hidden in the forward projection area of the encapsulating plate without affecting the one-time encapsulation operation of the two encapsulating plates.

[0025] Preferably, the encapsulation wheel includes:

[0026] a wheel portion; and

[0027] an eccentric shaft, the wheel portion being rollingly connected to the eccentric shaft;

[0028] wherein, when the eccentric shaft rotates, the wheel portion moves towards / away from one side of the encapsulation area.

[0029] By adopting the above technical solution, the setting of the eccentric shaft enables the distance that the wheel portion protrudes from the side of the encapsulation plate to be adjustable, and different wheel portion protrusion distances can be selectively applied to preforms with different wall thicknesses.

[0030] Preferably, it further includes a driving mechanism for driving the encapsulation module to slide on the frame, and the driving mechanism includes:

[0031] a driving motor mounted on the frame;

[0032] a driving shaft connected to the driving motor;

[0033] a transmission assembly connected to the encapsulation plate, and the transmission assembly includes a driving pulley, a guiding pulley, a tensioning pulley and a synchronous belt;

[0034] wherein, the driving pulley is connected to the driving shaft, the synchronous belt meshes with the driving pulley, the guiding pulley and the tensioning pulley, and both ends of the synchronous belt are fixed to both ends of the encapsulation module.

[0035] By adopting the above technical solution, the driving motor drives the driving shaft to rotate, the rotation of the driving shaft drives the synchronous belt to rotate through the driving pulley, and both ends of the synchronous belt are connected to the encapsulation plate, thereby realizing the sliding of the encapsulation module on the frame, and further realizing the intermittent encapsulation of the double die heads, improving production efficiency.

[0036] Preferably, the synchronization mechanism includes:

[0037] a third driving member, one end of the third driving member being connected to one of the encapsulation plates;

[0038] two racks respectively corresponding to and connected to one of the encapsulation plates; and

[0039] a synchronization gear meshing between the two racks for driving one of the racks to move towards / away from the other rack.

[0040] By adopting the above technical solution, when the third driving member drives one of the encapsulation plates to move, the encapsulation plate also synchronously drives one of the racks to displace, and the displacement of one of the racks drives the opposite displacement of the other rack through the synchronization gear, thereby realizing the movement of the two encapsulation plates towards / away from each other, and the synchronization structure is relatively simple.

[0041] Preferably, a heating wire is arranged inside the support rod.

[0042] By adopting the above technical solution, the heating wire can keep the support rod at a certain temperature. Since the temperature of the parison after being extruded from the die head is generally about 200 °C, the surface temperature will drop rapidly after extrusion. When the support rod tightens the parison, due to the existence of the surface temperature, the temperature loss of the parison within the range of the support rod can be reduced, and the encapsulation effect can be improved.

[0043] Preferably, the displacement mechanism includes a fourth driving member, and the fourth driving member is connected to the diagonal bracing mechanism.

[0044] By adopting the above technical solution, the movement of the diagonal bracing mechanism can realize the operation of tightening the parison by the support rod.

[0045] In order to be applicable to the encapsulation operation during the forming process of large-sized products, the second object of the present application is to provide a blow molding machine.

[0046] The blow molding machine provided by the present application adopts the following technical solution:

[0047] A blow molding machine includes the above-mentioned upper encapsulation device of the blow molding machine.

[0048] By adopting the above technical solution, before encapsulation, the lower edge of the parison is tightened by the two support rods in the diagonal bracing mechanism to reduce swing, and the encapsulation of the parison is realized by the horizontal opposite movement of the two encapsulation plates, thereby realizing the encapsulation of large-sized products.

