Production detection equipment for semiconductor refrigeration sensitive component

Abstract

The invention relates to the technical field of service life detection of semiconductor components, in particular to production detection equipment for semiconductor refrigeration sensitive components. Comprising a machine shell, a heat preservation box body, a hot liquid tank and a cold liquid tank are fixedly connected in the machine shell, a sliding frame is fixedly connected in the heat preservation box body, the hot liquid tank is used for storing liquid with the temperature larger than 100 DEG C, the cold liquid tank is used for storing liquid with the temperature smaller than-40 DEG C, and the sliding frame is slidably connected with partition plates which are longitudinally distributed at intervals. Liquid bags which are evenly distributed are fixedly connected to the upper face and the lower face of the partition plate, and a power connection device is fixedly connected into the heat preservation box body. The semiconductor component is clamped through the two adjacent liquid bags, then high-temperature liquid (liquid at 100 DEG C) and low-temperature liquid (liquid at-40 DEG C) are continuously conveyed into the liquid bags, the high-temperature liquid and the low-temperature liquid directly transfer temperature to the semiconductor component, and the accuracy of controlling the temperature of the semiconductor component is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor component life detection, and particularly to a production detection device for semiconductor refrigeration sensitive components. Background Art

[0002] After the production of semiconductor refrigeration sensitive components, reliability and life tests must be carried out to verify their long-term stability. The core of such tests is to use a detection device to simulate the operating environment of the components at extreme temperatures (for example, repeatedly alternating tests at two ambient temperatures of -40°C and 100°C). By observing the working state of the semiconductor components under harsh conditions, such as the smoothness of continuous operation and the rate of decay of the refrigeration efficiency over time, its durability is evaluated, and its actual service life is estimated.

[0003] Currently, the industry generally uses an incubator in combination with a blowing system to achieve environmental temperature control. However, this method has two main problems: First, the energy consumption of this control method is relatively high. When the blowing system heats or cools, it needs to continuously change the internal temperature of the incubator. This repeated heating and cooling process results in extremely low energy utilization efficiency; Second, the temperature adjustment process of this method is uneven. It is difficult for the blowing system to quickly adjust the entire test environment to the target temperature, and it can only rely on long-term operation to gradually make the temperature approach the target value. This not only greatly extends the test cycle but also further increases the energy consumption cost. More critically, the impact of temperature fluctuations and unevenness on the accuracy of test results is unpredictable, which will cause the performance parameters of semiconductor components in the test results to deviate from the true values, ultimately affecting the reliability of the product life assessment. Summary of the Invention

[0004] In order to overcome the disadvantages of high energy consumption and uneven temperature adjustment existing in the existing device using an incubator in combination with a blowing system for environmental temperature control, the present invention proposes a production detection device for semiconductor refrigeration sensitive components.

[0005] The technical solution of the present invention is as follows: A production detection device for semiconductor refrigeration sensitive components, including a machine shell. Inside the machine shell, there is a heat preservation box body, a hot liquid tank and a cold liquid tank fixedly connected. Inside the heat preservation box body, there is a sliding rack fixedly connected. The hot liquid tank is used to store liquids with a temperature greater than 100°C, and the cold liquid tank is used to store liquids with a temperature less than -40°C. The sliding rack is slidably connected with partitions longitudinally spaced apart. Both the upper and lower surfaces of the partitions are fixedly connected with evenly distributed liquid sacs. Inside the heat preservation box body, there is an electricity connection device provided with a detection module. The hot liquid tank and the cold liquid tank are jointly provided with a communication mechanism for sequentially communicating the hot liquid tank and the cold liquid tank with the liquid sacs. The hot liquid tank and the cold liquid tank are jointly provided with a liquid supply mechanism for delivering liquids into all the liquid sacs. The longitudinally spaced apart partitions are jointly provided with a driving mechanism for clamping semiconductor components by two adjacent liquid sacs on two adjacent partitions.

[0006] As a preferred technical solution of the present invention, the communication mechanism includes a first electromagnetic three-way valve fixedly connected between the hot liquid tank and the cold liquid tank. The first cavity and the third cavity are both communicated with the first electromagnetic three-way valve. The first electromagnetic three-way valve is fixedly connected and communicated with a first connector. The partition is fixedly connected with two symmetrically distributed liquid inlet pipes. The liquid inlet pipes are communicated with evenly distributed liquid inlets. The liquid inlets correspond to the liquid sacs one by one. The liquid sacs are communicated with the adjacent liquid inlet pipes through the corresponding liquid inlets. The liquid inlet pipes are communicated with the first connector. The hot liquid tank and the cold liquid tank are jointly fixedly connected with a second electromagnetic three-way valve. The second cavity and the fourth cavity are both communicated with the second electromagnetic three-way valve. The second electromagnetic three-way valve is fixedly connected and communicated with a second connector. The partition is fixedly connected with two symmetrically distributed liquid discharge pipes. The liquid discharge pipes correspond to the liquid inlet pipes one by one. The liquid discharge pipes are communicated with evenly distributed liquid discharge ports. Each liquid sac is communicated with two liquid discharge ports. The liquid discharge pipes are communicated with the second connector.

