Thermal insulation coating for construction on high-temperature surface and preparation method of thermal insulation coating

Abstract

The invention provides a thermal insulation coating for construction on a high-temperature surface and a preparation method thereof, and relates to the field of thermal insulation coatings. The thermal insulation coating for high-temperature surface construction is prepared from organic silicon resin, polybutadiene, a catalyst, E51 epoxy resin, a Karst catalyst, a solvent 1, a solvent 2, a thermal insulation functional filler, SiO2 aerogel, titanium dioxide and an adhesion promoter. The epoxy modified organic silicon resin and the two high-boiling-point organic solvents are combined, so that the problem that a traditional coating system cannot be directly constructed on a high-temperature surface is solved, the prepared high-temperature surface construction heat insulation coating material can be directly sprayed and constructed on the surface of a substrate at the high temperature of 160 DEG C, and normal production activities are not affected.

Description

Technical Field

[0001] The present invention relates to the technical field of heat-insulating and heat-preserving coatings, and particularly relates to a heat-insulating coating for construction on a high-temperature surface and a preparation method thereof. Background Art

[0002] During the use of high-temperature reaction furnaces and smelting furnaces used in industrial mass production, heat will be released to the surroundings. The surface temperature of the furnace body is high and the danger is great; in order to maintain the temperature inside the furnace, a large amount of energy needs to be consumed. Therefore, spraying a layer of coating with heat-insulating and heat-preserving effects on the furnace body surface is a simple and effective solution. However, using conventional heat-insulating and heat-preserving coating materials requires the furnace body to stop working and cool down before construction can be carried out, which will inevitably affect the normal production progress of the enterprise.

[0003] Currently, when existing coating systems are directly sprayed onto a high-temperature surface, the normal film-forming process of the coating system will be disrupted, the solvent evaporation process will be sharply shortened, the resin curing rate will be greatly accelerated, and problems such as foaming, orange peel, cracking, powdering, and poor adhesion will occur, and film formation cannot be achieved. Therefore, it is impossible to directly construct on a high-temperature surface. Therefore, a heat-insulating and heat-preserving coating material that can be sprayed and constructed on a high-temperature surface is needed. Summary of the Invention

[0004] In view of this, the present application uses a combination of epoxy-modified silicone resin and two high-boiling organic solvents to solve the problem that traditional coating systems cannot be directly constructed on a high-temperature surface, and prepares a heat-insulating coating material that can be constructed on a high-temperature surface.

[0005] The technical solution of the present invention is realized as follows: The present invention provides a heat-insulating coating for construction on a high-temperature surface, which is made from the following raw materials in parts by mass:

[0006]

[0007]

[0008] On the basis of the above technical solution, preferably, the solvent 1 is selected from at least one of DBE, cyclohexanone, and amyl acetate.

[0009] On the basis of the above technical solution, preferably, the solvent 2 is selected from DPNB and / or ethyl benzoate.

[0010] On the basis of the above technical solution, preferably, the catalyst is Pt.

[0011] According to another aspect of the present application, a preparation method of the above-mentioned heat-insulating coating for construction on a high-temperature surface is provided. Weigh the raw materials in parts by mass, and the method includes the following steps:

[0012] Step a: stirring a mixture containing an epoxy-modified silicone resin, solvent 1, and solvent 2 for 1 to obtain an epoxy-modified silicone resin solution;

[0013] Step b: Heat insulation filler, SiO 2 Aerogel and titanium dioxide are sequentially added to the epoxy-modified silicone resin solution, stirred for 2, an adhesion promoter is added, stirred for 3, and the thermal insulation coating for application on high-temperature surfaces is obtained.

[0014] Based on the above technical solution, preferably, in step a, the boiling point of solvent 1 is lower than the boiling point of solvent 2.

[0015] On the basis of the above technical solution, preferably, in step a, the preparation method of the epoxy-modified silicone resin comprises the following steps:

[0016] Step S1: reacting a mixture of an organic silicone resin, polybutadiene, Pt and toluene to obtain a modified organic silicone resin;

[0017] Step S2: reacting a mixture containing modified silicone resin, E51 epoxy resin, Custer catalyst and xylene by 2 to obtain epoxy modified silicone resin.