[0049] In summary, the present application includes at least one of the following beneficial technical effects:

[0050] 1. By arranging the diagonal bracing mechanism to realize tightening of the parison inserted into the parison during the encapsulation process, the swing of the lower part of the parison is reduced, and the encapsulation effect during the encapsulation operation of the encapsulation module on the parison is improved;

[0051] 2. By providing a relief notch on the encapsulation plate, the height difference between the encapsulation plate and the support rod can be reduced, so that the encapsulation position during the extrusion of the parison by the die head can be as much as possible within the lower edge range of the parison, reducing the waste after forming and improving the material utilization rate;

[0052] 3. By adding a secondary encapsulation component, and the secondary encapsulation position is lower than the primary encapsulation position of the encapsulation plate, thereby realizing double encapsulation of the upper and lower arrangements of the parison, better improving the encapsulation effect, and the secondary encapsulation can encapsulate the area that is not encapsulated at the support rod position during the primary encapsulation;

[0053] 4. By adjusting the radial distance of the encapsulation wheel, the distance that the wheel protrudes from the side of the encapsulation plate is adjusted, so as to be applicable to the encapsulation of parisons with different wall thicknesses. Description of the Drawings

[0054] Figure 1 Schematic diagram of the encapsulation device on the blow molding machine in Embodiment 1;

[0055] Figure 2 Schematic diagram mainly showing the structure of the encapsulation module in Embodiment 1;

[0056] Figure 3 Schematic diagram mainly showing the connection between the driving mechanism and the encapsulation plate in Embodiment 1;

[0057] Figure 4 Schematic diagram mainly showing the structure of the synchronization mechanism in Embodiment 1;

[0058] Figure 5 Schematic diagram mainly showing the structure of the heat conduction runner in the encapsulation plate in Embodiment 1;

[0059] Figure 6 Schematic diagram of the positional relationship between the support rod and the encapsulation plate in the vertical direction in Embodiment 1;

[0060] Figure 7 Schematic diagram mainly showing the structure of the secondary encapsulation assembly in Embodiment 1;

[0061] Figure 8 Schematic diagram of the connection of the secondary encapsulation assembly on the cam track in Embodiment 1;

[0062] Figure 9 Schematic diagram of the connection between the encapsulation wheel and the swing arm in Embodiment 1;

[0063] Figure 10 Schematic diagram of the preform in the unencapsulated state in Embodiment 1;

[0064] Figure 11 Schematic diagram of the preform in the encapsulated state in Embodiment 1;

[0065] Figure 12 Schematic diagram of the preform in the state of secondary encapsulation in Embodiment 1;

[0066] Figure 13 Schematic diagram of the preform in the state of completed secondary encapsulation in Embodiment 1.

[0067] Description of reference numerals: 10, housing; 11, first guide rail; 20, encapsulation module; 21, encapsulation area; 22, encapsulation plate; 221, relief notch; 222, inlet channel; 223, outlet channel; 224, first joint; 225, second joint; 23, cam track; 231, encapsulation section; 232, downward section; 233, parallel standby section; 24, synchronization mechanism; 241, third driving member; 242, rack; 243, synchronization gear; 25, second slider; 26, second guide rail; 27, mounting plate; 30, diagonal bracing mechanism; 31, first driving member; 32, strut; 40, driving mechanism; 41, driving motor; 42, driving shaft; 43, driving pulley; 44, tensioning pulley; 45, guiding pulley; 46, timing belt; 50, displacement mechanism; 51, fourth driving member; 60, secondary encapsulation assembly; 61, second driving member; 62, lead screw; 63, nut slider; 64, connecting seat; 65, swing arm; 66, encapsulation wheel; 661, wheel part; 662, eccentric section; 663, optical axis section; 664, threaded section; 665, wrench hole; 666, locking nut; 67, rotating shaft; 68, elastic member; 69, fixed shaft; 70, preform. Detailed implementation manners

[0068] The following further describes the present application in detail with reference to the accompanying drawings.

[0069] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation manner.

[0070] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which this application belongs. The terms used in the description of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items. Embodiment 1

[0071] Figure 1 With Figure 2 Fig. shows a structural schematic of an encapsulation device on a blow molding machine, which is installed on the frame of the blow molding machine, specifically in the vertical distance between the die head and the mold of the blow molding machine. The upper encapsulation device includes a housing 10, an encapsulation module 20 slidably connected to the housing 10, and a driving mechanism 40 for driving the encapsulation module 20 to slide on the housing 10.