[0007] As a preferred technical solution of the present invention, the liquid supply mechanism includes two multi-stage electric push rods, both of which are fixedly connected inside the machine shell. Inside the hot liquid tank and the cold liquid tank, there is a liquid pushing plate slidably connected. The telescopic ends of the two multi-stage electric push rods respectively pass through the hot liquid tank and the cold liquid tank and are hermetically connected thereto. The liquid pushing plate is fixedly connected with the telescopic end of the adjacent multi-stage electric push rod. The inner cavity of the hot liquid tank is separated into a first cavity and a second cavity by the adjacent liquid pushing plate. The inner cavity of the cold liquid tank is separated into a third cavity and a fourth cavity by the adjacent liquid pushing plate.

[0008] As a preferred technical solution of the present invention, both the hot liquid tank and the cold liquid tank are provided with a heat insulation layer and a temperature control component, and both the heat insulation layer and the temperature control component are used to maintain the temperature of the liquid in the hot liquid tank and the cold liquid tank.

[0009] As a preferred technical solution of the present invention, the inner cavity of the liquid sac is a mountain-shaped cavity, the connection between the liquid sac and the corresponding liquid inlet is located in the middle of its mountain-shaped cavity, and the connections between the liquid sac and the adjacent two liquid outlets are respectively located on both sides of its mountain-shaped cavity.

[0010] As a preferred technical solution of the present invention, the flow area of the liquid inlet is greater than the sum of the flow areas of the liquid outlets connected to the same liquid sac.

[0011] As a preferred technical solution of the present invention, the power mechanism includes a scissor expansion frame, the scissor expansion frame is installed between the spaced-apart partitions, a single-stage electric push rod is fixedly connected to one of the partitions, the telescopic end of the single-stage electric push rod is fixedly connected to the scissor expansion frame, and the single-stage electric push rod is used to control the expansion and contraction of the scissor expansion frame.

[0012] As a preferred technical solution of the present invention, it further includes an air supply pump, the air supply pump is fixedly connected inside the heat preservation box body, all the liquid sacs on one side of the partition are jointly fixedly connected with an air bag, the liquid sacs are located between the adjacent partitions and the adjacent air bags, the air supply pump is fixedly connected and communicated with an air supply pipeline, and the air bag is communicated with the air supply pipeline.

[0013] As a preferred technical solution of the present invention, it further includes an air extraction pump, the air extraction pump is fixedly connected and communicated with an air extraction pipeline, the air supply pipeline and the air extraction pipeline are respectively located on both sides of the longitudinally spaced-apart partitions, the air bag is communicated with the air extraction pipeline, and the air supply pipeline and the air extraction pipeline are both provided with electric control valves.

[0014] As a preferred technical solution of the present invention, it further includes uniformly distributed micro solenoid valves, the uniformly distributed micro solenoid valves are all fixedly connected inside the first connector, the number of the first connectors corresponds one-to-one to the number of the liquid inlet pipes, and the micro solenoid valves are communicated with the first connector and the corresponding liquid inlet pipes.

[0015] Compared with the prior art, the present invention has the following advantages: The present invention clamps semiconductor components by two adjacent liquid sacs, and then continuously conveys high-temperature liquid (100°C liquid) and low-temperature liquid (-40°C liquid) into the liquid sacs, enabling the high-temperature liquid and the low-temperature liquid to directly transfer temperature to the semiconductor components, increasing the accuracy of controlling the temperature of the semiconductor components. At the same time, the high-temperature liquid and the low-temperature liquid are respectively insulated by the hot liquid tank and the cold liquid tank. Compared with the existing methods such as repeatedly heating and cooling the inside of the insulation box using a ventilation system, this device has a higher utilization rate of electrical resources and excellent energy-saving and environmental protection performance. The present invention also adds air bags to buffer the intensity of the temperature transfer from the high-temperature liquid and the low-temperature liquid to the semiconductor components, reducing the probability of damage to the semiconductor components due to sudden temperature changes, thereby increasing the stability and reliability of the process of using this device for experiments, and ultimately facilitating the staff to more accurately evaluate the service life of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a three-dimensional structure schematic diagram of the present invention;

[0017] Figure 2 is a three-dimensional structure schematic diagram of the insulation box, the hot liquid tank and the cold liquid tank of the present invention;

[0018] Figure 3 is a three-dimensional structure schematic diagram of the sliding rack and the partition of the present invention;

[0019] Figure 4 is a cross-sectional view of the hot liquid tank and the cold liquid tank of the present invention;

[0020] Figure 5 is a three-dimensional structure schematic diagram of the partition and the power connection device of the present invention;

[0021] Figure 6 is a three-dimensional structure schematic diagram of the air supply pump and the air supply pipeline of the present invention;

[0022] Figure 7 For the present invention Figure 6 is a three-dimensional structure schematic diagram at position A;

[0023] Figure 8 is an exploded view of the partition and the liquid sac of the present invention;

[0024] Figure 9 is an exploded view of the liquid sac and the air bag of the present invention;

[0025] Figure 10 is an exploded view of the liquid sac and the liquid discharge pipeline of the present invention;

[0026] Figure 11 is a three-dimensional structure schematic diagram of the liquid inlet pipeline and the liquid discharge pipeline of the present invention;

[0027] Figure 12 Schematic three-dimensional structure diagram of the first connector and the second connector of the present invention;

[0028] Figure 13 Cross-sectional view of the first connector of the present invention.