[0018] On the basis of the above technical solution, preferably, in the step S1, the amount of Pt added is calculated based on the total mass of the silicone resin and polybutadiene, and 80 mg Pt is added per kilogram of the silicone resin and polybutadiene.

[0019] On the basis of the above technical solution, preferably, in the step S1, the silicone resin is a single-component room temperature curing silicone resin.

[0020] On the basis of the above technical scheme, preferably, in step S1, the polybutadiene is 1,2-polybutadiene, the double bond is on the side chain, the reaction activity is relatively high, and it can be purchased from manufacturers such as Merck, Cray Valley, Guangdong Wengjiang Chemical Reagent Co., Ltd., Shanghai Jizhi Biochemical Technology Co., Ltd., and Xi'an Qiyue Biotechnology Co., Ltd., and the structural formula is as follows:

[0021]

[0022] On the basis of the above technical solution, preferably, in the step S1, the reaction 1 is:

[0023]

[0024] On the basis of the above technical solution, preferably, in the step S2, the reaction 2 refers to the silicone resin continuing to react with polybutadiene under the action of the Custer catalyst to obtain the modified silicone resin.

[0025] Based on the above technical solutions, preferably, in step S2, the epoxy-modified silicone resin is obtained by blending and modifying epoxy resin and modified silicone resin.

[0026] Based on the above technical solutions, preferably, in step S2, the addition amount of the Kester catalyst is 50 mg of the Kester catalyst per kilogram of the silicone resin based on the mass of the silicone resin.

[0027] Based on the above technical solutions, preferably, in step S1, when using polybutadiene, the moisture present in the polybutadiene needs to be removed in advance.

[0028] Based on the above technical solutions, preferably, in step S1, the temperature of reaction 1 is 70 - 90 °C, and the time of reaction 1 is 4 - 8 h.

[0029] Based on the above technical solutions, preferably, in step S1, the temperature of reaction 1 independently selects any value from 70 °C, 75 °C, 80 °C, 85 °C, 90 °C or the range value between any two of the above.

[0030] Based on the above technical solutions, preferably, in step S1, the time of reaction 1 independently selects any value from 4 h, 5 h, 6 h, 7 h, 8 h or the range value between any two of the above.

[0031] Based on the above technical solutions, preferably, in step S2, the temperature of reaction 2 is 90 - 100 °C, and the time of reaction 2 is 6 - 12 h.

[0032] Based on the above technical solutions, preferably, in step S2, the temperature of reaction 2 independently selects any value from 90 °C, 92 °C, 95 °C, 98 °C, 100 °C or the range value between any two of the above.

[0033] Based on the above technical solutions, preferably, in step S2, the time of reaction 2 independently selects any value from 6 h, 7 h, 8 h, 9 h, 10 h, 11 h, 12 h or the range value between any two of the above.

[0034] Based on the above technical solutions, preferably, the rotation speed of stirring 1 is 500 - 1000 rpm, and the time of stirring 1 is 20 - 40 min.

[0035] Based on the above technical solutions, preferably, the rotation speed of the stirring 1 is independently selected from any value of 500 rpm, 600 rpm, 700 rpm, 800 rpm, 900 rpm, 1000 rpm or the range value between any two of the above.

[0036] Based on the above technical solutions, preferably, the time of the stirring 1 is independently selected from any value of 20 min, 25 min, 30 min, 35 min, 40 min or the range value between any two of the above.

[0037] Based on the above technical solutions, preferably, the rotation speed of the stirring 2 is 300 - 600 rpm, and the time of the stirring 2 is 30 - 60 min.

[0038] Based on the above technical solutions, preferably, the rotation speed of the stirring 2 is independently selected from any value of 300 rpm, 350 rpm, 400 rpm, 450 rpm, 500 rpm, 550 rpm, 600 rpm or the range value between any two of the above.