[0072] In this embodiment, in order to achieve the spaced encapsulation of the two die heads when the encapsulation module 20 slides on the frame 10, the length of the frame 10 is greater than the length of the encapsulation module 20. The encapsulation module 20 mainly includes two encapsulation plates 22 and a synchronization mechanism 24 for driving the two encapsulation plates 22 to move towards or away from each other in the horizontal direction. The distance between the two encapsulation plates 22 is the encapsulation area 21. During the encapsulation process, the die head is placed above the encapsulation area 21. After the parison 70 is extruded from the die head, the lower edge gradually enters the encapsulation area 21. The movement of the two encapsulation plates 22 towards or away from each other expands or shrinks the encapsulation area 21. When the encapsulation area 21 is shrunk and the two encapsulation plates 22 squeeze the parison 70 to achieve the encapsulation operation of the parison 70.

[0073] Combined with Figure 3 , the encapsulation module 20 further includes second sliders 25 provided on the encapsulation plates 22. The two second sliders 25 are slidably connected to a second guide rail 26 spanning between the two encapsulation plates 22. One end surface of the second guide rail 26 is connected with two mounting plates 27. First sliders (not shown in the figure) are provided on the two mounting plates 27, and the first sliders are slidably connected to the first guide rail 11 on the frame 10.

[0074] The driving mechanism 40 includes a driving motor 41 installed on one side of the frame 10. The driving motor 41 is connected with a driving shaft 42, and two driving pulleys 43 arranged at intervals are provided on the driving shaft 42. The driving mechanism 40 further includes a tensioning pulley 44 and several guiding pulleys 45 installed on one side of the frame 10. A synchronous belt 46 is meshed and installed on the driving pulley 43, the tensioning pulley 44 and the guiding pulleys 45. Two ends of the synchronous belt 46 are respectively connected with the corresponding two mounting plates 27 on the encapsulation plate 22. Thus, when the driving motor 41 works, the driving pulley 43 drives the synchronous belt 46 to rotate, thereby realizing the sliding of the entire encapsulation module 20 on the frame 10.

[0075] Combined with Figure 4 , the upper encapsulation device further includes a displacement mechanism 50 connected to the encapsulation module 20 and a diagonal bracing mechanism 30 connected to the displacement mechanism 50. The diagonal bracing mechanism 30 includes a first driving member 31 and a strut 32 connected to the first driving member 31. The strut 32 is placed in the encapsulation area 21 and can be driven by the first driving member 31 to displace perpendicular to the direction of the encapsulation area 21. The displacement mechanism 50 includes a fourth driving member 51. The fourth driving member 51 is connected to the first driving member 31 to realize the horizontal displacement of the first driving member 31. The fourth driving member 51 is installed below the second guide rail 26. The horizontal displacement direction of the first driving member 31 is perpendicular to the second guide rail 26, that is, perpendicular to the direction of the movement of the two encapsulation plates 22 towards or away from each other. Both the displacement mechanism 50 and the diagonal bracing mechanism 30 are provided with two sets and are symmetrically arranged. Thus, the two first driving members 31 can move towards or away from each other.

[0076] There are also two sets of synchronization mechanisms 24, which are respectively installed above the fourth driving member 51. Specifically, the synchronization mechanism 24 includes a third driving member 241, two racks 242, and a synchronization gear 243 that meshes with the two racks 242. One end of the third driving member 241 is connected to one of the encapsulation plates 22. One ends of the two racks 242 are respectively connected to the two encapsulation plates 22 corresponding to them. The synchronization gear 243 meshes between the two racks 242. The rotation of the synchronization gear 243 can drive the two racks 242 to move towards or away from each other, thereby realizing the movement of the two encapsulation plates 22 towards or away from each other. More specifically, when the third driving member 241 drives one of the encapsulation plates 22 to displace relative to the other encapsulation plate 22, the rack 242 connected to one of the encapsulation plates 22 displaces. The rack 242 drives the synchronization gear 243 to rotate. The rotation of the synchronization gear 243 drives the other rack 242 to move, thereby driving the displacement of the other encapsulation plate 22.