[0029] The markings in the figure are: 1, housing; 2, heat preservation box body; 3, hot liquid tank; 31, multi-stage electric push rod; 32, liquid pushing plate; 301, first cavity; 302, second cavity; 4, cold liquid tank; 401, third cavity; 402, fourth cavity; 5, sliding frame; 6, partition board; 7, liquid sac; 8, power connection device; 9, first electromagnetic three-way valve; 91, first connector; 10, liquid inlet pipeline; 1001, liquid inlet; 11, second electromagnetic three-way valve; 111, second connector; 12, liquid discharge pipeline; 1201, liquid discharge port; 15, scissor expansion frame; 16, single-stage electric push rod; 17, airbag; 18, air supply pump; 181, air supply pipeline; 19, air extraction pump; 191, air extraction pipeline; 20, micro solenoid valve. Detailed implementation manners

[0030] Those skilled in the art should correctly recognize the broader applicability of the principles disclosed by the present invention. Those of ordinary skill in the art will recognize that terms such as "upper" and "lower" are used to describe the drawings and do not represent limitations on the scope of the present invention. Any numerical labels such as "first" or "second" are merely illustrative and should not be regarded as limitations on the present invention either.

[0031] A production and detection device for semiconductor refrigeration sensitive components, taking Figures 1-8 as an example, includes a housing 1. A heat preservation box body 2, a hot liquid tank 3 and a cold liquid tank 4 are fixedly connected inside the housing 1. A sliding frame 5 is fixedly connected inside the heat preservation box body 2. The hot liquid tank 3 is used to store liquids with a temperature greater than 100 °C, and the cold liquid tank 4 is used to store liquids with a temperature less than -40 °C. The sliding frame 5 is slidably connected with partition boards 6 distributed at longitudinal intervals. Liquid sacs 7 are fixedly connected to both the upper and lower surfaces of the partition boards 6 evenly. A power connection device 8 is fixedly connected inside the heat preservation box body 2. The power connection device 8 is provided with a detection module. The hot liquid tank 3 and the cold liquid tank 4 are jointly provided with a communication mechanism for communicating the hot liquid tank 3 and the cold liquid tank 4 with the liquid sacs 7 in sequence. The hot liquid tank 3 and the cold liquid tank 4 are jointly provided with a liquid supply mechanism for delivering liquids into all the liquid sacs 7. The partition boards 6 distributed at longitudinal intervals are jointly provided with a driving mechanism for clamping semiconductor components by two adjacent liquid sacs 7 on two adjacent partition boards 6.

[0032] In the above scheme, a control terminal is installed on the casing 1; semiconductor components are placed at the intervals of the partitions 6 distributed at intervals in the longitudinal direction, and the distance between two adjacent partitions 6 is shortened, so that the semiconductor components are clamped by the liquid capsule 7 thereon. The liquid capsule 7 reduces the probability of displacement of the semiconductor components while controlling the temperature around the semiconductor components, and because the liquid capsule 7 has a deformable property, the adaptability of the device to semiconductor components of different sizes and shapes can be improved, thereby increasing the scope of application of the device; the hot liquid tank 3 is used to hold a constant temperature high-temperature liquid (for example, a liquid at 100°C, the temperature of which can be adjusted according to actual needs), and the cold liquid tank 4 is used to hold a constant temperature low-temperature liquid (for example, a liquid at -40°C, the temperature of which can be adjusted according to actual needs). The temperature of the liquid capsule 7 is adjusted by respectively transporting the high-temperature liquid and the low-temperature liquid to the liquid capsule 7, thereby realizing the control of the temperature of the semiconductor components, and the existing ventilation system is installed in the insulation box 2. The ventilation system is used to quickly restore the temperature in the insulation box 2 to room temperature in the intervals between repeated alternating tests, so that before the high-temperature liquid and the low-temperature liquid enter the liquid capsule 7, the liquid in the liquid capsule 7 is always kept at room temperature. In the initial state, the liquid in the liquid capsule 7 is a room-temperature liquid. The liquid in the liquid capsule 7, the high-temperature liquid and the low-temperature liquid are the same liquid (such as high-phenyl silicone oil, etc.), and the material of the liquid capsule 7 is silicone rubber or fluorosilicone rubber. The power connection device 8 is used to supply power to the semiconductor components. The power connection device 8 is a power connection socket. The power connection device 8 and the detection module thereon are electrically connected to the control terminal. The staff only needs to use the connecting wire to connect the semiconductor components, and then insert the connecting wire into the power connection device 8 to realize the power supply to the semiconductor components. The detection module transmits electrical signals to the semiconductor components to perform semiconductor component life detection contents such as hot carrier effect detection and electromigration life test; the ventilation system, liquid supply mechanism, connecting mechanism and driving mechanism are all electrically connected to the control terminal.