[0039] Based on the above technical solutions, preferably, the time of the stirring 2 is independently selected from any value of 30 min, 35 min, 40 min, 45 min, 50 min, 55 min, 60 min or the range value between any two of the above.

[0040] Based on the above technical solutions, preferably, the rotation speed of the stirring 3 is 500 - 1000 rpm, and the time of the stirring 3 is 30 - 60 min.

[0041] Based on the above technical solutions, preferably, the rotation speed of the stirring 3 is independently selected from any value of 500 rpm, 600 rpm, 700 rpm, 800 rpm, 900 rpm, 1000 rpm or the range value between any two of the above.

[0042] Based on the above technical solutions, preferably, the time of the stirring 3 is independently selected from any value of 30 min, 35 min, 40 min, 45 min, 50 min, 55 min, 60 min or the range value between any two of the above.

[0043] Based on the above technical solutions, preferably, the heat insulation functional filler is selected from at least one of hollow glass microspheres, alumina hollow spheres, and vitrified microspheres.

[0044] As an alternative implementation, the present application is achieved through the following technical solutions:

[0045] Step 1: Weigh silicone resin, polybutadiene, and Pt according to the mass and add them into toluene solution. Heat under reflux at 70 - 90 °C, stir for 6 h, and then perform vacuum distillation to remove the solvent, obtaining the modified silicone resin.

[0046] Step 2: Add the modified silicone resin obtained in Step 1, E51 epoxy resin, and Kast catalyst into xylene solution. Heat under reflux at 90 - 100 °C, stir for 8 h, and react to obtain the epoxy-modified silicone resin.

[0047] Step 3: Add the epoxy-modified silicone resin obtained in Step 2, Solvent 1, and Solvent 2 into a disperser and stir until evenly dispersed to obtain the epoxy-modified silicone resin solution.

[0048] Step 4: Add the heat-insulating functional filler, SiO 2 aerogel, and titanium dioxide into the mixture obtained in Step 3 in sequence and stir until evenly dispersed to obtain the mixture.

[0049] Step 5: Add the adhesion promoter into the mixture obtained in Step 4 and stir until evenly dispersed to obtain the heat-insulating coating that can be applied on the high-temperature surface.

[0050] Based on the above technical solutions, preferably, the molecular chain of the modified silicone resin becomes longer and the curing rate decreases; the epoxy resin physically blends with the modified silicone resin, and by utilizing the excellent properties of the epoxy resin itself, the toughness and adhesion performance of the modified silicone resin on the high-temperature surface are improved.

[0051] Based on the above technical solutions, preferably, when the boiling point of Solvent 1 is lower than that of Solvent 2, Solvent 1 can quickly volatilize on the substrate surface, enabling the coating to form a preliminary film and adhere to the substrate surface; when the boiling point of Solvent 2 is higher than that of Solvent 1, the volatilization rate of Solvent 2 on the substrate surface is slower, enabling the coating to maintain fluidity for a certain period of time, so that the paint film on the substrate surface can level off.

[0052] The heat-insulating coating prepared by the present application through the combination of epoxy-modified silicone resin, Solvent 1, and Solvent 2 has good film-forming property on the high-temperature surface. This benefits from the moderate curing rate of the epoxy-modified silicone resin. When the boiling point of Solvent 1 is lower than that of Solvent 2, Solvent 1 can quickly volatilize on the high-temperature surface without being completely volatilized during the process when the paint mist has not reached the high-temperature surface, thus enabling the coating to form a preliminary film on the high-temperature surface; among them, the boiling point of Solvent 2 is higher, and the volatilization rate of Solvent 2 on the high-temperature surface is relatively slow, enabling the coating to maintain fluidity for a certain period of time on the high-temperature surface, so that the paint film can level off. Therefore, when ensuring the appropriate ratio between Solvent 1 and Solvent 2, the spraying quality of the heat-insulating coating on the substrate surface can be guaranteed.