[0077] Refer to Figure 5 , a heat conduction flow channel is provided in the encapsulation plate 22. The heat conduction flow channel includes an inlet flow channel 222 and an outlet flow channel 223 that communicates with the inlet flow channel 222. One end of the inlet flow channel 222 is connected with a first joint 224. One end of the outlet flow channel 223 is connected with a second joint 225. The other ends of the inlet flow channel 222 and the outlet flow channel 223 are blocked by plugs. Hoses are connected to both the first joint 224 and the second joint 225. The hoses allow the heat medium to flow and be input into the encapsulation plate 22 and complete the cycle at the same time. The heat medium can be gas or fluid. The setting of the heat conduction flow channel enables the encapsulation plate 22 to have a certain temperature.

[0078] Refer to Figure 6 , the support rod 32 and the encapsulation plate 22 are in the vertical direction. The end of the support rod 32 is higher than the upper end surface of the encapsulation plate 22. There is a height difference H between the two. The support rod 32 is connected to the first driving member 31 by threaded connection or other connection methods. A heating wire is provided inside the support rod 32, so that the support rod 32 also has a certain temperature. At the same time, two relief notches 221 are spaced apart on one side wall of the encapsulation plate 22 facing the encapsulation area 21. The relief notches 221 allow the support rod 32 to pass through and have a certain horizontal displacement within the relief notches 221.

[0079] Combined with Figure 7 and Figure 8 , the encapsulation module 20 further includes a secondary encapsulation assembly 60. The secondary encapsulation assembly 60 is installed on the lower cross-section of the encapsulation plate 22 and mainly includes a second driving member 61 and an encapsulation wheel 66 connected to the second driving member 61. A cam track 23 is provided on one side of the lower end surface of the encapsulation plate 22. The cam track 23 is below the upper end surface of the encapsulation plate 22. The encapsulation wheel 66 can roll on the cam track 23 driven by the second driving member 61.

[0080] The secondary encapsulation assembly 60 also includes a screw rod 62 connected to the second driving member 61 and a nut slider 63 threadedly connected to the screw rod 62. The other end of the screw rod 62 is rotatably connected to the side wall of the encapsulation plate 22 and rotates in situ under the drive of the second driving member 61. The nut slider 63 can slide along the length direction of the encapsulation plate 22 under the rotation of the screw rod 62.

[0081] One side of the nut slider 63 is also connected to a connection seat 64, and one side of the connection seat 64 is connected to a swing arm 65, and one end of the swing arm 65 is rotatably connected to the encapsulation wheel 66. The swing arm 65 is rotatably connected to the connection seat 64 through a rotating shaft 67. The connection seat 64 is also provided with a fixed shaft 69, and the fixed shaft 69 is provided with an elastic member 68, and the two ends of the elastic member 68 are respectively connected to the nut slider 63 and the swing arm 65. Specifically, the elastic member 68 is a spring or a torsion spring. Under the action of the elastic member 68, the end of the swing arm 65 connected to the encapsulation wheel 66 always has a tendency to move away from the encapsulation area 21, which enables the encapsulation wheel 66 to always fit the surface of the cam track 23.

[0082] Combination Figure 9 The encapsulating wheel 66 includes a wheel portion 661, which is made of a high temperature resistant and elastic material, such as silicone rubber, fluororubber, etc. Such a material can maintain elasticity in the temperature range of -60° to 250°, and can be suitable for the temperature of the heated encapsulating plate 22 and the parison 70 itself during the encapsulating operation. The wheel portion 661 is connected to an eccentric shaft, and the eccentric shaft passes through the swing arm 65 and is connected to a locking nut 666, and the locking nut 666 is abutted against the swing arm 65 to limit the wheel portion 661.

[0083] The eccentric shaft includes an eccentric section 662, an optical axis section 663 and a threaded section 664 that are integrally connected. The wheel portion 661 is rotatably connected to the eccentric section 662. The optical axis section 663 is rotatably connected to the mounting hole of the swing arm 65. The locking nut 666 is threadedly connected to the threaded section 664. A wrench hole 665 is also provided on the end surface of the eccentric section 662 to facilitate the connection of manual or electric tools to drive the eccentric shaft to rotate. When the eccentric shaft rotates, the wheel portion 661 can be radially displaced away from or close to the encapsulation area 21 due to the setting of the eccentric section 662. The swing arm 65 is combined with the setting of the elastic member 68, so that when the wheel portion 661 is radially adjusted, it can always fit and contact with the surface of the cam track 23.