[0033] As a preferred technical solution of the present invention, Figures 2-4 and Figures 9-12For example, the connection mechanism includes a first electromagnetic three-way valve 9. The first electromagnetic three-way valve 9 is fixedly connected between the hot liquid tank 3 and the cold liquid tank 4. The first cavity 301 and the third cavity 401 are both connected to the first electromagnetic three-way valve 9. The first electromagnetic three-way valve 9 is fixedly connected and communicated with a first connector 91. The partition 6 is fixedly connected with two symmetrically distributed liquid inlet pipes 10. The liquid inlet pipes 10 are communicated with uniformly distributed liquid inlet ports 1001. The liquid inlet ports 1001 correspond to the liquid sacs 7 one by one. The liquid sacs 7 are communicated with the adjacent liquid inlet pipes 10 through the corresponding liquid inlet ports 1001. The liquid inlet pipes 10 are communicated with the first connector 91. The hot liquid tank 3 and the cold liquid tank 4 are jointly fixedly connected with a second electromagnetic three-way valve 11. The second cavity 302 and the fourth cavity 402 are both connected to the second electromagnetic three-way valve 11. The second electromagnetic three-way valve 11 is fixedly connected and communicated with a second connector 111. The partition 6 is fixedly connected with two symmetrically distributed liquid discharge pipes 12. The liquid discharge pipes 12 correspond to the liquid inlet pipes 10 one by one. The liquid discharge pipes 12 are communicated with uniformly distributed liquid discharge ports 1201. Each liquid sac 7 is communicated with two liquid discharge ports 1201. The liquid discharge pipes 12 are communicated with the second connector 111.

[0034] As a preferred technical solution of the present invention, taking Figure 3 and Figure 4 for example, the liquid supply mechanism includes two multi-stage electric push rods 31. The two multi-stage electric push rods 31 are both fixedly connected inside the machine shell 1. A liquid pushing plate 32 is slidably connected inside both the hot liquid tank 3 and the cold liquid tank 4. The telescopic ends of the two multi-stage electric push rods 31 respectively pass through the hot liquid tank 3 and the cold liquid tank 4 and are hermetically connected thereto. The liquid pushing plate 32 is fixedly connected to the telescopic end of the adjacent multi-stage electric push rod 31. The inner cavity of the hot liquid tank 3 is separated into a first cavity 301 and a second cavity 302 by the adjacent liquid pushing plate 32. The inner cavity of the cold liquid tank 4 is separated into a third cavity 401 and a fourth cavity 402 by the adjacent liquid pushing plate 32. The hot liquid tank 3 and the cold liquid tank 4 are both provided with a heat preservation layer and a temperature control component. The heat preservation layer and the temperature control component are both used to maintain the temperature of the liquid inside the hot liquid tank 3 and the cold liquid tank 4.

[0035] In the above solution, both the first electromagnetic three-way valve 9 and the second electromagnetic three-way valve 11 are electrically connected to the control terminal; the shapes of the liquid inlet pipes 10 and the liquid discharge pipes 12 inside the partition 6 are as Figure 11 shown. The multi-stage electric push rods 31 are electrically connected to the control terminal. The initial positions of the telescopic ends of the two multi-stage electric push rods 31 are as Figure 4 shown. The temperature control component is electrically connected to the control terminal. The structures of the hot liquid tank 3 and the cold liquid tank 4 are exactly the same. The temperature control component inside the hot liquid tank 3 is used to heat the liquid inside it to 100 °C (this temperature can be adjusted according to different requirements), and keep the temperature of the liquid inside the hot liquid tank 3 at 100 °C all the time. While the temperature control component inside the cold liquid tank 4 is used to cool the liquid inside it to -40 °C (this temperature can be adjusted according to different requirements), and keep the temperature of the liquid inside the cold liquid tank 4 at -40 °C all the time.

[0036] As a preferred technical solution of the present invention, taking Figure 9 as an example, the inner cavity of the liquid sac 7 is a mountain-shaped cavity. The connection between the liquid sac 7 and the corresponding liquid inlet 1001 is located in the middle of its mountain-shaped cavity, and the connections between the liquid sac 7 and the two adjacent liquid outlets 1201 are respectively located on both sides of its mountain-shaped cavity.

[0037] In the above solution, the inner cavity of the liquid sac 7 is as Figure 9 shown (hereinafter taking the Figure 9 viewpoint as an example). The connection between the liquid inlet 1001 and the adjacent liquid sac 7 is located in the middle of the front side of the mountain-shaped cavity of the liquid sac 7, while the connections between the liquid sac 7 and the two adjacent liquid outlets 1201 are respectively located on the left and right sides of the front part of its mountain-shaped cavity. When the liquid enters the liquid sac 7 from the liquid inlet 1001, the liquid flows backward through the middle of the mountain-shaped cavity of the liquid sac 7 and flows forward from the left and right sides of the mountain-shaped cavity of the liquid sac 7, and finally is discharged outward through the two liquid outlets 1201. Such a flow mode enables the temperature in the middle of the liquid sac 7 to affect the temperature on both sides, making the temperature change in the liquid sac 7 more uniform.

[0038] As a preferred technical solution of the present invention, taking Figure 9 as an example, the flow area of the liquid inlet 1001 is larger than the sum of the flow areas of the liquid outlets 1201 connected to the same liquid sac 7.

[0039] In the above solution, by defining the relationship between the flow areas of the liquid inlet 1001 and the two liquid outlets 1201 connected to the same liquid sac 7, the liquid inlet resistance of the liquid sac 7 is made smaller than its liquid outlet resistance, and the liquid sac 7 always maintains an expanded state, which is convenient for the liquid sac 7 to clamp the semiconductor components.

[0040] As a preferred technical solution of the present invention, taking Figure 3 , Figure 6 and Figure 7 as an example, the power mechanism includes a scissor expansion frame 15. The scissor expansion frame 15 is installed between the partition plates 6 distributed at intervals. One of the partition plates 6 is fixedly connected with a single-stage electric push rod 16. The telescopic end of the single-stage electric push rod 16 is fixedly connected with the scissor expansion frame 15, and the single-stage electric push rod 16 is used to control the expansion and contraction of the scissor expansion frame 15.