[0053] The heat-insulating coating material capable of being constructed on a high-temperature surface according to the present invention has the following beneficial effects compared with the prior art:

[0054] (1) The heat-insulating coating prepared in this application, which can be constructed on a high-temperature surface, can effectively reduce the temperature of the outer surface of high-temperature objects such as high-temperature reaction furnaces and smelting furnaces, improve safety, reduce the incidence of high-temperature injury accidents; reduce energy consumption; and can be constructed without stopping production, reducing the loss of production stoppage.

[0055] (2) The heat-insulating coating prepared in this application, which can be constructed on a high-temperature surface, can be directly spray-coated on the surface of a substrate at a high temperature of 160 °C without affecting normal production activities.

[0056] (3) The epoxy-modified silicone resin provided in this application extends the silicone side chain, reduces the curing rate of silicone on the high-temperature surface, and at the same time retains the advantages of high adhesion and good toughness of epoxy resin.

[0057] (4) The heat-insulating coating provided in this application, which can be constructed on a high-temperature surface, has good thick-film coating performance, and the one-time film-forming thickness can reach up to 1000 μm; it has good heat-insulating effect and can effectively reduce the surface temperature of the substrate; on the surface of the substrate under the condition of 160 °C, the heat-insulating temperature difference reaches 45 °C ± 5 °C. Description of the Drawings

[0058] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0059] Figure 1 It is a coating film diagram of the heat-insulating coating capable of being constructed on a high-temperature surface in the embodiment of the present invention;

[0060] Figure 2 It is a coating film diagram of the coating prepared without modifying the silicone resin in Comparative Example 1 of the present invention;

[0061] Figure 3 It is a coating film diagram of the coating prepared with less solvent 2 in Comparative Example 2 of the present invention;

[0062] Figure 4 It is a coating film diagram of the coating prepared with less solvent 1 in Comparative Example 3 of the present invention;

[0063] Figure 5 It is a coating film diagram of the coating prepared with other solvents in Comparative Example 4 of the present invention. Detailed Embodiments

[0064] Next, in combination with the embodiments of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0065] In the embodiments of the present application, "DBE" refers to dibasic acid ester, and "DPNB" refers to "dipropylene glycol butyl ether".

[0066] Example 1

[0067] Step 1: Weigh 45 g of silicone resin, 85 g of polybutadiene, and 0.010 g of Pt by mass and add them to 1000 mL of toluene solution. Heat under reflux at 70 °C, stir for 8 h, and then perform vacuum distillation to remove the toluene solvent, obtaining a modified silicone resin.

[0068] Step 2: Add the modified silicone resin obtained in Step 1, 1.5 g of E51 epoxy resin, and 0.002 g of Kast catalyst to 500 mL of xylene solution. Heat under reflux at 90 °C, stir for 12 h, and react to obtain an epoxy-modified silicone resin.

[0069] Step 3: Add the epoxy-modified silicone resin obtained in Step 2, 15 g of DBE solvent 1, and 5 g of DPNB solvent 2 to a disperser, and stir at 500 rpm for 40 min until evenly dispersed, obtaining an epoxy-modified silicone resin solution.

[0070] Step 4: Add 15 g of hollow glass microsphere heat-insulating functional filler, 1 g of SiO 2 aerogel, and 1.5 g of titanium dioxide to the mixture obtained in Step 3 in sequence, and stir at 300 rpm for 60 min until evenly dispersed, obtaining a mixture.

[0071] Step 5: Add 0.5 g of adhesion promoter to the mixture obtained in Step 4, and stir at 500 rpm for 60 min until evenly dispersed, obtaining a heat-insulating coating that can be applied to a high-temperature surface.

[0072] Example 2

[0073] Step 1: Weigh 58 g of silicone resin, 110 g of polybutadiene, and 0.013 g of Pt by mass and add them to 1000 mL of toluene solution. Heat under reflux at 90 °C, stir for 4 h, and then perform vacuum distillation to remove the toluene solvent, obtaining a modified silicone resin.