[0084] The cam track 23 includes a continuously opened encapsulation section 231 and downward sections 232 connected to both sides of the encapsulation section 231. The downward sections 232 are also connected with parallel standby sections 233. When the wheel part 661 is placed on the encapsulation section 231, the wheel part 661 protrudes from the side surface of the encapsulation plate 22 to form a distance A, and this distance A can change during the distance adjustment of the wheel part 661 so as to be applicable to the extrusion encapsulation of parisons 70 with different wall thicknesses. When the wheel part 661 is placed on the downward section 232 or the parallel standby section 233, the wheel part 661 is within the projection in the positive direction of the encapsulation plate 22, that is, the wheel part 661 does not protrude from the side wall of the encapsulation plate 22.

[0085] Combined with Figures 10 to 13 , when the upper encapsulation device encapsulates the parison 70, the driving mechanism 40 is used to drive the entire encapsulation module 20 to be placed under the die head in advance. While the parison 70 is extruded from the die head, the synchronization mechanism 24 acts to drive the two encapsulation plates 22 to gradually move towards each other on one side of the parison 70. The diagonal bracing mechanism 30 first moves towards each other under the drive of the displacement mechanism 50 and is placed under the opening of the parison 70. The diagonal bracing mechanism 30 acts to drive the strut 32 to move towards the parison 70. Subsequently, the displacement mechanism 50 drives the diagonal bracing mechanism 30 to move in the reverse direction, and the parison 70 is gradually expanded and tightened under the drive of the two struts 32.

[0086] Subsequently, the two encapsulation plates 22 continue to move towards each other and squeeze the parison 70 so that the lower edge parts of the parison 70 are adhered to each other to achieve encapsulation. At this time, after the compressed air is blown out from the die head, since one side of the parison 70 is encapsulated, the part of the parison 70 from the lower edge to the die head can be kept in a blown state. At this time, one encapsulation operation of the two encapsulation plates 22 on the parison 70 is completed.

[0087] Immediately afterwards, the diagonal bracing mechanism 30 resets, the two struts 32 disengage from the parison 70, and the two encapsulation plates 22 still remain in contact with the parison 70. The second driving member 61 works to drive the wheel part 661 to move along the cam track 23, and gradually rolls from one side of the parallel standby section 233 to the downward section 232 and finally rolls onto the encapsulation section 231. While the two wheel parts 661 are rolling on the encapsulation section 231, the parison 70 is encapsulated for the second time, and the positions not encapsulated by the struts 32 are encapsulated. After the second encapsulation is completed, the wheel part 661 can be in the parallel standby section 233 on the other side of the cam track 23, or the second driving member 61 works in the reverse direction to realize the reciprocating encapsulation of the wheel part 661. The reciprocating times can be selected according to the wall thickness and material of the parison 70. After the second encapsulation is completed, the two encapsulation plates 22 are separated, and the parison 70 continues to be extruded downward for the forming operation. Embodiment 2

[0088] A blow molding machine includes the upper encapsulation device of the blow molding machine in Embodiment 1.

[0089] The above are all preferred embodiments of the present application, and do not limit the protection scope of the present application. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application shall be covered within the protection scope of the present application.