[0041] In the above solution, the single-stage electric push rod 16 is electrically connected to the control terminal. The single-stage electric push rod 16 is used to control the expansion and contraction of the scissor expansion frame 15, and the scissor expansion frame 15 is used to change the distance between two adjacent partition plates 6.

[0042] The working principle of the above solution is as follows: When the staff is preparing to use this device to detect semiconductor components, the staff first activates the temperature control components in the hot liquid tank 3 and the cold liquid tank 4, heats the liquid in the temperature control components to 100°C, and cools the liquid in the cold liquid tank 4 to -40°C. The staff uses a connecting wire to connect the semiconductor component and inserts the connecting wire into the power connection device 8. Then, the staff places the semiconductor component on the liquid bag 7 between two adjacent partitions 6. The staff can place multiple semiconductor components at the same time to measure multiple different types of components or multiple semiconductor components of the same specification, thereby increasing the credibility of this experiment. However, the staff needs to keep a gap between different semiconductor components to avoid the temperature transfer between different semiconductor components, which may affect the accuracy of the detection results. After the staff places the semiconductor components, the staff activates the single-stage electric push rod 16 through the control terminal. The telescopic end of the single-stage electric push rod 16 controls the scissor expansion and contraction frame 15 to contract, gradually reducing the distance between two adjacent partitions 6. The two adjacent partitions 6 jointly clamp the semiconductor component between them through the liquid bag 7 therebetween. The semiconductor component is wrapped by the liquid bags 7 on the upper and lower adjacent sides (the two adjacent liquid bags 7 completely wrap the semiconductor component through deformation).

[0043] After the semiconductor component is wrapped by the liquid bags 7 on the upper and lower adjacent sides, the staff closes the single-stage electric push rod 16 through the control terminal and controls the first electromagnetic three-way valve 9 and the second electromagnetic three-way valve 11 to work, so that the first electromagnetic three-way valve 9 and the second electromagnetic three-way valve 11 are simultaneously connected to the hot liquid tank 3. Then, the staff prepares for the first high-temperature detection process: The staff activates the multi-stage electric push rod 31 on the hot liquid tank 3 through the control terminal. The telescopic end of the multi-stage electric push rod 31 drives the adjacent liquid pushing plate 32 to move forward. The liquid pushing plate 32 injects the high-temperature liquid (100°C liquid) in the first cavity 301 into the first electromagnetic three-way valve 9. The high-temperature liquid passes through the first electromagnetic three-way valve 9 and the first connector 91 and enters all the liquid inlet pipes 10. The high-temperature liquid enters the corresponding liquid bag 7 through the liquid inlet pipe 10 and the evenly distributed liquid inlets 1001 thereon. Then, after the high-temperature liquid flows through the mountain-shaped cavity in the liquid bag 7, it enters the liquid discharge pipe 12 through the liquid discharge ports 1201 on both sides. The high-temperature liquid finally returns to the second cavity 302 through the liquid discharge pipe 12, the second connector 111, and the second electromagnetic three-way valve 11. During the flow process, the high-temperature liquid gradually heats the semiconductor component through the liquid bag 7. After exchanging heat with the semiconductor component, the high-temperature liquid with reduced temperature returns to the second cavity 302 and will not be mixed with the high-temperature liquid in the first cavity 301. Therefore, the high-temperature liquid that just enters the liquid bag 7 and flows is always 100°C high-temperature liquid, which helps to raise the temperature of the semiconductor component to 100°C and maintain the temperature of the semiconductor component at 100°C during the detection period.

[0044] During the heating process of the semiconductor component, the control terminal continuously detects its performance through the detection module (including the period when the temperature of the semiconductor component is maintained at 100°C). After the telescopic end of the multi-stage electric push rod 31 on the hot liquid tank 3 moves to the end of the stroke, the first high-temperature detection process is completed. Subsequently, the control terminal stops collecting the detection data of the semiconductor component and controls the telescopic end of the multi-stage electric push rod 31 on the hot liquid tank 3 to reset. The telescopic end of the multi-stage electric push rod 31 squeezes the liquid in the second cavity 302 back into the first cavity 301 through the liquid pushing plate 32. Then, the control terminal controls the first electromagnetic three-way valve 9 and the second electromagnetic three-way valve 11 to disconnect from the hot liquid tank 3 at the same time. The control terminal starts the ventilation system in the heat preservation box 2. The ventilation system dissipates heat from the heat preservation box 2, gradually reducing the temperature of the liquid bag 7 and the semiconductor component to room temperature. Subsequently, the control terminal closes the ventilation system. The temperature control component in the hot liquid tank 3 reheats the liquid in the first cavity 301 and maintains the liquid in the first cavity 301 at 100°C again, facilitating the subsequent second high-temperature detection.

[0045] After the temperature in the heat preservation box 2 returns to room temperature, the control terminal starts the first low-temperature detection process automatically. The control terminal controls the first electromagnetic three-way valve 9 and the second electromagnetic three-way valve 11 to connect to the cold liquid tank 4 at the same time. The control terminal controls the multi-stage electric push rod 31 on the cold liquid tank 4 to work. The telescopic end of the multi-stage electric push rod 31 drives the liquid pushing plate 32 thereon to move, pushing the low-temperature liquid (-40°C liquid) in the third cavity 401 of the cold liquid tank 4 into the first electromagnetic three-way valve 9. The low-temperature liquid passes through the same flow path as the above-mentioned high-temperature liquid, in the order of the first electromagnetic three-way valve 9, the first connector 91, the liquid inlet pipe 10, the liquid inlet 1001, the liquid bag 7, the liquid outlet 1201, the liquid discharge pipe 12, the second connector 111, and the second electromagnetic three-way valve 11, and finally flows back into the fourth cavity 402 through the second electromagnetic three-way valve 11. The low-temperature liquid gradually reduces the temperature of the semiconductor component to -40°C, and the control terminal detects the performance of the semiconductor component through the detection module.