[0074] Step 2: Add the modified silicone resin obtained in Step 1, 2.5 g of E51 epoxy resin, and 0.003 g of Kast catalyst into 500 mL of xylene solution, heat under reflux at 100 °C, stir for 6 h, and react to obtain epoxy-modified silicone resin;

[0075] Step 3: Add the epoxy-modified silicone resin obtained in Step 2, 25 g of cyclohexanone solvent 1, and 8 g of ethyl benzoate solvent 2 into a disperser, stir at 1000 rpm for 20 min until evenly dispersed to obtain an epoxy-modified silicone resin solution;

[0076] Step 4: Add 25 g of hollow glass microsphere heat-insulating functional filler, 3 g of SiO 2 aerogel, and 2.5 g of titanium dioxide into the mixture obtained in Step 3 in sequence, stir at 600 rpm for 30 min until evenly dispersed to obtain a mixture;

[0077] Step 5: Add 1.5 g of adhesion promoter into the mixture obtained in Step 4, stir at 1000 rpm for 30 min until evenly dispersed to obtain a heat-insulating coating that can be applied on high-temperature surfaces.

[0078] Example 3

[0079] Step 1: Weigh 50 g of silicone resin, 100 g of polybutadiene, and 0.012 g of Pt by mass, add them into 1000 mL of toluene solution, heat under reflux at 80 °C, stir for 6 h, and perform vacuum distillation to remove the toluene solvent to obtain modified silicone resin;

[0080] Step 2: Add the modified silicone resin obtained in Step 1, 2 g of E51 epoxy resin, and 0.0025 g of Kast catalyst into 500 mL of xylene solution, heat under reflux at 95 °C, stir for 8 h, and react to obtain epoxy-modified silicone resin;

[0081] Step 3: Add the epoxy-modified silicone resin obtained in Step 2, 20 g of DBE solvent 1, and 6.5 g of DPNB solvent 2 into a disperser, stir at 700 rpm for 30 min until evenly dispersed to obtain an epoxy-modified silicone resin solution;

[0082] Step 4: Add 20 g of alumina hollow sphere heat-insulating functional filler, 2 g of SiO 2 aerogel, and 2 g of titanium dioxide into the mixture obtained in Step 3 in sequence, stir at 450 rpm for 45 min until evenly dispersed to obtain a mixture;

[0083] Step 5: Add 1 g of adhesion promoter into the mixture obtained in Step 4, stir at 700 rpm for 45 min until evenly dispersed to obtain a heat-insulating coating that can be applied on high-temperature surfaces.

[0084] Example 4

[0085] Step 1: Weigh 45 g of silicone resin, 85 g of polybutadiene and 0.010 g of Pt by mass and add them to 1000 mL of toluene solution. Heat under reflux at 70 °C, stir for 8 h, and then perform vacuum distillation to remove the toluene solvent, obtaining a modified silicone resin.

[0086] Step 2: Add the modified silicone resin obtained in Step 1, 1.5 g of E51 epoxy resin, and 0.002 g of Kast catalyst to 500 mL of xylene solution. Heat under reflux at 90 °C, stir for 12 h, and react to obtain an epoxy-modified silicone resin.

[0087] Step 3: Add the epoxy-modified silicone resin obtained in Step 2, 15 g of amyl acetate solvent 1, and 5 g of DPNB solvent 2 to a disperser, and stir at 500 rpm for 40 min until evenly dispersed, obtaining an epoxy-modified silicone resin solution.

[0088] Step 4: Add 15 g of hollow glass microsphere heat-insulating functional filler, 1 g of SiO 2 aerogel, and 1.5 g of titanium dioxide to the mixture obtained in Step 3 in sequence, and stir at 300 rpm for 60 min until evenly dispersed, obtaining a mixture.

[0089] Step 5: Add 0.5 g of adhesion promoter to the mixture obtained in Step 4, and stir at 500 rpm for 60 until evenly dispersed, obtaining a heat-insulating coating that can be applied on a high-temperature surface.