Claims

1. An encapsulation device on a blow molding machine, characterized in that, include: Frame (10); An encapsulation module (20) is slidably connected to the frame (10), the encapsulation module (20) comprising two encapsulation plates (22) and a synchronization mechanism (24) for driving the encapsulation plates (22) to move toward or away from each other in a horizontal direction, the two encapsulation plates (22) being spaced apart to form an encapsulation area (21) for the parison (70) to pass through; A diagonal support mechanism (30) is symmetrically arranged on both sides of the encapsulation module (20), the diagonal support mechanism (30) comprising a support rod (32) and a first driving member (31) for driving the support rod (32) to move in a vertical direction within the encapsulation area (21); A displacement mechanism (50) connected to the diagonal support mechanism (30) and used to drive the two diagonal support mechanisms (30) to move toward or away from each other; and A secondary encapsulation assembly (60), the secondary encapsulation assembly (60) comprising an encapsulation wheel (66) and a second driving member (61), the second driving member (61) being used to drive the encapsulation wheel (66) to roll along a travel direction perpendicular to the encapsulation plate (22); The end of the support rod (32) is higher than the upper end surface of the encapsulation plate (22); the encapsulation plate (22) is provided with a clearance notch (221) on one side facing the encapsulation area (21); when the two encapsulation plates (22) move towards each other to encapsulate the parison (70), the two clearance notches (221) enclose and form a guide space for the support rod (32) to slide; the encapsulation plate (22) is provided with a cam track (23) on one side; the cam track (23) is placed below the upper end surface of the encapsulation plate (22) and the cam track (23) is disposed at a position below the upper end surface of the encapsulation plate (22). The length of the sealing wheel (66) is greater than the maximum spacing between the two support rods (32), the sealing wheel (66) is rollingly connected to the cam track (23), and the cam track (23) includes a sealing section (231) and at least one descending section (232) connected to the sealing section (231); when the sealing wheel (66) rolls on the sealing section (231), the sealing wheel (66) protrudes from the side of the sealing plate (22), and when the sealing wheel (66) is placed on the descending section (232), the cross section of the sealing wheel (66) is within the forward projection of the sealing plate (22).

2. The encapsulation device on the blow molding machine according to claim 1, characterized in that, A heat conduction channel for the flow of heat medium is provided in the encapsulation plate (22).

3. The encapsulation device on the blow molding machine according to claim 1, characterized in that, The secondary encapsulation component (60) further comprises: a swing arm (65), wherein two ends of the swing arm (65) are rotatably connected to the second driving member (61) and the sealing wheel (66); and The elastic member (68) is connected to the swing arm (65) and always forces the swing arm (65) to have a movement tendency to move toward a side away from the encapsulation area (21).

4. The encapsulation device on the blow molding machine according to claim 1, characterized in that, The encapsulation wheel (66) comprises: Wheel portion (661); and An eccentric shaft, the wheel portion (661) being rollingly connected to the eccentric shaft; Wherein, when the eccentric shaft rotates, the wheel portion (661) moves towards or away from one side of the encapsulation area (21).

5. The encapsulation device on the blow molding machine according to claim 1, characterized in that, It also includes a driving mechanism (40) for driving the encapsulation module (20) to slide on the frame (10), the driving mechanism (40) comprising: A driving motor (41) is mounted on the frame (10); A drive shaft (42), connected to a drive motor (41); A transmission assembly, connected to the encapsulation plate (22), the transmission assembly including a drive pulley (43), a guide pulley (45), a tension pulley (44), and a timing belt (46); Wherein, the drive pulley (43) is connected to the drive shaft (42), the timing belt (46) is engaged with the drive pulley (43), the guide pulley (45), and the tension pulley (44), and both ends of the timing belt (46) are fixed to both ends of the encapsulation module (20).

6. The encapsulation device on the blow molding machine according to claim 1, characterized in that, The synchronization mechanism (24) includes: A third driving member (241), one end of the third driving member (241) being connected to one of the encapsulation plates (22); Two racks (524), respectively corresponding to and connected to one of the encapsulation plates (22); and A synchronization gear (253), engaged between the two racks (524) for driving one of the racks (524) to move towards / away from the other rack (524).

7. The encapsulation device on the blow molding machine according to claim 1, characterized in that, A heating wire is provided inside the support rod (32).

8. The encapsulation device on the blow molding machine according to claim 1, characterized in that, The displacement mechanism (50) includes a fourth driving member (51), the fourth driving member (51) being connected to the diagonal bracing mechanism (30).

9. A blow molding machine, characterized in that, It includes the upper encapsulation device of a blow molding machine according to any one of claims 1-8.

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