[0046] When the telescopic end of the multi-stage electric push rod 31 on the cold liquid tank 4 moves to the end of the stroke, the control terminal completes the first low-temperature detection process. Subsequently, the control terminal stops collecting the detection data of the semiconductor components, and controls the telescopic end of the multi-stage electric push rod 31 on the cold liquid tank 4 to reset. The telescopic end of the multi-stage electric push rod 31 reversely extrudes the liquid in the fourth cavity 402 back into the third cavity 401 through the liquid pushing plate 32. Subsequently, the control terminal controls the first electromagnetic three-way valve 9 and the second electromagnetic three-way valve 11 to disconnect from the cold liquid tank 4 at the same time. The control terminal restarts the ventilation system in the heat preservation box 2 again. The ventilation system gradually raises the temperature of the heat preservation box 2 to gradually raise the temperatures of the liquid sac 7 and the semiconductor components to the room temperature state. The control terminal closes the ventilation system. The temperature control component in the cold liquid tank 4 cools the liquid in the third cavity 401 and maintains the liquid in the third cavity 401 at -40 °C again, facilitating the second low-temperature detection process.

[0047] Subsequently, the control terminal alternately performs high-temperature detection and low-temperature detection according to the same principle as above until the detection module detects that the service performance of the semiconductor component deteriorates. Subsequently, the staff comprehensively calculates the service life of the semiconductor component based on the time and degree of deterioration of the service performance of the semiconductor component, completing the entire process of the semiconductor component life detection.

[0048] After completing the detection of the semiconductor component, the staff closes the temperature control components in the hot liquid tank 3 and the cold liquid tank 4 through the control terminal, and closes the ventilation system in the heat preservation box 2. Subsequently, the staff controls the telescopic end of the single-stage electric push rod 16 to reset through the control terminal, so that the distance between two adjacent partitions 6 returns to the initial state, and the liquid sac 7 stops clamping the semiconductor component. Finally, the staff removes the semiconductor component from the heat preservation box 2 to complete the use of this device.

[0049] As a preferred technical solution of the present invention, taking Figure 6 and Figure 12 as an example, it further includes an air supply pump 18. The air supply pump 18 is fixedly connected inside the heat preservation box 2. All the liquid sacs 7 on one side of the partition 6 are fixedly connected with an air bag 17 in common. The liquid sac 7 is located between the adjacent partition 6 and the adjacent air bag 17. The air supply pump 18 is fixedly connected and communicated with an air supply pipeline 181, and the air bag 17 is communicated with the air supply pipeline 181.

[0050] As a preferred technical solution of the present invention, taking Figure 2 and Figure 12 as an example, it further includes an air extraction pump 19. The air extraction pump 19 is fixedly connected and communicated with an air extraction pipeline 191. The air supply pipeline 181 and the air extraction pipeline 191 are respectively located on both sides of the longitudinally spaced partitions 6. The air bag 17 is communicated with the air extraction pipeline 191. The air supply pipeline 181 and the air extraction pipeline 191 are both provided with electric control valves.

[0051] In the above solution, when the airbag 17 is filled with air, the airbag 17 is used to reduce the efficiency of the temperature transfer from the liquid bag 7 to the semiconductor components. When the air in the airbag 17 is evacuated, the semiconductor components are in contact with the liquid bag 7 through the two thin walls of the airbag 17, thereby restoring the efficiency of the temperature transfer from the liquid bag 7 to the semiconductor components. The electrically controlled valve on the air supply pipeline 181, the electrically controlled valve on the air extraction pipeline 191, the air supply pump 18 and the air extraction pump 19 are all electrically connected to the control terminal.

[0052] The working principle of the above solution is as follows: When the control terminal controls the scissor expansion and contraction frame 15 to contract through the single-stage electric push rod 16, the gap between two adjacent partitions 6 decreases until the two airbags 17 contact the semiconductor components. Then the control terminal closes the single-stage electric push rod 16. Subsequently, when the high-temperature liquid (or low-temperature liquid) initially flows into the liquid bag 7 in the first electromagnetic three-way valve 9, the control terminal opens the electrically controlled valve on the air supply pipeline 181 and starts the air supply pump 18. The air supply pump 18 continuously supplies air into the airbag 17 through the air supply pipeline 181, separating the semiconductor components from the adjacent liquid bag 7 to prevent the semiconductor components from being damaged due to sudden temperature rise or sudden temperature drop, which may affect the test results of the semiconductor components. After the airbag 17 is filled with air, the control terminal closes the electrically controlled valve on the air supply pipeline 181 and the air supply pump 18. At this time, the high-temperature liquid (or low-temperature liquid) in the liquid bag 7 transfers heat to the semiconductor components through the airbag 17 and the gas inside it. When the temperature difference between the semiconductor components and the high-temperature liquid and the low-temperature liquid is less than 20°C, the control terminal opens the electrically controlled valve on the air extraction pipeline 191 and starts the air extraction pump 19. The air extraction pump 19 quickly evacuates the air in the airbag 17 through the air extraction pipeline 191. At this time, the semiconductor components are in contact with the liquid bag 7 through the two thin walls of the airbag 17. When the control terminal controls the scissor expansion and contraction frame 15 to continue contracting through the single-stage electric push rod 16, the gap between two adjacent partitions 6 decreases until the two airbags 17 clamp the semiconductor components. Then the control terminal closes the single-stage electric push rod 16, the electrically controlled valve on the air extraction pipeline 191 and the air extraction pump 19. The high-temperature liquid (or low-temperature liquid) in the liquid bag 7 transfers heat to the semiconductor components, facilitating the semiconductor components to be raised to the same temperature as the high-temperature liquid (or low-temperature liquid).