[0090] Example 5

[0091] Step 1: Weigh 52 g of silicone resin, 105 g of polybutadiene and 0.012 g of Pt by mass and add them to 1000 mL of toluene solution. Heat under reflux at 80 °C, stir for 6 h, and then perform vacuum distillation to remove the toluene solvent, obtaining a modified silicone resin.

[0092] Step 2: Add the modified silicone resin obtained in Step 1, 2.2 g of E51 epoxy resin, and 0.0025 g of Kast catalyst to 500 mL of xylene solution. Heat under reflux at 95 °C, stir for 8 h, and react to obtain an epoxy-modified silicone resin.

[0093] Step 3: Add the epoxy-modified silicone resin obtained in Step 2, 18 g of DBE solvent 1, and 6 g of DPNB solvent 2 to a disperser, and stir at 750 rpm for 30 min until evenly dispersed, obtaining an epoxy-modified silicone resin solution.

[0094] Step 4: Add 22 g of vitrified microsphere heat-insulating functional filler, 2 g of SiO 2 aerogel, and 2 g of titanium dioxide to the mixture obtained in Step 3 in sequence, and stir at 500 rpm for 42 min until evenly dispersed, obtaining a mixture.

[0095] Step 5: Add 1 g of adhesion promoter to the mixture obtained in Step 4, and stir at 750 rpm for 43 min until evenly dispersed to obtain a heat-insulating coating that can be applied on a high-temperature surface.

[0096] The heat-insulating coatings prepared in Examples 1 to 5 that can be applied on a high-temperature surface were sprayed on a substrate surface at 160 °C, and the heat-insulating temperature difference was tested. After testing, the heat-insulating temperature difference reached 45 °C ± 5 °C. As Figure 1 shown in the film diagrams of the heat-insulating coatings prepared in Examples 1 to 5 that can be applied on a high-temperature surface, the heat-insulating coatings leveled and formed films on the substrate surface without cracks, and could effectively reduce energy consumption after spraying.

[0097] Comparative Example 1

[0098] Omit Steps 1 and 2 in Example 1, and directly add 45 g of silicone resin to Step 3. The remaining preparation conditions are the same as those in Example 1 to obtain a heat-insulating coating. As Figure 2 shown, after spraying the heat-insulating coating prepared in Comparative Example 1 on the substrate surface, the surface of the paint film cracked and could not form a film, and it could not be directly sprayed and constructed on the high-temperature substrate surface.

[0099] Comparative Example 2

[0100] Replace 5 g of DPNB solvent 2 in Step 3 of Example 1 with 4 g of DPNB solvent 2, and the remaining steps are the same as those in Example 1 to obtain a heat-insulating coating. As Figure 3 shown, after spraying the heat-insulating coating prepared in Comparative Example 2 on the substrate surface, the surface of the paint film cracked, the paint film could not level, and the surface was uneven and could not form a film. Therefore, when the dosage of solvent 2 is not within the component range of the heat-insulating coating that can be applied on a high-temperature surface, the paint film on the sprayed substrate surface cannot level, showing an uneven surface and unable to form a film.

[0101] Comparative Example 3

[0102] Replace 15 g of DBE solvent 1 in Step 3 of Example 1 with 12 g of DBE solvent 1, and the remaining steps are the same as those in Example 1 to obtain a heat-insulating coating. As Figure 4 shown, after spraying the heat-insulating coating prepared in Comparative Example 3 on the substrate surface, there were cracks on the surface of the paint film, the surface was uneven, and the film-forming effect was poor. Therefore, when the dosage of solvent 1 is not within the component range of the heat-insulating coating that can be applied on a high-temperature surface, solvent 1 volatilizes completely during the process when the paint mist has not fully fallen onto the high-temperature surface, resulting in a poor film-forming effect of the coating on the high-temperature surface.