[0053] During the high and low temperature detection interval, that is, immediately after the Nth high temperature detection or the Nth low temperature detection (N is a positive integer greater than 1), while the control terminal is restoring the semiconductor component to room temperature through the ventilation system, the control terminal controls the scissor telescopic frame 15 to extend through the single-stage electric push rod 16, reducing the clamping force of two adjacent airbags 17 on the semiconductor component and providing space for gas to enter the airbag 17. Subsequently, the control terminal closes the single-stage electric push rod 16 and simultaneously starts the electric control valve on the air supply pipeline 181, the air supply pump 18, the electric control valve on the air extraction pipeline 191, and the air extraction pump 19. The air supply pump 18 and the air extraction pump 19 jointly cause the outside air to flow through the airbag 17, thereby improving the efficiency of restoring the temperature of the semiconductor component to room temperature. When the temperature of the semiconductor component is restored to room temperature, the control terminal simultaneously closes the electric control valve on the air supply pipeline 181, the air supply pump 18, the electric control valve on the air extraction pipeline 191, and the air extraction pump 19.

[0054] As a preferred technical solution of the present invention, taking Figure 13 as an example, it further includes uniformly distributed micro solenoid valves 20. The uniformly distributed micro solenoid valves 20 are all fixedly connected inside the first connector 91. The number of the first connectors 91 corresponds one-to-one to the number of the liquid inlet pipes 10. The micro solenoid valves 20 are communicated with the first connector 91 and the corresponding liquid inlet pipes 10.

[0055] In the above solution, the micro solenoid valve 20 is electrically connected to the control terminal. The micro solenoid valve 20 includes an integrated pressure sensor. The micro solenoid valve 20 dynamically adjusts the flow rate at the liquid inlet pipe 10 by detecting the magnitude of the flow pressure at each liquid inlet pipe 10, so as to make the liquid pressures in the two liquid bags 7 clamping the same semiconductor component equal, reducing the probability that the liquid pressures in the two liquid bags 7 clamping the same semiconductor component are different, resulting in the semiconductor component being subjected to an additional extrusion force, and further reducing the influence of the liquid pressure on the detection process of the semiconductor component (for example, the liquid pressure in the lower liquid bag 7 is greater than the liquid pressure in the upper liquid bag 7, resulting in the semiconductor component being subjected to an additional upward bending force).

[0056] The above is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of changes or substitutions, which should all be covered within the protection scope of the present invention.

Claims

1. A production and testing device for semiconductor refrigeration sensitive components, characterized by: The invention comprises a housing (1), wherein a heat preservation box (2), a hot liquid tank (3) and a cold liquid tank (4) are fixedly connected in the housing (1), wherein a sliding frame (5) is fixedly connected in the heat preservation box (2), wherein the hot liquid tank (3) is used to store liquid with a temperature greater than 100° C., wherein the cold liquid tank (4) is used to store liquid with a temperature less than -40° C., wherein the sliding frame (5) is slidably connected to a partition (6) distributed at intervals in the longitudinal direction, wherein the upper and lower surfaces of the partition (6) are fixedly connected to uniformly distributed liquid capsules (7), wherein an electrical connection device (8) is fixedly connected in the heat preservation box (2), wherein the hot liquid tank (3) is used to store liquid with a temperature greater than 100° C., wherein the cold liquid tank (4) is used to store liquid with a temperature less than -40° C., wherein the sliding frame (5) is slidably connected to a partition (6) distributed at intervals in the longitudinal direction, wherein the upper and lower surfaces of the partition (6) are fixedly connected to uniformly distributed liquid capsules (7), wherein the heat preservation box (2) is fixedly connected to an electrical connection device (8), wherein the hot liquid tank (3) is used to store liquid with a temperature greater than 100° C., wherein the hot liquid tank (3) is used to store liquid with a temperature less than -4 ... The power connection device (8) is provided with a detection module, the hot liquid tank (3) and the cold liquid tank (4) are provided with a connecting mechanism, the connecting mechanism is used to connect the hot liquid tank (3) and the cold liquid tank (4) with the liquid capsule (7) in sequence, the hot liquid tank (3) and the cold liquid tank (4) are provided with a liquid supply mechanism for conveying liquid into all the liquid capsules (7), and the partitions (6) spaced apart in the longitudinal direction are provided with a driving mechanism for clamping two adjacent liquid capsules (7) on two adjacent partitions (6) with semiconductor components.

2. The production and testing equipment for semiconductor refrigeration sensitive components according to claim 1 is characterized in that: The communication mechanism comprises a first electromagnetic three-way valve (9), the first electromagnetic three-way valve (9) is fixedly connected between the hot liquid tank (3) and the cold liquid tank (4), the first cavity (301) and the third cavity (401) are both connected to the first electromagnetic three-way valve (9), the first electromagnetic three-way valve (9) is fixedly connected to and connected to a first connector (91), the partition plate (6) is fixedly connected to two symmetrically distributed liquid inlet pipes (10), the liquid inlet pipes (10) are connected to uniformly distributed liquid inlets (1001), the liquid inlets (1001) correspond to the liquid capsules (7) one by one, the liquid capsules (7) are connected to the adjacent liquid inlet pipes (10) through the corresponding liquid inlet ports (1001), and the liquid inlet pipes (10) are connected to the liquid capsules (7) The hot liquid tank (3) and the cold liquid tank (4) are connected to the first connector (91), the hot liquid tank (3) and the cold liquid tank (4) are fixedly connected to a second electromagnetic three-way valve (11), the second cavity (302) and the fourth cavity (402) are both connected to the second electromagnetic three-way valve (11), the second electromagnetic three-way valve (11) is fixedly connected to and connected to a second connector (111), the partition (6) is fixedly connected to two symmetrically distributed drainage pipes (12), the drainage pipes (12) correspond to the liquid inlet pipes (10) one by one, the drainage pipes (12) are connected to uniformly distributed drainage ports (1201), each of the liquid capsules (7) is connected to two drainage ports (1201), and the drainage pipes (12) are connected to the second connector (111).

3. The production and testing equipment for semiconductor refrigeration sensitive components according to claim 2 is characterized in that: The liquid supply mechanism comprises two multi-stage electric push rods (31), both of which are fixedly connected to the housing (1); the hot liquid tank (3) and the cold liquid tank (4) are both slidably connected with a liquid push plate (32); the telescopic ends of the two multi-stage electric push rods (31) respectively pass through the hot liquid tank (3) and the cold liquid tank (4) and are sealed therewith; the liquid push plate (32) is fixedly connected to the telescopic ends of adjacent multi-stage electric push rods (31); the cavity in the hot liquid tank (3) is divided into a first cavity (301) and a second cavity (302) by adjacent liquid push plates (32); and the cavity in the cold liquid tank (4) is divided into a third cavity (401) and a fourth cavity (402) by adjacent liquid push plates (32).

4. The production and testing equipment for semiconductor refrigeration sensitive components according to claim 3 is characterized in that: The hot liquid tank (3) and the cold liquid tank (4) are both provided with a heat-insulating layer and a temperature-controlling component, and the heat-insulating layer and the temperature-controlling component are both used to maintain the temperature of the liquid in the hot liquid tank (3) and the cold liquid tank (4).

5. The production and testing equipment for semiconductor refrigeration sensitive components according to claim 2 is characterized in that: The cavity inside the liquid capsule (7) is a "V"-shaped cavity. The connection point between the liquid capsule (7) and the corresponding liquid inlet (1001) is located in the middle of the "V"-shaped cavity. The connection points between the liquid capsule (7) and the two adjacent liquid discharge ports (1201) are located on both sides of the "V"-shaped cavity.

6. The production and testing equipment for semiconductor refrigeration sensitive components according to claim 5, characterized in that: The flow area of ​​the liquid inlet (1001) is greater than the sum of the flow areas of the liquid discharge ports (1201) connected to the same liquid sac (7).

7. The production and testing equipment for semiconductor refrigeration sensitive components according to claim 2 is characterized in that: The power mechanism comprises a scissor-type telescopic frame (15), wherein the scissor-type telescopic frame (15) is installed between the partitions (6) that are spaced apart, wherein one of the partitions (6) is fixedly connected with a single-stage electric push rod (16), wherein the telescopic end of the single-stage electric push rod (16) is fixedly connected to the scissor-type telescopic frame (15), and the single-stage electric push rod (16) is used to control the telescopic movement of the scissor-type telescopic frame (15).

8. The production and testing equipment for semiconductor refrigeration sensitive components according to claim 7 is characterized in that: It also includes an air supply pump (18), which is fixedly connected to the heat preservation box (2); all the liquid bags (7) on one side of the partition (6) are fixedly connected to an air bag (17); the liquid bag (7) is located between the adjacent partition (6) and the adjacent air bag (17); the air supply pump (18) is fixedly connected to and connected to an air supply pipe (181); and the air bag (17) is connected to the air supply pipe (181).

9. The production and testing equipment for semiconductor refrigeration sensitive components according to claim 8, characterized in that: It also includes an air pump (19), the air pump (19) is fixedly connected to and communicated with an air pump pipe (191), the air supply pipe (181) and the air pump pipe (191) are respectively located on both sides of the partition (6) spaced apart in the longitudinal direction, the air bag (17) is communicated with the air pump pipe (191), and the air supply pipe (181) and the air pump pipe (191) are both provided with electric control valves. The production and testing equipment for semiconductor refrigeration sensitive components according to claim 2 is characterized in that: It also includes uniformly distributed micro solenoid valves (20), which are all fixedly connected to the first connecting head (91), the number of the first connecting heads (91) corresponds to the number of the liquid inlet pipes (10), and the micro solenoid valves (20) are all connected to the first connecting heads (91) and the corresponding liquid inlet pipes (10).

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