[0103] Comparative Example 4

[0104] Replace 15 g of DBE solvent 1 in Step 3 of Example 1 with 15 g of xylene as solvent 1, and keep the remaining steps the same as in Example 1 to obtain the heat-insulating coating. As Figure 5 shown, after spraying the heat-insulating coating prepared in Comparative Example 4 on the substrate surface, film formation cannot occur, and powder agglomerates on the surface. Therefore, when other solvents are used as solvent 1, the xylene solvent volatilizes completely before the paint mist reaches the high-temperature surface, resulting in the agglomeration of the coating into powder on the high-temperature surface.

[0105] In this application, when spraying and film-forming on the substrate surface at 160 °C using the heat-insulating coating material prepared in this application that can be applied on a high-temperature surface, when the epoxy-modified silicone resin is not added to the heat-insulating coating material that can be applied on a high-temperature surface, the paint film on the substrate surface cannot form a film, and cracks appear on the film surface; when the dosages of solvent 1 and solvent 2 are not within the raw material formula range, after spraying the prepared heat-insulating coating material, there are problems such as the paint film not being able to level and the paint film having concavities, convexities, and cracks. Therefore, this application uses the combination of epoxy-modified silicone resin and two high-boiling organic solvents (solvent 1 and solvent 2), and through the synergistic effect among epoxy-modified silicone resin, solvent 1, and solvent 2, solves the problem that traditional coating systems cannot be directly applied on a high-temperature surface.

[0106] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A thermal insulation coating for application on high temperature surfaces, characterized in that: The starting materials are composed of the following parts by weight:

2. The thermal insulation coating for application on high temperature surfaces as claimed in claim 1, characterized in that: The solvent 1 is selected from at least one of DBE, cyclohexanone and amyl acetate; The solvent 2 is selected from DPNB and / or ethyl benzoate; The catalyst is Pt.

3. The method for preparing a thermal insulation coating for application on a high temperature surface according to claim 1 or 2, characterized in that: Weigh the raw materials by mass, including the following steps: Step a: stirring a mixture containing an epoxy-modified silicone resin, solvent 1, and solvent 2 for 1 to obtain an epoxy-modified silicone resin solution; Step b: Add heat-insulating functional filler, SiO2 aerogel and titanium dioxide to the epoxy-modified silicone resin solution in sequence, stir for 2, add adhesion promoter, stir for 3, and obtain the heat-insulating coating for application on high-temperature surfaces.

4. The preparation method according to claim 3, characterized in that: In the step a, the boiling point of the solvent 1 is lower than the boiling point of the solvent 2.

5. The preparation method according to claim 3, characterized in that: In the step a, the preparation method of the epoxy-modified silicone resin comprises the following steps: Step S1: reacting a mixture of an organic silicone resin, polybutadiene, Pt and toluene to obtain a modified organic silicone resin; Step S2: reacting a mixture containing modified silicone resin, E51 epoxy resin, Custer catalyst and xylene by 2 to obtain epoxy modified silicone resin.

6. The preparation method according to claim 5, characterized in that: In the step S1, the amount of Pt added is calculated based on the total mass of the silicone resin and polybutadiene, and 80 mg of Pt is added per kilogram of the silicone resin and polybutadiene.

7. The preparation method according to claim 5, characterized in that: In the step S2, the amount of the Custer catalyst added is based on the mass of the silicone resin, and 50 mg of the Custer catalyst is added per kilogram of the silicone resin.

8. The preparation method according to claim 5, characterized in that: In the step S1, the temperature of the reaction 1 is 70 to 90° C., and the time of the reaction 1 is 4 to 8 hours; In the step S2, the temperature of the reaction 2 is 90-100°C, and the time of the reaction 2 is 6-12 hours.

9. The preparation method according to claim 3, characterized in that: The stirring speed of the stirring 1 is 500-1000 rpm, and the stirring time of the stirring 1 is 20-40 min; The rotation speed of the stirring 2 is 300-600 rpm, and the stirring time is 30-60 min; The rotation speed of the stirring 3 is 500-1000 rpm, and the time of the stirring 3 is 30-60 min.

10. The preparation method according to claim 3, characterized in that: The heat-insulating functional filler is selected from at least one of hollow glass microspheres, hollow alumina spheres, and vitrified microspheres.

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